A heat dissipation panel, a water-cooled heat sink and a heat dissipation panel processing method

Abstract

This invention provides a heat dissipation panel, a water-cooled radiator, and a method for processing the heat dissipation panel, relating to the field of cooling and heat dissipation technology. The heat dissipation panel includes a panel substrate that forms part of the fluid flow channels. Multiple rows of heat dissipation channels are arranged on the surface of the panel substrate. Fluid can flow inside the heat dissipation channels. The bottom surface of the heat dissipation channels is inclined, and a wave-like undulation is formed between adjacent rows of heat dissipation channels. When the fluid flows along the heat dissipation channels, the flow direction of the cooling fluid changes in the vertical direction. During the flow process, the fluid collides with the heat dissipation channels, causing the flow state of the cooling fluid to change drastically, generating turbulence and scouring, which destroys the heat film on the inner surface of the heat dissipation channels and improves the heat transfer efficiency of the heat dissipation fins.

Description

Technical Field

[0001] This invention relates to the field of cooling and heat dissipation technology, and more particularly to a heat dissipation panel. Furthermore, this invention also relates to a water-cooled radiator and a method for processing the heat dissipation panel. Background Technology

[0002] Ultra-high voltage direct current (UHVDC) transmission boasts advantages such as long transmission distance, large transmission capacity, and low loss, making it a crucial pathway for optimizing the allocation of my country's energy resources. With the continuous maturation and improvement of UHVDC transmission technology, the DC current will increase from the original 5000A to 6250A, and a 2-hour overload will reach 6690A. This significant current increase places higher demands on the thyristor converter valve, a core component of UHVDC transmission equipment. Water-cooled radiators are a vital component of thyristor converter valves. In existing technologies, to meet the cooling requirements of increasing the DC current from 4000A to 5000A, the internal water channels of water-cooled radiators have undergone multiple optimizations. The radiator's heat dissipation efficiency and thermal resistance have almost reached their limits, making further improvements to meet the 6250A operating conditions extremely difficult. The 6250A radiator requires lower thermal resistance and better temperature uniformity under the same fluid flow rate. For example, under the conditions of 4.8kW heat dissipation power and 9L / min flow rate, the thermal resistance should be less than or equal to 3K / kW and the table surface temperature uniformity should be less than 4℃.

[0003] The main factors affecting the heat dissipation capacity of a heat sink panel are heat dissipation area and heat transfer coefficient. Since increasing the heat dissipation area to improve the heat dissipation capacity of a heat sink is limited by the installation space of the converter valve, the important means to improve the heat dissipation capacity of a heat sink is to improve the heat transfer coefficient, and improving the heat dissipation coefficient mainly depends on the structure of the heat sink fins.

[0004] like Figure 11 As shown, the heat sink fin structure currently used in this field is mainly a spiral flow channel structure, which is directly machined onto the substrate using milling. During the use of the heat sink, due to the viscosity of the cooling medium, a thermal film will form on the surface of the heat sink fins. This thermal film has very low thermal conductivity, which will prevent heat exchange between the coolant and the fin body, resulting in a decrease in the heat transfer efficiency of the heat sink, thereby reducing the heat dissipation capacity of the heat sink.

[0005] For those skilled in the art, improving the heat dissipation capacity of water cooling is a technical problem that needs to be solved. Summary of the Invention

[0006] This invention provides a heat dissipation panel that can cause a rapid change in the flow state of the cooling fluid, generating turbulence that washes over the surface of the heat dissipation fins, destroying the thermal film on the surface of the heat dissipation fins, and improving the heat transfer efficiency of the heat dissipation fins. The specific solution is as follows:

[0007] A heat dissipation panel includes a panel substrate that forms part of a fluid flow channel. The surface of the panel substrate has multiple rows of heat dissipation channels arranged in an inclined manner. The adjacent rows of heat dissipation channels form a wave-like undulation to change the flow direction of the cooling fluid in the vertical direction.

[0008] Optionally, the heat dissipation channels are provided with heat dissipation fins arranged in rows, and the cooling fluid flows between two adjacent heat dissipation fins;

[0009] The adjacent rows of heat dissipation fins are staggered, allowing the cooling fluid to impact the fins and change the flow direction of the cooling fluid in the horizontal direction.

[0010] Optionally, the surface of the panel substrate is provided with at least two water collection channels, which are used to distribute the incoming cooling fluid in rows and to allow the cooled fluid after heat exchange to converge and flow out.

[0011] Optionally, the angle θ between the bottom surface of the heat dissipation channel and the surface of the panel substrate is in the range of 15 to 45°; the angle α between the depth direction of the heat dissipation channel and the vertical line is in the range of 15 to 45°.

[0012] Optionally, the heat dissipation channel is composed of rows of independent blind holes, and the blind holes of two adjacent rows of heat dissipation channels are staggered in the arrangement direction.

[0013] The blind holes located in different rows are interconnected to form a connecting channel for the flow of cooling fluid.

[0014] Optionally, the blind holes form four curved sidewalls of the heat dissipation fins, and the connecting channels form four planar sidewalls of the heat dissipation fins.

[0015] Optionally, the heat dissipation channel is composed of continuous wavy channels, with adjacent rows of heat dissipation channels intersect each other in the arrangement direction and overlap in the direction perpendicular to the arrangement direction.

[0016] Optionally, the heat dissipation fins have a rhomboid cross-section.

[0017] The present invention also provides a water-cooled radiator, comprising a base and a heat dissipation panel as described in any of the above claims, wherein the base and the panel substrate are sealed together to form a space for the flow of cooling fluid; the base is provided with an inlet channel for liquid inflow and an outlet channel for liquid outflow.

[0018] Cooling fluid flows through the inlet channel and into the heat dissipation channel, and then flows out from the outlet channel.

[0019] Optionally, two panel substrates are provided; the base is provided with a guide channel, the liquid inlet channel guides the fluid to the two panel substrates through the guide channel, and the fluid flowing through the two panel substrates converges into the liquid outlet channel through the guide channel.

[0020] The present invention also provides a method for processing a heat dissipation panel, comprising:

[0021] The panel substrate is fixed on an inclined worktable fixture, so that the panel substrate forms a machining angle β with the horizontal plane;

[0022] The cutting tool performs milling operations on the panel substrate perpendicular to the horizontal surface, including:

[0023] The cutting tool moves in a wavy pattern to form a row of wavy channels on the panel substrate; the next row of wavy channels is machined in a staggered manner so that adjacent rows of wavy channels overlap in a direction perpendicular to the arrangement direction;

[0024] Alternatively, the tool first drills independent blind holes in rows on the panel substrate, with adjacent rows of blind holes staggered in the arrangement direction; then the tool connects the blind holes in different rows to form a connecting channel for the flow of cooling fluid.

[0025] This invention provides a heat dissipation panel, including a panel substrate that forms part of a fluid flow channel. Multiple rows of heat dissipation channels are arranged on the surface of the panel substrate. Fluid can flow within the heat dissipation channels. The bottom surface of the heat dissipation channels is inclined, and a wave-like undulation is formed between adjacent rows of heat dissipation channels. When the fluid flows along the heat dissipation channels, the flow direction of the cooling fluid changes in the vertical direction. During the flow process, the fluid collides with the heat dissipation channels, causing the flow state of the cooling fluid to change drastically, generating turbulence and scouring, which destroys the heat film on the inner surface of the heat dissipation channels and improves the heat transfer efficiency of the heat dissipation fins. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 An isometric view of a specific embodiment of the heat dissipation panel provided by the present invention;

[0028] Figure 2 A front view of a specific embodiment of the heat dissipation panel provided by the present invention;

[0029] Figure 3 for Figure 2 Cross-sectional view along the AA direction;

[0030] Figure 4 This is a schematic diagram showing the change in the flow direction of the cooling fluid in the vertical direction.

[0031] Figure 5 This is a schematic diagram showing the change in the flow direction of the cooling fluid in the horizontal direction.

[0032] Figure 6 An axonometric view of one specific embodiment of the base;

[0033] Figure 7 An isometric view of a specific embodiment of the water-cooled radiator provided by the present invention;

[0034] Figure 8 A side view of a specific embodiment of the water-cooled radiator provided by the present invention;

[0035] Figure 9 for Figure 8 Cross-sectional view along the BB direction;

[0036] Figure 10 A schematic diagram of a fixture for fixing the panel substrate to an inclined worktable;

[0037] Figure 11 Currently, the main heat dissipation fin structure in this field is the spiral flow channel structure.

[0038] The image includes:

[0039] Panel base 1, heat dissipation channel 2, heat dissipation fins 3, water collection channel 4, base 5, liquid inlet channel 51, liquid outlet channel 52, guide channel 53, inclined worktable fixture 6. Detailed Implementation

[0040] The core of this invention is to provide a heat dissipation panel that can cause a rapid change in the flow state of the cooling fluid, generating turbulence that washes over the surface of the heat dissipation fins, destroys the thermal film on the surface of the heat dissipation fins, and improves the heat transfer efficiency of the heat dissipation fins.

[0041] To enable those skilled in the art to better understand the technical solution of the present invention, the heat dissipation panel and water-cooled radiator of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Combination Figures 1 to 3As shown, this invention provides a heat dissipation panel, including a panel base 1 that forms part of a fluid flow channel. After the heat dissipation panel is assembled with other structures, it together forms the fluid flow channel. Multiple rows of heat dissipation channels 2 are arranged on the surface of the panel base 1. The heat dissipation channels 2 are groove-shaped structures fitted onto the panel base 1, allowing liquid to flow within them. Since the heat dissipation channels 2 on the panel base 1 are not enclosed structures, they need to be assembled with other structures to form a closed channel structure so that fluid can flow within it. For example, the panel base 1 and a base 5 are assembled together to form a closed heat dissipation channel 2 for liquid flow. The heat dissipation channel 2 allows for unidirectional fluid flow within it.

[0043] Combination Figure 3 As shown, the cross-sectional structure of the panel substrate 1 is displayed, and the bottom surface of the heat dissipation channel 2 is inclined. The bottom surface referred to here is... Figure 3 As shown in the direction, the panel substrate 1 is a plate with a certain thickness. Figure 3 The upper surface of the panel substrate 1 is provided with a groove, and the lower surface of the panel substrate 1 is a solid structure. The fluid flows according to... Figure 3 The flow is in the direction indicated by the arrow, flowing from one end of panel substrate 1 to the other end of panel substrate 1.

[0044] Combination Figure 2 As shown, the heat dissipation channels 2 are distributed in an array. Figure 2 The left-right direction (X-axis) is the row, and the top-bottom direction (Y-axis) is the column; for example... Figure 3 As shown, a wave-like undulation is formed between two adjacent rows of heat dissipation channels 2, which is used to change the flow direction of the cooling fluid in the vertical direction. Combined with... Figure 3 As shown, when fluid flows between two adjacent rows of heat dissipation channels 2, the fluid does not move in the same constant direction, but rather moves up and down in the vertical direction. The vertical direction referred to here is... Figure 3 In the vertical direction (Z-axis), as the fluid generally flows from left to right, the fluid continuously changes its flow direction diagonally upwards and downwards.

[0045] Using the heat dissipation panel structure provided by this invention, since the fluid constantly changes its direction of movement in the vertical direction, the fluid can collide with the heat dissipation channel 2 during the flow process, causing the flow state of the cooling fluid to change drastically, generating turbulence and forming a scouring effect, which destroys the heat film on the inner surface of the heat dissipation channel 2 and improves the heat transfer efficiency of the heat dissipation fins.

[0046] Based on the above scheme, the heat dissipation channel 2 of the present invention is provided with a row of heat dissipation fins 3, and a number of heat dissipation fins 3 are provided in a row of heat dissipation channels 2 at intervals. A channel space for fluid to pass through is formed between two adjacent heat dissipation fins 3, and the cooling fluid flows from between two adjacent heat dissipation fins 3.

[0047] The adjacent rows of heat dissipation fins 3 are staggered, allowing the cooling fluid to impact the fins 3, thus changing the flow state of the cooling fluid in the horizontal direction. Combined with... Figure 2 The two adjacent rows of heat dissipation fins 3 are not one-to-one. Taking the top two rows as an example, there is a gap between the heat dissipation fins 3 in the first row, and the heat dissipation fins 3 in the second row are positioned directly opposite the gap in the first row, generally in the middle of the gap in the first row, to ensure uniform fluid flow. Figure 2 As shown, the arrows indicate the direction of fluid flow. The main focus is on the fluid flow direction around a row of heat dissipation fins 3 distributed along the Y-axis. After entering the heat dissipation channel 2, the fluid passes through the gaps between the first row of heat dissipation fins 3. When it reaches the second row, it impacts the heat dissipation fins 3 directly. The heat dissipation fins 3 split the fluid into two paths, which then enter the gaps on both sides to continue flowing. As the fluid flows row by row, its direction changes continuously in the transverse direction of the X-axis, thereby generating turbulence and creating a scouring effect. This damages the heat film on the inner surface of the heat dissipation channel 2 and improves the heat transfer efficiency of the heat dissipation fins 3.

[0048] When a thermal film forms on the surface of the heat dissipation fins 3 in the radiator, this thermal film prevents heat exchange between the cooling medium and the heat dissipation fins 3, reducing the heat transfer efficiency of the heat dissipation fins 3. Therefore, it is necessary to eliminate the thermal film on the surface of the heat dissipation fins 3. The heat dissipation panel of the present invention can generate a scouring effect of the heat dissipation fluid in the vertical and horizontal directions, which can more effectively and fully destroy the thermal film on the inner surface of the heat dissipation channel 2, thereby maximizing the heat transfer efficiency of the heat dissipation fins 3.

[0049] The present invention eliminates the heat film by creating turbulent flow in the cooling fluid. This turbulent flow then washes away the heat film on the surface of the heat sink fins 3. To achieve turbulence, the Reynolds number of the cooling fluid (Ra = v / υ, where v is the fluid velocity, υ is the fluid viscosity, and Ra is the Reynolds number) must not be lower than a certain value (generally not less than 2400). Higher viscosity fluids require higher flow velocities, and fluid resistance (also known as flow resistance) is proportional to the square of the flow velocity. Therefore, higher flow velocities result in higher flow resistance. Heat transfer efficiency and flow resistance are contradictory; higher flow resistance leads to higher heat transfer efficiency, while lower flow resistance leads to lower heat transfer efficiency. Therefore, while increasing the cooling fluid velocity to create turbulence eliminates the heat film on the surface of the heat sink fins 3, the increased velocity directly increases flow resistance, directly affecting the operating conditions of the cooling water pump circulation. The present invention improves the structure of the heat dissipation fins 3. Without increasing the flow rate of the cooling fluid, the cooling fluid not only collides with the heat dissipation fins 3 in the horizontal direction, but also collides with the heat dissipation fins 3 in the vertical direction. This causes the flow state of the cooling fluid to change drastically, generating turbulence that washes over the surface of the heat dissipation fins 3, destroying the heat film on the surface of the heat dissipation fins 3 and causing the cooling fluid to form turbulence, thereby achieving the purpose of improving heat transfer efficiency.

[0050] Combination Figure 1 , Figure 2 As shown, the surface of the panel substrate 1 is provided with at least two water collection channels 4. The water collection channel 4 is a long, narrow, hollow structure, through which fluid can flow smoothly. The water collection channel 4 is used to distribute the incoming cooling fluid in rows and to allow the cooled fluid after heat exchange to converge and flow out. Figure 2 As shown, the upper water collection channel 4 is used for the inflow of cooling fluid, and the lower water collection channel 4 is used for the outflow of cooling fluid; the length (X-axis) of the water collection channel 4 is greater than or equal to the length (X-axis) of a row of heat dissipation channels 2, and the inflowing cooling fluid is evenly distributed to each position of the first row of heat dissipation channels 2, so that the fluid is evenly distributed to each position, so that the cooling fluid flows through each position of the heat dissipation channel 2.

[0051] Combination Figure 4 As shown, the angle θ between the bottom surface of the heat dissipation channel 2 and the surface of the panel substrate 1 ranges from 15° to 45°, and the angle α between the depth direction of the heat dissipation channel 2 and the vertical line is also from 15° to 45°, including both endpoint values. The depth direction of the heat dissipation channel 2 is inclined, and the depth direction of the heat dissipation channel 2 is perpendicular to the bottom surface of the heat dissipation channel 2.

[0052] Based on any of the above technical solutions and their combinations, this invention provides a configuration of a heat dissipation channel 2. The heat dissipation channel 2 is composed of rows of independently drilled blind holes, with the blind holes in adjacent rows of heat dissipation channels 2 staggered in the arrangement direction. Blind holes in different rows are interconnected to form a connecting channel for the flow of cooling fluid. For a row of blind holes, each blind hole is drilled independently, and the row of blind holes is arranged along the X-axis, without direct connection between the blind holes. After the blind holes in each row are drilled, the blind holes in different rows are interconnected, and the channel connecting two adjacent rows of blind holes forms a connecting channel for the flow of cooling fluid. The length direction of the connecting channel is the inclined direction between the X-axis and the Y-axis. The connecting channel and the blind holes together constitute the heat dissipation channel 2 for fluid flow.

[0053] According to the above processing method, the blind holes form the four curved sidewalls of the heat dissipation fin 3, and the connecting channels form the four planar sidewalls of the heat dissipation fin 3. The heat dissipation fin 3 has an octagonal columnar structure with four concave curved sidewalls and four planar sidewalls. Of course, the heat dissipation fin 3 is not limited to the above-mentioned four curved sidewalls and four planar sidewalls; it can also be a shape where all eight surfaces are planar or curved. These specific embodiments should all be included within the protection scope of this invention. For example... Figure 5 In the structure shown, all eight sidewalls of the heat dissipation fin 3 are planar.

[0054] Based on any of the above technical solutions and their combinations, this invention provides another configuration of the heat dissipation channel 2. The heat dissipation channel 2 is composed of continuous wavy channels. Adjacent rows of heat dissipation channels 2 are staggered in the arrangement direction and overlap perpendicular to the arrangement direction, where the overlap direction is the Y-axis direction. When a row of wavy channels is processed, a row forms a continuous channel. When processing the next row of wavy channels, it is staggered with the previous row of wavy channels and is connected to them, so that the cooling fluid flows between adjacent rows of wavy channels, and the heat dissipation channel 2 is formed by each row of wavy channels.

[0055] In the processing method of the wavy channel, the cross-section of the heat dissipation fin 3 is rhomboid, combined with... Figure 2 As shown, during the milling process of a row of wavy channels, two sidewalls of the rhomboid heat dissipation fin 3 are formed. During the milling process of the next row of wavy channels, the other two sidewalls of the rhomboid heat dissipation fin 3 are formed. Of course, the processing structure of wavy channels used in this invention is not limited to forming heat dissipation fins 3 with a rhomboid cross-sectional shape. The sidewalls of the heat dissipation fin 3 can also be curved surfaces or other shapes.

[0056] The present invention also provides a water-cooled radiator, combined with Figures 6 to 9The water-cooled radiator includes a base 5 and the aforementioned heat dissipation panel. The base 5 and the panel base 1 are sealed together to form a space for the flow of cooling fluid. The base 5 is provided with an inlet channel 51 for liquid inlet and an outlet channel 52 for liquid outlet. The cooling fluid flows through the inlet channel 51 and into the heat dissipation channel 2. After flowing through the heat dissipation channel 2, the cooling fluid flows out from the outlet channel 52.

[0057] Preferably, two panel substrates 1 are provided in this invention; the base 5 is provided with a guide channel 53, and the liquid inlet channel 51 guides the fluid to the two panel substrates 1 respectively through the guide channel 53. The fluid flowing through the two panel substrates 1 converges into the liquid outlet channel 52 through the guide channel 53. The liquid inlet channel 51 and the liquid outlet channel 52 are arranged parallel to each other and perpendicular to the guide channel 53. The function of the guide channel 53 is to divide the cooling fluid into two paths, which flow to the two water-cooled radiators respectively, so that the cooling fluid flows into different heat dissipation channels 2 respectively and performs the cooling and heat dissipation function respectively.

[0058] In use, the thyristor is attached to the panel substrate 1. Heat is transferred from the thyristor and other heat-generating components to the water-cooled radiator. During the flow of cooling fluid, the heat is carried away by the cooling fluid. Two panel substrates 1 are provided, which can dissipate heat from the thyristors on both sides simultaneously.

[0059] The present invention also provides a method for processing a heat dissipation panel, comprising the following steps:

[0060] The panel base 1 is fixed on the inclined worktable fixture 6, so that the panel base 1 forms a machining angle β with the horizontal plane; combined with Figure 6 The inclined worktable fixture 6 is used to fix the surface of the panel base 1 at an angle to the horizontal plane. This angle is the machining tilt angle β, which is equal to the tilt angle θ, to determine the tilt angle in the longitudinal direction of the heat dissipation channel 2.

[0061] The cutting tool performs milling operations on the panel substrate 1 perpendicular to the horizontal surface, including the following two cases:

[0062] The first method involves the cutting tool moving along a wavy path to form a row of wavy channels on the panel substrate 1; the next row of wavy channels is then machined in a staggered manner so that adjacent rows of wavy channels overlap in the direction perpendicular to the arrangement. Using this machining method, a whole row of connected wavy channels can be machined in one pass, resulting in higher machining efficiency.

[0063] The second method involves drilling independent blind holes in rows on the panel substrate 1, with adjacent rows of blind holes staggered in the arrangement direction. Then, the tool connects the blind holes in different rows to form a connecting channel for the flow of cooling fluid. This machining method requires multiple feeds when machining each blind hole, followed by milling the channel to connect the blind holes.

[0064] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipating panel, characterized by, The panel base (1) is arranged with multiple rows of heat dissipation channels (2) on the surface, the bottom surface of the heat dissipation channel (2) is arranged in an inclined manner, and the adjacent two rows of heat dissipation channels (2) are arranged in a wave shape to change the flow direction of the cooling fluid in the vertical direction. The heat dissipation channel (2) is arranged with heat dissipation fins (3), and the cooling fluid flows between the adjacent two heat dissipation fins (3). The adjacent two rows of heat dissipation fins (3) are arranged in a staggered manner, and the cooling fluid can impact on the heat dissipation fins (3) to change the flow direction of the cooling fluid in the horizontal direction.

2. The heat dissipating panel of claim 1, wherein, At least two water collecting channels (4) are arranged on the surface of the panel base (1), and the water collecting channels (4) are used for distributing the incoming cooling fluid in rows and collecting the heat-exchanged cooling fluid.

3. The heat dissipating panel of claim 1, wherein, The angle θ between the bottom surface of the heat dissipation channel (2) and the surface of the panel base (1) is in the range of 15-45°, and the angle α between the longitudinal direction of the heat dissipation channel (2) and the vertical line is in the range of 15-45°.

4. The heat dissipating panel according to any one of claims 1 to 3, characterized in that, The heat dissipation channel (2) is composed of independent blind holes arranged in rows, and the blind holes of the adjacent two rows of heat dissipation channels (2) are staggered in the arrangement direction. The blind holes of different rows are connected to form a connecting channel for the flow of the cooling fluid.

5. The heat dissipating panel of claim 4, wherein, The blind holes form four curved side walls of the heat dissipation fin (3), and the connecting channel forms four plane side walls of the heat dissipation fin (3).

6. The heat dissipating panel according to any one of claims 1 to 3, wherein, The heat dissipation channel (2) is composed of continuous wave-shaped channels, the adjacent two rows of heat dissipation channels (2) are staggered in the arrangement direction, and there is overlap in the direction perpendicular to the arrangement direction.

7. The heat dissipating panel of claim 6, wherein, The cross section of the heat dissipation fin (3) is rhombic.

8. A water-cooled heat sink, characterized by The base (5) and the panel base (1) are sealed and covered to form a space for the flow of the cooling fluid, the base (5) is provided with an inlet flow channel (51) for the inlet of the liquid and an outlet flow channel (52) for the outlet of the liquid, The cooling fluid flows through the inlet flow channel (51) and flows into the heat dissipation channel (2), and flows out from the outlet flow channel (52).

9. The water-cooled heat sink of claim 8, wherein, The panel base (1) is provided with two; the base (5) is provided with a flow guide channel (53), the inlet flow channel (51) guides the fluid to the two panel bases (1) through the flow guide channel (53), and the fluid flowing through the two panel bases (1) is collected to the outlet flow channel (52) through the flow guide channel (53).

10. A method of processing a heat spreading panel, characterized by, The application is applied to the heat dissipation panel of any one of claims 1-7 and the water-cooled heat sink of claims 8 or 9, comprising: The panel base (1) is fixed on the inclined workbench tool (6), so that the panel base (1) forms a machining inclination angle β with the horizontal plane; The cutter is perpendicular to the horizontal plane to mill the panel base (1), comprising: The cutter is arranged in a wave shape to form a row of wave-shaped channels on the panel base (1); the next row of wave-shaped channels is processed in a staggered manner, so that the adjacent two rows of wave-shaped channels have overlap in the direction perpendicular to the arrangement direction; Alternatively, the tool first drills independent blind holes in rows on the panel base body (1), and the blind holes in two adjacent rows are staggered with each other in the arrangement direction; and then the tool connects the blind holes in different rows to each other to form the connecting channels for the cooling fluid to flow.

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