A drive motor controller partitioned liquid cooling plate

Abstract

A kind of drive motor controller partition liquid cooling plate, including controller housing, the inside of the controller housing is equipped with heat dissipation base plate, the heat dissipation base plate is sealed with controller housing by sealing ring and forms liquid cooling plate flow channel, the upper end surface of the heat dissipation base plate is equipped with IGBT module, the lower end surface of the heat dissipation base plate is equipped with the heat dissipation column corresponding with IGBT module, the heat dissipation column is located in liquid cooling plate flow channel, the liquid cooling plate flow channel includes two flow channel regions, respectively with the two IGBT half-bridge of IGBT module corresponding, from flow channel import to flow channel export respectively first flow channel region, second flow channel region;The parameter of the liquid cooling plate flow channel meets the following relation:

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of dynamo motor controller, and particularly relates to a partitioned liquid cooling plate for driving motor controller. BACKGROUND

[0002] Under the background of global energy structure upgrading and transformation, the new energy vehicle industry has entered the "fast lane" of rapid development. With the development of electric drive of new energy vehicles towards multi-in-one high integration, high torque density, high power density, high safety level, the heat loss of motor controller and electronic power devices also increases a lot, which puts forward higher requirements for heat dissipation. The heat dissipation directly affects the safe and reliable operation of the motor controller, and further affects the performance of the driving motor and the performance and efficiency of the whole vehicle. When the controller is in a peak working state, its temperature will rise rapidly. Once the temperature exceeds the safe temperature range of the controller, the stability of the controller electronic device will decrease or fail, and even the key components will be burned out.

[0003] At present, the liquid cooling plate of the motor controller in the prior art has the following problems: the cooling liquid enters the flow channel of the liquid cooling plate from the inlet of the liquid cooling plate, and the cooling liquid absorbs heat during the flow process from the inlet of the liquid cooling plate to the outlet of the liquid cooling plate. The temperature of the cooling liquid near the inlet region of the flow channel of the liquid cooling plate is low, and the heat dissipation effect of the corresponding IGBT (Insulated Gate Bipolar Transistor) half-bridge is good, and the temperature of the IGBT half-bridge is low. The temperature of the cooling liquid near the outlet region of the flow channel of the liquid cooling plate is high, and the heat dissipation effect of the corresponding IGBT half-bridge is poor, and the temperature rise of the IGBT half-bridge is easy to exceed the standard, which is easy to cause the failure or burning of the IGBT module; at the same time, the temperature distribution of the heat dissipation substrate is uneven, and the temperature difference is large, and the IGBT module will generate a large periodic thermal stress during operation, which seriously affects the safe and stable operation of the electronic device.

[0004] However, the flow channel structure of the existing controller liquid cooling plate is designed by experience, and needs to be repeatedly tested and modified, which has a long test cycle, low design efficiency, increases the product development cost and development cycle. There is a lack of design method for the flow channel structure of the controller liquid cooling plate, and the flow channel structure of the liquid cooling plate is not reasonable, which is easy to cause uneven cooling of the liquid cooling plate, local temperature rise of the IGBT module exceeding the standard, and failure or burning of the power power device; at the same time, the temperature distribution of the heat dissipation substrate is uneven, and the IGBT module will generate a large periodic thermal stress during operation, which seriously affects the normal work of the electronic device. SUMMARY

[0005] The present application is to solve the technical problems of long design cycle and modification cycle of the design method of the flow channel structure of the liquid cooling plate in the prior art.

[0006] The purpose of the present application is achieved in that:

[0007] A drive motor controller partition liquid cooling plate, comprising a controller shell, a heat dissipation base plate is arranged inside the controller shell, the heat dissipation base plate and the controller shell are sealed by sealing ring to form a liquid cooling plate flow channel, the controller shell is provided with a flow channel inlet and a flow channel outlet communicated with the liquid cooling plate flow channel, the upper end surface of the heat dissipation base plate is provided with an IGBT module, the lower end surface of the heat dissipation base plate is provided with a heat dissipation column corresponding to the IGBT module, the heat dissipation column is located in the liquid cooling plate flow channel, the liquid cooling plate flow channel includes two flow channel regions corresponding to two IGBT half-bridges of the IGBT module, respectively, from the flow channel inlet to the flow channel outlet, it is first flow channel region, second flow channel region;

[0008] Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, the diameter of the heat dissipation column of the first flow channel region is d1, the column spacing between the heat dissipation columns of the first flow channel region is s1, the row spacing between the heat dissipation columns of the first flow channel region is c1, the diameter of the heat dissipation column of the second flow channel region is d2, the column spacing between the heat dissipation columns of the second flow channel region is s2, and the row spacing between the heat dissipation columns of the second flow channel region is c2, the relationship between them is:

[0009]

[0010] Further, the liquid cooling plate flow channel includes three flow channel regions corresponding to three IGBT half-bridges of the IGBT module, respectively, from the flow channel inlet to the flow channel outlet of the liquid cooling plate flow channel, it is first flow channel region, second flow channel region, third flow channel region;

[0011] Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, the diameter of the heat dissipation column of the first flow channel region is d1, the column spacing between the heat dissipation columns of the first flow channel region is s1, the row spacing between the heat dissipation columns of the first flow channel region is c1, the diameter of the heat dissipation column of the second flow channel region is d2, the column spacing between the heat dissipation columns of the second flow channel region is s2, the row spacing between the heat dissipation columns of the second flow channel region is c2, the diameter of the heat dissipation column of the third flow channel region is d3, the column spacing between the heat dissipation columns of the third flow channel region is s3, and the row spacing between the heat dissipation columns of the third flow channel region is c3, the relationship between them is:

[0012] And / or,

[0013] Further, the length of the liquid cooling plate flow channel is l, (B*n-10) mm≤l≤(B*n+10) mm; and / or, the width of the liquid cooling plate flow channel is b, (L-5) mm≤b≤(L+5) mm.

[0014] Wherein, B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of IGBT half-bridges.

[0015] Further, the heat dissipation column is in a cylindrical shape, and the arrangement of the heat dissipation column is in a staggered manner.

[0016] Further, the height h of the heat dissipation column is 3 mm≤h≤10 mm.

[0017] Further, the heat dissipation column is divided into three regions, from the flow channel inlet to the flow channel outlet of the liquid cooling plate, which are the heat dissipation column of the first flow channel region corresponding to the first IGBT half-bridge of the IGBT module, the heat dissipation column of the second flow channel region corresponding to the second IGBT half-bridge of the IGBT module, and the heat dissipation column of the third flow channel region corresponding to the third IGBT half-bridge of the IGBT module.

[0018] The diameter of the heat dissipation column of the first flow channel region is d1, 1 mm≤d1≤5 mm; the heat dissipation columns of the first flow channel region are arranged in a staggered manner along a first preset direction, and the column spacing between adjacent two heat dissipation columns is s1, 1 mm≤s1-d1≤5 mm; the heat dissipation columns of the first flow channel region are arranged in a staggered manner along a second preset direction, and the row spacing between adjacent two rows of heat dissipation columns is c1, 1 mm≤c1-d1≤5 mm.

[0019] The diameter of the heat dissipation column of the second flow channel region is d2, 1 mm≤d2≤5 mm; the heat dissipation columns of the second flow channel region are arranged in a staggered manner along a first preset direction, and the column spacing between adjacent two heat dissipation columns is s2, 1 mm≤s2-d2≤5 mm; the heat dissipation columns of the second flow channel region are arranged in a staggered manner along a second preset direction, and the row spacing between adjacent two rows of heat dissipation columns is c2, 1 mm≤c2-d2≤5 mm.

[0020] The diameter of the heat dissipation column of the third flow channel region is d3, 1 mm≤d3≤5 mm; the heat dissipation columns of the third flow channel region are arranged in a staggered manner along a first preset direction, and the column spacing between adjacent two heat dissipation columns is s3, 1 mm≤s3-d3≤5 mm; the heat dissipation columns of the third flow channel region are arranged in a staggered manner along a second preset direction, and the row spacing between adjacent two rows of heat dissipation columns is c3, 1 mm≤c3-d3≤5 mm.

[0021] Further, the heat dissipation columns of the first flow channel region are arranged in a staggered manner along a first preset direction, and the number of heat dissipation columns in each row is The heat dissipation columns of the first flow channel region are arranged in a second preset direction, and the number of rows of the heat dissipation columns is

[0022] The heat dissipation columns of the second flow channel region are arranged in a first preset direction, and the number of heat dissipation columns in each row is The heat dissipation columns of the second flow channel region are arranged in a second preset direction, and the number of rows of the heat dissipation columns is

[0023] The heat dissipation columns of the third flow channel region are arranged in a first preset direction, and the number of heat dissipation columns in each row is The heat dissipation columns of the third flow channel region are arranged in a second preset direction, and the number of rows of the heat dissipation columns is Wherein, the symbol [] represents an integer.

[0024] Further, the inside of the controller shell is provided with a groove for forming a liquid cooling plate flow channel, the groove is provided with a flow channel inlet and a flow channel outlet on both sides of the groove bottom, and the controller shell is provided with a sealing groove matched with the sealing ring near the groove.

[0025] Further, the heat dissipation substrate is made of copper or silicon carbide aluminum material, and the heat dissipation column is made of aluminum, aluminum alloy or copper material.

[0026] Further, the controller shell is made of aluminum or aluminum alloy material.

[0027] Compared with the prior art, the drive motor controller partition liquid cooling plate of the application has the beneficial effects that: for the drive motor controller liquid cooling plate, the relationship between the specific parameter size and arrangement position of the heat dissipation column in the liquid cooling plate flow channel can be easily obtained through the calculation formula of the structure parameter and arrangement parameter of the heat dissipation column in the liquid cooling plate flow channel, the specific size and arrangement position of the heat dissipation column in the flow channel can be calculated on the basis of ensuring temperature uniformity and heat dissipation performance according to the external forced convection heat transfer law, thereby simplifying the design process of the drive motor controller liquid cooling plate flow channel structure and greatly reducing the design cycle and mold modification cycle of the drive motor controller liquid cooling plate flow channel. Therefore, through the technical solution provided by the application, the technical problem of long design and mold modification cycle of the design method of the drive motor controller liquid cooling plate flow channel structure in the prior art can be solved. BRIEF DESCRIPTION OF DRAWINGS

[0028] The drawings accompanying the specification of this application form a part thereof, serve to provide further understanding of the application, and together with the description of the exemplary embodiments of the application, serve to explain the application, and do not constitute an improper limitation on the application.

[0029] Figure 1 Structure diagram of the partitioned liquid cooling plate of the drive motor controller;

[0030] Figure 2 Structure diagram of the outer side of the controller shell;

[0031] Figure 3 Sectional view of the partitioned liquid cooling plate of the drive motor controller;

[0032] Figure 4 Side view of the partitioned liquid cooling plate of the drive motor controller;

[0033] Figure 5 Structure diagram of the IGBT module on the heat dissipation base plate;

[0034] Figure 6 Structure diagram of the heat dissipation column on the heat dissipation base plate.

[0035] The reference signs: IGBT module 1, first IGBT half-bridge 11, second IGBT half-bridge 12, third IGBT half-bridge 13, controller shell 2, heat dissipation base plate 3, liquid cooling plate flow channel 4, first flow channel area 41, second flow channel area 42, second flow channel area 43, flow channel inlet 44, flow channel outlet 45, heat dissipation column 5, sealing ring 6. DETAILED DESCRIPTION

[0036] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0037] Reference Figures 1 to 6 A partitioned liquid cooling plate of a drive motor controller, comprising a controller shell 2, a heat dissipation base plate 3 arranged inside the controller shell 2, the heat dissipation base plate 3 and the controller shell 2 are sealed by a sealing ring 6 to form a liquid cooling plate flow channel 4, the controller shell 2 is provided with a flow channel inlet 44 and a flow channel outlet 45 which are in communication with the liquid cooling plate flow channel 4, the inner side of the controller shell 2 is provided with a groove for forming the liquid cooling plate flow channel 4, the groove bottom of the groove is respectively provided with the flow channel inlet 44 and the flow channel outlet 45 of the liquid cooling plate flow channel 4, the controller shell 2 is provided with a sealing groove near the groove which cooperates with the sealing ring 6, and the sealing ring 6 is located in the sealing groove to seal the gap between the controller shell 2 and the heat dissipation base plate 3. The upper end surface of the heat dissipation base plate 3 is provided with an IGBT module, the lower end surface of the heat dissipation base plate 3 is provided with a heat dissipation column 5 corresponding to the IGBT module 1, the heat dissipation column 5 is located in the liquid cooling plate flow channel 4, and a small gap can be left between the heat dissipation column 5 and the groove bottom of the groove of the controller shell 2. The liquid cooling plate flow channel 4 includes two flow channel areas corresponding to two IGBT half-bridges of the IGBT module 1, and the first flow channel area 41 and the second flow channel area 42 are respectively arranged from the flow channel inlet 44 to the flow channel outlet 45.

[0038] wherein the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, the diameter of the heat dissipation column of the first flow channel area is d1, the column spacing between the heat dissipation columns of the first flow channel area is s1, the row spacing between the heat dissipation columns of the first flow channel area is c1, the diameter of the heat dissipation column of the second flow channel area is d2, the column spacing between the heat dissipation columns of the second flow channel area is s2, and the row spacing between the heat dissipation columns of the second flow channel area is c2, and the relationship between them is:

[0039]

[0040] Preferably, the liquid cooling plate flow channel 4 includes three flow channel areas corresponding to the three IGBT half-bridges of the IGBT module 1, respectively, from the flow channel inlet 44 to the flow channel outlet 45 of the liquid cooling plate flow channel 4, which are the first flow channel area 41, the second flow channel area 42, and the third flow channel area 43, respectively.

[0041] wherein the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, the diameter of the heat dissipation column of the first flow channel area is d1, the column spacing between the heat dissipation columns of the first flow channel area is s1, the row spacing between the heat dissipation columns of the first flow channel area is c1, the diameter of the heat dissipation column of the second flow channel area is d2, the column spacing between the heat dissipation columns of the second flow channel area is s2, the row spacing between the heat dissipation columns of the second flow channel area is c2, the diameter of the heat dissipation column of the third flow channel area is d3, the column spacing between the heat dissipation columns of the third flow channel area is s3, and the row spacing between the heat dissipation columns of the third flow channel area is c3, and the relationship between them is:

[0042] and / or,

[0043] It should be noted that the liquid cooling plate flow channel 4 of the embodiment is a cooling liquid flow channel, and the main function of the drive motor controller partition liquid cooling plate is to dissipate heat for the IGBT module 1. The heat loss of the IGBT module 1 is taken away by the cooling liquid flowing through the liquid cooling plate flow channel 4, the temperature rise of the IGBT module 1 is reduced, the IGBT module operates in a safe temperature range, and the reliability of the stable operation of the controller is ensured.

[0044] The driving motor controller partition liquid cooling plate provided in the embodiment can obtain the relationship between the specific parameter sizes of the flow channel structure of the driving motor controller partition liquid cooling plate through the above relationship and the forced convection heat transfer law of fluid across the outside of the tube bundle during heat dissipation, the relationship is based on the influence of the diameter of the heat dissipation column 5 of the driving motor controller partition liquid cooling plate, the column spacing between the heat dissipation columns 5, and the row spacing between the heat dissipation columns 5 on the heat dissipation performance of the driving motor controller partition liquid cooling plate and the temperature distribution of the heat dissipation substrate 3, which improves the uniformity of the temperature distribution of the heat dissipation substrate 3, reduces the risk of local temperature rise of the IGBT module 1 exceeding the standard, reduces the periodic thermal stress of the IGBT module, and improves the reliability of stable operation of the driving motor controller.

[0045] The driving motor controller partition liquid cooling plate provided in the embodiment can obtain the relationship between the specific parameter sizes of the flow channel structure of the driving motor controller partition liquid cooling plate through the above relationship and the forced convection heat transfer law of fluid across the outside of the tube bundle during heat dissipation, the relationship is based on the influence of the diameter of the heat dissipation column 5 of the driving motor controller partition liquid cooling plate, the column spacing between the heat dissipation columns 5, and the row spacing between the heat dissipation columns 5 on the heat dissipation performance of the driving motor controller partition liquid cooling plate and the temperature distribution of the heat dissipation substrate 3, which improves the uniformity of the temperature distribution of the heat dissipation substrate 3, reduces the risk of local temperature rise of the IGBT module 1 exceeding the standard, reduces the periodic thermal stress of the IGBT module, and improves the reliability of stable operation of the driving motor controller.

[0046] Specifically, the length of the liquid cooling plate flow channel 4 is l, and (B*n-10) mm≤l≤(B*n+10) mm; and / or, the width of the liquid cooling plate flow channel 4 is b, and (L-5) mm≤b≤(L+5) mm.

[0047] Wherein, B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of IGBT half-bridges. The number of IGBT half-bridges n=3 in the embodiment is the commonly used number of IGBT half-bridges of the IGBT module of the driving motor controller in the electric vehicle industry. The length and width of the liquid cooling plate flow channel 4 satisfy the above two relationship formulas, so that the length and width of the liquid cooling plate flow channel 4 can be prevented from being too small to cause insufficient heat dissipation capacity or poor temperature uniformity of the heat dissipation substrate 3, and the structure size of the driving motor controller partition liquid cooling plate can be prevented from being too large to increase the material cost and volume.

[0048] Specifically, the heat dissipation column 5 is in a cylindrical shape, and the heat dissipation columns 5 are arranged in a staggered manner. The heat dissipation columns are arranged at intervals along a first preset direction, and the heat dissipation columns are arranged at intervals along a second preset direction. In this way, the turbulence disturbance intensity of the cooling liquid in the liquid cooling plate flow channel 3 can be improved, and the forced convection heat transfer performance is enhanced, so as to improve the heat dissipation capacity of the controller liquid cooling plate and reduce the temperature rise of the IGBT module. The first preset direction of the embodiment is the width direction of the liquid cooling plate flow channel 4, and the second preset direction is the length direction of the liquid cooling plate flow channel 4.

[0049] Specifically, the height h of the heat dissipation column (5) is 3mm≤h≤10mm, so that a better heat dissipation effect can be obtained.

[0050] Specifically, the heat dissipation column 5 is divided into three regions, from the flow channel inlet 44 to the flow channel outlet 45 of the liquid cooling plate flow channel 4, which are the heat dissipation columns corresponding to the first IGBT half-bridge 11 of the IGBT module 1, the heat dissipation columns corresponding to the second IGBT half-bridge 12 of the IGBT module 1, and the heat dissipation columns corresponding to the third IGBT half-bridge 13 of the IGBT module 1. From the flow channel inlet 44 to the flow channel outlet 45 of the liquid cooling plate flow channel 4, the cooling liquid continuously absorbs the heat loss of the IGBT module 1 during the flow process, the temperature of the cooling liquid continuously rises, and the heat dissipation capacity of the cooling liquid gradually weakens. The liquid cooling plate flow channel 4 is divided into a first flow channel region 41, a second flow channel region 42, and a third flow channel region 43. In this way, according to the cooling liquid temperature change law, different heat dissipation column structure parameters and arrangement positions are designed in different flow channel regions, which can ensure the uniformity of the liquid cooling plate heat dissipation and prevent the power device from failing or being damaged due to the excessive temperature rise of the third IGBT half-bridge 13.

[0051] The diameter of the heat dissipation column in the first flow channel region is d1, and 1mm≤d1≤5mm. The heat dissipation columns in the first flow channel region are arranged at intervals along the first preset direction, and the column spacing between adjacent two heat dissipation columns is s1, and 1mm≤s1-d1≤5mm. The heat dissipation columns in the first flow channel region are arranged at intervals along the second preset direction, and the row spacing between adjacent two rows of heat dissipation columns is c1, and 1mm≤c1-d1≤5mm.

[0052] The diameter of the heat dissipation column in the second flow channel region is d2, and 1mm≤d2≤5mm. The heat dissipation columns in the second flow channel region are arranged at intervals along the first preset direction, and the column spacing between adjacent two heat dissipation columns is s2, and 1mm≤s2-d2≤5mm. The heat dissipation columns in the second flow channel region are arranged at intervals along the second preset direction, and the row spacing between adjacent two rows of heat dissipation columns is c2, and 1mm≤c2-d2≤5mm.

[0053] The diameter of the heat dissipation column of the third flow channel region is d3, and 1mm≤d3≤5mm; the heat dissipation columns of the third flow channel region are arranged at intervals along a first preset direction, the column spacing between adjacent two heat dissipation columns is s3, and 1mm≤s3-d3≤5mm; the heat dissipation columns of the third flow channel region are arranged at intervals along a second preset direction, the row spacing between adjacent two rows of heat dissipation columns is c3, and 1mm≤c3-d3≤5mm.

[0054] According to the process processing feasibility, when the diameter of the heat dissipation column 5 is less than 1mm, the processing difficulty of the heat dissipation column of the heat dissipation substrate will be significantly increased; when the diameter of the heat dissipation column 5 is greater than 5mm, a larger vortex area will be generated behind the heat dissipation column 5, resulting in a significant reduction in the convective heat transfer performance of the liquid cooling plate. The column spacing between adjacent two heat dissipation columns 5 in the first flow channel region 41, the column spacing between adjacent two heat dissipation columns 5 in the second flow channel region 42, and the column spacing between adjacent two heat dissipation columns 5 in the third flow channel region 43 respectively satisfy the above three relationship formulas, so that the liquid cooling plate flow channel can meet the flow resistance loss requirement, and the forced convective heat transfer performance of the liquid cooling plate is ensured; when the flow channel size between adjacent two heat dissipation columns is less than 1mm, the fluid flow channel is too narrow, the flow channel cross-sectional area is too small, the flow velocity is too large, and the flow resistance loss in the liquid cooling plate flow channel will be significantly increased; when the flow channel size between adjacent two heat dissipation columns is greater than 5mm, the fluid flow channel cross-sectional area is too large, the flow velocity is too small, and the forced convective heat transfer performance in the liquid cooling plate flow channel is significantly reduced. The row spacing between adjacent two rows of heat dissipation columns 5 in the first flow channel region 41, the row spacing between adjacent two rows of heat dissipation columns 5 in the second flow channel region 42, and the row spacing between adjacent two rows of heat dissipation columns 5 in the third flow channel region 43 respectively satisfy the above three relationship formulas, so that the liquid cooling plate flow channel can meet the flow resistance loss requirement, and the total forced convective heat transfer area of the heat dissipation column 5 in the liquid cooling plate flow channel 4 is ensured to meet the heat dissipation amount requirement of the liquid cooling plate.

[0055] Specifically, the heat dissipation columns of the first flow channel region are arranged at intervals along a first preset direction, the number of heat dissipation columns in each row is The heat dissipation columns of the first flow channel region are arranged at intervals along a second preset direction, and the number of rows of heat dissipation columns is

[0056] The heat dissipation columns of the second flow channel region are arranged at intervals along a first preset direction, the number of heat dissipation columns in each row is The heat dissipation columns of the second flow channel region are arranged at intervals along a second preset direction, and the number of rows of heat dissipation columns is

[0057] The heat dissipation columns of the third flow channel region are arranged at intervals along a first preset direction, the number of heat dissipation columns in each row is The heat dissipation columns of the third flow channel region are arranged at intervals along a second preset direction, and the number of rows of heat dissipation columns is where the symbol [ ] represents an integer.

[0058] Specifically, the heat dissipation substrate 3 is made of copper or silicon carbide aluminum, etc., the heat dissipation column 5 is made of aluminum, or aluminum alloy, or copper, etc. The controller housing 2 is made of aluminum or aluminum alloy, etc. The heat dissipation substrate 3, the heat dissipation column 5 and the controller housing 2 are all made of high thermal conductivity materials, so that the heat conduction effect can be improved to improve the heat transfer capacity of the IGBT module 1 to the heat dissipation substrate 3 and the heat dissipation column 5, improve the heat dissipation performance of the drive motor controller partition liquid cooling plate, reduce the temperature rise of the IGBT module 1, and improve the temperature rise reliability of the controller. The heat dissipation substrate 3 and the controller housing 2 are connected by bolts, welding or other conventional connection methods, and the heat dissipation substrate 3 and the heat dissipation column 5 are connected by welding, one-piece forming or other conventional connection methods.

[0059] It should be noted that the IGBT module is installed on the upper end surface of the heat dissipation substrate 3 and is composed of three IGBT half-bridges, and IGBT is the main heat source. The difference between the maximum temperature rises of the adjacent IGBT half-bridges in the embodiment is less than or equal to 2℃.

[0060] The heat generation Φ of a single IGBT half-bridge, the IGBT module is composed of n IGBT half-bridges, q m is the mass flow rate of the cooling liquid, c is the specific heat capacity of the cooling liquid, the cooling liquid flows through the liquid cooling plate flow channel to absorb the loss heat of the IGBT, and the temperature of the cooling liquid gradually rises. The temperature difference Δt between the cooling liquid inlet and the cooling liquid outlet:

[0061]

[0062] The contact area between the liquid cooling plate flow channel wall and the cooling liquid is A, the convective heat transfer coefficient h' between the liquid cooling plate flow channel wall and the cooling liquid, the average temperature of the liquid cooling plate flow channel wall is t 板 , the average temperature of the cooling liquid is t 液 , and the forced convection heat transfer Φ 对流 between the liquid cooling plate flow channel wall and the cooling liquid:

[0063] Φ 对流 = h' A (t 板 -t 液 );

[0064] The Nusselt number Nu of the single-phase fluid convective heat transfer in the liquid cooling plate flow channel is affected by the flow Reynolds number Re and the Prandtl number Pr of the cooling liquid:

[0065] Nu = f (Re, Pr);

[0066] The thermal conductivity of the cooling liquid is λ, the diameter of the heat dissipation column is d, and the convective heat transfer coefficient h' between the liquid cooling plate flow channel wall and the cooling liquid;

[0067] h' = Nu * lambda / d

[0068] In the process of cooling and heat dissipation of the liquid cooling plate, the heat flow in the heat transfer process satisfies the relationship:

[0069] Φ = Φ 对流 .

[0070] The above five formulas are conventional theoretical formulas, and those skilled in the art can understand their specific meanings and calculation methods.

[0071] According to the heat transfer law in the cooling and heat dissipation process of the liquid cooling plate, through theoretical derivation, numerical simulation and experimental verification, the influence law of the diameter of the heat dissipation column of the liquid cooling plate, the column spacing of the heat dissipation column and the row spacing of the heat dissipation column on the temperature distribution of the heat dissipation substrate is found, the flow channel structure design method of the partitioned liquid cooling plate of the drive motor controller is obtained, the flow channel structure of the controller liquid cooling plate is quickly designed, the design efficiency of the controller liquid cooling plate is improved, the test and mold modification times are reduced, the development cost of the drive motor controller liquid cooling plate is reduced, the uniform heat dissipation performance of the liquid cooling plate is improved, the local temperature rise of the IGBT module is prevented, the thermal stress of the IGBT module is reduced, and the safety and reliability of the long-term stable operation of the drive motor controller are improved.

[0072] The partitioned liquid cooling plate of the drive motor controller realizes the following technical effects: a flow channel structure design method of the partitioned liquid cooling plate of the drive motor controller is provided, the design efficiency of the flow channel structure of the liquid cooling plate of the drive motor controller is improved, the test times and mold modification times are reduced, the development cycle is shortened, the development cost and test cost are reduced, the risk of local temperature rise of the IGBT module is reduced, the temperature uniformity of the liquid heat dissipation substrate is improved, the periodic thermal stress of the IGBT module during operation is reduced, the temperature rise safety requirement of the power device in the drive motor controller is met, and the long-term stable operation reliability of the drive motor controller is improved.

[0073] It is to be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0074] The relative positions, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the various parts shown in the drawings are not drawn in accordance with the actual proportional relationship for the convenience of description. The techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the authorized description under appropriate circumstances. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0075] In the description of the present application, it should be understood that the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and in the absence of contrary statements, these orientation words do not indicate and imply that the devices or elements referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of the parts themselves.

[0076] For the convenience of description, spatial relative terms such as "over", "above", "upper surface", "upper", "upper end surface", etc. can be used herein to describe the spatial positional relationship of one device or feature with respect to other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the devices described in the drawings. For example, if the devices in the drawings are inverted, the device described as "above" or "over" other devices or structures will be positioned "below" or "under" the other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0077] In addition, it should be noted that the use of the words "first", "second", and the like to define parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as a limitation on the scope of protection of the present application.

[0078] For the convenience of description, the above description can be only the preferred embodiments of the present application, and is not used to limit the present application. The present application can have various changes and variations for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A partitioned liquid cooling plate for a drive motor controller, characterized in that: The system includes a controller housing (2), with a heat dissipation substrate (3) on the inner side of the controller housing (2). The heat dissipation substrate (3) and the controller housing (2) are sealed by a sealing ring (6) to form a liquid cooling plate channel (4). The controller housing (2) has a channel inlet (44) and a channel outlet (45) that communicate with the liquid cooling plate channel (4). The upper end face of the heat dissipation substrate (3) is provided with an IGBT module, and the lower end face of the heat dissipation substrate (3) is provided with a heat dissipation column (5) corresponding to the IGBT module (1). The heat dissipation column (5) is located inside the liquid cooling plate channel (4). The liquid cooling plate channel (4) includes two channel regions, which correspond to the two IGBT half-bridges of the IGBT module (1) respectively. The channel inlet (44) to the channel outlet (45) are respectively the first channel region (41) and the second channel region (42). Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat sink is h, the diameter of the heat sink in the first flow channel region is d1, the column spacing between the heat sinks in the first flow channel region is s1, the row spacing between the heat sinks in the first flow channel region is c1, the diameter of the heat sink in the second flow channel region is d2, the column spacing between the heat sinks in the second flow channel region is s2, and the row spacing between the heat sinks in the second flow channel region is c2, the relationship between them is:

2. The partitioned liquid cooling plate for the drive motor controller according to claim 1, characterized in that: The liquid cooling plate flow channel (4) includes three flow channel regions, which correspond to the three IGBT half-bridges of the IGBT module (1) respectively. The flow channel inlet (44) to the flow channel outlet (45) of the liquid cooling plate flow channel (4) are the first flow channel region (41), the second flow channel region (42), and the third flow channel region (43). Wherein, the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat sink is h, the diameter of the heat sink in the first flow channel region is d1, the column spacing between the heat sinks in the first flow channel region is s1, the row spacing between the heat sinks in the first flow channel region is c1, the diameter of the heat sink in the second flow channel region is d2, the column spacing between the heat sinks in the second flow channel region is s2, the row spacing between the heat sinks in the second flow channel region is c2, the diameter of the heat sink in the third flow channel region is d3, the column spacing between the heat sinks in the third flow channel region is s3, and the row spacing between the heat sinks in the third flow channel region is c3, the relationship between them is:

3. The partitioned liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The length of the liquid cooling plate channel (4) is l , ( -10) mm ≤ l ≤( +10) mm; and / or, the width of the liquid cooling plate channel (4) is b (L-5) mm ≤ b ≤ (L+5) mm; Where B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of IGBT half-bridges.

4. The partitioned liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The heat dissipation column (5) is cylindrical and arranged in a staggered pattern.

5. The partitioned liquid cooling plate for the drive motor controller according to claim 1 or 2, characterized in that: The height h of the heat dissipation column (5) is 3mm ≤ h ≤ 10mm.

6. The partitioned liquid cooling plate for the drive motor controller according to claim 2, characterized in that: The heat dissipation column (5) is divided into three regions, from the inlet (44) of the liquid cooling plate channel (4) to the outlet (45), which are respectively the heat dissipation column of the first channel region corresponding to the first IGBT half-bridge (11) of the IGBT module (1), the heat dissipation column of the second channel region corresponding to the second IGBT half-bridge (12) of the IGBT module (1), and the heat dissipation column of the third channel region corresponding to the third IGBT half-bridge (13) of the IGBT module (1); The diameter of the heat dissipation column in the first flow channel region is d1, 1mm≤d1≤5mm; the heat dissipation column in the first flow channel region is spaced apart along a first preset direction, and the column spacing between two adjacent heat dissipation columns is s1, 1mm≤s1-d1≤5mm; the heat dissipation column in the first flow channel region is spaced apart along a second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c1, 1mm≤c1-d1≤5mm. The diameter of the heat dissipation column in the second flow channel region is d2, 1mm≤d2≤5mm; the heat dissipation column in the second flow channel region is spaced apart along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s2, 1mm≤s2-d2≤5mm; the heat dissipation column in the second flow channel region is spaced apart along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c2, 1mm≤c2-d2≤5mm. The diameter of the heat dissipation columns in the third flow channel region is d3, 1mm≤d3≤5mm; the heat dissipation columns in the third flow channel region are spaced apart along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s3, 1mm≤s3-d3≤5mm; the heat dissipation columns in the third flow channel region are spaced apart along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c3, 1mm≤c3-d3≤5mm.

7. The partitioned liquid cooling plate for the drive motor controller according to claim 6, characterized in that: The heat dissipation columns in the first flow channel region are spaced apart along a first preset direction, and the number of heat dissipation columns in each row is [number missing]. The heat dissipation columns in the first flow channel region are spaced apart along a second preset direction, and the number of rows of the heat dissipation columns is [number missing]. ; The heat dissipation columns in the second flow channel region are spaced apart along a first preset direction, and the number of heat dissipation columns in each row is [number missing]. The heat dissipation columns in the second flow channel region are spaced apart along a second preset direction, and the number of rows of heat dissipation columns is [number missing]. ; The heat dissipation columns in the third flow channel region are spaced apart along a first preset direction, and the number of heat dissipation columns in each row is [number missing]. The heat dissipation columns in the third flow channel region are spaced apart along a second preset direction, and the number of rows of heat dissipation columns is [number missing]. ; among which symbols This represents taking the integer part.

8. The partitioned liquid cooling plate for the drive motor controller according to claim 1, characterized in that: The controller housing (2) has a groove on its inner side for forming a liquid cooling plate channel (4). The bottom of the groove has a channel inlet (44) and a channel outlet (45) of the liquid cooling plate channel (4) on both sides. The controller housing (2) has a sealing groove near the groove that cooperates with the sealing ring (6).

9. The partitioned liquid cooling plate for the drive motor controller according to claim 1, characterized in that: The heat dissipation substrate (3) is made of copper or silicon carbide aluminum material, and the heat dissipation column (5) is made of aluminum, aluminum alloy, or copper material.

10. The partitioned liquid cooling plate for the drive motor controller according to claim 1, characterized in that: The controller housing (2) is made of aluminum or aluminum alloy.

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