Drive motor controller liquid cooling plate

Abstract

A kind of drive motor controller liquid cooling plate, comprising: the shell of controller, IGBT module is arranged inside the shell of controller;Substrate, the substrate is arranged between IGBT module and the shell of controller, the substrate is sealed with controller shell to form liquid cooling plate flow channel, the shell of controller is equipped with flow channel entrance and flow channel exit communicated with liquid cooling plate flow channel;Heat dissipation column, the heat dissipation column is set to the lower end surface of substrate, with the IGBT module corresponding to the upper end surface of substrate, the heat dissipation column is located in liquid cooling plate flow channel;The liquid cooling plate flow channel includes two flow channel regions, from flow channel entrance to flow channel exit respectively first flow channel region, second flow channel region, each flow channel region is respectively corresponding with each IGBT half bridge of IGBT module;The parameter of the liquid cooling plate flow channel satisfies the following relation:

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of drive motor controller, in particular to a drive motor controller liquid cooling plate. BACKGROUND

[0002] The drive motor controller liquid cooling plate is a device for heat dissipation of the drive motor controller in the new energy electric vehicle. In the electric vehicle industry, since the drive motor controller needs to continuously convert power, a large amount of heat will be generated, which may cause damage to the controller or shorten the service life if not dissipated in time. The current drive motor controller liquid cooling plate has the problem that the cooling liquid enters the liquid cooling plate flow channel from the flow channel inlet of the motor controller liquid cooling plate, cools the corresponding IGBT (Insulated Gate Bipolar Transistor) half-bridge through the liquid cooling plate flow channel, and then flows out from the flow channel outlet. However, the cooling liquid continuously absorbs the heat of the IGBT half-bridge during the flow in the liquid cooling plate flow channel, and the temperature of the cooling liquid continuously rises. Thus, the cooling liquid near the flow channel inlet area has low temperature, the corresponding IGBT half-bridge has good heat dissipation effect, and the temperature of the IGBT half-bridge is low; the cooling liquid near the flow channel outlet area has high temperature, the corresponding IGBT half-bridge has poor heat dissipation effect, and the temperature rise of the IGBT half-bridge is prone to exceed the standard, thereby causing the service life of the IGBT module to be shortened, and even failure or burning; at the same time, the temperature distribution of the drive motor controller liquid cooling plate is uneven, the temperature difference is large, and the IGBT module will generate a large periodic thermal stress during the operation of the motor controller, which seriously affects the safe and stable operation of the motor controller.

[0003] At present, the liquid cooling plate flow channel structure of the controller liquid cooling plate is designed relying on experience, and needs to be repeatedly tested and modified, which has a long test cycle, low design efficiency, great product development difficulty, high development cost, and long development cycle. Moreover, the liquid cooling plate flow channel structure is not reasonably designed, which is prone to cause uneven cooling of the liquid cooling plate, local temperature rise of the IGBT module exceeding the standard, and failure or burning of the power device; at the same time, the temperature distribution of the heat dissipation substrate is uneven, and the IGBT module will generate a large periodic thermal stress during the operation, which seriously affects the normal work of the electronic device. SUMMARY

[0004] The present application aims at the problems in the prior art, and provides a drive motor controller liquid cooling plate, which solves the problems of uneven temperature distribution and large temperature difference of the liquid cooling plate, large periodic thermal stress generated during the operation, serious influence on the safety of the electronic device, and the need for repeated testing and modification in the design process of the liquid cooling plate flow channel structure, long test cycle, low design efficiency, great product development difficulty, high development cost, and long development cycle.

[0005] The present application is achieved in the following way:

[0006] A driving motor controller liquid cooling plate, comprising:

[0007] A controller shell, an IGBT module is arranged inside the controller shell;

[0008] A base plate is arranged between the IGBT module and the controller shell, the base plate and the controller shell form a liquid cooling plate flow channel, and the controller shell is provided with a flow channel inlet and a flow channel outlet in communication with the liquid cooling plate flow channel;

[0009] A heat dissipation column is arranged at the lower end face of the base plate and corresponds to the IGBT module at the upper end face of the base plate, and the heat dissipation column is located in the liquid cooling plate flow channel;

[0010] The liquid cooling plate flow channel includes two flow channel regions, which are a first flow channel region and a second flow channel region from the flow channel inlet to the flow channel outlet, and each flow channel region corresponds to each IGBT half-bridge of the IGBT module;

[0011] Wherein, the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total number of rows of the heat dissipation column is m; the diameter of the heat dissipation column in the first flow channel region is d1, the number of rows of the heat dissipation column in the first flow channel region is n1, the diameter of the heat dissipation column in the second flow channel region is d2, the number of rows of the heat dissipation column in the second flow channel region is n2, the circumference is π, and the parameters of the liquid cooling plate flow channel satisfy the following relationship:

[0012]

[0013] Further, the liquid cooling plate flow channel includes three flow channel regions, which are a first flow channel region, a second flow channel region and a third flow channel region from the flow channel inlet to the flow channel outlet; the IGBT module includes three IGBT half-bridges, which are a first IGBT half-bridge, a second IGBT half-bridge and a third IGBT half-bridge, the first flow channel region corresponds to the first IGBT half-bridge, the second flow channel region corresponds to the second IGBT half-bridge, and the third flow channel region corresponds to the third IGBT half-bridge;

[0014] Wherein, the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total number of rows of the heat dissipation column is m; the diameter of the heat dissipation column in the first flow channel region is d1, the number of rows of the heat dissipation column in the first flow channel region is n1, the diameter of the heat dissipation column in the second flow channel region is d2, the number of rows of the heat dissipation column in the second flow channel region is n2, the diameter of the heat dissipation column in the third flow channel region is d3, the number of rows of the heat dissipation column in the third flow channel region is n3, the circumference is π, and the parameters of the liquid cooling plate flow channel satisfy the following relationship:

[0015] and / or,

[0016]

[0017] Further, the length of the liquid cooling plate flow channel is L, (b*n0-10) mm≤L≤(b*n0+10) mm; and / or,

[0018] The width of the liquid cooling plate flow channel is B, (l-10) mm≤B≤(l+10) mm;

[0019] Wherein, n0 is the number of IGBT half-bridges of the IGBT module, b is the width of the IGBT half-bridge, and l is the length of the IGBT half-bridge.

[0020] Further, the heat dissipation column is cylindrical, and the arrangement mode of the heat dissipation column adopts a cross arrangement.

[0021] Further, the height h of the heat dissipation column is 3mm≤h≤10mm.

[0022] Further, the heat dissipation columns are arranged along the length direction of the liquid cooling plate flow channel, the number of rows of the heat dissipation columns is m, and each row of the heat dissipation columns is arranged along the width direction of the liquid cooling plate flow channel,

[0023] The diameter of the heat dissipation column in the first flow channel region is d1, 1mm≤d1≤5mm; the number of rows of the heat dissipation columns in the first flow channel region is n1, and the spacing between two adjacent heat dissipation columns in the same row is s1, and 1mm≤s1-d1≤5mm;

[0024] The diameter of the heat dissipation column in the second flow channel region is d2, 1mm≤d2≤5mm; the number of rows of the heat dissipation columns in the second flow channel region is n2, and the spacing between two adjacent heat dissipation columns in the same row is s2, and 1mm≤s2-d2≤5mm;

[0025] The diameter of the heat dissipation column in the third flow channel region is d3, 1mm≤d3≤5mm; the number of rows of the heat dissipation columns in the third flow channel region is n3, and the spacing between two adjacent heat dissipation columns in the same row is s3, and 1mm≤s3-d3≤5mm.

[0026] Further, the total number of rows of the heat dissipation columns arranged along the length direction of the liquid cooling plate flow channel is m, the m is an integer multiple of 3, and the spacing between two adjacent rows of the heat dissipation columns is c, and 1mm≤

[0027] c-d1≤5mm, 1mm≤c-d2≤5mm, 1mm≤c-d3≤5mm, wherein d1 is the diameter of the heat dissipation column of the first flow channel area, d2 is the diameter of the heat dissipation column of the second flow channel area, and d3 is the diameter of the heat dissipation column of the third flow channel area.

[0028] Further, a groove is arranged on the inner side of the shell of the controller, the groove is provided with a flow channel inlet and a flow channel outlet on both sides of the groove bottom, and the shell of the controller and the four edges of the base plate are sealed by a sealing ring, so that the groove and the base plate cooperate to form a liquid cooling plate flow channel.

[0029] Further, the base plate is made of copper or silicon carbide aluminum material, and the heat dissipation column is made of aluminum, aluminum alloy or copper material.

[0030] Further, the shell of the controller is made of aluminum or aluminum alloy material.

[0031] According to the technical scheme of the application, for the liquid cooling plate of the drive motor controller, the specific parameter size and quantity relationship of the heat dissipation column in the flow channel of the liquid cooling plate can be obtained by the above calculation formula of the parameters and quantity of the heat dissipation column in the flow channel of the liquid cooling plate, the calculation formula is obtained according to the external forced convection heat transfer law, so that the specific size and quantity of the heat dissipation column in the flow channel of the liquid cooling plate of the drive motor controller can be selected and calculated on the basis of ensuring temperature uniformity and heat dissipation performance, thereby simplifying the design process of the flow channel structure of the liquid cooling plate of the drive motor controller, and reducing the design cycle and mold modification cycle of the flow channel of the liquid cooling plate of the drive motor controller to a certain extent. Therefore, by the technical scheme provided by the application, the technical problem of long design and mold modification cycle of the design method of the flow channel structure of the liquid cooling plate of the drive motor controller in the prior art can be solved. BRIEF DESCRIPTION OF DRAWINGS

[0032] The drawings accompanying the specification of this application form a part thereof, serve to provide further understanding of the application, and together with the description of the exemplary embodiments of the application given below, make an explanation of the application, and do not constitute an improper limitation of the application.

[0033] Figure 1 It is a schematic diagram of the liquid cooling plate structure of the drive motor controller;

[0034] Figure 2 It is a schematic diagram of the outer side structure of the controller shell;

[0035] Figure 3 It is a sectional view of the liquid cooling plate of the drive motor controller;

[0036] Figure 4 It is a side view of the liquid cooling plate of the drive motor controller;

[0037] Figure 5 It is a schematic diagram of the structure of the IGBT module on the base plate;

[0038] Figure 6 Figure 1 is a schematic diagram of the structure of the heat dissipation column on the substrate.

[0039] Reference signs: IGBT module 1, first IGBT half-bridge 11, second IGBT half-bridge 12, third IGBT half-bridge 13, controller housing 2, substrate 3, liquid cooling plate flow channel 4, first flow channel area 41, second flow channel area 42, second flow channel area 43, flow channel inlet 44, flow channel outlet 45, heat dissipation column 5, sealing ring 6. DETAILED DESCRIPTION

[0040] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0041] Reference Figures 1 to 6 A liquid cooling plate for driving motor controller, characterized in that it comprises:

[0042] The controller housing 2 is provided with an IGBT module 1 on the inner side of the controller housing 2;

[0043] The substrate 3 is arranged between the IGBT module 1 and the controller housing 2, and the substrate 3 and the controller housing 2 form a liquid cooling plate flow channel 4 in a sealed manner. The controller housing 2 is provided with a flow channel inlet 44 and a flow channel outlet 45 which communicate with the liquid cooling plate flow channel 4. The inner side of the controller housing 2 is provided with a groove, and the groove is provided with the flow channel inlet 44 and the flow channel outlet 45 on both sides of the groove bottom. The controller housing 2 and the substrate 3 are sealed by a sealing ring 6 on four sides, so that the groove and the substrate 3 cooperate to form the liquid cooling plate flow channel 4. The controller housing 2 is provided with a sealing groove near the groove, which cooperates with the sealing ring 6. The sealing ring 6 is located in the sealing groove to seal the gap between the controller housing 2 and the substrate 3.

[0044] The heat dissipation column 5 is arranged at the lower end surface of the substrate 3 and corresponds to the IGBT module 1 at the upper end surface of the substrate 3. The heat dissipation column 5 is located in the liquid cooling plate flow channel 4. The heat dissipation column 5 cooperates with the small gap between the groove bottom of the groove of the controller housing 2.

[0045] The liquid cooling plate flow channel 4 includes two flow channel areas, i.e. the first flow channel area 41 and the second flow channel area 42 from the flow channel inlet 44 to the flow channel outlet 45. Each flow channel area corresponds to each IGBT half-bridge of the IGBT module 1.

[0046] Wherein, the liquid cooling plate flow channel length is L, the liquid cooling plate flow channel width is B, the heat dissipation column height is h, and the total number of rows of the heat dissipation column is m; the diameter of the heat dissipation column in the first flow channel area is d1, the number of rows of the heat dissipation column in the first flow channel area is n1, the diameter of the heat dissipation column in the second flow channel area is d2, the number of rows of the heat dissipation column in the second flow channel area is n2, the diameter of the heat dissipation column in the third flow channel area is d3, the number of rows of the heat dissipation column in the third flow channel area is n3, and the circumference ratio is π. The parameters of the liquid cooling plate flow channel satisfy the following relationship:

[0047]

[0048] The liquid cooling plate flow channel 4 of the embodiment includes three flow channel areas, the first flow channel area 41, the second flow channel area 42, and the third flow channel area 43 from the flow channel inlet 44 to the flow channel outlet 45; the IGBT module 1 includes three IGBT half-bridges, the first IGBT half-bridge 11, the second IGBT half-bridge 12, and the third IGBT half-bridge 13, the first flow channel area 41 corresponds to the first IGBT half-bridge 11, the second flow channel area 42 corresponds to the second IGBT half-bridge 12, and the third flow channel area 43 corresponds to the third IGBT half-bridge 13.

[0049] Wherein, the liquid cooling plate flow channel length is L, the liquid cooling plate flow channel width is B, the heat dissipation column height is h, and the total number of rows of the heat dissipation column is m; the diameter of the heat dissipation column in the first flow channel area is d1, the number of rows of the heat dissipation column in the first flow channel area is n1, the diameter of the heat dissipation column in the second flow channel area is d2, the number of rows of the heat dissipation column in the second flow channel area is n2, the diameter of the heat dissipation column in the third flow channel area is d3, the number of rows of the heat dissipation column in the third flow channel area is n3, and the circumference ratio is π. The parameters of the liquid cooling plate flow channel satisfy the following relationship:

[0050] and / or,

[0051]

[0052] From the liquid flow channel inlet 44 to the outlet 45, the cooling liquid continuously absorbs the loss heat of the IGBT module 1 in the flow process, the temperature of the cooling liquid continuously rises, and the heat dissipation capacity of the cooling liquid gradually weakens. The liquid cooling plate flow channel 4 is divided into the first flow channel area 41, the second flow channel area 42, and the third flow channel area 43. According to the cooling liquid temperature change law, different heat dissipation column structure parameters and quantities are designed in different flow channel areas, which can ensure the uniformity of the liquid cooling plate heat dissipation of the drive motor controller and prevent the power device from failing or being damaged due to the excessive temperature rise of the third IGBT half-bridge 13.

[0053] It should be noted that the liquid cooling plate flow channel 4 in the embodiment is a cooling liquid flow channel, and the main function of the liquid cooling plate is to dissipate heat for the IGBT module. The cooling liquid flows through the liquid cooling plate flow channel 4 to take away the heat loss of the IGBT, reduce the temperature rise of the IGBT module, and make the IGBT module operate in a safe temperature range, thereby ensuring the reliability of the controller.

[0054] The driving motor controller liquid cooling plate provided in the embodiment can obtain the relationship between the specific parameter sizes of the liquid cooling plate flow channel structure through the above relationship and the forced convection heat transfer law of fluid across the outside of the tube bundle in the heat dissipation process. The above relationship is based on the influence law of the diameter of the heat dissipation column, the flow channel spacing between the heat dissipation columns, and the number of heat dissipation columns on the heat dissipation performance and temperature distribution of the driving motor controller liquid cooling plate, which improves the uniformity of the temperature of the driving motor controller liquid cooling plate, reduces the risk of local temperature rise of the IGBT module exceeding the standard, reduces the periodic thermal stress of the IGBT module, and improves the reliability of stable operation of the controller.

[0055] The driving motor controller liquid cooling plate provided in the embodiment can obtain the relationship between the specific parameter sizes of the liquid cooling plate flow channel structure through the above relationship and the forced convection heat transfer law of fluid across the outside of the tube bundle in the heat dissipation process. The above relationship is based on the influence law of the diameter of the heat dissipation column, the flow channel spacing between the heat dissipation columns, and the number of heat dissipation columns on the heat dissipation performance and temperature distribution of the driving motor controller liquid cooling plate, which improves the uniformity of the temperature of the driving motor controller liquid cooling plate, reduces the risk of local temperature rise of the IGBT module exceeding the standard, reduces the periodic thermal stress of the IGBT module, and improves the reliability of stable operation of the controller.

[0056] Specifically, the length of the liquid cooling plate flow channel is L, and (b*n0-10) mm≤L≤(b*n0+10) mm; and / or, the width of the liquid cooling plate flow channel is B, and (l-10) mm≤B≤(l+10) mm.

[0057] Wherein, n0 is the number of IGBT half-bridges of the IGBT module, b is the width of the IGBT half-bridge, and l is the length of the IGBT half-bridge. The number of IGBT half-bridges of the IGBT module 1 in the embodiment is n0=3, which is the number of IGBT half-bridges commonly used in the driving motor controller IGBT module in the electric vehicle industry.

[0058] The length and width of the liquid cooling plate flow channel 4 meet the above two relationship formulas, so that the length and width of the liquid cooling plate flow channel 4 can be prevented from being too small to cause insufficient heat dissipation capacity or poor substrate temperature uniformity, and the liquid cooling plate structure size can be prevented from being too large to increase the material cost and volume.

[0059] The height h of the heat dissipation column in the embodiment is 3mm≤h≤10mm, so that a better heat dissipation effect can be obtained. The heat dissipation column is in a cylindrical shape, and the arrangement mode of the heat dissipation column adopts a staggered arrangement, so that the turbulence disturbance intensity of the cooling liquid in the liquid cooling plate flow channel can be improved, and the forced convection heat transfer performance is further enhanced, so as to improve the heat dissipation capacity of the drive motor controller liquid cooling plate, and effectively reduce the temperature rise of the IGBT module. The total number of rows of the heat dissipation columns arranged along the length direction of the liquid cooling plate flow channel is m, and each row of the heat dissipation columns is arranged along the width direction of the liquid cooling plate flow channel,

[0060] The diameter of the heat dissipation column in the first flow channel region is d1, and 1mm≤d1≤5mm; the number of rows of the heat dissipation columns in the first flow channel region is n1 (n1 is an integer), and the spacing between the two adjacent heat dissipation columns in the same row is s1, and 1mm≤s1-d1≤5mm;

[0061] The diameter of the heat dissipation column in the second flow channel region is d2, and 1mm≤d2≤5mm; the number of rows of the heat dissipation columns in the second flow channel region is n2 (n2 is an integer), and the spacing between the two adjacent heat dissipation columns in the same row is s2, and 1mm≤s2-d2≤5mm;

[0062] The diameter of the heat dissipation column in the third flow channel region is d3, and 1mm≤d3≤5mm; the number of rows of the heat dissipation columns in the third flow channel region is n3 (n3 is an integer), and the spacing between the two adjacent heat dissipation columns in the same row is s3, and 1mm≤s3-d3≤5mm.

[0063] According to the process feasibility, when the diameter of the heat dissipation column 5 is less than 1mm, the processing difficulty of the substrate heat dissipation column will be significantly increased; when the diameter of the heat dissipation column 5 is greater than 5mm, a larger vortex area will be generated behind the heat dissipation column 5, which will significantly reduce the convection heat transfer performance of the liquid cooling plate. The spacing between the two adjacent heat dissipation columns 5 in the first flow channel region 41, the spacing between the two adjacent heat dissipation columns 5 in the second flow channel region 42, and the spacing between the two adjacent heat dissipation columns 5 in the third flow channel region 43 satisfy the above three relationship formulas, so that the liquid cooling plate flow channel 4 can meet the flow resistance loss requirement, and the forced convection heat transfer performance of the drive motor controller liquid cooling plate is ensured; when the flow channel size between the two adjacent heat dissipation columns is less than 1mm, the fluid flow channel is too narrow, the flow channel cross-sectional area is too small, the flow velocity is too large, and the flow resistance loss in the liquid cooling plate flow channel will be significantly increased; when the flow channel size between the two adjacent heat dissipation columns is greater than 5mm, the fluid flow channel cross-sectional area is too large, the flow velocity is too small, and the forced convection heat transfer performance in the liquid cooling plate flow channel is significantly reduced.

[0064] The heat dissipation columns of the embodiment are arranged at intervals along the length direction of the liquid cooling plate flow channel, the number of rows of the heat dissipation columns is m, m is an integer multiple of 3, the spacing between the two adjacent rows of heat dissipation columns is c, and 1mm≤c-d1≤5mm, 1mm≤c-d2≤5mm, 1mm≤c-d3≤5mm, where d1 is the diameter of the heat dissipation column in the first flow channel area, d2 is the diameter of the heat dissipation column in the second flow channel area, and d3 is the diameter of the heat dissipation column in the third flow channel area. The spacing between the two adjacent rows of heat dissipation columns in the first flow channel area 41, the spacing between the two adjacent rows of heat dissipation columns in the second flow channel area 42, and the spacing between the two adjacent rows of heat dissipation columns in the third flow channel area 43 satisfy the above three relationship formulas respectively, so that the liquid cooling plate flow channel 4 can meet the flow resistance loss requirement, and the total forced convection heat transfer area of the heat dissipation columns 5 in the liquid cooling plate flow channel 4 is ensured to meet the heat dissipation amount requirement of the liquid cooling plate.

[0065] The substrate is made of copper or silicon carbide aluminum material, and the heat dissipation column is made of aluminum, aluminum alloy, copper or other materials. The shell of the controller is made of aluminum or aluminum alloy material. The substrate 3, the heat dissipation column 5 and the controller shell 2 are all made of high thermal conductivity material, which can improve the heat conduction effect, improve the heat transfer capacity of the IGBT module 1 to the substrate 3 and the heat dissipation column 5, improve the heat dissipation performance of the drive motor controller liquid cooling plate, effectively reduce the temperature rise of the IGBT module 1, and improve the temperature rise reliability of the drive motor controller. The substrate 3 and the controller shell 2 are connected by bolts, welding or other conventional connection methods, and the substrate 3 and the heat dissipation column 5 are connected by welding, one-piece forming or other conventional connection methods.

[0066] The IGBT module is installed on the upper end surface of the substrate 3 of the drive motor controller liquid cooling plate, and is composed of three IGBT half bridges. IGBT is the main heat source. The difference between the maximum temperature rises of the adjacent IGBT half bridges is less than or equal to 4℃.

[0067] The heat dissipation amount Φ of a single IGBT half bridge, the IGBT module is composed of n0 IGBT half bridges, q m is the mass flow rate of the cooling liquid, c is the specific heat capacity of the cooling liquid, the cooling liquid flows through the liquid cooling plate flow channel to absorb the loss heat of IGBT, and the cooling liquid temperature gradually rises. The temperature difference △t of the cooling liquid at the inlet and outlet of the flow channel:

[0068]

[0069] The contact area between the liquid cooling plate flow channel wall and the cooling liquid is A, the convection heat transfer coefficient h' between the liquid cooling plate flow channel wall and the cooling liquid, the average temperature of the liquid cooling plate flow channel wall is t 板 , the average temperature of the cooling liquid is t 液 , and the forced convection heat transfer amount Φ between the liquid cooling plate flow channel wall and the cooling liquid对流 :

[0070] Φ 对流 = h' * (t 板 -t 液 );

[0071] The Nusselt number Nu of single-phase fluid convection heat transfer in the flow channel of the liquid cooling plate is affected by the flow Reynolds number Re and the Prandtl number Pr of the cooling liquid:

[0072] Nu = f (Re, Pr);

[0073] The thermal conductivity of the cooling liquid is λ, the diameter of the heat dissipation column is d, and the convection heat transfer coefficient h' between the wall surface of the liquid cooling plate flow channel and the cooling liquid;

[0074] h' = Nu * lambda / d;

[0075] In the cooling and heat dissipation process of the liquid cooling plate, the heat flow in the heat transfer process satisfies the relationship:

[0076] Φ = Φ 对流 .

[0077] The above five formulas are conventional theoretical formulas, and those skilled in the art can understand their specific meanings and calculation methods.

[0078] According to the heat transfer law in the cooling and heat dissipation process of the liquid cooling plate, through theoretical derivation, numerical simulation and experimental verification, the influence law of the diameter of the heat dissipation column, the spacing between the heat dissipation columns and the number of the heat dissipation columns of the liquid cooling plate on the temperature distribution of the substrate is found, the flow channel structure design method of the liquid cooling plate of the drive motor controller is obtained, the flow channel structure of the liquid cooling plate of the drive motor controller is quickly designed, the design efficiency of the liquid cooling plate of the drive motor controller is improved, the test and modification times are reduced, the development difficulty, the development cost of the liquid cooling plate of the drive motor controller is reduced, the uniform heat dissipation performance of the liquid cooling plate of the drive motor controller is improved, the local temperature rise of the IGBT module is prevented, the thermal stress of the IGBT module is reduced, and the safety and reliability of the long-term stable operation of the drive motor controller are improved.

[0079] The liquid cooling plate of the drive motor controller realizes the following technical effects: a liquid cooling plate flow channel structure design method of a drive motor controller is provided, the design efficiency of the liquid cooling plate flow channel structure of the drive motor controller is improved, the test times and modification times are reduced, the development cycle is shortened, the development cost and test cost are reduced, the risk of local temperature rise of the IGBT module is reduced, the temperature uniformity of the substrate of the liquid cooling plate of the drive motor controller is improved, the periodic thermal stress of the IGBT module during operation is reduced, the temperature rise safety requirement of the power device in the drive motor controller is met, and the long-term stable operation reliability of the drive motor controller is improved.

[0080] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof.

[0081] The relative positions, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. It should be understood that the sizes of the various portions shown in the drawings are not drawn to scale for ease of description. Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered part of the disclosure where appropriate. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary and not as a limitation. Thus, other examples of the example embodiments can have different values. It should be noted that like reference numerals and letters refer to like items in the following drawings, and thus, once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0082] In the description of the present application, it should be understood that the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal", and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate and imply that the devices or elements referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer relative to the contour of the components themselves.

[0083] For purposes of the description hereinafter, the terms "upper", "lower", "right", "left", "rear", "front", "vertical" and "horizontal" as can be perceived herein relative to the accompanying drawings refer to the orientation of the components being described. However, it is to be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device described herein is inverted or rotated by 90 degrees, then the descriptions of "above" or "below" or "upper" or "lower" or "front" or "back" or "vertical" or "horizontal" apply accordingly. Likewise, if the device is rotated by 180 degrees, then "front" and "back" or "upper" and "lower" are interchanged. Thus, the exemplary terms "above" and "below" can encompass both orientations of above and below. The device can be oriented in other ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0084] In addition, it should be noted that the use of "first", "second", and the like herein does not indicate that there are only two of these parts, but rather that there are at least two parts. Terms such as "first", "second", and the like can be used interchangeably with "another", unless contextually inconsistent. The above terms are not intended to limit the protection scope of the present application, and cannot be understood as a limitation on the protection scope of the present application.

[0085] For the sake of brevity, conventional techniques related to making and using aspects of the application can or can not be described in detail herein. In some instances, well-known structures and techniques can be shown in diagram form rather than in detail to avoid obscuring the related figures.

Claims

1. A drive motor controller liquid cooling plate, characterized by, The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate.

2. The liquid-cooled plate for driving motor controller according to claim 1, wherein: The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. And / or, The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. The application relates to a drive motor controller liquid cooling plate. 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4. The liquid-cooled plate for driving motor controller according to claim 1 or 2, characterized by: The heat dissipation column is cylindrical, and the arrangement mode of the heat dissipation column adopts fork arrangement.

5. The liquid-cooled plate for driving motor controller according to claim 1 or 2, characterized by: The height h of the heat dissipation column satisfies 3mm≤h≤10mm.

6. The liquid-cooled plate for driving motor controller according to claim 2, wherein: The heat dissipation columns are arranged at intervals along the length direction of the liquid cooling plate flow channel, the number of rows of the heat dissipation columns is m, and the heat dissipation columns in each row are arranged at intervals along the width direction of the liquid cooling plate flow channel, The diameter of the heat dissipation column of the first flow channel region is d1, and 1mm≤d1≤5mm; the number of each row of the heat dissipation column of the first flow channel region is n1, and the spacing between two adjacent heat dissipation columns in the same row is s1, and 1mm≤s1-d1≤5mm. The diameter of the heat dissipation column of the second flow channel region is d2, and 1mm≤d2≤5mm; the number of each row of the heat dissipation column of the second flow channel region is n2, the spacing between two adjacent heat dissipation columns in the same row is s2, and 1mm≤s2-d2≤5mm. The diameter of the heat dissipation column of the third flow channel region is d3, 1mm≤d3≤5mm; the number of each row of the heat dissipation column of the third flow channel region is n3, the spacing between two adjacent heat dissipation columns in the same row is s3, and 1mm≤s3-d3≤5mm.

7. The liquid-cooled plate for driving motor controller according to claim 2 or 6, characterized by: The total number of rows of the heat dissipation columns arranged at intervals along the length direction of the flow channel of the liquid cooling plate is m, m is an integer multiple of 3, and the spacing between the two adjacent rows of heat dissipation columns is c, and 1mm≤c-d1≤5mm, 1mm≤c-d2≤5mm, 1mm≤c-d3≤5mm, wherein d1 is the diameter of the heat dissipation column in the first flow channel area, d2 is the diameter of the heat dissipation column in the second flow channel area, and d3 is the diameter of the heat dissipation column in the third flow channel area.

8. The liquid-cooled plate for driving motor controller according to claim 1, wherein: The inner side of the shell (2) of the controller is provided with a groove, the groove bottom is respectively provided with a flow channel inlet (44) and a flow channel outlet (45) on both sides, and the shell (2) of the controller and the base plate (3) are sealed by the sealing ring (6) on four sides, so that the groove and the base plate (3) cooperate to form a liquid cooling plate flow channel (4).

9. The liquid-cooled plate for driving motor controller according to claim 1, wherein: The base plate is made of copper or silicon carbide aluminum material, and the heat dissipation column is made of aluminum, aluminum alloy or copper material.

10. The liquid-cooled plate for driving motor controller according to claim 1, wherein: The shell of the controller is made of aluminum or aluminum alloy material.

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