A dual-axis cutting position alignment optimization method and device

Abstract

The present application discloses a dual-axis cutting position alignment optimization method and device, including: alignment process: determining the cutting path position and first angle of the wafer or packaged product to be cut; determining the first angle deviation between the first cutting path and the last cutting path of each wafer through visual recognition, and evenly distributing the first angle deviation to all cutting paths; determining the alignment trajectory of the cutting knife according to each cutting path after the deviation is evenly distributed; cutting process: determining the second angle deviation between the two cutting paths simultaneously cut by the first cutting knife and the second cutting knife during actual dual-axis cutting according to each cutting path after the deviation is evenly distributed; averaging the second angle deviation, and after averaging, calculating the positions of the two knives that are actually cutting at the same time; and executing cutting. The present application processes the corresponding workbench angle and cutting position when the dual-axis angles are different, thereby reducing the cutting error introduced by inconsistent product angles during dual-axis cutting.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method and device for optimizing the alignment of dual-axis cutting positions of a dicing machine. Background Art

[0002] For cost and practicality reasons, most dual-axis dicing machines on the market currently use a single worktable with two cutting axes. The cutting axes have two motion directions: longitudinal and forward and backward, designated here by the Z and Y axes. The worktable also has two motion directions: left and right and rotational, designated by the X and θ axes. This allows for only one angle between the two axes during dual-axis dicing. This design can generally meet the cutting requirements of most products on the market. The basic premise of this design is that the cutting paths of most products are parallel. In fact, most wafers can almost meet this requirement. However, the cutting paths of some packaged PCB boards, QFD, and DFN products have poor parallelism.

[0003] Currently, there are roughly two approaches to alignment during dicing. One is intended for high-precision products like wafers. This method typically assumes that the angles assigned to both axes during dual-axis dicing are the same. Alignment generates only one angle, and there are no discrepancies between the two axis angles when assigning the cutting trajectory. This method eliminates the need to manipulate angles and positions during dicing; cutting proceeds directly according to the assigned cutting trajectory. The other method generates two angles, corresponding to the start and end positions of the cut, during alignment. These two angles are then divided equally between each cut. This alignment method produces a different angle for each cut. When dual-axis alignment is used, the angles for axes one and two are different when cutting simultaneously. Using a dual-axis, single-table dicing machine to cut such products requires an algorithm to balance the optimal angle and cutting position when planning the cutting trajectory. Existing methods assume that this angle error will not affect product quality, so the angle for axis one is used for dicing, while the angle for axis one's cutting position is used for axis two. This cutting method will cause the axis 2 to be cut obliquely, and the cutting position of the axis 2 will also be offset due to the different angles.

[0004] With existing cutting methods based on the angle of axis one, if the angle difference between the corresponding cutting positions of axis one and axis two is large, axis two will be cut obliquely. Due to the difference in angle, the cutting position of axis two will also be cut offset. This slicing phenomenon will be amplified as the table size increases, and the offset will increase the further away from the center of the table. According to the commonly used 400*400 square table, if the corresponding cutting angle deviation of the two axes is 0.02, the maximum cutting position deviation can be 69.8μm, and the parallelism of the cutting positions of axis one and axis two will be poor. Summary of the Invention

[0005] The embodiments of the present application provide a dual-axis cutting position alignment optimization method and device for processing the corresponding workbench angles and cutting positions when the dual-axis angles are different, thereby reducing cutting errors.

[0006] The present invention provides a method for optimizing the alignment of dual-axis cutting positions, including the following steps:

[0007] Alignment process:

[0008] Determining a cutting line position and a first angle of a wafer or packaged product to be cut, wherein any one of the cutting lines corresponds to a cutting path of a cutting blade on the wafer or packaged product, and the cutting path includes angle and position information;

[0009] Determine a first angular deviation between a first cutting lane and a last cutting lane in the cutting lane, and evenly distribute the first angular deviation to the second cutting lane and all subsequent cutting lanes;

[0010] Determine the alignment trajectory of the cutting blade according to each cutting path after the deviation is evenly divided;

[0011] Cutting process:

[0012] Determine two cutting lanes corresponding to a cutting performed simultaneously by a first cutting knife and a second cutting knife of a dual-axis cutting;

[0013] determining a second angle deviation between the two cutting lanes according to the respective cutting lanes after the deviation is evenly divided;

[0014] averaging the second angular deviations to the first cutting blade and the second cutting blade, and calculating actual cutting positions of the first cutting blade and the second cutting blade after averaging;

[0015] Perform the cut.

[0016] Optionally, determining the alignment trajectory of the cutting blade according to each cutting path after the deviation is evenly divided includes:

[0017] The midpoint coordinates of the original alignment trajectory are used as the basic coordinates, and the alignment trajectory of the cutting knife is calculated by rotating the first angle average value around the rotation center in the basic coordinates to meet the following requirements:

[0018] dX1=dXCenter-(dXCenter-dXPos)*cosT1+(dYPos-dYCenter)*sinT1

[0019] dY1=dYCenter+(dXCenter-dXPos)*sinT1+(dYPos-dYCenter)*cosT1

[0020] Where dXCenter and dYCenter represent the coordinates of the rotation center, dXPos and dYPos represent the coordinates of the input original point, T1 is the average change angle, and dX1 and dY1 represent the adjusted alignment trajectory.

[0021] Optionally, the actual cutting positions of the first cutting blade and the second cutting blade are calculated to satisfy:

[0022] dX2=dXCenter-(dXCenter-dXPos)*cosT2+(dYPos-dYCenter)*sinT2

[0023] dY2=dYCenter+(dXCenter-dXPos)*sinT2+(dYPos-dYCenter)*cosT2

[0024] Among them, dX2 and dY2 represent the adjusted cutting trajectory, and T2 is the averaged change angle.

[0025] Optionally, the cutting process further includes, in accordance with the cutting sequence, repeatedly determining the angle deviation between two cutting paths corresponding to each cutting execution, and determining the positions of the first cutting knife and the second cutting knife.

[0026] The present application also provides a dual-axis cutting position alignment optimization device, including a control terminal connected to a dual-axis cutting device for controlling the dual-axis cutting device to adjust the position and perform cutting. The control terminal is configured to:

[0027] Perform the alignment process as follows:

[0028] Determining a cutting line position and a first angle of a wafer or packaged product to be cut, wherein any one of the cutting lines corresponds to a cutting path of a cutting blade on the wafer or packaged product, and the cutting path includes angle and position information;

[0029] Determine a first angular deviation between a first cutting lane and a last cutting lane in the cutting lane, and evenly distribute the first angular deviation to the second cutting lane and all subsequent cutting lanes;

[0030] Determine the alignment trajectory of the cutting blade according to each cutting path after the deviation is evenly divided;

[0031] Perform the following cutting process:

[0032] Determine two cutting lanes corresponding to a cutting performed simultaneously by a first cutting knife and a second cutting knife of a dual-axis cutting;

[0033] determining a second angle deviation between the two cutting lanes according to the respective cutting lanes after the deviation is evenly divided;

[0034] averaging the second angular deviations to the first cutting blade and the second cutting blade, and calculating and determining the positions of the first cutting blade and the second cutting blade after averaging;

[0035] Controls the execution of cutting.

[0036] Optionally, the control terminal is further configured to:

[0037] The midpoint coordinates of the original alignment trajectory are used as the basic coordinates, and the alignment trajectory of the cutting knife is calculated by rotating the first angle average value around the rotation center in the basic coordinates to meet the following requirements:

[0038] dX1=dXCenter-(dXCenter-dXPos)*cosT1+(dYPos-dYCenter)*sinT1

[0039] dY1=dYCenter+(dXCenter-dXPos)*sinT1+(dYPos-dYCenter)*cosT1

[0040] Where dXCenter and dYCenter represent the coordinates of the rotation center, dXPos and dYPos represent the coordinates of the input original point, T1 is the average change angle, and dX1 and dY1 represent the adjusted alignment trajectory.

[0041] Optionally, the control terminal is further configured to calculate actual cutting positions of the first cutting knife and the second cutting knife in the following manner:

[0042] dX2=dXCenter-(dXCenter-dXPos)*cosT2+(dYPos-dYCenter)*sinT2

[0043] dY2=dYCenter+(dXCenter-dXPos)*sinT2+(dYPos-dYCenter)*cosT2

[0044] Among them, dX2 and dY2 represent the adjusted cutting trajectory, and T2 is the averaged change angle.

[0045] Optionally, the control terminal is further configured to:

[0046] According to the cutting sequence, each time a cutting is performed, the angle deviation between the two cutting paths corresponding to the cutting is repeatedly determined, and the positions of the first cutting blade and the second cutting blade are determined.

[0047] The embodiment of the present application proposes a method for processing the corresponding workbench angle and cutting position when the dual-axis angles are different, which can effectively reduce the cutting error.

[0048] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0050] Figure 1 This is an example of a cutting lane for dual-axis cutting according to an embodiment of the present application;

[0051] Figure 2 This is an example of the process of the dual-axis cutting position alignment optimization method according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0053] When the dicing machine cuts some QFN and DFN materials with poor parallelism of the dicing lanes, the dicing quality is difficult to control. When directly using unprocessed alignment track dual-axis cutting, the cutting quality will be greatly reduced. In order to pursue better cutting quality, many manufacturers often use single-axis dicing, or perform image recognition in the dicing image to correct the dicing position. These processing methods will increase the cutting time and greatly reduce the production efficiency of the dicing machine.

[0054] For a dual-cutting-spindle single-table device, simultaneous cutting of different-angle cutting paths by dual-spindles will inevitably produce angle deviations, such as Figure 1As shown, the material to be cut 1, the two lines on the left are the actual cutting path 2, because there is only one angle when cutting, the best effect of dual-axis cutting is the cutting position 3 shown in the right figure. The method proposed in this application is used to reduce the angle deviation to the minimum and eliminate the position deviation at the same time. The embodiment of this application provides a dual-axis cutting position alignment optimization method, such as Figure 2 As shown, the following steps are included:

[0055] Alignment process:

[0056] The positions and angles of the cutting lanes of the wafer or packaged product to be cut are determined, wherein any of the cutting lanes corresponds to a cutting path of the wafer or packaged product by a cutting knife, and the cutting path includes angle and position information.

[0057] Determine the first angular deviation between the first and last lanes in each cut, and evenly distribute this first angular deviation to the second and subsequent lanes. For example, if there are 100 lanes in the packaged product to be cut, and the angular deviation between the first and 100th lanes is 1, then adjust the angle by 0.01° for each lane from the second and subsequent lanes.

[0058] The alignment track of the cutting blade is determined based on each cutting path after the deviation is evenly divided.

[0059] Cutting process:

[0060] Determine the two cutting lanes corresponding to one cutting performed by the first cutting knife and the second cutting knife of the dual-axis cutting. The specific dual-axis cutting equipment has two axes, namely the first axis and the second axis, and the first cutting knife and the second cutting knife are respectively provided on the first axis and the second axis. When performing cutting, since the interval between the first cutting knife and the second cutting knife cannot be small enough to follow the sequence (the first cutting lane, the second cutting lane, ...), it is necessary to perform cutting at certain intervals. For example, if there are a total of 100 cutting lanes for the product to be cut, a feasible cutting method is that the first cutting knife cuts from the first cutting lane and the second cutting knife cuts from the 21st cutting lane, and then repeats it multiple times to complete the cutting. Therefore, the first cutting lane to the 21st cutting lane are the corresponding two cutting lanes.

[0061] The second angle deviation between the two cutting lanes is determined based on the deviation-averaged cutting lanes. For example, the first to the 21st cutting lanes are two corresponding cutting lanes, and the angle deviation between the two cutting lanes is 0.2°.

[0062] The second angular deviation is averaged for the first cutting blade and the second cutting blade, and after the averaging, the actual cutting positions of the first cutting blade and the second cutting blade are determined. Based on the above embodiment, if the angular deviation between the two cutting paths is 0.2°, the average of the first cutting blade and the second cutting blade is 0.1°, and the actual cutting positions of the first cutting blade and the second cutting blade are determined.

[0063] Perform the cut.

[0064] The embodiment of the present application proposes a method for processing the corresponding workbench angle and cutting position when the dual-axis angles are different, which can effectively reduce cutting errors and improve cutting flatness.

[0065] In some embodiments, determining the alignment trajectory of the cutting blade based on each cutting path after deviation averaging includes: using the midpoint coordinates of the original alignment trajectory as the base coordinates, and calculating the alignment trajectory of the cutting blade by rotating the point in the base coordinates around the rotation center by a certain angle to satisfy:

[0066] dX1=dXCenter-(dXCenter-dXPos)*cosT1+(dYPos-dYCenter)*sinT1

[0067] dY1=dYCenter+(dXCenter-dXPos)*sinT1+(dYPos-dYCenter)*cosT1

[0068] Where dXCenter and dYCenter represent the coordinates of the rotation center, dXPos and dYPos represent the coordinates of the input original point, T1 is the average change angle, and dX1 and dY1 represent the adjusted alignment trajectory.

[0069] An exemplary process is as follows:

[0070] Coordinates of the rotation center dXCenter = 528.50895, dYCenter = 271.93815;

[0071] The alignment data is assigned to the cutting line start point X11 = 452.399, the cutting line end point X12 = 512.399, the cutting position Y1 = 156.9125, and the cutting table angle is 180.069319;

[0072] The alignment data is assigned to the cutting line start point X21 = 452.399 of axis 2, the cutting line end point X22 = 512.399, the cutting position Y2 = 383.826, and the cutting table angle is 180.043459.

[0073] Calculate this data, and for the alignment trajectory dXPos=(528.50895+271.93815) / 2 and dYPos=156.9125 assigned to the first cutting knife, substitute them into the formula to obtain dX1=482.4294541 and dY1=156.9003396.

[0074] Similarly, the data of the second cutting knife is substituted into dX1=482.3695177, dY1=383.8138206. The obtained dY value is the new cutting position.

[0075] When cutting simultaneously on two axes, the worktable has only one angle. Therefore, the angles of axis one (corresponding to the first cutting blade) and axis two (corresponding to the second cutting blade) must be processed to the same angle. In the embodiments of the present application, averaging is used. The change in the angle after averaging will affect the actual cutting position. In some embodiments, after averaging, the positions of the first cutting blade and the second cutting blade are determined to satisfy:

[0076] dX2=dXCenter-(dXCenter-dXPos)*cosT2+(dYPos-dYCenter)*sinT2

[0077] dY2=dYCenter+(dXCenter-dXPos)*sinT2+(dYPos-dYCenter)*cosT2

[0078] Among them, dX2 and dY2 represent the adjusted cutting trajectory, and T2 is the averaged change angle.

[0079] The specific calculation example is as described above and will not be repeated here.

[0080] In some embodiments, the cutting process further includes, for each cutting operation performed in the cutting sequence, repeatedly determining the angular deviation between the two cutting lanes corresponding to each cutting operation, and determining the actual cutting positions of the first and second cutting blades. The first cutting blade cuts along the first cutting lane and the second cutting blade cuts along the 21st cutting lane. After the first cutting blade cuts along the second cutting lane and the second cutting blade cuts along the 22nd cutting lane, the angle and position change are repeatedly determined before the cutting operation is performed again.

[0081] The present application provides a dual-axis cutting position alignment optimization method that takes into account both cutting quality issues and improves cutting efficiency, reduces angle deviation to a minimum, and eliminates position deviation at the same time.

[0082] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are protected by this application.

Claims

1. A dual-axis cutting position alignment optimization method, characterized in that: The steps include: Alignment process: Determining a cutting line position and a first angle of a wafer or packaged product to be cut, wherein any one of the cutting lines corresponds to a cutting path of a cutting blade on the wafer or packaged product, and the cutting path includes angle and position information; Determine a first angular deviation between a first cutting lane and a last cutting lane in the cutting lane, and evenly distribute the first angular deviation to the second cutting lane and all subsequent cutting lanes; Determine the alignment trajectory of the cutting blade according to each cutting path after the deviation is evenly divided; Cutting process: Determine two cutting lanes corresponding to a cutting performed simultaneously by a first cutting knife and a second cutting knife of a dual-axis cutting; determining a second angle deviation between the two cutting lanes according to the respective cutting lanes after the deviation is evenly divided; averaging the second angular deviations to the first cutting blade and the second cutting blade, and calculating actual cutting positions of the first cutting blade and the second cutting blade after averaging; Perform the cut.

2. The dual-axis cutting position alignment optimization method according to claim 1, characterized in that: Determining the alignment trajectory of the cutting blade based on each cutting path after deviation averaging includes: The midpoint coordinates of the original alignment trajectory are used as the basic coordinates, and the alignment trajectory of the cutting knife is calculated by rotating the first angle average value around the rotation center in the basic coordinates to meet the following requirements: dX1=dXCenter-(dXCenter-dXPos)*cosT1+(dYPos-dYCenter)*sinT1dY1=dYCenter+(dXCenter-dXPos)*sinT1+(dYPos-dYCenter)*cosT1, where dXCenter and dYCenter represent the coordinates of the rotation center, dXPos and dYPos represent the coordinates of the input original point, T1 is the equally divided change angle, and dX1 and dY1 represent the adjusted alignment trajectories.

3. The dual-axis cutting position alignment optimization method according to claim 2, wherein: Calculating the actual cutting positions of the first cutting blade and the second cutting blade satisfies: dX2=dXCenter-(dXCenter-dXPos)*cosT2+(dYPos-dYCenter)*sinT2dY2=dYCenter+(dXCenter-dXPos)*sinT2+(dYPos-dYCenter)*cosT2 Among them, dX2 and dY2 represent the adjusted cutting trajectory, and T2 is the averaged change angle.

4. The dual-axis cutting position alignment optimization method according to claim 1, wherein: The cutting process further includes, in accordance with the cutting sequence, repeatedly determining the angle deviation between two cutting paths corresponding to each cutting execution, and determining the positions of the first cutting blade and the second cutting blade.

5. A dual-axis cutting position alignment optimization device, characterized in that: The device comprises a control terminal connected to the biaxial cutting device for controlling the biaxial cutting device to adjust the position and perform cutting. The control terminal is configured to: Perform the alignment process as follows: Determining a cutting line position and a first angle of a wafer or packaged product to be cut, wherein any one of the cutting lines corresponds to a cutting path of a cutting blade on the wafer or packaged product, and the cutting path includes angle and position information; Determine a first angular deviation between a first cutting lane and a last cutting lane in the cutting lane, and evenly distribute the first angular deviation to the second cutting lane and all subsequent cutting lanes; Determine the alignment trajectory of the cutting blade according to each cutting path after the deviation is evenly divided; Perform the following cutting process: Determine two cutting lanes corresponding to a cutting performed simultaneously by a first cutting knife and a second cutting knife of a dual-axis cutting; determining a second angle deviation between the two cutting lanes according to the respective cutting lanes after the deviation is evenly divided; averaging the second angular deviations to the first cutting blade and the second cutting blade, and calculating and determining the positions of the first cutting blade and the second cutting blade after averaging; Controls the execution of cutting.

6. The dual-axis cutting position alignment optimization device according to claim 5, characterized in that: The control terminal is further specifically used for: The midpoint coordinates of the original alignment trajectory are used as the basic coordinates, and the alignment trajectory of the cutting knife is calculated by rotating the first angle average value around the rotation center in the basic coordinates to meet the following requirements: dX1=dXCenter-(dXCenter-dXPos)*cosT1+(dYPos-dYCenter)*sinT1dY1=dYCenter+(dXCenter-dXPos)*sinT1+(dYPos-dYCenter)*cosT1, where dXCenter and dYCenter represent the coordinates of the rotation center, dXPos and dYPos represent the coordinates of the input original point, T1 is the equally divided change angle, and dX1 and dY1 represent the adjusted alignment trajectories.

7. The dual-axis cutting position alignment optimization device according to claim 6, characterized in that: The control terminal is further configured to calculate the actual cutting positions of the first cutting blade and the second cutting blade in the following manner: dX2=dXCenter-(dXCenter-dXPos)*cosT2+(dYPos-dYCenter)*sinT2dY2=dYCenter+(dXCenter-dXPos)*sinT2+(dYPos-dYCenter)*cosT2 Among them, dX2 and dY2 represent the adjusted cutting trajectory, and T2 is the averaged change angle.

8. The dual-axis cutting position alignment optimization device according to claim 5, characterized in that: The control terminal is further specifically used for: According to the cutting sequence, each time a cutting is performed, the angle deviation between the two cutting paths corresponding to the cutting is repeatedly determined, and the positions of the first cutting blade and the second cutting blade are determined.

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