Wafer loading assembly and wax unloading machine

Abstract

The present application provides a wafer loading assembly and a wax unloading machine, wherein a lifting channel suitable for lifting a plug box is provided on the support; the lifting assembly is provided on the support to drive the plug box to lift in the lifting channel; the flip conveying mechanism is provided on the support, and a conveying part is provided thereon, and the flip conveying mechanism has a flipping state and a non-flipping state, in the flipping state, the conveying part rotates to the bottom of the plug box, so that the conveying part drives the ceramic disk on the plug box to move; in the non-flipping state, the conveying part leaves the lifting channel; the conveying mechanism is provided on one side of the flip conveying mechanism to drive the movement toward the ceramic disk oven part. The lifting assembly is used to drive the ceramic disk to rise in the height direction, the flip conveying mechanism is used to move the ceramic disk out of the lifting assembly in the horizontal direction, and the conveying mechanism further conveys the ceramic disk in the horizontal direction and then transfers it to the oven. Through the above operation, lifting in the height direction can efficiently utilize the height space.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing equipment, and in particular to a wafer loading assembly and a wax unloading machine. Background Art

[0002] Wafer waxing process is a process in wafer manufacturing, such as Fig.18 As shown, in the wafer grinding process, the thick wafer a is first attached to the ceramic plate c with a wax layer b. The ceramic plate c is a heat-conducting ceramic material, and a heating plate is arranged under the ceramic plate c. After the grinding or polishing process, the wafer a needs to be removed from the ceramic plate c, which is the wax removal process. In the wax removal process, in the prior art, the ceramic plates are usually placed into the plug one by one, and then the plug is transported to the wax removal machine for wax removal. The ceramic plate c is heated, and after the wax layer on the ceramic plate is melted, the wafer a is removed from the ceramic plate c for subsequent processes.

[0003] In the prior art, the wax applying machine includes a horizontal heating transmission mechanism and a push rod mechanism arranged on one side of the horizontal heating transmission mechanism. When applying wax, the ceramic discs are taken out one by one from the jam by a robot or manually and placed one by one on the horizontal heating transmission mechanism. The horizontal heating transmission mechanism transfers the ceramic discs to the push rod mechanism one by one, and at the same time, the ceramic discs are gradually heated to soften the solid wax. After the ceramic disc is transferred to the push rod mechanism, the push rod mechanism pushes the wafer on the ceramic disc, so that the wafer is detached from the ceramic disc, thereby completing the wax applying.

[0004] However, the above operation process has the following defects:

[0005] In the wax unloading machine, a plurality of (usually 3 to 4) ceramic disks are placed in the horizontal heating transmission mechanism (the ceramic disks are relatively large, and a plurality of wafers are bonded thereon in a circular array). The plurality of ceramic disks are arranged along the length direction of the horizontal heating transmission mechanism, which makes the wax unloading machine very long and occupies a large area. The placement of the whole machine is very inconvenient and has very high requirements on the application environment. Moreover, the stuck ceramic disks cannot be all placed in the horizontal heating transmission mechanism, resulting in poor automation effect, which greatly affects the production rhythm and reduces the efficiency of the production line. In addition, there are many heating areas on the horizontal heating transmission mechanism, and the heat is dissipated quickly, consuming more energy. Summary of the invention

[0006] Therefore, the technical problem to be solved by the present application is to overcome the defects of the prior art wax unloading equipment, such as being very long, occupying a large area which makes it inconvenient to place the whole machine, and having very high requirements for the application environment, thereby providing a wafer loading assembly and wax unloading machine that can greatly reduce the size of the whole wax unloading machine.

[0007] According to a first aspect of the present application, there is provided a wafer loading assembly, which is suitable for being arranged on one side of an oven, wherein a heating element is arranged in the oven, and the oven is used to transfer a ceramic disc from top to bottom; the wafer loading assembly comprises: a bracket, which is provided with a lifting channel suitable for lifting and lowering a plug box, wherein the plug box is used to carry the ceramic disc, and the ceramic disc can bond a plurality of wafers; a lifting assembly, which is arranged on the bracket, and is used to support the plug box to be lifted and lowered in the lifting channel; a flipping conveying mechanism, which is arranged on the bracket, and is provided with a conveying part, wherein the flipping conveying mechanism has a flipping state and a non-flipping state, and in the flipping state, the flipping conveying mechanism flips to the lower end of the plug box after the lifting assembly lifts the plug box, and the conveying part is connected to the ceramic disc located at the lowermost end of the plug box, so that the conveying part conveys the ceramic disc to the conveying mechanism; a conveying mechanism, which is arranged between the bracket and the oven, and is used to convey the ceramic disc to the oven.

[0008] The wafer loading assembly provided in the present application, the flipping and conveying mechanism includes: a driving part, which is arranged on the bracket; a transmission part, the driving part acts on one end of the transmission part, and the conveying part is installed at the other end of the transmission part, when the flipping and conveying mechanism is switched from the flipping state to the non-flipping state, the conveying part leaves the lifting channel; a rotating shaft, which is installed on the bracket, and the transmission part is hinged to the rotating shaft.

[0009] The wafer loading assembly provided in the present application, the transmission part includes: a flipping member, one end of which is hinged on the rotating shaft; a connecting rod part, one end of which is connected to the driving part and the other end of which is connected to the other end of the flipping member, and the transmission part is arranged on the connecting rod part.

[0010] The wafer loading assembly provided in the present application, the connecting rod part includes: a connecting plate, one end of which acts on the driving part; a connecting rod, one end of which is connected to the other end of the connecting plate, and the other end is connected to the flip member.

[0011] The wafer loading assembly provided in the present application, the connecting rod part also includes: a mounting seat connected to the connecting rod, the flip member is connected to the mounting seat, and the conveying part is installed on the mounting seat.

[0012] The wafer loading assembly provided in the present application, the conveying part includes: a driving motor, and a third transmission belt connected to the driving motor for force transmission, and a position sensor is arranged on the mounting seat.

[0013] The wafer loading assembly provided in the present application, wherein the driving part includes two groups of cylinders, and the two connecting plates are correspondingly connected to the power output ends of the cylinders.

[0014] In the wafer loading assembly provided in the present application, a bending portion is provided on the connecting rod, and the center of the bending portion is provided on one side of the lifting channel.

[0015] The wafer loading assembly provided in the present application, the conveying mechanism includes: a third driving device, which is arranged stationary relative to the bracket; a first transmission belt, the power output end of the third driving device acts on the first transmission belt; a first conveying roller, the first transmission belt acts on the first conveying roller to drive the first conveying roller to rotate; a second conveying roller, which is connected to the first conveying roller through a second transmission belt.

[0016] In the wafer loading assembly provided in the present application, a driven conveying roller is arranged between the first conveying roller and the second conveying roller.

[0017] The present application provides a wax unloading machine, comprising: the wafer loading assembly provided in the present application; an oven, arranged on one side of the wafer loading assembly, the oven is provided with an oven inlet, a heating element is provided in the oven, a push rod structure area is provided in the oven, the oven is used to transfer ceramic discs from top to bottom, and transport the ceramic discs to the push rod structure area.

[0018] The wax unloading machine provided in the present application further includes: a wafer pushing mechanism, which is arranged between the conveying mechanism and the oven entrance, and is used to push the wafer into the oven.

[0019] The wax unloading machine provided in the present application, the wafer pushing mechanism includes: a pushing member, which moves relative to the oven entrance; a second driving device, which is connected to the pushing member and is used to drive the pushing member to move in the height direction; a first driving device, which is connected to the second driving device and is used to drive the second driving device to move closer to or away from the oven.

[0020] In the wax unloading machine provided in the present application, the conveying mechanism of the wafer loading assembly is provided with a third driving device, and the third driving device is installed on the oven.

[0021] The technical solution of this application has the following advantages:

[0022] 1. The wafer loading assembly provided in the present application comprises: a bracket, on which a lifting channel suitable for lifting and lowering a cartridge box is provided; a lifting assembly, which is arranged on the bracket and used to support the cartridge box to be lifted and lowered in the lifting channel; a flipping conveying mechanism, which is arranged on the bracket and has a conveying part, and the flipping conveying mechanism has a flipping state and a non-flipping state. In the flipping state, the flipping conveying mechanism flips to the lower end of the cartridge box after the lifting assembly lifts the cartridge box, and the conveying part is connected to the ceramic disk at the lower end of the cartridge box, so that the conveying part conveys the ceramic disk to the conveying mechanism; a conveying mechanism, which is arranged between the bracket and the oven and used to convey the ceramic disk to the oven for heating.

[0023] Compared with the related art, the wax unloading machine adopts a horizontal heating transmission mechanism to transmit and heat the ceramic disc, which makes the wax unloading machine long in size, occupies a large area, is inconvenient to place the whole machine, has high requirements for the application environment, and the number of ceramic discs transmitted each time is limited and cannot be placed in the horizontal heating transmission mechanism, resulting in poor automation effect. The wafer loading assembly of the present application can greatly reduce the size of the wax unloading machine through the coordination of the bracket, the lifting assembly, the flip transmission mechanism and the conveying mechanism, and the combination with the oven, reduce the requirements for the application environment and transmit multiple ceramic discs at one time, thereby improving the degree of automation.

[0024] Specifically: the lifting component supports the jam box carrying multiple ceramic discs to lift and lower in the height direction. After the jam box is lifted by the lifting component, the flip conveyor mechanism is driven to flip to the lower end of the jam, and the conveying part of the flip rubbing and mixing conveying mechanism is connected to the ceramic disc located at the lower end of the jam, so that the flip conveyor mechanism conveys the ceramic disc to the conveying mechanism, and the conveying mechanism conveys the ceramic disc to the oven. In the oven, the ceramic disc is heated and transferred from top to bottom. Finally, the ceramic disc enters the push rod mechanism to complete the waxing.

[0025] It can be seen from the above description that in the present application, the transmission path of the ceramic disc is changed from the "horizontal long-distance transmission" in the related art to "ascending-horizontal short-distance transmission-descending", which greatly reduces the length of the wax unloading machine of the present application, reduces the floor space, facilitates the placement of the whole machine, and reduces the requirements for the application environment; moreover, since the jam is directly involved in the transmission of the ceramic disc, multiple ceramic discs can be placed in the jam at one time, the degree of automation is improved, and the efficiency of the production line is improved. In addition, the ceramic disc of the present application is heated as a whole in the oven. Compared with the related art that sets multiple heating areas in the horizontal direction, the present application heats centrally in the oven, which is more energy-efficient.

[0026] 2. The wafer loading assembly provided in the present application controls the flip conveying mechanism to rotate when the ceramic disc needs to be transferred from the lifting assembly. At this time, the flip conveying mechanism acts on the bottom surface of the plug box, so that the conveying part can directly act on the ceramic disc position, and then transport the ceramic discs one by one. When the ceramic disc does not need to be transferred, the flip conveying mechanism is controlled to reset. At this time, the flip conveying mechanism is separated from the ceramic disc position or the plug box area, thereby ensuring that the plug box can stably perform the lifting action driven by the lifting assembly.

[0027] 3. The wax unloading machine provided in the present application includes the wafer loading assembly provided in the present application, and an oven, wherein a heating element is provided in the oven, and the oven is used to transport a ceramic disc along a height direction, wherein the ceramic disc is suitable for placing wafers, and a push rod structure area is provided in the oven, and the oven is used to transport the ceramic disc from top to bottom and convey the ceramic disc to the push rod structure area.

[0028] Through the combination of the oven and the wafer loading assembly, the ceramic plate can be first lifted in the height direction, and then the ceramic plate can be moved in the horizontal direction by flipping the conveying mechanism and the conveying structure, and then lowered in the height direction by the oven to further realize the subsequent waxing operation. Through the above-mentioned movement in the height direction and the horizontal direction, the height space can be effectively utilized to avoid the situation where a large space is occupied in the horizontal length direction.

[0029] 4. The wax unloading machine provided by the present application has a pusher that moves relative to the oven entrance; a second drive device is connected to the pusher to drive the pusher to move in the height direction; a first drive device is connected to the second drive device to drive the second drive device to move closer to or away from the oven. Through the above-mentioned setting method, it can be ensured that the ceramic disc enters the oven stably and the subsequent wax unloading operation is carried out, avoiding the gap between the oven and the wafer loading assembly, which causes the ceramic disc to fall during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 A front view of the wafer loading assembly provided for this application;

[0032] Figure 2 for Figure 1 A perspective view of a wafer loading assembly provided in;

[0033] Figure 3 for Figure 1 A schematic diagram of the wafer loading assembly provided in the working state of the flipping conveying mechanism;

[0034] Figure 4 for Figure 1 A three-dimensional diagram of the wafer loading assembly provided in the working state of the flip conveyor mechanism;

[0035] Figure 5 A schematic diagram of the structure of the waxing machine provided for this application;

[0036] Figure 6 A three-dimensional diagram of the oven in the waxing machine provided for this application;

[0037] Figure 7 A perspective view of the oven provided for this application;

[0038] Figure 8 for Figure 7 A front cross-sectional view of the oven shown;

[0039] Fig. 9 for Figure 7 a rear cross-sectional view of the oven shown;

[0040] Fig.10 for Figure 8 Another front cross-sectional view of the oven shown;

[0041] Fig.11 for Figure 7 Another perspective view of the oven provided;

[0042] Fig.12 for Figure 7 A top view of the oven is provided;

[0043] Fig.13 for Figure 7 The front view of the oven provided in;

[0044] Fig.14 for Figure 7 The installation diagram of the lifting mechanism provided in;

[0045] Fig.15 A top view of the oven provided for this application;

[0046] Fig.16 for Fig.15 Enlarged view of area A in the middle;

[0047] Fig.17 This is a schematic diagram of the assembly of the lifting mechanism and the conveying roller provided in this application;

[0048] Fig.18 This is a related schematic diagram in the background technology of this application.

[0049] Description of the background art reference numerals:

[0050] a-wafer; b-wax layer; c-ceramic disk.

[0051] Description of the accompanying drawings in this application:

[0052] 1- Bracket;

[0053] 2- Oven;

[0054] 201-box; 202-support frame; 203-longitudinal transmission mechanism; 205-arc-shaped positioning part; 206-adjusting rod; 207-adjusting bushing; 208-tightening wheel; 209-adjusting slot; 210-adjusting handle; 211-first positioning part; 212-second positioning part; 213-thrust bolt; 214-pull back bolt;

[0055] 2021-vertical support plate;

[0056] 2031-transmission chain; 2032-fixing member; 2033-carrying plate;

[0057] 2041-driving motor; 2042-transmission shaft; 2043-transmission chain; 2044-transmission gear;

[0058] 2121- push hole; 2122- pull back hole;

[0059] 3-heating element; 4-card box; 5-lifting assembly; 6-transport mechanism; 7-flipping and conveying mechanism; 8-wafer pushing mechanism;

[0060] 61-third driving device; 62-first transmission belt; 63-second transmission belt; 64-first transmission roller; 65-second transmission roller; 66-driven transmission roller;

[0061] 71-driving part; 72-connecting plate; 73-connecting rod; 74-mounting seat; 75-turning member; 76-driving motor; 77-third transmission belt; 78-position sensor;

[0062] 81-first driving device; 82-second driving device; 83-pushing member;

[0063] 9- lifting mechanism;

[0064] 901-driving device; 902-carrying plate; 9021-notch portion;

[0065] 10-Transport roller. DETAILED DESCRIPTION

[0066] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0067] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0068] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0069] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0070] This embodiment provides a wafer loading assembly, such as Figure 1-Figure 6 As shown, it is used to transfer the ceramic plate to be waxed. The wafer loading equipment is suitable for installation on one side of the oven. The oven can drive the ceramic plate to rise and fall in the height direction. The wafer and the ceramic plate enter the wafer loading assembly together, and then enter the oven after being transferred by the wafer loading assembly. The separation operation between the wafer and the ceramic plate is completed in the oven. It includes:

[0071] A bracket 1, wherein the bracket 1 is provided with a lifting channel suitable for lifting the plug box 4;

[0072] Specifically, the bracket 1 itself is arranged along the height direction. Figure 1 As shown, an open area is provided on the top of the bracket 1, which can form a lifting channel, and the plug box 4 is lifted and lowered through the lifting channel. The structure of the plug box 4 itself is not limited, and it can adopt the common plug box 4 structure in the prior art, and the plug box 4 itself can accommodate multiple ceramic discs in the height direction.

[0073] In this embodiment, the ceramic disk itself has a good heat transfer effect and will not be damaged in a high temperature environment.

[0074] A lifting assembly 5 is provided on the bracket 1 to drive the plug box 4 to move up and down in the lifting channel;

[0075] Specifically, the structure of the lifting assembly itself is not limited, as long as it can achieve the action of pushing the jam box 4 in the height direction. As an embodiment, the lifting assembly itself adopts a combination of a lead screw structure and a motor. At the same time, a lifting platform is also provided on the top of the lifting assembly, and the jam box 4 can be directly placed on the lifting platform, thereby improving the stability of its own movement.

[0076] Meanwhile, the lifting channel itself can be an open area arranged inside the bracket 1, through which the upper end of the lifting assembly 5 can be moved.

[0077] The flipping conveying mechanism 7 is arranged on the bracket 1, and a conveying part is arranged on the flipping conveying mechanism 7. The flipping conveying mechanism 7 has a flipping state and a non-flipping state. In the flipping state, the conveying part rotates to the bottom of the plug box so that the conveying part drives the ceramic disk on the plug box to move; in the non-flipping state, the conveying part leaves the lifting channel;

[0078] Specifically, the function of the flipping conveyor mechanism 7 is to sequentially remove the ceramic discs on the plug box 4 from the plug box 4 for subsequent transfer operations. In this embodiment, the flipping conveyor mechanism 7 is rotatably arranged on the bracket 1. At this time, the flipping conveyor mechanism 7 can realize the flipping operation under the drive of external force, such as Figure 2-Figure 4 As shown: the flip conveyor mechanism 7 flips counterclockwise and moves to the working position, and the conveyor part rotates to the lower position of the plug box 4. When the ceramic plate does not need to be transported, the flip conveyor mechanism 7 is controlled to rotate clockwise, and the conveyor part leaves the lower surface of the plug box 4. At the same time, the flip conveyor mechanism 7 will no longer interfere with the lower part of the plug box 4, so that the plug box 4 can be lifted and lowered conveniently, and the lifting assembly can easily drive the plug box 4 to move in the height direction.

[0079] The conveying mechanism 6 is arranged in front of the flipping conveying mechanism 7 along the direction in which the wafer moves to the oven, and is used to drive the wafer to move toward the oven. Figure 5 In the perspective shown, the ceramic plate can be moved from right to left by the conveying mechanism and then enter the oven located on the left side of the conveying mechanism.

[0080] Specifically, the flip conveyor mechanism 7 cannot directly convey the ceramic discs transported thereon to the oven. In this case, the conveyor mechanism needs to intervene as an additional aid to further transfer the ceramic discs transported by the flip conveyor mechanism 7 to the oven. In this embodiment, the composition of the conveyor mechanism itself is not limited, as long as the ceramic discs can be further transported to the oven:

[0081] As an embodiment, the flipping and conveying mechanism 7 includes: a driving part 71, which is arranged on the bracket 1; a transmission part, the driving part 71 acts on one end of the transmission part, and the conveying part is installed at the other end of the transmission part. When the flipping and conveying mechanism is in a non-flipping state, the conveying part leaves the lifting channel; a rotating shaft, which is installed on the bracket 1, and the transmission part is hinged to the rotating shaft.

[0082] Specifically, the structure of the driving part 71 itself is not limited, as long as it can realize the driving action of the transmission part. The driving part 71 itself can be a cylinder structure, and the rotation angle of the transmission part itself is controlled by controlling the expansion and contraction amount of the cylinder structure itself. At the same time, a rotating shaft is provided on the bracket 1, and the transmission part itself can be inserted on the rotating shaft, and the two ends of the rotating shaft are respectively installed on the bracket 1. The transmission part itself uses the rotating shaft as a hinge point to realize the rotation action.

[0083] In this embodiment, the structure of the transmission part itself is not limited, as long as the transmission action can be realized, it can be a single structure, such as a rod or a carrier plate, or a composite structure composed of multiple structures.

[0084] As an embodiment, the transmission part includes: a flip member 75, one end of which is hinged on the rotating shaft; a connecting rod part, one end of which is connected to the driving part 71 and the other end is connected to the other end of the flip member 75, and the transmission part is arranged on the connecting rod part.

[0085] Specifically. Figure 2 and Figure 3 As shown, the top end of the flip member 75 is hinged on the rotating shaft, and the lower end of the flip member 75 can swing under the drive of an external force. The top end of the connecting rod is connected to the driving part 71, and the lower end of the connecting rod is connected to the flip member 75. When the driving part 71 is started, the connecting rod drives the flip member 75, so that the top end of the flip member 75 rotates relative to the rotating shaft.

[0086] In this embodiment, the structure of the connecting rod portion itself is not limited, as long as the force of the driving portion 71 can be transmitted to the flip member 75 .

[0087] As an implementation method, Figure 2As shown, the connecting rod portion includes: a connecting plate 72, one end of which acts on the driving portion 71; a connecting rod 73, one end of which is connected to the other end of the connecting plate 72, and the other end of which is connected to the flip member 75.

[0088] Specifically, Figure 2 As shown, the driving part 71 is arranged on the outside of the plug box 4, the connecting plate 72 itself is arranged horizontally, the movable end of the driving part 71 is connected to the outer end of the connecting plate 72, and the inner end of the connecting plate 72 is connected to the connecting rod 73. The connecting rod 73 extends from top to bottom along the height direction and acts on the flip member 75.

[0089] Further, in this embodiment, if Figure 2 As shown, in order to further improve the stability of the transmission part on the connecting rod part, the connecting rod part also includes: a mounting seat 74 connected to the connecting rod 73, the flip member 75 is connected to the mounting seat 74, and the transmission part is installed on the mounting seat 74.

[0090] By providing the mounting seat 74, the connecting rod 73 can be stably installed first, and the transmission part can be placed by providing the mounting seat 74, so as to prevent the transmission part from shaking. Specifically, the mounting seat 74 itself can adopt a plate-like structure, and the connecting rod 73 can be installed on the plate-like structure by welding.

[0091] In this embodiment, the structure of the conveying part itself is not limited, as long as it can realize the conveying action of the ceramic disk. Figure 2 As shown, the transmission part includes: a driving motor 76 and a third transmission belt 77 connected to the driving motor 76 for force transmission, and a position sensor 78 is arranged on the mounting seat 74.

[0092] Specifically, Figure 1 and Figure 4 As shown, the driving motor 76 is installed on the mounting seat 74, and a third transmission belt 77 is installed on one side of the driving motor 76. The third transmission belt 77 itself is symmetrically installed on both sides of the mounting seat 74. At the same time, a pulley structure is arranged between the driving motor 76 and the third transmission belt 77. After the driving motor 76 is started, the power is transmitted to the rotating shaft of the transmission belt through the pulley structure, thereby realizing the movement of the transmission belt.

[0093] At the same time, if Figure 4 As shown, the position sensor 78 on the mounting seat 74 is used to detect whether the transmission belt carries a ceramic disk. The position sensor itself can send a signal to the drive motor 76. After obtaining the signal that the ceramic disk exists, the drive motor 76 drives to drive the transmission belt to move the ceramic disk; when the position sensor does not detect the ceramic disk, the drive motor 76 is controlled not to start.

[0094] Furthermore, if Figure 2 and Figure 4 As shown, the connecting rod 73 is provided with a curved portion, and the center of the curved portion is arranged on one side of the lifting channel.

[0095] like Figure 2 From the perspective shown, the curved portion itself faces outward, that is, the left side of the figure is protruding. This arrangement can avoid interference between the connecting rod 73 itself and other components, such as the flipping transmission mechanism 7.

[0096] It should be noted that in this embodiment, the connecting plate 72 and the connecting rod 73 can be a single-rod structure or a symmetrically arranged double-rod structure. Figure 2 As shown, the connecting plate 72 and the connecting rod 73 are arranged in two groups, and the two groups of structures are symmetrically arranged on both sides of the plug box 4. At the same time, the driving part 71 adopts two groups of cylinders. This arrangement can transmit power to the connecting plate 72 more smoothly, thereby ensuring the stable movement of the transmission part and preventing tilting due to uneven force.

[0097] In this embodiment, the structure of the conveying mechanism itself is not limited, as long as it can complete the reception of the materials transmitted by the conveying part.

[0098] As an implementation method, the conveying mechanism itself can directly adopt a lead screw slider structure and cooperate with a motor. After the motor is started, it drives the lead screw to move horizontally to move the material from the conveying part to the inside of the oven.

[0099] As another embodiment, Figure 4 and Figure 5 As shown, the conveying mechanism includes: a third driving device 61, which is stationary relative to the bracket 1; a first transmission belt 62, and the power output end of the third driving device 61 acts on the first transmission belt 62; a first conveying roller 64, and the first transmission belt 62 acts on the first conveying roller 64 to drive the first conveying roller 64 to rotate; a second conveying roller 65, which is connected to the first conveying roller 64 through a second transmission belt.

[0100] Specifically, the third driving device 61 itself is stably arranged relative to the bracket 1. It can be directly supported by a support platform placed on the ground, or installed on the bracket 1, and can also be installed on the oven, as long as it can achieve relative stability; further, the third driving device 61 is installed with a first transmission belt 62, and the power of the third driving device 61 is output through the first transmission belt 62. Specifically, the power output end of the third driving device 61 and the first transmission belt 62 can be connected by a tension fit, or can be matched by a spline. Further, the power transmitted by the first transmission belt 62 will act on the first conveying roller 64, and the second transmission belt is arranged on the first conveying roller 64. The second transmission belt 63 relies on the first conveying roller 64 and the second conveying roller 65 to realize rotation, thereby realizing the conveying of materials, and in this embodiment, the ceramic disc.

[0101] like Figure 5 As shown, in this embodiment, a driven conveying roller 66 is arranged between the first conveying roller 64 and the second conveying roller 65. The driven conveying roller 66 can realize auxiliary conveying operation of the material. Example 2

[0102] This embodiment provides an oven for heating wafers. After the wafers are heated, the wax layer between the wafers and the ceramic plate will soften, thereby facilitating subsequent wax removal operations. Figure 7-Figure 17 As shown, including:

[0103] The box body 201 is provided with a box body 201 entrance and a box body 201 exit, the box body 201 entrance is used to receive the ceramic plate entering the box body 201, and the box body 201 is provided with a heating chamber inside;

[0104] A heating element 3 is arranged inside the box 201;

[0105] Specifically, the entrance of the box 201 is used to enter the wafer that has not yet been waxed, and the wafer and the ceramic plate are combined together through the wax layer. The heating operation of the heating element 3 on the wafer allows the wax layer between the wafer and the ceramic plate to be heated and melted, and after the wafer and the ceramic plate are separated, it leaves the oven through the outlet of the box 201. In this embodiment, the heating element 3 itself can be made of common heating materials in the prior art such as resistance wire.

[0106] The support frame 202 is arranged inside the heating chamber and located on both sides of the entrance of the box body 201;

[0107] like Figure 3 As shown, the support frames 202 are arranged in the heating chamber along the height direction, and the number of the support frames 202 is two groups, and they are arranged side by side in the horizontal direction. Figure 3In the perspective shown, the entrance of the box body 201 is arranged at the midline of the box body 201 , and two groups of support frames 202 are arranged on the left and right sides of the entrance of the box body 201 .

[0108] A longitudinal transfer mechanism 203 is correspondingly mounted on the support frame 202. The longitudinal transfer mechanism 203 includes a plurality of bearing parts. One side adjacent to the longitudinal transfer mechanism 203 forms a supporting area. The bearing parts are used to support the ceramic disk in the supporting area and drive the ceramic disk to move in the height direction.

[0109] Specifically, Figure 2 As shown, the wafers entering the oven can be transported along the height direction by the carrying part. Figure 2 From the perspective described, the area between the two groups of support frames 202 on the left and right sides forms a supporting area, and the wafers are transported from top to bottom in the supporting area.

[0110] It should be noted that, in this embodiment, Figure 2 From the perspective shown, the carrying part in the longitudinal transfer mechanism 203 located on the left side and the carrying part in the longitudinal transfer mechanism 203 located on the right side are arranged flush with each other, that is, the carrying parts arranged on the longitudinal transfer mechanisms 203 on the left and right sides are on the same horizontal line. Such an arrangement can ensure that the wafers between the longitudinal transfer mechanisms 203 on the left and right sides can be transported downward in a horizontal state.

[0111] A longitudinal driving mechanism, disposed in the heating chamber, for driving the longitudinal transfer mechanism 203 to move;

[0112] Specifically, Figure 8 As shown in FIG. 1 , when the wafer needs to be transported downward, the Figure 8 The longitudinal transmission mechanism 203 on the left side needs to rotate clockwise. Figure 8 The longitudinal transmission mechanism 203 on the middle right side needs to rotate counterclockwise. The function of the longitudinal drive mechanism itself is to realize the above-mentioned rotation action.

[0113] The lifting mechanism 9 is arranged below the longitudinal transfer mechanism 203 to receive the ceramic disk transferred by the longitudinal transfer mechanism 203 and drive the ceramic disk to move to the push rod mechanism area. A push rod mechanism is arranged in the push rod mechanism area, and the wafer can be separated from the ceramic disk by the push rod mechanism.

[0114] Specifically, the lifting mechanism 9 is used to receive the wafers descending from the longitudinal transfer mechanism 203 and further transfer them to corresponding operations to perform subsequent wax removal operations.

[0115] In this embodiment, the structure of the longitudinal transfer mechanism 203 is not limited, as long as it can move the wafer in the height direction. Figure 8 As shown, as an embodiment, the longitudinal transfer mechanism 203 includes:

[0116] The transmission chain 2031 is annularly wound around the support frame 202;

[0117] The bearing portion is installed on the conveying chain 2031 and extends in the horizontal direction.

[0118] Specifically, the longitudinal drive mechanism and the transmission chain 2031 can realize power transmission through a combination of a sprocket and a chain. Figure 8 and Fig.11 As shown, the conveying chain 2031 itself is arranged in a ring shape and extends in the height direction. Gears are installed at the top and bottom ends of the conveying chain 2031, and the gears are installed on the box body 201, so as to realize the stable rotation of the conveying chain 2031.

[0119] In this embodiment, the structure of the bearing part itself is not limited, as long as it can be stably mounted on the conveying chain 2031 and can transport the ceramic disk. Figure 8 As shown, the bearing part includes: a fixing member 2032, which is installed on the conveying chain 2031 and extends in the horizontal direction; and a bearing plate 2033, which is installed on the fixing member 2032 and is used to support the ceramic disk.

[0120] Specifically, one end of the fixing member 2032 can be directly installed between two links of the conveying chain 2031, so as to play a role of stable fixing. At the same time, the carrying plate 2033 is arranged on one side of the fixing member 2032, so that when the carrying plate 2033 moves to the position of the supporting area, the carrying plate 2033 itself can always face upward, that is, one side of the wafer, so as to complete the support of the wafer.

[0121] Furthermore, the material of the bearing plate 2033 itself is not limited. It can be a metal material or a ceramic material, as long as it can achieve a stable supporting action. In this embodiment, the bearing plate 2033 is made of a self-lubricating material. A self-lubricating material refers to a solid powder, a film or some integral material that reduces the friction and wear between two bearing surfaces. Optionally, the bearing plate 2033 can be made of a plastic with a self-lubricating function, such as polytetrafluoroethylene.

[0122] In this embodiment, the bearing portion corresponding to one side of the supporting area must be kept stable to avoid tilting during the top-down transfer process. Figure 8As shown, the oven further includes: a vertical support plate 2021 , the conveying chain 2031 is installed on the vertical support plate 2021 , and the side of the conveying chain 2031 close to the supporting area is arranged close to the vertical support plate 2021 .

[0123] Specifically, the vertical support plate 2021 is arranged on the inner wall of the box body 201. Figure 8 In the perspective shown, the vertical support plate 2021 on the left is located at the right side of the left conveying chain 2031. Correspondingly, the vertical support plate 2021 on the right is located at the left side of the conveying chain 2031 on the right.

[0124] In this embodiment, the structure of the longitudinal driving mechanism is not limited, as long as the rotation of the conveying chain 2031 can be achieved. Figure 7 and Figure 8 As shown, the longitudinal driving mechanism comprises:

[0125] A driving motor 2041 is arranged on the box body 201;

[0126] The transmission chain 2043 is connected to the driving motor 2041 via a transmission shaft 2042 , and the transmission chain 2043 is used to drive the conveying chain 2031 to rotate.

[0127] Specifically, the driving motor 2041 is arranged outside the box 201, the number of the transmission chain 2043 is set to two groups, and the driving motor 2041 is provided with a transmission shaft 2042, and the power of the driving motor 2041 is transferred to the transmission chain 2031 through the transmission shaft 2042. In this embodiment, the number of the driving motor 2041 can be two groups, and each group of power motors corresponds to a transmission chain 2043 separately; the number of the driving motor 2041 can also be one group, such as Figure 7 As shown, a transmission gear 2044 can be arranged between the two transmission shafts 2042 . When the driving motor 2041 is started, the two sets of transmission shafts 2042 can be driven to rotate at the same time through the cooperation of the transmission gear 2044 .

[0128] like Figure 8 As shown, the transmission chain 2043 itself extends in the horizontal direction. Figure 8 From the perspective shown, a gear is installed at one end of the transmission shaft 2042 entering the box body 201, and the gear is assembled with the transmission gear 2044. A gear set is installed between the transmission gear 2044 and the transmission gear. The two gears in the gear set are coaxially arranged so that the transmission gear 2044 and the transmission gear can rotate synchronously.

[0129] In this embodiment, the distance between the two support frames 202 can be fixedly set, and at this time, only ceramic plates or wafers of specific sizes can be lifted and lowered. As a variant, the distance between the two support frames 202 can also be adjusted. For example, Figure 2 in the perspective described, the two support frames 202 can move relatively closer to or away from each other.

[0130] Furthermore, the implementation method for moving the support frame 202 is not limited. As an implementation method, the distance between the two support frames 202 can be adjusted manually.

[0131] As another implementation method, for example, Figure 8 、 Fig. 9 and Fig.13 shown, in order to implement the above actions, the box body 201 further includes:

[0132] An adjusting bushing 207 is arranged at the lower part of the box body 201. The support frame 202 is connected to the adjusting bushing 207, and the adjusting bushing 207 is used to drive the support frame 202 to move so as to change the relative distance between the two support frames 202;

[0133] An adjusting rod 206, the adjusting bushing 207 is installed on the adjusting rod 206, and the adjusting bushing 207 can be stabilized at different positions on the adjusting rod 206.

[0134] Specifically, the adjusting bushing 207 is installed on the adjusting rod 206, the adjusting bushing 207 itself is connected to the support frame 202, and a friction connection can be adopted between the adjusting bushing 207 and the adjusting rod 206, so that the adjusting bushing 207 can be stabilized at a specific position on the adjusting rod 206. In this embodiment, the adjusting bushing 207 is arranged in a cylindrical shape, and the adjusting bushing 207 and the support frame 202 can be connected by welding.

[0135] In this embodiment, further, an adjusting hole is provided at a position corresponding to the adjusting bushing 207 on the box body 201. An adjusting handle 210 is inserted through the adjusting hole, and the adjusting handle 210 is connected to the adjusting bushing 207 to drive the adjusting bushing 207 to move.

[0136] Specifically, as Figure 7 shown, the adjusting hole itself extends along the width direction of the box body 201, that is, the horizontal direction. Correspondingly, the adjusting handle 210 can also move relative to the box body 201 in the horizontal direction. For example, Figure 7 in the perspective shown, the number of adjusting handles 210 is two. When the two adjusting handles 210 move relatively away from each other, the adjusting handles 210 move relatively away from each other, and at this time, the two support frames 202 move relatively away from each other.

[0137] It should be pointed out that the structure of the adjustment handle 210 is not limited in this embodiment, and it includes an adjustment end and a connection end. The adjustment end protrudes from the box body 201. The adjustment end of the adjustment handle 210 is controlled by an external force to drive the adjustment handle 210 to move. The connection end is connected to the adjustment bushing 207, and the connection end and the adjustment bushing 207 are connected by welding.

[0138] In the oven structure provided in this embodiment, when the distance between the two groups of support frames 202 is adjusted, the structure further includes:

[0139] The adjusting slot 209 is provided on the box body 201 and extends in the height direction;

[0140] The tensioning wheel 208 is movably disposed in the adjusting groove 209 and is suitable for acting on the transmission chain 2043. The tension of the transmission chain 2043 can be adjusted by adjusting the position of the tensioning wheel 208 in the adjusting groove 209.

[0141] Specifically, Figure 7 As shown, the take-up wheel 208 can move up and down relative to the adjustment slot 209. When the two sets of support frames 202 are relatively close, the transmission chain 2043 will be loose, and the connection between the transmission chain 2043 and the gear will be unstable. By controlling the take-up wheel 208 to move downward, as shown in FIG. Figure 4 As shown, when the take-up wheel 208 moves downward, the drive sprocket will be tightened again.

[0142] It should be noted that the tension wheel 208 itself can be a gear structure or a groove structure, as long as it can be stably connected to the transmission chain 2043. At the same time, a clamping structure is provided between the tension wheel 208 and the adjustment groove 209, and the tension wheel 208 can be stabilized at a specific position of the adjustment groove 209 through the clamping structure. In this embodiment, the clamping structure can be a bolt provided on the tension wheel 208, and the degree of clamping of the tension wheel 208 on the adjustment groove 209 can be controlled by adjusting the insertion distance of the bolt on the tension wheel 208.

[0143] Furthermore, in this embodiment, if Fig.10 As shown, in order to limit the position of the adjusting bushing 207 on the adjusting rod 206, a first positioning portion 211 is further provided in the box body 201. The first positioning portion 211 is provided in the box body 201 and is located on the path where the two support frames 202 approach each other.

[0144] Specifically, Fig.10 and Fig.11As shown, the first positioning portion 211 is disposed at the midline of the box body 201, and the two sets of support frames 202 are symmetrically disposed relative to the first positioning portion 211. When the adjusting bushing 207 moves toward the middle of the adjusting rod 206, once it contacts the first positioning portion 211, it stops moving.

[0145] It should be noted that the first positioning portion 211 may be a positioning block disposed in the box body 201 , and the positioning block itself is connected to the box body 201 via screws.

[0146] Further, such as Fig.10 As shown, a connecting plate is provided on the top of the sleeve, and one end of the connecting plate close to the first positioning portion 211 is at a certain distance from the adjusting sleeve 207. In this way, when the connecting plate contacts the first positioning portion 211, a certain distance can be maintained between the two support frames 202, thereby achieving stable transmission of the wafer.

[0147] In this embodiment, the first positioning portion 211 can limit excessive movement of the adjustment bushing 207 when the two support frames 202 move relatively closer to each other; when it is necessary to limit excessive movement of the support member when the two support frames 202 move relatively farther away from each other, this embodiment is provided with a second positioning portion 212, which is arranged on the path where the two support frames 202 move away from each other.

[0148] Specifically, the second positioning portion 212 itself is not limited in its setting position, and it can be set inside the box body 201 or outside the box body 201, as long as it can play a role in limiting the action.

[0149] As an implementation method, Fig.10 As shown, the second positioning portion 212 is provided on the box body 201. The second positioning portion 212 is provided obliquely above the adjusting bushing 207. When the adjusting bushing 207 moves outward, the second positioning portion 212 can abut against the adjusting bushing 207, thereby preventing the adjusting bushing 207 from excessively moving outward. In this embodiment, the second positioning portion 212 can be a positioning block installed at the lower part of the box body 201, and the positioning block is installed on the bottom surface of the box body 201.

[0150] In this embodiment, in addition to adjusting the position of the adjusting bushing 207 on the adjusting rod 206 by adjusting the handle 210, the position of the adjusting bushing 207 can also be adjusted by providing a relevant adjusting device between the second positioning portion 212 and the adjusting bushing 207. Fig.16 As shown, a push hole 2121 and a pull-back hole 2122 are provided in the second positioning portion 212, wherein the push hole is suitable for placing a push bolt 213, and the push bolt 213 is used to push the adjusting bushing 207;

[0151] At the same time, a threaded hole is provided on the pull-back hole 2122 , a thread is provided in the threaded hole, and a pull-back bolt 214 is provided in the threaded hole. The end of the pull-back bolt 214 is connected to the adjusting bushing 207 , thereby pulling the adjusting bushing 207 to move.

[0152] Specifically, in order to realize the adjustment action of the pull-back bolt 214 on the adjustment bushing 207, the pull-back bolt 214 idles in the adjustment bushing, and at the same time, the pull-back bolt 214 and the adjustment bushing cannot be relatively disengaged, thereby ensuring that the pull-back bolt can drive the adjustment bushing to move.

[0153] Specifically, the second positioning portion 212 is in a stationary state relative to the box body 201. When it is necessary to control the adjustment bushing 207 to move away from the second positioning portion 212, a push bolt 213 is placed in the push hole, and the adjustment bushing 207 is moved away from the second positioning portion 212 by rotating the push bolt 213. When it is necessary to control the adjustment bushing 207 to move closer to the second positioning portion 212, the pull-back bolt 214 is placed in the threaded portion of the adjustment bushing 207 and rotated. At this time, the adjustment bushing 207 is pulled back to the position of the second positioning portion 212 by the action of the thread, thereby controlling the two groups of support frames 202 to move away from each other.

[0154] In this embodiment, Figure 8 As shown, the oven further includes: an arc-shaped positioning portion 205 , which is arranged in the oven and between the transmission chain 2043 and the entrance of the box body 201 .

[0155] The arc-shaped positioning portion 205 is used to limit the position of the ceramic disk entering the oven, and also prevent the ceramic disk from colliding with the transmission chain 2043.

[0156] In this embodiment, after the wafer is lowered to a specific position driven by the longitudinal transfer mechanism 203, it is necessary to further perform a separation operation between the ceramic plate and the wafer. To this end, the lifting mechanism 9 includes a driving device 901 and a carrier plate 902, on which a heating element 3 is disposed, and the carrier plate 902 is used to receive the ceramic plate transferred by the longitudinal transfer mechanism 203 under the drive of the driving device 901.

[0157] Specifically, the carrier plate 902 itself is arranged in a planar shape, and when the longitudinal transfer mechanism 203 moves the wafer downward to the setting position, the driving device 901 drives the carrier plate 902 to rise until the carrier plate 902 contacts the wafer. At the same time, the heating element 3 on the carrier plate 902 heats the wafer to ensure that the wax layer is in a molten state.

[0158] Furthermore, a temperature sensor may be provided inside or outside the oven to sense the temperature in the heating chamber. When the temperature is raised to a level that can be used to heat the wafer, the temperature sensor sends a signal to the drive device 901, and the drive device 901 drives the wafer to descend.

[0159] In this embodiment, after the carrier plate 902 transports the wafer to a specific height, the wafer needs to be transferred to a specific station to separate the wafer from the ceramic plate. Fig.15 As shown, a conveying end surface is also provided in the box body 201 and is arranged on the lifting path of the carrying plate 902 . A conveying roller 10 is arranged on the conveying end surface, and a notch portion 9021 is provided at a position corresponding to the conveying roller 10 on the carrying plate 902 .

[0160] Specifically, Fig.15 and Fig.17 As shown, the wafer will first stay on the conveying end surface, at which time the wafer will be separated from the carrier plate 902. A notch 9021 is provided on the conveying end surface to ensure that the carrier plate 902 leaves smoothly. At this time, the conveying roller 10 is started, and the transmission roller will drive the wafer to move to the waxing station. A push rod structure is provided at the waxing station, and the wafer and the ceramic plate can be separated by the push rod structure. The structure of the push rod mechanism itself is not limited, and it can directly operate the common structure in the prior art. Example

[0161] This embodiment provides a wax unloading machine, comprising: the wafer loading assembly provided in embodiment 1;

[0162] The oven 2 provided in Example 2 is arranged on one side of the wafer loading assembly, and an oven inlet is provided on the oven. A heating element 3 is provided in the oven. The oven is used to transport the ceramic disc along the height direction. The ceramic disc is suitable for placing wafers. A push rod structure area is provided in the oven. The oven is used to transport the ceramic disc from top to bottom and convey the ceramic disc to the push rod structure area.

[0163] Specifically, Figure 5 and Figure 6 As shown. Figure 5 In the perspective shown, the oven 2 is arranged at the left side of the wafer loading assembly, and the ceramic plate moves from right to left and is transferred from the wafer loading assembly to the oven 2. In this embodiment, a heating element 3 is arranged inside the oven 2, and the ceramic plate can be heated by the heating element, so that the wax layer between the ceramic plate and the wafer can be melted. A push rod structure area is arranged inside the oven, and a push rod structure is arranged in the push rod structure area, and the push rod structure is used to separate the wafer from the ceramic plate.

[0164] Furthermore, in this embodiment, the ceramic disc can be transported in the height direction inside the oven. Through the combination of the oven and the wafer loading assembly, the ceramic disc can be first raised in the height direction, then transported in the horizontal direction, and further lowered in the height direction, and after the lowering is completed, the push rod structure area is pushed to perform the subsequent waxing operation. Through the above-mentioned setting method, the height space can be effectively utilized, thereby avoiding the situation where the space occupied is too large due to the complete horizontal transportation of the ceramic disc and the waxing operation.

[0165] In this embodiment, when the conveying mechanism on the wafer loading assembly transfers the ceramic disc to one side of the oven, there may be a certain gap between the conveying mechanism and the oven. The existence of the gap will cause the ceramic disc to be unable to enter the oven accurately and stably, thereby causing errors in the transmission of the ceramic disc. For this reason, in this embodiment, an additional wafer pushing mechanism 8 is provided, which is provided between the conveying mechanism and the oven entrance to push the wafer into the oven.

[0166] Specifically, the structure of the wafer pushing mechanism 8 itself is not limited. As an implementation method, a combination of a carrier plate and a cylinder commonly used in the prior art can be used, the carrier plate is used to receive the ceramic disc transferred from the conveying structure, and the cylinder further drives the ceramic disc to move toward the oven, so as to enter the oven through the oven inlet;

[0167] As another embodiment, Figure 5 and Figure 6 As shown, the wafer pushing mechanism 8 includes:

[0168] A pusher 83 moves relative to the oven entrance;

[0169] Specifically, the pusher 83 itself can play a role in supporting and driving the ceramic disk. Figure 5 As shown, in this embodiment, the pusher 83 itself can be set as a plate-shaped structure, so as to facilitate driving the ceramic disk;

[0170] A second driving device 82 is connected to the pushing member 83 to drive the pushing member 83 to move in a height direction;

[0171] exist Figure 6 In the perspective shown, the second driving device 82 is used to drive the pusher 83 to move in the up-down direction. The second driving device 82 itself can use a cylinder to accurately adjust the position in the height direction;

[0172] A first driving device 81 is connected to the second driving device 82, and is used to drive the second driving device 82 to move closer to or away from the oven;

[0173] like Figure 6 In the perspective shown, the first driving device 81 is used to drive the pusher 83 to move in the horizontal direction. The first driving device 81 is installed on the upper surface of the oven. The first driving device 81 adopts a cylinder, and the second driving device 82 is installed at the end of the movable head of the cylinder. Specifically, the connecting plate 72 can be installed on the second driving device 82, and the end of the movable head of the second driving device 82 is connected to the connecting plate 72 by welding.

[0174] The working process of the wafer pushing mechanism 8 is as follows: the transmission belts are set to two groups, and the pusher 83 can be lifted and lowered in the area between the two groups of transmission belts. When the ceramic disk needs to be moved, the pusher 83 is first driven by the first driving device 81 to move to the outside of the ceramic disk. Figure 5 As shown, the first driving device 81 drives the pusher 83 to move, and the pusher 83 is then driven by the second driving device 82 to descend, and the ceramic plate is located at the upper left of the pusher 83. Further, the first driving device 81 and the second driving device 82 are started to move the pusher 83 to the ceramic plate, and the first driving device 81 drives the ceramic plate further toward one side of the oven, that is, Figure 5 Move the left side of the oven to enter the oven.

[0175] The working process of the waxing machine provided by the present embodiment is as follows:

[0176] The plug box with multiple layers of ceramic discs disposed therein is transferred to the position of the bracket 1 by a trolley or other structure, and then the lifting assembly 5 is started to raise the plug box to a predetermined height position of the bracket 1;

[0177] The flip conveyor mechanism 7 is started and rotated to Figure 4 In the state shown, the third transmission belt 77 arranged thereon is moved to the lower part of the plug box, the third transmission belt 77 drives the ceramic disc to leave the plug box, and then moves to the conveying mechanism 6, the third driving device 61 in the conveying mechanism is started, so that the ceramic disc moves toward the oven part under the drive of the second transmission belt 63;

[0178] The lifting assembly 5 drives the plug box to move downward for a distance, so that the third transmission belt 77 can contact the ceramic disk on the upper layer, and the third transmission belt 77 starts to continue to transport the ceramic disk;

[0179] The ceramic plate moves to the wafer pushing mechanism 8, and the pusher 83 acts on the ceramic plate through the first driving device and the second driving device, and further moves toward the oven entrance until it enters the oven entrance;

[0180] The ceramic plate is driven to move vertically downward inside the oven 2, and the heating element in the oven starts working, and when it descends to the push rod structure area, the wafer on the ceramic plate is waxed;

[0181] After all the ceramic discs are transferred from the plug box, the turning conveyor mechanism 7 is controlled to turn to Figure 2 In the state shown, the space below the plug box is open, the lifting assembly 5 drives the empty plug box down, and then replaces it with the plug box with the ceramic disk, and drives the plug box to rise again, and then controls the flip conveyor mechanism 7 to rotate to Figure 4 State, and repeat this process multiple times.

[0182] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection created by this application.

Claims

1. A wafer loading assembly, It is characterized in that Suitable for being arranged on one side of an oven (2), wherein a heating element (3) is provided inside the oven (2), and the oven is used to transfer ceramic discs from top to bottom; the wafer loading assembly comprises: A support (1) is provided with a lifting channel suitable for lifting a plug box, the plug box is used to carry the ceramic plate, and the ceramic plate can bond a plurality of wafers; A lifting assembly (5) is arranged on the bracket and is used to support the plug box (4) to be lifted and lowered in the lifting channel; a flipping and conveying mechanism (7) arranged on the bracket, on which a conveying portion is arranged, the flipping and conveying mechanism (7) having a flipping state and a non-flipping state, in which the flipping and conveying mechanism (7) flips to the lower end of the plug box (4) after the lifting assembly (5) lifts the plug box (4), and the conveying portion is connected to the ceramic disc located at the lower end of the plug box (4), so that the conveying portion conveys the ceramic disc to the conveying mechanism (6); A conveying mechanism (6) is arranged between the support (1) and the oven (2) and is used to convey the ceramic disc into the oven (2).

2. The wafer loading assembly according to claim 1, It is characterized in that The flipping and conveying mechanism (7) comprises: A driving unit (71) is arranged on the bracket; A transmission part, wherein the driving part acts on one end of the transmission part, and the conveying part is installed at the other end of the transmission part. When the flipping and conveying mechanism switches from the flipping state to the non-flipping state, the conveying part leaves the lifting channel; A rotating shaft is installed on the bracket, and the transmission part is hinged to the rotating shaft.

3. The wafer loading assembly according to claim 2, It is characterized in that The transmission part comprises: A turning member (75), one end of which is hinged on the rotating shaft; A connecting rod portion has one end connected to the driving portion (71) and the other end connected to the other end of the flip member (75), and the transmission portion is arranged on the connecting rod portion.

4. The wafer loading assembly according to claim 3, It is characterized in that The connecting rod portion comprises: A connecting plate (72), one end of which acts on the driving portion (71); A connecting rod (73) has one end connected to the other end of the connecting plate, and the other end connected to the flip member.

5. The wafer loading assembly according to claim 4, It is characterized in that The connecting rod portion further comprises: The mounting seat (74) is connected to the connecting rod, the flip member (75) is connected to the mounting seat (74), and the transmission part is installed on the mounting seat.

6. The wafer loading assembly according to claim 5, It is characterized in that The transmission unit comprises: A drive motor (76) and a third drive belt (77) drivingly connected to the drive motor; and a position sensor (78) is provided on the mounting seat (74).

7. The wafer loading assembly according to any one of claims 4 to 6, It is characterized in that The driving part (71) comprises two groups of cylinders, and the two connecting plates (72) are correspondingly connected to the power output ends of the cylinders.

8. The wafer loading assembly according to claim 7, It is characterized in that The connecting rod (73) is provided with a curved portion, and the center of the curved portion is arranged on one side of the lifting channel.

9. The wafer loading assembly according to any one of claims 1 to 6, It is characterized in that The conveying mechanism comprises: A third driving device (61) is arranged stationary relative to the support; a first transmission belt (62), wherein a power output end of the third driving device (61) acts on the first transmission belt (62); a first conveying roller (64), the first transmission belt (62) acting on the first conveying roller to drive the first conveying roller to rotate; The second conveying roller (65) is connected to the first conveying roller (64) via a second transmission belt (63).

10. The wafer loading assembly according to claim 9, It is characterized in that A driven conveying roller (66) is arranged between the first conveying roller and the second conveying roller.

11. A waxing machine, It is characterized in that include: The wafer loading assembly according to any one of claims 1 to 10; An oven (2) is arranged on one side of the wafer loading assembly, an oven inlet is arranged on the oven (2), a heating element (3) is arranged in the oven (2), a push rod structure area is arranged in the oven (2), and the oven is used to transfer the ceramic disc from top to bottom and transport the ceramic disc to the push rod structure area.

12. The wax removing machine according to claim 11, It is characterized in that The waxing machine also includes: A wafer pushing mechanism (8) is arranged between the conveying mechanism and the oven entrance, and is used to push the wafer into the oven.

13. The wax removal machine according to claim 12, It is characterized in that The wafer pushing mechanism comprises: A pusher (83) moves relative to the oven entrance; A second driving device (82) connected to the pushing member, and used to drive the pushing member (83) to move in a height direction; The first driving device (81) is connected to the second driving device (82) and is used to drive the second driving device (82) to move towards or away from the oven.

14. The wax removing machine according to claim 11, It is characterized in that The conveying mechanism of the wafer loading assembly is provided with a third driving device (61), and the third driving device (61) is installed on the oven.

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