An evaporation coating component, device and coating method for preventing winding coating

Abstract

The present invention belongs to the technical field of coating of power generation glass, and discloses an evaporation coating component, equipment and coating method for preventing coating bypass, wherein an evaporation coating component for preventing coating bypass is applied to the coating of substrate of power generation glass, the substrate has a coating front and a back, and comprises a substrate holding component and a carrier frame, wherein the substrate holding component has an adsorption portion suitable for adsorbing the back of the substrate, the carrier frame has a placement groove adapted to the substrate, the placement groove has a hollow structure penetrating the bottom of the placement groove to expose the front of the substrate coating; the substrate holding component is detachably connected to the carrier frame, and when the substrate holding component is connected to the carrier frame, the two are enclosed to form a blocking structure so that the basic back is not exposed, and the front of the substrate coating is exposed to the outside through the hollow structure for coating. The present invention can solve the problem of evaporation coating bypass.

Description

Technical Field

[0001] The invention belongs to the technical field of power generation glass coating, and in particular relates to an evaporation coating component, equipment and coating method for preventing bypass coating. Background Art

[0002] The current evaporation coating process in the large-size coating industry (such as thin-film batteries) has a coating pain point in that when a large area needs to be coated, support points are required, such as rollers for support, or support plates with support points for loading. However, there are a series of coating problems. For example, if there is a design of a supporting roller, poor coating will occur at the support point. The coating layer composition of the roller will be thin or abnormal. Although the structure of the substrate with only a loading plate can effectively avoid this, it is not easy to complete the coating of large-size substrates. It is easy to cause warping and fragmentation at high temperatures, which is also the main reason for limiting the defects of large-size chips.

[0003] The evaporation coating equipment or process currently used has the following problems:

[0004] 1. High cost of consumables: The heating quartz tubes, sealing rings, ceramic rollers, graphite pads, and top heating filament lamps of the current mainstream evaporation equipment are prone to breakage and damage during high-temperature continuous production. Once these problems occur, high consumable costs are required to replace the accessories.

[0005] 2. Uneven film formation: The current roller-type coating equipment has traces of roller marks in the middle and edges, which makes the entire film layer uneven and incomplete. In the subsequent process, the size needs to be adjusted according to the mark problem.

[0006] 3. Contamination on the back: Since evaporation is only performed from the bottom to the top, only the upper part of the carrier board's structural substrate is exposed to the coating. Under the pressure of the evaporating atmosphere, a small amount of atmosphere will be deposited on the back. This has a huge impact on substrates with easily deposited coatings on the back.

[0007] 4. Warping problem: Whether it is an evaporation coating mechanism with a loading plate or a coating mechanism supported by a roller, the substrate will be affected by thermal stress in the unsupported position, resulting in bending deformation, which will have an adverse effect on subsequent coating.

[0008] 5. Difficult to maintain: The traditional roller evaporation coating has small maintenance space, troublesome replacement of accessories, frequent disassembly, and difficult and time-consuming maintenance, especially chip breakage, roller breakage, ceramic roller damage, etc., which cause great difficulties for equipment maintenance. Summary of the invention

[0009] In view of this, the purpose of the present invention is to provide an evaporation coating component that prevents wrap-around coating, so as to solve the problem that the evaporation coating wraps around the back side and is easily warped and deformed; the purpose of the present invention is to provide an evaporation coating device that solves the problem of coating efficiency on the basis of the evaporation coating component; the purpose of the present invention is to provide an evaporation coating method that adopts the evaporation coating device to realize cyclic coating and improve the coating efficiency.

[0010] In order to achieve the above object, the present invention adopts the following technical solutions:

[0011] In a first aspect, an evaporation coating assembly for preventing winding coating is provided, which is applied to the coating of a substrate of power generation glass, wherein the substrate has a coating front and a back, and comprises a substrate holding component and a carrier frame, wherein the substrate holding component has an adsorption portion suitable for adsorbing the back of the substrate, and the carrier frame has a placement groove adapted to the substrate, and the placement groove has a hollow structure that passes through the bottom of the placement groove to expose the coating front of the substrate;

[0012] The substrate holding component is detachably connected to the carrier frame. When the substrate holding component is connected to the carrier frame, the two are enclosed to form a blocking structure so that the back side is not exposed, and the coated front side of the substrate is exposed to the outside through the hollow structure for coating.

[0013] In a possible implementation, the substrate holding component includes a shell with an open bottom, a receiving groove is formed in the shell, an adsorption channel plate adapted to the substrate is provided in the receiving groove, a plurality of evenly distributed adsorption holes are formed on one side of the adsorption channel plate corresponding to the substrate, and a channel connecting port is formed on the other side of the adsorption channel plate, and the channel connecting port is connected to a negative pressure pipeline penetrating into the shell.

[0014] In a possible implementation, a heating component is further provided in the receiving tank and is located on the back side of the adsorption channel plate and in contact with the receiving tank;

[0015] The carrier frame is provided with baffles distributed along the circumferential direction and used for supporting the substrate in the placement groove, and the baffles also constitute edge blocking structures for blocking the circumferential edge of the substrate from evaporation.

[0016] In a possible implementation, the housing has a bottom connection portion located at a peripheral side of the receiving groove, and the board carrier frame has a top connection portion located at a peripheral side of the placement groove, and the top connection portion is adapted to the bottom connection portion of the housing;

[0017] The bottom connection part is provided with a plurality of first snap-fit ​​connection parts along its circumference, two adjacent first snap-fit ​​connection parts are arranged at intervals and a snap-fit ​​groove is formed between the two, the top connection part is provided with a plurality of second snap-fit ​​connection parts which are staggered with the first snap-fit ​​connection parts in the relative direction, the second snap-fit ​​connection parts are adapted to the snap-fit ​​grooves, and a locking component is provided on the first snap-fit ​​connection part or the second snap-fit ​​connection part, so that when the shell is connected to the carrier frame, each second snap-fit ​​connection part is respectively embedded in a snap-fit ​​groove and the shell and the carrier frame are relatively fixed by the locking component.

[0018] In a second aspect, an evaporation coating device is also provided, including a lifting circulation chamber, wherein a first conveying device, a lifting circulation device located above the first conveying device, and an evaporation coating component for preventing winding coating according to any of the above technical solutions are respectively provided in the lifting circulation chamber;

[0019] Wherein, the lifting circulation device comprises a circulating lifting mechanism for conveying along a closed conveying path, the circulating lifting mechanism has a plurality of conveying shafts distributed along the closed conveying path, each conveying shaft is rotatably connected with a group of the substrate holding components; the lifting circulation chamber is also provided with a coating evaporation chamber, the circulating lifting mechanism has a coating station penetrating in the coating evaporation chamber, and the evaporation coating assembly passing through the coating station and located in the coating evaporation chamber is conveyed with at least one group;

[0020] The first conveying device is used to transport the substrate carrier frame and has at least a coating section located in the coating evaporation chamber, the coating section has two first conveying parts distributed along a material discharging direction, the two first conveying parts are spaced apart from each other and a coating area is formed between the two first conveying parts, and the two first conveying parts are respectively used to support one side of the bottom of the substrate carrier frame so that the coating front side of the substrate placed in the substrate carrier frame is exposed in the coating area;

[0021] The coating area is provided with at least one coating vapor generating device located below the plate carrier frame, and the coating evaporation chamber or the circulation lifting chamber is connected with a vacuum pumping device.

[0022] In a possible implementation, the coating evaporation chamber has an inlet and an outlet, and an openable and closable sealing component is respectively provided at the inlet and the outlet;

[0023] The first conveying device also has a connection preparation section located on the inlet side of the coating evaporation chamber and a desorption section located on the outlet side of the coating evaporation chamber. The circulating lifting mechanism also has a connection station corresponding to the connection preparation section and a desorption station corresponding to the desorption section. The circulating lifting mechanism corresponds to at least one group of evaporation coating components at the connection station and the desorption station respectively.

[0024] In a possible implementation, the circulating lifting mechanism includes two groups of crawler belts arranged along the closed conveying path, a plurality of mutually spaced conveying shafts are connected between the two groups of crawler belts, and a group of transmission components are respectively connected to the inner side of each group of crawler belts, and the two groups of transmission components are driven by the same drive component;

[0025] The first conveying device is a roller conveying structure.

[0026] In a possible implementation, the evaporation coating equipment further includes a feeding chamber connected to the feeding direction of the lifting circulation chamber and a discharging chamber connected to the discharging direction of the lifting circulation chamber, and the first conveying device further includes a feeding section and a discharging section extending to the feeding chamber and the discharging chamber;

[0027] The feeding chamber is provided with a first robot for placing the substrate into the carrier frame, and the first robot is provided with a first picking component; the discharging chamber is provided with a second robot for separating the substrate from the carrier frame, and the second robot is provided with a second picking component.

[0028] In a possible implementation, the evaporation coating equipment also includes a second conveying device, which has a substrate conveying part connected to the feeding section, a chip conveying part connected to the discharging section, and a circulating conveying part whose two ends are respectively connected to the feeding section and the discharging section and are jointly connected to form a circulatory conveying frame for circulating a substrate.

[0029] In a third aspect, an evaporation coating method is also provided, which is an evaporation coating device based on any one of the above technical solutions, comprising the following steps:

[0030] Placing the substrate on the substrate transmission part of the second transmission device, and transmitting the substrate into the feeding chamber of the evaporation coating equipment, wherein the substrate is located on the feeding section of the first transmission device in the feeding chamber;

[0031] The first robot places the substrate entering the feed chamber in a carrier frame entering the feed chamber through the circulation transmission part of the second conveying device, and then the carrier frame carrying the substrate passes through the first induction door and enters the lifting circulation chamber through the feeding section of the first conveying device;

[0032] When the carrier frame carrying the substrate enters the connection preparation section of the circulation chamber, the circulation lifting mechanism rotates and a group of substrate holding components on it are lowered to the connection station, and stops when the substrate holding components are in contact with the carrier frame. The substrate holding components and the carrier frame are buckled and relatively fixed by the locking components, and then the substrate is adsorbed by a negative pressure of the adsorption part, and heated at the same time;

[0033] The circulating lifting mechanism continues to rotate, so that the fastened and fixed evaporation coating assembly enters the coating evaporation chamber through the second induction door, and the exposed front surface of the substrate is coated with a film by the steam generated by the coating steam generating device in the coating evaporation chamber under a closed and vacuum environment;

[0034] After the substrate is coated, it is transferred to the desorption station through the third induction door by the circulating lifting mechanism, and the substrate is desorbed at the desorption station, and the substrate falls into the carrier frame, and the heating is stopped and the lock between the substrate holding component and the carrier frame is released;

[0035] After the connection is released, the substrate holding component is lifted upward and circulated by the circulating lifting mechanism, and the carrier frame carrying the substrate on which the chip has been coated passes through the fourth sensing door into the unloading chamber, and in the unloading chamber, the chip is placed on the chip transfer part by the second robot and transferred out, and the carrier frame is placed on the circulating transfer part by the second robot and transferred to the feeding chamber for the next coating process.

[0036] Compared with the prior art, the present invention has the following beneficial effects:

[0037] 1. Low consumption of consumables: Due to the special top of this structure, there is no need to add additional heating filaments on the top of the chamber; there is no need for ceramic support rollers at the bottom; and there are graphite accessories to prevent poor edge sealing, so there is less material loss.

[0038] 2. Uniform coating: Because the coating method is negative pressure adsorption heating on the top, there is no problem of supporting points on the bottom film layer, which gets rid of the limitation of film formation; also due to the uniform force adsorption of the coating, the problem of chip warping during the coating process is solved, so the uniformity of film formation is greatly improved, and the system software remotely controls the transmission speed, time, adsorption intensity, and heating temperature, making the coating process easier to control.

[0039] 3. No pollution on the back of the membrane surface: Since the mechanism is in an upper and lower quota mode, there is negative pressure suction on the top, a supporting baffle on the bottom, and an effective buckling matching device, it can effectively prevent evaporation and coating to the back.

[0040] 4. Easy maintenance: The upper and lower structural devices can be separated and disassembled. The maintenance cover can be opened through mechanical operation, and the supporting baffle can be replaced and the adsorption hole plate on the top can be cleaned, so maintenance is simple.

[0041] 5. This type of evaporation coating can effectively solve the coating difficulties of large-size substrates and provide better realization possibilities for large-scale evaporation coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 This is a schematic structural diagram of an evaporation coating component for preventing winding coating in a separated state according to an embodiment of the present application;

[0043] Figure 2 A perspective structural diagram of an evaporation coating assembly for preventing bypass coating according to an embodiment of the present application;

[0044] Figure 3 An exploded schematic diagram of a substrate holding component of an evaporation coating assembly for preventing winding coating according to an embodiment of the present application;

[0045] Figure 4 It is a partially enlarged schematic diagram of a carrier frame of an evaporation coating assembly for preventing winding coating according to an embodiment of the present application;

[0046] Figure 5 A three-dimensional schematic diagram of an evaporation coating device according to an embodiment of the present application;

[0047] Figure 6 A plan view of an evaporation coating device according to an embodiment of the present application;

[0048] Figure 7 A perspective view of an evaporation coating device in the embodiment of the present application in the front view direction;

[0049] Figure 8 for Figure 7 A partial enlarged schematic diagram of the lifting circulation chamber;

[0050] Fig. 9 This is a perspective structural diagram of an evaporation coating device according to an embodiment of the present application, with the circulating transmission part hidden.

[0051] In the figure: 1-evaporation coating assembly; 11-substrate holding component; 111-housing; 112-heating component; 113-adsorption channel plate; 114-integrated channel; 115-first buckle connection; 116-cylinder rod; 12-carrier frame; 121-square frame; 122-placement groove; 123-baffle; 124-second buckle connection; 125-locking hole; 2-evaporation coating equipment; 21-lifting circulation chamber; 211-coating evaporation chamber; 212-connection preparation section; 213-desorption section; 214-second induction door; 215-third induction door; 216-first induction door; 217-fourth induction door; 22-feeding chamber; 23-discharging chamber; 24-substrate transmission part; 25-chip transmission part; 26-circulation transmission part; 3-circulation lifting mechanism; 31-crawler belt; 32-transmission main shaft; 33-transmission gear; 34-second transmission belt; 35-first transmission belt; 4-evaporation crucible; 5-substrate; 6-chip; 7-first manipulator; 8-second manipulator; 9-first conveying device; 91-first transmission part; 10-vacuum pump group. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0053] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0054] Please refer to Figure 1-4 As shown, an embodiment of the present application provides an evaporation coating assembly 1 for preventing bypass coating, which is applied to coating a substrate 5 of power generation glass, wherein the substrate 5 has a coated front and a back.

[0055] Evaporation coating is generally performed by heating a target material to generate vapor molecules, and the vapor molecules are used to evaporate and coat the coating front side of the substrate 5 in the form of molecular deposition, while the back side of the substrate 5 does not need to be coated.

[0056] An evaporation coating component 1 for preventing winding coating in an embodiment of the present application includes a substrate holding component 11 and a carrier frame 12, wherein the substrate holding component 11 has an adsorption portion suitable for adsorbing the back side of a substrate 5, and the carrier frame 12 has a placement groove 122 adapted to the substrate 5, and the placement groove 122 has a hollow structure that passes through the bottom of the placement groove 122 to expose the coated front side of the substrate 5.

[0057] The substrate holding component 11 is used to adsorb the substrate 5 in a surface contact manner, specifically, it is adsorbed by an adsorption portion that matches the back of the substrate 5, so that the basic back side is not exposed to the outside, so that the evaporation coating can be avoided around the back side. The carrier frame 12 is used to carry the substrate 5, and it can facilitate the placement of the substrate 5 through the placement groove 122. Of course, the placement groove 122 can support or hold the substrate 5 in the groove after it is placed, that is, a corresponding support structure is arranged in the placement groove 122, such as a plurality of convex parts arranged along the circumference of the inner wall of the placement groove 122, or a circumferentially continuous retaining edge, or other structures with the same function, without limitation. The bottom of the placement groove 122 is hollowed out so that the coated front side of the substrate 5 is exposed to the outside and is convenient for coating. The carrier frame 12 is preferably a square frame 121 that matches the substrate 5, which can also be used as a carrier of the substrate 5 on the conveying device.

[0058] In some application scenarios, the coated area on the front side of the coating can be a large area coated except for the periphery, or the entire front side of the coating can be a coated area. Accordingly, the hollow structure can be adaptively hollowed out according to the coating area range so that only the corresponding area is easily exposed to the outside. When the hollow structure is not completely hollowed out at the bottom of the bottom placement groove 122, it can be formed to support the substrate 5 and can help block steam molecules from coating the peripheral area.

[0059] In an embodiment of the present application, the substrate holding component 11 is detachably connected to the carrier frame 12. When the substrate holding component 11 is connected to the carrier frame 12, the two are enclosed to form a blocking structure so that the back side is basically not exposed, and the coated front side of the substrate 5 is exposed to the outside through the hollow structure for coating.

[0060] The substrate holding component 11 and the carrier frame 12 are detachably connected, that is, the two have a separated state and a connected state. In the connected state, the carrier frame 12 can block the steam molecules from passing through the gap between the substrate 5 and the placement groove 122 because its placement groove 122 matches the substrate 5, so as to prevent the occurrence of bypass plating. Even if some steam molecules enter the upper part through the gap, the basic back side is adsorbed and not exposed, and the bypass plating will not occur. In the separated state, the carrier frame 12 can be used for the transmission of the substrate 5 in the transmission device.

[0061] Through the above technical solution, the substrate holding component 11 can adsorb the back side of the substrate 5 in a surface adsorption manner, and the back side is not exposed, thereby avoiding plating on the back side. Since it is a surface adsorption contact, there is no problem of no support points on the bottom film layer, and the film formation is free from limitations. Also, since the substrate 5 is adsorbed under uniform force during the coating process, the problem of chip 6 warping during the coating process is solved. Therefore, the uniformity of film formation is greatly improved. Moreover, through the carrier frame 12, it can facilitate the transmission of the substrate 5 in the transmission device and can also play a further blocking role.

[0062] In one embodiment, the substrate holding component 11 includes a shell 111 with an open bottom, a receiving groove is formed in the shell 111, and an adsorption channel plate 113 adapted to the substrate 5 is provided in the receiving groove. The adsorption channel plate 113 has a plurality of evenly distributed adsorption holes formed on one side corresponding to the substrate 5, and a channel connection port (not shown in the figure) is formed on the other side of the adsorption channel plate 113, and the channel connection port is connected to a negative pressure pipeline (not shown in the figure) penetrating into the shell 111.

[0063] The adsorption channel plate 113 provided in the housing 111 can form a negative pressure on the side close to the back of the substrate 5 through the hole channel inside it, and adsorb the back of the substrate 5 through the negative pressure effect, and the negative pressure effect is realized by the negative pressure pipeline. In the specific implementation process, the negative pressure pipeline may include components such as a vacuum pump and a pipeline. In order to facilitate the wiring of the pipes, an integrated channel 114 is provided on the housing 111. The channel connection port can be constructed on the adsorption channel plate 113 or can be provided on the heating plate, and can also be connected to the vacuum pump.

[0064] Furthermore, in order to achieve the adsorption process, the receiving tank is further provided with a heating component 112 located on the back side of the adsorption channel plate 113 and in contact with the adsorption channel plate 113. The heating component 112 is used to heat while being basically adsorbed, so that the substrate 5 can have a certain temperature by heating, so as to better facilitate the coating.

[0065] In a specific implementation process, the heating component 112 may include a heating plate and a heating wire, and the heating wire is installed on the bottom side of the stainless steel material, and the heating wire supplies heat to the heating plate. Of course, the heating component 112 may also adopt other heating structures or heating methods with equivalent functions, and there is no limitation. Correspondingly, the adsorption channel plate 113 is made of high temperature resistant material.

[0066] Specifically, the carrier frame 12 is formed with baffles 123 distributed along the circumferential direction and used to support the substrate 5 in the placement groove 122, and the baffles 123 also constitute an edge blocking structure for blocking the circumferential edge of the substrate 5 from evaporation. The baffles 123 are continuous structures in the circumferential direction, and the baffles 123 can support the substrate 5 and keep the substrate 5 in the placement groove 122, while the area inside the baffles 123 is a hollow structure. Through the baffles 123 with such a structure, the edge of the substrate 5 that does not need to be coated can be reduced, so that the coating effect is better.

[0067] In an embodiment of the present application, the shell 111 has a bottom connection portion located on the circumferential side of the accommodating groove, and the carrier frame 12 has a top connection portion located on the circumferential side of the placement groove 122, and the top connection portion is adapted to the bottom connection portion of the shell 111; the bottom connection portion is provided with a plurality of first snap-fit ​​connection portions 115 along its circumference, and two adjacent first snap-fit ​​connection portions 115 are arranged at intervals and a snap-fit ​​groove is formed therebetween, and the top connection portion is provided with a plurality of second snap-fit ​​connection portions 124 that are staggered with the first snap-fit ​​connection portions 115 in relative directions, and the second snap-fit ​​connection portions 124 are adapted to the snap-fit ​​grooves, and a locking component is provided on the first snap-fit ​​connection portion 115 or the second snap-fit ​​connection portion 124, so that when the shell 111 is connected to the carrier frame 12, each second snap-fit ​​connection portion 124 is respectively embedded in a snap-fit ​​groove and the shell 111 and the carrier frame 12 are relatively fixed by the locking component.

[0068] The bottom connection part of the shell 111 and the top connection part of the carrier frame 12 match each other, so that after the connection, a barrier structure that can effectively block steam molecules is formed on the surrounding side, and the two are also connected by a snap-fit ​​structure. When the first snap-fit ​​connection part 115 and the second snap-fit ​​connection part 124 are snapped with each other and connected by a locking part, the shell 111 and the carrier frame 12 can be relatively fixed, which can further improve stability and enable better blocking.

[0069] In a preferred embodiment of the first snap-fit ​​connection portion 115 and the second snap-fit ​​connection portion 124, the first snap-fit ​​connection portion 115 includes a mounting shell arranged on four sides of the bottom connection portion of the outer shell 111, and the mounting shell is provided with two first cylinders or a double-rod cylinder, and the cylinder rod 116 of the first cylinder or the double-rod cylinder can pass through the mounting shell; the second snap-fit ​​connection portion 124 includes an L-shaped connecting block arranged at the four corners of the top connection portion of the carrier frame 12, and the end surfaces of both ends of the connecting block are respectively provided with locking holes 125, and the locking holes 125 can be used for the cylinder rod 116 of the first cylinder or the double-rod cylinder to extend into for locking; the locking component is the first cylinder or the double-rod cylinder.

[0070] In this way, through the cooperation of the first snap-fit ​​connection part 115 and the second snap-fit ​​connection part 124, the substrate holding component 11 and the carrier frame 12 can be connected as a whole, which is convenient for connection and locking, and can also play a better blocking role, and also allows the substrate holding component 11 and the carrier frame 12 to move together.

[0071] In some application scenarios, the carrier frame 12 can be moved by injection robots, transmission devices and other structures, while the substrate holding component 11 can be lifted and lowered by some lifting mechanisms. Of course, different operating modes of coating can be performed by configuring related mechanisms or devices according to actual needs, without limitation.

[0072] Please refer to Figures 5-9, the embodiment of the present application also provides an evaporation coating device 2, including a lifting circulation chamber 21, in which a first conveying device 9, a lifting circulation device located above the first conveying device 9, and an evaporation coating assembly 1 for preventing winding coating as in any of the above technical solutions are respectively provided. The first conveying device 9 is used to convey the carrier frame 12, and the lifting circulation device is used to enable the evaporation coating assembly 1 to be lifted and circulated for continuous coating.

[0073] Among them, the lifting circulation device includes a circulating lifting mechanism 3 that transmits along a closed transmission path, the circulating lifting mechanism 3 has a plurality of transmission shafts distributed along the closed transmission path, and each transmission shaft is rotatably connected to a group of the substrate holding components 11; the lifting circulation chamber 21 is also provided with a coating evaporation chamber 211, the circulating lifting mechanism 3 has a coating station that passes through the coating evaporation chamber 211, and there is at least one group of the evaporation coating components 1 that pass through the coating station and are located in the coating evaporation chamber 211.

[0074] The circulating lift can make the multiple conveying shafts thereon rotate along the closed conveying path, and the substrate holding component 11 connected to the conveying shaft can be cyclically rotated and can maintain an unchanged posture under the action of gravity, always facing downward. The coating station of the circulating lift mechanism 3 is the position where coating, connection and / or desorption are required, and the substrate holding component 11 at this station can cooperate with the carrier frame 12 for coating.

[0075] The first conveying device 9 is used to transport the carrier frame 12 and has at least a coating section located in the coating evaporation chamber 211. The coating section has two first transmission parts 91 distributed along a discharge direction. The two first transmission parts 91 are spaced apart from each other and a coating area is formed between the two first transmission parts 91. The two first transmission parts 91 are respectively used to support one side of the bottom of the carrier frame 12 so that the coated front side of the substrate 5 placed in the carrier frame is exposed to the coating area.

[0076] The first conveying device 9 having two first transmission parts 91 can contact and support the bottom two sides of the carrier frame 12 respectively, so that the hollow structure can be exposed, so that the coating front side of the substrate 5 can be exposed in the coating area and can be coated. The coating area allows the steam generated by the target material heating to pass through and coat the exposed coating front side.

[0077] The coating area is provided with at least one coating vapor generating device located below the carrier frame 12 , and the coating evaporation chamber 211 or the circulation lifting chamber is connected with a vacuum pumping device.

[0078] By setting a coating vapor generating device in the coating area, the vapor generated by the target material can be deposited upward on the coating front surface, and a group of coating vapor generating devices corresponds to one substrate 5. The vacuum device is used to form a vacuum environment in the coating evaporation chamber 211 or the circulation lifting chamber, and perform coating in a vacuum environment. In the specific implementation process, the coating vapor generating device includes at least one group of evaporation crucibles 4, each group of evaporation crucibles 4 can heat the required target material respectively, and the vacuum device can be a vacuum pump group 10.

[0079] In one embodiment, the coating evaporation chamber 211 has an inlet and an outlet, and an openable and closable sealing component is respectively provided at the inlet and the outlet; the first conveying device 9 also has a connection preparation section 212 located on the inlet side of the coating evaporation chamber 211 and a desorption section 213 located on the outlet side of the coating evaporation chamber 211, and the circulation lifting mechanism 3 also has a connection station corresponding to the connection preparation section 212 and a desorption station corresponding to the desorption section 213, and the circulation lifting mechanism 3 corresponds to at least one group of evaporation coating components 1 at the connection station and the desorption station, respectively.

[0080] The evaporation coating is carried out in the coating evaporation chamber 211. The sealing components of the inlet and outlet of the coating evaporation chamber 211 are used for sealing to prevent the overflow of steam molecules, and the sealing components can be opened and closed to facilitate the entry and exit of the evaporation coating assembly 1. The connection station of the first conveying device 9 can be convenient for the first conveying device 9 to transfer the carrier frame 12 carrying the substrate 5 to the connection station. The circulating lifting mechanism 3 moves a group of substrate holding components 11 to a position where they can be connected to the carrier frame 12 and connect, so that they can enter the coating evaporation chamber 211 after connection and adsorption; and the desorption section 213 of the first conveying device 9 can facilitate the evaporation coating assembly 1 after coating to be desorbed and disconnected at this station, and the carrier plate can continue to be transferred out after separation, and the substrate holding component 11 can be rotated by the circulating lifting mechanism 3 for use, which is more convenient.

[0081] In the specific implementation process, the sealing component can be an induction door or other components that can be opened and closed, without limitation.

[0082] In a preferred embodiment of the circulating lifting mechanism 3, the circulating lifting mechanism 3 includes two groups of crawler belts 31 arranged along the closed conveying path, the two groups of crawler belts 31 are connected with a plurality of conveying shafts spaced apart from each other, and the inner side of each group of crawler belts 31 is respectively connected with a group of transmission components, and the two groups of transmission components are driven by the same drive component; the first conveying device 9 is a roller conveying structure.

[0083] There are two groups of crawler belts 31 and they are connected to the two ends of the conveying shaft respectively, so that the conveying shaft equipped with the substrate holding component 11 can be stably circulated and transmitted. The two groups of crawler belts 31 are driven by a driving component driving two groups of transmission components connected respectively, which can reduce the occupied space and also reduce the cost.

[0084] In the specific implementation process, the transmission assembly includes two first gears meshing with the inner side of the walking belt 31, the two first gears are connected to the first belt drive wheel through a connecting shaft, the two first belt drive wheels are synchronously driven with the second belt drive wheel through the first transmission belt 35, the second belt drive wheel is connected to the third belt drive wheel through a connecting shaft, the third belt drive wheel is connected to the fourth belt drive wheel at one end of the transmission main shaft 32 through the second transmission belt 34, and the other end of the transmission main shaft 32 is connected to another set of transmission components, a transmission gear 33 is provided on the transmission main shaft 32, and the transmission gear 33 is meshed with the driving gear connected to the output end of the driving motor, so that the synchronous transmission of the walking belt 31 can be realized.

[0085] In an embodiment of the present application, the evaporation coating equipment 2 also includes a feed chamber 22 connected to the lifting circulation chamber 21 in the feeding direction and a discharge chamber 23 connected to the lifting circulation chamber 21 in the discharge direction, and the first conveying device 9 also has a feed section and a discharge section extending into the feed chamber 22 and the discharge chamber 23; the feed chamber 22 is provided with a first robot 7 for placing the substrate 5 into the carrier frame 12, and the first robot 7 is provided with a first picking component; the discharge chamber 23 is provided with a second robot 8 for separating the substrate 5 from the carrier frame 12, and the second robot 8 is provided with a second picking component.

[0086] In this way, the substrate 5 can be loaded by the first manipulator 7 in the feeding chamber 22, and the substrate 5 on which the chip 6 is formed after coating can be separated from the carrier frame 12 by the second manipulator 8 in the discharging chamber 23, which is more convenient and practical, improves the working efficiency, and is more suitable for batch coating operations. In the specific implementation process, the first picking component and the second picking component can be adsorbed by suction cups.

[0087] In order to realize the cyclical and continuous conveying of the carrier frame 12 and the substrate 5, the evaporation coating equipment 2 also includes a second conveying device, which has a substrate conveying part 24 connected to the feeding section, a chip conveying part 25 connected to the discharging section, and a cyclic conveying part 26 whose two ends are respectively connected to the feeding section and the discharging section and are connected together to form a cyclic conveying part 26 that can cyclically convey the carrier frame 12.

[0088] Among them, the substrate transmission part 24 is used for inputting the substrate 5 so that it can continuously provide the substrate 5, the chip transmission part 25 is used for transmitting the chip 6 formed by coating the substrate 5 to the next process, and the circulation transmission part 26 is used for the circulation transmission of the carrier frame 12 to reuse the carrier frame 12.

[0089] In the specific implementation process, it also includes a control system, which may mainly include a PLC controller or industrial control equipment with the same function. The control system is connected to relevant electrical components respectively, and the operation of the equipment can be realized by setting a conventional control program. The system adopts existing technology and does not belong to the improvement points of this application, so it will not be repeated here.

[0090] Please refer to Figure 1-9 As shown, an embodiment of the present application further provides an evaporation coating method, based on an evaporation coating device 2 as in any of the above technical solutions, comprising the following steps:

[0091] Step S1: placing the substrate 5 on the substrate transfer part 24 of the second transfer device, and transferring the substrate 5 into the feed chamber 22 of the evaporation coating device 2, wherein the substrate 5 is located on the feed section of the first transfer device in the feed chamber 22;

[0092] Step S2: The first robot 7 places the substrate 5 entering the feed chamber 22 in the carrier frame 12 entering the feed chamber 22 through the circulation transmission part 26 of the second conveying device, and then the carrier frame 12 carrying the substrate 5 passes through the first induction door 216 and enters the lifting circulation chamber through the feeding section of the first conveying device 9;

[0093] Step S3: When the carrier frame 12 carrying the substrate 5 enters the connection preparation section 212 of the circulation chamber, the circulation lifting mechanism 3 rotates and causes a group of substrate holding components 11 thereon to descend to the connection station, and stops when the substrate holding components 11 are in contact with the carrier frame 12, and the substrate holding components 11 and the carrier frame 12 are engaged and relatively fixed by the locking component, and then the substrate 5 is adsorbed by a negative pressure of the adsorption part, and heated at the same time;

[0094] Step S4: the circulating lifting mechanism 3 continues to rotate, so that the fastened and fixed evaporation coating assembly 1 enters the coating evaporation chamber 211 through the second sensing door 214, and the exposed front surface of the substrate 5 is coated with the steam generated by the coating steam generating device in the closed and vacuum coating evaporation chamber 211;

[0095] Step S5: After the substrate 5 is coated, it is transferred to the desorption station through the circulation lifting mechanism 3 through the third induction door 215, and the substrate 5 is desorbed at the desorption station, and the substrate 5 falls into the carrier frame 12, and the heating is stopped and the lock between the substrate holding component 11 and the carrier frame 12 is released;

[0096] Step S6: After the connection is released, the substrate holding component 11 is lifted upward and circulated by the circulating lifting mechanism 3, and the carrier frame 12 carrying the substrate 5 on which the chip 6 has been formed after coating passes through the fourth sensing door 217 and enters the unloading chamber 23. In the unloading chamber 23, the chip 6 is placed on the chip transfer part 25 by the second robot 8 and transferred out. The carrier frame 12 is placed on the circulating transfer part 26 by the second robot 8 and transferred to the feeding chamber 22 for the next coating process.

[0097] This evaporation coating method not only solves the problem of winding coating, but also can realize batch coating. No manual operation is required throughout the process, only control is required. It is suitable for large-scale coating operations, and each substrate 5 can be coated with a small number of carrier frames 12, which greatly reduces costs and improves work efficiency.

[0098] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An evaporation coating assembly for preventing bypass coating, which is applied to the coating of a substrate of a power generation glass, wherein the substrate has a coating front and a coating back, and is characterized in that: It includes a substrate holding component and a substrate carrier frame, wherein the substrate holding component has an adsorption portion suitable for adsorbing the back of the substrate, and the substrate carrier frame has a placement groove adapted to the substrate, and the placement groove has a hollow structure that penetrates the bottom of the placement groove to expose the front side of the substrate coating; The substrate holding component is detachably connected to the substrate carrier frame. When the substrate holding component is connected to the substrate carrier frame, the two enclose a blocking structure so that the back side of the substrate is not exposed, and the coated front side of the substrate is exposed to the outside through the hollow structure for coating; The substrate holding component includes a shell with an open bottom, a receiving groove formed in the shell, an adsorption channel plate adapted to the substrate is arranged in the receiving groove, a plurality of evenly distributed adsorption holes are formed on one side of the adsorption channel plate corresponding to the substrate, and a channel connecting port is formed on the other side of the adsorption channel plate, and the channel connecting port is communicated with a negative pressure pipeline penetrating into the shell.

2. The evaporation coating component for preventing winding coating according to claim 1, characterized in that: The receiving tank is also provided with a heating component located on the back side of the adsorption channel plate and in contact with the adsorption channel plate; The carrier frame is provided with baffles distributed along the circumferential direction and used for supporting the substrate in the placement groove, and the baffles also constitute edge blocking structures for blocking the circumferential edge of the substrate from evaporation.

3. The evaporation coating component for preventing winding coating according to claim 2, characterized in that: The housing has a bottom connection portion located at the periphery of the receiving groove, and the board carrier frame has a top connection portion located at the periphery of the placing groove, and the top connection portion is adapted to the bottom connection portion of the housing; The bottom connection part is provided with a plurality of first snap-fit ​​connection parts along its circumference, two adjacent first snap-fit ​​connection parts are arranged at intervals and a snap-fit ​​groove is formed between the two, the top connection part is provided with a plurality of second snap-fit ​​connection parts which are staggered with the first snap-fit ​​connection parts in the relative direction, the second snap-fit ​​connection parts are adapted to the snap-fit ​​grooves, and a locking component is provided on the first snap-fit ​​connection part or the second snap-fit ​​connection part, so that when the shell is connected to the carrier frame, each second snap-fit ​​connection part is respectively embedded in a snap-fit ​​groove and the shell and the carrier frame are relatively fixed by the locking component.

4. An evaporation coating device, characterized in that: It comprises a lifting circulation chamber, wherein the lifting circulation chamber is respectively provided with a first conveying device, a lifting circulation device located above the first conveying device, and an evaporation coating component for preventing winding coating as described in any one of claims 1 to 3; The lifting circulation device comprises a circulating lifting mechanism for conveying along a closed conveying path, the circulating lifting mechanism has a plurality of conveying shafts distributed along the closed conveying path, each conveying shaft is rotatably connected to a group of the substrate holding components; the lifting circulation chamber is also provided with a coating evaporation chamber, the circulating lifting mechanism has a coating station passing through the coating evaporation chamber, and there is at least one group of the evaporation coating components passing through the coating station and located in the coating evaporation chamber; The first conveying device is used to transport the substrate carrier frame and has at least a coating section located in the coating evaporation chamber, the coating section has two first conveying parts distributed along a material discharging direction, the two first conveying parts are spaced apart from each other and a coating area is formed between the two first conveying parts, and the two first conveying parts are respectively used to support one side of the bottom of the substrate carrier frame so that the coating front side of the substrate placed in the substrate carrier frame is exposed in the coating area; The coating area is provided with at least one coating vapor generating device located below the plate carrier frame, and the coating evaporation chamber or the circulation lifting chamber is connected with a vacuum pumping device.

5. The evaporation coating device according to claim 4, characterized in that: The coating evaporation chamber has an inlet and an outlet, and an openable and closable sealing component is respectively provided at the inlet and the outlet; The first conveying device also has a connection preparation section located on the inlet side of the coating evaporation chamber and a desorption section located on the outlet side of the coating evaporation chamber. The circulating lifting mechanism also has a connection station corresponding to the connection preparation section and a desorption station corresponding to the desorption section. The circulating lifting mechanism corresponds to at least one group of evaporation coating components at the connection station and the desorption station respectively.

6. The evaporation coating device according to claim 5, characterized in that: The circulating lifting mechanism comprises two groups of crawler belts arranged along the closed conveying path, the two groups of crawler belts are connected with a plurality of conveying shafts spaced apart from each other, and the inner side of each group of crawler belts is respectively connected with a group of transmission components, and the two groups of transmission components are driven by the same driving component; The first conveying device is a roller conveying structure.

7. An evaporation coating device according to any one of claims 4 to 6, characterized in that: The evaporation coating equipment also includes a feeding chamber connected to the feeding direction of the lifting circulation chamber and a discharging chamber connected to the discharging direction of the lifting circulation chamber, and the first conveying device also has a feeding section and a discharging section extending to the feeding chamber and the discharging chamber; The feeding chamber is provided with a first robot for placing the substrate into the carrier frame, and the first robot is provided with a first picking component; the discharging chamber is provided with a second robot for separating the substrate from the carrier frame, and the second robot is provided with a second picking component.

8. The evaporation coating device according to claim 7, characterized in that: The evaporation coating equipment also includes a second conveying device, which has a substrate conveying part connected to the feeding section, a chip conveying part connected to the discharging section, and a circulating conveying part whose two ends are respectively connected to the feeding section and the discharging section and are jointly connected to form a circulatory conveying frame for circulatory transmission.

9. An evaporation coating method, based on an evaporation coating device as claimed in any one of claims 4 to 8, characterized in that: The following steps are involved: Placing the substrate on the substrate transmission part of the second transmission device, and transmitting the substrate into the feeding chamber of the evaporation coating equipment, wherein the substrate is located on the feeding section of the first transmission device in the feeding chamber; The first robot places the substrate entering the feed chamber in a carrier frame entering the feed chamber through the circulation transmission part of the second conveying device, and then the carrier frame carrying the substrate passes through the first induction door and enters the lifting circulation chamber through the feeding section of the first conveying device; When the carrier frame carrying the substrate enters the connection preparation section of the circulation chamber, the circulation lifting mechanism rotates and a group of substrate holding components on it are lowered to the connection station, and stops when the substrate holding components are in contact with the carrier frame. The substrate holding components and the carrier frame are buckled and relatively fixed by the locking components, and then the substrate is adsorbed by a negative pressure of the adsorption part, and heated at the same time; The circulating lifting mechanism continues to rotate, so that the fastened and fixed evaporation coating assembly enters the coating evaporation chamber through the second induction door, and the exposed front surface of the substrate is coated with a film by the steam generated by the coating steam generating device in the coating evaporation chamber under a closed and vacuum environment; After the substrate is coated, it is transferred to the desorption station through the third induction door by the circulating lifting mechanism, and the substrate is desorbed at the desorption station, and the substrate falls into the carrier frame, and the heating is stopped and the lock between the substrate holding component and the carrier frame is released; After the connection is released, the substrate holding component is lifted upward and circulated by the circulating lifting mechanism, and the carrier frame carrying the substrate on which the chip has been coated passes through the fourth sensing door into the unloading chamber, and in the unloading chamber, the chip is placed on the chip transfer part by the second robot and transferred out, and the carrier frame is placed on the circulating transfer part by the second robot and transferred to the feeding chamber for the next coating process.

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