Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
CN116825690BActive Publication Date: 2026-06-23KOKUSAI DENKI KK
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KOKUSAI DENKI KK
- Filing Date
- 2022-09-14
- Publication Date
- 2026-06-23
AI Technical Summary
Technical Problem
The low substrate handling efficiency in existing substrate processing equipment leads to insufficient production efficiency.
Method used
A substrate processing device equipped with a transport chamber, a transfer chamber, and a transfer room is adopted. Through the coordinated work of the transport unit, the transfer machine, and the transfer mechanism, the efficient transfer and transport of multiple support devices are realized, thereby improving the transport efficiency of the substrate.
Benefits of technology
It improves substrate handling efficiency, shortens substrate handling time, avoids handling bottleneck speed, and enhances production efficiency and management reliability.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116825690B_ABST
Abstract
The present application provides a substrate processing apparatus, a semiconductor device manufacturing method, and a recording medium, and provides a technology capable of improving the conveying efficiency of a substrate. A technology is provided, which includes: at least one processing chamber capable of processing a substrate; a support device capable of supporting the substrate; a conveying unit capable of conveying the support device; a transfer chamber capable of transferring the substrate; a conveying chamber adjacent to the transfer chamber and the processing chamber and capable of moving the conveying unit; and a handover chamber disposed in the conveying chamber and capable of handing over a plurality of the support devices.
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