Sorting device, conveying system and sorting identification method

By designing an automated sorting device, the automated detection and sorting of wafer carrier structures was achieved, solving the problems of type errors and damage caused by manual operation, and improving the accuracy and efficiency of sorting.

CN116833108BActive Publication Date: 2025-12-05CHANGXIN MEMORY TECH INC
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Patent Information

Application Number
CN202210303331.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-03-25
Publication Date
2025-12-05
Estimated Expiration
2042-03-25

AI Technical Summary

Technical Problem

In the existing technology, the classification operation of wafer carrier structures relies on manual operation, which can lead to errors in classification, waste manpower, and may damage the wafer carrier box.

Method used

Design a sorting device, including a detection structure, a pickup structure, and a drive structure. It achieves automated detection and sorting plug pickup, transfer, and insertion through electrical signal connection. The device uses the cooperation of the gripping part and the transfer part to grip and transfer the sorting plug, and combines a scanner and an information reader to perform information comparison and correction.

Benefits of technology

The automation level of the sorting device has been improved, the amount of manual operation has been reduced, the damage to the wafer support structure has been reduced, and the accuracy and efficiency of sorting have been ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a classification device, a conveying system and a classification identification method. The classification device is used for detecting and classifying wafer carrying structures. The classification device comprises a detection structure, which is used for detecting the type of the wafer carrying structure; a pickup structure, which is connected to the detection structure through an electrical signal, and which picks up a corresponding classification plug according to the type detected by the detection structure and transfers the classification plug; and a driving structure, which comprises a driving part and a carrying part. The carrying part is used for cooperating with the pickup structure to support the transferred classification plug. The driving part is drivingly connected to the carrying part, so that the classification plug on the carrying part is inserted into a corresponding classification hole of the wafer carrying structure through the driving part. Through the technical solution provided by the application, the technical problem of large manual operation amount in the classification operation of the wafer carrying structure in the prior art can be solved.
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Description

Technical Field

[0001] This application relates to the field of detection and classification technology for wafer carrier structures, and more specifically, to a classification device, a conveying system, and a classification and identification method. Background Technology

[0002] Currently, a large number of wafer carriers are needed in the semiconductor manufacturing process. Wafer carriers are the carriers that hold wafers during production. Generally speaking, different types of wafers require different types of wafer carriers. The two most commonly used types in existing technology are Cu or Non-Cu, which are distinguished by inserting sorting plugs into the corresponding sorting holes.

[0003] However, the assembly and disassembly of the sorting plugs in the existing technology are all done manually, which can easily lead to errors in sorting type, waste manpower, and may also cause damage to the wafer carrier. Summary of the Invention

[0004] The main objective of this application is to provide a classification device, a conveying system, and a classification and identification method to solve the technical problem of high manual workload in the classification operation of wafer carrier structures in the prior art.

[0005] To achieve the above objectives, according to one aspect of this application, a sorting apparatus is provided for detecting and sorting wafer carrier structures. The sorting apparatus includes: a detection structure for detecting the type of the wafer carrier structure; a pickup structure connected to the detection structure via an electrical signal, the pickup structure picking up and transferring the corresponding sorting plug according to the type detected by the detection structure; and a driving structure including a driving part and a supporting part, the supporting part cooperating with the pickup structure to support the transferred sorting plug, the driving part being drivenly connected to the supporting part to insert the sorting plug on the supporting part into the corresponding sorting hole on the wafer carrier structure.

[0006] Furthermore, the picking structure includes: a gripping part adapted to a sorting plug to grip the sorting plug; and a transfer part connected to the gripping part to transfer the gripping part.

[0007] Furthermore, the gripping part includes: a first gripper and a second gripper, the first gripper and the second gripper being spaced apart, and at least one of the first gripper and the second gripper being positionally adjustable so as to grip or release the sorting plug by changing the distance between the first gripper and the second gripper.

[0008] Furthermore, the end of the first gripper away from the second gripper forms the first gripping end, and the end of the second gripper away from the first gripper forms the second gripping end. Both the first gripper and the second gripper move in directions that are closer to or further away from each other.

[0009] Furthermore, the gripping part also includes: a linkage assembly disposed between the first gripper and the second gripper, the linkage assembly having a first hinge drive end and a second hinge drive end, the first hinge drive end being connected to the first gripper and the second hinge drive end being connected to the second gripper.

[0010] Furthermore, the linkage assembly includes a drive link, a first link, and a second link. The drive link is oscillatingly configured and has a first swing end and a second swing end disposed opposite to each other. The first link is hinged to the first swing end, and the end of the first link away from the drive link forms a first hinged drive end. The second link is hinged to the second swing end, and the end of the second link away from the drive link forms a second hinged drive end.

[0011] Furthermore, the picking structure also includes a pushing part, which is movably disposed between the first gripper and the second gripper in a vertical direction. When the first gripper and the second gripper release the sorting plug, the pushing part pushes the sorting plug out.

[0012] Furthermore, the sorting device includes an operating table with a pick-and-place through hole and a sorting plug at the pick-and-place through hole. A gripping part is movably disposed above the operating table to grip the sorting plug at the pick-and-place through hole.

[0013] Furthermore, a first pushing through hole is provided on the operating table. The first pushing through hole is spaced apart from the pick-up and put-out through hole, and the supporting part is vertically and vertically positioned at the first pushing through hole.

[0014] Furthermore, the operating table is provided with a guide groove extending along a first preset direction, and at least part of the transfer part is located in the guide groove and is movably disposed along the first preset direction.

[0015] Furthermore, the sorting device also includes: a support platform, installed above the operating table, the support platform being used to support the wafer carrier structure; a second pushing through hole is provided on the support platform, the second pushing through hole being opposite to the first pushing through hole, and the second pushing through hole being opposite to the sorting hole of the wafer carrier structure, so that the carrier part pushes the sorting plug through the first pushing through hole and the second pushing through hole and then enters the sorting hole.

[0016] Furthermore, the sorting device also includes a scanner, which is mounted on an operating table. A first clearance hole is provided on the support table, and the part to be scanned on the wafer carrier structure is positioned opposite to the first clearance hole. The first clearance hole is positioned opposite to the scanner.

[0017] Furthermore, the detection structure includes an information reader, which is mounted on an operating table. A second clearance hole is provided on the support table. The label on the wafer carrier structure is positioned opposite to the second clearance hole. The second clearance hole is positioned opposite to the information reader. The information reader is connected to the scanner via an electrical signal.

[0018] Furthermore, the classification device also includes a control structure. The information reader and the scanner are both connected to the control structure via electrical signals. The control structure modifies the information stored in the tag based on the comparison result between the code number read by the information reader and the code number obtained by the scanner.

[0019] Furthermore, the driving unit includes: a driving rod, which is vertically and vertically configurable; a sliding block, which is driven by the driving rod to move, the sliding block having a driving ramp that abuts against the bearing portion to drive the bearing portion to move; and a guide rod, which is inclined and the sliding block passes through the guide rod to guide the sliding block to slide towards the bearing portion when the driving rod drives the sliding block to move.

[0020] Furthermore, the rod of the drive rod extends vertically, and the sliding block is located above the drive rod; the drive structure also includes: a push plate, disposed between the drive rod and the sliding block, the sliding block being slidably disposed on the push plate, the push plate being provided with a limiting boss, the limiting boss abutting against the sliding block to limit the sliding distance of the sliding block; and / or, a limiting plate, disposed above the sliding block, the limiting plate abutting against the sliding block to limit the rising height of the sliding block.

[0021] Furthermore, the bearing part includes a bearing rod and a bearing plate connected to each other, and a first limiting flange is provided on the bearing rod; the driving part also includes: a bushing, which is sleeved on at least a portion of the bearing rod, and a second limiting flange is provided on the bushing, the second limiting flange being spaced apart from the first limiting flange; a reset member, which is sleeved on the bearing rod, with a first end abutting against the first limiting flange and a second end abutting against the second limiting flange.

[0022] Furthermore, the drive structure also includes: a displacement detection element disposed on the drive rod, the displacement detection element being used to detect the displacement of the drive rod; and / or a position detection element disposed on the push plate, the position detection element being used to detect whether the sorting plug on the bearing part enters the sorting hole.

[0023] Furthermore, the sorting device also includes: a storage section having a storage cavity containing sorting plugs, and a discharge port communicating with the storage cavity to discharge the sorting plugs through the discharge port; the storage section includes an ejector section, the ejector end of which is vertically and flexibly disposed within the storage cavity to eject the sorting plugs through the ejector section.

[0024] According to another aspect of this application, a transfer system is provided, comprising: the sorting device provided above; and a transfer device for transferring and transferring a wafer carrier structure to the sorting device.

[0025] According to another aspect of this application, a classification and identification method is provided. The classification and identification method uses the classification device provided above. The classification and identification method is used to classify and identify wafer carrier structures. The classification and identification method includes: detecting the type of wafer carrier structure using the detection structure of the classification device; picking up a classification plug that matches the detected type of wafer carrier structure using the picking structure of the classification device, and transferring the classification plug to the carrier part of the driving structure of the classification device; and driving the carrier part to move using the driving part of the driving structure to insert the classification plug on the carrier part into the corresponding classification hole of the wafer carrier structure.

[0026] Furthermore, the classification and identification method employs the classification device provided above, and the classification and identification method further includes: using the scanner of the classification device to scan the part to be scanned on the wafer carrier structure to obtain the first product information of the wafer carrier structure; using the information reader of the classification device to read the label on the wafer carrier structure to obtain the second product information of the wafer carrier structure; comparing the obtained second product information with the obtained first product information; when the second product information is consistent with the first product information, determining that the second product information corresponding to the label is correct; when the second product information is inconsistent with the first product information, modifying the second product information corresponding to the label according to the first product information.

[0027] By applying the technical solution of this application, through the cooperation of the detection structure, the picking structure and the driving structure, it is easy to insert the sorting plug that is compatible with the type of wafer carrier structure into the corresponding sorting hole, thereby improving the automation level of the sorting device, reducing manual operation, and also reducing damage to the wafer carrier structure. Attached Figure Description

[0028] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0029] Figure 1 A top view of the pickup structure and operating table provided according to an embodiment of this application is shown;

[0030] Figure 2 A schematic diagram of the structure of a support platform provided according to an embodiment of this application is shown;

[0031] Figure 3 A schematic diagram of a support platform provided according to an embodiment of this application, mounted on an operating table, is shown.

[0032] Figure 4 A schematic diagram of a wafer carrier structure provided according to an embodiment of this application is shown;

[0033] Figure 5 A schematic diagram of a wafer carrier structure provided according to an embodiment of this application, mounted on a support platform, is shown.

[0034] Figure 6 A schematic diagram of the picking structure provided according to an embodiment of this application is shown;

[0035] Figure 7 A schematic diagram of the structure of the gripping part according to an embodiment of the present application when gripping the sorting plug is shown;

[0036] Figure 8 A schematic diagram of the structure of the gripper releasing the sorting plug according to an embodiment of this application is shown;

[0037] Figure 9 A schematic diagram of the structure provided in the embodiment of this application is shown when the driving structure drives the classification plug to its initial position;

[0038] Figure 10 A schematic diagram of a drive structure according to an embodiment of this application is shown, showing the drive structure driving the sorting plug to move into the sorting hole of the wafer support structure;

[0039] Figure 11 A schematic diagram of the structure provided in the embodiments of this application is shown when the driving structure drives the sorting plug to move into the sorting hole of the wafer support structure and then returns to the initial position;

[0040] Figure 12 A schematic diagram of the storage section provided according to an embodiment of this application is shown (where the arrows indicate the discharge direction of the sorting plug);

[0041] Figure 13 A schematic diagram of the structure in which the sorting plug is ejected by the ejector portion of the storage section according to an embodiment of this application is shown;

[0042] Figure 14 A schematic diagram of the structure of a transmission system provided according to an embodiment of this application is shown;

[0043] Figure 15 A flowchart of a classification and identification method provided according to an embodiment of this application is shown.

[0044] The above figures include the following reference numerals:

[0045] 10. Wafer support structure; 11. Sorting hole; 20. Detection structure; 30. Pick-up structure; 31. Gripping part; 311. First gripper; 312. Second gripper; 313. Linkage assembly; 3131. Drive link; 3132. First link; 3133. Second link; 32. Transfer part; 33. Pushing part; 34. Worm gear structure; 35. Electric push rod; 40. Sorting plug; 50. Drive structure; 51. Drive part; 511. Drive rod; 512. Sliding block; 5121. Drive inclined surface; 513. Guide rod; 514. Bushing ; 515, Reset component; 516, Drive motor; 52, Bearing part; 521, Bearing rod; 522, Bearing plate; 53, Push plate; 54, Limiting plate; 55, Displacement detection component; 56, Position detection component; 60, Operating table; 61, Pick-up and drop-off through hole; 62, First push through hole; 63, Guide groove; 70, Support platform; 71, Second push through hole; 72, Positioning part; 721, Positioning protrusion; 73, First clearance hole; 74, Second clearance hole; 80, Scanner; 90, Storage part; 91, Storage cavity; 92, Ejection part; 100, Conveying device. Detailed Implementation

[0046] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0047] like Figures 1 to 13 As shown, Embodiment 1 of this application provides a sorting device for detecting and sorting wafer carrier structures 10. The sorting device includes a detection structure 20, a pickup structure 30, and a driving structure 50. The detection structure 20 detects the type of the wafer carrier structure 10. The pickup structure 30 is electrically connected to the detection structure 20, and picks up the corresponding sorting plug 40 according to the type detected by the detection structure 20 and transfers it. The driving structure 50 includes a driving part 51 and a supporting part 52. The supporting part 52 cooperates with the pickup structure 30 to support the transferred sorting plug 40. The driving part 51 is driven to the supporting part 52 to insert the sorting plug 40 on the supporting part 52 into the corresponding sorting hole 11 on the wafer carrier structure 10.

[0048] By using the sorting device provided in this embodiment, through the cooperation of the detection structure 20, the picking structure 30 and the driving structure 50, it is easy to insert the sorting plug 40 that is compatible with the type of wafer carrier structure 10 into the corresponding sorting hole 11, thereby improving the automation level of the sorting device, reducing manual operation, and also reducing damage to the wafer carrier structure 10.

[0049] Specifically, the pickup structure 30 in this embodiment includes a gripping part 31 and a transfer part 32. The gripping part 31 is adapted to the sorting plug 40 to grip the sorting plug 40. The transfer part 32 is connected to the gripping part 31 to transfer the gripping part 31. With this structure, the gripping part 31 can improve the gripping stability of the sorting plug 40, and the transfer part 32 can facilitate the transfer of the gripping part 31, thereby realizing the transfer of the sorting plug 40 and improving the transfer stability of the sorting plug 40. Through the cooperation of the gripping part 31 and the transfer part 32, the sorting plug 40 can be easily transferred to the position corresponding to the sorting hole 11, thereby facilitating the insertion of the sorting plug 40 into the corresponding sorting hole 11 and achieving accurate sorting.

[0050] In this embodiment, the gripping part 31 includes a first gripping member 311, a second gripping member 312, and a connecting rod assembly 313. The first gripping member 311 and the second gripping member 312 are spaced apart, and at least one of the first gripping member 311 and the second gripping member 312 is adjustable in position so that the sorting plug 40 can be gripped or released by changing the distance between the first gripping member 311 and the second gripping member 312. The gripping part 31 has a simple structure and can easily achieve gripping or releasing by using only the first gripping member 311 and the second gripping member 312, making operation convenient. The end of the first gripping member 311 away from the second gripping member 312 forms a first gripping end, and the end of the second gripping member 312 away from the first gripping member 311 forms a second gripping end. Both the first gripping member 311 and the second gripping member 312 move in a direction that moves closer to or further away from each other. A linkage assembly 313 is disposed between a first gripper 311 and a second gripper 312. The linkage assembly 313 has a first hinged drive end and a second hinged drive end. The first hinged drive end is connected to the first gripper 311, and the second hinged drive end is connected to the second gripper 312. The linkage assembly 313 includes a drive link 3131, a first link 3132, and a second link 3133. The drive link 3131 is pivotally disposed and has a first swing end and a second swing end disposed opposite to each other. The first link 3132 is hinged to the first swing end, and the end of the first link 3132 away from the drive link 3131 forms the first hinged drive end. The second link 3133 is hinged to the second swing end, and the end of the second link 3133 away from the drive link 3131 forms the second hinged drive end. This structural design facilitates optimization of the gripping section 31 and allows for adjustment of the distance between the first gripping member 311 and the second gripping member 312 by controlling the first connecting rod 3132 and the second connecting rod 3133. Specifically, the sorting plug 40 in this embodiment includes a main board body, a first insertion protrusion, and a second insertion protrusion. The first insertion protrusion and the second insertion protrusion are spaced apart on the main board body, and both protrude from the main board body. The first gripping member 311 abuts against the first insertion protrusion, and the second gripping member 312 abuts against the second insertion protrusion.

[0051] Specifically, the picking structure 30 in this embodiment further includes a pushing part 33, which is movably disposed vertically between the first gripper 311 and the second gripper 312. When the first gripper 311 and the second gripper 312 release the sorting plug 40, the pushing part 33 pushes the sorting plug 40 out. With this structural arrangement, it is convenient to push the sorting plug 40 out by the pushing part 33 when the sorting plug 40 is released, so as to facilitate the smooth transfer of the sorting plug 40.

[0052] In this embodiment, the pickup structure 30 further includes a worm gear structure 34 and an electric push rod 35. The worm gear structure 34 drives the connecting rod assembly 313 to move, so that the worm gear structure 34 rotates through the driving connecting rod 3131, and through the driving connecting rod 3131, drives the first connecting rod 3132 and the second connecting rod 3133 to move the first gripper 311 and the second gripper 312 closer to each other or further away from each other, thereby realizing the gripping or releasing of the sorting plug 40 by the first gripper 311 and the second gripper 312. When the first gripper 311 and the second gripper 312 release the sorting plug 40, the electric push rod 35 pushes the pushing part 33 to move, so that the sorting plug 40 is pushed out from the gap between the first gripper 311 and the second gripper 312, thereby facilitating the sorting plug 40 to enter the corresponding sorting hole 11 on the wafer carrier structure 10.

[0053] In this embodiment, the transfer part 32 is movably disposed along a first preset direction, and the gripping part 31 is movably disposed on the transfer part 32 along a second preset direction. The first preset direction and the second preset direction are set at a preset angle. With this structural arrangement, the gripping part 31 and the transfer part 32 cooperate to facilitate the transfer of the sorting plug 40 to the desired location, improving the convenience of the transfer. Specifically, in this embodiment, the angle between the first preset direction and the second preset direction is 90°. The gripping part 31 and the transfer part 32 enable free movement in the X and Y directions.

[0054] Specifically, the sorting device in this embodiment includes an operating table 60, on which a pick-and-place through hole 61 is provided, and a sorting plug 40 is provided at the pick-and-place through hole 61. A clamping part 31 is movably disposed above the operating table 60 to clamp the sorting plug 40 at the pick-and-place through hole 61. This structural arrangement facilitates optimized structural layout, improves structural compactness, and smoothly enables the clamping and transfer of the sorting plug 40.

[0055] In this embodiment, there are at least two pick-and-place through holes 61, which are spaced apart on the operating table 60, and the diameters of the at least two pick-and-place through holes 61 are different. This structural arrangement facilitates the removal of the corresponding sorting plug 40 from the corresponding pick-and-place through hole 61 according to the type of wafer carrier structure 10, improving the convenience and accuracy of the operation.

[0056] Specifically, in this embodiment, the operating table 60 is also provided with a first pushing through hole 62, which is spaced apart from the pick-up and put-down through hole 61. The supporting part 52 is vertically and vertically disposed at the first pushing through hole 62. This structural arrangement facilitates better optimization of the structural layout and also makes it easier to push the sorting plug 40 to the first pushing through hole 62 via the supporting part 52, and then push it into the corresponding sorting hole 11 through the first pushing through hole 62.

[0057] In this embodiment, the operating table 60 is provided with a guide groove 63 extending along a first preset direction, and at least a portion of the transfer part 32 is located within the guide groove 63 and is movably disposed along the first preset direction. By providing the guide groove 63 extending along the first preset direction, the transfer part 32 can be easily moved along the first preset direction under the guidance of the guide groove 63.

[0058] like Figure 2 and Figure 3 As shown, the sorting device in this embodiment also includes a support platform 70, which is installed above the operating table 60 and is used to support the wafer carrier structure 10. The support platform 70 is provided with a second pushing through hole 71, which is opposite to the first pushing through hole 62 and the sorting hole 11 of the wafer carrier structure 10. This allows the carrier part 52 to push the sorting plug 40 through the first pushing through hole 62 and the second pushing through hole 71 into the sorting hole 11, thereby facilitating the smooth insertion of the sorting plug 40 into the corresponding sorting hole 11. Specifically, in Figure 2 and Figure 3 The support platform 70 can be configured as a transparent plate structure, so that the operating table 60 and the structure on the operating table 60 can be seen when viewed from above. Specifically, in this embodiment, the support platform 70 can be made of transparent material, through which the operating table 60 and the structure located between the operating table 60 and the support platform 70 can be clearly observed.

[0059] In this embodiment, a positioning part 72 is provided on the support platform 70, which cooperates with at least a portion of the wafer carrier structure 10 for positioning. This structural arrangement improves the positioning stability of the wafer carrier structure 10, preventing it from wobbling on the support platform 70. This facilitates the stable insertion of the sorting plug 40 into the sorting hole 11 of the wafer carrier structure 10, preventing misalignment during insertion and improving the accuracy of the sorting operation.

[0060] Specifically, in this embodiment, the positioning part 72 includes multiple positioning protrusions 721, which are spaced apart on the support platform 70. The bottom of the wafer carrier structure 10 has multiple positioning grooves, which are spaced apart. Each positioning protrusion 721 corresponds to one of the positioning grooves, and each positioning protrusion 721 is inserted into its corresponding positioning groove. This structural arrangement simplifies the structure of the multiple positioning protrusions 721. The cooperation between the multiple distributed positioning protrusions 721 and their corresponding positioning grooves improves positioning stability and prevents the wafer carrier structure 10 from shaking during the support process and the insertion of the sorting plug 40 into the sorting hole 11. This ensures that the sorting plug 40 can smoothly enter the corresponding sorting hole 11, further improving the accuracy of the sorting operation.

[0061] Specifically, in this embodiment, there are three positioning protrusions 721, which are located at the three vertices of a triangle. There are also three positioning grooves, which are arranged in a one-to-one correspondence with the three positioning protrusions 721. This structural arrangement facilitates better positioning stability of the wafer carrier structure 10.

[0062] In this embodiment, the sorting device further includes a scanner 80, which is mounted on an operating table 60. A first clearance hole 73 is provided on a support table 70. The part to be scanned on the wafer carrier structure 10 is disposed opposite to the first clearance hole 73, and the first clearance hole 73 is disposed opposite to the scanner 80. With this structural arrangement, the scanner 80 can obtain the first product information corresponding to the part to be scanned.

[0063] Specifically, the detection structure 20 in this embodiment includes an information reader, which is mounted on the operating table 60. A second clearance hole 74 is provided on the support table 70. The label on the wafer carrier structure 10 is positioned opposite to the second clearance hole 74, and the second clearance hole 74 is positioned opposite to the information reader. This structural arrangement facilitates the smooth reading of the second product information on the label through the information reader.

[0064] In this embodiment, the information reader and the scanner 80 are connected via electrical signals. The sorting device also includes a control structure, with both the information reader and the scanner 80 connected to the control structure via electrical signals. The control structure modifies the information stored on the tag based on the comparison result between the encoding number read by the information reader and the encoding number scanned by the scanner 80. This structure avoids errors caused by inconsistencies between the corresponding second product information and the first product information on the tag, facilitating the verification and correction of the second product information corresponding to the tag.

[0065] Specifically, the driving unit 51 in this embodiment includes a driving rod 511, a sliding block 512, and a guide rod 513. The driving rod 511 is vertically movable; the driving rod 511 pushes the sliding block 512 to move. The sliding block 512 has a driving inclined surface 5121, which abuts against the supporting unit 52 to push the supporting unit 52 to move. The guide rod 513 is inclined, and the sliding block 512 passes through the guide rod 513 to guide the sliding block 512 to slide closer to the supporting unit 52 when the driving rod 511 pushes the sliding block 512 to move. With this structural arrangement, the structure is compact and the drive is stable, so that the supporting unit 52 can be smoothly driven to move under the driving action of the driving inclined surface 5121. Specifically, in this embodiment, the drive rod 511 is a worm gear structure, and the drive part 51 also includes a worm wheel connected to the drive motor 516. The drive motor 516 drives the worm wheel to rotate, so as to push the sliding block 512 to move upward and generate a rightward displacement, thereby pushing the bearing part 52 to generate an upward displacement, thereby inserting the sorting plug 40 into the sorting hole 11.

[0066] In this embodiment, the rod of the drive rod 511 extends vertically, and the sliding block 512 is located above the drive rod 511. The drive structure 50 also includes a push plate 53 and / or a limiting plate 54. The push plate 53 is disposed between the drive rod 511 and the sliding block 512, and the sliding block 512 is slidably disposed on the push plate 53. The push plate 53 is provided with a limiting boss, which abuts against the sliding block 512 to limit the sliding distance of the sliding block 512, thereby limiting the lifting height of the sliding block 512. The limiting plate 54 is disposed above the sliding block 512, and the limiting plate 54 abuts against the sliding block 512 to limit the lifting height of the sliding block 512. With this structural arrangement, the lifting height of the sliding block can be limited by the structure of the limiting boss and the limiting plate 54, thereby limiting the lifting height of the bearing part 52.

[0067] In this embodiment, the drive unit 51 also includes a drive motor 516, which drives the drive rod 511 to move.

[0068] Specifically, in this embodiment, the supporting part 52 includes a supporting rod 521 and a supporting plate 522 connected to each other. A first limiting flange is provided on the supporting rod 521. The driving part 51 also includes a bushing 514 and a reset member 515. The bushing 514 is sleeved on at least a portion of the supporting rod 521, and a second limiting flange is provided on the bushing 514, spaced apart from the first limiting flange. The reset member 515 is sleeved on the supporting rod 521, with its first end abutting against the first limiting flange and its second end abutting against the second limiting flange. With this structural arrangement, the first limiting flange, the second limiting flange, and the reset member 515 facilitate the reset of the supporting part 52. Specifically, when the driving rod 511 descends vertically, the pushing plate 53 and the sliding block 512 both descend, and subsequently, under the action of the reset member 515, both the supporting rod 521 and the supporting plate 522 descend. Specifically, in this embodiment, the reset element 515 can be a spring. After the sorting plug 40 is inserted into the sorting hole 11, the drive motor 516 drives the turbine to rotate in the opposite direction, and under the action of the spring, the support rod 521 and the support plate 522 will be reset to their initial state.

[0069] In this embodiment, the drive structure 50 further includes a displacement detection element 55 and / or a position detection element 56. The displacement detection element 55 is disposed on the drive rod 511 and is used to detect the displacement of the drive rod 511 to determine whether the displacement of the sorting plug 40 meets the lifting requirements. The position detection element 56 is disposed on the push plate 53 and is used to detect whether the sorting plug 40 on the bearing portion 52 has entered the sorting hole 11 to confirm the accuracy of sorting. In this embodiment, the displacement detection element 55 can be a laser sensor, and the position detection element 56 can be a laser displacement sensor, which detects whether the sorting plug 40 is correctly placed.

[0070] Specifically, the sorting device in this embodiment further includes a storage unit 90, which has a storage cavity 91. The storage cavity 91 stores sorting plugs 40, and the storage unit 90 is provided with a discharge port communicating with the storage cavity 91 so that the sorting plugs 40 can be discharged through the discharge port. This structural arrangement facilitates the storage of multiple sorting plugs 40, facilitates the operation of the sorting plugs 40, reduces the need for adding sorting plugs 40, and improves operational efficiency. Specifically, in this embodiment, there are multiple storage units 90, which are spaced apart. At least two storage units 90 store sorting plugs 40 of different sizes to enable the storage and retrieval of sorting plugs 40 of different sizes.

[0071] In this embodiment, the storage unit 90 further includes an ejection unit 92, the ejection end of which is movably disposed within the storage cavity 91 to eject the sorting plug 40. This structural arrangement facilitates the smooth ejection of the sorting plug 40 from the storage cavity 91, allowing the gripping unit 31 to grip the ejected sorting plug 40 and the transfer unit 32 to transfer the gripped sorting plug 40.

[0072] Specifically, in this embodiment, the tag is a glass tube electronic tag, and the corresponding second product information on the glass tube electronic tag can be deleted or changed.

[0073] The sorting device in this embodiment has a compact structure. It integrates a detection structure 20, a pickup structure 30, a drive structure 50, an operating table 60, a support table 70, a scanner 80, and other structures into one unit. It can realize functions such as picking up and placing, transferring, and inserting the sorting plug 40 into the sorting hole 11, thereby improving the automation level of the sorting operation.

[0074] like Figure 14 As shown, Embodiment 2 of this application provides a conveying system, which includes a sorting device and a conveying device 100. The sorting device is the same as that provided in Embodiment 1, and the conveying device 100 is used to convey and transfer the wafer carrier structure 10 to the sorting device. With this structural arrangement, the wafer carrier structure 10 can be easily transferred and sorted via the sorting device. Specifically, the conveying device 100 in this embodiment can be an overhead crane. The sorting device works in conjunction with the overhead crane to achieve automatic loading and unloading of the wafer carrier structure 10. The overhead crane and the track work together to convey the wafer carrier structure 10 to the storage section where the wafer carrier structure 10 is stored.

[0075] like Figure 15As shown, Embodiment 3 of this application provides a classification and identification method. This method employs the classification device described above and is used to classify and identify the wafer carrier structure 10. The method includes: detecting the type of the wafer carrier structure 10 using the detection structure 20 of the classification device; picking up a classification plug 40 that matches the detected type of the wafer carrier structure 10 using the pickup structure 30 of the classification device, and transferring / placing the classification plug 40 onto the carrier portion 52 of the drive structure 50 of the classification device; and driving the carrier portion 52 using the drive portion 51 of the drive structure 50 to insert the classification plug 40 on the carrier portion 52 into the corresponding classification hole 11 of the wafer carrier structure 10. This method facilitates rapid identification of the type of the wafer carrier structure 10 and allows the classification plug 40 corresponding to the identified type of the wafer carrier structure 10 to be inserted into the corresponding classification hole 11 on the wafer carrier structure 10, thus completing the classification operation. The above classification and recognition process is completed automatically without human intervention, which improves the automation level of classification and recognition, reduces the workload of manual operation, reduces errors caused by manual operation, and improves the accuracy of classification and recognition.

[0076] Specifically, during classification and identification, the wafer carrier structure 10 is first placed on the support stage 70 and the type of the wafer carrier structure 10 is confirmed. The ejection part 92 of the storage part 90 ejects the corresponding classification plug 40. The picking structure 30 picks up the classification plug 40 and transfers the classification plug 40 to the position corresponding to the classification hole 11 of the wafer carrier structure 10. The driving structure 50 drives the classification plug 40 into the classification hole 11, and the laser displacement sensor detects whether the insertion position of the classification plug 40 is correct.

[0077] In this embodiment, the classification and identification method uses the classification device provided above. The method further includes: scanning the portion to be scanned of the wafer carrier structure 10 using the scanner 80 of the classification device to obtain first product information of the wafer carrier structure 10; reading or identifying the label of the wafer carrier structure 10 using the information reader of the classification device to obtain second product information of the wafer carrier structure 10; comparing the obtained second product information with the obtained first product information; when the second product information matches the first product information, determining that the second product information corresponding to the label is correct; when the second product information does not match the first product information, modifying the second product information corresponding to the label according to the first product information. By comparing the first product information scanned by the scanner with the second product information read by the information reader, this method facilitates rapid information comparison and error correction, improves the accuracy of the second product information corresponding to the label, avoids errors in the information on the label, and improves the accuracy of the information.

[0078] As can be seen from the above description, the embodiments of this application achieve the following technical effects: improving the automation and accuracy of classification, and reducing manual workload.

[0079] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0080] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0081] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0082] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0083] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0084] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A sorting device, characterized in that The classification device is used for detecting and classifying wafer carrying structures (10), and comprises: a detection structure (20) for detecting the type of the wafer carrying structure (10); a pickup structure (30) connected with the detection structure (20) through an electrical signal, the pickup structure (30) picks up a corresponding classification plug (40) according to the type detected by the detection structure (20) and transfers it; a driving structure (50) comprising a driving part (51) and a carrying part (52), the carrying part (52) is used for cooperating with the pickup structure (30) to support the transferred classification plug (40), and the driving part (51) is drivingly connected with the carrying part (52) to insert the classification plug (40) on the carrying part (52) into a corresponding classification hole (11) of the wafer carrying structure (10) through the driving part (51); the pickup structure (30) comprises: a clamping part (31) matched with the classification plug (40) to clamp the classification plug (40) through the clamping part (31); a transfer part (32) connected with the clamping part (31) to transfer the clamping part (31) through the transfer part (32); the classification device comprises an operation table (60), the operation table (60) is provided with a taking and placing through hole (61), the classification plug (40) is arranged at the taking and placing through hole (61), and the clamping part (31) is movably arranged above the operation table (60) to clamp the classification plug (40) at the taking and placing through hole (61); the operation table (60) is further provided with a first pushing through hole (62), the first pushing through hole (62) is arranged at the first pushing through hole (62), and the carrying part (52) is movably arranged at the first pushing through hole (62); the operation table (60) is provided with a guide groove (63) extending along a first preset direction, and at least part of the transfer part (32) is movably arranged in the guide groove (63) along the first preset direction; the classification device further comprises: a support table (70) installed above the operation table (60), the support table (70) is used for supporting the wafer carrying structure (10); the support table (70) is provided with a second pushing through hole (71), the second pushing through hole (71) is arranged opposite to the first pushing through hole (62), and the second pushing through hole (71) is arranged opposite to the classification hole (11) of the wafer carrying structure (10) to make the carrying part (52) push the classification plug (40) to pass through the first pushing through hole (62) and the second pushing through hole (71) and then enter the classification hole (11).

2. The classification device of claim 1, wherein the clamping part (31) comprises: A first clamping member (311) and a second clamping member (312) are arranged in a spaced manner, at least one of the first clamping member (311) and the second clamping member (312) is arranged in an adjustable manner, so as to clamp or release the classification plug (40) by changing the distance between the first clamping member (311) and the second clamping member (312); The first clamping member (311) forms a first clamping end at an end away from the second clamping member (312), the second clamping member (312) forms a second clamping end at an end away from the first clamping member (311), and the first clamping member (311) and the second clamping member (312) are moved in a direction of approaching or moving away from each other; A linkage assembly (313) is arranged between the first clamping member (311) and the second clamping member (312), and the linkage assembly (313) has a first articulated driving end and a second articulated driving end, the first articulated driving end is connected with the first clamping member (311), and the second articulated driving end is connected with the second clamping member (312); The linkage assembly (313) comprises a driving linkage (3131), a first linkage (3132) and a second linkage (3133), the driving linkage (3131) is arranged in a swingable manner, and the driving linkage (3131) has a first swing end and a second swing end arranged in a relative manner; the first linkage (3132) is articulated with the first swing end, and an end of the first linkage (3132) away from the driving linkage (3131) forms the first articulated driving end; the second linkage (3133) is articulated with the second swing end, and an end of the second linkage (3133) away from the driving linkage (3131) forms the second articulated driving end.

3. The classification device of claim 2, wherein, The picking structure (30) further comprises: A pushing part (33) is movably arranged in a vertical direction between the first clamping member (311) and the second clamping member (312), and when the first clamping member (311) and the second clamping member (312) release the classification plug (40), the pushing part (33) pushes the classification plug (40) out.

4. The classification device according to claim 1, wherein The classification device further comprises a scanner (80) mounted on the operation table (60), the support table (70) is provided with a first avoiding hole (73), a part to be scanned on the wafer carrying structure (10) is arranged opposite to the first avoiding hole (73), and the first avoiding hole (73) is arranged opposite to the scanner (80); The detection structure (20) comprises an information reading piece, the information reading piece is installed on the operation table (60), a second avoiding hole (74) is arranged on the support table (70), a label on the wafer carrying structure (10) is arranged opposite to the second avoiding hole (74), the second avoiding hole (74) is arranged opposite to the information reading piece, and the information reading piece is connected with the scanner (80) through an electric signal; The classification device further comprises a control structure, the information reading piece and the scanner (80) are connected with the control structure through an electric signal, and the control structure modifies the information stored in the label according to the comparison result of the code number read by the information reading piece and the code number scanned by the scanner (80).

5. The sorting device of claim 1, wherein, The driving part (51) comprises: A driving rod (511) is arranged in a lifting manner; A sliding block (512) is pushed to move by the driving rod (511), the sliding block (512) has a driving slope (5121), the driving slope (5121) abuts against the carrying part (52), and the carrying part (52) is pushed to move by the driving slope (5121); A guide rod (513) is arranged in an inclined manner, and the sliding block (512) is arranged on the guide rod (513) to guide the sliding block (512) to slide towards the carrying part (52) when the driving rod (511) pushes the sliding block (512) to move.

6. The classification device of claim 5, wherein, The rod body of the driving rod (511) extends in a vertical direction, and the sliding block (512) is located above the driving rod (511); the driving structure (50) further comprises: A pushing plate (53) is arranged between the driving rod (511) and the sliding block (512), the sliding block (512) is slidably arranged on the pushing plate (53), a limiting boss is arranged on the pushing plate (53), and the limiting boss abuts against the sliding block (512) to limit the sliding distance of the sliding block (512); and / or, A limiting plate (54) is arranged above the sliding block (512), and the limiting plate (54) abuts against the sliding block (512) to limit the rising height of the sliding block (512).

7. The sorting device of claim 5, wherein, The carrying part (52) comprises a carrying rod (521) and a carrying plate (522) connected with each other, and a first limiting flange is arranged on the carrying rod (521); the driving part (51) further comprises: A shaft sleeve (514) is sleeved on at least part of the carrying rod (521), a second limiting flange is arranged on the shaft sleeve (514), and the second limiting flange is arranged in a spaced manner with the first limiting flange; A reset piece (515) is sleeved on the carrying rod (521), a first end of the reset piece (515) abuts against the first limiting flange, and a second end of the reset piece (515) abuts against the second limiting flange.

8. The sorting device of claim 6, wherein, The driving structure (50) further comprises: A displacement detection member (55) is arranged on the driving rod (511), and the displacement detection member (55) is configured to detect the displacement of the driving rod (511); and / or A position detection member (56) is arranged on the pushing plate (53), and the position detection member (56) is configured to detect whether the classification plug (40) on the bearing part (52) enters the classification hole (11).

9. The sorting device of claim 1, wherein, The classification device further comprises: A storage part (90) having a storage cavity (91) in which the classification plug (40) is stored, and the storage part (90) is provided with a discharge port in communication with the storage cavity (91) so that the classification plug (40) is discharged through the discharge port; The storage part (90) comprises an ejection part (92), and an ejection end of the ejection part (92) is arranged in the storage cavity (91) in a liftable manner, so that the classification plug (40) is ejected through the ejection part (92).

10. A transport system characterized by, The conveying system comprises: The classification device according to any one of claims 1 to 9; A conveying device (100) configured to convey the wafer bearing structure (10) and transfer the wafer bearing structure (10) to the classification device.

11. A method of classifying recognition, characterized by, The classification and identification method adopts the classification device according to claim 4, and the classification and identification method is configured to classify and identify the wafer bearing structure, and the classification and identification method comprises: Detecting the type of the wafer bearing structure by using the detection structure of the classification device; Picking up the classification plug adapted to the detected type of the wafer bearing structure by using the picking-up structure of the classification device, and transferring the classification plug to the bearing part of the driving structure of the classification device; Driving the bearing part to move by using the driving part of the driving structure, so that the classification plug on the bearing part is inserted into the corresponding classification hole of the wafer bearing structure.

12. The classification recognition method according to claim 11, wherein, The classification and identification method further comprises: Scanning the part to be scanned of the wafer bearing structure by using the scanner to obtain first product information of the wafer bearing structure; Reading the label of the wafer bearing structure by using the information reading member to obtain second product information of the wafer bearing structure; Comparing the obtained second product information with the obtained first product information, when the second product information is consistent with the first product information, it is determined that the second product information corresponding to the label is correct, and when the second product information is inconsistent with the first product information, the second product information corresponding to the label is changed according to the first product information.

Citation Information

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