Display modules and display devices

Abstract

This application provides a display module and a display device. The display module includes: a display panel, a communication layer located on the non-display side of the display panel, a flexible circuit board located on the side of the communication layer away from the display panel, a flip-chip film, and a support member; the communication layer protrudes from the flexible circuit board along the direction from the display area to the bonding area; one end of the flip-chip film is connected to the bonding area of ​​the display panel, and the other end is bent to connect to one side of the flexible circuit board; a driver chip is connected to the side of the flip-chip film facing the communication layer; the support member is disposed between the flip-chip film and the communication layer, and there is a gap between the driver chip and the communication layer; on the display panel, the orthographic projection of the support member and the orthographic projection of the driver chip do not overlap. In this application embodiment, the support member provides a certain space for the driver chip, avoiding direct contact between the driver chip and the communication layer under external force, thereby preventing damage to the driver chip and improving the reliability and service life of the driver chip.

Description

Technical Field

[0001] This application relates to the field of display module technology, and more specifically, to a display module and a display device. Background Technology

[0002] Currently, some display modules integrate driver chips onto a chip-on-film (COF) to form a chip-on-film (COF). The two ends of the COF are then connected to the display panel and the flexible circuit board, respectively. This allows the OLB side (Outer Lead Bonding) of the COF to be bonded to the display panel, and the ILB side (Internal Pin Bonding) of the COF to be bonded to the flexible circuit board. The flexible circuit board is then bonded to the communication layer to complete the bending of the flexible circuit layer, before the next step of display module fabrication can be carried out.

[0003] However, the driver chip on the flip-chip film may be at least partially opposite the communication layer. When the flexible circuit board is bonded to the communication layer, the driver chip may come into contact with the communication layer and be damaged, resulting in damage to the driver chip. Summary of the Invention

[0004] This application addresses the shortcomings of existing methods by proposing a display module and display device to solve the technical problem that occurs when the flexible circuit board is bonded to the communication layer, causing the driver chip to come into contact with and be damaged by the communication layer.

[0005] In a first aspect, embodiments of this application provide a display module, which includes: a display panel, a communication layer located on the non-display side of the display panel, a flexible circuit board, a flip-chip film, and a support member;

[0006] The flexible circuit board is located on the side of the communication layer away from the display panel, along the direction from the display area to the bonding area, and the communication layer protrudes from the flexible circuit board;

[0007] One end of the flip-chip film is connected to the bonding area of ​​the display panel, and the other end of the flip-chip film is bent to connect to the side of the flexible circuit board away from the communication layer; the side of the flip-chip film facing the communication layer is connected to the driver chip.

[0008] The support is positioned between the flip-chip film and the communication layer, creating a gap between the driver chip and the communication layer; on the display panel, the orthographic projection of the support and the orthographic projection of the driver chip do not overlap.

[0009] Optionally, the support has a hollow region, and the driving chip is located within the hollow region.

[0010] Optionally, the orthographic projection of the support member onto the communication layer falls within the range of the communication layer.

[0011] Optionally, the support member has a first end and a second end in a direction perpendicular to the communication layer, one of the communication layer and the flexible circuit layer is connected to the first end via a pad, and the other of the communication layer and the flexible circuit layer is in contact with the second end;

[0012] On a plane parallel to the communication layer, the end face area of ​​the first end of the support is smaller than the end face area of ​​the second end of the support.

[0013] Optionally, the end face of the first end of the support is connected to the side of the flexible circuit layer near the driver chip via a pad, and the end face of the second end of the support contacts the side of the communication layer away from the display panel.

[0014] Optionally, the end face of the first end of the support is connected to the side of the communication layer away from the display panel via a pad, and the end face of the second end of the support is in contact with the side of the flexible circuit layer near the driver chip.

[0015] Optionally, the support member is a frame structure with openings at both ends and a hollow area in the middle;

[0016] The frame structure has a first end and a second end at its two ends in the direction perpendicular to the communication layer;

[0017] On a plane parallel to the communication layer, the outer peripheral surface of the second end has an edge structure extending in a direction away from the hollow region;

[0018] The end face of the edge structure facing the communication layer is flush with the end face of the second end, and the size of the outer peripheral surface of the edge structure is larger than the size of the outer peripheral surface of the first end.

[0019] Optionally, the frame structure has heat dissipation openings, and the orientation of the heat dissipation openings is parallel to the communication layer.

[0020] Optionally, the pads are L-shaped and located at at least one corner at the first end of the frame structure.

[0021] Optionally, the thickness of the frame structure is 0.4 mm to 0.7 mm.

[0022] Optionally, the thickness between the inner peripheral surface of the first end and the outer peripheral surface of the first end is 0.1 mm to 0.3 mm along the direction from the display area to the bonding area.

[0023] Optionally, the thickness between the outer peripheral surface of the edge structure and the inner peripheral surface of the second end is 0.1 mm to 0.6 mm along the direction from the display area to the bonding area.

[0024] Optionally, the display module also includes:

[0025] A support film is located between the communication layer and the display panel;

[0026] The polarizer, optical adhesive layer, and cover plate are stacked sequentially on the side of the display panel away from the communication layer, in a direction away from the display panel. The polarizer is located between the display panel and the optical adhesive layer.

[0027] Secondly, embodiments of this application also provide a display device, including any of the display modules provided in the first aspect above.

[0028] The beneficial technical effects of the technical solutions provided in this application include:

[0029] In this embodiment, one end of the flip-chip film is connected to the bonding area of ​​the display panel, and the other end is bent towards the back of the display panel and connected to the flexible circuit board. The communication layer is located between the display panel and the flexible circuit board, with one end of the communication layer located within the space where the flip-chip film is bent, such that the end of the driver chip on the flip-chip film away from the flip-chip film is at least partially opposite to the communication layer. A support member is located between the flip-chip film and the communication layer, creating a distance between the driver chip and the communication layer, providing the driver chip with sufficient space to avoid contact between the driver chip and the communication layer under external force, thereby preventing damage to the driver chip and improving the reliability and lifespan of the driver chip.

[0030] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0031] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0032] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of another display module provided in an embodiment of this application;

[0034] Figure 3 This application provides a schematic diagram of the connection structure between the communication layer and the support component in a display module.

[0035] Figure 4 for Figure 3 A schematic diagram of the cross section at the midline CC;

[0036] Figure 5 for Figure 3 Schematic diagram of the cross section at the midline DD;

[0037] Figure 6 This is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0038] Figure 7 This application provides a schematic diagram of the communication layer structure of a display module according to an embodiment of the present application.

[0039] Figure 8 A perspective schematic diagram of the communication layer structure of a display module provided in an embodiment of this application;

[0040] Figure 9 and Figure 10 These are schematic diagrams of the structure of a support member for a display module provided in an embodiment of this application, viewed from different angles.

[0041] Figure 11 This is a schematic diagram of the heat dissipation opening of a support member provided in an embodiment of this application;

[0042] Figure 12 A schematic diagram of the heat dissipation opening of another support member provided in an embodiment of this application;

[0043] Figure 13 A schematic diagram of the circuit routing of a flip-chip thin film and a driver chip provided in an embodiment of this application;

[0044] Figure 14 This is a schematic flowchart illustrating a method for manufacturing a display module according to an embodiment of this application.

[0045] Figure label:

[0046] 100 - Display Module;

[0047] 10-Display panel; 11-Bonding area; 12-Display area;

[0048] 20 - Communication layer; 21 - First pad; 22 - Second pad; 23 - Bottom layer trace; 201 - First copper layer; 202 - Ferrite layer; 203 - First protective layer; 204 - Second copper layer; 205 - Substrate; 206 - Third copper layer; 207 - Second protective layer; 208 - Adhesive layer;

[0049] 30 - Flexible circuit board;

[0050] 40 - Flip film; 41 - Third pad; 42 - First region; 43 - Second region;

[0051] 50-Driver chip;

[0052] 60 - Support component; 61 - Hollow area; 62 - First end; 63 - Second end; 64 - Pad; 65 - Frame structure; 651 - Heat dissipation opening; 652 - Edge structure;

[0053] 101-Solder paste; 102-Support film; 103-Polarizer; 104-Optical adhesive layer; 105-Cover plate. Detailed Implementation

[0054] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0055] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be understood that the term “comprising” as used in this application means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude implementations of other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by this art. It should be understood that when we say an element is “connected” or “coupled” to another element, the element may be directly connected or coupled to the other element, or it may mean that the element and the other element are connected through an intermediate element. The term “and / or” as used herein refers to at least one of the items defined by the term; for example, “A and / or B” can be implemented as “A,” or as “B,” or as “A and B.”

[0056] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0057] The applicant's research found that in related technologies, a foam is designed between the driver chip and the communication layer to separate the driver chip and the communication layer, thereby preventing the driver chip from being damaged.

[0058] However, when attaching the foam, it is necessary to apply force to ensure that the foam is completely attached to the top of the driver chip to prevent the foam from falling off. This can easily damage the driver chip and carries the risk of electrostatic discharge.

[0059] Furthermore, the foam is attached to the driver chip, and together with the adhesive coating around the driver chip, it wraps the driver chip inside, making the area around the driver chip almost completely sealed. This is not conducive to heat dissipation of the driver chip, and reduces the reliability and lifespan of the driver chip.

[0060] The display module and display device provided in this application are intended to solve the above-mentioned technical problems of the prior art.

[0061] The technical solution of this application and how it solves the above-mentioned technical problems are described in detail below with specific embodiments. It should be noted that the following embodiments can be referenced, borrowed, or combined with each other, and the same terms, similar features, and similar implementation steps in different embodiments will not be described again.

[0062] This application provides a display module 100, such as... Figure 1 or Figure 2 As shown, the display module 100 includes: a display panel 10, a communication layer 20 located on the non-display side of the display panel 10, a flexible circuit board 30, a flip-chip film 40, and a support member 60.

[0063] The display panel 10 includes a display area 12 and a bonding area 11.

[0064] The flexible circuit board 30 is located on the side of the communication layer 20 away from the display panel 10, along the direction from the display area 12 to the bonding area 11, and the communication layer 20 protrudes from the flexible circuit board 30.

[0065] One end of the flip-chip film 40 is connected to the bonding area 11 of the display panel 10, and the other end of the flip-chip film 40 is bent to connect to the side of the flexible circuit board 30 away from the communication layer 20; a driver chip 50 is connected to the side of the flip-chip film 40 facing the communication layer 20.

[0066] The support member 60 is disposed between the flip-chip film 40 and the communication layer 20, so that there is a gap between the driver chip 50 and the communication layer 20; on the display panel 10, the orthographic projection of the support member 60 and the orthographic projection of the driver chip 50 have no overlapping area.

[0067] In this embodiment, one end of the flip-chip film 40 is connected to the bonding area 11 of the display panel 10, and the other end is bent toward the back of the display panel 10 and connected to the flexible circuit board 30. The communication layer 20 is located between the display panel 10 and the flexible circuit board 30, with one end of the communication layer 20 located within the space where the flip-chip film 40 is bent, such that the end of the driver chip 50 on the flip-chip film 40 away from the flip-chip film 40 is at least partially opposite to the communication layer 20. The support member 60 is located between the flip-chip film 40 and the communication layer 20, creating a distance between the driver chip 50 and the communication layer 20, providing the driver chip 50 with sufficient space, and preventing contact between the driver chip 50 and the communication layer 20 under external force, thereby preventing damage to the driver chip 50 and improving the reliability and service life of the driver chip 50.

[0068] Furthermore, on the display panel 10, the orthographic projection of the support member 60 and the orthographic projection of the driver chip 50 have no overlapping area, and there is no overlapping area between the support member 60 and the driver chip 50 on a plane perpendicular to the display panel 10. This makes the impact of the support member 60 on the driver chip 50 relatively small, and it protects the driver chip 50 while ensuring its normal operation.

[0069] Optionally, the bonding area 11 is located at the edge of the display panel 10.

[0070] Understandably, reference Figure 1In the embodiments of this application, the "two sides" of each membrane structure are the two sides in the vertical direction, and the "two ends" are the two ends in the horizontal direction.

[0071] Optionally, such as Figure 1 or Figure 2 As shown, the communication layer 20 and the flexible circuit board 30 are connected by solder paste 101.

[0072] Optionally, communication layer 20 is an NFC (Near Field Communication) layer, as shown in the reference. Figures 7-8 The communication layer 20 also has a first pad 21 and a second pad 22. The first pad 21 is soldered to the pad 64 of the support 60, and the second pad 22 is used for soldering to other devices. Figure 8 The underlying trace structure 23 of the NFC coil is also shown, which is closer to the display panel 10, which helps to improve NFC performance and increase the NFC recognition distance.

[0073] refer to Figure 4 , Figure 4 for Figure 3 The cross-sectional diagram at line CC can also be seen as a structural diagram of the NFC film over a large area. Here, the NFC comprises at least eight layers: a first copper layer 201, a ferrite layer 202, a first protective layer 203, a second copper layer 204, a substrate 205, a third copper layer 206, a second protective layer 207, and an adhesive layer 208. (Reference) Figure 5 , Figure 5 for Figure 3 The cross-sectional diagram at line DD shows that the NFC structure is thinner here, with two fewer film layers (first copper layer 201 and ferrite layer 202) compared to CC. This provides space for the driver chip 50, increases the distance between the driver chip 50 and the communication layer 20, and further reduces the probability of the driver chip 50 being damaged by the communication layer 20.

[0074] refer to Figure 13 , Figure 13 A schematic diagram of the connection between the driver chip 50 and the flip-chip film 40 is shown. The four L-shaped markings around the driver chip 50 are the third pads 41 corresponding to the pads 64 of the support component 60 on the flip-chip film 40. The box above the driver chip 50 is the first region 42, and the circuit traces in the first region 42 are the pull lines between the display panel 10 and the driver chip 50, including data lines and driver circuit traces. The box below the driver chip 50 is the second region 43, and the circuit traces in the second region 43 include at least three parts: one part is the voltage output trace of the driver chip 50, connected to the voltage regulator and filter capacitors on the flexible circuit board 30; another part is the line providing the voltage required for the operation of the driver chip 50 and the display panel 10 in the entire display module 100; and the third part is the signal test point pull line.

[0075] Optionally, the flip-chip film 40 and the driver chip 50 form a COF (Chip-on-Flush) structure. The flip-chip film 40 serves as a flexible additional circuit board as a chip packaging carrier, allowing the chip to be bonded to the flexible substrate circuit. The driver chip 50 is then bent to the back of the display panel 10 to achieve a narrow bezel. A structural diagram of the COF bonding can be found in the reference diagram. Figure 6 .

[0076] In some possible implementations, such as Figure 1 or Figure 2 As shown, the support member 60 has a hollow region 61, and the driving chip 50 is located within the hollow region 61.

[0077] In this embodiment, the support member 60 is designed with open ends and a hollow area 61 in the middle. When the support member 60 is placed between the flip-chip film 40 and the communication layer 20, the hollow area 61 can just accommodate the driver chip 50, providing all-round protection for the driver chip 50.

[0078] In some possible implementations, such as Figure 1 or Figure 2 As shown, the orthographic projection of the support member 60 onto the communication layer 20 falls within the range of the communication layer 20. This can also be understood as the support member 60 not exceeding the communication layer 20 along the direction from the display area 12 to the bonding area 11.

[0079] In this embodiment, the support member 60 is located entirely between the communication layer 20 and the flip-chip film 40, without occupying any extra area of ​​the display device frame, which is beneficial for achieving a narrow bezel.

[0080] For some possible implementations, please refer to Figure 1 , Figure 2 , Figure 5 and Figure 10 The support member 60 has a first end 62 and a second end 63 in a direction perpendicular to the communication layer 20. One of the communication layer 20 and the flip-chip film 40 is connected to the first end 62 via a pad 64, and the other of the communication layer 20 and the flip-chip film 40 is in contact with the second end 63.

[0081] On a plane parallel to the communication layer 20, the end face area of ​​the first end 62 of the support member 60 is smaller than the end face area of ​​the second end 63 of the support member 60.

[0082] In this embodiment, the first end 62 of the support member 60 is welded to one of the communication layer 20 and the flip-chip film 40, and the second end 63 of the support member 60 contacts or abuts against the other of the communication layer 20 and the flip-chip film 40. The support member 60 only needs to be connected and fixed by the pads 64 of the first end 62, and it is not necessary to provide pads 64 at both ends. For example, the first end 62 of the support member 60 is connected to the communication layer 20, and the second end 63 has a larger area and abuts against the flip-chip film 40, which can disperse the stress from the flip-chip film 40 and also avoid damage to the flip-chip film 40 caused by stress concentration from the support member 60.

[0083] It is understood that the end face of the first end 62 is parallel to the communication layer 20, and the end face of the second end 63 is parallel to the communication layer 20.

[0084] In some possible implementations, such as Figure 2 As shown, the first end 62 of the support member 60 is connected to the pad 64, and the end face of the first end 63 is connected to the side of the flip-chip film 40 near the driver chip 50 through the pad 64. The end face of the second end 63 of the support member 60 is in contact with the side of the communication layer 20 away from the display panel 10.

[0085] In this embodiment, the first end 62 of the support member 60 is welded to the flip-chip film 40 for fixation. The flip-chip film 40 with the support member 60 welded to it is then connected to the display panel 10 and the flexible circuit board 30, so that the support member 60 is located between the flip-chip film 40 and the communication layer 20, which protects the driver chip 50 and prevents the driver chip 50 from being damaged during the bonding process between the flip-chip film 40 and the flexible circuit board 30 or the display panel 10.

[0086] In some possible implementations, such as Figure 1 As shown, the end face of the first end 62 of the support member 60 is connected to the side of the communication layer 20 away from the display panel 10 via the solder pad 64, and the end face of the second end 63 of the support member 60 contacts the side of the flip-chip film 40 near the driver chip 50. Unlike the previous embodiment, in this embodiment, the first end 62 of the support member 60 is soldered to the communication layer 20 for fixation, and then the flip-chip film 40 is connected to the display panel 10 and the flexible circuit board 30. This allows the support member 60 to be positioned below the communication layer 20 during the bonding process of the flip-chip film 40, creating a space between the communication layer 20 and the flip-chip film 40 to accommodate the driver chip 50, thus protecting the driver chip 50 and preventing it from being damaged during the bonding process between the flip-chip film 40 and the flexible circuit board 30 or the display panel 10.

[0087] In some possible implementations, refer to Figure 9 and Figure 10The support member 60 is a frame structure 65 with openings at both ends and a hollow area 61 in the middle.

[0088] The frame structure 65 has a first end 62 and a second end 63 at its two ends in the direction perpendicular to the communication layer 20. On a plane parallel to the communication layer 20, the outer peripheral surface of the second end 63 has an edge structure 652 extending in the direction away from the hollow region 61. The size of the outer peripheral surface of the edge structure 652 is larger than the size of the outer peripheral surface of the first end 62.

[0089] In this embodiment, the support member 60 is a frame structure 65 with openings at both ends and a hollow middle. The second end 63 of the frame structure 65 has an edge structure 652 extending toward the side of the frame structure 65, so that the area of ​​the second end 63 on the plane parallel to the communication layer 20 is larger than the area of ​​the first end 62 of the support member 60. It can also be understood that the edge structure 652 is a brim structure, which can increase the contact area with the flip-chip film 40 or the communication layer 20, disperse stress, and avoid stress concentration on the flip-chip film 40 from damaging the driver chip 50.

[0090] It is understood that the first end 62 of the support member 60 is the first end 62 of the frame structure 65, and the second end 63 of the support member 60 is the second end 63 of the frame structure 65.

[0091] In some possible implementations, refer to Figure 9 and Figure 10 The frame structure 65 has a heat dissipation opening 651, and the orientation of the heat dissipation opening 651 is parallel to that of the communication layer 20.

[0092] In this embodiment, a heat dissipation opening 651 is provided on the side of the frame structure 65. When the driver chip 50 is placed in the hollow area 61 inside the frame structure 65, both ends are sealed by the flip-chip thin film 40 and the communication layer 20. The heat dissipation opening 651 can exchange heat between the hollow area 61 where the driver chip 50 is located and the external environment, dissipate heat from the driver chip 50, and improve the reliability and service life of the driver chip 50.

[0093] Optionally, the frame structure 65 is a rectangular frame structure, and the orientation of the heat dissipation opening 651 on the frame structure 65 is parallel to the length direction or the width direction of the frame structure 65.

[0094] Optionally, refer to Figure 11 The heat dissipation opening 651 consists of multiple circular openings; or refer to... Figure 12 The heat dissipation opening 651 is a strip-shaped opening, which makes the preparation simpler.

[0095] In some possible implementations, refer to Figure 10 The pad 64 is L-shaped and is located at at least one corner of the first end 62 of the frame structure 65.

[0096] In this embodiment, the frame structure 65 can be a rectangular frame structure 65. The first end 62 of the frame structure 65 has four corners. The pads 64 are designed in an L-shape to match the four corners of the first end 62 of the frame structure 65. An L-shaped pad 64 can be provided at each corner, and the angle of the pad 64 is consistent with the angle of each corner of the first end 62 of the frame structure 65. In this embodiment, the frame structure 65 only needs to be fixed by at least one pad 64, without the need to weld the entire first end 62 of the frame structure 65, which can save on the manufacturing cost and welding cost of the frame structure 65.

[0097] Optionally, refer to Figure 10 There are four L-shaped pads 64. An L-shaped pad 64 can be set at each corner of the first end 62 of the frame structure 65, so that the connection between the frame structure 65 and the communication layer 20 or the flip-chip film 40 is more stable and less prone to slippage under external force.

[0098] Optionally, the main body of the frame structure 65 is made of resin material, and the solder pads 64 are made of metal. Using L-shaped solder pads 64 can reduce the weight and cost of the frame structure 65 while ensuring welding quality.

[0099] Alternatively, pad 64 can be made of metal, such as copper.

[0100] In some possible implementations, the thickness of the frame structure 65 is 0.4 mm to 0.7 mm.

[0101] It can be understood that the thickness of the frame structure 65 and the distance between the first end 62 and the second end 63 can also be understood as the distance between the horizontal portion of the flip-chip film 40 located on the non-display surface of the display panel 10 and the communication layer 20, i.e. Figure 1 or Figure 2 The height of the vertical frame structure 65 is such that the thickness of the driver chip 50 is less than 0.4 mm, and the support 60 can provide sufficient support space for the driver chip 50 to prevent the driver chip 50 from being damaged by the communication layer 20.

[0102] Along the direction from the display area 12 to the bonding area 11, the thickness between the inner and outer peripheral surfaces of the first end 62 is 0.1 mm to 0.3 mm.

[0103] In this embodiment, the frame structure 65 is a rectangular ring structure. The thickness between the inner and outer peripheral surfaces of the first end 62 is also the thickness of the sidewall of the first end 62 of the frame structure 65. This dimension is not less than 0.1 mm, so that the first end 62 has enough space to set the pad 64. This dimension is also not more than 0.3 mm, which can ensure a good welding effect between the frame structure 65 and the flip-chip film 40, or between the frame structure 65 and the communication layer 20.

[0104] Along the direction from the display area 12 to the bonding area 11, the thickness between the outer peripheral surface of the edge structure 652 and the inner peripheral surface of the second end 63 is 0.1 mm to 0.6 mm.

[0105] In this embodiment, the dimension between the outer peripheral surface of the edge structure 652 and the inner peripheral surface of the second end 63 is also the thickness of the sidewall of the second end 63. This dimension is not less than 0.1 mm and not more than 0.6 mm, so that the second end 63 has sufficient contact area with the communication layer 20 or the flip-chip film 40, which can ensure the stability between the frame structure 65 and the flip-chip film 40 or between the frame structure 65 and the communication layer 20, and reduce the possibility of the frame structure 65 sliding between the flip-chip film 40 and the communication layer 20.

[0106] In some possible implementations, the display module 100 further includes a support film 102, a polarizer 103, an optical adhesive layer 104, and a cover plate 105.

[0107] The support film 102 is located between the communication layer 20 and the display panel 10.

[0108] The polarizer 103, the optical adhesive layer 104, and the cover plate 105 are stacked sequentially on the side of the display panel 10 away from the communication layer 20 in a direction away from the display panel 10, with the polarizer 103 located between the display panel 10 and the optical adhesive layer 104.

[0109] In this embodiment, the support film 102 can support the display panel 10, the optical adhesive layer 104 can bond the polarizer and the cover plate, the left side of the cover plate 105 is the frame area, which may include ink to cover the frame of each film layer of the display module 100, and the right side is the viewing window area, where the image displayed in the display area 12 of the display panel 10 can be seen.

[0110] Based on the same inventive concept, this application also provides a display device, including any of the display modules 100 provided in the foregoing embodiments.

[0111] The display device provided in this embodiment includes any of the display modules 100 provided in the above embodiments, and their implementation principles are similar, so they will not be described again here.

[0112] Alternatively, the display device may be a watch.

[0113] Based on the same inventive concept, this application also provides a method for manufacturing a display module 100, used to manufacture any of the display modules 100 provided in the foregoing embodiments, such as... Figure 14 As shown, the method includes steps S101-S103:

[0114] S101: Connect the first end 62 of the support member 60 to the side of the communication layer 20 away from the display panel 10 or the side of the flip-chip film 40 connected to the driver chip 50.

[0115] S102: Connect the two ends of the flip-chip film 40 to the bonding area 11 of the display panel 10 and one side of the flexible circuit board 30, respectively.

[0116] S103: Align the side of the flexible circuit board 30 away from the flip-chip film 40 with the side of the communication layer 20 away from the display panel 10, so that the display panel 10, the communication layer 20 and the flexible circuit board 30 are stacked. One end of the communication layer 20 protrudes from the flexible circuit board 30 along the direction from the display area 12 to the bonding area 11. The support member 60 is disposed between the flip-chip film 40 and the communication layer 20. There is a distance between the driver chip 50 and the communication layer 20. On the display panel 10, the orthographic projection of the support member 60 and the orthographic projection of the driver chip 50 have no overlapping area.

[0117] In this embodiment, the position of the support member 60 is determined by first fixing the support member 60 to the flip-chip film 40 or first fixing the support member 60 to the communication layer 20. Then, the two ends of the flip-chip film 40 are bonded to the display panel 10 and the flexible circuit board 30 respectively, so that the support member 60 is supported between the communication layer 20 and the flip-chip film 40. Then, the communication layer 20 and the flexible circuit board 30 are aligned and bonded. There is a distance between the driver chip 50 and the communication layer 20 to avoid the driver chip 50 being damaged by the communication layer 20 due to being too close to the communication layer 20 during the bonding process of various components of the display module 100, thus ensuring the safety of the driver chip 50 and improving the service life of the driver chip 50.

[0118] Optionally, in the above S101, connecting the first end 62 of the support member 60 to the side of the communication layer 20 away from the display panel 10 or the side of the flip-chip film 40 connected to the driver chip 50 includes: connecting the first end 62 of the support member 60 to the side of the communication layer 20 away from the display panel 10.

[0119] In this embodiment, the first end 62 of the support member 60 is first connected to the communication layer 20, so that the support member 60 is installed on the main structure of the display module 100. Then, the display panel 10 and the flexible circuit board 30 are bonded using a flip-chip film 40 with a driver chip 50. During the bonding process, care is taken to match the positional relationship between the driver chip 50 and the support member 60 to avoid the driver chip 50 being damaged by the support member 60 during the bonding process.

[0120] Optionally, in the above S101, connecting the first end 62 of the support member 60 to the side of the communication layer 20 away from the display panel 10 or the side of the flip film 40 connected to the driving chip 50 includes: connecting the first end 62 of the support member 60 to the side of the flip film 40 connected to the driving chip 50.

[0121] In this embodiment, the support member 60 is first connected to the flip-chip film 40, making the flip-chip film 40, the support member 60, and the driver chip 50 an integrated structure. Then, both ends of the flip-chip film 40 are connected to the display panel 10 and the flexible circuit board 30 respectively for bonding. This step can determine the position of the support member 60 before bonding, which can avoid the driver chip 50 being damaged by the support member 60 during the bonding process.

[0122] Optionally, the support 60 is a wall-type frame structure 65, which can confine the driver chip 50 within the hollow area 61 of the frame structure 65. The driver chip 50 is connected to the flip-chip film 40 through a dispensing process. The adhesive is confined within the frame structure 65, which can reduce the overflow distance of the adhesive around the driver chip 50 to a certain extent. Reference Figure 1 or Figure 2 The triangle next to the driver chip indicates the adhesive coating around the driver chip.

[0123] By applying some embodiments of this application, at least the following beneficial effects can be achieved:

[0124] 1. One end of the flip-chip film 40 is connected to the bonding area 11 of the display panel 10, and the other end is bent towards the back of the display panel 10 and connected to the flexible circuit board 30. The communication layer 20 is located between the display panel 10 and the flexible circuit board 30. One end of the communication layer 20 is located within the space where the flip-chip film 40 is bent, so that the end of the driver chip 50 on the flip-chip film 40 away from the flip-chip film 40 is at least partially opposite to the communication layer 20. The support member 60 is located between the flip-chip film 40 and the communication layer 20, so that there is a distance between the driver chip 50 and the communication layer 20, giving the driver chip 50 a certain space to exist, avoiding contact between the driver chip 50 and the communication layer 20 under the action of external force, thereby preventing damage to the driver chip 50 and improving the reliability and service life of the driver chip 50.

[0125] 2. On the display panel 10, the orthographic projection of the support member 60 and the orthographic projection of the driver chip 50 have no overlapping area. There is no overlapping area between the support member 60 and the driver chip 50 on the plane perpendicular to the display panel 10, which makes the impact of the support member 60 on the driver chip 50 small. It protects the driver chip 50 while ensuring its normal operation.

[0126] 3. The support member 60 is designed with open ends and a hollow area 61 in the middle. When the support member 60 is placed between the flip-chip film 40 and the communication layer 20, the hollow area 61 can just accommodate the driver chip 50, providing all-round protection for the driver chip 50.

[0127] 4. The support component 60 is located entirely between the communication layer 20 and the flip-chip film 40, without occupying much of the display device bezel area, which is beneficial for achieving a narrow bezel.

[0128] 5. The first end 62 of the support member 60 is connected to the communication layer 20, and the second end 63 has a larger area and abuts against the flip-chip film 40. It can disperse the stress from the flip-chip film 40 and also prevent the flip-chip film 40 from being damaged by stress concentration from the support member 60.

[0129] 6. A heat dissipation opening 651 is provided on the side of the frame structure 65. When the driver chip 50 is placed in the hollow area 61 inside the frame structure 65, both ends are sealed by the flip-chip thin film 40 and the communication layer 20. The heat dissipation opening 651 can exchange heat between the hollow area 61 where the driver chip 50 is located and the external environment, dissipate heat from the driver chip 50, and improve the reliability and service life of the driver chip 50.

[0130] Those skilled in the art will understand that the steps, measures, and solutions in the various operations, methods, and processes discussed in this application can be alternated, modified, combined, or deleted. Other steps, measures, and solutions in the various operations, methods, and processes discussed in this application can also be alternated, modified, rearranged, decomposed, combined, or deleted. Prior art steps, measures, and solutions in the various operations, methods, and processes disclosed in this application can also be alternated, modified, rearranged, decomposed, combined, or deleted.

[0131] In the description of this application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate directions or positional relationships based on the exemplary directions or positional relationships shown in the accompanying drawings. They are used to facilitate the description or simplification of the embodiments of this application and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0132] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0133] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0134] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0135] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown sequentially according to the arrows, the order in which these steps are implemented is not limited to the order indicated by the arrows. Unless explicitly stated herein, in some implementation scenarios of this application, the steps in each process can be executed in other orders as needed. Moreover, some or all of the steps in each flowchart may include multiple sub-steps or multiple stages based on the actual implementation scenario. Some or all of these sub-steps or stages may be executed at the same time or at different times. In scenarios where the execution times are different, the execution order of these sub-steps or stages can be flexibly configured according to needs, and this application does not limit this.

[0136] The above description is only a partial embodiment of this application. It should be noted that for those skilled in the art, other similar implementation methods based on the technical concept of this application, without departing from the technical concept of this application, also fall within the protection scope of the embodiments of this application.

Claims

1. A display module, characterized in that, include: The display panel includes a display area and a bonding area; The communication layer is located on the non-display side of the display panel; A flexible circuit board, wherein the flexible circuit board is located on the side of the communication layer away from the display panel, in the direction from the display area to the bonding area, and the communication layer protrudes from the flexible circuit board; A flip-chip film, one end of which is connected to the bonding area of ​​the display panel, and the other end of which is bent to be connected to the side of the flexible circuit board away from the communication layer; a driver chip is connected to the side of the flip-chip film facing the communication layer. A support member is disposed between the flip-chip film and the communication layer, such that there is a gap between the driver chip and the communication layer; on the display panel, the orthographic projection of the support member and the orthographic projection of the driver chip do not overlap, and one end of the communication layer is located within the space where the flip-chip film is bent, such that the end of the driver chip on the flip-chip film away from the flip-chip film is at least partially opposite to the communication layer.

2. The display module according to claim 1, characterized in that, The support has a hollow area, and the driving chip is located within the hollow area.

3. The display module according to claim 1, characterized in that, The orthographic projection of the support member onto the communication layer falls within the range of the communication layer.

4. The display module according to claim 1, characterized in that, The support member has a first end and a second end in a direction perpendicular to the communication layer. One of the communication layer and the flip-chip film is connected to the first end via a pad, and the other of the communication layer and the flip-chip film is in contact with the second end. On a plane parallel to the communication layer, the end face area of ​​the first end of the support is smaller than the end face area of ​​the second end of the support.

5. The display module according to claim 4, characterized in that, The end face of the first end of the support member is connected to the side of the flip-chip film near the driver chip via the pad, and the end face of the second end of the support member is in contact with the side of the communication layer away from the display panel.

6. The display module according to claim 4, characterized in that, The end face of the first end of the support member is connected to the side of the communication layer away from the display panel via the pad, and the end face of the second end of the support member is in contact with the side of the flip-chip film near the driver chip.

7. The display module according to claim 4, characterized in that, The support member is a frame structure with openings at both ends and a hollow area in the middle; The frame structure has two ends, the first end and the second end, respectively, in the direction perpendicular to the communication layer; On a plane parallel to the communication layer, the outer peripheral surface of the second end has an edge structure extending in a direction away from the hollow region; The end face of the edge structure facing the communication layer is flush with the end face of the second end, and the size of the outer peripheral surface of the edge structure is larger than the size of the outer peripheral surface of the first end.

8. The display module according to claim 7, characterized in that, The frame structure has heat dissipation openings, and the orientation of the heat dissipation openings is parallel to that of the communication layer.

9. The display module according to claim 8, characterized in that, The pad is L-shaped and located at at least one corner of the first end of the frame structure.

10. The display module according to claim 8, characterized in that, The thickness of the frame structure is 0.4 mm to 0.7 mm; Alternatively, along the direction from the display area to the bonding area, the thickness between the inner and outer peripheral surfaces of the first end is 0.1 mm to 0.3 mm; Alternatively, along the direction from the display area to the bonding area, the thickness between the outer peripheral surface of the edge structure and the inner peripheral surface of the second end is 0.1 mm to 0.6 mm.

11. The display module according to claim 1, characterized in that, Also includes: A support film is located between the communication layer and the display panel; A polarizer, an optical adhesive layer, and a cover plate are sequentially stacked on the side of the display panel away from the communication layer, in a direction away from the display panel, with the polarizer located between the display panel and the optical adhesive layer.

12. A display device, characterized in that, include: The display module as described in any one of claims 1-11.

Images