Chip dicing and separation device

Abstract

The present invention discloses a chip dicing and separation device, and relates to the field of chip dicing technology; the present invention comprises an operating table, a placement plate is fixedly provided on the outer side of the operating table, and a support plate is fixedly provided on the side of the placement plate away from the operating table; in the present invention, a film pasting mechanism and a flipping mechanism are provided, so that a film can be quickly pasted on the back of a wafer chip, thereby avoiding the problem of insufficient flatness caused by manual film pasting, thereby achieving the purpose of smooth film pasting; in the present invention, a film pasting mechanism and a flipping mechanism are provided, so that a film can be quickly pasted on the back of a wafer chip, thereby avoiding the problem of insufficient flatness caused by manual film pasting, thereby achieving the purpose of smooth film pasting; in the present invention, a separation mechanism and an adjustment mechanism are provided, so that the angle of a water spray head can be adjusted, thereby avoiding the problem of inconvenience in adjusting the angle of the water spray head during the rinsing process, thereby achieving the angle of the water spray head adjusted according to the dicing and separation situation, so that the residue removal effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of chip dicing, and in particular to a chip dicing and dissociation device. Background Art

[0002] Wafer chips are the basic materials for manufacturing semiconductor chips. Various circuit element structures can be processed on wafer chips to become IC products with specific electrical functions. Wafer dicing machines usually use precise mechanical transmission systems, high-precision cutting tools and advanced control systems to ensure the quality and efficiency of dicing. During the dicing process, the wafer must first be fixed. Usually, tools such as suction cups or tape are used to firmly fix the wafer on the workbench of the dicing machine. Then, the robotic arm accurately locates the position where dicing is required through the control system, and uses a high-speed rotating cutting tool to diced the wafer. Before dicing the wafer chip, a film must be attached to the back of the wafer to assist in dicing separation;

[0003] In the prior art, when applying film to the back of wafer chips, it is often done manually, which makes the film not smooth enough. During the dicing process, the chip needs to be sprayed with water to wash away the debris produced by cutting. It is inconvenient to adjust the position and angle of the water spray head during the water spraying process, which affects the residue and the quality of the chip. In addition, the waste water is usually discharged directly after use, causing waste. In response to the above problems, the inventor proposes a chip dicing and dissociation device to solve the above problems. Summary of the invention

[0004] In order to solve the problem of inconvenience in applying film to the back of the wafer and inconvenience in adjusting the angle of the water spray head; the purpose of the present invention is to provide a chip dicing and dissociation device.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: a chip dicing and dissociation device, including an operating table, a placement plate is fixedly provided on the outside of the operating table, the placement plate is used to place the wafer, a support plate is fixedly provided on the side of the placement plate away from the operating table, the support plate is used for fixed support, a film pasting mechanism is provided on the outside of the support plate, the film pasting mechanism is used to apply film to the back of the wafer, the film pasting mechanism includes a support frame, the support frame is used for fixed support, a flipping mechanism is provided on the inside of the support frame, the flipping mechanism is used to flip the two rollers to apply film, and an adsorption mechanism is provided on the outside of the support plate The adsorption mechanism adsorbs and lifts the wafer after pasting, so as to facilitate taking out the wafer. A separation mechanism is provided on the side of the operating table close to the placement plate, and the separation mechanism is used to separate the wafer. The separation mechanism includes a dicing box and an adjustment frame, and the adjustment frame is used for installation. The dicing box is fixedly inserted through the operating table, and an adjustment mechanism is provided on the inner side of the adjustment frame. The adjustment mechanism can adjust the angle of the water spray head, so as to facilitate operation. A filtering mechanism is provided at the bottom of the operating table, and the filtering mechanism is used to filter waste water. A dicing mechanism is installed on the top of the operating table, and the dicing mechanism dices the wafer.

[0006] Preferably, a chip slot is provided on the side of the placement plate away from the operating table, and a protective pad is movably inserted in the chip slot, the chip slot is used to clamp the wafer, so as to facilitate the film pasting work, and the protective pad is used to protect the wafer to avoid damage. A No. 1 T-shaped slide is provided in the support plate, and a No. 1 reciprocating threaded rod is rotatably provided in the No. 1 T-shaped slide, and a No. 1 threaded slider is provided on the outer thread sleeve of the No. 1 reciprocating threaded rod, and the No. 1 threaded slider is fixedly connected to the support frame, and a No. 1 motor is fixedly provided on the outer side of the support plate, and the end of the No. 1 motor output shaft is inserted through the support plate and fixedly connected to the No. 1 reciprocating threaded rod, and a protective film cylinder is detachably installed in the support frame, and the No. 1 T-shaped slide is used for limiting, and the No. 1 reciprocating threaded rod can drive the No. 1 threaded slider to move, and the movement of the No. 1 threaded slider can move the support frame and the protective film cylinder, so that the protective film can be covered on the wafer. The protective film, motor No. 1 is used to provide power output, the flipping mechanism includes a turntable and a roller, the turntable is rotatably connected to the support frame, the outer side of the turntable is fixedly provided with a symmetrically distributed connecting plate, the roller is rotatably connected to the connecting plate, and the side of the placement plate away from the operating table is fixedly provided with a symmetrically distributed flipping block, the inner wall of the support frame is fixedly provided with a symmetrically distributed fixed block, a limit rod is movably inserted through the fixed block, a wedge is fixedly provided at the end of the limit rod, and a symmetrically distributed card slot is opened on the side of the turntable, the wedge is movably inserted in the card slot, and a spring is movably sleeved on the outer side of the limit rod, the roller is used to evenly stick the protective film to the back of the wafer, and the connecting plate is used for fixed connection. The flipping block can flip the roller, so that it is more convenient to adjust the roller, and the limit rod, wedge and other structures can limit the turntable after flipping, so that the roller is more stable when moving.

[0007] Preferably, the adsorption mechanism includes a top plate, the top plate is fixedly connected to the support plate, and an electric push rod is fixedly installed on one side of the top plate away from the operating table, the end of the output shaft of the electric push rod is inserted into the top plate and fixedly provided with a negative pressure suction cup, the top plate is used for fixed support, the electric push rod can drive the negative pressure suction cup to move up and down, the negative pressure suction cup can adsorb the wafer, and the adsorption mechanism is convenient for taking out the wafer after film pasting, and an operation panel is fixedly arranged in the dicing box, and a symmetrically distributed No. 2 T-shaped slideway is opened in the fixed box, and a No. 2 reciprocating threaded rod is rotatably penetrated in the No. 2 T-shaped slideway, and a No. 2 threaded slider is threadedly sleeved on the outer side of the No. 2 reciprocating threaded rod, and the No. 2 threaded slider is fixedly connected to the adjusting frame, and a No. 2 motor is fixedly arranged on the outer side of one of the fixed boxes, and the output shaft end of the No. 2 motor is inserted into the fixed box and fixedly connected to the No. 2 reciprocating threaded rod, the operation panel is used for placing the slices to be dissociated, and the No. 2 T-shaped slideway is used for limiting the No. 2 threaded slider The cam is provided with a screw rod, and a sliding block is fixedly provided on both sides of the sliding block. The sliding block is inserted in the square groove, and the circular block is movably inserted in the sliding groove. A water spray head is fixedly inserted in the rotating frame, and a No. 3 motor is fixedly provided on the outside of the adjusting frame. The end of the output shaft of the No. 3 motor is inserted in the adjusting frame and is fixedly connected with the screw rod. The rotating frame drives the water spray head to rotate, so that the angle of the water spray head can be adjusted. The square groove is used to clamp the sliding block, and the sliding block can drive the rotating frame to rotate by moving up and down, and the circular block and the sliding groove make the rotating frame and the circular block limitedly connected. The end of the output shaft of the No. 3 motor rotates to drive the screw rod to rotate, and the rotation of the screw rod drives the sliding block to move.

[0008] Preferably, the filter mechanism comprises a filter box, the filter box is fixedly connected to the operating table, a filter plate is fixedly arranged in the filter box, a No. 3 reciprocating threaded rod is rotatably arranged in the filter box, a scraper is arranged on the outer thread sleeve of the No. 3 reciprocating threaded rod, and a symmetrically distributed auxiliary rod is fixedly arranged on the inner wall of the filter box, the auxiliary rod is movably inserted into the scraper, the filter plate is used to filter the waste water, the No. 3 reciprocating threaded rod and the scraper can filter the filtered residue, the auxiliary rod is used to assist, the scraper moves, a No. 2 synchronous wheel is fixedly arranged on the outer side of the No. 3 reciprocating threaded rod, one of the No. 2 reciprocating threaded rods is fixedly arranged on the outer side of the No. 2 reciprocating threaded rod, a No. 1 synchronous wheel is fixedly arranged, and a No. 3 synchronous wheel is fixedly arranged on the side of the No. 2 reciprocating threaded rod close to the No. 1 synchronous wheel, and the No. 2 synchronous wheel is rotatably moved with the No. 1 synchronous wheel. A No. 1 synchronous belt is sleeved on the outer side of the wheel, and a No. 2 synchronous belt is sleeved on the outer side of the two No. 3 synchronous wheels. The rotation of the No. 2 reciprocating threaded rod drives one of the No. 3 synchronous wheels to rotate through the No. 2 synchronous belt transmission. The thread directions of the two No. 2 reciprocating threaded rods are in opposite directions. The No. 1 synchronous belt, the No. 1 synchronous wheel and the No. 2 synchronous wheel drive the No. 3 reciprocating threaded rod to rotate. A symmetrically distributed L-shaped slideway is fixedly arranged in the filter box, and a waste box is movably inserted through the filter box. The waste box is located above the L-shaped slideway. Handles are fixedly arranged at both ends of the waste box, and a drain pipe is fixedly arranged through the bottom of the waste box. The L-shaped slideway is used to limit the waste box, and a drain outlet for filtered water is provided in the waste box. The handle is convenient for operating the waste box, and the drain pipe is used to discharge water in the filter box.

[0009] Compared with the prior art, the present invention has the following beneficial effects:

[0010] 1. The present invention can quickly apply film to the back of the wafer chip by setting up a film applying mechanism and a flipping mechanism, avoiding the problem of manual film applying and uneven film, thereby achieving the purpose of even film applying;

[0011] 2. The present invention can adjust the angle of the water spray head by setting a separation mechanism and an adjustment mechanism, thereby avoiding the problem of inconvenient adjustment of the angle of the water spray head during the rinsing process, so that the angle of the water spray head can be adjusted according to the dicing separation situation, so as to achieve a better effect of removing residues;

[0012] 3. In the present invention, a filtering mechanism is provided to filter the sprayed water residues, thereby avoiding the problem of inconvenience in filtering the used water, thereby achieving the purpose of filtering and reusing the waste water. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a schematic diagram of the structure of the present invention;

[0015] Figure 2 The structure of the present invention Figure 1 A is an enlarged schematic diagram;

[0016] Figure 3 The structure of the present invention Figure 1 A magnified schematic diagram of B;

[0017] Figure 4 The structure of the present invention Figure 1 A magnified schematic diagram of middle C;

[0018] Figure 5 It is a schematic diagram of the structural support frame and its connection structure of the present invention;

[0019] Figure 6 The structure of the present invention Figure 5 A magnified schematic diagram of D in the middle;

[0020] Figure 7 Another schematic diagram of the structure of the present invention;

[0021] Figure 8 The structure of the present invention Figure 7 Middle E is an enlarged schematic diagram;

[0022] Fig. 9 It is a cross-sectional schematic diagram of the structural filter box and its connection structure of the present invention;

[0023] Fig.10 The structure of the present invention Fig. 9 A magnified schematic diagram of F in the middle.

[0024] In the figure: 1. operating table; 11. placing plate; 12. chip slot; 13. protection pad; 14. dicing mechanism; 2. film sticking mechanism; 21. support plate; 22. No. 1 T-type slideway; 23. No. 1 reciprocating threaded rod; 24. No. 1 threaded slider; 25. support frame; 26. protective film cylinder; 27. adsorption mechanism; 271. top plate; 272. electric push rod; 273. negative pressure suction cup; 28. No. 1 motor; 3. flipping mechanism; 31. turntable; 32. connecting plate; 33. roller; 34. card slot; 35. fixed block; 36. limit rod; 37. wedge; 38. spring; 39. flipping block; 4. separation mechanism; 41. dicing box; 411. operating panel; 42. fixed box; 421. No. 2 T-type Slide; 422, No. 2 reciprocating threaded rod; 423, No. 2 threaded slider; 424, adjusting frame; 425, No. 2 motor; 43, adjusting mechanism; 431, rotating frame; 432, square groove; 433, slide; 434, screw rod; 435, sliding block; 436, round block; 437, sprinkler head; 438, No. 3 motor; 44, No. 1 synchronous wheel; 441, No. 1 synchronous belt; 442, No. 2 synchronous wheel; 443, No. 3 synchronous wheel; 444, No. 2 synchronous belt; 5, filtering mechanism; 51, filtering box; 511, filtering plate; 52, No. 3 reciprocating threaded rod; 521, scraper; 522, auxiliary rod; 53, L-shaped slide; 531, waste box; 532, handle; 54, drain pipe. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] like Figure 1-10As shown, the present invention provides a chip dicing and dissociation device, including an operating table 1, a placing plate 11 is fixedly arranged on the outside of the operating table 1, the placing plate 11 is used to place the wafer, a support plate 21 is fixedly arranged on the side of the placing plate 11 away from the operating table 1, the support plate 21 is used for fixed support, a film pasting mechanism 2 is arranged on the outside of the support plate 21, the film pasting mechanism 2 is used to apply film to the back of the wafer, the film pasting mechanism 2 includes a support frame 25, the support frame 25 is used for fixed support, a flipping mechanism 3 is arranged on the inside of the support frame 25, the flipping mechanism 3 is used to flip two rollers 33 to apply film, and an adsorption mechanism 27 is arranged on the outside of the support plate 21, the adsorption mechanism 27 will be pasted The completed wafer is adsorbed and lifted up, so that it is convenient to take out the wafer. A separation mechanism 4 is provided on the side of the operating table 1 close to the placement plate 11. The separation mechanism 4 is used to separate the wafer. The separation mechanism 4 includes a dicing box 41 and an adjustment frame 424. The adjustment frame 424 is used for installation. The dicing box 41 is fixedly inserted through the operating table 1. An adjustment mechanism 43 is provided on the inner side of the adjustment frame 424. The adjustment mechanism 43 can adjust the angle of the water spray head 437, so as to make the operation more convenient. A filtering mechanism 5 is provided at the bottom of the operating table 1. The filtering mechanism 5 is used to filter the waste water. A dicing mechanism 14 is installed at the top of the operating table 1. The dicing mechanism 14 dices the wafer.

[0027] A chip slot 12 is formed on one side of the placement plate 11 away from the operating table 1 , and a protection pad 13 is movably inserted into the chip slot 12 .

[0028] By adopting the above technical solution, the chip slot 12 is used to clamp the wafer, so as to facilitate the film laminating work, and the protection pad 13 is used to protect the wafer to avoid damage.

[0029] A No. 1 T-shaped slideway 22 is provided in the support plate 21, and a No. 1 reciprocating threaded rod 23 is rotatably provided in the No. 1 T-shaped slideway 22. A No. 1 threaded slider 24 is threadedly sleeved on the outer side of the No. 1 reciprocating threaded rod 23, and the No. 1 threaded slider 24 is fixedly connected to the support frame 25. A No. 1 motor 28 is fixedly provided on the outer side of the support plate 21, and the end of the output shaft of the No. 1 motor 28 is inserted through the support plate 21 and fixedly connected to the No. 1 reciprocating threaded rod 23. A protective film cylinder 26 is detachably installed in the support frame 25.

[0030] By adopting the above technical solution, the No. 1 T-shaped slide 22 is used for limiting, the No. 1 reciprocating threaded rod 23 can drive the No. 1 threaded slider 24 to move, and the movement of the No. 1 threaded slider 24 can move the lower support frame 25 and the protective film cylinder 26, so that the protective film can be covered on the top of the wafer, and the No. 1 motor 28 is used to provide power output.

[0031] The flipping mechanism 3 includes a turntable 31 and a roller 33. The turntable 31 is rotatably connected to the support frame 25. A symmetrically distributed connecting plate 32 is fixedly arranged on the outer side of the turntable 31. The roller 33 is rotatably connected to the connecting plate 32. A symmetrically distributed flipping block 39 is fixedly arranged on the side of the placement plate 11 away from the operating table 1. A symmetrically distributed fixed block 35 is fixedly arranged on the inner wall of the support frame 25. A limit rod 36 is movably inserted through the fixed block 35. A wedge 37 is fixedly arranged at the end of the limit rod 36. A symmetrically distributed card slot 34 is opened on the side of the turntable 31. The wedge 37 is movably inserted in the card slot 34. A spring 38 is movably sleeved on the outer side of the limit rod 36.

[0032] By adopting the above technical solution, the roller 33 is used to evenly stick the protective film on the back of the wafer, the connecting plate 32 is used for fixed connection, the flip block 39 can flip the roller 33, so that it is more convenient to adjust the roller 33, and the limit rod 36 and the wedge 37 and other structures can limit the turntable 31 after flipping, so that the roller 33 is more stable when moving.

[0033] The adsorption mechanism 27 includes a top plate 271, which is fixedly connected to the support plate 21. An electric push rod 272 is fixedly installed on one side of the top plate 271 away from the operating table 1. The output shaft end of the electric push rod 272 is inserted into the top plate 271 and fixedly provided with a negative pressure suction cup 273.

[0034] By adopting the above technical solution, the top plate 271 is used for fixed support, the electric push rod 272 can drive the negative pressure suction cup 273 to move up and down, the negative pressure suction cup 273 can adsorb the wafer, and the adsorption mechanism 27 is convenient for taking out the wafer after film pasting.

[0035] An operating panel 411 is fixedly provided in the dicing box 41, and a symmetrically distributed No. 2 T-shaped slideway 421 is provided in the fixed box 42, a No. 2 reciprocating threaded rod 422 is rotatably penetrated in the No. 2 T-shaped slideway 421, a No. 2 threaded slider 423 is threadedly sleeved on the outer side of the No. 2 reciprocating threaded rod 422, and the No. 2 threaded slider 423 is fixedly connected to the adjusting frame 424, and a No. 2 motor 425 is fixedly provided on the outer side of one of the fixed boxes 42, and the output shaft end of the No. 2 motor 425 is inserted through the fixed box 42 and fixedly connected to the No. 2 reciprocating threaded rod 422.

[0036] By adopting the above technical solution, the operating plate 411 is used to place the slices to be dissociated, the No. 2 T-shaped slide 421 is used to limit the No. 2 threaded slider 423, the No. 2 reciprocating threaded rod 422 is used to move the No. 2 threaded slider 423 and the adjustment frame 424, and the No. 2 motor 425 is used to provide power output.

[0037] A rotating frame 431 is rotatably provided on the inner wall of the adjusting frame 424, a square groove 432 is opened in the rotating frame 431, and sliding grooves 433 distributed in pairs are opened on the inner wall of the square groove 432, a screw rod 434 is rotatably provided in the adjusting frame 424, a sliding block 435 is threadedly sleeved on the outer side of the screw rod 434, and circular blocks 436 are fixedly provided on both sides of the sliding block 435, the sliding block 435 is inserted in the square groove 432, and the circular block 436 is movably inserted in the sliding groove 433, a water spray head 437 is fixedly inserted in the rotating frame 431, and a No. 3 motor 438 is fixedly provided on the outer side of the adjusting frame 424, and the end of the output shaft of the No. 3 motor 438 is inserted through the adjusting frame 424 and fixedly connected to the screw rod 434.

[0038] By adopting the above technical solution, the rotating frame 431 rotates and drives the water spray head 437 to rotate, so that the angle of the water spray head 437 can be adjusted. The square groove 432 is used to clamp the sliding block 435. The sliding block 435 moves up and down to drive the rotating frame 431 to rotate. The circular block 436 and the slide groove 433 enable the rotating frame 431 and the circular block 436 to be limitedly connected. The output shaft end of the third motor 438 rotates to drive the screw rod 434 to rotate, and the rotation of the screw rod 434 drives the sliding block 435 to move.

[0039] The filtering mechanism 5 includes a filter box 51, which is fixedly connected to the operating table 1. A filter plate 511 is fixedly arranged in the filter box 51. A No. 3 reciprocating threaded rod 52 is rotatably arranged in the filter box 51. A scraper 521 is threadedly sleeved on the outer side of the No. 3 reciprocating threaded rod 52. Auxiliary rods 522 that are symmetrically distributed are fixedly arranged on the inner wall of the filter box 51. The auxiliary rods 522 are movably inserted through the scraper 521.

[0040] By adopting the above technical solution, the filter plate 511 is used to filter the wastewater, the No. 3 reciprocating threaded rod 52 and the scraper 521 can filter the filtered residue, the auxiliary rod 522 is used to assist, and the scraper 521 moves.

[0041] A No. 2 synchronous wheel 442 is fixedly sleeved on the outer side of the No. 3 reciprocating threaded rod 52, a No. 1 synchronous wheel 44 is fixedly sleeved on the outer side of one of the No. 2 reciprocating threaded rods 422, a No. 3 synchronous wheel 443 is fixedly sleeved on one side of the No. 2 reciprocating threaded rod 422 close to the No. 1 synchronous wheel 44, a No. 1 synchronous belt 441 is sleeved on the outer sides of the No. 2 synchronous wheel 442 and the No. 1 synchronous wheel 44, and a No. 2 synchronous belt 444 is sleeved on the outer sides of the two No. 3 synchronous wheels 443.

[0042] By adopting the above technical solution, the rotation of the No. 2 reciprocating threaded rod 422 drives one of the No. 3 synchronous wheels 443 to rotate through the No. 2 synchronous belt 444. The thread directions of the two No. 2 reciprocating threaded rods 422 are in opposite directions. The No. 1 synchronous belt 441, the No. 1 synchronous wheel 44 and the No. 2 synchronous wheel 442 are driven to drive the No. 3 reciprocating threaded rod 52 to rotate.

[0043] A symmetrically distributed L-shaped slide 53 is fixedly provided in the filter box 51, a waste box 531 is movably inserted through the filter box 51, the waste box 531 is located above the L-shaped slide 53, handles 532 are fixedly provided at both ends of the waste box 531, and a drain pipe 54 is fixedly provided through the bottom of the waste box 531.

[0044] By adopting the above technical solution, the L-shaped slide 53 is used to limit the waste box 531. A drain outlet for filtered water is provided in the waste box 531. The handle 532 facilitates the operation of the waste box 531. The drain pipe 54 is used to discharge the water in the filter box 51.

[0045] Working principle: First, place the wafer to be operated upside down in the chip slot 12, then press the protective film of the protective film cylinder 26 under the roller 33, and then start the No. 1 motor 28 to make the No. 1 motor 28 start working. The output end of the No. 1 motor 28 drives the No. 1 reciprocating threaded rod 23 to rotate, and the rotation of the No. 1 reciprocating threaded rod 23 drives the No. 1 threaded slider 24 and the support frame 25 to move. The movement of the support frame 25 drives the roller 33 and the protective film cylinder 26 to move. The protective film cylinder 26 attaches the film to the back of the wafer, and the roller 33 sticks the protective film to the back of the wafer. When the front roller 33 moves to the flip block 39, the flip block 39 causes the nearby roller 33 to flip, and the flip of the roller 33 drives the connecting plate 32 and the turntable 31 to rotate, and the turntable 31 rotates The wedge 37 and the limit rod 36 move upward, and the spring 38 is compressed while the wedge 37 moves upward, so that when the wedge 37 moves to another slot 34, the wedge 37 is inserted into the slot 34 under the action of the spring 38, so that the next film can be applied, and then the electric push rod 272 is started, so that the output end of the electric push rod 272 drives the negative pressure suction cup 273 to move downward, so that when the negative pressure suction cup 273 contacts the back of the wafer, the wafer is adsorbed by the negative pressure suction cup 273, and then the negative pressure suction cup 273 is reset to drive the wafer to move upward, and then the wafer on the negative pressure suction cup 273 is manually taken down and placed on the operating panel 411, and the wafer is fixed by the positioning mechanism, and the water spray head 437 is connected to the external water source. The second motor 425 is connected in a row, and then when the dicing mechanism 14 slicing and separating the wafer, the second motor 425 is started, so that the second motor 425 starts to work, and the output shaft end of the second motor 425 rotates to drive the second reciprocating threaded rod 422 to rotate, and the second reciprocating threaded rod 422 rotates to drive the third synchronous wheel 443 to rotate through the second synchronous belt 444 to drive the two second reciprocating threaded rods 422 to rotate, and the two second reciprocating threaded rods 422 rotate to drive the second threaded slider 423 and the adjustment frame 424 to move, so that the water spray head 437 can reciprocate to wash away the debris generated during the wafer dicing process. If it is necessary to adjust the angle of the water spray head 437, the third motor 438 is started, so that the third motor 438 starts to work, and the third The output shaft end of the motor 438 rotates to drive the screw rod 434 to rotate. The screw rod 434 rotates to drive the sliding block 435 to move downward with the assistance of the square groove 432, the slide groove 433 and the circular block 436. The sliding block 435 moves downward, driving the rotating frame 431 to rotate. The rotating frame 431 rotates to drive the water spray head 437 to move downward, so that the angle of the water spray head 437 can be adjusted. During the flushing process, the flowing waste water will enter the filter box 51 and be filtered by the filter plate 511. During the rotation of the No. 2 reciprocating threaded rod 422, the No. 1 synchronous wheel 44 is driven to rotate. The No. 1 synchronous wheel 44 rotates through the No. 1 synchronous belt 441 to drive the No. 2 synchronous wheel 442 to rotate. The rotation of the No. 2 synchronous wheel 442 drives the No. 3 reciprocating threaded rod 52 to rotate.The third reciprocating threaded rod 52 rotates to drive the scraper 521 to move back and forth. The scraper 521 moves back and forth to drop the impurities attached to the filter plate 511 into the waste box 531. Finally, the filtered water can also be reused.

[0046] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A chip dicing and dissociation device, comprising an operating table (1), characterized in that: A placement plate (11) is fixedly provided on the outside of the operating table (1); a support plate (21) is fixedly provided on the side of the placement plate (11) away from the operating table (1); a film pasting mechanism (2) is provided on the outside of the support plate (21); the film pasting mechanism (2) comprises a support frame (25); a turning mechanism (3) is provided on the inside of the support frame (25); an adsorption mechanism (27) is provided on the outside of the support plate (21); a separation mechanism (4) is provided on the side of the operating table (1) close to the placement plate (11); the separation mechanism (4) comprises a dicing box (41) and an adjustment frame (424); the dicing box (41) is fixedly inserted through the operating table (1); an adjustment mechanism (43) is provided on the inside of the adjustment frame (424); a filtering mechanism (5) is provided at the bottom of the operating table (1); and a dicing mechanism (14) is installed at the top of the operating table (1); A chip slot (12) is provided on a side of the placement plate (11) away from the operating table (1), and a protective pad (13) is movably inserted into the chip slot (12); A No. 1 T-shaped slideway (22) is provided in the support plate (21), a No. 1 reciprocating threaded rod (23) is rotatably provided in the No. 1 T-shaped slideway (22), a No. 1 threaded slider (24) is threadedly sleeved on the outer side of the No. 1 reciprocating threaded rod (23), the No. 1 threaded slider (24) is fixedly connected to the support frame (25), a No. 1 motor (28) is fixedly provided on the outer side of the support plate (21), an output shaft end of the No. 1 motor (28) is inserted through the support plate (21) and is fixedly connected to the No. 1 reciprocating threaded rod (23), and a protective film cylinder (26) is detachably installed in the support frame (25); The turning mechanism (3) comprises a turntable (31) and a roller (33), the turntable (31) being rotatably connected to the support frame (25), a symmetrically distributed connecting plate (32) being fixedly provided on the outer side of the turntable (31), the roller (33) being rotatably connected to the connecting plate (32), a symmetrically distributed turning block (39) being fixedly provided on the side of the placement plate (11) away from the operating table (1), a symmetrically distributed fixing block (35) being fixedly provided on the inner wall of the support frame (25), a limit rod (36) being movably inserted through the inside of the fixing block (35), a wedge (37) being fixedly provided at the end of the limit rod (36), a symmetrically distributed clamping groove (34) being opened on the side of the turntable (31), the wedge (37) being movably inserted in the clamping groove (34), and a spring (38) being movably sleeved on the outer side of the limit rod (36); The adsorption mechanism (27) comprises a top plate (271), the top plate (271) being fixedly connected to the support plate (21), an electric push rod (272) being fixedly mounted on a side of the top plate (271) away from the operating table (1), an output shaft end of the electric push rod (272) being inserted through the top plate (271) and fixedly provided with a negative pressure suction cup (273); An operating panel (411) is fixedly provided in the dicing box (41), a second T-shaped slideway (421) is symmetrically arranged in the fixed box (42), a second reciprocating threaded rod (422) is rotatably provided in the second T-shaped slideway (421), a second threaded slider (423) is threadedly sleeved on the outer side of the second reciprocating threaded rod (422), the second threaded slider (423) is fixedly connected to the adjustment frame (424), a second motor (425) is fixedly provided on the outer side of one of the fixed boxes (42), an output shaft end of the second motor (425) is inserted through the fixed box (42) and fixedly connected to the second reciprocating threaded rod (422); The inner wall of the adjusting frame (424) is rotatably provided with a rotating frame (431), a square groove (432) is provided in the rotating frame (431), and the inner wall of the square groove (432) is provided with slide grooves (433) distributed in pairs, a screw rod (434) is rotatably provided in the adjusting frame (424), a sliding block (435) is threadedly sleeved on the outer side of the screw rod (434), and circular blocks (436) are fixedly provided on both sides of the sliding block (435), the sliding block (435) is inserted in the square groove (432), and the circular block (436) is movably inserted in the slide groove (433), a water spray head (437) is fixedly inserted in the rotating frame (431), and a No. 3 motor (438) is fixedly provided on the outer side of the adjusting frame (424), and the output shaft end of the No. 3 motor (438) is inserted through the adjusting frame (424) and fixedly connected to the screw rod (434); The filtering mechanism (5) comprises a filtering box (51), the filtering box (51) being fixedly connected to the operating table (1), a filtering plate (511) being fixedly provided in the filtering box (51), a No. 3 reciprocating threaded rod (52) being rotatably provided in the filtering box (51), a scraper (521) being threadedly sleeved on the outer side of the No. 3 reciprocating threaded rod (52), and auxiliary rods (522) being symmetrically distributed and fixedly provided on the inner wall of the filtering box (51), the auxiliary rods (522) being movably inserted through the scraper (521); The outer fixed sleeve of the third reciprocating threaded rod (52) is provided with a second synchronous wheel (442), the outer fixed sleeve of one of the second reciprocating threaded rods (422) is provided with a first synchronous wheel (44), the fixed sleeve on one side of the second reciprocating threaded rod (422) close to the first synchronous wheel (44) is provided with a third synchronous wheel (443), the outer sides of the second synchronous wheel (442) and the first synchronous wheel (44) are provided with a first synchronous belt (441), and the outer sides of the two third synchronous wheels (443) are provided with a second synchronous belt (444); A symmetrically distributed L-shaped slideway (53) is fixedly provided in the filter box (51), a waste box (531) is movably inserted through the filter box (51), the waste box (531) is located above the L-shaped slideway (53), handles (532) are fixedly provided at both ends of the waste box (531), and a drainage pipe (54) is fixedly provided through the bottom of the waste box (531).

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