A method for characterizing a cutting mode of a micro-milling repair process of a surface defect of a KDP crystal

By establishing a three-dimensional model of the cutting energy specificity of ball-end micromilling, the problem of characterizing the cutting mode in the micromilling repair of KDP crystal surface defects was solved, enabling accurate prediction and improvement of KDP crystal surface quality and providing optimization suggestions for process parameters.

CN116882073BActive Publication Date: 2026-05-26HARBIN INST OF TECH
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Patent Information

Application Number
CN202310611461.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-05-29
Publication Date
2026-05-26
Estimated Expiration
2043-05-29

AI Technical Summary

Technical Problem

Existing technologies have failed to establish a three-dimensional model of the cutting energy of ball-end micromilling that takes into account the presence of micro-defects, and cannot effectively characterize the cutting mode in the micromilling repair process of KDP crystal surface defects, resulting in surface quality fluctuations and laser damage.

Method used

By measuring the depth of defects on the crystal surface, a three-dimensional calculation model of the average cutting area of ​​ball end micromilling is established. Cutting force is collected, a cutting energy model is constructed, and the cutting mode in the micromilling repair process is analyzed.

Benefits of technology

This study enabled precise characterization of the micromilling repair process for surface defects in KDP crystals, quantitatively investigated the relationship between cutting specific energy and cutting mode, and improved the controllability of repaired surface quality and process parameters.

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Abstract

This invention discloses a method for characterizing the cutting mode during the micro-milling repair process of KDP crystal surface defects. It relates to the field of optical component processing technology and addresses the problem that existing methods assume the workpiece material surface is defect-free, lacking a three-dimensional model of the cutting energy specificity for ball-end micro-milling that considers the presence of micro-defects. The method includes the following steps: Step 1, selecting repair process parameters and measuring the depth of crystal surface defects; Step 2, establishing a three-dimensional calculation model of the average cutting area of ​​ball-end micro-milling; Step 3, collecting the cutting force during the surface defect micro-milling repair process; Step 4, constructing a cutting energy specificity model for the ball-end micro-milling repair process; Step 5, analyzing the cutting mode during the micro-milling repair process based on the cutting energy specificity model. This invention provides a reference for improving surface quality, controlling size effects, and optimizing process parameters in actual repair processes, thereby further improving the surface quality of repaired KDP crystal components.
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