Display module and display device

By introducing a combination structure of a rigid support layer and a heat dissipation functional layer into the display module, the force transmission problem caused by the forward movement of the waterproof adhesive in the narrow bezel design is solved, the module strength and waterproofness are improved, the risk of failure is reduced, and a display module design with narrow bezel and high strength is realized.

CN116884316BActive Publication Date: 2026-05-08BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BOE TECHNOLOGY GROUP CO LTD
Filing Date
2023-07-25
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

In existing display modules with narrow bezel designs, the forward placement of the waterproof adhesive causes the force to be directly transmitted to the Panel Tail area when the device is dropped, resulting in Panel peeling and deformation, which affects the module's strength and waterproofness.

Method used

The design employs a combination structure of a first rigid support layer and a heat dissipation functional layer in the bonding area of ​​the display panel. The rigid support layer transmits force to prevent deformation of the bonding area, and the design incorporates a stepped structure to improve the leveling effect of the waterproof adhesive and enhance waterproofness.

Benefits of technology

The strength and water resistance of the display module have been improved, reducing the risk of failure. At the same time, the overall thickness of the narrow bezel design remains unchanged, avoiding the generation of adhesive bubbles and improving assembly reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The display module comprises a display panel, in a first direction, the display panel comprises a display area, a bending area and a binding area, the bending area is bendable to bend the binding area to the backlight side of the display area, when the bending area is in a bending state, a heat dissipation functional layer is arranged between the display area and the binding area, and a first rigid support layer is arranged between the heat dissipation functional layer and the binding area. The display device is also disclosed.
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Description

Technical Field

[0001] This disclosure relates to the field of display product manufacturing technology, and in particular to a display module and display device. Background Technology

[0002] With the rapid development of display technology, end-users are increasingly inclined to adopt devices with full-screen solutions, which requires continued improvement in the design capabilities of narrow bezel modules. At the same time, the waterproof performance of products is also an important factor that cannot be ignored.

[0003] Taking mobile phones as an example, current products apply waterproof adhesive between the mid-frame and the display module. This adhesive occupies part of the bottom bezel, resulting in a relatively wide bezel. To achieve a narrow bezel design, one proposed solution is to move the adhesive forward, allowing it to flow down through the Panel Tail area (bonding area) and connect to the mid-frame. However, while this method achieves a narrow bezel, the direct contact between the mid-frame and the panel means that during drop tests or other mechanical strength tests, the external force is directly transmitted to the Panel Tail area, causing peeling, deformation, and ultimately module failure. Summary of the Invention

[0004] To address the aforementioned technical problems, this disclosure provides a display module and a display device that solve the problem of achieving a narrow bezel while ensuring waterproofing, and simultaneously increasing the strength of the display module.

[0005] To achieve the above objectives, the technical solution adopted in this disclosure is: a display module, including a display panel, wherein in a first direction, the display panel includes a display area, a bending area, and a bonding area, the bending area can be bent to bend the bonding area to the backlight side of the display area, and when the bending area is in a bent state, a heat dissipation functional layer is provided between the display area and the bonding area, and a first rigid support layer is provided between the heat dissipation functional layer and the bonding area.

[0006] Optionally, in the second direction, the first rigid support layer has a first central area and first edge areas located on opposite sides of the first central area, and the orthographic projection of the binding area on the first rigid support layer is located in the first central area;

[0007] In the second direction, the heat dissipation functional layer has a second central region and second edge regions located on opposite sides of the second central region, and the orthographic projection of the rigid support layer on the heat dissipation functional layer is located in the second central region;

[0008] The second direction is perpendicular to the first direction, and the second direction is perpendicular to the light emission direction of the display panel.

[0009] Optionally, the heat dissipation functional layer is disposed in a groove on the side facing the first rigid support layer, and a portion of the first rigid support layer is embedded in the groove.

[0010] Optionally, the heat dissipation functional layer includes a metal layer disposed near the bonding area, and the depth of the groove is less than the thickness of the metal layer in the light emission direction of the display panel.

[0011] Optionally, the heat dissipation functional layer includes a metal layer disposed near the bonding area and a foam layer located on the side of the metal layer away from the bonding area. In the light emission direction of the display panel, the depth of the groove is greater than the thickness of the metal layer, and the depth of the groove is less than or equal to the sum of the thickness of the metal layer and the thickness of the foam layer.

[0012] Optionally, the heat dissipation functional layer includes a stainless steel heat sink, and the depth of the groove in the light-emitting direction of the display panel is less than or equal to the thickness of the stainless steel heat sink.

[0013] Optionally, in the second direction, the length of the groove is less than 0.5 mm, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the light emission direction of the display panel.

[0014] Optionally, the first rigid support layer is a stainless steel support plate.

[0015] Optionally, a second rigid support layer is provided on the side of the binding area away from the display area.

[0016] Optionally, in the second direction, the binding area includes a third central area and third edge areas located on opposite sides of the third central area, and the orthographic projection of the second rigid support layer on the binding area is located in the third central area.

[0017] Optionally, in the second direction, the second rigid support layer includes a fourth central region and fourth edge regions located on opposite sides of the fourth central region, the orthographic projection of the binding region on the second rigid support layer is located in the fourth central region, and an elastic buffer layer is provided between the fourth edge regions and the heat dissipation functional layer.

[0018] Optionally, the orthographic projection of the elastic buffer layer onto the heat dissipation functional layer lies entirely within the heat dissipation functional layer.

[0019] Optionally, there is a gap between the elastic buffer layer and the second rigid support layer.

[0020] Optionally, the first rigid support layer comprises a graphite layer made of graphite material.

[0021] Optionally, a driver IC is disposed on the side of the bonding area away from the display area, and in the second direction, the gap between the second rigid support layer and the driver IC is 20-30um.

[0022] This disclosure also provides a display device, including the above-described display module and a mid-frame located outside the display module. The display module further includes a cover plate located on the light-emitting side of the display panel.

[0023] A second rigid support layer is provided on the side of the binding area away from the display area;

[0024] The cover plate includes a first area exposed on the display panel, the first area includes a first sub-area corresponding to the bonding area, and a second sub-area other than the first sub-area, the second sub-area being provided with a first adhesive barrier layer connected to the middle frame;

[0025] It also includes a second adhesive barrier layer, which together with the first adhesive barrier layer forms a ring structure. The second adhesive barrier layer covers the second rigid support layer, the portion of the bonding area exposed in the second rigid support layer, the portion of the first rigid support layer exposed in the bonding area, the portion of the heat dissipation functional layer exposed in the first rigid support layer, and part of the cover plate.

[0026] The beneficial effects of this disclosure are as follows: By using the first rigid support layer instead of the traditional elastic support layer, the bonding area of ​​the display panel will not deform when subjected to positive pressure, thus improving the strength of the bonding area. Furthermore, the force on the bonding area can be transferred to the heat dissipation functional layer instead of the bonding area itself, ensuring that the traces of each film layer in the bonding area will not crack, improving the overall strength of the display panel and reducing the risk of failure. In addition, using the first rigid support layer instead of the elastic support layer in the traditional technology does not increase the overall thickness of the display device. Further, the stepped structure formed in this application allows the waterproof adhesive to flow better onto the target surface, avoiding adhesive bubbles caused by adhesive pulling, and enabling the waterproof adhesive to better adhere to the sides of the display module to prevent moisture ingress. At the same time, this method provides good adhesion, helping to avoid adhesive pulling that can cause air bubbles to be buried in the adhesive, eliminating potential reliability issues in the overall assembly of the display device. Attached Figure Description

[0027] Figure 1 A schematic diagram of a display module in traditional technology. Figure 1 ;

[0028] Figure 2 A schematic diagram of a display module in traditional technology. Figure 2 ;

[0029] Figure 3 A schematic diagram of a display module in traditional technology. Figure 3 ;

[0030] Figure 4 A schematic diagram of a display module in traditional technology. Figure 4 ;

[0031] Figure 5 A schematic diagram of the display module in the embodiments of this disclosure. Figure 1 ;

[0032] Figure 6 A schematic diagram of the display module in the embodiments of this disclosure. Figure 2 ;

[0033] Figure 7 A schematic diagram of the display module in the embodiments of this disclosure. Figure 3 ;

[0034] Figure 8 A schematic diagram of the display module in the embodiments of this disclosure. Figure 4 ;

[0035] Figure 9 A schematic diagram of the display module in the embodiments of this disclosure. Figure 5 ;

[0036] Figure 10 A schematic diagram of the display module in the embodiments of this disclosure. Figure 6 ;

[0037] Figure 11 A schematic diagram of the display module in the embodiments of this disclosure. Figure 7 ;

[0038] Figure 12 A schematic diagram of the display module in the embodiments of this disclosure. Figure 8 ;

[0039] Figure 13 A schematic diagram of the display module in the embodiments of this disclosure. Figure 9 ;

[0040] Figure 14 A schematic diagram of the display module in the embodiments of this disclosure. Figure 10 . Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0042] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0043] Figure 1 This diagram illustrates the assembly state of the display module and mid-frame in traditional technology. In conventional assembly, the edge of the cover plate 1 overlaps with the mid-frame 10, and waterproof adhesive is applied to the inside of the overlap joint to form a waterproof adhesive layer 3. Therefore, due to the unique nature of this structure, the bottom bezel of the screen cannot be made smaller in the final assembly state (affected by the overlap area of ​​the mid-frame and the minimum area for adhesive application).

[0044] Figure 2 This is a schematic diagram of a display module in a traditional narrow-bezel display device. Figure 3 This is a schematic diagram illustrating the assembly state of the display module and mid-frame in a traditional narrow-bezel display device. Compared to... Figure 1 The structure is such that the waterproof adhesive layer 3 is moved forward (refer to the direction shown in the diagram, move to the right).

[0045] The display panel 2 includes a display area, a bending area, and a bonding area arranged sequentially along a first direction. When the bending area is bent, the bonding area bends towards the backlight side of the display area. Since the waterproof adhesive layer 3 is directly applied to the side of the bonding area away from the display area, part of the waterproof adhesive layer 3 is connected to the bonding area, while another part is connected to other components such as the motherboard in the entire device. This method prevents the interior (the direction where ICs and FPCs are located to the right of the waterproof adhesive layer) from being corroded by moisture. However, this solution has a fatal flaw: because the bonding area between the device's frame 10 and the display panel is directly connected through the waterproof adhesive layer 3, during a drop, the forces acting on the frame 10 in all directions will be directly transmitted to the display panel through the waterproof adhesive layer 3. Figure 3 The diagram shows the force analysis of the display panel during a drop test. For ease of understanding, all forces are orthogonally decomposed into the frontal pressure Fz and the horizontal shear forces Fx and Fy acting on the display panel. This is in contrast to traditional non-narrow bezel solutions (…). Figure 1 (the structure in the middle), although Figure 1 The bezel in the middle frame is large, but the middle frame 10 is connected to the cover plate 1, so it can have higher strength during the drop of the whole machine; while the display panel in the narrow bezel solution will be affected by the force transmitted by the middle frame, causing the display panel to fail.

[0046] refer to Figures 5-14 To address the aforementioned problems, the technical solution adopted in this disclosure is: a display module, including a display panel, in a first direction (referring to...) Figure 1 The display panel includes a display area 21, a bending area 22, and a bonding area 23 (in the Y direction). The bending area 22 can be bent to bend the bonding area 23 to the backlight side of the display area 21. When the bending area 22 is in a bent state, a heat dissipation functional layer 5 is provided between the display area 21 and the bonding area 23, and a first rigid support layer 6 is provided between the heat dissipation functional layer 5 and the bonding area 23.

[0047] In conventional technology, an elastic support layer is provided between the heat dissipation functional layer 5 and the bonding area 23 (see reference). Figures 1-4The elastic support layer 4) is used to ensure the bending radius of the bending area 22. However, the elastic support layer in the conventional technology includes a PET substrate layer and adhesive layers on opposite sides of the PET substrate layer. When the bonding area 23 of the display panel is subjected to positive pressure (pressure in the light emission direction of the display panel), the elastic support layer will deform, causing problems such as breakage of the lines on the bonding area 23 of the display panel. In this embodiment, the first rigid support layer 6 is used instead of the elastic support layer. When the bonding area 23 of the display panel is subjected to positive pressure, it will not deform, improving the strength of the bonding area 23 of the display panel. Moreover, the force on the bonding area 23 can be transferred to the heat dissipation functional layer 5, instead of the bonding area 23 itself bearing the force, ensuring that the traces of each film layer in the bonding area 23 will not crack, improving the overall strength of the display panel and reducing the risk of failure.

[0048] It should be noted that in this embodiment, the first rigid support layer 6 is used instead of the elastic support layer in the traditional technology, and the overall thickness of the display device is not increased.

[0049] In conventional technical solutions, an elastic support layer is provided between the heat dissipation functional layer 5 and the bonding area 23 to ensure the bending radius of the bending area 22. However, the elastic support layer in conventional technology includes a PET substrate layer and adhesive layers on opposite sides of the PET substrate layer. The PET substrate and the adhesive layers on opposite sides are integrally formed, and the sides of the adhesive layers are flush with the sides of the PET substrate layer. After assembly with the bonding area 23 of the display panel, the orthographic projection of the elastic support layer on the bonding area 23 needs to be located within the bonding area 23. That is, relative to the outer contour of the bonding area 23, the elastic support layer needs to be recessed. (Refer to...) Figure 4 During the process of dispensing adhesive to form a waterproof adhesive layer, due to the significant height difference between the dispensing point and the bonding area 23, air bubbles are easily generated. These air bubbles are naturally generated during the process and are uncontrollable. However, the presence of these air bubbles will cause them to expand during reliability testing, thereby rupturing the waterproof area and leading to waterproofing failure. To solve the above problem, in this embodiment, in the second direction (reference...) Figure 1In the X direction (where the second direction is perpendicular to the first direction and also perpendicular to the light emission direction of the display panel), the first rigid support layer 6 is extended outward, so that the edges of the bonding area 23, the first rigid support layer 6, the heat dissipation layer 5, and the cover plate 1 on the same side form a stepped structure. This allows the waterproof adhesive to flow more smoothly onto the target surface, avoiding adhesive bubbles caused by adhesive pulling. It also allows the waterproof adhesive to better adhere to the sides of the display module, preventing moisture ingress. Simultaneously, this method provides excellent adhesion, helping to avoid adhesive pulling that could trap air bubbles within the adhesive, thus eliminating potential reliability issues in the overall assembly of the display device.

[0050] For details, please refer to Figure 8 In the second direction, the first rigid support layer 6 has a first central area and first edge areas located on opposite sides of the first central area, and the orthographic projection of the binding area 23 on the first rigid support layer 6 is located in the first central area.

[0051] In the second direction, the heat dissipation functional layer 5 has a second central region and second edge regions located on opposite sides of the second central region, and the orthographic projection of the rigid support layer on the heat dissipation functional layer 5 is located in the second central region;

[0052] The second direction is perpendicular to the first direction, and the second direction is perpendicular to the light emission direction of the display panel.

[0053] It should be noted that the first rigid support layer 6 is a rigid support structure. The first rigid support layer 6 and the binding area 23 can be connected by an adhesive layer. The adhesive layer can be formed by applying glue or applying tape. The first rigid support layer 6 and the adhesive layer adopt a separate structure. Therefore, the size of the adhesive layer can be set according to actual needs (that is, the size of the adhesive layer and the size of the first rigid support layer 6 can be different). When the first rigid support layer 6 is expanded outward relative to the binding area 23, the size of the adhesive layer can be set according to the size of the binding area 23. That is, the adhesive layer can be recessed. While realizing the connection between the first rigid support layer 6 and the binding area 23, the outward expansion of the first rigid support layer 6 is not affected.

[0054] refer to Figures 9-14 In an exemplary embodiment, the heat dissipation functional layer 5 is disposed in a groove on the side facing the first rigid support layer 6, and a portion of the first rigid support layer 6 is embedded in the groove.

[0055] The groove can accommodate and fix the first rigid support layer 6. When the whole machine is dropped, the force on the whole machine will be transmitted to the first rigid support layer 6 through the waterproof adhesive. The pressure in the Z direction can be transmitted downward through the first rigid support layer 6 to the heat dissipation functional layer 5, while the shear force will be transmitted to the groove of the heat dissipation functional layer 5 through the first rigid support layer 6. Since the groove has a limiting function, most of the shear force can be absorbed by the limiting function of the groove, thereby ensuring the strength of the binding area 23.

[0056] The depth of the groove can be set according to actual needs. The following describes several structural forms in this embodiment.

[0057] refer to Figure 9 In an exemplary embodiment, the heat dissipation functional layer 5 includes a metal layer 51 disposed near the bonding area 23, and the depth of the groove is less than or equal to the thickness of the metal layer 51 in the light emission direction of the display panel.

[0058] In one specific embodiment, in the light-emitting direction of the display panel, the depth of the groove is half the thickness of the metal layer 51, but is not limited thereto.

[0059] In an exemplary embodiment, the depth of the groove is 0.015~0.30mm in the light-emitting direction of the display panel.

[0060] In an exemplary embodiment, the heat dissipation functional layer 5 includes a metal layer 51 disposed near the bonding area 23 and a foam layer 52 located on the side of the metal layer 51 away from the bonding area 23. In the light emission direction of the display panel, the depth of the groove is greater than the thickness of the metal layer 51, and the depth of the groove is less than or equal to the sum of the thickness of the metal layer 51 and the thickness of the foam layer 52. Figure 10 In the light-emitting direction of the display panel, the depth of the groove is greater than the thickness of the metal layer 51, and the depth of the groove is less than the sum of the thickness of the metal layer 51 and the thickness of the foam layer 52. Figure 11 In the light-emitting direction of the display panel, the depth of the groove is greater than the thickness of the metal layer 51, and the depth of the groove is equal to the sum of the thickness of the metal layer 51 and the thickness of the foam layer 52.

[0061] For example, the heat dissipation functional layer 5 further includes a mesh adhesive layer 53 located on the side of the foam layer 52 away from the metal layer 51. When the depth of the groove is equal to the sum of the thickness of the metal layer 51 and the thickness of the foam layer 52, that is, when the groove penetrates the metal layer 51 and the foam layer 52, the first rigid support layer 6 is in direct contact with the mesh adhesive layer 53.

[0062] refer to Figure 12 and Figure 13 In an exemplary embodiment, the heat dissipation functional layer 5 includes a stainless steel heat sink, which is connected to the display area 21 of the display panel via an optical adhesive layer 54 or a mesh adhesive layer 53. In the light emission direction of the display panel, the depth of the groove is less than or equal to the thickness of the stainless steel heat sink.

[0063] In an exemplary embodiment, the length of the groove is less than 0.5 mm in the second direction, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the light emission direction of the display panel.

[0064] In some specific embodiments, the width of the groove in the second direction is 0.1-0.2 mm, but is not limited thereto.

[0065] In an exemplary embodiment, the first rigid support layer 6 is a stainless steel support plate.

[0066] The stainless steel plate can provide support and enhance the strength of the binding area 23, preventing deformation of the binding area 23 under stress, which could lead to display panel failure. In addition, the stainless steel support plate has a certain heat dissipation function, improving the heat dissipation effect.

[0067] refer to Figures 6-14 In an exemplary embodiment, a second rigid support layer 7 is provided on the side of the binding area 23 away from the display area 21.

[0068] The first rigid support layer 6 and the second rigid support layer 7 work together to ensure the strength of the upper and lower surfaces of the bonding area 23. When subjected to external force, the vertical force (positive pressure) is directly transmitted to the heat dissipation functional layer 5 on the lower side of the bonding area 23, rather than the bonding area 23 itself bearing the force. This ensures that the traces of each film layer in the bonding area 23 will not crack, improves the overall strength of the bonding area 23, and reduces the risk of failure.

[0069] In an exemplary embodiment, in the second direction, the binding area 23 includes a third central area and third edge areas located on opposite sides of the third central area, and the orthographic projection of the second rigid support layer 7 onto the binding area 23 is located in the third central area.

[0070] By adopting the above scheme, the second rigid support layer 7 is recessed relative to the bonding area 23. In the second direction, the edges of the second rigid support layer 7, the bonding area 23, the first rigid support layer 6, the heat dissipation functional layer 5, and the cover plate 1 on the same side form a stepped structure. The waterproof adhesive can flow better to the target surface, avoiding glue bubbles caused by glue pulling. This allows the waterproof adhesive to better adhere to the side of the display module, preventing moisture from entering.

[0071] refer to Figure 14 In an exemplary embodiment, in the second direction, the second rigid support layer 7 includes a fourth central region and fourth edge regions located on opposite sides of the fourth central region. The orthographic projection of the binding region 23 on the second rigid support layer 7 is located in the fourth central region. An elastic buffer layer 9 is provided between the fourth edge regions and the heat dissipation functional layer 5.

[0072] Using the above solution, when the positive pressure on the display module exceeds a certain range during the process of the whole machine being subjected to force, the bonding area 23 will be squeezed towards the elastic buffer layer 9 due to the pressure. At this time, the elastic buffer layer 9 can play a buffering role to ensure the front printing effect.

[0073] For example, the elastic buffer layer 9 can be foam, but is not limited thereto.

[0074] In an exemplary embodiment, the orthographic projection of the elastic buffer layer 9 onto the heat dissipation functional layer 5 is entirely within the heat dissipation functional layer 5.

[0075] For example, in the second direction, the edge of the heat dissipation functional layer 5 is exposed outside the elastic buffer layer 9. In the second direction, the edges of the second rigid support layer 7, the elastic buffer layer 9, the first rigid support layer 6, the heat dissipation functional layer 5, and the cover plate 1 on the same side form a stepped structure, so that the waterproof adhesive can flow better to the target surface, avoid glue bubbles caused by glue pulling, and allow the waterproof adhesive to better adhere to the side of the display module to prevent moisture from entering.

[0076] In an exemplary embodiment, there is a gap between the elastic buffer layer 9 and the second rigid support layer 7.

[0077] For example, the gap is set to 0.01-0.2mm to effectively ensure the elastic buffering effect.

[0078] For example, in the second direction, the second rigid support layer 7 is exposed in the binding area 23 for a length of 1-2 mm to avoid interfering with the assembly of other components.

[0079] It should be noted that in the embodiment where the elastic buffer layer 9 is provided between the second rigid support layer 7 and the heat dissipation functional layer 5, since the force on the binding area 23 is buffered by the elastic buffer layer 9 and transmitted to the heat dissipation functional layer 5 through the elastic buffer layer 9, in some embodiments, the material of the first rigid support layer 6 can be made of other materials that can maintain a flat surface, except for stainless steel. For example, the first rigid support layer 6 includes a graphite layer made of graphite material.

[0080] It should be noted that the first rigid support layer 6 may include multiple stacked graphite layers to ensure its support strength and prevent deformation.

[0081] In an exemplary embodiment, a driver IC 8 is disposed on the side of the bonding area 23 away from the display area 21, and in the second direction, the gap between the second rigid support layer 7 and the driver IC 8 is 20-30 μm.

[0082] In the embodiment where the first rigid support layer 6 includes a graphite layer, since the graphite layer is in direct contact with the metal layer 51 in the heat dissipation functional layer 5, the heat near the driver IC 8 can be more evenly distributed to the surface of the heat dissipation functional layer 5 more quickly and effectively, thereby reducing the local temperature of the bonding area 23 near the driver IC 8.

[0083] This disclosure also provides a display device, including the above-described display module and a mid-frame 10 located outside the display module. The display module further includes a cover plate 1 located on the light-emitting side of the display panel.

[0084] A second rigid support layer 7 is provided on the side of the binding area 23 away from the display area 21;

[0085] The cover plate 1 includes a first area exposed on the display panel. The first area includes a first sub-area corresponding to the binding area 23, and a second sub-area other than the first sub-area. A first adhesive barrier layer 31 connected to the middle frame 10 is provided on the second sub-area.

[0086] It also includes a second adhesive barrier layer 32, which together with the first adhesive barrier layer 31 forms a ring structure. The second adhesive barrier layer 32 covers the second rigid support layer 7, the portion of the bonding area 23 exposed in the second rigid support layer 7, the portion of the first rigid support layer 6 exposed in the bonding area 23, the portion of the heat dissipation functional layer 5 exposed in the first rigid support layer 6, and part of the cover plate 1.

[0087] The first rigid support layer 6 and the second rigid support layer 7 work together to enhance the strength of the bonding area 23, and when subjected to external force, the vertical force (positive pressure) is directly transmitted to the heat dissipation functional layer 5 on the lower side of the bonding area 23, rather than the bonding area 23 itself bearing the force. This ensures that the traces of each film layer in the bonding area 23 will not crack, improves the overall strength of the bonding area 23, and reduces the risk of failure.

[0088] The second adhesive barrier layer 32 and the first adhesive barrier layer 31 together form a ring structure, which can effectively prevent water vapor erosion.

[0089] The second adhesive barrier layer 32 covers the second rigid support layer 7, the portion of the bonding area 23 exposed in the second rigid support layer 7, the portion of the first rigid support layer 6 exposed in the bonding area 23, the portion of the heat dissipation functional layer 5 exposed in the first rigid support layer 6, and part of the cover plate 1, which can achieve the function of narrow bezel.

[0090] For example, the first adhesive barrier layer 31 and the second adhesive barrier layer 32 are made of the same material, which is waterproof adhesive, but this is not a limitation.

[0091] For example, the first adhesive barrier layer 31 and the second adhesive barrier layer 32 are made of the same material. Both the first adhesive barrier layer 31 and the second adhesive barrier layer 32 can be formed by water-based adhesive, solid adhesive, PSA, Tape or other combinations that can serve as any support and bonding structure, injection molding process, etc.

[0092] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display module, comprising a display panel, wherein, in a first direction, the display panel includes a display area, a bending area, and a bonding area, the bending area being bendable to bend the bonding area to the backlight side of the display area, wherein, When the bending area is in a bent state, a heat dissipation functional layer is provided between the display area and the bonding area, and a first rigid support layer is provided between the heat dissipation functional layer and the bonding area; a second rigid support layer is provided on the side of the bonding area away from the display area. In the second direction, the second rigid support layer includes a fourth central region and fourth edge regions located on opposite sides of the fourth central region. The orthographic projection of the binding region on the second rigid support layer is located in the fourth central region. An elastic buffer layer is provided between the fourth edge regions and the heat dissipation functional layer. In the second direction, the first rigid support layer has a first central area and first edge areas located on opposite sides of the first central area, and the orthographic projection of the binding area on the first rigid support layer is located in the first central area; In the second direction, the heat dissipation functional layer has a second central region and second edge regions located on opposite sides of the second central region, and the orthographic projection of the first rigid support layer on the heat dissipation functional layer is located in the second central region; The second direction is perpendicular to the first direction, and the second direction is perpendicular to the light emission direction of the display panel.

2. The display module according to claim 1, wherein, The heat dissipation functional layer is disposed in a groove on the side facing the first rigid support layer, and a portion of the first rigid support layer is embedded in the groove.

3. The display module according to claim 2, wherein, The heat dissipation functional layer includes a metal layer disposed near the bonding area, and in the light emission direction of the display panel, the depth of the groove is less than the thickness of the metal layer.

4. The display module according to claim 2, wherein, The heat dissipation functional layer includes a metal layer disposed near the bonding area and a foam layer located on the side of the metal layer away from the bonding area. In the light emission direction of the display panel, the depth of the groove is greater than the thickness of the metal layer, and the depth of the groove is less than or equal to the sum of the thickness of the metal layer and the thickness of the foam layer.

5. The display module according to claim 2, wherein, The heat dissipation functional layer includes a stainless steel heat sink, and in the light emission direction of the display panel, the depth of the groove is less than or equal to the thickness of the stainless steel heat sink.

6. The display module according to claim 2, wherein, In the second direction, the length of the groove is less than 0.5 mm, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the light emission direction of the display panel.

7. The display module according to claim 1, wherein, The first rigid support layer is a stainless steel support plate.

8. The display module according to claim 1, wherein, The orthogonal projection of the elastic buffer layer onto the heat dissipation functional layer lies entirely within the heat dissipation functional layer.

9. The display module according to claim 1, wherein, There is a gap between the elastic buffer layer and the second rigid support layer.

10. The display module according to claim 1, wherein, The first rigid support layer comprises a graphite layer made of graphite material.

11. The display module according to claim 1, wherein, A driver IC is disposed on the side of the bonding area away from the display area. In the second direction, the gap between the second rigid support layer and the driver IC is 20-30 μm.

12. A display device, wherein, The display module includes the display module according to any one of claims 1-11, and a mid-frame located outside the display module, wherein the display module further includes a cover plate located on the light-emitting side of the display panel; A second rigid support layer is provided on the side of the binding area away from the display area; The cover plate includes a first area exposed on the display panel. The first area includes a first sub-area corresponding to the bonding area and a second sub-area other than the first sub-area. The second sub-area is provided with a first adhesive barrier layer connected to the middle frame. It also includes a second adhesive barrier layer, which together with the first adhesive barrier layer forms a ring structure, and the second adhesive barrier layer covers the second rigid support layer, the portion of the first rigid support layer exposed in the bonding area, the portion of the heat dissipation functional layer exposed in the first rigid support layer, and part of the cover plate.

Citation Information

Patent Citations

  • Electronic device including waterproof structure

    CN108738267A

  • Flexible display device and preparation method thereof

    CN113066361A

  • Display module

    CN114446173A

  • Display device

    CN115484792A