Film forming apparatus and film forming method

Abstract

The present application provides a kind of film formation device and film formation method for improving the monitoring accuracy of monitoring unit.The film formation device has: first evaporation source, which releases evaporation material to substrate;First monitoring component, which monitors the release state of evaporation material from first evaporation source;Second evaporation source, which releases evaporation material to substrate;And second monitoring component, which monitors the release state of evaporation material from second evaporation source, wherein, with anti-attachment component, the anti-attachment component inhibits the scattering of evaporation material from first evaporation source to second monitoring component, and inhibits the scattering of evaporation material from second evaporation source to first monitoring component, the anti-attachment component has: first wall part, which is arranged along the first direction and extends;And second wall part, which is arranged along the direction intersecting with the first direction from the first wall part, the connecting part of first wall part and second wall part is located between first evaporation source and second evaporation source and first monitoring component and second monitoring component in the first direction.

Description

Technical Field

[0001] This invention relates to a film-forming apparatus and a film-forming method. Background Technology

[0002] In the manufacture of organic EL displays, etc., a mask is used to vapor-deposit organic materials, metal materials, and other vapor-deposited substances emitted from an evaporation source onto a substrate. A vapor deposition apparatus has been proposed that includes a monitoring unit for monitoring the emission state of the vapor-deposited substance from the vapor deposition source, for the purpose of managing the film thickness of the vapor-deposited substance deposited onto the substrate (Patent Document 1 and Patent Document 2).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-137877

[0006] Patent Document 2: Japanese Patent Application Publication No. 2019-99870 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] When multiple monitoring units are set up corresponding to multiple vapor deposition sources, sometimes the vapor deposition material can reach a monitoring unit from a vapor deposition source that does not correspond to a particular monitoring unit (crosstalk). This crosstalk reduces the monitoring accuracy of the monitoring unit.

[0009] This invention provides a technique to improve the monitoring accuracy of a monitoring unit.

[0010] Solution for solving the problem

[0011] According to the present invention, a film-forming apparatus is provided, comprising:

[0012] The first vapor deposition source releases vapor deposition material onto the substrate;

[0013] A first monitoring component is disposed in a first direction relative to the first vapor deposition source to monitor the release state of vapor deposition material from the first vapor deposition source.

[0014] A second evaporation source, disposed relative to the first evaporation source in a second direction intersecting the first direction, releases evaporation material onto the substrate; and

[0015] A second monitoring component, disposed in the first direction relative to the second vapor deposition source, monitors the release state of the vapor deposition material from the second vapor deposition source.

[0016] in,

[0017] The film-forming apparatus includes an anti-adhesion member that inhibits the dispersion of the vapor-deposited material from the first vapor deposition source to the second monitoring component, and also inhibits the dispersion of the vapor-deposited material from the second vapor deposition source to the first monitoring component.

[0018] The anti-adhesion component includes:

[0019] A first wall portion, which extends along the first direction; and

[0020] The second wall portion extends from the first wall portion in a direction intersecting the first direction.

[0021] The connection between the first wall portion and the second wall portion is located in the first direction between the first vapor deposition source and the second vapor deposition source and the first monitoring component and the second monitoring component.

[0022] Furthermore, according to the present invention, a film-forming method is provided, wherein...

[0023] The process of forming a film on a substrate using the aforementioned film-forming apparatus is provided.

[0024] The effects of the invention

[0025] According to the present invention, a technique for improving the monitoring accuracy of a monitoring unit can be provided. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a film-forming apparatus according to one embodiment of the present invention.

[0027] Figure 2 It is along Figure 1 A cross-sectional view of the vapor deposition apparatus for the A-A line.

[0028] Figure 3 yes Figure 1 A diagram illustrating the operation of the film-forming device.

[0029] Figure 4 (A) is Figure 3 (B) is a magnified view of a portion of the structure, which is a three-dimensional view of the anti-adhesion component.

[0030] Figure 5 yes Figure 3 Sectional view along line B-B.

[0031] Figure 6 Figures (A) to (D) are other structural examples of anti-attachment components.

[0032] Figure 7 (A) and (B) are diagrams showing other structural examples of anti-adhesion components.

[0033] Figure 8 Figures (A) to (D) are other structural examples of anti-attachment components.

[0034] Figure 9 (A) and (B) are diagrams showing other structural examples of anti-adhesion components.

[0035] Figure 10 (A) is an overall view of the organic EL display device, and (B) is a view showing the cross-sectional structure of 1 pixel.

[0036] Explanation of reference numerals in the attached figures

[0037] 1 Film forming device, 2 Conveying device, 3 Evaporation device, 5A Evaporation source, 5B Evaporation source, 7A Monitoring unit, 7B Monitoring unit. Detailed Implementation

[0038] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Furthermore, the following embodiments do not limit the invention as defined in the claims. Although multiple features are described in the embodiments, not all of these features are necessarily essential to the invention, and multiple features can be arbitrarily combined. In the accompanying drawings, the same or identical structures are labeled with the same reference numerals, and repeated descriptions are omitted.

[0039] <Overview of the film-forming device>

[0040] Figure 1 This is a schematic diagram of a film-forming apparatus 1 according to an embodiment of the present invention. Figure 2 It is along Figure 1 A cross-sectional view of the vapor deposition apparatus 3 along line A-A. Furthermore, in each figure, arrows X and Y represent mutually orthogonal horizontal directions, and arrow Z represents the vertical direction. The film deposition apparatus 1 includes a transport device 2 and a vapor deposition apparatus 3. The transport device 2 is positioned above the vapor deposition apparatus 3.

[0041] The conveying device 2 includes a conveying chamber 20, which is internally formed into a conveying chamber 20c that is maintained as a vacuum during use. An inlet 20a is provided at one end of the conveying chamber 20 in the X direction, and an outlet 20b is provided at the other end. The object to be processed is fed into the conveying chamber 20c through the inlet 20a and, after processing, is discharged outwards through the outlet 20b. A plurality of conveying rollers 21 arranged in the X direction are provided in the conveying chamber 20c. Two rows of these conveying rollers 21 are arranged separately in the Y direction. Each conveying roller 21 rotates about a rotation axis in the Y direction. The object to be processed is placed on the two rows of conveying rollers 21 at its two ends in the Y direction, and is conveyed horizontally in the X direction by the rotation of the conveying rollers 21. In this embodiment, a roller mechanism is used as the conveying mechanism for the object to be processed, but other types of conveying mechanisms, such as magnetic levitation conveying, can also be used.

[0042] The vapor deposition apparatus 3 includes a source chamber 30, which forms an internal space 30a that is maintained as a vacuum during use. The source chamber 30 has a box shape with an opening at the top, and the transport chamber 20c communicates with the internal space 30a through the opening. The vapor deposition apparatus 3 includes a vapor deposition unit 5 that discharges vapor deposition material upwards.

[0043] The vapor deposition unit 5 includes vapor deposition sources 5A and 5B arranged in the X direction. Vapor deposition sources 5A and 5B are so-called line sources. Each vapor deposition source 5A and 5B extends in a direction intersecting the transport direction (X direction) of the object to be processed conveyed by the transport device 2 (in this embodiment, the Y direction orthogonal to the transport direction). Furthermore, relative to vapor deposition source 5A, vapor deposition source 5B is positioned in a direction intersecting the Y direction (in this embodiment, the X direction).

[0044] Vapor deposition sources 5A and 5B include a crucible for holding raw materials for vapor deposition, a heater for heating the crucible, etc., and release the vapor deposition material as vapor into the conveying chamber 20c by heating the raw materials. For example, vapor deposition source 5A releases Ag as the vapor deposition material, and vapor deposition source 5B releases Mg as the vapor deposition material.

[0045] The vapor deposition apparatus 3 includes a baffle unit 6. The baffle unit 6 includes a baffle 60, an arm member 61, and a drive unit 62. The baffle 60 rotates on a moving track that includes the position between the vapor deposition source unit 5 and the workpiece being processed, which is being transported within the transport chamber 20c. The moving track is the path along which the baffle 60 moves, typically a circular track, but sometimes an elliptical track or a straight track.

[0046] In this embodiment, the baffle 60 extends along the extension direction of the vapor deposition unit 5 (Y direction in this embodiment), and the drive unit 62 rotates the baffle 60 about the rotation center along the extension direction of the vapor deposition unit 5 (Y direction in this embodiment) via the arm member 61.

[0047] In this embodiment, the baffle unit 6 has two sets of baffles 60. The outlet (nozzle) of the vapor deposition unit 5 can be opened and closed relative to the transport chamber 20c by means of the two baffles 60, thereby restricting the release of vapor deposition material into the transport chamber 20c and restricting the incident angle.

[0048] An anti-adhesion member 4 is provided on the upper part of the vapor deposition unit 5 and around the baffle 7 to inhibit the adhesion of vapor deposition material to the surrounding area. The anti-adhesion member 4 has a square cylindrical shape with open top and bottom and is arranged from the internal space 30a to the conveying chamber 20c.

[0049] In the vapor deposition apparatus 3, monitoring units 7A and 7B are also provided at one end in the Y direction to monitor the release state of the vapor deposition material from the vapor deposition unit 5. Monitoring unit 7A, as a first monitoring component, corresponds to vapor deposition source 5A, which is the first vapor deposition source, and monitoring unit 7B, as a second monitoring component, corresponds to vapor deposition source 5B, which is the second vapor deposition source. An anti-adhesion member 8 is provided between the monitoring units 7A and 7B and the vapor deposition sources 5A and 5B. At the other end in the Y direction of the vapor deposition apparatus 3, monitoring units and an anti-adhesion member 8 corresponding to the vapor deposition sources 5A and 5B are also provided, but... Figure 2 Only the monitoring unit 7C corresponding to the vapor deposition source 5A is shown in the diagram.

[0050] Figure 3 This is an explanatory diagram illustrating an example of the operation of the film-forming apparatus 1. The film-forming apparatus 1 is a linear type capable of performing a film-forming method in which a workpiece is conveyed via a conveying device 2 (conveyance process) while a vapor deposition device 3 deposits a vapor deposition substance onto the workpiece (vapor deposition process). The film-forming apparatus 1 can be applied, for example, to manufacturing apparatuses that perform methods for manufacturing electronic devices or optical components, such as display devices (flat panel displays, etc.), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements).

[0051] exist Figure 3 In this example, substrate 10 is shown as the object to be processed. Substrate 10 is transported together with mask 11, and vapor deposition material is deposited onto substrate 10 through mask 11 located below substrate 10, thereby forming a thin film of vapor deposition material with a predetermined pattern on substrate 100. Substrate 10 is, for example, a plate made of materials such as glass, resin, or metal, and the vapor deposition material is an organic material, an inorganic material (metal, metal oxide, etc.), or a substance.

[0052] In this embodiment, multiple vapor deposition sources 5A and 5B are arranged in the transport direction of the substrate 10. Different types of vapor deposition materials can be emitted by the vapor deposition apparatuses 5A and 5B. For example, vapor deposition source 5A emits Ag as a vapor deposition material, and vapor deposition source 5B emits Mg as a vapor deposition material.

[0053] exist Figure 3 In the example, the discharge range of the vapor deposition sources 5A and 5B is limited by the baffle 60, and the vapor deposition material of each vapor deposition source 5A and 5B is discharged to approximately the same area relative to the substrate 10. Thus, in this embodiment, vapor deposition material can be deposited onto the substrate 10 by multiple vapor deposition sources 5A and 5B.

[0054] <Monitoring Unit and Anti-Adhesion Components>

[0055] Apart from Figure 1 , Figure 2 External reference Figure 4 (A) Figure 5 The monitoring units 7A and 7B and the anti-adhesion component 8 are described. Figure 4 (A) is Figure 2 An enlarged view of part 7A of the monitoring unit. Figure 5 It is along Figure 2 A cross-sectional view of the vapor deposition apparatus 3 for the B-B line.

[0056] Monitoring units 7A and 7B are supported on support member 9. Support member 9 has a partition wall 90 between monitoring units 7A and 7B and vapor deposition sources 5A and 5B, and windows 9a and 9b are formed in the partition wall 90, extending through the partition wall 90 in its thickness direction. Monitoring units 7A and 7B are disposed behind the partition wall 90, particularly behind the windows 9a and 9b.

[0057] The monitoring unit 7A has a crystal oscillator 7a inside its housing as a film thickness sensor. Evaporated material emitted from the evaporation source 5A is introduced through an inlet 7b formed in the housing and adheres to the crystal oscillator 7a. The inlet 7b faces the window 9a. The frequency of the crystal oscillator 7a varies according to the amount of evaporated material adhered. By monitoring the frequency of the crystal oscillator 7a, the emission state of the evaporation source 5A, such as the film thickness of the evaporated material deposited on the substrate 10, can be monitored. The monitoring unit 7B also uses the same structure to monitor the emission state of the evaporation source 5B.

[0058] The vapor deposition unit 5 has a housing 50, on the upper surface of which are formed a plurality of nozzles 5a for discharging vapor deposition material from vapor deposition source 5A and a plurality of nozzles 5b for discharging vapor deposition material from vapor deposition source 5B. The plurality of nozzles 5a are arranged in the Y direction, and the plurality of nozzles 5b are also arranged in the Y direction.

[0059] Monitoring unit 7A is disposed relative to vapor deposition source 5A in the Y direction, which is the first direction, and in this embodiment, it is located on the extension line of the arrangement direction of the plurality of nozzles 5a. Monitoring unit 7B is disposed relative to vapor deposition source 5B in the Y direction, and in this embodiment, it is located on the extension line of the arrangement direction of the plurality of nozzles 5b. Relative to monitoring unit 7A, monitoring unit 7B is disposed in a second direction (the X direction in this embodiment) that intersects the Y direction.

[0060] Monitoring units 7A and 7B are separately disposed from the vapor deposition unit 5 in the Y direction, and an anti-adhesion member 8 is provided between the monitoring units 7A and 7B and the vapor deposition unit 5. The anti-adhesion member 8 includes: a wall portion 80 extending in the Y direction; a wall portion 81 extending from the wall portion 80 in a direction intersecting the Y direction; and a wall portion 82 extending from the wall portion 80 in a direction intersecting the Y direction on the side of the wall portion 80 opposite to the wall portion 81.

[0061] The wall portion 80 is a flat plate-shaped component in the Y-Z plane, positioned in the X direction between the plurality of nozzles 5a and 5b, particularly at the very center. In this embodiment, wall portions 81 and 82 extend continuously in the X direction and are flat plate-shaped components in the X-Z plane. Connecting portions 8a at the ends of wall portions 81 and 82 in the Y direction of wall portion 80, on the side of monitoring units 7A and 7B, are connected to wall portion 80. Connecting portions 8a are located in the Y direction between vapor deposition sources 5A and 5B and monitoring units 7A and 7B. The anti-adhesion member 8 has a T-shape when viewed from above.

[0062] Reference Figure 5 The function of the anti-adhesion component 8 will be explained. The vapor-deposited material is introduced from nozzle 5a along the path indicated by line L1 into monitoring unit 7A. Additionally, the vapor-deposited material is introduced from nozzle 5b along the path indicated by line L2 into monitoring unit 7B. Each monitoring unit 7A and 7B monitors the emission status of its corresponding vapor-deposited sources 5A and 5B.

[0063] On the other hand, the vapor-deposited material emitted from nozzle 5a disperses radially, and therefore sometimes disperses towards monitoring unit 7B along the path indicated by line L3. If the vapor-deposited material from vapor deposition source 5A reaches monitoring unit 7B, the monitoring accuracy of vapor deposition source 5B decreases. Similarly, the vapor-deposited material emitted from nozzle 5b sometimes disperses towards monitoring unit 7A along the path indicated by line L5, and if the vapor-deposited material from vapor deposition source 5B reaches monitoring unit 7A, the monitoring accuracy of vapor deposition source 5A decreases.

[0064] The wall portion 80 prevents crosstalk of the vapor-deposited material. That is, by providing the wall portion 80, the vapor-deposited material is prevented from scattering from the vapor deposition source 5A to the monitoring unit 7B along the path indicated by line L3. Similarly, the vapor-deposited material is prevented from scattering from the vapor deposition source 5B to the monitoring unit 7A along the path indicated by line L5.

[0065] On the other hand, the wall portion 80 reaches a high temperature because the vapor-deposited material adheres and accumulates from each vapor deposition source 5A and vapor deposition source 5B. Therefore, radiant heat from the vapor deposition source 5A is sometimes reflected from the wall portion 80 towards the monitoring unit 7A along the path indicated by line L4. If the temperature of the monitoring unit 7A rises, the monitoring accuracy of the vapor deposition source 5A decreases. The wall portion 81 suppresses such radiant heat from the vapor deposition source 5A from reaching the monitoring unit 7A. Similarly, radiant heat from the vapor deposition source 5B is sometimes reflected from the wall portion 80 towards the monitoring unit 7B along the path indicated by line L6. If the radiant heat from the vapor deposition source 5B reflected by the wall portion 80 reaches the monitoring unit 7B, the monitoring accuracy of the vapor deposition source 5B decreases. The wall portion 82 suppresses such reflected radiant heat from the vapor deposition source 5B from reaching the monitoring unit 7B.

[0066] Thus, in this embodiment, by providing the anti-adhesion component 8, the monitoring accuracy of the monitoring unit can be improved.

[0067] <Structural Examples of Anti-Adhesion Components>

[0068] The anti-adhesion component 8 can be adopted in various ways depending on the specifications and usage of the vapor deposition source 5A and vapor deposition source 5B. Figure 6 The anti-adhesion member 8A of (A) is provided with two sets of wall portions 81 and 82, which are respectively connected to the connecting portions 8a of the end of the wall portion 80 in the Y direction on the monitoring unit 7A and the monitoring unit 7B side, and the connecting portions 8b of the end of the vapor deposition source 5A and the vapor deposition source 5B side, forming an H-shape when viewed from above. The wall portions 81 and 82 connected to the connecting portions 8b mainly prevent crosstalk of the vapor deposition material and the reflected radiant heat from the vapor deposition source 5A and the vapor deposition source 5B from reaching the monitoring unit 7A and the monitoring unit 7B.

[0069] Figure 6 The anti-adhesion member 8B of (B) does not have a wall portion 81; instead, it is formed by wall portions 80 and 82. The wall portion 80 is positioned in the X direction between the plurality of nozzles 5a and 5b, offset from the center towards the monitoring unit 7A and the vapor deposition source 5A. The anti-adhesion member 8B has an L-shape when viewed from above. The anti-adhesion member 8B is a structure that facilitates prevention, for example, when the vapor deposition source 5B has a greater impact from crosstalk and the arrival of reflected radiant heat compared to the vapor deposition source 5A.

[0070] Figure 6 The anti-adhesion member 8C of (C) is provided with two wall portions 82, and one of the wall portions 82 is connected to the connecting portion 8c at the midpoint of the wall portion 80 in the Y direction. This structure is beneficial for preventing the radiant heat that is reflected from the wall portion 80 and reaches the monitoring unit 7B.

[0071] Figure 6 The anti-adhesion member 8D of (D) is provided with three wall portions 81 and 82, which are connected to the connecting portions 8a, 8b at the ends of the wall portion 80 in the Y direction and the connecting portion 8c at the middle part. It is a structure that is beneficial to prevent crosstalk and prevent radiant heat from being reflected from the wall portion 80 to the monitoring unit 7A and the monitoring unit 7B.

[0072] Figure 7The anti-adhesion member 8E of (A) does not have a wall portion 81, and is constituted by a wall portion 80 and two wall portions 82. The two wall portions 82 are respectively connected to the connecting portions 8a and 8b at the ends of the wall portion 80 in the Y direction, and the anti-adhesion member 8E has a C-shape (or U-shape) when viewed from above. The anti-adhesion member 8E is a structure that is advantageous for preventing, for example, when the radiant heat reaching the monitoring unit 7B reflected by the wall portion 80 is greater than the radiant heat reaching the monitoring unit 7A.

[0073] Figure 7 The anti-adhesion member 8F of (B) replaces wall portions 81 and 82 with wall portions 83 and 84 extending in opposite directions. The extending directions of wall portions 83 and 84 are inclined from the X direction. Wall portion 83 extends obliquely from the connecting portion 8a towards the vapor deposition source 5A, and wall portion 84 extends obliquely from the connecting portion 8a towards the vapor deposition source 5B. The anti-adhesion member 8F has an arrow shape when viewed from above. It can prevent radiant heat from being reflected from the wall portion 80 to the monitoring unit 7A and the monitoring unit 7B while shortening the width of wall portions 83 and 84.

[0074] Figure 8 The anti-adhesion member 8G of (A) has two separate wall portions 80 in the X direction. The ends of the two wall portions 80 on the vapor deposition source 5A and vapor deposition source 5B sides are connected by wall portions 85. The connection point of the wall portions 85 can also be the midpoint of the two wall portions 80 in the Y direction. Wall portion 81 is connected to the wall portion 80 on the monitoring unit 7A side at the connection point 8a, and wall portion 82 is connected to the wall portion 80 on the monitoring unit 7B side at the connection point 8a. By providing two wall portions 80, the temperature rise of the anti-adhesion member 8G can be suppressed, and the radiant heat reaching the device reflected by the wall portions 80 can be reduced.

[0075] Figure 8 The anti-adhesion component 8H of (B) is in Figure 8 In the example of (A), such as Figure 7 In example (B), inclined wall portions 83 and 84 are set instead of wall portions 81 and 82, as in example (B). Figure 8 The anti-adhesion component 8I of (C) is in Figure 8 In example (A), multiple wall portions 81 and 82 are provided, but two wall portions 81 and 82 are provided. One wall portion 81 and 82 is connected to the end connection portion 8a of the wall portion 80, and the other wall portion 81 and 82 is connected to the middle connection portion 8c of the wall portion 80. Figure 8 The (D) anti-adhesion component 8J is in Figure 8 In example (C), such as Figure 7 In example (B), inclined wall portions 83 and 84 are set instead of wall portions 81 and 82, as in example (B).

[0076] Figure 9 The anti-adhesion member 8K of (A) has two wall portions 80 separately provided in the X direction, but unlike... Figure 8 In example (A), the two wall portions 80 are not connected. Wall portion 81 is provided at both ends of the wall portion 80 in the Y direction on the monitoring unit 7A side, and wall portion 82 is provided at both ends of the wall portion 80 in the Y direction on the monitoring unit 7B side. This structural example can also suppress the temperature rise of the anti-adhesion member 8K and reduce the radiant heat reaching the device reflected by the wall portion 80. Figure 9 Example (B) is in Figure 9 In the example of (A), such as Figure 7 In example (B), inclined wall portions 83 and 84 are set instead of wall portions 81 and 82, as in example (B).

[0077] In this way, the anti-adhesion component 8 can be used in various ways. Figure 6 (A) Figure 9 The construction example illustrated in (B) can also be appropriately combined. That is, as long as the connection part 8a between the wall part 80 and the wall part 81 is located in the Y direction between the vapor deposition source 5A and the vapor deposition source 5B and the monitoring unit 7A and the monitoring unit 7B, the anti-adhesion member 8 can be adopted in various ways.

[0078] In this embodiment, two vapor deposition sources 5A and 5B are provided, and two corresponding monitoring units 7A and 7B are also provided at one end of the vapor deposition apparatus 3 in the Y direction. However, more than three vapor deposition sources and more than three corresponding monitoring units can also be provided. In this case, the number of anti-adhesion components is one less than the number of vapor deposition sources and monitoring units.

[0079] <Electronic Devices>

[0080] Below, an example of an electronic device will be described. The structure of an organic EL display device will be illustrated below as an example of an electronic device.

[0081] First, the organic EL display device to be manufactured will be explained. Figure 10 (A) is an overall view of the organic EL display device 500. Figure 10 (B) is a diagram showing the cross-sectional structure of 1 pixel.

[0082] like Figure 10 As shown in (A), a plurality of pixels 52, each equipped with a plurality of light-emitting elements, are arranged in a matrix in the display area 51 of the organic EL display device 500. Details will be described later, but each light-emitting element has a structure having an organic layer sandwiched between a pair of electrodes.

[0083] Furthermore, the term "pixel" as used herein refers to the smallest unit capable of displaying a desired color in the display area 51. In the case of a color organic EL display device, pixel 52 is constituted by a combination of multiple sub-pixels, namely a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, which emit different colors from each other. Pixel 52 is typically composed of a combination of three types of sub-pixels: red (R) light-emitting elements, green (G) light-emitting elements, and blue (B) light-emitting elements, but is not limited to this. Pixel 52 may contain at least one type of sub-pixel, preferably two or more types, and more preferably three or more types. For example, the sub-pixels constituting pixel 52 may also be a combination of four types of sub-pixels: red (R) light-emitting elements, green (G) light-emitting elements, blue (B) light-emitting elements, and yellow (Y) light-emitting elements.

[0084] Figure 10 (B) is Figure 10 A partial cross-sectional view along line A-B of (A). Pixel 52 has multiple sub-pixels composed of an organic EL element having a first electrode (anode) 54, a hole transport layer 55, a red layer 56R, a green layer 56G, a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. The hole transport layer 55, red layer 56R, green layer 56G, blue layer 56B, and electron transport layer 57 are equivalent to organic layers. The red layer 56R, green layer 56G, and blue layer 56B are respectively formed into patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue light, respectively.

[0085] Furthermore, the first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 can be formed commonly across multiple light-emitting elements 52R, 52G, and 52B, or they can be formed for each light-emitting element. That is, they can also be formed as follows: Figure 10 As shown in (B), after the hole transport layer 55 is formed as a common layer across multiple sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B are formed separately for each sub-pixel region. Then, on top of this, the electron transport layer 57 and the second electrode 58 are formed as a common layer across multiple sub-pixel regions.

[0086] Furthermore, to prevent short circuits between the adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Also, since the organic EL layer is susceptible to degradation due to moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

[0087] exist Figure 10In (B), the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but depending on the structure of the organic EL display element, they can also be formed by multiple layers having a hole blocking layer and an electron blocking layer. Alternatively, a hole injection layer with a band structure can be formed between the first electrode 54 and the hole transport layer 55 to allow holes to be smoothly injected from the first electrode 54 into the hole transport layer 55. Similarly, an electron injection layer can also be formed between the second electrode 58 and the electron transport layer 57.

[0088] The red layer 56R, green layer 56G, and blue layer 56B can each be formed from a single light-emitting layer, or they can be formed by stacking multiple layers. For example, the red layer 56R can be composed of two layers, with the upper layer being a red light-emitting layer and the lower layer being a hole transport layer or an electron blocking layer. Alternatively, the lower layer can be a red light-emitting layer and the upper layer can be an electron transport layer or a hole blocking layer. By setting layers on the lower or upper sides of the light-emitting layers in this way, the light-emitting position and optical path length in the light-emitting layers can be adjusted, thereby improving the color purity of the light-emitting element.

[0089] Furthermore, an example of red layer 56R is shown here, but green layer 56G and blue layer 56B can also adopt the same structure. Additionally, the number of layers can be two or more. Moreover, layers of different materials can be stacked, such as a light-emitting layer and an electron-blocking layer, or layers of the same material can be stacked, for example, two or more light-emitting layers.

[0090] In the manufacture of such electronic devices, the above-described film-forming apparatus 1 can be used. The manufacturing method can include a conveying process of conveying a substrate 53 via a conveying device 2 and a vapor deposition process of vapor deposition of at least one layer on the conveyed substrate 53 via a vapor deposition apparatus 3.

[0091] The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the claims are appended to disclose the scope of the invention.

Claims

1. A film forming apparatus characterized by comprising: Possessing: a first evaporation source that discharges an evaporation material toward a substrate; a first monitoring member that is disposed in a first direction with respect to the first evaporation source and monitors a discharge state of the evaporation material from the first evaporation source; a second evaporation source that is disposed in a second direction intersecting the first direction with respect to the first evaporation source and discharges an evaporation material toward the substrate; and a second monitoring member that is disposed in the first direction with respect to the second evaporation source and monitors a discharge state of the evaporation material from the second evaporation source, characterized in that the film formation apparatus possesses an anti-adhesion member that suppresses scattering of the evaporation material from the first evaporation source toward the second monitoring member and suppresses scattering of the evaporation material from the second evaporation source toward the first monitoring member, the anti-adhesion member possesses: a first wall portion that is disposed extending in the first direction; and a second wall portion that is disposed extending from the first wall portion in a direction intersecting the first direction, a connection portion of the first wall portion and the second wall portion is located between the first evaporation source and the second evaporation source and the first monitoring member and the second monitoring member in the first direction.

2. The film formation apparatus according to claim 1, characterized in that the anti-adhesion member possesses a third wall portion that is disposed extending from the first wall portion on a side opposite the second wall portion in a direction intersecting the first direction, a connection portion of the first wall portion and the third wall portion is located between the first evaporation source and the second evaporation source and the first monitoring member and the second monitoring member in the first direction.

3. The film formation apparatus according to claim 2, characterized in that the second wall portion and the third wall portion are continuously disposed extending in the second direction.

4. The film formation apparatus according to claim 2, characterized in that the second wall portion and the third wall portion are disposed extending in different directions from each other.

5. The film formation apparatus according to claim 1, characterized in that the anti-adhesion member has a plurality of the second wall portions separated in the first direction.

6. The film formation apparatus according to claim 2, characterized in that the anti-adhesion member has a plurality of the third wall portions separated in the first direction.

7. The film formation apparatus according to claim 2, characterized in that the first wall portion, the second wall portion, and the third wall portion are located between the first evaporation source and the second evaporation source and the first monitoring member and the second monitoring member in the first direction.

8. The film formation apparatus according to claim 1, characterized in that the anti-adhesion member possesses: a third wall portion that is disposed extending in the first direction and separated from the first wall portion in the second direction; and a fourth wall portion that is disposed extending from the third wall portion on a side opposite the first wall portion in a direction intersecting the first direction.

9. The film formation apparatus according to claim 8, characterized in that ​ The anti-adhesion member has a fifth wall portion that extends in the second direction and connects the first wall portion and the third wall portion.

10. The film formation apparatus according to claim 9, wherein The first wall portion and the third wall portion have a first end portion on a side of the first evaporation source and the second evaporation source and a second end portion on a side of the first monitoring member and the second monitoring member, The fifth wall portion connects the first wall portion and the third wall portion at the first end portion.

11. A film formation method, comprising: a step of forming a film on a substrate using the film formation apparatus according to any one of claims 1 to 10.

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