A silicon wafer cleaning device for single crystal silicon production

Abstract

The application relates to the technical field of semiconductor manufacturing, in particular to a silicon wafer cleaning device for monocrystalline silicon production, which comprises a silicon wafer basket, a clamping mechanism, a moving assembly and a sliding rod, the clamping mechanism is arranged in the silicon wafer basket, the clamping mechanism comprises a first clamping assembly, a second clamping assembly, a third clamping assembly,..., and an Nth clamping assembly, and the adjacent clamping assemblies are used for clamping silicon wafers; the moving assembly comprises a first guide plate and a second guide plate, the first guide plate and the second guide plate are both slidably arranged in the silicon wafer basket, the first guide plate is provided with a first track, and the second guide plate is provided with a second track; the sliding rod is slidably arranged in the silicon wafer basket and is arranged between the first guide plate and the second guide plate; and the sliding rod is used for cleaning the silicon wafers when moving along the first track and the second track. The first guide plate, the second guide plate and the sliding rod are arranged, the silicon wafers are intermittently leaked out from the clamped part, and therefore the clamped part of the silicon wafers can be cleaned.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a silicon wafer cleaning apparatus for monocrystalline silicon production. Background Technology

[0002] From the moment a silicon wafer is pulled from a single-crystal silicon rod, it undergoes slicing, grinding, and polishing processes. In between, it comes into contact with various chemical reagents such as polishing agents and abrasives, and is also contaminated by particulate matter. The quality of silicon wafer cleaning has a decisive impact on device performance, so it is necessary to remove these impurities thoroughly.

[0003] Impurities adsorbed on the surface of silicon wafers can be classified into three types: molecular, ionic, and atomic. Among them, molecular impurities have a weaker adsorption force on the silicon wafer surface and are generally removed first. Ionic and atomic impurities are chemically adsorbed impurities with a stronger adsorption force and are generally removed after molecular impurities are cleaned.

[0004] Existing cleaning devices cannot effectively clean silicon wafers when the wafers are clamped between the toothed posts, resulting in impurities still adhering to the surface of the cleaned wafers and affecting device performance. Summary of the Invention

[0005] Therefore, it is necessary to provide a silicon wafer cleaning device for monocrystalline silicon production, addressing the problems existing in current cleaning devices.

[0006] The above objectives are achieved through the following technical solutions:

[0007] A silicon wafer cleaning apparatus for monocrystalline silicon production, comprising:

[0008] Silicon wafer flower basket;

[0009] A clamping mechanism is disposed within the silicon wafer basket. The clamping mechanism includes a first clamping component, a second clamping component, ..., an Nth clamping component, with adjacent clamping components used to clamp the silicon wafer.

[0010] A movable component, comprising a first guide plate and a second guide plate, both of which are slidably disposed within the silicon wafer basket. A first track is provided on the first guide plate, and a second track is provided on the second guide plate.

[0011] A sliding rod is slidably disposed within the silicon wafer basket, and the sliding rod is disposed between the first guide plate and the second guide plate;

[0012] The sliding rod is used to clean the silicon wafer as it moves along the first and second tracks.

[0013] In one embodiment, the first track and the second track have the same structure; the first track includes a first guide surface, a second guide surface, a third guide surface, a fourth guide surface, a fifth guide surface, a sixth guide surface, a seventh guide surface and an eighth guide surface, wherein the first guide surface, the third guide surface, the fifth guide surface and the seventh guide surface are curved surfaces, and the second guide surface, the fourth guide surface, the sixth guide surface and the eighth guide surface are all vertical planes.

[0014] In one embodiment, the heights of the second guide surface, the fourth guide surface, the sixth guide surface, and the sixth guide surface are set values.

[0015] In one embodiment, the first clamping assembly includes a first clamping plate, a second clamping plate, a first toothed post, a second toothed post, a first elastic member, and a second elastic member; the first clamping plate and the second clamping plate have the same structure; the first clamping plate is provided with a first mounting hole and a second mounting hole, the first toothed post is slidably disposed in the first mounting hole, one end of the first elastic member is fixedly connected to the first toothed post, and the other end is fixedly connected to the first clamping plate; the second toothed post is slidably disposed in the second mounting hole, one end of the second elastic member is fixedly connected to the second toothed post, and the other end is fixedly connected to the first clamping plate.

[0016] In one embodiment, a first guide post is provided in the first mounting hole; a second guide post is provided in the second mounting hole; a first guide groove is provided on the first toothed post, and the first guide groove and the first guide post cooperate; a second guide groove is provided on the second toothed post, and the second guide groove and the second guide post cooperate.

[0017] In one embodiment, the cleaning device further includes a third elastic element, a fourth elastic element, a fifth elastic element, and a sixth elastic element; a first connecting shaft is provided on the first guide plate; a second connecting shaft is provided on the second guide plate; one end of the third elastic element is fixedly connected to one end of the first connecting shaft, and the other end is fixedly connected to the silicon wafer basket; one end of the fourth elastic element is fixedly connected to the other end of the first connecting shaft, and the other end is fixedly connected to the silicon wafer basket; one end of the fifth elastic element is fixedly connected to one end of the second connecting shaft, and the other end is fixedly connected to the silicon wafer basket; one end of the sixth elastic element is fixedly connected to the other end of the second connecting shaft, and the other end is fixedly connected to the silicon wafer basket.

[0018] In one embodiment, a plurality of perforations are uniformly formed on the sidewall of the silicon wafer basket.

[0019] In one embodiment, the bottom of the silicon wafer basket is provided with a plurality of through holes evenly distributed.

[0020] In one embodiment, the cleaning device further includes a drive element for providing a driving force for the movement of the sliding rod.

[0021] The beneficial effects of this invention are:

[0022] This invention relates to a silicon wafer cleaning apparatus for monocrystalline silicon production, comprising a silicon wafer basket, a clamping mechanism, a moving assembly, and a sliding rod. The clamping mechanism is disposed within the silicon wafer basket and includes a first clamping assembly, a second clamping assembly, ..., an Nth clamping assembly, with adjacent clamping assemblies used to clamp the silicon wafer. The moving assembly includes a first guide plate and a second guide plate, both slidably disposed within the silicon wafer basket. A first track is provided on the first guide plate, and a second track is provided on the second guide plate. The sliding rod is slidably disposed within the silicon wafer basket, positioned between the first and second guide plates. The sliding rod cleans the silicon wafer as it moves along the first and second tracks. By configuring the first guide plate, the second guide plate, and the sliding rod, the clamped portion of the silicon wafer is intermittently exposed, thereby ensuring that the clamped portion of the silicon wafer can be cleaned and maintaining device performance.

[0023] When a portion of a silicon wafer is exposed while being clamped on one side, the distance between the silicon wafer on that side and its adjacent wafer increases, resulting in better flow of chemical agents and improved cleaning performance.

[0024] By setting guide grooves on the toothed post and guide posts in the mounting hole, when the part of the silicon wafer being clamped is intermittently exposed, the first and second toothed posts rotate and rub the clamped surface of the silicon wafer, resulting in a better cleaning effect on the clamped part of the silicon wafer. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural schematic diagram of a silicon wafer cleaning apparatus for monocrystalline silicon production provided in an embodiment of the present invention.

[0026] Figure 2 This is a three-dimensional structural schematic diagram of a silicon wafer cleaning device for monocrystalline silicon production that removes the silicon wafer basket according to an embodiment of the present invention.

[0027] Figure 3 This is an exploded structural diagram of a silicon wafer cleaning device for monocrystalline silicon production that removes the silicon wafer basket, according to an embodiment of the present invention.

[0028] Figure 4 This is a front view of a silicon wafer cleaning apparatus for monocrystalline silicon production that removes the silicon wafer basket according to an embodiment of the present invention.

[0029] Figure 5This is a schematic diagram illustrating the working principle of a silicon wafer cleaning device for monocrystalline silicon production that removes the silicon wafer basket, according to an embodiment of the present invention.

[0030] Figure 6 This is a top view of a silicon wafer cleaning apparatus for monocrystalline silicon production that removes the silicon wafer basket, according to an embodiment of the present invention.

[0031] Figure 7 This is an exploded view of the first clamping component of a silicon wafer cleaning apparatus for monocrystalline silicon production according to an embodiment of the present invention.

[0032] in:

[0033] 100. Silicon wafer basket; 110. First mounting post; 120. Second mounting post; 130. Drain hole;

[0034] 200. Clamping mechanism; 210. First clamping assembly; 211. First clamping plate; 2111. First mounting hole; 2112. First guide post; 212. First toothed post; 2121. First compression spring; 2122. First guide groove; 213. Second clamping plate; 2131. Second mounting hole; 2132. Second guide post; 214. Second toothed post; 2141. Second compression spring; 2142. Second guide groove; 220. Second clamping assembly; 230. Third clamping assembly; 240. Fourth clamping assembly;

[0035] 300. Moving component; 310. First guide plate; 311. First guide surface; 312. Second guide surface; 313. Third guide surface; 314. Fourth guide surface; 320. First connecting shaft; 321. First lever; 322. Second lever; 330. Second guide plate; 331. Fifth guide surface; 332. Sixth guide surface; 333. Seventh guide surface; 334. Eighth guide surface; 340. Second connecting shaft; 341. Third lever; 342. Fourth lever;

[0036] 400, sliding rod; 401, guide block. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0038] The serial numbers assigned to components in this document, such as "first," "second," etc., are merely used to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] like Figures 1 to 7 As shown, an embodiment of the present invention provides a silicon wafer cleaning device for monocrystalline silicon production, used for cleaning silicon wafers. In this embodiment, the silicon wafer cleaning device for monocrystalline silicon production includes a silicon wafer basket 100, a clamping mechanism 200, a moving component 300, and a sliding rod 400. The silicon wafer basket 100 is a cuboid shell without a top cover, and has a long side and a short side. Multiple perforations 130 are evenly spaced on the long side walls of both sides of the silicon wafer basket 100, and multiple through holes are evenly spaced on the bottom of the silicon wafer basket 100. A first mounting post 110 and a second mounting post 120 are provided on the short side walls of the silicon wafer basket 100, and the first mounting post 110 and the second mounting post 120 are hollow cylinders. The first mounting post 110 and the second mounting post 120 are both connected to the silicon wafer basket 100; there are four first mounting posts 110, two of which are fixedly connected to the short side wall of one side of the silicon wafer basket 100, the axes of the two first mounting posts 110 are coplanar and parallel to the bottom surface of the silicon wafer basket 100, the axes of the two first mounting posts 110 are perpendicular to the short side wall of one side of the silicon wafer basket 100, and the two first mounting posts 110 are symmetrically arranged about the midline of the short side of the silicon wafer basket 100; the other two first mounting posts 110 are fixedly connected to the short side wall of the other side of the silicon wafer basket 100; the four first mounting posts 110 are symmetrically arranged about the silicon wafer basket 100.

[0041] The axis of the second mounting post 120 is coplanar and parallel to the axis of the first mounting post 110; there are four second mounting posts 120, two of which are fixedly connected to the short side wall of one side of the silicon wafer basket 100, the axes of the two second mounting posts 120 are coplanar and parallel to the bottom surface of the silicon wafer basket 100, and the axes of the two second mounting posts 120 are perpendicular to the short side wall of one side of the silicon wafer basket 100. The two second mounting posts 120 are symmetrically arranged about the midline of the short side of the silicon wafer basket 100. The two second mounting posts 120 are installed between the two first mounting posts 110, and are arranged horizontally from left to right as follows: first mounting post 110, second mounting post 120, second mounting post 120, first mounting post 110; the other two second mounting posts 120 are fixedly connected to the short side wall of the other side of the silicon wafer basket 100; the four second mounting posts 120 are symmetrically arranged about the silicon wafer basket 100.

[0042] There are two sets of clamping mechanisms 200, which are set on the inner wall of the long side of the silicon wafer basket 100, and the two sets of clamping mechanisms 200 are symmetrically arranged about the silicon wafer basket 100. The clamping mechanism 200 includes a first clamping component 210, a second clamping component 220, a third clamping component 230, a fourth clamping component 240... and an Nth clamping component. For ease of description, N is set to four. The clamping components are set between adjacent holes 130. The adjacent clamping components are used to clamp the silicon wafer. The first clamping component 210, the second clamping component 220, the third clamping component 230 and the fourth clamping component 240 have the same structure.

[0043] The moving assembly 300 includes a first guide plate 310, a first connecting shaft 320, a second guide plate 330, and a second connecting shaft 340. A first track is provided on the first guide plate 310, and along the first track, from top to bottom in the vertical direction, a fourth guide surface 314, a third guide surface 313, a second guide surface 312, a first guide surface 311, a fifth guide surface 331, a sixth guide surface 332, a seventh guide surface 333, and an eighth guide surface 334 are sequentially arranged. The axis of the first connecting shaft 320 is perpendicular to the first guide plate 310, and the first connecting shaft 320 is located in the middle of the first guide plate 310. There are two first connecting shafts 320, and both first connecting shafts 320... The first connecting shaft 320 is fixedly connected to the first guide plate 310 and is symmetrically arranged about the first guide plate 310. The first connecting shaft 320 is provided with a first lever 321 and a second lever 322 perpendicular to the axis of the first connecting shaft 320. There is a set distance between the first lever 321 and the second lever 322, and there are multiple sets of the first lever 321 and the second lever 322. There are two through holes between the two first connecting shafts 320 and the two through holes are symmetrically arranged about the first guide plate 310. There is a set distance between the two through holes.

[0044] The second guide plate 330 is provided with a second track, which, judging from its shape alone, is obtained by rotating the first track by 180 degrees. On the second track, from top to bottom vertically, are arranged the eighth guide surface 334, the seventh guide surface 333, the sixth guide surface 332, the fifth guide surface 331, the first guide surface 311, the second guide surface 312, the third guide surface 313, and the fourth guide surface 314. The axis of the second connecting shaft 340 is perpendicular to the second guide plate 330, and the second connecting shaft 340 is positioned... At the center of the second guide plate 330, there are two second connecting shafts 340. Both second connecting shafts 340 are fixedly connected to the second guide plate 330 and are symmetrically arranged about the second guide plate 330. A third lever 341 and a fourth lever 342 perpendicular to the axis of the second connecting shaft 340 are provided on the second connecting shaft 340. There is a set distance between the third lever 341 and the fourth lever 342. There are multiple sets of third levers 341 and fourth levers 342.

[0045] The first guide surface 311, the third guide surface 313, the fifth guide surface 331 and the seventh guide surface 333 are curved or inclined surfaces, while the second guide surface 312, the fourth guide surface 314, the sixth guide surface 332 and the eighth guide surface 334 are vertical surfaces.

[0046] The first connecting shaft 320 has one end that can slide left and right and is fitted into the left first mounting post 110, and the other end that can slide left and right and is fitted into the right first mounting post 110; the second connecting shaft 340 passes through the through hole on the first guide plate 310, and one end of the second connecting shaft 340 can slide left and right and is fitted into the left second mounting post 120, and the other end that can slide left and right and is fitted into the right second mounting post 120; the first lever 321 and the second lever 322 are offset from the third lever 341 and the fourth lever 342 in the vertical direction.

[0047] A guide block 401 is sleeved on the sliding rod 400. A through hole is provided at the bottom of the silicon wafer basket 100. The sliding rod 400 can slide up and down and is sleeved on the through hole. The sliding rod 400 is located between the first guide plate 310 and the second guide plate 330.

[0048] By setting the first guide plate 310, the second guide plate 330 and the sliding rod 400, the clamped part of the silicon wafer is intermittently exposed, thereby allowing the clamped part of the silicon wafer to be cleaned.

[0049] In some embodiments, by setting different heights for the second guide surface 312, the fourth guide surface 314, the sixth guide surface 332, and the eighth guide surface 334, the cleaning time for the clamped portion of the silicon wafer is different, thereby meeting different cleaning requirements.

[0050] It is understandable that the heights of the second guide surface 312, the fourth guide surface 314, the sixth guide surface 332, and the eighth guide surface 334 can be different or the same.

[0051] In some embodiments, the first clamping assembly 210 includes a first clamping plate 211, a second clamping plate 213, a first toothed post 212, a second toothed post 214, a first elastic element, and a second elastic element. In this embodiment, the first elastic element is a first compression spring 2121, and the second elastic element is a second compression spring 2141. The first clamping plate 211 and the second clamping plate 213 have the same structure, and the second clamping plate 213 is obtained by rotating the first clamping plate 211 by 180 degrees. The first toothed post 212 and the second toothed post 214 have the same structure, and the second toothed post 214 is obtained by rotating the first toothed post 212 by 180 degrees.

[0052] The first clamping plate 211 and the second clamping plate 213 are arranged vertically from top to bottom, and there is a set distance between the first clamping plate 211 and the second clamping plate 213. One end of the first clamping plate 211 is fixedly connected to the inner wall of the long side of the silicon wafer basket 100. A first mounting hole 2111 is provided at the upper position of one side wall of the end of the first clamping plate 211 away from the silicon wafer basket 100, and a second mounting hole 2131 is provided at the lower position of the other side wall. The axis of the first mounting hole 2111 and the second mounting hole 2131 are... The axes of the mounting holes 2131 are coplanar and the plane is perpendicular to the bottom surface of the silicon wafer basket 100; the first toothed post 212 can slide left and right in the first mounting hole 2111, one end of the first compression spring 2121 is fixedly connected to the first clamping plate 211, and the other end is fixedly connected to the first toothed post 212; the second toothed post 214 can slide left and right in the second mounting hole 2131, one end of the second compression spring 2141 is fixedly connected to the second clamping plate 213, and the other end is fixedly connected to the second toothed post 214.

[0053] In some embodiments, a first guide post 2112 is provided vertically downward on the inner circumferential wall of the first mounting hole 2111, and a second guide post 2132 is provided vertically upward on the inner circumferential wall of the second mounting hole 2131; a first guide groove 2122 is provided on the first toothed post 212, which is used to cooperate with the first guide post 2112; a second guide groove 2142 is provided on the second toothed post 214, which is used to cooperate with the second guide post 2132.

[0054] By setting guide grooves on the toothed post and guide posts in the mounting hole, when the part of the silicon wafer being clamped is intermittently exposed, the first toothed post 212 and the second toothed post 214 have a rotating motion, which rubs the clamped surface of the silicon wafer, resulting in a better cleaning effect on the clamped part of the silicon wafer.

[0055] In some embodiments, the silicon wafer cleaning apparatus for monocrystalline silicon production further includes a third elastic element, a fourth elastic element, a fifth elastic element, and a sixth elastic element; in this embodiment, the third elastic element is a third compression spring, the fifth elastic element is a fourth compression spring, the fourth elastic element is a first tension spring, and the sixth elastic element is a second tension spring; one end of the third compression spring is fixedly connected to the first connecting shaft 320, and the other end is fixedly connected to the inner wall of the left first mounting post 110; one end of the first tension spring is fixedly connected to the first connecting shaft 320, and the other end is fixedly connected to the inner wall of the right first mounting post 110; one end of the second tension spring is fixedly connected to the second connecting shaft 340, and the other end is fixedly connected to the inner wall of the left second mounting post 120; one end of the fourth compression spring is fixedly connected to the second connecting shaft 340, and the other end is fixedly connected to the inner wall of the right second mounting post 120.

[0056] In some embodiments, a plurality of perforations 130 are evenly spaced on the long sidewalls of both sides of the silicon wafer basket 100, allowing the chemical agents to flow fully.

[0057] Understandably, multiple perforations 130 can also be evenly arranged on the short sidewalls of both sides of the silicon wafer basket 100.

[0058] In some embodiments, the bottom of the silicon wafer basket 100 is uniformly provided with a plurality of through holes, which allow the chemical agents to flow fully.

[0059] In some embodiments, the silicon wafer cleaning apparatus for monocrystalline silicon production further includes a driving component, which provides a driving force for the movement of the sliding rod 400. In this embodiment, the driving component is an electric cylinder, which is fixedly installed at the bottom of the chemical tank. The output shaft of the electric cylinder can be connected to the sliding rod 400 through a nut. The electric cylinder drives the sliding rod 400 to move up and down at a uniform speed in the vertical direction.

[0060] It is understandable that the output shaft of the electric cylinder can also be magnetically connected to the sliding rod 400. That is, an electromagnet is provided at the end of the output shaft of the electric cylinder, and a magnet is provided at the lower end of the sliding rod 400. When it is necessary to connect the output shaft of the electric cylinder and the lower end of the sliding rod 400, the electromagnet at the end of the output shaft of the electric cylinder is made magnetic by energizing it, thereby connecting the output shaft of the electric cylinder and the lower end of the sliding rod 400 together. When it is necessary to disconnect the output shaft of the electric cylinder and the lower end of the sliding rod 400, the electromagnet at the end of the output shaft of the electric cylinder is made demagnetized by de-energizing it, thereby separating the output shaft of the electric cylinder and the lower end of the sliding rod 400.

[0061] Based on the above embodiments, the usage principle and working process of the embodiments of the present invention are as follows:

[0062] The general steps for cleaning silicon wafers are: removing molecular impurities, removing ionic impurities, removing atomic impurities, and finally rinsing with high-purity water to obtain clean silicon wafers.

[0063] The silicon wafer cleaning apparatus for monocrystalline silicon production provided in one embodiment of the present invention can be applied to the entire process of cleaning silicon wafers, and preferably is used in the process of removing molecular impurities.

[0064] During the preparation phase, the silicon wafers to be cleaned are clamped between adjacent clamping components, namely, silicon wafer A is clamped between the first clamping component 210 and the second clamping component 220, silicon wafer B is clamped between the second clamping component 220 and the third clamping component 230, and silicon wafer C is clamped between the third clamping component 230 and the fourth clamping component 240; and the first toothed post 212 and the second toothed post 214 on the first clamping component 210, the second clamping component 220, the third clamping component 230 and the fourth clamping component 240 are used to clamp the silicon wafers.

[0065] The silicon wafer basket 100 is placed at a designated position in the chemical solution tank, which is filled with chemical agents. These agents flow upwards under the action of a water pump and can overflow from the tank. An electric cylinder is installed at the bottom of the tank, and its drive shaft is fixedly connected to one end of a sliding rod 400, thus positioning the silicon wafer cleaning device for monocrystalline silicon production in a specific position. Figure 4 and Figure 6 The state is such that the guide block 401 is located in the middle of the first guide plate 310, the first lever 321 corresponds to the first clamping assembly 210, the third lever 341 corresponds to the second clamping assembly 220, the second lever 322 corresponds to the third clamping assembly 230, and the fourth lever 342 corresponds to the fourth clamping assembly 240.

[0066] Assume the distance between adjacent silicon wafers is twelve, that is, the distance between silicon wafer A and silicon wafer B is twelve, the distance between silicon wafer B and silicon wafer C is twelve, and the distance between silicon wafer C and the fourth silicon wafer is twelve; the width of the first lever 321, the second lever 322, the third lever 341, and the fourth lever 342 is two; the distance between silicon wafer A and the first lever 321 is five, the distance between silicon wafer A and the third lever 341 is five, the distance between silicon wafer B and the third lever 341 is five, the distance between silicon wafer B and the second lever 322 is five, the distance between silicon wafer C and the second lever 322 is five, the distance between silicon wafer C and the fourth lever 342 is five, and the distance between the fourth silicon wafer and the fourth lever 342 is five; the complete ejection amount of the first toothed post 212 and the second toothed post 214 is five.

[0067] During the cleaning stage, the sliding rod 400 moves vertically upward at a constant speed under the drive of the electric cylinder. When the guide block 401 moves from the middle of the first guide plate 310 to between the first guide surface 311 and the second guide surface 312, the first guide plate 310 moves 15 units to the left, causing the first lever 321 and the second lever 322 to move 15 units to the left, causing the second lever 322 to move the silicon wafer B 10 units to the left. At this time, the right side of the silicon wafer B is exposed, and the distance between the silicon wafer B and the silicon wafer C is 22 units, allowing more chemical agents to pass between the silicon wafer B and the silicon wafer C, so that the right side of the silicon wafer B is cleaned, thus cleaning the even-numbered right side of the silicon wafers. The second guide plate 330 moves 5 units to the left, causing the third lever 341 and the fourth lever 342 to move 5 units to the left, so that the third lever 341 is attached to the right side of the silicon wafer A, and the fourth lever 342 is attached to the right side of the silicon wafer C.

[0068] The second guide surface 312 is a vertical surface with a set distance. By setting different set distances, the cleaning time of the clamped part on the right side of the even-numbered silicon wafers is different, so as to meet different cleaning needs.

[0069] When the guide block 401 moves between the third guide surface 313 and the fourth guide surface 314, the first guide plate 310 moves to the right, causing the first lever 321 and the second lever 322 to move to the right, so that the second lever 322 is against the right side of the silicon wafer B, at which point the silicon wafer B is in its initial position; the second guide plate 330 moves to the left, causing the third lever 341 and the fourth lever 342 to move to the left, so that the third lever 341 drives the silicon wafer A to move to the left, exposing the clamped portion of the right side of the silicon wafer A, thus... The distance between silicon wafer A and silicon wafer B is 22, allowing more chemical reagent to pass between them, thus cleaning the right side of silicon wafer A that is being held in place. The fourth lever 342 moves silicon wafer C ten units to the left, exposing the right side of silicon wafer C that is being held in place. This makes the distance between silicon wafer C and the fourth silicon wafer 22, allowing more chemical reagent to pass between them, thus cleaning the right side of silicon wafer C that is being held in place. This ensures that the right side of the odd-numbered silicon wafers that are being held in place are cleaned.

[0070] The fourth guide surface 314 is a vertical surface with a set distance. By setting different set distances, the cleaning time of the clamped part on the right side of the odd-numbered silicon wafer is different, so as to meet different cleaning needs.

[0071] When the guide block 401 moves to the set position of the fourth guide surface 314, the electric cylinder drives the sliding rod 400 to move vertically downward at a constant speed. The above process is repeated so that the right side of all silicon wafers is cleaned.

[0072] When the guide block 401 moves from the middle of the second guide plate 330 to between the first guide surface 311 and the second guide surface 312 at the lower part of the second guide plate 330, the first guide plate 310 moves five units to the right, causing the first lever 321 and the second lever 322 to move five units to the right, so that the first lever 321 is attached to the left side of silicon wafer A, and the second lever 322 is attached to the left side of silicon wafer C; the second guide plate 330 moves fifteen units to the right, causing the third lever 341 and the fourth lever 342 to move fifteen units to the right, so that the third lever 341 drives silicon wafer B to move ten units to the right, so that the left side of silicon wafer B is clamped. The exposure of silicon wafers A and B results in a distance of 22, allowing more chemical reagents to pass between them, thus cleaning the clamped portion of the left side of silicon wafer B. The fourth lever 342 moves 15 to the right, causing it to move the fourth silicon wafer 10 to the right, exposing the clamped portion of the fourth silicon wafer. This results in a distance of 22 between the fourth silicon wafer and silicon wafer C, allowing more chemical reagents to pass between them, thus cleaning the clamped portion of the left side of the fourth silicon wafer. This ensures that the clamped portions of the left sides of even-numbered silicon wafers are cleaned.

[0073] When the guide block 401 moves to the space between the third guide surface 313 and the fourth guide surface 314 at the lower part of the second guide plate 330, the second guide plate 330 moves ten units to the left, causing the third lever 341 and the fourth lever 342 to move ten units to the left, so that silicon wafer B and the fourth silicon wafer are in their initial positions, with the third lever 341 attached to the left side of silicon wafer B and the fourth lever 342 attached to the left side of the fourth silicon wafer; the first guide plate 310 moves ten units to the right, causing the first lever 321 and the second lever 342 to move ten units to the right. 322 moves 10 units to the right, causing the first lever 321 to move silicon wafer A 10 units to the left, thus cleaning the clamped portion of the left side of silicon wafer A; causing the second lever 322 to move silicon wafer C 10 units to the right, thus exposing the clamped portion of the left side of silicon wafer C, making the distance between silicon wafer C and silicon wafer B 22 units, allowing more chemical reagent to pass between silicon wafer C and silicon wafer B, thus cleaning the clamped portion of the left side of silicon wafer C, and thus cleaning the clamped portion of the left side of the odd-numbered silicon wafers.

[0074] When the guide block 401 moves to the set position of the fourth guide surface 314 at the lower part of the second guide plate 330, the electric cylinder drives the sliding rod 400 to move vertically upward at a constant speed. The above process is repeated so that the left side of all silicon wafers is cleaned.

[0075] After setting the cycle for the electric cylinder to drive the sliding rod 400, the silicon wafer basket 100 can be retrieved, facilitating the next step of the process.

[0076] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A silicon wafer cleaning device for monocrystalline silicon production, characterized in that, include: Silicon wafer flower basket; A clamping mechanism is disposed within the silicon wafer basket. The clamping mechanism includes a first clamping component, a second clamping component, ..., an Nth clamping component, with adjacent clamping components used to clamp the silicon wafer. A movable component, comprising a first guide plate and a second guide plate, both of which are slidably disposed within the silicon wafer basket. A first track is provided on the first guide plate, and a second track is provided on the second guide plate. A sliding rod is slidably disposed within the silicon wafer basket, and the sliding rod is disposed between the first guide plate and the second guide plate; The sliding rod is used to clean the silicon wafer as it moves along the first track and the second track; The moving component further includes a first connecting shaft and a second connecting shaft. On the first track, a fourth guide surface, a third guide surface, a second guide surface, a first guide surface, a fifth guide surface, a sixth guide surface, a seventh guide surface, and an eighth guide surface are arranged vertically from top to bottom. The axis of the first connecting shaft is perpendicular to the first guide plate, and the first connecting shaft is located in the middle of the first guide plate. There are two first connecting shafts, both of which are fixedly connected to the first guide plate and are symmetrically arranged about the first guide plate. A first lever and a second lever are provided on the first connecting shaft, perpendicular to the axis of the first connecting shaft. There is a set distance between the first lever and the second lever, and there are multiple sets of the first lever and the second lever. Two through holes are provided between the two first connecting shafts, and the two through holes are closed. The first guide plate is symmetrically arranged with a set distance between the two through holes; the second track is obtained by rotating the first track 180 degrees; on the second track, from top to bottom in the vertical direction, there are an eighth guide surface, a seventh guide surface, a sixth guide surface, a fifth guide surface, a first guide surface, a second guide surface, a third guide surface, and a fourth guide surface; the axis of the second connecting shaft is perpendicular to the second guide plate and the second connecting shaft is located in the middle of the second guide plate. There are two second connecting shafts, both of which are fixedly connected to the second guide plate and are symmetrically arranged about the second guide plate; the second connecting shaft is provided with a third lever and a fourth lever perpendicular to the axis of the second connecting shaft, and there is a set distance between the third lever and the fourth lever. There are multiple sets of the third lever and the fourth lever.

2. The silicon wafer cleaning apparatus for monocrystalline silicon production according to claim 1, characterized in that, The first clamping assembly includes a first clamping plate, a second clamping plate, a first toothed post, a second toothed post, a first elastic element, and a second elastic element; the first clamping plate and the second clamping plate have the same structure; the first clamping plate is provided with a first mounting hole and a second mounting hole, the first toothed post is slidably disposed in the first mounting hole, one end of the first elastic element is fixedly connected to the first toothed post, and the other end is fixedly connected to the first clamping plate; the second toothed post is slidably disposed in the second mounting hole, one end of the second elastic element is fixedly connected to the second toothed post, and the other end is fixedly connected to the first clamping plate.

3. The silicon wafer cleaning apparatus for monocrystalline silicon production according to claim 2, characterized in that, A first guide post is provided in the first mounting hole; a second guide post is provided in the second mounting hole; a first guide groove is provided on the first toothed post, and the first guide groove and the first guide post cooperate; a second guide groove is provided on the second toothed post, and the second guide groove and the second guide post cooperate.

4. The silicon wafer cleaning apparatus for monocrystalline silicon production according to claim 1, characterized in that, The cleaning device further includes a third elastic element, a fourth elastic element, a fifth elastic element, and a sixth elastic element; a first connecting shaft is provided on the first guide plate; a second connecting shaft is provided on the second guide plate; one end of the third elastic element is fixedly connected to one end of the first connecting shaft, and the other end is fixedly connected to the silicon wafer basket; one end of the fourth elastic element is fixedly connected to the other end of the first connecting shaft, and the other end is fixedly connected to the silicon wafer basket; one end of the fifth elastic element is fixedly connected to one end of the second connecting shaft, and the other end is fixedly connected to the silicon wafer basket; one end of the sixth elastic element is fixedly connected to the other end of the second connecting shaft, and the other end is fixedly connected to the silicon wafer basket.

5. The silicon wafer cleaning apparatus for monocrystalline silicon production according to claim 1, characterized in that, The silicon wafer basket has multiple drainage holes evenly distributed on its side wall surface.

6. The silicon wafer cleaning apparatus for monocrystalline silicon production according to claim 1, characterized in that, The bottom of the silicon wafer basket is evenly provided with multiple through holes.

7. The silicon wafer cleaning apparatus for monocrystalline silicon production according to claim 1, characterized in that, The cleaning device further includes a drive unit for providing driving force for the movement of the sliding rod.

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