An electron gun device for preventing the base film of a micro-capacitor from being scalded and a method for preventing scalding

Abstract

The present invention discloses an electron gun device for preventing the micro-capacitor base film from being scalded, which comprises an emission cavity. A molecular pump and an emission component are installed on one side of the emission cavity, and an emission port is opened on the other side. A protective cover is sleeved outside the emission component, and the protective cover is fixedly connected to an interface flange. The outside of the emission port is communicated with an emission channel. One end of the emission channel is fixedly connected to the emission cavity, and the other end of the emission channel is connected to a focusing channel. A focusing coil is sleeved on the focusing channel. One side of the focusing coil is connected to a focusing coil cooling sleeve, and the other side of the focusing coil cooling sleeve is connected to a base flange. The base flange is connected to a partition plate. A deflection channel is arranged at the other end of the focusing channel, and the deflection channel is connected to the partition plate. A deflection coil is installed on the deflection channel. This device is applied to a vacuum coating machine, and can bombard the base film with electron beams, making the base film be passively charged with sufficient and uniform electric charge, so that the base film can be tightly and evenly adsorbed on the main hub.

Description

Technical Field

[0001] The present invention relates to the technical field of micro-capacitor production, and particularly to an electron gun device for preventing the base film of a micro-capacitor from being scalded and a method for preventing scalding. Background Art

[0002] A vacuum coating machine mainly refers to a type of coating that needs to be carried out under a relatively high vacuum. Specifically, it includes many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD pulsed laser deposition, etc. Among them, the substrate to be coated is called the base film, and the material to be coated is called the target. In evaporation coating, generally, the substrate and the target are placed in the same vacuum chamber. The target is heated so that the surface components are evaporated in the form of atomic clusters or ions and deposited on the surface of the substrate, and a thin film is formed through the film-forming process. In a vacuum coating machine, conventionally, the base film is tightened on the main hub by an external force so that the base film fits with the main hub. When the 1500 °C aluminum vapor on the surface of the base film condenses by reducing the temperature of the main hub, it will not be scalded. However, when the base film is tightened by an external force, the fit with the main hub is not tight enough, and the degree of fit is not uniform enough. The local base film and the main hub are not tightly fitted, resulting in the partial failure of the rapid heat conduction function of the main hub and causing local scalding of the base film. Eventually, the qualified rate of mass-produced micro-capacitors is lower than 70%.

[0003] To solve the above problems, this paper proposes an electron gun with specific parameters to bombard the base film with an electron beam, making the base film passively charged with sufficient and uniform electric charges, which can achieve the goal of the base film fitting with the main hub. The electron gun with specific parameters can ensure that the electron beam will not burn the base film during the bombardment process and will not cause damage such as stretching or scalding. And after continuous condensation and heat release of 1600 °C aluminum vapor and 800 °C zinc vapor, it can still ensure the qualified rate of subsequent micro-capacitors. Without the influence of other factors, the internal high voltage of the micro-capacitor is significantly increased, and the qualified rate exceeds 99%. Summary of the Invention

[0004] The object of the present invention is to provide an electron gun device and a scald prevention method for preventing the base film of a micro-capacitor from being scalded, so as to solve the problems mentioned in the background art. To achieve the above object, the present invention provides the following technical solution: An electron gun device for preventing the base film of a micro-capacitor from being scalded, including an emission cavity, a connection port and an installation port are opened on one side of the emission cavity, an emission port is opened on the other side, a molecular pump is installed on the connection port, an interface flange is installed on the installation port, the interface flange is bolted to a ventilation flange, the ventilation flange is connected to an emission component, the emission end of the emission component is located inside the emission cavity and faces the emission port, a protective cover is sleeved outside the emission component, the protective cover is fixedly connected to the interface flange, the outside of the emission port is communicated with an emission channel, one end of the emission channel is fixedly connected to the emission cavity, the other end of the emission channel is connected to a focusing channel, a focusing coil is sleeved on the focusing channel, one side of the focusing coil is connected to a focusing coil cooling sleeve, the other side of the focusing coil cooling sleeve is connected to a base flange, the base flange is connected to a partition plate, the other end of the focusing channel is provided with a deflection channel and is communicated with each other, the deflection channel is connected to the partition plate, and a deflection coil is installed on the deflection channel.

[0005] Preferably, the emission component includes an electrode plate and a conductive rod. The middle of the electrode plate is connected to one end of a conductive rod Ⅰ, the other end of the conductive rod Ⅰ is connected to one end of an electrode rod, the conductive rod is connected to one end of a conductive ring, an insulating pad is installed between the conductive ring and the electrode plate, the other end of the conductive ring is connected to one end of a filament base, the other end of the filament base is connected to a filament conductive rod, the filament conductive rod is connected to a filament joint, the other end of the electrode rod passes through the filament base and is connected to a conductive rod Ⅱ, an insulating pad Ⅰ is installed between the filament conductive rod and the electrode rod, the conductive rod Ⅱ is connected to a filament conductive rod Ⅰ through an electrode piece, the filament conductive rod Ⅰ is connected to a filament joint Ⅰ, the two ends of a tungsten wire are installed inside the filament joint and the filament joint Ⅰ, a emission head structure is provided at the front end of the tungsten wire, a filament cover is sleeved outside the outer end of the tungsten wire, the filament cover is insulated and connected to the filament base, an insulating protective shell is fixedly installed outside the front ends of the filament base and the conductive ring, an aluminum heat dissipation ring is connected to the rear end of the conductive ring, an electron emission port is opened in the middle of the front end of the filament cover, and the emission head structure is located inside the electron emission port.

[0006] Preferably, a cooling flange is fixed inside the emission port, a through hole is opened on the cooling flange, the through hole is in a horn shape, and the through hole faces the emission end of the emission component.

[0007] Preferably, a plug valve seat is sleeved outside the emission channel, a plug valve is installed on the plug valve seat, and the bottom of the plug valve extends into the emission channel.

[0008] Preferably, a fan installation cavity is provided at the end of the protective cover, a fan is fixed inside the fan installation cavity, and the fan faces the emission component.

[0009] Preferably, the deflection coil includes a horizontal deflection coil and a vertical deflection coil.

[0010] Preferably, a sealing ring is provided at the connection between the emission channel and the emission cavity.

[0011] Preferably, KF flanges are provided on both sides of the emission cavity.

[0012] A method for preventing scalding of the base film of a micro capacitor in an electron gun device, specifically including the following steps:

[0013] (1), During the operation of the vacuum winding type capacitor coating machine, first thread one end of the base film into the winding type coating machine, and move the winding type coating machine along the movement guide rail into the vacuum cavity; Turn on the vacuum pumping device to make the vacuum environment of the equipment reach -5 mbar; Turn on the GNS water cooling system to reduce the temperature of the main hub to -16 °C; Turn on the fan at the tail of the electron gun and turn on the electron gun.

[0014] (2), Pass a current of 20 A through the emission component of the electron gun to electrically heat the emission component; Then apply a high voltage of 6000 V (current is 5 - 10 mA) to the heated emission component; The emission component emits electrons; Under the combined action of the focusing coil, the horizontal deflection coil, and the vertical deflection coil, the electrons form an electron beam and bombard the base film; And adjust the coil parameters and current parameters, the end of the electron beam (close to the hub end) can move horizontally and vertically on the surface of the main hub, and the horizontal displacement distance is sufficient to cover the width of the base film, and the vertical deflection coil can adjust the bombardment point position up and down.

[0015] (3), The main hub rotates, driving the base film to be transported forward at a speed of 10 m / s, and the diameter of the electron beam is about 2 cm; Use an 1800 Hz sine wave signal generator to control the horizontal deflection; The same point on the base film will be scanned 3 - 4 times to ensure that each point on the base film carries enough negative charges.

[0016] (4), After the base film is charged negatively, it is adsorbed on the main hub and fits tightly, and the heat on the outer surface and the inner surface of the base film can be conducted to the main hub more quickly; The winding type coating machine moves to the evaporation system, the aluminum evaporation dish of the evaporation system evaporates upward, and the aluminum vapor is at 1600 °C; The zinc evaporation dish evaporates upward, and the temperature of the zinc vapor is 800 °C; The base film is transported forward at a speed of 10 m / s and is in direct contact with the high temperature for about 0.1 s. Under the action of the GNS water cooling system, the temperature of the base film is closer to the temperature of the main hub (-16 °C), effectively avoiding local scalding.

[0017] (5), With the bombardment of the electron gun and the transmission of the main hub, the base film is first coated with aluminum and then with zinc.

[0018] (6) After the static eliminator of the whole machine removes the static electricity, the entire coated film is wound into a roll.

[0019] Technical effects and advantages of the present invention: This device is applied to a vacuum coating machine, which can bombard the base film with an electron beam, making the base film passively charged with sufficient and uniform electric charge, enabling the base film to be tightly and evenly adsorbed on the main hub. When aluminum vapor and zinc vapor release heat on the surface of the base film, the base film will quickly conduct the heat to the main hub; by using a focusing coil and a deflection coil, the focusing of electrons can be achieved to form an electron beam, and the deflection angle of the electron beam can be accurately changed. Brief Description of the Drawings

[0020] Figure 1 is a structural schematic diagram of the present invention;

[0021] Figure 2 is a sectional view of the present invention;

[0022] Figure 3 is a structural view of the emission component of the present invention;

[0023] Figure 4 is a front view of the emission component of the present invention;

[0024] Figure 5 is Figure 4 a sectional view along the A-A direction in

[0025] Figure 6 is a schematic diagram of a vacuum coating machine including an electron gun device.

[0026] In the figure: 1 - Emission chamber 1, 2 - Connection port, 3 - Mounting port, 4 - Emission port, 5 - Molecular pump, 6 - Interface flange, 7 - Ventilation flange, 8 - Emission component, 9 - Protective cover, 10 - Emission channel, 11 - Focusing channel, 12 - Focusing coil, 13 - Focusing coil cooling sleeve, 14 - Base flange, 15 - Partition board, 16 - Deflection channel, 17 - Deflection coil, 18 - Cooling flange, 19 - Through hole, 20 - Gate valve seat, 21 - Gate valve, 22 - Fan mounting cavity, 23 - Fan, 24 - Sealing ring, 25 - KF flange, 26 - Vacuum pumping device, 27 - Vacuum chamber, 28 - Main hub, 29 - Electron gun, 30 - Evaporation system, 31 - Roll-to-roll coating machine, 32 - Motion guide rail, 80 - Electrode plate, 81 - Conductive rod, 82 - Conductive rod I, 83 - Electrode rod, 84 - Conductive ring, 85 - Insulating pad, 86 - Filament base, 87 - Filament conductive rod, 88 - Filament joint, 89 - Conductive rod II, 810 - Insulating pad I, 811 - Electrode piece, 812 - Filament conductive rod I, 813 - Filament joint I, 814 - Tungsten wire, 815 - Emission head structure, 816 - Filament cover, 817 - Insulating protection shell, 818 - Aluminum heat dissipation ring, 819 - Electron emission port. Detailed Description of the Invention

[0027] In order to make the implementation means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, an integral connection or a mechanical connection, and it can also be an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components.

[0028] Embodiment 1

[0029] As Figure 1 - Figure 2 An electron gun device for preventing the base film of a micro capacitor from being scalded, as shown, includes an emission cavity 1. A connection port 2 and an installation port 3 are opened on one side of the emission cavity 1, and an emission port 4 is opened on the other side. A molecular pump 5 is installed on the connection port 2, and an interface flange 6 is installed on the installation port 3. The interface flange 6 is bolted to a ventilation flange 7, and the ventilation flange 7 is connected to an emission assembly 8. The emission end of the emission assembly 8 is located inside the emission cavity 1 and faces the emission port 4. A protective cover 9 is sleeved outside the emission assembly 8, and the protective cover 9 is fixedly connected to the interface flange 6. The outside of the emission port 4 is communicated with an emission channel 10. One end of the emission channel 10 is fixedly connected to the emission cavity 1, and the other end of the emission channel 10 is connected to a focusing channel 11. A focusing coil 12 is sleeved on the focusing channel 11. One side of the focusing coil 12 is connected to a focusing coil cooling sleeve 13, and the other side of the focusing coil cooling sleeve 13 is connected to a base flange 14. The base flange 14 is connected to a partition plate 15. The other end of the focusing channel 11 is provided with a deflection channel 16 and is communicated therewith. The deflection channel 16 is connected to the partition plate 15, and a deflection coil 17 is installed on the deflection channel 16.

[0030] Embodiment 2

[0031] As Figure 1 - Figure 5An electron gun device for preventing the base film of a micro-capacitor from being scalded, comprising an emission cavity 1. On both outer sides of the emission cavity 1, there are KF flanges 25. On one side of the emission cavity 1, there are a connection port 2 and a mounting port 3, and on the other side, there is an emission port 4. A molecular pump 5 is installed on the connection port 2, and an interface flange 6 is installed on the mounting port 3. The interface flange 6 is bolted to a ventilation flange 7, and the ventilation flange 7 is connected to an emission assembly 8. The emission end of the emission assembly 8 is located inside the emission cavity 1. Inside the emission port 4, there is a cooling flange 18, and a through hole 19 is formed on the cooling flange 18. The through hole 19 is in a horn shape and is directly opposite to the emission end of the emission assembly 8. The outside of the emission assembly 8 is covered with a protective cover 9, and the protective cover 9 is fixedly connected to the interface flange 6. At the end of the protective cover 9, there is a fan mounting cavity 22, and a fan 23 is fixedly installed inside the fan mounting cavity 22. The fan 23 is directly opposite to the emission assembly 8. The outside of the emission port 4 is communicated with an emission channel 10. One end of the emission channel 10 is fixedly connected to the emission cavity 1 and the connection part is sealed by a sealing ring 24. The other end of the emission channel 10 is connected to a focusing channel 11. An insertion valve seat 20 is sleeved outside the emission channel 10, and an insertion valve 21 is installed on the insertion valve seat 20. The bottom of the insertion valve 21 extends into the emission channel 10. A focusing coil 12 is sleeved on the focusing channel 11. One side of the focusing coil 12 is connected to a focusing coil cooling sleeve 13, and the other side of the focusing coil cooling sleeve 13 is connected to a base flange 14. The base flange 14 is connected to a partition plate 15. The other end of the focusing channel 11 is provided with a deflection channel 16 and they are communicated with each other. The deflection channel 16 is connected to the partition plate 15, and a deflection coil 17 is installed on the deflection channel 16. The deflection coil 17 includes a horizontal deflection coil and a vertical deflection coil;

[0032] The emission component 8 includes an electrode plate 80 and a conductive rod 81. One end of a conductive rod I 82 is connected to the middle of the electrode plate 80, and the other end of the conductive rod I 82 is connected to one end of an electrode rod 83. One end of the conductive rod 81 is connected to one end of a conductive ring 84. An insulating pad 85 is installed between the conductive ring 84 and the electrode plate 80. The other end of the conductive ring 84 is connected to one end of a filament base 86. The other end of the filament base 86 is connected to a filament conductive rod 87. The filament conductive rod 87 is connected to a filament connector 88. The other end of the electrode rod 83 passes through the filament base 86 and is connected to a conductive rod II 89. An insulating pad I 810 is installed between the filament conductive rod 87 and the electrode rod 83. The conductive rod II 89 is connected to a filament conductive rod I 812 through an electrode piece 811. The filament conductive rod I 812 is connected to a filament connector I 813. Both ends of a tungsten wire 814 are installed inside the filament connector 88 and the filament connector I 812. An emission head structure 815 is provided at the front end of the tungsten wire 814. A filament cover 816 is sleeved outside the tungsten wire 814. The filament cover 816 is insulatingly connected to the filament base 86. An insulating protective shell 817 is fixedly installed on the outer sides of the front ends of the filament base 86 and the conductive ring 84. An aluminum heat dissipation ring 818 is connected to the rear end of the conductive ring 84. An electron emission port 819 is opened in the middle of the front end of the filament cover 816. The emission head structure 815 is located inside the electron emission port 819.

[0033] Start the flap valve 21, connect the power supply through the electrode plate 80 and the conductive rod 81, apply current and voltage to the tungsten wire 814 of the emission component 8. The emission head structure 815 at the front end of the tungsten wire 814 emits electrons, and the electrons pass through the through hole 19 through the electron emission port 819 and enter the emission channel 10. The electrons pass through the flap valve 21 and enter the focusing channel 11. An electron beam is formed by focusing through the focusing coil 12 wound outside the focusing channel 11. The electron beam enters the deflection channel 16. Under the action of the deflection coil 17, the electron beam deflects and bombards the base film; and during the operation of the focusing coil 12, the focusing coil 12 is cooled by a cooling medium inside the focusing coil cooling sleeve 13; the fan 23 is started to dissipate heat from the emission component 8.

[0034] Embodiment 3

[0035] As Figure 1 - Figure 5An electron gun device for preventing the base film of a micro capacitor from being scalded, comprising an emission cavity 1. On both outer sides of the emission cavity 1, there are KF flanges 25. On one side of the emission cavity 1, there are a connection port 2 and a mounting port 3, and on the other side, there is an emission port 4. A molecular pump 5 is installed on the connection port 2, and an interface flange 6 is installed on the mounting port 3. The interface flange 6 is bolted to a ventilation flange 7, and the ventilation flange 7 is connected to an emission assembly 8. The emission end of the emission assembly 8 is located inside the emission cavity 1. Inside the emission port 4, there is a fixed cooling flange 18, and a through hole 19 is opened on the cooling flange 18. The through hole 19 is in a horn shape and is directly opposite to the emission end of the emission assembly 8. The outside of the emission assembly 8 is covered with a protective cover 9. The protective cover 9 is fixedly connected to the interface flange 6. At the end of the protective cover 9, there is a fan mounting cavity 22, and a fan 23 is fixed inside the fan mounting cavity 22. The fan 23 is directly opposite to the emission assembly 8. The outside of the emission port 4 is communicated with an emission channel 10. One end of the emission channel 10 is fixedly connected to the emission cavity 1, and the connection part is sealed by a sealing ring 24. The other end of the emission channel 10 is connected to a focusing channel 11. An insertion valve seat 20 is sleeved outside the emission channel 10, and an insertion valve 21 is installed on the insertion valve seat 20. The bottom of the insertion valve 21 extends into the emission channel 10. A focusing coil 12 is sleeved on the focusing channel 11. One side of the focusing coil 12 is connected to a focusing coil cooling sleeve 13, and the other side of the focusing coil cooling sleeve 13 is connected to a base flange 14. The base flange 14 is connected to a partition plate 15. The other end of the focusing channel 11 is provided with a deflection channel 16 and is communicated with each other. The deflection channel 16 is connected to the partition plate 15. A deflection coil 17 is installed on the deflection channel 16. The deflection coil 17 includes a horizontal deflection coil and a vertical deflection coil.

[0036] A method for preventing scalding of an electron gun device for preventing the base film of a micro capacitor from being scalded, specifically including the following content:

[0037] (1), as Figure 6 shown, during the working process of a vacuum winding type capacitance coating machine, first thread one end of the base film into the winding type coating machine 31, and move the winding type coating machine 31 along the movement guide rail 32 into the vacuum cavity; turn on the vacuum pumping device 26 to make the vacuum cavity 27 of the device reach an environmental condition of -5 mbar; turn on the GNS water cooling system to lower the temperature of the main hub 28 to -16 degrees Celsius; turn on the fan 23 at the tail of the electron gun 29 and turn on the electron gun 29.

[0038] (2) Pass a current of 20 A through the emission component 8 of the electron gun 29 to electrically heat the emission component 8; then apply a high voltage of 6000 V (with a current of 5 - 10 mA) to the heated emission component 8; the emission component 8 emits electrons; under the combined action of the focusing coil 12, the horizontal deflection coil, and the vertical deflection coil, the electrons form an electron beam that bombards the base film; and by adjusting the parameters of the focusing coil 12 and the deflection coil 17 and the current parameters, the end of the electron beam (near the hub end) can move horizontally and vertically on the surface of the main hub 28, and the horizontal displacement distance is sufficient to cover the width of the base film, and the vertical deflection coil can adjust the bombardment point position up and down.

[0039] (3) The main hub 28 rotates to drive the base film to be transported forward at a speed of 10 m / s, and the diameter of the electron beam is about 2 cm; use an 1800 Hz sine wave signal generator to control the horizontal deflection; the same point on the base film will be scanned 3 - 4 times to ensure that each point on the base film carries enough negative charges.

[0040] (4) After the base film is charged negatively, it is adsorbed on the main hub 28 and fits tightly, and the heat on the outer surface and the inner surface of the base film can be conducted to the main hub 28 more quickly; the winding type coating machine 31 moves to the evaporation system 30, the aluminum evaporation dish of the evaporation system 30 evaporates upward, and the aluminum vapor is at 1600 degrees Celsius; the zinc evaporation dish evaporates upward, and the temperature of the zinc vapor is 800 degrees Celsius; the base film is transported forward at a speed of 10 m / s and the direct contact time with the high temperature is about 0.1 s. Under the action of the GNS water cooling system, the temperature of the base film is closer to the temperature of the main hub (-16 °C), effectively avoiding local scalding.

[0041] (5) With the bombardment of the electron gun 29 and the transmission of the main hub 28, the base film is first coated with aluminum and then with zinc.

[0042] (6) After the static eliminator of the whole machine removes the electricity, the whole coated film is wound into a roll.

[0043] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electron gun device for preventing the base film of a micro capacitor from being scalded, comprising an emission cavity, characterized in that: One side of the emission cavity is provided with a connection port and a mounting port, and the other side is provided with an emission port. A molecular pump is installed on the connection port, and an interface flange is installed on the mounting port. The interface flange is bolted to the ventilation flange, and the ventilation flange is connected to the emission assembly. The emission end of the emission assembly is located inside the emission cavity and faces the emission port. A protective cover is sleeved outside the emission assembly, and the protective cover is fixedly connected to the interface flange. The outside of the emission port is communicated with an emission channel. One end of the emission channel is fixedly connected to the emission cavity, and the other end of the emission channel is connected to a focusing channel. A focusing coil is sleeved on the focusing channel. One side of the focusing coil is connected to a focusing coil cooling sleeve, and the other side of the focusing coil cooling sleeve is connected to a base flange. The base flange is connected to a partition plate. The other end of the focusing channel is provided with a deflection channel and is communicated therewith. The deflection channel is connected to the partition plate, and a deflection coil is installed on the deflection channel.

2. The electron gun device for preventing the micro-capacitor base film from being scalded according to claim 1, characterized in that: The emission assembly includes an electrode plate and a conductive rod. The middle of the electrode plate is connected to one end of a conductive rod I. The other end of the conductive rod I is connected to one end of an electrode rod. The conductive rod is connected to one end of a conductive ring. An insulating pad is installed between the conductive ring and the electrode plate. The other end of the conductive ring is connected to one end of a filament base. The other end of the filament base is connected to a filament conductive rod. The filament conductive rod is connected to a filament joint. The other end of the electrode rod passes through the filament base and is connected to a conductive rod II. An insulating pad I is installed between the filament conductive rod and the electrode rod. The conductive rod II is connected to a filament conductive rod I through an electrode piece. The filament conductive rod I is connected to a filament joint I. The two ends of a tungsten wire are installed inside the filament joint and the filament joint I. The front end of the tungsten wire is provided with an emission head structure. A filament cover is sleeved outside the outer end of the tungsten wire. The filament cover is insulated and connected to the filament base. An insulating protective shell is fixedly installed outside the front ends of the filament base and the conductive ring. An aluminum heat dissipation ring is connected to the rear end of the conductive ring. A through hole is opened in the middle of the front end of the filament cover. The emission head structure is located inside the electron emission port.

3. The electron gun device for preventing the base film of a micro-capacitor from being scalded according to claim 1, characterized in that: A cooling flange is fixedly installed inside the emission port. A through hole is opened in the cooling flange. The through hole is in a horn shape and faces the emission end of the emission assembly.

4. The electron gun device for preventing the micro capacitor base film from being scalded according to claim 1, characterized in that: An insertion valve seat is sleeved outside the emission channel. An insertion valve is installed on the insertion valve seat. The bottom of the insertion valve extends into the emission channel.

5. An electron gun device for preventing the base film of a micro-capacitor from being scalded according to claim 1, characterized in that: A fan installation cavity is provided at the end of the protective cover. A fan is fixedly installed inside the fan installation cavity. The fan faces the emission assembly.

6. The electron gun device for preventing the base film of a micro capacitor from being scalded according to claim 1, wherein: The deflection coil includes a horizontal deflection coil and a vertical deflection coil.

7. The electron gun device for preventing the base film of a micro capacitor from being scalded according to claim 1, wherein: A sealing ring is provided at the connection between the emission channel and the emission cavity.

8. An electron gun device for preventing the base film of a micro capacitor from being scalded according to claim 1, characterized in that: KF flanges are provided on both sides of the emission cavity.

9. A method for preventing scalding of the electron gun device for preventing scalding of the base film of a micro capacitor, based on the electron gun device for preventing scalding of the base film of a micro capacitor according to any one of claims 1-8, characterized in that: Specifically, it includes the following contents (1). During the working process of the vacuum winding capacitive coating machine, first introduce one end of the base film into the winding coating machine and move the winding coating machine along the movement guide rail into the vacuum cavity; turn on the vacuum pumping device to make the vacuum cavity of the equipment reach an environmental condition of -5 mbar; turn on the GNS water cooling system to lower the temperature of the main hub to -16 °C; turn on the fan at the tail of the electron gun and turn on the electron gun. (2) Pass a current of 20 A through the emission component of the electron gun to electrically heat the emission component; then apply a high voltage of 6000 V to the heated emission component; electrons are emitted from the emission component; under the combined action of the focusing coil, horizontal deflection coil, and vertical deflection coil, the electrons form an electron beam that bombards the base film; and by adjusting the coil parameters and current parameters, the end of the electron beam moves horizontally and vertically on the surface of the main hub, and the horizontal displacement distance is sufficient to cover the width of the base film, and the vertical deflection coil adjusts the position of the bombardment point up and down; (3) The main hub rotates, driving the base film to be transported forward at a speed of 10 m / s, and the diameter of the electron beam is 2 cm; an 1800 Hz sine wave signal generator is used to control the horizontal deflection; the same point on the base film will be scanned 3 - 4 times to ensure that each point on the base film carries enough negative charge; (4) After the base film is charged negatively, it is adsorbed on the main hub and fits tightly. The heat on the outer surface and the inner surface of the base film is conducted to the main hub more quickly; the winding coating machine moves to the evaporation system. The aluminum evaporation dish of the evaporation system evaporates upward, and the aluminum vapor is at 1600 degrees Celsius; the zinc evaporation dish evaporates upward, and the temperature of the zinc vapor is 800 degrees Celsius; the base film is transported forward at a speed of 10 m / s and directly contacts the high temperature for 0.1 s. Under the action of the GNS water cooling system, the temperature of the base film is closer to the temperature of the main hub, effectively avoiding local scalding; (5) With the bombardment of the electron gun and the transmission of the main hub, the base film is first coated with aluminum and then with zinc; (6) After the static eliminator of the whole machine removes the electricity, the whole coated film is wound into a roll.

Images