Heat dissipation module and manufacturing method thereof

By setting a cover plate and a capillary structure in the heat dissipation module for tight bonding, the problem of discontinuous return of liquid working fluid in the heat pipe and heat spreader combination structure is solved, and smooth return of working fluid and stable improvement of heat dissipation efficiency are achieved.

CN116952033BActive Publication Date: 2026-05-01MICROLOOPS HUIZHOU CORP +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
MICROLOOPS HUIZHOU CORP
Filing Date
2022-04-15
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

In known vapor chamber and heat pipe combination structures, the capillary structure inside the heat pipe fails to adhere to the capillary structure inside the vapor chamber, resulting in discontinuous reflux of the liquid working fluid and reduced heat conduction efficiency.

Method used

By setting a cover plate in the heat dissipation module, the second capillary structure is tightly attached to the first capillary structure, ensuring smooth return of the working fluid. Furthermore, by setting the second capillary structure inside the shell and heat pipe to be tightly attached to the first capillary structure, a stable fluid return path is formed.

Benefits of technology

It achieves smooth return of working fluid and stable heat dissipation efficiency, enhancing the heat dissipation efficiency of the heat dissipation module, especially through the design of bidirectional or multidirectional heat exchange airflow to further improve the heat dissipation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to a heat dissipation module and its manufacturing method. The heat dissipation module includes a housing, a first capillary structure, and at least two heat pipe assemblies. The housing has several sidewalls on its outer periphery, at least two of which are provided with openings and inner edges formed within the openings. The first capillary structure covers the interior of the housing and is arranged along each inner edge. Each heat pipe assembly includes a cover plate, several heat pipes, and a second capillary structure. Each cover plate has several perforations and an inner sidewall. Each heat pipe has an open end, and the open ends of the heat pipes are connected and sealed to the corresponding perforations. Each second capillary structure covers the inner sidewall and the interior of the heat pipes. Each cover plate closes to the corresponding opening, ensuring tight contact between the second and first capillary structures. In this way, the liquid working fluid within the heat dissipation module can smoothly flow back to the first capillary structure via the second capillary structure, achieving stable heat dissipation efficiency.
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Description

Technical Field

[0001] This invention relates to a heat dissipation structure combining a heat spreader and a heat pipe, and more particularly to a heat dissipation module and its manufacturing method. Background Technology

[0002] Heat pipes and vapor chambers are widely used due to their good thermal conductivity. While heat pipes can ensure the uniform flow of the gaseous working fluid inside, their limited volume restricts the amount of heat they can conduct. Vapor chambers, on the other hand, have a large heating area for direct contact with the heat source, but the flow of the gaseous working fluid is quite turbulent, which limits their heat dissipation efficiency.

[0003] Therefore, in order to solve the aforementioned problems, the industry has combined heat pipes and vapor chambers to form a heat-conducting structure, with the heat pipes passing through one side of the vapor chamber and the internal space of the heat pipes and the internal space of the vapor chamber being interconnected.

[0004] However, the known combination structure of heat pipe and heat spreader, although it has heat dissipation performance, has the following problems: the capillary structure inside the heat pipe fails to adhere to the capillary structure inside the heat spreader, which causes interruption or discontinuity in the flow of liquid working fluid, thus greatly reducing its heat dissipation performance.

[0005] In view of this, the inventor has devoted himself to researching and applying theoretical principles to address the aforementioned problems in the prior art, which is the goal of the inventor's development. Summary of the Invention

[0006] The present invention provides a heat dissipation module and its manufacturing method, which utilizes the cover plate corresponding to the opening to close and cause the second capillary structure to be tightly attached to the first capillary structure, so as to achieve the advantages of smooth working fluid return and stable heat dissipation efficiency of the heat dissipation module.

[0007] In an embodiment of the present invention, the present invention provides a heat dissipation module, comprising: a housing having a plurality of sidewalls on its outer periphery, at least two of the plurality of sidewalls respectively having a vent and an inner edge formed inside the vent; a first capillary structure covering the interior of the housing and arranged along each of the inner edges; and at least two heat pipe assemblies, each heat pipe assembly comprising a cover plate, a plurality of heat pipes and a second capillary structure, each cover plate having a plurality of perforations and an inner sidewall, each heat pipe having an open end, each heat pipe being sealed by the open end corresponding to each of the perforations, each second capillary structure covering each of the inner sidewalls and the interior of the plurality of heat pipes; wherein each cover plate is closed corresponding to each vent, so that each second capillary structure and the first capillary structure are in close contact with each other.

[0008] In an embodiment of the present invention, the present invention also provides a method for manufacturing a heat dissipation module, the steps of which include: a) providing a housing, the outer periphery of which has a plurality of sidewalls, at least two of which are respectively provided with a vent and an inner edge formed inside the vent; b) providing a first capillary structure, covering the interior of the housing and arranging the first capillary structure along each of the inner edges; c) providing at least two cover plates, each cover plate having a plurality of perforations, and each cover plate having an inner sidewall; d) providing a plurality of heat pipes, each heat pipe having an open end, and sealing each heat pipe by connecting the open end to each of the perforations; e) providing at least two second capillary structures, covering each of the second capillary structures on each of the inner sidewalls and inside the plurality of heat pipes; and f) covering each of the cover plates to each of the vents, such that each of the second capillary structures and the first capillary structure are in close contact with each other.

[0009] Based on the above, the outer periphery of each second capillary structure is in close contact with the outer periphery of the first capillary structure, thereby ensuring that the first capillary structure and each second capillary structure will be in continuous contact, allowing the liquid working fluid inside the heat dissipation module to flow smoothly back from the heat pipe to the first capillary structure of the shell through the second capillary structure, so as to achieve the advantages of smooth working fluid return and stable heat dissipation efficiency of the heat dissipation module.

[0010] Based on the above, at least two of the several side walls of the shell are provided with ventilation openings, and each heat pipe assembly is installed in the corresponding ventilation opening, so that the heat dissipation module has a double-sided or multi-sided heat pipe structure, allowing the heat dissipation module to have bidirectional or multidirectional heat exchange airflow, thereby enhancing the heat dissipation efficiency of the heat dissipation module. Attached Figure Description

[0011] Figure 1 This is a flowchart illustrating the steps of manufacturing the heat dissipation module of the present invention.

[0012] Figure 2 This is a schematic diagram of the first capillary structure of the present invention covering the inside of the shell and arranged along each inner edge.

[0013] Figure 3 This is a schematic diagram of the second capillary structures of the present invention covering the inner sidewalls and the interior of several heat pipes.

[0014] Figure 4 This is a schematic diagram of the present invention showing how each cover plate is intended to cover the corresponding opening.

[0015] Figure 5 This is a three-dimensional assembly diagram of the heat dissipation module of the present invention.

[0016] Figure 6 This is a cross-sectional schematic diagram of the heat dissipation module of the present invention.

[0017] Figure 7 This is another cross-sectional view of the heat dissipation module of the present invention.

[0018] Figure 8 This is another three-dimensional assembly view of the heat dissipation module of the present invention.

[0019] Figure 9 This is another three-dimensional assembly diagram of the heat dissipation module of the present invention.

[0020] Figure 10 This is a cross-sectional schematic diagram of another embodiment of the heat dissipation module of the present invention.

[0021] Figure 11 This is a top view schematic diagram of another embodiment of the heat dissipation module of the present invention.

[0022] Explanation of symbols in the attached diagram:

[0023] 10: Heat dissipation module;

[0024] 1: Shell;

[0025] 11: Side wall;

[0026] 111: Opening;

[0027] 112: Inner rim;

[0028] 12: Top wall;

[0029] 13: Bottom wall;

[0030] 2: First capillary structure;

[0031] 21: Support column;

[0032] 3: Heat pipe assembly;

[0033] 31: Cover plate;

[0034] 311: Perforation;

[0035] 312: Inner wall;

[0036] 313: Positioning ring;

[0037] 314: Inclined torus;

[0038] 32: Heat pipe;

[0039] 321: Open end;

[0040] 322: Closed end;

[0041] 323: Third capillary structure;

[0042] 33: Second capillary structure;

[0043] 4: Fin assembly;

[0044] 41: Fins;

[0045] 5: Fan assembly;

[0046] 51: Fixed base;

[0047] 52: Fan;

[0048] 100: Heating element;

[0049] Steps a~f Detailed Implementation

[0050] The detailed description and technical content of the present invention will be explained in conjunction with the accompanying drawings. However, the accompanying drawings are for illustrative purposes only and are not intended to limit the present invention.

[0051] Please refer to Figures 1 to 9 As shown, the present invention provides a heat dissipation module and its manufacturing method. The heat dissipation module 10 mainly includes a housing 1, a first capillary structure 2 and at least two heat pipe assemblies 3.

[0052] like Figure 1 The diagram shows the steps of manufacturing the heat dissipation module 10 of the present invention. First, as shown... Figure 1 Step a and Figure 2 As shown, a housing 1 is provided. The outer periphery of the housing 1 has a plurality of sidewalls 11. At least two of the sidewalls 11 are respectively provided with a vent 111 and an inner edge 112 formed inside the vent 111.

[0053] In addition, such as Figure 2 , Figures 4 to 9 As shown, the housing 1 further has a top wall 12 and a bottom wall 13, the top wall 12 or the bottom wall 13 is used for thermal bonding to the heating element 100, and several side walls 11 are disposed between the top wall 12 and the bottom wall 13 and surround the outer periphery of the top wall 12 and the bottom wall 13.

[0054] In this embodiment, the shell 1 is rectangular, but this is not a limitation. The shell 1 can be any geometric shape such as triangle or pentagon. In this embodiment, there are two side walls 11 with openings 111 that are opposite to each other, but this is not a limitation. The number and position of the side walls 11 with openings 111 can be adjusted according to the actual installation environment.

[0055] Second, such as Figure 1 Step b and Figure 2 As shown, a first capillary structure 2 is provided, which is covered inside the housing 1 and arranged along each inner edge 112.

[0056] Furthermore, such as Figure 2 , Figure 4 , Figures 6 to 7 As shown, the shell 1 has several support columns 21 inside, with their two ends respectively abutting against the top wall 12 and the bottom wall 13, thereby strengthening the structural strength of the shell 1 and preventing the shell 1 from deforming.

[0057] Third, such as Figure 1 Step c and Figure 3 As shown, at least two cover plates 31 are provided, each cover plate 31 has a plurality of perforations 311, and each cover plate 31 has an inner sidewall 312.

[0058] Detailed explanation is as follows, such as Figures 3 to 9 As shown, each inner sidewall 312 extends with a positioning ring 313 surrounding a plurality of perforations 311. The inner periphery of each positioning ring 313 has an inclined annular surface 314 whose diameter gradually increases in the direction away from the inner sidewall 312, and the outer periphery dimension of each inclined annular surface 314 is larger than the inner periphery dimension of the first capillary structure 2 arranged along each inner edge 112.

[0059] Fourth, such as Figure 1 Step d and Figure 3 As shown, several heat pipes 32 are provided. Each heat pipe 32 has an open end 321 at one end and a closed end 322 at the other end. Each heat pipe 32 is connected and sealed with its open end 321 corresponding to each perforation 311. That is, each heat pipe 32 is connected with its open end 321 corresponding to each perforation 311 and welded to the cover plate 31 along the perforation 311.

[0060] Fifth, such as Figure 1 Step e and Figure 3 As shown, at least two second capillary structures 33 are provided, and each second capillary structure 33 is coated on each inner sidewall 312 and inside the plurality of heat pipes 32.

[0061] Further explanation is as follows, such as Figures 3 to 4 , Figures 6 to 7As shown, each second capillary structure 33 is filled inside each positioning ring 313 and covered on each inclined ring surface 314 so that each second capillary structure 33 is securely covered on each inner sidewall 312.

[0062] Each heat pipe assembly 3 includes a cover plate 31, several heat pipes 32, and a second capillary structure 33. In this embodiment, each second capillary structure 33 covers the entire interior area of ​​the several heat pipes 32, but this is not a limitation. The first capillary structure 2 and the second capillary structure 33 are each a powder sintered body.

[0063] Sixth, such as Figure 1 Step f and Figures 4 to 7 As shown, each cover plate 31 is closed to each corresponding opening 111, that is, each cover plate 31 is welded to the shell 1 along the opening 111, so that each second capillary structure 33 and the first capillary structure 2 are tightly attached to each other.

[0064] Finally, the present invention further provides a working fluid (not shown in the figure), which is filled into the housing 1 and several heat pipes 32, and the housing 1 and several heat pipes 32 are evacuated and sealed to complete the heat dissipation module 10. The housing 1, the cover plate 31 and the first capillary structure 2 together constitute a heat spreader.

[0065] like Figures 8 to 9 As shown, the heat dissipation module 10 of the present invention further includes a fin group 4 and a fan group 5. The fin group 4 includes a plurality of fins 41 sleeved on a plurality of heat pipes 32. The fan group 5 includes a fixing seat 51 stacked with the fin group 4 and a plurality of fans 52 mounted on the fixing seat 51 and configured corresponding to the housing 1 and the plurality of heat pipes 32. The fin group 4 and the fan group 5 are used to improve the heat dissipation efficiency of the heat dissipation module 10.

[0066] like Figures 4 to 7 As shown, the heat dissipation module 10 of the present invention is used in the following manner: a first capillary structure 2 is covered inside the housing 1 and arranged along each inner edge 112; a second capillary structure 33 is covered on each inner sidewall 312 and inside several heat pipes 32. When each cover plate 31 is closed corresponding to each opening 111, because the outer periphery of each second capillary structure 33 overlaps with the outer periphery of the first capillary structure 2, each cover plate 31 will drive each second capillary structure 33 to push the first capillary structure 2, so that the outer periphery of each second capillary structure 33 and the outer periphery of the first capillary structure 2 are in close contact with each other, thereby ensuring that the first capillary structure 2 and each second capillary structure 33 will be in continuous contact, allowing the liquid working fluid to flow smoothly back from the heat pipes 32 to the first capillary structure 2 of the housing 1 through the second capillary structure 33, so that the heat dissipation module 10 has the advantages of smooth working fluid return and stable heat dissipation efficiency.

[0067] In addition, such as Figures 8 to 9As shown, the top wall 12 or bottom wall 13 of the housing 1 is thermally attached to the heating element 100. At least two of the several side walls 11 are provided with ventilation openings 111. Each heat pipe assembly 3 is installed corresponding to the ventilation openings 111, so that the heat dissipation module 10 has a structure of double-sided or multi-sided heat pipes 32, so that the heat dissipation module 10 has bidirectional or multidirectional heat exchange airflow, thereby enhancing the heat dissipation efficiency of the heat dissipation module 10.

[0068] Furthermore, each second capillary structure 33 fills the interior of each positioning ring 313 and covers each inclined ring surface 314. The positioning ring 313 can increase the structural strength of the second capillary structure 33, making the second capillary structure 33 less prone to deformation and having sufficient strength to squeeze the first capillary structure 2. The inclined ring surface 314 can expand the contact area of ​​the second capillary structure 33.

[0069] Please refer to Figure 10 The image shows another embodiment of the heat dissipation module 10 of the present invention. Figure 10 Implementation examples and Figures 1 to 9 The embodiments are largely the same. Figure 10 Implementation examples and Figures 1 to 9 The difference in the embodiments is that each heat pipe 32 has a third capillary structure 323 inside.

[0070] The following is a detailed description: In this embodiment, each heat pipe 32 has a third capillary structure 323 inside. Each second capillary structure 33 covers the interior of each open end 321 and is stacked on top of each third capillary structure 323, but this is not a limitation. The first capillary structure 2 and the second capillary structure 33 are each a powder sintered body, and the third capillary structure 323 is any one or a combination of a powder sintered body, a mesh body, a fiber body, and a groove. This achieves the same effect as... Figures 1 to 9 The functions and effects of the embodiments.

[0071] Please refer to Figure 11 The image shows another embodiment of the heat dissipation module 10 of the present invention. Figure 11 Implementation examples and Figures 1 to 9 The embodiments are largely the same. Figure 11 Implementation examples and Figures 1 to 9 The difference in the embodiment is that the number of sidewalls 11 with ventilation openings 111 and heat pipe assemblies 3 are three, but this is not a limitation. The number and position of the sidewalls 11 with ventilation openings 111 can be adjusted according to the actual accommodating space of the heat dissipation module 10, and each heat pipe assembly 3 is installed corresponding to each ventilation opening 111.

[0072] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of patent protection of the present invention. Therefore, all equivalent changes made based on the description or drawings of the present invention are similarly included within the scope of protection of the present invention and are hereby stated.

Claims

1. A heat dissipation module, characterized in that, include: A shell is a rectangular cylinder with two openings arranged opposite each other and a top wall, a bottom wall, a left wall and a right wall surrounding the outer periphery of the two openings, and an inner edge formed inside each opening. A first capillary structure covers the interior of the shell and is arranged along each of the inner edges; as well as At least two heat pipe assemblies, each heat pipe assembly includes a cover plate, a plurality of heat pipes and a second capillary structure, each cover plate is provided with a plurality of perforations and has an inner sidewall, each heat pipe has an open end, each heat pipe is connected and sealed with the open end corresponding to each of the perforations, and each of the second capillary structures is covered on each of the inner sidewalls and inside the plurality of heat pipes. Each of the cover plates covers the corresponding openings, so that each of the second capillary structures and the first capillary structure are tightly attached to each other. Each of the inner sidewalls extends with a positioning ring surrounding the plurality of perforations. Each of the second capillary structures is filled inside the positioning ring. The inner periphery of each positioning ring has an inclined ring surface whose diameter gradually increases in the direction away from the inner sidewall. The outer periphery dimension of each inclined ring surface is larger than the inner periphery dimension of the first capillary structure arranged along the inner edge of each of the inner openings. Each of the second capillary structures is covered on the inclined ring surface.

2. The heat dissipation module according to claim 1, characterized in that, The interior of the shell also has several support columns at both ends that abut against the top wall and the bottom wall.

3. The heat dissipation module according to claim 1, characterized in that, Each of the second capillary structures covers the entire area inside the plurality of heat pipes.

4. The heat dissipation module according to claim 1, characterized in that, Each heat pipe has a third capillary structure inside, and each second capillary structure covers the interior of each open end and is stacked on top of each third capillary structure.

5. The heat dissipation module according to claim 1, characterized in that, It also includes a fin assembly and a fan assembly. The fin assembly includes several fins that are sleeved on the heat pipes. The fan assembly includes a mounting base that is stacked with the fin assembly and several fans that are mounted on the mounting base and configured to correspond to the housing and the heat pipes.

6. A method for manufacturing a heat dissipation module, characterized in that the steps include... include: a) Provide a housing, which is a rectangular cylinder, having two openings arranged opposite each other and having a top wall, a bottom wall, a left wall and a right wall surrounding the outer periphery of the two openings, and an inner edge formed inside each opening. b) Provide a first capillary structure, which covers the interior of the housing and is arranged along each of the inner edges; c) Provide at least two cover plates, each of which has several perforations, and each of which has an inner sidewall. Each inner sidewall extends with a positioning ring surrounding the several perforations. The inner periphery of each positioning ring has an inclined annular surface whose diameter gradually increases in the direction away from the inner sidewall, and the outer periphery dimension of each inclined annular surface is larger than the inner periphery dimension of the first capillary structure arranged along each inner periphery. d) Provide several heat pipes, each heat pipe having an open end, and seal each heat pipe by passing the open end through each of the perforations. e) providing at least two second capillary structures, each second capillary structure being coated on each of the inner sidewalls and inside the plurality of heat pipes, each second capillary structure being filled inside each of the positioning rings and coated on each of the inclined ring surfaces; and f) Cover each of the cover plates with the corresponding openings, so that each of the second capillary structures and the first capillary structure are tightly attached to each other.

7. The method for manufacturing a heat dissipation module according to claim 6, characterized in that, In step e), each of the second capillary structures covers the entire area inside the plurality of heat pipes.

8. The method for manufacturing a heat dissipation module according to claim 6, characterized in that, In step e), each heat pipe has a third capillary structure inside, and the second capillary structure covers the inside of each opening end and is stacked on top of the third capillary structure.

Citation Information

Patent Citations

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    CN108731526A

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