An acidic degreasing agent and its preparation method

Abstract

The present invention discloses an acidic degreasing agent and a preparation method thereof, relating to the technical field of PCB electroplating. The acidic degreasing agent of the present invention comprises the following components in percentage by weight: 4-6% of organic acid; 1-2% of inorganic acid; 0.5-1% of penetrant; 0.5-1% of copper ion polymerization inhibitor; 0.2-0.7% of adsorption and desorption agent; the balance is water; the organic acid is at least one of sulfamic acid and citric acid; the copper ion polymerization inhibitor is at least one of sodium tartrate, sodium gluconate and succinic acid. The acidic degreasing agent of the present invention can effectively remove the dust and grease marks on the copper surface, and while ensuring the cleaning effect of the copper surface, it can effectively slow down the etching of the copper surface, does not form a copper surface composite film, and has no influence on subsequent electroplating. At the same time, it can also well solve the problem of step gradient occurring in pattern electroplating, so that the flatness, adhesion and corrosion resistance of the electroplated layer are not easily affected.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB electroplating, and particularly to an acidic degreasing agent and a preparation method thereof. Background Art

[0002] With the development of modern electronic information technology, PCB design is gradually developing towards multi-layer and densification, making the manufacturing technology more difficult and the technical requirements for the production process higher and higher. In the process flow of PCB board processing, the PCB electroplating process is a very important link. During the production and manufacturing of copper plates, dirt such as oxides, dust, oil stains, and fingerprint marks are likely to be generated on the surface. Whether it is full-panel electroplating or pattern electroplating, a degreasing process is required to remove the grease and oxides on the copper surface of the circuit board, and to keep the steel surface clean and increase wettability, so as to avoid residual substances during the subsequent cleaning process. If these greases are not removed completely, it will also affect the normal progress of the subsequent processes. In the chemical micro-etching process, if the copper surface is not cleaned properly, it will affect the chemical micro-etching of the subsequent processes, resulting in insufficient surface roughness, affecting the adhesion of the photoresist, and even affecting subsequent processes such as tin plating and pattern electroplating of copper. In the electroplating process, it will not only contaminate the plating solution, making the plating solution lose its activity faster, but also make the coating unstable and appear defective, and the flatness, adhesion, and corrosion resistance of the electroplated layer will all be affected.

[0003] Currently, the production process of the board is: copper deposition - acidic degreasing - water washing - pattern transfer - acidic degreasing - water washing - micro-etching - water washing - pickling - electroplating of copper and nickel. There are two types of degreasing agents, acidic and alkaline. Only acidic degreasing agents can be used in this process and not alkaline degreasing agents because the ink used in the pattern has poor alkali resistance and is easily damaged to the pattern circuit. In pattern electroplating, incomplete degreasing is more likely to cause the problem of step plating, manifested as anti-plating, with appearance defects such as pits, rough plating surfaces, anti-plating pattern marks, fisheyes, and trailing at the hole openings.

[0004] Acidic degreasing agents are generally organic type, inorganic type, and composite type. The inorganic type mainly uses sulfuric acid or hydrochloric acid. Patent CN114774937A discloses a degreasing method of an environmentally friendly inorganic acidic degreasing agent for PCB electroplating. The main components are inorganic acids sulfuric acid or hydrochloric acid, a corrosion inhibitor aromatic aldehyde substance benzaldehyde, a wetting agent saponin substance platycodin D, a stabilizer pentanol derivative 4-pentyloxybenzyl alcohol, and an accelerator phenolic substance nonylphenol, which has a fast and excellent degreasing effect. However, only using an inorganic type of industrial strong acid degreasing agent has a certain effect on removing oil stains and fingerprints on copper plates, but it will over-etch the copper surface under strong acid conditions, especially for thin copper plates after chemical copper deposition, which is likely to affect the subsequent processes and cause the problem of copper surface depression. A large amount of smoke will be generated when hydrochloric acid is configured, which is easy to cause harm to operators, and in the presence of chlorine, pitting corrosion is likely to occur.

[0005] The organic type generally uses oxalic acid or citric acid. Patent CN112064050A discloses an acidic degreasing agent for electroplating copper and its preparation method. The main components are: oxalic acid, citric acid, potassium salicylate, sodium sulfate, surfactants a-olefin sulfonate and dodecyl ethoxysulfobetaine, emulsification stabilizers triethanolamine oleate soap, saponin and aminotrimethylenephosphonic acid, and disodium ethylenediaminetetraacetate. This acidic degreasing agent is easy to wash, can quickly remove fingerprints, oil stains and oxides, and can effectively improve the adhesion of the plating layer. However, for acidic degreasing agents that only use organic acids, although the problem of etching the copper surface is reduced, the acidity of the organic acids themselves is relatively low. To achieve the effect of degreasing and removing oxides, a relatively high concentration is required. Most organic acids have low solubility in water, which limits production. At the same time, the high concentration also increases the material cost. When using organic acids, bacteria are very likely to grow in the bath solution, and the bacteria are easily adhered to the copper surface, causing defects in the appearance of the copper surface. The bacteria generally appear in a large outbreak. The best treatment plan after their appearance is to sterilize after changing the bath and then re-open the bath, resulting in a large consumption of the potion.

[0006] The composite type mainly uses sulfuric acid and citric acid. Patent CN104388960A discloses a special degreasing agent for preventing gold plating on non-conductive vias of PCB chemical nickel-gold plates, which includes the following components: acid compounds sulfuric acid and lemon, mercapto compounds 2-mercaptobenzothiazole and 2-mercaptothiazoline, sulfur compounds N,N-dimethyldithiocarbonyl propanesulfonate and isothiourea, and surfactant alkylphenol polyoxyethylene ether. It can be directly added and used in the degreasing tank of the chemical nickel-gold production line without adding any equipment. Although the composite type neutralizes the problems of insufficient acidity and excessive acidity, this formulation can effectively slow down the etching of the copper surface while ensuring the cleaning effect of the copper surface, making up for the shortcomings of using only organic acids. However, isothiourea used in the formulation has certain reproductive toxicity, mutagenicity and carcinogenicity, and has certain risks and hazards when used for a long time. This formulation also cannot solve the problem of step plating in graphic electroplating. Moreover, although using 2-mercaptobenzothiazole in the formulation can reduce the etching of the copper surface, this substance forms a composite film, which will affect subsequent graphic electroplating and is likely to cause non-plating of tin. Summary of the Invention

[0007] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an acidic degreasing agent and its preparation method. The acidic degreasing agent of the present invention can effectively remove dust and grease marks on the copper surface. Moreover, while ensuring the cleaning effect of the copper surface, it can effectively slow down the etching of the copper surface, does not form a composite film on the copper surface, and has no influence on subsequent electroplating. At the same time, it can also well solve the problem of step gradient in graphic electroplating, so that the flatness, adhesion and corrosion resistance of the electroplating layer are not easily affected.

[0008] To achieve the above purpose, the technical solution adopted by the present invention is:

[0009] In a first aspect, the present invention provides an acidic degreasing agent comprising the following components in percentage by weight:

[0010] Organic acid 4-6%; inorganic acid 1-2%; penetrant 0.5-1%; copper ion inhibitor 0.5-1%; adsorption and analytical agent 0.2-0.7%; the balance is water;

[0011] The organic acid is at least one of aminosulfonic acid and citric acid; the copper ion inhibitor is at least one of sodium tartrate, sodium gluconate and succinic acid.

[0012] When the pattern is electroplated, a small amount of grease and some dust remain at the junction of the dry film and the copper surface of the board. This part is difficult to clean by normal pickling. During the pickling process, copper ions are gradually enriched around it, and the copper surface is oxidized in a humid environment. The acidic degreasing agent of the present invention removes the problem of copper surface oxidation through inorganic acid, and the organic acid can clean fingerprints under the action of the penetrant. The adsorption analytical agent can be adsorbed on the grease and dust at the junction to form larger molecules through adsorption. At the same time, the adsorption analytical agent has strong hydrophilicity and is easily dissolved in water during the subsequent rinsing process. The copper ion inhibitor can also slow down the amount of copper ion corrosion, and does not form a composite film on the copper surface, which has no effect on subsequent electroplating.

[0013] The present invention adopts organic acid, inorganic acid, penetrant, copper ion inhibitor and adsorption analytical agent to cooperate with each other, so as to effectively remove dust and grease on the copper surface, ensure the cleanliness of the copper surface and reduce the amount of copper surface corrosion, so that the process of pattern electroplating is not easily affected.

[0014] Preferably, the organic acid consists of aminosulfonic acid and citric acid.

[0015] The organic acid in the present invention is compounded with aminosulfonic acid and citric acid, which can better remove the grease marks on the copper surface and solve the problem of copper surface oxidation, thereby being less likely to affect subsequent tin plating and pattern copper electroplating processes.

[0016] Preferably, the weight ratio of aminosulfonic acid to citric acid is 2:1.

[0017] The invention adopts a specific ratio of aminosulfonic acid and citric acid to compound, which is conducive to better removing the grease marks on the copper surface, so that the copper surface is cleaned more cleanly and is less likely to affect the normal progress of subsequent processes.

[0018] Preferably, the copper ion inhibitor consists of sodium tartrate and succinic acid.

[0019] The copper ion polymerization inhibitor in the present invention is a compound of sodium tartrate and succinic acid, which is beneficial to further slow down the amount of copper ion corrosion and prevent the formation of a copper surface composite film, thereby making the subsequent electroplating process less likely to be affected.

[0020] Preferably, the weight ratio of sodium tartrate to succinic acid is 1:1.

[0021] In the present invention, the compounding of sodium tartrate and succinic acid in a specific ratio is beneficial to further reducing the copper surface etching, making it difficult for a composite film to form on the copper surface, and making it less likely to occur that tin cannot be electroplated during the subsequent graphic electroplating process.

[0022] Preferably, the inorganic acid is sulfuric acid.

[0023] Preferably, the penetrant is at least one of octyldecanol polyoxyethylene ether and octyldecanol polyoxyethylene ether.

[0024] Preferably, the adsorption and desorption agent is trihydroxy polyoxypropylene ether.

[0025] Preferably, the acidic degreasing agent further comprises a bactericide in a weight percentage of 0.02-0.07%.

[0026] In the present invention, the bactericide can prevent the problem of easy growth of bacteria in organic acids and further improve the product yield.

[0027] In a second aspect, the present invention provides a preparation method of an acidic degreasing agent, comprising the following steps: adding an organic acid, an inorganic acid, a penetrant, a copper ion polymerization inhibitor, and an adsorption and desorption agent into water respectively, and fully dissolving to obtain the acidic degreasing agent.

[0028] The process of the present invention is simple, has low energy consumption, and good cleaning effect.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0030] By using an organic acid, an inorganic acid, a penetrant, a copper ion polymerization inhibitor, an adsorption and desorption agent, and a bactericide in cooperation with each other, the present invention can well solve the problems of easy occurrence of stepped plating, pits or rough plating surface in graphic electroplating, ensure the cleanliness of the copper surface and reduce the copper surface etching amount, and also prevent the problem of easy growth of bacteria in organic acids, which is beneficial to further improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic diagram of the copper surface after being cleaned with the acidic degreasing agent of Example 1 in the present invention.

[0032] Figure 2 is a schematic diagram of the copper surface after being cleaned with the acidic degreasing agent of Example 2 in the present invention.

[0033] Figure 3 is a schematic diagram of the copper surface after being cleaned with the acidic degreasing agent of Example 3 in the present invention.

[0034] Figure 4 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 4 in the present invention.

[0035] Figure 5 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 5 in the present invention.

[0036] Figure 6 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 6 in the present invention.

[0037] Figure 7 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 7 in the present invention.

[0038] Figure 8 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 8 in the present invention.

[0039] Figure 9 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 9 in the present invention.

[0040] Figure 10 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 10 in the present invention.

[0041] Figure 11 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 11 in the present invention.

[0042] Figure 12 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 12 in the present invention.

[0043] Figure 13 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 13 in the present invention.

[0044] Figure 14 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Example 14 in the present invention.

[0045] Figure 15 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Comparative Example 1 in the present invention.

[0046] Figure 16 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Comparative Example 2 in the present invention.

[0047] Figure 17 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Comparative Example 3 in the present invention.

[0048] Figure 18 Schematic diagram of the copper surface after cleaning with the acidic degreaser of Comparative Example 4 in the present invention.

[0049] Figure 19 It is a schematic diagram of the copper surface after being cleaned with the acidic degreasing agent of Comparative Example 5 in the present invention. Specific Embodiments

[0050] To better illustrate the purpose, technical solution and advantages of the present invention, the present invention will be further described below in conjunction with specific embodiments, but the protection scope and implementation manners of the present invention are not limited thereto.

[0051] The materials, reagents, etc. used in the following embodiments are commercially available reagents and materials unless otherwise specified.

[0052] Example 1

[0053] This example discloses an acidic degreasing agent, which comprises the following components in percentage by weight:

[0054] Sulfamic acid 6%; sulfuric acid 1%; JFC-4 1%; sodium tartrate 0.5%; trihydroxy polyoxypropylene ether 0.2%; Kathon 0.02%; the balance is water.

[0055] JFC-4 and JFC-6, the manufacturer is Linyi Lusen. JFC-4 is octyldecanol polyoxyethylene ether, and JFC-6 is octyldecanol polyoxyethylene ether.

[0056] This example also discloses a preparation method of the acidic degreasing agent. Sulfamic acid, sulfuric acid, JFC-4, sodium tartrate, trihydroxy polyoxypropylene ether and Kathon are respectively added into water according to the ratio, and fully dissolved to obtain the acidic degreasing agent.

[0057] Example 2

[0058] An acidic degreasing agent, which comprises the following components in percentage by weight:

[0059] Citric acid 4%; sulfuric acid 2%; JFC-6 0.5%; sodium gluconate 1%; trihydroxy polyoxypropylene ether 0.7%; Kathon 0.07%; the balance is water.

[0060] The preparation method of the acidic degreasing agent is the same as that of Example 1.

[0061] Example 3

[0062] An acidic degreasing agent, which comprises the following components in percentage by weight:

[0063] Sulfamic acid 4%; citric acid 2%; sulfuric acid 1%; JFC-4 1%; succinic acid 1%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water;

[0064] In this example, the weight ratio of sulfamic acid to citric acid is 2:1.

[0065] Example 4

[0066] An acidic degreaser, comprising components in the following weight percentages:

[0067] Sulfamic acid 3%; citric acid 1.5%; sulfuric acid 1%; JFC-4 1%; succinic acid 1%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water;

[0068] In this embodiment, the weight ratio of sulfamic acid to citric acid is 2:1.

[0069] Example 5

[0070] An acidic degreaser, comprising components in the following weight percentages:

[0071] Sulfamic acid 2%; citric acid 4%; sulfuric acid 1%; JFC-4 1%; succinic acid 1%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water;

[0072] In this embodiment, the weight ratio of sulfamic acid to citric acid is 1:2.

[0073] Example 6

[0074] An acidic degreaser, comprising components in the following weight percentages:

[0075] Sulfamic acid 6%; sulfuric acid 1%; JFC-4 1%; succinic acid 1%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water;

[0076] In this embodiment, the organic acid is sulfamic acid.

[0077] Example 7

[0078] An acidic degreaser, comprising components in the following weight percentages:

[0079] Citric acid 6%; sulfuric acid 1%; JFC-4 1%; succinic acid 1%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water;

[0080] In this embodiment, the organic acid is citric acid.

[0081] Example 8

[0082] An acidic degreaser, comprising components in the following weight percentages:

[0083] Sulfamic acid 4%; citric acid 2%; sulfuric acid 2%; JFC-4 1%; sodium tartrate 0.5%; succinic acid 0.5%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water;

[0084] In this embodiment, the copper ion polymerization inhibitor is sodium tartrate and succinic acid, and the weight ratio of sodium tartrate to succinic acid is 1:1.

[0085] Example 9

[0086] An acidic degreaser comprises the following components in percentage by weight:

[0087] Sulfamic acid 4%; citric acid 2%; sulfuric acid 2%; JFC-4 1%; sodium tartrate 0.6%; succinic acid 0.4%; polyoxypropylene triol 0.5%; Kathon 0.05%; the balance is water;

[0088] In this embodiment, the copper ion polymerization inhibitor is sodium tartrate and succinic acid, and the weight ratio of sodium tartrate to succinic acid is 3:2.

[0089] Example 10

[0090] An acidic degreaser comprises the following components in percentage by weight:

[0091] Sulfamic acid 4%; citric acid 2%; sulfuric acid 2%; JFC-4 1%; succinic acid 0.5%; sodium gluconate 0.5%; polyoxypropylene triol 0.5%; Kathon 0.05%; the balance is water;

[0092] In this embodiment, the copper ion polymerization inhibitor is succinic acid and sodium gluconate.

[0093] Example 11

[0094] An acidic degreaser comprises the following components in percentage by weight:

[0095] Sulfamic acid 4%; citric acid 2%; sulfuric acid 2%; JFC-4 1%; sodium tartrate 0.5%; sodium gluconate 0.5%; polyoxypropylene triol 0.5%; Kathon 0.05%; the balance is water;

[0096] In this embodiment, the copper ion polymerization inhibitor is sodium tartrate and sodium gluconate.

[0097] Example 12

[0098] An acidic degreaser comprises the following components in percentage by weight:

[0099] Sulfamic acid 4%; citric acid 2%; sulfuric acid 2%; JFC-4 1%; sodium tartrate 1%; polyoxypropylene triol 0.5%; Kathon 0.05%; the balance is water;

[0100] In this embodiment, the copper ion polymerization inhibitor is sodium tartrate.

[0101] Example 13

[0102] An acidic degreaser, comprising the following components in weight percentages:

[0103] Sulfamic acid 4%; citric acid 2%; sulfuric acid 2%; JFC-4 1%; succinic acid 1%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water;

[0104] In this example, the copper ion inhibitor is succinic acid.

[0105] Example 14

[0106] An acidic degreaser, comprising the following components in weight percentages:

[0107] Sulfamic acid 4%; citric acid 2%; sulfuric acid 2%; JFC-4 0.5%; JFC-6 0.5%; sodium tartrate 0.5%; succinic acid 0.5%; trihydroxy polyoxypropylene ether 0.5%; Kathon 0.05%; the balance is water.

[0108] In this example, the copper ion inhibitors are sodium tartrate and succinic acid.

[0109] Comparative Example 1

[0110] An acidic degreaser, which is different from Example 14 in that an adsorption and desorption agent is not added to the acidic degreaser.

[0111] Comparative Example 2

[0112] An acidic degreaser, which is different from Example 14 in that a copper ion inhibitor is not added to the acidic degreaser.

[0113] Comparative Example 3

[0114] An acidic degreaser, which is different from Example 14 in that a bactericide is not added to the acidic degreaser.

[0115] Comparative Example 4

[0116] An acidic degreaser, which is different from Example 14 in that acetic acid is used to replace citric acid in equal weight in the acidic degreaser.

[0117] Comparative Example 5

[0118] An acidic degreaser, which is different from Example 14 in that 2-mercaptobenzothiazole is used to replace sodium tartrate in equal weight in the acidic degreaser.

[0119] Experiment

[0120] Use the above-mentioned acidic degreaser to clean copper plates respectively, and the steps are as follows: First, clean the cleaning tank (first clean it with 2% acidic degreaser), then add water, heat it to 35°C, prepare the corresponding concentration according to the weight ratio, then turn on the circulation, heat it to 35°C, adjust the machine transfer speed, load the plates, clean, and unload the plates.

[0121] Performance effect test

[0122] 1. Pollutant removal test: Check whether there are still fingerprints and oxidation conditions by AOI

[0123] 2. Water film condition: Whether there is a water film on the copper surface

[0124] 3. Copper etching condition: Measure the copper ion content in g / L after normal plate production (1000 square meters per day) for one week. The acceptance standard for the production line is <1 g / L

[0125] 4. Persistence of degreaser: Whether it is prone to bacteria growth after the open-tank solution is used for normal plate production (1000 square meters per day) for one week

[0126] 5. Influence on subsequent processes: Whether there is stepped plating during tin electroplating

[0127] The above test results are shown in Table 1.

[0128] Table 1

[0129]

[0130]

[0131] According to Examples 3-4 in Table 1, it can be seen that in Examples 3 and 4, the organic acids are compounded with sulfamic acid and citric acid. The acidic degreaser can well remove fingerprints on the copper surface and reduce the occurrence of copper surface etching, so it is less likely to affect subsequent processes such as tin electroplating and pattern electroplating of copper. And, by comparing Examples 5-7 with Example 3 respectively, it can be seen that when the weight ratio of sulfamic acid and citric acid in Example 5 is not 2:1, the effect of the acidic degreaser is not as good as that in Example 3, indicating that when the weight ratio of sulfamic acid and citric acid is 2:1, the acidic degreaser can better remove fingerprints on the copper surface. In Example 6, the organic acid is sulfamic acid, and in Example 7, the organic acid is citric acid. The effects of the acidic degreasers are not as good as that in Example 3, indicating that when the organic acids are compounded with sulfamic acid and citric acid in a specific ratio, they can well remove fingerprints on the copper surface, so it is less likely to affect subsequent processes such as tin electroplating and pattern electroplating of copper.

[0132] As can be seen from Examples 8 - 9 in Table 1, the copper ion polymerization inhibitor in Example 8 is sodium tartrate and succinic acid, and the weight ratio of sodium tartrate to succinic acid is 1:1. In Example 9, the weight ratio of sodium tartrate to succinic acid is 3:2, and the copper ion content is higher than that in Example 8, indicating that the copper ion polymerization inhibitor is compounded with sodium tartrate and succinic acid in a weight ratio of 1:1, which is beneficial to further reducing the etching amount of copper ions. Moreover, by comparing Example 12 - 13 with Example 8 respectively, it can be obtained that the copper ion polymerization inhibitor in Example 12 is sodium gluconate, and the copper ion polymerization inhibitor in Example 13 is succinic acid, and the copper ion content in both is higher than that in Example 8, indicating that only when the copper ion polymerization inhibitor is compounded with sodium tartrate and succinic acid in a specific ratio can the etching amount of copper ions be better reduced, making the subsequent electroplating process not easily affected.

[0133] As can be seen from Examples 10 - 11 in Table 1, the copper ion polymerization inhibitor in Example 10 is compounded with succinic acid and sodium gluconate, and the copper ion content after one week is higher than that in Example 8. The copper ion polymerization inhibitor in Example 11 is compounded with sodium tartrate and sodium gluconate, and the copper ion content is higher than that in Example 8. It is not that any compounding of substances can well reduce the etching amount of copper ions. Only by compounding sodium tartrate and succinic acid in the present invention can the copper ion content be better reduced, and then the etching amount of copper ions be reduced.

[0134] By comparing Comparative Examples 1 - 3 with Example 14 in Table 1 respectively, it can be obtained that in Comparative Example 1, no adsorption - desorption agent is added, and there are slight residual fingerprints on the copper surface. Moreover, the copper ion content is higher than that in Example 1, and there will also be a gradient. In Comparative Example 2, no copper ion polymerization inhibitor is added, and there are slight residual fingerprints on the copper surface, and the copper ion content is much higher than that in Example 1. In Comparative Example 3, no bactericide is added, and there are slight residual fingerprints on the copper surface, and the acid degreaser is prone to growing bacteria. The performance of Comparative Examples 1 - 3 is inferior to that of Example 14, indicating that through the synergistic cooperation of organic acids, inorganic acids, penetrants, copper ion polymerization inhibitors, adsorption - desorption agents, and bactericides in the present invention, the dust and grease on the copper surface can be well removed, ensuring the cleanliness of the copper surface and reducing the etching amount of the copper surface, so that the graphic electroplating process is not easily affected.

[0135] As can be seen from Comparative Example 4 in Table 1, in Comparative Example 4, other organic acids are used to replace citric acid, and there are residual fingerprints on the copper surface, indicating that not any organic acid can achieve the effect of this application.

[0136] As can be seen from Comparative Example 5 in Table 1, in Comparative Example 5, other copper ion polymerization inhibitors are used to replace sodium tartrate, and there are slight residual fingerprints on the copper surface, indicating that not any copper ion polymerization inhibitor can achieve the effect of this application.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. An acidic degreaser, characterized in that, The acidic degreasing agent comprises the following components in percentage by weight: organic acid 6%; inorganic acid 2%; penetrant 1%; copper ion polymerization inhibitor 1%; adsorption and desorption agent 0.5%; bactericide 0.05%; the balance is water; the organic acid consists of sulfamic acid and citric acid, and the weight ratio of sulfamic acid to citric acid is 2:1; the copper ion polymerization inhibitor consists of sodium tartrate and succinic acid, and the weight ratio of sodium tartrate to succinic acid is 1:1; the inorganic acid is sulfuric acid; the penetrant comprises JFC-4 and JFC-6, and the weight ratio of JFC-4 to JFC-6 is 1:1; the adsorption and desorption agent is trihydroxy polyoxypropylene ether; the bactericide is Kathon.

2. The preparation method of the acidic degreaser according to claim 1, characterized in that, It includes the following steps: Add the organic acid, inorganic acid, penetrant, copper ion polymerization inhibitor, adsorption and desorption agent and bactericide into water respectively and dissolve them fully to obtain the acidic degreasing agent.

Images