Electrochromic device based on quantitatively controlled electrochromic solution and preparation process thereof
By coating spacer particles within the annular adhesive layer and applying an electrochromic solution layer using a dispensing method, the problems of bubbles and mutual solubility in electrochromic devices have been solved, thus improving production yield and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NINGBO HUALING OPTICAL TECH CO LTD
- Filing Date
- 2023-08-28
- Publication Date
- 2026-04-28
AI Technical Summary
In existing electrochromic device manufacturing processes, the electrochromic solution is prone to bubbles and is miscible with the frame adhesive, resulting in low production yield and efficiency.
The preparation process of the electrochromic solution is quantitatively controlled. By coating spacer particles into the annular adhesive layer to form a particle region, the electrochromic solution layer is laid by dispensing adhesive and then pre-curing and secondary curing are carried out in a vacuum environment to avoid mutual solubility reaction.
It improved the production yield of electrochromic devices, reduced bubble problems, simplified the preparation steps, reduced the risk of defects, and improved production efficiency.
Smart Images
Figure CN117031844B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electrochromic device technology, and more specifically, to an electrochromic device based on quantitative control of an electrochromic solution and its preparation process. Background Technology
[0002] Electrochromism is the phenomenon where electrochromic materials undergo electrochemical oxidation-reduction reactions under the influence of an applied electric field, resulting in color changes due to the gain or loss of electrons. Because electrochromism can produce stable and reversible color changes, electrochromic devices made from electrochromic materials have been widely used in fields such as smart windows, displays, and imaging equipment.
[0003] Currently, the common manufacturing process for electrochromic devices involves first bonding the conductive layers of two pre-cut glass pieces together using an adhesive frame. After the adhesive cures, a vacuum is drawn, and the electrochromic solution is poured in. Finally, the device is sealed to complete assembly. However, this pouring method suffers from several drawbacks, including the potential for air bubbles to form in the electrochromic solution, the easy miscibility between the electrochromic solution and the adhesive frame, and the need for secondary sealing. Consequently, its production yield and efficiency are limited. Summary of the Invention
[0004] The purpose of this invention is to provide an electrochromic device based on quantitatively controlled electrochromic solution and its preparation process. The preparation process is simple and can improve the production yield and production efficiency of electrochromic devices.
[0005] The embodiments of the present invention are implemented as follows:
[0006] One aspect of the present invention provides a fabrication process for an electrochromic device based on a quantitatively controlled electrochromic solution. The fabrication process includes: providing a first transparent conductive glass and a second transparent conductive glass; applying a border adhesive to the conductive surface of the first transparent conductive glass to form an annular adhesive layer; coating spacer particles within the annular adhesive layer to form a particle region located within the annular adhesive layer on the conductive surface of the first transparent conductive glass; coating an electrochromic solution material within the particle region to form an electrochromic solution layer, with a gap between the electrochromic solution layer and the annular adhesive layer; bonding the second transparent conductive glass onto the annular adhesive layer and pre-curing the annular adhesive layer to obtain a first device; applying pressure to the first device while simultaneously performing a secondary curing of the annular adhesive layer to fill the cavity of the annular adhesive layer with the electrochromic solution. This fabrication method is simple and can improve the production yield and efficiency of electrochromic devices.
[0007] Optionally, spacer particles are coated within the annular adhesive layer to form a particle region within the annular adhesive layer on the conductive surface of the first transparent conductive glass. This includes uniformly coating spacer particles within the annular adhesive layer to form a particle region within the annular adhesive layer on the conductive surface of the first transparent conductive glass, wherein the diameter of the spacer particles is smaller than the thickness of the annular adhesive layer.
[0008] Optionally, the second transparent conductive glass is bonded to the annular adhesive layer, and the annular adhesive layer is pre-cured to obtain the first device, including: adsorbing and bonding the second transparent conductive glass to the annular adhesive layer in a vacuum environment to obtain the second device; applying pressure to the second device to reduce the thickness of the annular adhesive layer; and irradiating the annular adhesive layer with ultraviolet light to pre-cur the annular adhesive layer to obtain the first device.
[0009] Optionally, pressurizing the second device to reduce the thickness of the annular adhesive layer includes: pressurizing the second device to reduce the thickness of the annular adhesive layer, wherein the thickness of the reduced annular adhesive layer is greater than the diameter of the spacer particles.
[0010] Optionally, pressurizing the first device while simultaneously performing secondary curing on the annular adhesive layer to fill the inner cavity of the annular adhesive layer with the electrochromic solution includes: placing the first device in an oven for baking and curing, and simultaneously pressurizing and maintaining pressure on the first device during baking and curing to perform secondary curing on the annular adhesive layer and to fill the inner cavity of the annular adhesive layer with the electrochromic solution.
[0011] Optionally, the oven temperature is between 70°C and 90°C.
[0012] Optionally, the first device is pressurized and held under pressure during baking, including: pressurizing and holding the first device under pressure during baking so that the thickness of the annular adhesive layer is the same as the diameter of the spacer particles.
[0013] Optionally, the diameter of the spacer particles is between 0.05 mm and 0.15 mm.
[0014] Optionally, the thickness of the first transparent conductive glass and the second transparent conductive glass is between 0.05 mm and 1.1 mm.
[0015] In another aspect, the present invention provides an electrochromic device based on a quantitatively controlled electrochromic solution, which is prepared by the above-described fabrication process for an electrochromic device based on a quantitatively controlled electrochromic solution.
[0016] The beneficial effects of this invention include:
[0017] This application involves coating spacer particles into a ring-shaped adhesive layer, with the electrochromic solution layer deposited within the particle region formed by the spacer particles, creating a gap between the electrochromic solution layer and the ring-shaped adhesive layer. This allows for pre-curing of the ring-shaped adhesive layer, transforming it from a liquid to a solid state. During the subsequent pressurization and secondary curing of the first device, the electrochromic solution layer completely fills the inner cavity of the ring-shaped adhesive layer, preventing mutual solubility between the two layers. Furthermore, since this application does not employ the liquid-filling method of existing technologies but instead uses a dispensing method to form the electrochromic solution layer, it solves the problem of air bubbles easily forming in the electrochromic solution in existing technologies, improving the production yield of electrochromic devices and effectively reducing losses. Simultaneously, because this application does not use a liquid-filling method, it eliminates the need for secondary sealing of the filling port compared to existing technologies. This simplifies the preparation method, reduces preparation steps, further reduces the risk of defects caused by multiple processes, and improves production efficiency. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is one of the schematic flowcharts illustrating the fabrication process of an electrochromic device based on quantitatively controlled electrochromic solution provided in an embodiment of the present invention.
[0020] Figure 2 The second schematic diagram of the fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution provided in the embodiments of the present invention;
[0021] Figure 3 One of the process diagrams for fabricating an electrochromic device based on quantitatively controlled electrochromic solution provided in an embodiment of the present invention;
[0022] Figure 4 The second diagram illustrates the fabrication process of an electrochromic device based on quantitatively controlled electrochromic solution, as provided in an embodiment of the present invention.
[0023] Figure 5 The third diagram illustrates the fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution provided in this embodiment of the invention.
[0024] Figure 6 Figure 4 shows the fabrication process of an electrochromic device based on quantitatively controlled electrochromic solution provided in an embodiment of the present invention.
[0025] Figure 7 Figure 5 shows the fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution provided in this embodiment of the invention.
[0026] Icons: 10-First transparent conductive glass; 20-Second transparent conductive glass; 30-Annular adhesive layer; 40-Particle region; 41-Spacer particles; 50-Electrochromic solution layer; 100-First device. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.
[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0030] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0031] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.
[0032] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0033] Please refer to Figure 1 This embodiment provides a fabrication process for an electrochromic device based on a quantitatively controlled electrochromic solution. The fabrication process for the electrochromic device based on a quantitatively controlled electrochromic solution includes:
[0034] S100, providing a first transparent conductive glass 10 and a second transparent conductive glass 20.
[0035] The first transparent conductive glass 10 and the second transparent conductive glass 20 are made of indium tin oxide.
[0036] Optionally, the thickness of the first transparent conductive glass 10 and the second transparent conductive glass 20 is between 0.05 mm and 1.1 mm. For example, the thickness of the first transparent conductive glass 10 and the second transparent conductive glass 20 can be 0.05 mm, 0.21 mm, 0.5 mm, 0.8 mm, 1.1 mm, etc.
[0037] Furthermore, it should be noted that the thickness of the first transparent conductive glass 10 and the thickness of the second transparent conductive glass 20 can be the same or different, and this application does not impose specific restrictions on this.
[0038] S200, apply edge adhesive to the conductive surface of the first transparent conductive glass 10 to form an annular adhesive layer 30, such as... Figure 3 .
[0039] The thickness and width of the annular adhesive layer 30 are not specifically limited in this application, and those skilled in the art can set them according to the size of the electrochromic device to be formed.
[0040] S300, spacer particles 41 are coated within the annular adhesive layer 30 to form a particle region 40 within the annular adhesive layer 30 on the conductive surface of the first transparent conductive glass 10, such as... Figure 4 .
[0041] That is, electrochromic particles are coated on the conductive surface of the first transparent conductive glass 10, and within the area enclosed by the annular adhesive layer 30. The spacer particles 41 coated within the area surrounded by the annular adhesive layer 30 together form the particle region 40.
[0042] It should be noted that the spacer particles 41 are located within the area enclosed by the annular adhesive layer 30, and do not overlap with the annular adhesive layer 30. That is, the orthographic projection of the particle region 40 onto the first transparent conductive glass 10 lies within the orthographic projection of the annular adhesive layer 30 onto the first transparent conductive glass 10, and the orthographic projection of the particle region 40 onto the first transparent conductive glass 10 does not overlap with the orthographic projection of the annular adhesive layer 30 onto the first transparent conductive glass 10. Figure 4 As shown.
[0043] Optionally, the diameter of the spacer particles 41 is between 0.05 mm and 0.15 mm. For example, the diameter of the spacer particles 41 can be 0.05 mm, 0.1 mm, or 0.15 mm, etc.
[0044] The particle region 40 provided in the annular adhesive layer 30 of this application can be used to support the first transparent conductive glass 10 and the second transparent conductive glass 20.
[0045] Optionally, step S300, which involves coating spacer particles 41 within the annular adhesive layer 30 to form a particle region 40 within the annular adhesive layer 30 on the conductive surface of the first transparent conductive glass 10, can be achieved in the following ways:
[0046] Spacer particles 41 are uniformly coated within the annular adhesive layer 30 to form a particle region 40 within the annular adhesive layer 30 on the conductive surface of the first transparent conductive glass 10. The diameter of the spacer particles 41 is smaller than the thickness of the annular adhesive layer 30.
[0047] The spacer particles 41 are evenly distributed inside the annular adhesive layer 30, which can provide stable support for the first transparent conductive glass 10 and the second transparent conductive glass 20, so that the stress is the same everywhere.
[0048] In this embodiment, the diameter of the spacer particle 41 can be 0.1 mm, and the thickness of the annular adhesive layer 30 is greater than 0.1 mm. Of course, the above-mentioned diameter of the spacer particle 41 of 0.1 mm is only an example proposed in this application and is not a limitation on the diameter of the spacer particle 41.
[0049] S400, an electrochromic solution material is coated within the particle region 40 to form an electrochromic solution layer 50. A gap exists between the electrochromic solution layer 50 and the annular adhesive layer 30. Figure 5 .
[0050] It should be noted that the electrochromic solution layer 50 can be formed by precisely dispensing it into the interior of the annular adhesive layer 30. The dispensing method allows for precise control of the amount of electrochromic solution material.
[0051] This application provides a gap between the electrochromic solution layer 50 and the annular adhesive layer 30. In this way, the uncured annular adhesive layer 30 will not come into contact with the electrochromic solution material, thereby preventing the annular adhesive layer 30 from dissolving in the electrochromic solution material and improving the performance of the electrochromic device.
[0052] The size of the gap is not limited in this application, and those skilled in the art can determine it themselves.
[0053] S500, the second transparent conductive glass 20 is bonded to the annular adhesive layer 30, and the annular adhesive layer 30 is pre-cured to obtain the first device 100, such as... Figure 6 and Figure 7 .
[0054] After the second transparent conductive glass 20 is bonded to the annular adhesive layer 30, the first transparent conductive glass 10 and the second transparent conductive glass 20 will be connected as a whole. At this time, the electrochromic solution layer 50 is located between the first transparent conductive glass 10 and the second transparent conductive glass 20, and is located within the annular adhesive layer 30. Then, the annular adhesive layer 30 is pre-cured to obtain the first device 100 as shown in the image. Figure 7 As shown.
[0055] Please refer to Figure 2 Optionally, step S500, which involves attaching the second transparent conductive glass 20 to the annular adhesive layer 30 and pre-curing the annular adhesive layer 30 to obtain the first device 100, can be specifically achieved through the following steps S510-S530:
[0056] S510. In a vacuum environment, the second transparent conductive glass 20 is adsorbed and bonded to the annular adhesive layer 30 to obtain the second device.
[0057] S520. Apply pressure to the second device to reduce the thickness of the annular adhesive layer 30.
[0058] S530. The annular adhesive layer 30 is subjected to ultraviolet irradiation to pre-cur the annular adhesive layer 30 to obtain the first device 100.
[0059] In this application, there is no need to evacuate the device; it is only necessary to allow the first transparent conductive glass 10 to adhere to the second transparent conductive glass 20 in a vacuum environment.
[0060] The application does not limit the pressure applied to the second device in step S520, as long as it can appropriately reduce the thickness of the annular adhesive layer 30.
[0061] Optionally, step S520, applying pressure to the second device to reduce the thickness of the annular adhesive layer 30, can be achieved in the following way:
[0062] Pressure is applied to the second device to reduce the thickness of the annular adhesive layer 30, wherein the thickness of the reduced annular adhesive layer 30 is greater than the diameter of the spacer particles 41. It should be noted that this pressure application is the first pressure application.
[0063] For example, after the first pressurization treatment, the thickness of the thinned annular adhesive layer 30 can be between 0.01 mm and 0.10 mm larger than the diameter of the spacer particles 41. For instance, the diameter of the spacer particles 41 can be 0.1 mm, and the thickness of the thinned annular adhesive layer 30 can be between 0.11 mm and 0.2 mm.
[0064] S600, pressurize the first device 100 and simultaneously perform secondary curing on the annular adhesive layer 30 so that the electrochromic solution fills the inner cavity of the annular adhesive layer 30.
[0065] After the annular adhesive layer 30 is pre-cured, the first device 100 is pressurized (this is the second pressurization), which further thins the annular adhesive layer 30, allowing the electrochromic solution to completely fill the inner cavity of the annular adhesive layer 30. During this process, since the annular adhesive layer 30 has been pre-cured, no mutual solubility will occur between the annular adhesive layer 30 and the electrochromic solution.
[0066] While pressurizing the first device 100, this application also requires secondary curing of the annular adhesive layer 30 to ensure that the annular adhesive layer 30 is completely cured. In this way, the electrochromic device based on quantitatively controlled electrochromic solution can be prepared.
[0067] Additionally, it should be noted that in step S600, the gap between the annular adhesive layer 30 and the electrochromic solution layer 50 before secondary curing will decrease as the thickness of the annular adhesive layer 30 decreases to the same level as the spacer particles 41, allowing the electrochromic solution to fill the entire inner cavity of the annular adhesive layer 30. Furthermore, since the annular adhesive layer 30 has already been pre-cured, there will be no mutual solubility reaction between the annular adhesive layer 30 and the electrochromic solution layer 50.
[0068] Optionally, the above step S600, which involves pressurizing the first device 100 and simultaneously performing secondary curing on the annular adhesive layer 30 to fill the inner cavity of the annular adhesive layer 30 with the electrochromic solution, can be achieved in the following way:
[0069] The first device 100 is placed in an oven for baking and curing. At the same time as baking and curing, the first device 100 is pressurized and held under pressure to perform secondary curing of the annular adhesive layer 30 and to fill the inner cavity of the annular adhesive layer 30 with the electrochromic solution.
[0070] It should be noted that placing the first device 100 in the oven for baking is to allow the annular adhesive layer 30 to be cured a second time, so that the annular adhesive layer 30 is fully cured. In this embodiment, optionally, the oven temperature can be between 70°C and 90°C, for example, the oven temperature can be 80°C.
[0071] Optionally, the above steps, including applying and maintaining pressure on the first device 100 during baking, include:
[0072] During baking, the first device 100 is pressurized and held under pressure so that the thickness of the annular adhesive layer 30 is the same as the diameter of the spacer particles 41.
[0073] Applying pressure again to the first device 100 reduces the thickness of the annular adhesive layer 30 to match the diameter of the spacer particles 41. The spacer particles 41 provide support, allowing precise control of the thickness of the annular adhesive layer 30 at each location, preventing collapse due to the softness of the transparent conductive glass. Holding the pressure while applying it fixes the thickness of the annular adhesive layer 30 and allows the device to take shape after the adhesive has fully cured.
[0074] In summary, the fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution provided in this application includes: providing a first transparent conductive glass 10 and a second transparent conductive glass 20; applying a border adhesive to the conductive surface of the first transparent conductive glass 10 to form an annular adhesive layer 30; coating spacer particles 41 within the annular adhesive layer 30 to form a particle region 40 within the annular adhesive layer 30 on the conductive surface of the first transparent conductive glass 10; forming an electrochromic solution layer 50 within the particle region 40, with a gap between the electrochromic solution layer 50 and the annular adhesive layer 30; attaching the second transparent conductive glass 20 to the annular adhesive layer 30 and pre-curing the annular adhesive layer 30 to obtain a first device 100; applying pressure to the first device 100 while simultaneously performing a secondary curing of the annular adhesive layer 30 to fill the inner cavity of the annular adhesive layer 30 with the electrochromic solution. This application involves coating spacer particles 41 into the annular adhesive layer 30, and depositing the electrochromic solution layer 50 within the particle region 40 formed by the spacer particles 41, creating a gap between the electrochromic solution layer 50 and the annular adhesive layer 30. This allows for pre-curing of the annular adhesive layer 30, transforming it from a liquid to a solid state. Thus, during the pressure application and secondary curing of the first device 100, the electrochromic solution layer 50 can completely fill the inner cavity of the annular adhesive layer 30, while preventing mutual dissolution between the annular adhesive layer 30 and the electrochromic solution layer 50. Furthermore, since this application does not use the prior art's liquid-filling method but instead uses a dispensing method to form the electrochromic solution layer 50, it solves the problem of air bubbles easily forming in the electrochromic solution in the prior art, thereby improving the production yield of electrochromic devices and effectively reducing losses. Meanwhile, since this application does not use the liquid filling method, it does not require secondary sealing of the filling port compared to the prior art. The preparation method is simpler than the prior art, which can reduce the preparation steps and thus further reduce the adverse risks caused by multiple processes and improve production efficiency.
[0075] In another aspect, the present invention provides an electrochromic device based on a quantitatively controlled electrochromic solution, which is prepared by the aforementioned fabrication process for an electrochromic device based on a quantitatively controlled electrochromic solution. Since the specific steps and beneficial effects of the fabrication process for this electrochromic device based on a quantitatively controlled electrochromic solution have been described in detail above, they will not be repeated here.
[0076] The above description is merely an optional embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
[0077] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not describe the various possible combinations separately.
Claims
1. A fabrication process for an electrochromic device based on quantitatively controlled electrochromic solution, characterized in that, include: Provide a first transparent conductive glass and a second transparent conductive glass; Apply edge adhesive to the conductive surface of the first transparent conductive glass to form a ring-shaped adhesive layer; Spacer particles are coated within the annular adhesive layer to form a particle region located within the annular adhesive layer on the conductive surface of the first transparent conductive glass. An electrochromic solution material is coated in the particle region to form an electrochromic solution layer, and there is a gap between the electrochromic solution layer and the annular adhesive layer. In a vacuum environment, the second transparent conductive glass is bonded to the annular adhesive layer, and the annular adhesive layer is pre-cured to obtain the first device; The first device is pressurized, and the annular adhesive layer is simultaneously cured a second time so that the electrochromic solution fills the inner cavity of the annular adhesive layer.
2. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 1, characterized in that, The step of coating spacer particles within the annular adhesive layer to form a particle region located within the annular adhesive layer on the conductive surface of the first transparent conductive glass includes: Spacer particles are uniformly coated within the annular adhesive layer to form a particle region within the annular adhesive layer on the conductive surface of the first transparent conductive glass. The diameter of the spacer particles is smaller than the thickness of the annular adhesive layer.
3. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 1, characterized in that, The step of bonding the second transparent conductive glass onto the annular adhesive layer and pre-curing the annular adhesive layer to obtain the first device includes: In a vacuum environment, the second transparent conductive glass is adsorbed and bonded onto the annular adhesive layer to obtain the second device; Pressure is applied to the second device to reduce the thickness of the annular adhesive layer; The annular adhesive layer is subjected to ultraviolet irradiation to pre-cure it, thereby obtaining the first device.
4. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 3, characterized in that, Applying pressure to the second device to reduce the thickness of the annular adhesive layer includes: The second device is pressurized to reduce the thickness of the annular adhesive layer, wherein the reduced thickness of the annular adhesive layer is greater than the diameter of the spacer particles.
5. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 1 or 3, characterized in that, The step of pressurizing the first device and simultaneously performing secondary curing on the annular adhesive layer to fill the inner cavity of the annular adhesive layer with the electrochromic solution includes: The first device is placed in an oven for baking and curing. At the same time as baking and curing, the first device is pressurized and held under pressure to perform secondary curing of the annular adhesive layer and to fill the inner cavity of the annular adhesive layer with the electrochromic solution.
6. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 5, characterized in that, The oven temperature is between 70°C and 90°C.
7. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 5, characterized in that, The step of applying and maintaining pressure to the first device during baking includes: During baking, the first device is pressurized and held at pressure so that the thickness of the annular adhesive layer is the same as the diameter of the spacer particles.
8. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 1, characterized in that, The diameter of the spacer particles is between 0.05 mm and 0.15 mm.
9. The fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution according to claim 1, characterized in that, The thickness of the first transparent conductive glass and the second transparent conductive glass is between 0.05 mm and 1.1 mm.
10. An electrochromic device based on quantitatively controlled electrochromic solution, characterized in that, It is prepared by the fabrication process of the electrochromic device based on quantitatively controlled electrochromic solution as described in any one of claims 1 to 9.
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