A PCBA production process monitoring management system and method based on the Internet of Things

Abstract

The present invention discloses a PCBA production process monitoring management system and method based on the Internet of Things, which belongs to the field of process monitoring management. The process monitoring management system includes a data acquisition module, a database, a data analysis module and a data feedback module. The data acquisition module is used to collect basic information of PCBA and basic information of electronic components, collect image information of components through a camera device, the database is used to store the collected data information and analysis results, the data analysis module is used to analyze and process the collected data, and the data feedback module is used to display the analysis results to users through a display device, and process PCBA according to the analysis results. The present invention collects image information in real time through a camera device, analyzes the surface contaminants of electronic components, solder joints and pin states, and the relevant technicians process according to the analysis results, thereby improving the work efficiency of the technicians and the accuracy of the inspection.

Description

Technical Field

[0001] The present invention relates to the field of process monitoring management, and in particular to a PCBA production process monitoring management system and method based on the Internet of Things. Background Art

[0002] With the continuous development of electronic equipment, PCB circuit boards, also known as printed circuit boards, printed circuit boards, and printed circuit boards, are important electronic components, support bodies for electronic components, and providers of circuit connections for electronic components. They have become an absolute dominant position in the electronics industry.

[0003] PCBA circuit board is a PCB blank board that goes through the entire process of SMT mounting and then DIP plug-in. Both SMT and DIP are ways to integrate parts on the PCB board. SMT is surface mounting technology, which mainly uses mounting machines to mount some tiny parts on the PCB board. DIP is to insert parts on the PCB board. When the parts are large in size and not suitable for mounting or the manufacturer's production process cannot use SMT technology, the parts are integrated in the form of plug-ins.

[0004] However, in the process of producing PCBA circuit boards and performing DIP plug-in, the pollutants on the surface of electronic components have a great impact on PCBA circuit boards, resulting in a high defect rate, causing short circuits and open circuits of components, which in turn cause abnormal operation of electrical appliances or even damage. When soldering, PCBA circuit boards may have incomplete soldering, lack of soldering or solder wrapping, which can easily cause circuit failures. Manual inspection of solder joints is not only time-consuming, but also very likely to result in missed inspections. At the same time, electronic component plug-ins are prone to unevenness, such as pins inserted too short or missing.

[0005] Therefore, it is necessary to quickly check the contaminants on the surface of electronic components, the soldering conditions of solder joints, and the insertion conditions of component pins. Therefore, a PCBA production process monitoring management system and method based on the Internet of Things is needed. Summary of the invention

[0006] The purpose of the present invention is to provide a PCBA production process monitoring and management system and method based on the Internet of Things, which monitors and manages the PCBA production process in real time, enters basic information into a database, collects surface image information of electronic components and PCBA welding surface image information in real time through a camera device, analyzes the surface contaminants, solder joints and pin states of the electronic components, classifies the electronic components according to the analysis results, classifies the welded PCBA circuit boards, and displays them to relevant technicians through a display device, thereby cleaning the components and repairing the PCBA circuit boards to solve the problems raised in the above-mentioned background technology.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a PCBA production process monitoring and management system based on the Internet of Things, the process monitoring and management system includes a data acquisition module, a database, a data analysis module and a data feedback module;

[0008] The data acquisition module is connected to the database, the database is connected to the data analysis module, and the data analysis module is connected to the data feedback module; the data acquisition module is used to collect basic information of PCBA and basic information of electronic components, and collect image information of components through a camera device. The database is used to store the collected data information and analysis results. The data analysis module is used to analyze and process the collected data. The data feedback module is used to display the analysis results to the user through a display device, and process the PCBA according to the analysis results.

[0009] Furthermore, the data acquisition module includes a basic information acquisition unit, a component image acquisition unit and a circuit board image acquisition unit. The basic information acquisition unit is used to collect basic information of components, basic information of circuit boards and basic information of equipment, such as component type, number, circuit board number and equipment number, etc. The component image acquisition unit uses a camera device to capture images of components that need to be plug-in, and the circuit board image acquisition unit uses a camera device to capture images of soldered PCBA circuit boards, for example, using a high-definition camera for image capture.

[0010] Furthermore, the database includes an encryption unit and a storage unit. The encryption unit encrypts the transmission information by salted hash encryption. The hash function is an encryption algorithm, which is a one-way cryptographic system and an irreversible mapping from plain text to cipher text. There is only an encryption process but no decryption process. Salt is a set of random data. Before the string is hashed, it will be attached to a string of characters. The salt is also stored in the hash value result, but the change for each hash calculation makes no two hash values ​​use the same salt. Because salt makes the password longer and more random, it also makes data transmission more secure. The storage unit is used to store the collected information and analysis results.

[0011] Furthermore, the data analysis module includes a component preprocessing unit and a circuit board inspection unit. The component preprocessing unit is used to analyze and process the contaminants on the surface of the components, such as oil stains and paint on the surface of the components, based on the collected component images. The circuit board analysis unit is used to analyze and process the solder joints and pins of the soldered PCBA circuit board based on the collected circuit board images.

[0012] Furthermore, the data feedback module includes a component classification unit, a circuit board classification unit and a display unit. The component classification unit is used to classify the components according to the results of the analysis of the surface contaminants of the components, for example, the components without contaminants on the surface are transmitted to the next step of the PCBA production process for welding, and the components with contaminants are transmitted to relevant personnel for cleaning to prevent the influence of contaminants. The circuit board classification unit is used to classify the circuit boards according to the results of the analysis of the solder joints and pins of the PCBA circuit board. For example, the circuit boards with solder joint shortages, solder wraps, pin insertion sections, etc. are transmitted to relevant technicians for re-welding and repair to prevent the occurrence of uneven components, short circuits of circuit boards, etc. The display unit is used to display the basic information and analysis results of the circuit board to the relevant technicians through the display device, for example, the number of the circuit board and the corresponding analysis results are displayed to the technicians through the display screen, so as to facilitate the relevant technicians to repair the circuit boards with problems.

[0013] A PCBA production process monitoring and management method based on the Internet of Things includes the following steps:

[0014] S1. Collect basic information. Collect component surface image information and soldered PCBA circuit board image information through camera equipment. Store the collected information and analysis results into the database and encrypt the entire process.

[0015] S2. Analyze and process the contaminants on the surface of components based on the collected surface image information of components;

[0016] S3, analyzing and processing the solder joints and pins of the soldered circuit board according to the collected PCBA circuit board image information;

[0017] S4. According to the analysis results, the components and circuit boards are classified and processed, and the analysis results are displayed to relevant technical personnel through a display device.

[0018] Furthermore, in step S2, the surface image information of each component is collected in real time by a high-definition camera, and the image contrast E is calculated in real time as:

[0019]

[0020] Among them, f(m,n)=|mn| is the difference in grayscale values ​​between adjacent pixels, and p is the number of grayscale differences between adjacent pixels. By setting a threshold for image contrast, the more pollutants there are on the surface of the component, the smaller the image contrast. When the image contrast is lower than the threshold, the component is separated and transmitted to relevant technicians for processing.

[0021] Furthermore, in step S3, image information of the welding surface of each PCBA circuit board after welding is collected in real time by a high-definition camera;

[0022] Use image ranging technology to measure the pin length and set a threshold for the pin length. When the pin length is less than the threshold, it is determined to be an abnormal circuit board, indicating that the components are not properly inserted, such as the component plug-in is uneven, etc.; send it to relevant technicians for inspection;

[0023] A soldering diagram of a qualified PCBA circuit board is entered into the database as the reference image y, and the collected image is x. The structural similarity index F of the image is calculated in real time by the following formula:

[0024]

[0025] z1=(β1Z) 2 , z2=(β2Z) 2 ;

[0026] in, is the pixel average of image x, is the pixel average of image y, is the pixel variance of image x, is the pixel variance of image y, α xy is the pixel covariance of image x and image y, z1 and z2 are positive constants, Z is the dynamic range of pixel values, β1 and β2 are weights; the range of the image structural similarity index is [0,1];

[0027] Set a threshold F for the structural similarity index 阈 , when F ≥ F 阈 When the soldering is qualified, it is sent to the next step of the PCBA production process for pin cutting; when F <F 阈 When the welding is judged as unqualified, it is sent to relevant technicians for maintenance, such as repair welding.

[0028] Furthermore, in step S4, based on the results of the analysis of the surface contaminants of the components, the components are classified and processed, and the components with more contaminants are sent to relevant technicians for processing; based on the results of the analysis of the solder joints and pins of the PCBA circuit board, the circuit boards are classified and processed, and the PCBA circuit boards with unqualified welding are sent to relevant technicians for initial repair processing, and the basic information and analysis results are displayed to the relevant technicians through the display device, thereby improving the work efficiency of employees and reducing the pressure of manual inspection.

[0029] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0030] The present invention inputs basic information into a database, collects surface image information of electronic components and PCBA welding surface image information in real time through a camera device, analyzes the surface pollutant conditions of electronic components, solder joints and pin states, classifies the electronic components according to the analysis results, classifies the welded PCBA circuit boards, and displays them to relevant technicians through a display device, thereby cleaning the components and repairing the PCBA circuit boards, improving the work efficiency of technicians and the accuracy of inspection, reducing the work pressure of inspectors, reducing the defective rate of PCBA circuit boards, making electrical appliances more durable, and improving the robustness of electrical appliance use. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0032] Figure 1 This is a schematic diagram of the module composition of a PCBA production process monitoring and management system based on the Internet of Things of the present invention;

[0033] Figure 2 It is a schematic diagram of the steps of a PCBA production process monitoring and management method based on the Internet of Things of the present invention; DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] See also Figure 1-Figure 2 , the present invention provides a technical solution: a PCBA production process monitoring and management system based on the Internet of Things, the process monitoring and management system includes a data acquisition module, a database, a data analysis module and a data feedback module;

[0036] The data acquisition module is connected to the database, the database is connected to the data analysis module, and the data analysis module is connected to the data feedback module;

[0037] The data acquisition module is used to acquire basic information of PCBA and basic information of electronic components, and acquires image information of components through a camera device. The data acquisition module includes a basic information acquisition unit, a component image acquisition unit, and a circuit board image acquisition unit. The basic information acquisition unit is used to acquire basic information of components, basic information of circuit boards, and basic information of equipment, such as component type, number, circuit board number, and equipment number, etc. The component image acquisition unit acquires images of components that need to be plug-in through a camera device, and the circuit board image acquisition unit acquires images of soldered PCBA circuit boards through a camera device, such as using a high-definition camera for image acquisition.

[0038] The database is used to store the collected data information and analysis results. The database includes an encryption unit and a storage unit. The encryption unit encrypts the transmission information by salted hash encryption. The hash function is an encryption algorithm. It is a one-way cryptographic system and an irreversible mapping from plain text to cipher text. There is only an encryption process but no decryption process. Salt is a set of random data. Before the string is hashed, it will be attached to a string of characters. The salt is also stored in the hash value result, but the change for each hash calculation makes no two hash values ​​use the same salt. Because salt makes the password longer and more random, it also makes data transmission more secure. The storage unit is used to store the collected information and analysis results.

[0039] The data analysis module is used to analyze and process the collected data. The data analysis module includes a component preprocessing unit and a circuit board inspection unit. The component preprocessing unit is used to analyze and process the contaminants on the surface of the components, such as oil stains and paint on the surface of the components, based on the collected component images. The circuit board analysis unit is used to analyze and process the solder joints and pins of the soldered PCBA circuit board based on the collected circuit board images.

[0040] The data feedback module is used to display the analysis results to the user through a display device, and process the PCBA according to the analysis results. The data feedback module includes a component classification unit, a circuit board classification unit and a display unit. The component classification unit is used to classify the components according to the results of the analysis of the surface contaminants of the components, such as transferring the components without contaminants on the surface to the next step of the PCBA production process for welding, and transferring the components with contaminants to relevant personnel for cleaning to prevent the influence of contaminants. The circuit board classification unit is used to classify the circuit board according to the results of the analysis of the solder joints and pins of the PCBA circuit board, such as transferring the circuit board with solder joints missing, solder wrapping, pin insertion sections, etc. to relevant technicians for repair and welding, to prevent the occurrence of uneven components, short circuits of circuit boards, etc. The display unit is used to display the basic information and analysis results of the circuit board to the relevant technicians through the display device, such as displaying the number of the circuit board and the corresponding analysis results to the technicians through the display screen, so as to facilitate the relevant technicians to repair the circuit board with problems.

[0041] A PCBA production process monitoring and management method based on the Internet of Things includes the following steps:

[0042] S1. Collect basic information. Collect component surface image information and soldered PCBA circuit board image information through camera equipment. Store the collected information and analysis results into the database and encrypt the entire process.

[0043] S2. Analyze and process the contaminants on the surface of components based on the collected surface image information of components;

[0044] In step S2, the surface image information of each component is collected in real time by a high-definition camera, and the image contrast E is calculated in real time as:

[0045]

[0046] Among them, f(m,n)=|mn| is the difference in grayscale values ​​between adjacent pixels, and p is the number of grayscale differences between adjacent pixels. By setting a threshold for image contrast, the more pollutants there are on the surface of the component, the smaller the image contrast. When the image contrast is lower than the threshold, the component is separated and transmitted to relevant technicians for processing.

[0047] S3, analyzing and processing the solder joints and pins of the soldered circuit board according to the collected PCBA circuit board image information;

[0048] In step S3, the image information of the welding surface of each PCBA circuit board after welding is collected in real time by a high-definition camera;

[0049] Use image ranging technology to measure the pin length and set a threshold for the pin length. When the pin length is less than the threshold, it is determined to be an abnormal circuit board, indicating that the components are not properly inserted, such as the component plug-in is uneven, etc.; send it to relevant technicians for inspection;

[0050] A soldering diagram of a qualified PCBA circuit board is entered into the database as the reference image y, and the collected image is x. The structural similarity index F of the image is calculated in real time by the following formula:

[0051]

[0052] z1=(β1Z) 2 , z2=(β2Z) 2 ;

[0053] in, is the pixel average of image x, is the pixel average of image y, is the pixel variance of image x, is the pixel variance of image y, α xy is the pixel covariance of image x and image y, z1 and z2 are positive constants, Z is the dynamic range of pixel values, β1 and β2 are weights; the range of the image structural similarity index is [0,1];

[0054] Set a threshold F for the structural similarity index 阈 , when F ≥ F 阈 When the soldering is qualified, it is sent to the next step of the PCBA production process for pin cutting; when F <F 阈 When the welding is judged as unqualified, it is sent to relevant technicians for maintenance, such as repair welding.

[0055] S4. According to the analysis results, the components and circuit boards are classified and processed, and the analysis results are displayed to relevant technical personnel through a display device.

[0056] In step S4, according to the results of the analysis of the surface contaminants of the components, the components are classified and processed, and the components with more contaminants are sent to relevant technicians for processing; according to the results of the analysis of the solder joints and pins of the PCBA circuit board, the circuit boards are classified and processed, and the PCBA circuit boards with unqualified welding are sent to relevant technicians for initial repair processing, and the basic information and analysis results are displayed to the relevant technicians through the display device, which improves the work efficiency of employees and reduces the pressure of manual inspection.

[0057] Implementation case 1:

[0058] When monitoring the surface contamination of electronic components, if the image contrast threshold is set to 25, the camera captures the image as When , the image contrast is: E = ∑f(m, n) 2 ÷p=[(3 2 +0 2 )+(3 2 +1 2 +3 2 )+(3 2 +3 2 )+(0 2 +4 2 +1 2 )+(4 2 +1 2 +1 2 +0 2 )+(4 2 +1 2 +3 2 )+(1 2 +3 2 )+(3 2 +0 2 +3 2 )+(3 2 +4 2 )]÷9=17.78<25;

[0059] At this point, there are contaminants on the component, which needs to be cleaned and sent to relevant technicians.

[0060] If the pin length is less than the threshold, it is determined to be an abnormal circuit board and sent to relevant technicians for inspection;

[0061] If the pin length is greater than or equal to the threshold, the solder joint is checked and the structural similarity index threshold of the image is set to F 阈 =0.95,

[0062] If the structural similarity index F of the image is: At this time, the welding is judged to be unqualified, and the PCBA circuit board is sent to relevant technicians for repair;

[0063] If the structural similarity index F of the image is: At this point, the soldering is determined to be qualified, and the PCBA circuit board is sent to the next step of the process for pin cutting;

[0064] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0065] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PCBA production process monitoring and management method based on the Internet of Things, characterized by: The following steps are involved: S1. Collect basic information. Collect component surface image information and soldered PCBA circuit board image information through camera equipment. Store the collected information and analysis results into the database and encrypt the entire process. S2. Analyze and process the contaminants on the surface of components based on the collected surface image information of components; In step S2, the surface image information of each component is collected in real time by a high-definition camera, and the image contrast E is calculated in real time as: E=∑f(m,n) 2 ÷p; Among them, f(m,n)=|mn|, which is the difference in grayscale values ​​between adjacent pixels, and p is the number of grayscale differences between adjacent pixels. By setting a threshold for image contrast, the more pollutants there are on the surface of the component, the smaller the image contrast. When the image contrast is lower than the threshold, the component is separated and sent to relevant technicians for processing. S3, analyzing and processing the solder joints and pins of the soldered circuit board according to the collected PCBA circuit board image information; In step S3, the image information of the welding surface of each PCBA circuit board after welding is collected in real time by a high-definition camera; Use image ranging technology to measure the pin length and set a threshold for the pin length. When the pin length is less than the threshold, it is determined to be an abnormal circuit board and sent to relevant technicians for inspection; A soldering diagram of a qualified PCBA circuit board is entered into the database as the reference image y, and the collected image is x. The structural similarity index F of the image is calculated in real time by the following formula: in, is the pixel average of image x, is the pixel average of image y, is the pixel variance of image x, is the pixel variance of image y, α xy is the pixel covariance of image x and image y, z1 and z2 are positive constants, Z is the dynamic range of pixel values, β1 and β2 are weights; the range of the image structural similarity index is [0,1]; Set a threshold F for the structural similarity index 阈 , when F ≥ F 阈 When the soldering is qualified, it is sent to the next step of the PCBA production process for pin cutting; when F <F 阈 When the welding is judged as unqualified, it will be sent to relevant technicians for repair; S4. Classify the components and circuit boards according to the analysis results, and display the analysis results to relevant technicians through a display device; In step S4, according to the results of the analysis of the surface contaminants of the components, the components are classified and processed, and the components with more contaminants are sent to relevant technicians for processing; according to the results of the analysis of the solder joints and pins of the PCBA circuit board, the circuit boards are classified and processed, and the PCBA circuit boards with unqualified welding are sent to relevant technicians for initial repair processing, and the basic information and analysis results are displayed to the relevant technicians through the display device.

2. A process monitoring and management system for a PCBA production process monitoring and management method based on the Internet of Things as described in any one of claim 1, characterized in that: The process monitoring and management system includes: data acquisition module, database, data analysis module and data feedback module; The data acquisition module is connected to the database, the database is connected to the data analysis module, and the data analysis module is connected to the data feedback module; the data acquisition module is used to collect basic information of PCBA and basic information of electronic components, and collect image information of components through a camera device. The database is used to store the collected data information and analysis results. The data analysis module is used to analyze and process the collected data. The data feedback module is used to display the analysis results to the user through a display device, and process the PCBA according to the analysis results.

3. According to the PCBA production process monitoring and management system based on the Internet of Things according to claim 2, it is characterized in that: The data acquisition module includes a basic information acquisition unit, a component image acquisition unit and a circuit board image acquisition unit. The basic information acquisition unit is used to acquire basic information of components, basic information of circuit boards and basic information of equipment. The component image acquisition unit uses a camera to acquire images of components that need to be plug-in, and the circuit board image acquisition unit uses a camera to acquire images of soldered PCBA circuit boards.

4. According to the PCBA production process monitoring and management system based on the Internet of Things according to claim 3, it is characterized in that: The database includes an encryption unit and a storage unit. The encryption unit encrypts the transmission information by using a salted hash encryption method. The storage unit is used to store the collected information and analysis results.

5. According to the PCBA production process monitoring and management system based on the Internet of Things according to claim 4, it is characterized in that: The data analysis module includes a component preprocessing unit and a circuit board inspection unit. The component preprocessing unit is used to analyze and process the contaminants on the surface of the components according to the collected component images, and the circuit board analysis unit is used to analyze and process the solder joints and pins of the soldered PCBA circuit board according to the collected circuit board images.

6. According to the PCBA production process monitoring and management system based on the Internet of Things according to claim 5, it is characterized in that: The data feedback module includes a component classification unit, a circuit board classification unit and a display unit. The component classification unit is used to classify components according to the results of analyzing surface contaminants of components. The circuit board classification unit is used to classify circuit boards according to the results of analyzing solder joints and pins of PCBA circuit boards. The display unit is used to display basic information and analysis results of circuit boards to relevant technicians through a display device.

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