New energy vehicle circuit board manufacturing method and new energy vehicle circuit board

Abstract

The present application provides a method for manufacturing a circuit board for a new energy vehicle and a circuit board for a new energy vehicle. The above-mentioned method for manufacturing a circuit board for a new energy vehicle includes: performing a grinding operation on a substrate; performing a copper deposition operation on a substrate to form a copper deposition board; performing a VCP electroplating operation on the copper deposition board to form an electroplated board; performing a grinding operation on the electroplated board by a ceramic grinding device; performing a polishing operation on the electroplated board by a polishing device; and manufacturing an outer layer circuit on the electroplated board. After the copper deposition board is subjected to the VCP electroplating operation, the electroplated board is polished by a ceramic grinding device to grind off the protrusions on the surface of the electroplating layer of the electroplating board, thereby improving the surface flatness of the electroplating layer of the electroplating board, so that the flatness of the gold deposition surface of the circuit board for new energy vehicles meets the design requirements, reduces the requirements for electroplating equipment, and thereby reduces the maintenance time and maintenance time of the electroplating equipment, and improves the production efficiency of the circuit board for new energy vehicles.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a method for manufacturing a new energy vehicle circuit board and a new energy vehicle circuit board. Background Art

[0002] In the electroplating process of new energy vehicle circuit boards, in order to meet the increasingly high requirements for the flatness of the surface treatment of immersion gold in new energy vehicle circuit boards, high standards, high frequencies and high requirements are generally adopted in the electroplating process to maintain and maintain the production equipment, but this will lead to lower production efficiency of new energy vehicle circuit boards. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for manufacturing a new energy vehicle circuit board and a new energy vehicle circuit board with improved production efficiency.

[0004] The objective of the present invention is achieved through the following technical solutions:

[0005] A method for manufacturing a new energy vehicle circuit board, comprising:

[0006] Performing grinding operation on the substrate;

[0007] Performing a copper deposition operation on the substrate to form a copper deposition board;

[0008] Performing a VCP electroplating operation on the copper plate to form an electroplated plate;

[0009] Grinding the electroplated plate by a ceramic grinding plate device;

[0010] Performing a polishing operation on the electroplated plate by a polishing device;

[0011] The outer layer circuit is made on the electroplating board.

[0012] In one embodiment, the ceramic grinding plate device includes a first conveying device and two ceramic grinding rollers, the two ceramic grinding rollers are arranged opposite to each other up and down, each of the ceramic grinding rollers is arranged in the first conveying device and is transmission-connected to the first conveying device, the first conveying device is used to convey the electroplated plate between the two ceramic grinding rollers, and the first conveying device is also used to drive the two ceramic grinding rollers to rotate, so that the two ceramic grinding rollers are used together to grind the electroplating layer of the electroplated plate.

[0013] In one embodiment, each of the ceramic grinding rollers includes a grinding roller body and a ceramic sleeve. The grinding roller body of each of the ceramic grinding rollers is transmission-connected to the first conveying device. The ceramic sleeve of each of the ceramic grinding rollers is fixedly sleeved on the corresponding grinding roller body. The ceramic sleeves of the two ceramic grinding rollers are used together to grind the electroplating layer of the electroplating plate.

[0014] In one embodiment, each of the ceramic grinding rollers has a plurality of ceramic sleeves, and the plurality of ceramic sleeves of each of the ceramic grinding rollers abut against each other in sequence.

[0015] In one of the embodiments, a plurality of ceramic blocks arranged at intervals are protruded from the outer surface of each ceramic sleeve.

[0016] In one embodiment, the ceramic block of each ceramic sleeve is square.

[0017] In one embodiment, the polishing device includes a second conveying device and two polishing rollers, the two polishing rollers are arranged opposite to each other up and down, each of the ceramic grinding rollers is arranged in the second conveying device and is transmission-connected to the second conveying device, the second conveying device is used to transport the electroplated plate between the two polishing rollers, and the second conveying device is also used to drive the two polishing rollers to rotate, so that the two polishing rollers are used together to polish the electroplating layer of the electroplated plate.

[0018] In one embodiment, each of the polishing rollers comprises a polishing roller body and a polishing sleeve body, the polishing roller body of each of the polishing rollers is transmission-connected to the second conveying device, and the polishing sleeve body of each of the polishing rollers is fixedly sleeved on the corresponding polishing roller body.

[0019] In one embodiment, the polishing sleeve of each polishing roller is made of non-woven material.

[0020] A new energy vehicle circuit board is prepared by using the new energy vehicle circuit board manufacturing method described in any of the above embodiments.

[0021] Compared with the prior art, the present invention has at least the following advantages:

[0022] 1. After the VCP electroplating operation is performed on the copper plate, the plated plate is polished by a ceramic grinding device to grind off the protrusions on the surface of the electroplating layer of the plated plate, thereby improving the surface flatness of the electroplating layer of the plated plate, so that the flatness of the gold-plated surface of the new energy vehicle circuit board meets the design requirements, reduces the requirements for electroplating equipment, and thus reduces the maintenance time and maintenance time of the electroplating equipment, and improves the production efficiency of the new energy vehicle circuit board.

[0023] 2. After the electroplating plate is ground by the ceramic grinding device, the electroplating plate is polished by the polishing device, thereby improving the surface finish of the electroplating layer of the electroplating plate, that is, reducing the surface roughness of the electroplating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A flowchart of a method for manufacturing a new energy vehicle circuit board according to an embodiment;

[0026] Figure 2 A schematic structural diagram of a ceramic grinding plate device according to an embodiment;

[0027] Figure 3 for Figure 2 An enlarged schematic diagram of the ceramic grinding plate device at position A is shown;

[0028] Figure 4 A schematic structural diagram of a polishing device according to an embodiment;

[0029] Figure 5 for Figure 4 An enlarged schematic diagram of the polishing device shown at B;

[0030] Figure 6 A schematic diagram of the structure of a ceramic grinding plate device and a polishing device according to an embodiment;

[0031] Figure 7 for Figure 6 The structural schematic diagram of the ceramic grinding plate device shown;

[0032] Figure 8 for Figure 6 The structural schematic diagram of the polishing device shown. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to enable the reader to understand the contents disclosed in the present invention more thoroughly and comprehensively.

[0034] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] The present application provides a method for manufacturing a circuit board for a new energy vehicle, comprising: performing a grinding operation on a substrate; performing a copper deposition operation on the substrate to form a copper deposition board; performing a VCP electroplating operation on the copper deposition board to form an electroplated board; performing a grinding operation on the electroplated board by a ceramic grinding device; performing a polishing operation on the electroplated board by a polishing device; and manufacturing an outer layer circuit on the electroplated board.

[0037] The above-mentioned method for manufacturing circuit boards for new energy vehicles, after VCP electroplating operation is performed on the copper-plated plate, grinding operation is performed on the electroplated plate by means of a ceramic grinding plate device, the protrusions on the surface of the electroplated layer of the electroplated plate are ground off, and the surface flatness of the electroplated layer of the electroplated plate is improved, so that the flatness of the surface of the gold-plated surface of the circuit board for new energy vehicles meets the design requirements, and the requirements for electroplating equipment are reduced, thereby reducing the maintenance time and maintenance time of the electroplating equipment, and improving the production efficiency of the circuit board for new energy vehicles. After the electroplating plate is polished by means of a ceramic grinding plate device, the electroplated plate is polished by means of a polishing device, so that the surface finish of the electroplated layer of the electroplated plate is improved, that is, the surface roughness of the electroplated layer is reduced.

[0038] In order to better understand the technical solutions and beneficial effects of the present application, the present application is further described in detail below in conjunction with specific embodiments:

[0039] like Figure 1 As shown, a method for manufacturing a new energy vehicle circuit board in one embodiment includes:

[0040] S101: performing a grinding operation on the substrate.

[0041] In this embodiment, the substrate is a plate through which holes are drilled, and the edges of the holes have burrs. The burrs of the substrate are removed by grinding the substrate so as to perform a copper deposition operation.

[0042] S103: performing copper deposition operation on the substrate to form a copper deposition board.

[0043] In this embodiment, a copper layer is attached to the surface of the substrate and the hole wall by performing a copper deposition operation on the substrate. Since the copper deposition operation belongs to the prior art, it is not described in detail in this application.

[0044] S105: performing VCP electroplating operation on the copper plate to form an electroplated plate.

[0045] In this embodiment, the VCP electroplating is vertical continuous electroplating, and a plating layer is formed on the surface and inner wall of the copper plate by VCP electroplating.

[0046] S107: Grinding the electroplated plate by a ceramic grinding plate device.

[0047] In this embodiment, the surface of the electroplated plate is polished by a ceramic grinding plate device to grind off the protrusions on the surface of the electroplated layer of the electroplated plate to improve the surface flatness of the electroplated plate, that is, to improve the flatness of the immersion gold surface of the new energy vehicle circuit board.

[0048] S109: polishing the electroplated plate by a polishing device.

[0049] In this embodiment, the surface of the electroplated plate is polished by a polishing device, so that the surface of the copper plating layer of the electroplated plate is polished, thereby improving the surface finish of the electroplated layer of the electroplated plate, that is, reducing the surface roughness of the electroplated layer of the electroplated plate.

[0050] S111: Make outer circuits on the electroplating board.

[0051] In this embodiment, an outer layer circuit is made on the surface of the electroplating plate. Since the outer layer circuit production belongs to the prior art, it is not elaborated in detail in this application.

[0052] The above-mentioned method for manufacturing circuit boards for new energy vehicles, after VCP electroplating operation is performed on the copper-plated plate, grinding operation is performed on the electroplated plate by means of a ceramic grinding plate device, the protrusions on the surface of the electroplated layer of the electroplated plate are ground off, and the surface flatness of the electroplated layer of the electroplated plate is improved, so that the flatness of the surface of the gold-plated surface of the circuit board for new energy vehicles meets the design requirements, and the requirements for electroplating equipment are reduced, thereby reducing the maintenance time and maintenance time of the electroplating equipment, and improving the production efficiency of the circuit board for new energy vehicles. After the electroplating plate is polished by means of a ceramic grinding plate device, the electroplated plate is polished by means of a polishing device, so that the surface finish of the electroplated layer of the electroplated plate is improved, that is, the surface roughness of the electroplated layer is reduced.

[0053] like Figure 2As shown, in one embodiment, the ceramic grinding plate device 10 includes a first conveying device 100 and two ceramic grinding rollers 200, the two ceramic grinding rollers 200 are arranged opposite to each other up and down, each ceramic grinding roller 200 is arranged in the first conveying device 100 and is connected to the first conveying device 100 by transmission, the first conveying device 100 is used to convey the electroplating plate 20 to between the two ceramic grinding rollers 200, and the first conveying device 100 is also used to drive the two ceramic grinding rollers 200 to rotate, so that the two ceramic grinding rollers 200 are used together to grind the electroplating layer of the electroplating plate 20. In this embodiment, the first conveying device 100 is a conventional circuit board conveying device, and the pressure of each ceramic grinding roller 200 on the electroplating plate 20 can be adjusted by adjusting the gap between the two ceramic grinding rollers 200, thereby realizing the adjustment of the grinding amount of the two ceramic grinding rollers 200 on the electroplating plate 20.

[0054] like Figure 2 As shown, in one embodiment, each ceramic grinding roller 200 includes a grinding roller body 210 and a ceramic sleeve 220. The grinding roller body 210 of each ceramic grinding roller 200 is transmission-connected to the first conveying device 100. The ceramic sleeve 220 of each ceramic grinding roller 200 is fixedly sleeved on the corresponding grinding roller body 210. The ceramic sleeves 220 of the two ceramic grinding rollers 200 are used together to grind the electroplating layer of the electroplating plate 20.

[0055] like Figure 2 As shown, in one embodiment, each ceramic grinding roller 200 has a plurality of ceramic sleeves 220 , and the plurality of ceramic sleeves 220 of each ceramic grinding roller 200 are abutted in sequence, thereby reducing the manufacturing difficulty of each ceramic grinding roller 200 .

[0056] In one embodiment, a plurality of ceramic blocks disposed at intervals are protruded from the outer surface of each ceramic sleeve 220 , so that each ceramic sleeve 220 can grind the electroplating plate 20 .

[0057] In one embodiment, the ceramic blocks of each ceramic sleeve 220 are square in shape, so as to improve the polishing effect of each ceramic sleeve 220 .

[0058] like Figure 4As shown, in one embodiment, the polishing device 30 includes a second conveying device 300 and two polishing rollers 400, the two polishing rollers 400 are arranged opposite to each other up and down, each ceramic grinding roller 200 is arranged in the second conveying device 300 and is transmission-connected to the second conveying device 300, the second conveying device 300 is used to convey the electroplated board 20 to between the two polishing rollers 400, and the second conveying device 300 is also used to drive the two polishing rollers 400 to rotate, so that the two polishing rollers 400 are used together to polish the electroplating layer of the electroplated board 20. In this embodiment, the second conveying device 300 is a conventional circuit board conveying device, and the pressure of each polishing roller 400 on the electroplated board 20 can be adjusted by adjusting the gap between the two polishing rollers 400, thereby achieving the adjustment of the grinding amount of the two polishing rollers 400 on the electroplated board 20.

[0059] like Figure 4 As shown, in one embodiment, each polishing roller 400 includes a polishing roller body 410 and a polishing sleeve body 420 . The polishing roller body 410 of each polishing roller 400 is transmission-connected to the second conveying device 300 , and the polishing sleeve body 420 of each polishing roller 400 is fixedly sleeved on the corresponding polishing roller body 410 .

[0060] In one embodiment, the polishing sleeve 420 of each polishing roller 400 is made of non-woven material, so that the polishing sleeve 420 of each polishing roller 400 can polish the electroplating plate 20 .

[0061] like Figure 2 As shown, in one embodiment, the ceramic grinding plate device 10 also includes a grinding plate pressure regulating mechanism 500, which is installed on the first conveying device 100, and the power output end of the grinding plate pressure regulating mechanism 500 is connected to the upper ceramic grinding roller 200, and the grinding plate pressure regulating mechanism 500 is used to adjust the height of the upper ceramic grinding roller 200 to achieve the gap adjustment between the two ceramic grinding rollers 200, thereby achieving the pressure adjustment of each ceramic grinding roller 200 on the electroplating plate 20, and thereby achieving the adjustment of the grinding amount. Through the adjustment of the grinding plate pressure regulating mechanism 500, the grinding amount is within an appropriate range, and the loss of the electroplating layer is reduced while ensuring the flatness of the electroplating layer.

[0062] like Figure 2 and Figure 3As shown, in one embodiment, the grinding plate pressure adjustment mechanism 500 includes a first rotating rod 510 and a first connecting rod 520, the first rotating rod 510 is inserted into the first frame 110 of the first conveying device 100 and is threadedly connected to the first frame 110, the lower end of the first rotating rod 510 is rotatably connected to the upper end of the first connecting rod 520, and the first rotating rod 510 is also used to limit the movement of the first connecting rod 520 in the extension direction, and the lower end of the first connecting rod 520 is rotatably connected to the ceramic grinding roller 200 located above. In this embodiment, when adjusting the grinding amount, the first rotating rod 510 is rotated to move the first rotating rod 510 upward or downward, so that the first rotating rod 510 drives the first connecting rod 520 and the ceramic grinding roller 200 located above to move upward or downward together, thereby realizing the gap adjustment between the two ceramic grinding rollers 200, that is, realizing the pressure adjustment of each ceramic grinding roller 200 on the electroplating plate 20, thereby realizing the adjustment of the grinding amount.

[0063] like Figure 3 As shown, in one embodiment, the grinding plate pressure adjustment mechanism 500 further includes a first control wheel 530, and the center of the first control wheel 530 is fixedly connected to the first rotating rod 510. In this embodiment, the first rotating rod 510 is rotated by rotating the first control wheel 530, thereby improving the convenience of adjusting the grinding amount.

[0064] like Figure 3 As shown, in one embodiment, the first rotating rod 510 is provided with a first connecting hole 511, and the first rotating rod 510 is provided with a first limiting groove 512 on the inner wall of the first connecting hole 511, and the first limiting groove 512 extends to the upper end surface of the first rotating rod 510, and the upper end of the first connecting rod 520 is located in the first connecting hole 511, and the upper end of the first connecting rod 520 is convexly provided with a first limiting portion 521, and the first limiting portion 521 is located in the first limiting groove 512, and the grinding plate pressure adjustment mechanism 500 also includes a first limiting rod 540, and the lower end of the first limiting rod 540 is located in the first limiting groove 512 and is threadedly connected to the first rotating rod 510, so that the first limiting portion 521 is located between the first limiting rod 540 and the groove wall of the first limiting groove 512, thereby limiting the movement of the first connecting rod 520 in the extension direction. In this embodiment, since the lower end of the first limiting rod 540 is located in the first limiting groove 512 and is threadedly connected to the first rotating rod 510, the first limiting rod 540 is detachably connected to the first rotating rod 510. When installing the first connecting rod 520, the first connecting rod 520 is inserted into the first limiting groove 512, thereby avoiding interference between the first limiting portion 521 and the first rotating rod 510, and improving the assembly convenience of the grinding plate pressure adjustment mechanism 500.

[0065] like Figure 3As shown, in one embodiment, the grinding plate pressure adjustment mechanism 500 further includes a first elastic buffer pad 550, which is located in the first limiting groove 512, and the first elastic buffer pad 550 elastically abuts against the lower end of the first limiting rod 540 and the upper end of the first connecting rod 520. In this embodiment, when the electroplating plate 20 enters between the two ceramic grinding rollers 200, it will abut against the two ceramic grinding rollers 200. At this time, the ceramic grinding roller 200 located on the upper side will move up and squeeze the first elastic buffer pad 550, so that the first elastic buffer pad 550 plays a role in buffering the impact force of the electroplating plate 20, reducing the probability of the electroplating plate 20 being damaged and improving the production qualification rate.

[0066] like Figure 4 and Figure 5 As shown, in one embodiment, the polishing device 30 also includes a polishing pressure regulating mechanism 600, which is installed on the second conveying device 300, and the power output end of the polishing pressure regulating mechanism 600 is connected to the upper polishing roller 400. The polishing pressure regulating mechanism 600 is used to adjust the height of the upper polishing roller 400 to achieve the gap adjustment between the two polishing rollers 400, thereby achieving the pressure adjustment of each polishing roller 400 on the electroplating plate 20, and thereby achieving the adjustment of the grinding amount. Through the adjustment of the polishing pressure regulating mechanism 600, the grinding amount is within an appropriate range, which ensures the flatness of the electroplating layer while reducing the loss of the electroplating layer.

[0067] like Figure 5 As shown, in one embodiment, the polishing pressure adjustment mechanism 600 includes a second rotating rod 610 and a second connecting rod 620, the second rotating rod 610 is inserted into the second frame 310 of the second conveying device 300 and is threadedly connected to the second frame 310, the lower end of the second rotating rod 610 is rotatably connected to the upper end of the second connecting rod 620, and the second rotating rod 610 is also used to limit the movement of the second connecting rod 620 in the extension direction, and the lower end of the second connecting rod 620 is rotatably connected to the polishing roller 400 located above. In this embodiment, when adjusting the grinding amount, the second rotating rod 610 is rotated to move the second rotating rod 610 upward or downward, so that the second rotating rod 610 drives the second connecting rod 620 and the polishing roller 400 located above to move upward or downward together, thereby realizing the gap adjustment between the two polishing rollers 400, that is, realizing the pressure adjustment of each polishing roller 400 on the electroplating plate 20, thereby realizing the adjustment of the grinding amount.

[0068] In one embodiment, the polishing pressure adjustment mechanism 600 further includes a second control wheel 630, the center of which is fixedly connected to the second rotating rod 610. In this embodiment, the second rotating rod 610 is rotated by rotating the second control wheel 630, thereby improving the convenience of adjusting the polishing amount.

[0069] In one embodiment, the second rotating rod 610 is provided with a second connecting hole 611, and the second rotating rod 610 is provided with a second limiting groove 612 on the inner wall of the second connecting hole 611, and the second limiting groove 612 extends to the upper end surface of the second rotating rod 610, and the upper end of the second connecting rod 620 is located in the second connecting hole 611, and the upper end of the second connecting rod 620 is protruding with a second limiting portion 621, and the second limiting portion 621 is located in the second limiting groove 612. The polishing pressure adjustment mechanism 600 also includes a second limiting rod 640, and the lower end of the second limiting rod 640 is located in the second limiting groove 612 and is threadedly connected to the second rotating rod 610, so that the second limiting portion 621 is located between the second limiting rod 640 and the groove wall of the second limiting groove 612, thereby limiting the movement of the second connecting rod 620 in the extension direction. In this embodiment, since the lower end of the second limiting rod 640 is located in the second limiting groove 612 and is threadedly connected to the second rotating rod 610, the second limiting rod 640 is detachably connected to the second rotating rod 610. When the second connecting rod 620 is installed, the second connecting rod 620 is inserted into the second limiting groove 612 to avoid interference between the second limiting portion 621 and the second rotating rod 610, thereby improving the convenience of assembly of the polishing pressure adjustment mechanism 600.

[0070] like Figure 5 As shown, in one embodiment, the polishing pressure adjustment mechanism 600 further includes a second elastic buffer pad 650, which is located in the second limiting groove 612, and the second elastic buffer pad 650 elastically abuts against the lower end of the second limiting rod 640 and the upper end of the second connecting rod 620. In this embodiment, when the electroplating plate 20 enters between the two polishing rollers 400, it abuts against the two polishing rollers 400. At this time, the polishing roller 400 located on the upper side moves up and squeezes the second elastic buffer pad 650, so that the second elastic buffer pad 650 plays a role in buffering the impact force of the electroplating plate 20, reducing the probability of the electroplating plate 20 being damaged and improving the production qualification rate.

[0071] In one embodiment, during the step of grinding the electroplated plate by the ceramic grinding plate device, water is sprayed on the electroplated plate. In this embodiment, by spraying water on the electroplated plate, the water flushes the powder formed by grinding away from the electroplated plate, thereby improving the grinding effect.

[0072] In one embodiment, during the step of polishing the electroplated plate by the polishing device, water is sprayed on the electroplated plate. In this embodiment, by spraying water on the electroplated plate, the water flushes the powder formed by polishing away from the electroplated plate, thereby improving the polishing effect.

[0073] In one embodiment, after the step of polishing the electroplating plate by a polishing device and before the step of making the outer layer circuit on the electroplating plate, the method for making the circuit board of a new energy vehicle further includes: cleaning the electroplating plate; and drying the electroplating plate. In this embodiment, the electroplating plate is cleaned to completely remove the powder formed on the electroplating plate due to grinding and polishing, thereby improving the cleanliness of the electroplating plate and preventing the powder from having an adverse effect on the production of the outer layer circuit. After the electroplating plate is cleaned, the electroplating plate is dried to prevent the moisture on the electroplating plate from having an adverse effect on the production of the outer layer circuit.

[0074] The present application also provides a new energy vehicle circuit board, which is prepared by the new energy vehicle circuit board manufacturing method described in any of the above embodiments. Further, the new energy vehicle circuit board manufacturing method includes: grinding the substrate; copper deposition on the substrate to form a copper deposition board; VCP electroplating the copper deposition board to form an electroplated board; grinding the electroplated board by a ceramic grinding device; polishing the electroplated board by a polishing device; and making an outer layer circuit on the electroplated board.

[0075] The above-mentioned new energy vehicle circuit board, after the VCP electroplating operation is performed on the copper plate, the electroplating plate is polished by a ceramic grinding plate device to grind off the protrusions on the surface of the electroplating layer of the electroplating plate, thereby improving the surface flatness of the electroplating layer of the electroplating plate, so that the flatness of the gold-plating surface of the new energy vehicle circuit board meets the design requirements, reduces the requirements for the electroplating equipment, thereby reducing the maintenance time and maintenance time of the electroplating equipment, and improving the production efficiency of the new energy vehicle circuit board. After the electroplating plate is polished by the ceramic grinding plate device, the electroplating plate is polished by the polishing device, thereby improving the surface finish of the electroplating layer of the electroplating plate, that is, reducing the surface roughness of the electroplating layer.

[0076] Compared with the prior art, the present invention has at least the following advantages:

[0077] 1. After the VCP electroplating operation is performed on the copper plate, the plated plate is polished by a ceramic grinding device to grind off the protrusions on the surface of the electroplating layer of the plated plate, thereby improving the surface flatness of the electroplating layer of the plated plate, so that the flatness of the gold-plated surface of the new energy vehicle circuit board meets the design requirements, reduces the requirements for electroplating equipment, and thus reduces the maintenance time and maintenance time of the electroplating equipment, and improves the production efficiency of the new energy vehicle circuit board.

[0078] 2. After the electroplating plate is ground by the ceramic grinding device, the electroplating plate is polished by the polishing device, thereby improving the surface finish of the electroplating layer of the electroplating plate, that is, reducing the surface roughness of the electroplating layer.

[0079] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a new energy vehicle circuit board, characterized in that: include: Performing grinding operation on the substrate; Performing a copper deposition operation on the substrate to form a copper deposition board; Performing a VCP electroplating operation on the copper plate to form an electroplated plate; Grinding the electroplated plate by a ceramic grinding plate device; Performing a polishing operation on the electroplated plate by a polishing device; Making outer circuits on the electroplating board; Wherein, the ceramic grinding plate device includes a first conveying device, a grinding plate pressure regulating mechanism and two ceramic grinding rollers, the grinding plate pressure regulating mechanism is installed on the first conveying device, the two ceramic grinding rollers are arranged opposite to each other up and down, the power output end of the grinding plate pressure regulating mechanism is connected to the ceramic grinding roller on the upper side, each of the ceramic grinding rollers is arranged in the first conveying device and is transmission-connected to the first conveying device, the first conveying device is used to convey the electroplated plate to between the two ceramic grinding rollers, and the first conveying device is also used to drive the two ceramic grinding rollers to rotate, so that the two ceramic grinding rollers are used together to grind the electroplating layer of the electroplated plate; The grinding plate pressure adjustment mechanism includes a first rotating rod, a first connecting rod, a first control wheel, a first limiting rod and a first elastic buffer pad; the first rotating rod is inserted into the first frame of the first conveying device and is threadedly connected to the first frame, the lower end of the first rotating rod is rotatably connected to the upper end of the first connecting rod, and the first rotating rod is also used to limit the movement of the first connecting rod in the extension direction, and the lower end of the first connecting rod is rotatably connected to the ceramic grinding roller located above; the center of the first control wheel is fixedly connected to the first rotating rod; the first rotating rod is provided with a first connecting hole, the first rotating rod is provided with a first limiting groove on the inner wall of the first connecting hole, the first limiting groove extends to the upper end surface of the first rotating rod, the upper end of the first connecting rod is located in the first connecting hole, and the upper end of the first connecting rod is convexly provided with a first limiting portion, and the first limiting portion is located in the first limiting groove; the lower end of the first limiting rod is located in the first limiting groove and is threadedly connected to the first rotating rod; the first elastic buffer pad is located in the first limiting groove, and the first elastic buffer pad elastically abuts against the lower end of the first limiting rod and the upper end of the first connecting rod respectively.

2. The method for manufacturing a new energy vehicle circuit board according to claim 1, characterized in that: Each of the ceramic grinding rollers includes a grinding roller body and a ceramic sleeve. The grinding roller body of each of the ceramic grinding rollers is transmission-connected to the first conveying device. The ceramic sleeve of each of the ceramic grinding rollers is fixedly sleeved on the corresponding grinding roller body. The ceramic sleeves of the two ceramic grinding rollers are used together to grind the electroplating layer of the electroplating plate.

3. The method for manufacturing a new energy vehicle circuit board according to claim 2, characterized in that: The number of the ceramic sleeves of each of the ceramic grinding rollers is multiple, and the multiple ceramic sleeves of each of the ceramic grinding rollers are abutted in sequence.

4. The method for manufacturing a new energy vehicle circuit board according to claim 3, characterized in that: A plurality of ceramic blocks arranged at intervals are protruded from the outer surface of each ceramic sleeve.

5. The method for manufacturing a new energy vehicle circuit board according to claim 4, characterized in that: The ceramic blocks of each ceramic sleeve are square.

6. The method for manufacturing a new energy vehicle circuit board according to claim 1, characterized in that: The polishing device includes a second conveying device and two polishing rollers. The two polishing rollers are arranged opposite to each other up and down. Each of the ceramic grinding rollers is arranged in the second conveying device and is transmission-connected to the second conveying device. The second conveying device is used to transport the electroplated plate between the two polishing rollers. The second conveying device is also used to drive the two polishing rollers to rotate, so that the two polishing rollers are used together to polish the electroplated layer of the electroplated plate.

7. The method for manufacturing a new energy vehicle circuit board according to claim 6, characterized in that: Each of the polishing rollers comprises a polishing roller body and a polishing sleeve body. The polishing roller body of each of the polishing rollers is transmission-connected to the second conveying device, and the polishing sleeve body of each of the polishing rollers is fixedly sleeved on the corresponding polishing roller body.

8. The method for manufacturing a new energy vehicle circuit board according to claim 7, characterized in that: The polishing sleeve body of each polishing roller is made of non-woven material.

9. A new energy vehicle circuit board, characterized in that: The method for manufacturing a new energy vehicle circuit board according to any one of claims 1 to 8 is used for the preparation.

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