A heating base and a method for heating and coating a substrate

Abstract

The present invention discloses a heating base and a method for heating and coating a substrate. The base includes: a vacuum chamber, a substrate chamber, a heating device, a substrate fixture, and a lifting device; the substrate chamber is connected to a cooling device to achieve cooling; the top of the substrate chamber is hermetically connected to the vacuum chamber, and the bottom of the substrate chamber is hermetically connected to the heating device; the substrate fixture is detachable from the substrate chamber to fix the substrate; the heating device is provided with a plurality of gas inlets and outlets, and heating gas enters the heating device and is heated to achieve heating of the substrate; cooling gas enters the heating device to achieve cooling of the heating device; the bottom of the heating device is connected to the lifting device, and the lifting device drives the heating device to drive the vacuum chamber and the substrate chamber to reciprocally lift, so as to realize the lifting of the substrate to a preset coating position in the vacuum chamber. The present invention has the advantages of compact structure, high heating uniformity, and precise control, etc., solves the problem of low substrate coating quality caused by uneven heating, easy displacement of the substrate, and difficult substrate clamping, and realizes high-quality coating of the substrate.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor vacuum coating, and particularly relates to a heating base and a substrate heating and coating method, which are used to realize the lifting and high-temperature heating of a coating substrate. Background Art

[0002] Existing heating bases for vacuum coating, on the one hand, realize the lifting of the substrate through the up and down movement of different strokes, and on the other hand, uniformly heat the substrate through a heater to ensure good heating uniformity at different temperatures, thereby ensuring the coating quality. At the same time, the heater also needs to be cooled to prevent overheating and affect the safety of the equipment.

[0003] Traditional heaters are difficult to meet the requirements of vacuum coating. For example, it is difficult to achieve high uniformity heating through solid contact heating, and it is easy to change the position of the substrate by backpressure gas-assisted heating. Moreover, the method of vacuum adsorbing the substrate is not applicable to vacuum coating, and due to the too thin thickness of the substrate, it is also inconvenient to clamp. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a heating base and a substrate heating and coating method with a compact structure, simple operation, high heating uniformity, precise control and wide application range.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A heating base includes: a vacuum chamber, a substrate chamber, a heating device, a substrate fixture and a lifting device; the substrate chamber is connected to a cooling device to realize the cooling of the substrate chamber; the top of the substrate chamber is hermetically connected to the vacuum chamber, and the bottom of the substrate chamber is hermetically connected to the heating device; the substrate fixture is detachably arranged on the side of the substrate chamber to fix the substrate in the substrate chamber; the heating device is provided with heating gas inlets and outlets, gas enters the heating device and is heated, and the gas heated to a preset temperature enters the substrate chamber to realize the heating of the substrate; the heating device is also provided with cooling gas inlets and outlets, cooling gas enters the heating device to realize the cooling of the heating device, the inert gas first cools the heating device, and then is heated by the heating device; the bottom of the heating device is connected to the lifting device, and under the drive of the lifting device, the heating device reciprocates up and down, and drives the vacuum chamber and the substrate chamber to reciprocate up and down to realize the lifting of the substrate to a preset coating position in the vacuum chamber.

[0007] As a further improvement of the present invention, the heating device includes a heating gas pipe, a ring heater, an upper partition plate and a lower partition plate. The heating gas pipe is fixed in the ring heater through the upper partition plate and the lower partition plate. The lower partition plate is connected to the lifting device, and the upper partition plate is connected to the substrate cover. The heating gas pipe is provided with gas inlets and outlets to enable an inert gas to enter the heating gas pipe. Under the heating effect of the ring heater, the gas is heated to a preset temperature and then output from the heating gas pipe into the substrate cover to heat the substrate in the substrate cover to the preset coating temperature.

[0008] As a further improvement of the present invention, the heating device further includes a cooling channel, a transition gas pipe and a gas storage ring. The cooling channel surrounds the outer edge of the ring heater to form the barrel wall of the heating device. The transition gas pipe and the gas storage ring are arranged at the bottom of the cooling channel. One end of the transition gas pipe is provided with a second air inlet, and the other end of the transition gas pipe is communicated with the first air inlet of the cooling channel. The first air outlet of the cooling channel is communicated with the gas storage ring, and the second air outlet of the gas storage ring is communicated with the third air inlet of the heating gas pipe. The inert gas flows through the second air inlet, the transition gas pipe and the first air inlet in sequence and then enters the cooling channel, flows around the outer edge of the ring heater for one week and then enters the gas storage ring. After the gas pressure in the gas storage ring reaches the preset value, the second air outlet is opened, and the gas enters the heating gas pipe through the third air inlet for heating. After the heating reaches the preset temperature, the gas enters the substrate cover through the third air outlet of the heating gas pipe.

[0009] As a further improvement of the present invention, a plurality of heating gas pipes are stacked in series in the vertical direction in the ring heater.

[0010] As a further improvement of the present invention, a pressure relief valve is provided on the gas storage ring.

[0011] As a further improvement of the present invention, a ring-shaped substrate baffle is provided at the top of the substrate cover to limit the movement of the substrate in the vertical direction. A fixture inlet is provided on the side of the substrate cover to enable the substrate fixture to enter and exit the substrate cover.

[0012] As a further improvement of the present invention, the distance between the substrate baffle and the fixture inlet is less than 2 mm.

[0013] As a further improvement of the present invention, the substrate fixture includes an arc-shaped support piece, an electric spring and an arc edge. The arc edge is arranged on the outside of the arc-shaped support piece, and the electric spring is located at the connection between the arc-shaped support piece and the arc edge. The arc-shaped support piece is used to carry the substrate, and the arc edge is used to realize the sealing connection between the substrate fixture and the substrate cover. After the substrate is clamped and fixed in the substrate cover, the electric spring is used to push the arc-shaped support piece away from the substrate.

[0014] As a further improvement of the present invention, the lifting device includes: a connecting rod, a hollow main shaft, a balance rod and a base. The top of the hollow main shaft is hermetically connected to the bottom of the heating device, and the bottom of the hollow main shaft is connected to a driving motor disposed within the base. Driven by the driving motor, the hollow main shaft drives the heating device to reciprocally lift and lower. The base is provided with a connecting rod and a balance rod. The middle of the connecting rod is connected to the hollow main shaft, and both sides of the connecting rod are respectively connected to the balance rod, and the balance rod is used to assist the hollow main shaft in lifting and lowering.

[0015] As a further improvement of the present invention, a heating gas inlet pipe, a heating gas outlet pipe, a substrate cooling gas inlet pipe and a substrate cooling gas outlet pipe are provided within the hollow main shaft; the heating gas inlet pipe is connected to the second air inlet to enable an inert gas to enter the heating base, and the heating gas outlet pipe is connected to the substrate cover to enable the inert gas to be discharged from the heating base; the substrate cooling gas inlet pipe and the substrate cooling gas outlet pipe are connected to the substrate cover to enable a cooling gas to enter and exit the substrate cover.

[0016] As a general technical concept, the present invention further provides a substrate heating and coating method based on the above heating base, including the following steps:

[0017] S1. Evacuate the vacuum chamber, and use a substrate fixture to place the substrate at a predetermined position within the substrate cover;

[0018] S2. Input an inert gas into the heating base through the heating gas inlet pipe. The inert gas enters the cooling channel after passing through the second air inlet, the transition pipe, and the first air inlet, flows around the outer edge of the annular heater for one week, and then enters the gas storage ring;

[0019] S3. After the gas pressure within the gas storage ring reaches a preset value, open the second air outlet. The gas enters the heating gas pipe through the third air inlet, and the annular heater heats the inert gas; after the heating reaches a preset temperature, the gas enters the substrate cover through the third air outlet;

[0020] S4. Use an electric spring to move the arc-shaped support piece of the substrate fixture to the periphery of the substrate to prevent the arc-shaped support piece from affecting the pressure and heat on the substrate;

[0021] S5. Determine the vacuum degree within the vacuum chamber in combination with the relative magnitudes of the process gas delivery rate, the substrate cover leakage rate, and the evacuation rate. After the vacuum degree within the vacuum chamber meets the predetermined requirements, perform the coating process;

[0022] S6. After the coating process is completed, first use an electric spring to reset the arc-shaped support piece of the substrate fixture, then relieve the pressure of the substrate cover. The substrate falls back onto the substrate fixture under the action of its own gravity, take out the substrate, turn off the annular heater, and finally turn off the input gas to complete one coating process.

[0023] Compared with the prior art, the advantages of the present invention are as follows:

[0024] 1. For the heating base of the present invention, by arranging a heating device at the bottom of the substrate cover, and the inert gas first cools the heating device and then is heated by the heating device. The heated inert gas is transported into the substrate cover by the heating device. By using the heated inert gas to evenly fill the space between the substrate and the substrate cover, when the substrate is placed on the substrate cover, both substrate heating and substrate clamping by air pressure are achieved, enabling the heating gas to fully contact the substrate, effectively improving the heating uniformity of the substrate. At the same time, by connecting the substrate cover to an external cooling device, rapid cooling of the substrate cover and the substrate is realized. Further, driven by the lifting device, the heating base reciprocates up and down, enabling the substrate cover to be lifted and lowered to a preset coating position in the vacuum chamber, improving the flexibility of use of the heating base. The present invention has advantages such as a large stroke, a small volume, good heating uniformity, and low cost.

[0025] 2. For the heating base of the present invention, by using the gas to be heated to first cool the ring heater and then using the ring heater to heat the gas with a certain temperature, a heating effect with twice the result and half the effort can be achieved. Moreover, this heating method does not depend on the thermal uniformity of the heater, reducing the requirements for the heater. By completely using the heating gas to heat the substrate, the temperature uniformity of the substrate is significantly improved. At the same time, using gas pressure to clamp the substrate also solves the problem that the backpressure gas affects the substrate positioning. Further, the design of the double balance rods improves the smoothness of different strokes during the lifting movement of the heating base to prevent jamming.

[0026] 3. For the substrate heating and coating method of the present invention, first, the inert gas is used to cool the heating device to ensure the stable operation of the heating device. Then, the heater is used to heat this inert gas, making full use of the advantages of both the heater cooling and gas heating methods, while cooling the heater and also increasing the heating speed of the gas. When the preset gas pressure is reached in the heating device, the gas is heated. After the gas is heated to the preset temperature, it directly enters the substrate cover from the heating device. This can not only use air pressure to tightly fix the substrate in the substrate cover to prevent the substrate from deviating during the coating process, but also use the heating gas to quickly and evenly heat the substrate, achieving basically the same temperature everywhere in the substrate cover. Combined with the cooperation of the backpressure gas, uniform heating of each part of the substrate is achieved, and finally high-quality coating of the substrate is realized. Description of the Drawings

[0027] Figure 1 It is a schematic structural principle diagram of the heating base of the present invention.

[0028] Figure 2 It is a schematic structural principle diagram of the heating device in the present invention.

[0029] Figure 3 It is a schematic diagram of the structural principle of another perspective of the heating device in the present invention.

[0030] Figure 4 It is a schematic diagram of the structural principle of the bottom of the heating device in the present invention.

[0031] Figure 5 It is a schematic diagram of the structural principle of the heating gas pipe in the present invention. Among them, Figure (a) is a top view and Figure (b) is a three-dimensional view.

[0032] Figure 6 It is a schematic diagram of the structural principle of the partition in the present invention. Among them, Figure (a) is the upper partition and Figure (b) is the lower partition.

[0033] Figure 7 It is a schematic diagram of the structural principle of the hollow main shaft in the present invention.

[0034] Figure 8 It is a schematic diagram of the structural principle of the base in the present invention.

[0035] Figure 9 It is a schematic diagram of the structural principle of the substrate cover in the present invention.

[0036] Figure 10 It is a schematic diagram of the structural principle of the substrate fixture in the present invention.

[0037] Figure 11 It is a schematic diagram of the structural principle of the connecting rod in the present invention.

[0038] Figure 12 It is a schematic diagram of the process of heating and coating the substrate in the present invention.

[0039] Legend Explanation: 1. Vacuum cover; 2. Substrate cover; 3. Heating device; 4. Bellows; 5. Connecting rod; 6. Substrate fixture; 7. Hollow main shaft; 8. Balance rod; 9. Base; 31. Cooling channel; 32. Heating gas pipe; 33. Ring heater; 34. First air inlet; 35. First air outlet; 36. Second air inlet; 37. Pressure relief valve; 38. Second air outlet; 39. Third air outlet; 321. Third air inlet; 361. Transition gas pipe; 362. Gas storage ring; 331. Upper partition; 332. Lower partition; 61. Arc-shaped support piece; 62. Electric spring; 63. Arc edge; 21. Substrate edge stop; 22. Fixture inlet; 51. Balance rod matching hole; 52. Main shaft fixing hole; 71. Heating gas inlet pipe; 72. Heating gas outlet pipe; 73. Substrate cooling gas inlet pipe; 74. Substrate cooling gas outlet pipe. Detailed Implementation Manner

[0040] The present invention will be further described below in conjunction with the accompanying drawings of the specification and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0041] Embodiment 1

[0042] As Figures 1 to 11 shown, the heating base of the present invention includes: a vacuum cover 1, a substrate cover 2, a heating device 3, a substrate fixture 6 and a lifting device. The substrate cover 2 is connected to a cooling device to cool the substrate cover 2. The top of the substrate cover 2 is hermetically connected to the vacuum cover 1, and the bottom of the substrate cover 2 is hermetically connected to the heating device 3; the substrate fixture 6 is detachably arranged on the side of the substrate cover 2 to fix the substrate in the substrate cover 2. The heating device 3 is provided with heating gas inlets and outlets. Gas enters the heating device 3 and is heated, and the gas heated to a preset temperature enters the substrate cover 2 to heat the substrate. The heating device 3 is also provided with cooling gas inlets and outlets. Cooling gas enters the heating device 3 to cool the heating device 3. The inert gas first cools the heating device 3 and then is heated by the heating device 3. That is to say, the gas entering the heating base is the same gas. It first cools the heating device 3, then is heated by the heating device 3, and finally enters the substrate cover 2 to heat the substrate. The bottom of the heating device 3 is connected to the lifting device. Driven by the lifting device, the heating device 3 reciprocates up and down, driving the vacuum cover 1 and the substrate cover 2 to reciprocate up and down, so as to lift the substrate in the vacuum chamber to a preset coating position.

[0043] In this embodiment, the heating device 3 includes a heating gas pipe 32, an annular heater 33, an upper partition 331 and a lower partition 332. The heating gas pipe 32 is fixed in the annular heater 33 through the upper partition 331 and the lower partition 332. The lower partition 332 is connected to the lifting device, and the upper partition 331 is connected to the substrate cover 2. The heating gas pipe 32 is provided with gas inlets and outlets to allow the inert gas to enter the heating gas pipe 32. Under the heating action of the annular heater 33, the gas is heated to a preset temperature and is output from the heating gas pipe 32 to the substrate cover 2 to heat the substrate in the substrate cover 2 to a preset coating temperature.

[0044] As Figures 2 to 6 shown, in this embodiment, the annular heater 33 is embedded in the barrel wall of the heating device and is evenly distributed in the vertical direction, which can form a closed heating field in the middle area of the heating device. After the gas passes through multiple vertically arranged heating gas pipes 32 for heating, the temperature of the heating gas is more uniform, and the temperature uniformity of the heating gas can be achieved without relying on the uniform distribution of the heating field.

[0045] In this embodiment, the heating device 3 further includes a cooling channel 31, a transition gas pipe 361, and a gas storage ring 362. The cooling channel 31 surrounds the outer edge of the annular heater 33 to form the barrel wall of the heating device 3. The transition gas pipe 361 and the gas storage ring 362 are arranged at the bottom of the cooling channel 31. One end of the transition gas pipe 361 is provided with a second air inlet 36, the other end of the transition gas pipe 361 is communicated with the first air inlet 34 of the cooling channel 31, the first air outlet 35 of the cooling channel 31 is communicated with the gas storage ring 362, and the second air outlet 38 of the gas storage ring 362 is communicated with the third air inlet 321 of the heating gas pipe 32. The inert gas flows through the second air inlet 36, the transition gas pipe 361, and the first air inlet 34 in sequence and then enters the cooling channel 31, flows around the outer edge of the annular heater 33 for one week and then enters the gas storage ring 362. Thus, the cooling of the side and bottom of the annular heater 33 can be completed. After the gas pressure in the gas storage ring 362 reaches the preset value, the second air outlet 38 is opened, and the gas enters the heating gas pipe 32 through the third air inlet 321 for heating. After the heating reaches the preset temperature, the gas enters the substrate cover 2 through the third air outlet 39 of the heating gas pipe 32 to heat the substrate in the substrate cover 2.

[0046] In this embodiment, a plurality of heating gas pipes 32 are stacked in series in the vertical direction inside the annular heater 33. After the heating device works normally, the gas input from the heating gas inlet can first cool the heating device. After the gas runs around the heating device for one week, it enters the heater for heating. At this time, the gas already has a certain initial temperature, which can shorten the heating time in the heater and improve the efficiency.

[0047] In this embodiment, a pressure relief valve 37 is provided on the gas storage ring 362 to prevent the pressure in the gas storage ring 362 from being too high and avoid danger.

[0048] As Figure 9 shown, in this embodiment, an annular substrate baffle 21 is provided at the top of the substrate cover 2 to limit the movement of the substrate in the vertical direction. A fixture inlet 22 is provided on the side of the substrate cover 2 to enable the substrate fixture 6 to enter and exit the substrate cover 2.

[0049] In this embodiment, the distance between the substrate baffle 21 and the fixture inlet 22 is less than 2 mm. On the premise of ensuring the smooth passage of the substrate, it is convenient for the substrate to be pressed by the heating gas at the same time.

[0050] The vacuum cover 2 has a constant vacuum degree during film coating. The constant pressure space composed of the substrate cover 2 and the substrate fixture 6 has a constant leakage rate, and the leaked gas is the same as the process gas. Therefore, the conveying speed of the process gas, the leakage speed of the substrate cover, and the vacuum pumping speed can be combined to ensure that the air pressure in the vacuum chamber meets the process requirements during film coating.

[0051] As Figure 10As shown in the figure, in this embodiment, the substrate fixture 6 includes an arc-shaped support piece 61, an electric spring 62, and an arc edge 63. The arc edge 63 is arranged on the outer side of the arc-shaped support piece 61, and the electric spring 62 is located at the connection between the arc-shaped support piece 61 and the arc edge 63. The arc-shaped support piece 61 is used to carry the substrate, and the arc edge 63 is used to realize the sealed connection between the substrate fixture 6 and the substrate cover 2. After the substrate is clamped and fixed in the substrate cover 2, the electric spring 62 is used to push the arc-shaped support piece 61 away from the substrate.

[0052] The substrate is placed on the arc-shaped support piece 61. When the substrate is transported to the preset position, that is, after the arc edge 63 and the fixture inlet 22 of the substrate cover 2 coincide, the introduced heating gas presses the substrate against the substrate baffle 21 of the substrate cover 2 to ensure that the position of the substrate remains unchanged during the coating process. After the substrate is pressed, the electric spring 62 is energized to push the arc-shaped support piece 61 to move to both sides, avoiding partial heating gas being blocked by the arc-shaped support piece 61 and preventing uneven pressure and heating of the substrate.

[0053] The substrate cover 2 and the substrate fixture 6 together form a constant-pressure space to ensure that the pressure on the substrate remains unchanged. Moreover, the entire constant-pressure space is filled with uniformly heated gas, which also forms a constant-temperature space, enabling direct heating of the substrate and improving the heating uniformity of the substrate surface.

[0054] As Figure 7 、 Figure 8 and Figure 11 As shown in the figure, in this embodiment, the lifting device includes: a connecting rod 5, a hollow main shaft 7, a balance rod 8, and a base 9. The top of the hollow main shaft 7 is hermetically connected to the bottom of the heating device 3, and a bellows 4 is also provided at the connection between the hollow main shaft 7 and the heating device 3 to improve the sealing performance of the heating base. The bottom of the hollow main shaft 7 is connected to a drive motor arranged in the base 9. Driven by the drive motor, the hollow main shaft 7 drives the heating device 3 to perform reciprocating lifting. The base 9 is provided with a connecting rod 5 and a balance rod 8. The middle of the connecting rod 5 is connected to the hollow main shaft 7 through a main shaft fixing hole 52, and both sides of the connecting rod 5 are respectively connected to the balance rod 8 through balance rod matching holes 51. The balance rod 8 is used to assist the hollow main shaft 7 in lifting and improve the stability of the movement of the heating base.

[0055] In this embodiment, a heating gas inlet pipe 71, a heating gas outlet pipe 72, a substrate cooling gas inlet pipe 73, and a substrate cooling gas outlet pipe 74 are disposed inside the hollow main shaft 7. The heating gas inlet pipe 71 is connected to the second air inlet 36 to enable an inert gas to enter the heating base, and the heating gas outlet pipe 72 is connected to the substrate cover 2 to enable the inert gas to be discharged from the heating base. The substrate cooling gas inlet pipe 73 and the substrate cooling gas outlet pipe 74 are connected to the substrate cover 2 to enable a cooling gas to enter and exit the substrate cover 2. The gas of the substrate cooling device directly enters the substrate cover 2 from the substrate cooling gas inlet pipe 73 and then is output from the substrate cooling gas outlet pipe 74, which can not only be used for cooling the substrate, but also for cooling the vacuum chamber. The types of inert gases conveyed by the heating gas inlet pipe 71 and the substrate cooling gas inlet pipe 73 are the same, which is beneficial to protecting the vacuum environment. It is mainly used for the following two working conditions: one is the working condition where the same substrate needs to be coated at different temperatures and the substrate needs to be quickly cooled. The other is the working condition where the coating equipment becomes overheated after working for a long time and needs to be cooled down.

[0056] Embodiment 2

[0057] As Figure 12 shown, the present invention provides a substrate heating and coating method implemented based on the heating base in Embodiment 1, including the following steps:

[0058] S1. Evacuate the vacuum cover 1, and use the substrate fixture 6 to place the substrate at a predetermined position inside the substrate cover 2. Driven by the drive motor and the hollow main shaft 7, the entire heating base is raised to a preset coating position.

[0059] S2. Input an inert gas into the heating base through the heating gas inlet pipe 71. The inert gas enters the cooling channel 31 after passing through the second air inlet 36, the transition air pipe 361, and the first air inlet 34, and flows around the outer edge of the annular heater 33 for one week and then enters the gas storage ring 362. During the process of the inert gas flowing around the outer periphery of the annular heater 33, it can not only reduce the temperature of the annular heater 33, but also increase the temperature of the inert gas itself, improving the thermal energy utilization rate inside the heating base.

[0060] S3. After the gas pressure in the gas storage ring 362 reaches a preset value, open the second air outlet 38. The gas enters the heating air pipe 32 through the third air inlet 321, and the annular heater 33 heats the inert gas; after the heating reaches a preset temperature, the gas enters the substrate cover 2 through the third air outlet 39. On the one hand, the substrate is pressed tightly against the substrate baffle 21 of the substrate cover 2 by the air pressure to fix the substrate; on the other hand, the heating gas fills the substrate cover 2 to quickly and uniformly heat the substrate. Directly heating the substrate with the gas can greatly improve the uniformity of the substrate surface temperature, and the substrate is completely covered by the heating gas, which also improves the heating speed of the substrate.

[0061] S4. Use the electric spring 62 to move the arc-shaped support piece 61 of the substrate fixture 6 to the periphery of the substrate to prevent the arc-shaped support piece 6 from affecting the pressure and heat on the substrate.

[0062] S5. Determine the vacuum degree in the vacuum chamber 1 by combining the relative magnitudes of the process gas delivery speed, the leakage speed of the substrate cover, and the evacuation speed. After the vacuum degree in the vacuum chamber 1 meets the predetermined requirements, perform the coating process.

[0063] S6. After the coating process is completed, first use the electric spring 62 to reset the arc-shaped support piece 61 of the substrate fixture 6, then relieve the pressure of the substrate cover 2. The substrate falls back onto the substrate fixture 6 under the action of its own gravity. Take out the substrate, turn off the annular heater 33, and finally turn off the input gas to complete one coating process.

[0064] In the above steps, if multiple coating processes at different temperatures are involved in the middle, after adjusting the temperature on the surface of the substrate by the interaction of the substrate cooling gas and the heating gas, return to step S1 to continue the iteration.

[0065] In this embodiment, first use an inert gas to cool the heating device to ensure the stable operation of the heating device; then use the heater to heat this inert gas, making full use of the advantages of both the cooling of the heater and the heating of the gas. While cooling the heater, it also improves the heating speed of the gas; when the preset gas pressure is reached in the heating device, start heating the gas. After the gas is heated to the preset temperature, it directly enters the substrate cover from the heating device. This can not only use the air pressure to press and fix the substrate in the substrate cover to prevent the substrate from running off during the coating process, but also use the heating gas to quickly and evenly heat the substrate, achieving basically the same temperature everywhere in the substrate cover. Combined with the cooperation of the backpressure gas, it realizes uniform heating of each part of the substrate, and finally realizes high-quality coating of the substrate.

[0066] Although the present invention is disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make many possible changes and modifications to the technical solution of the present invention, or modify it into an equivalent embodiment with equivalent changes, without departing from the spirit and technical solution of the present invention. Therefore, any simple modification, equivalent replacement, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A heating base, characterized in that, Comprising: A vacuum chamber (1), a substrate chamber (2), a heating device (3), a substrate fixture (6) and a lifting device; the substrate chamber (2) is connected to a cooling device to cool the substrate chamber (2); the top of the substrate chamber (2) is hermetically connected to the vacuum chamber (1), and the bottom of the substrate chamber (2) is hermetically connected to the heating device (3); the substrate fixture (6) is detachably arranged on the side of the substrate chamber (2) for fixing the substrate in the substrate chamber (2); the heating device (3) is provided with heating gas inlets and outlets, gas enters the heating device (3) and is heated, and the gas heated to a preset temperature enters the substrate chamber (2) to heat the substrate; the heating device (3) is also provided with cooling gas inlets and outlets, cooling gas enters the heating device (3) to cool the heating device (3), the inert gas first cools the heating device (3) and then is heated by the heating device (3); the bottom of the heating device (3) is connected to the lifting device, and driven by the lifting device, the heating device (3) reciprocates up and down, driving the vacuum chamber (1) and the substrate chamber (2) to reciprocate up and down to lift the substrate in the vacuum cavity to a preset coating position.

2. The heating base according to claim 1, characterized in that, The heating device (3) includes a heating gas pipe (32), an annular heater (33), an upper partition plate (331) and a lower partition plate (332). The heating gas pipe (32) is fixed in the annular heater (33) through the upper partition plate (331) and the lower partition plate (332). The lower partition plate (332) is connected to the lifting device, and the upper partition plate (331) is connected to the substrate chamber (2). The heating gas pipe (32) is provided with gas inlets and outlets to allow the inert gas to enter the heating gas pipe (32). Under the heating action of the annular heater (33), the gas is heated to a preset temperature and is output from the heating gas pipe (32) to the substrate chamber (2) to heat the substrate in the substrate chamber (2) to a preset coating temperature.

3. The heating base according to claim 2, wherein The heating device (3) further includes a cooling channel (31), a transition gas pipe (361) and a gas storage ring (362). The cooling channel (31) surrounds the outer edge of the annular heater (33) to form the barrel wall of the heating device (3). The transition gas pipe (361) and the gas storage ring (362) are arranged at the bottom of the cooling channel (31). One end of the transition gas pipe (361) is provided with a second air inlet (36), the other end of the transition gas pipe (361) is communicated with the first air inlet (34) of the cooling channel (31), the first air outlet (35) of the cooling channel (31) is communicated with the gas storage ring (362), and the second air outlet (38) of the gas storage ring (362) is communicated with the third air inlet (321) of the heating gas pipe (32). The inert gas sequentially flows through the second air inlet (36), the transition gas pipe (361) and the first air inlet (34) and then enters the cooling channel (31), flows around the outer edge of the annular heater (33) for one week and then enters the gas storage ring (362). After the gas pressure in the gas storage ring (362) reaches the preset value, the second air outlet (38) is opened, and the gas enters the heating gas pipe (32) through the third air inlet (321) for heating. After the heating reaches the preset temperature, the gas enters the substrate cover (2) through the third air outlet (39) of the heating gas pipe (32).

4. The heating base according to claim 3, wherein A plurality of heating gas pipes (32) are vertically connected in series and stacked inside the annular heater (33).

5. The heating base according to claim 3, characterized in that, A pressure relief valve (37) is provided on the gas storage ring (362).

6. The heating base according to claim 3, characterized in that, An annular substrate baffle (21) is provided at the top of the substrate cover (2) to limit the movement of the substrate in the vertical direction. A fixture inlet (22) is provided on the side of the substrate cover (2) to enable the substrate fixture (6) to enter and exit the substrate cover (2).

7. The heating base according to claim 6, characterized in that, The distance between the substrate baffle (21) and the fixture inlet (22) is less than 2 mm.

8. The heating base according to any one of claims 1 to 7, characterized in that, The substrate fixture (6) includes an arc-shaped support piece (61), an electric spring (62) and an arc edge (63). The arc edge (63) is arranged outside the arc-shaped support piece (61), and the electric spring (62) is located at the connection between the arc-shaped support piece (61) and the arc edge (63). The arc-shaped support piece (61) is used to carry the substrate, and the arc edge (63) is used to realize the sealed connection between the substrate fixture (6) and the substrate cover (2). After the substrate is clamped and fixed in the substrate cover (2), the electric spring (62) is used to push the arc-shaped support piece (61) away from the substrate.

9. The heating base according to any one of claims 3 to 7, characterized in that The lifting device includes: a connecting rod (5), a hollow main shaft (7), a balance rod (8) and a base (9). The top of the hollow main shaft (7) is hermetically connected to the bottom of the heating device (3), and the bottom of the hollow main shaft (7) is connected to a driving motor arranged in the base (9). Driven by the driving motor, the hollow main shaft (7) drives the heating device (3) to reciprocate up and down. A connecting rod (5) and a balance rod (8) are provided on the base (9). The middle of the connecting rod (5) is connected to the hollow main shaft (7), and both sides of the connecting rod (5) are respectively connected to the balance rod (8). The balance rod (8) is used to assist the hollow main shaft (7) in lifting and lowering.

10. The heating base according to claim 9, wherein Inside the hollow main shaft (7), there are a heating gas inlet pipe (71), a heating gas outlet pipe (72), a substrate cooling gas inlet pipe (73) and a substrate cooling gas outlet pipe (74); the heating gas inlet pipe (71) is connected to the second air inlet (36) to enable inert gas to enter the heating base, and the heating gas outlet pipe (72) is connected to the substrate cover (2) to enable inert gas to be discharged from the heating base; the substrate cooling gas inlet pipe (73) and the substrate cooling gas outlet pipe (74) are connected to the substrate cover (2) to enable cooling gas to enter and exit the substrate cover (2).

11. A method for heating and coating a substrate based on the heating base according to any one of claims 1 to 10, characterized in that, It includes the following steps: S1. Evacuate the vacuum cover (1), and use the substrate fixture (6) to place the substrate at a predetermined position inside the substrate cover (2); S2. Input inert gas into the heating base through the heating gas inlet pipe (71). The inert gas enters the cooling channel (31) after passing through the second air inlet (36), the transition air pipe (361), and the first air inlet (34), flows around the outer edge of the annular heater (33) for one week, and then enters the gas storage ring (362); S3. After the gas pressure in the gas storage ring (362) reaches the preset value, open the second air outlet (38). The gas enters the heating air pipe (32) through the third air inlet (321), and the annular heater (33) heats the inert gas; after the heating reaches the preset temperature, the gas enters the substrate cover (2) through the third air outlet (39); S4. Use the electric spring (62) to move the arc-shaped support piece (61) of the substrate fixture (6) to the periphery of the substrate to prevent the arc-shaped support piece (61) from affecting the pressure and heat on the substrate; S5. Determine the vacuum degree inside the vacuum cover (1) by combining the relative magnitudes of the process gas delivery speed, the substrate cover leakage speed, and the evacuation speed. After the vacuum degree inside the vacuum cover (1) meets the predetermined requirements, perform the coating process; S6. After the coating process is completed, first use the electric spring (62) to reset the arc-shaped support piece (61) of the substrate fixture (6), then relieve the pressure of the substrate cover (2). The substrate falls back onto the substrate fixture (6) under the action of its own gravity, take out the substrate, turn off the annular heater (33), and finally turn off the input gas to complete one coating process.

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