Systems and methods for pre-aligning samples for more efficient processing of multiple samples by a broad ion beam (BIB) system

By incorporating an adjustable mask and a dual BIB source design on the sample holder, the problems of long alignment time and frequent shutdowns in wide ion beam polishing systems are solved, improving sample processing efficiency and system continuous operation time, making it suitable for multi-sample processing.

CN117091926BActive Publication Date: 2026-04-10FEI CO
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
FEI CO
Filing Date
2023-05-19
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

Existing wide ion beam polishing systems suffer from long alignment times and frequent downtime for maintenance during sample preparation, resulting in low efficiency and limiting their widespread use in commercial applications.

Method used

By setting adjustable first and second masks on the sample holder, the sample is ensured to have a predetermined geometric relationship with the mask edge, thus achieving sample pre-alignment, reducing alignment steps within the BIB system, and reducing downtime by utilizing the dual BIB source design.

Benefits of technology

This improved the efficiency of sample processing and the continuous uptime of the system, reduced the frequency of downtime maintenance, and achieved higher sample processing throughput and system uptime.

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Abstract

Systems and methods for pre-aligning a sample for more efficient processing of multiple samples by a broad ion beam (BIB) system in accordance with the present invention include securing a sample to an adjustable portion of a sample holder, nesting the sample holder with a first mask having a first mask edge, wherein the first mask is positioned outside of a BIB system, and aligning the sample so that it has a desired geometric relationship with the first mask edge. The first mask and a second mask within the BIB system having a second mask edge can be geometrically similar such that the geometric relationship between the first mask edge and the sample when the sample holder is nested with the first mask is the same as the geometric relationship between the second mask edge and the sample when the sample holder is nested with the second mask.
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Description

BACKGROUND

[0001] A broad ion beam (BIB) polishing system is used to prepare samples for study. Specifically, the BIB polishing system directs a high energy, unfocused or minimally focused ion (e.g., argon ion) beam at a sample, where the beam degrades and / or otherwise removes the portion of the sample on which it is incident. Because the broad ion beam does not require focusing or requires minimal focusing, the BIB polishing system does not have the optical column limitations of other sample preparation techniques, such as focused ion beam (FIB) milling, and thus the BIB polishing system can employ a much higher primary energy beam current. Due to the higher primary energy beam current, the BIB system is able to remove sample material more quickly than existing systems to expose regions of interest, resulting in a faster sample preparation process.

[0002] Unfortunately, while efficient in removing sample material, the samples being processed require precise alignment with a special mask designed to block beam portions from being incident on sample regions that the user does not want removed. Because this alignment process takes time and requires precision skills, it results in a slowing of the sample preparation workflow. Additionally, because the higher current broad ion beam removes sample material more quickly, the rate of redeposition of the removed material onto the broad ion beam source is also increased, forcing the user to remove the source more frequently for cleaning, in turn requiring system downtime. Due to these limitations on workflow efficiency, the majority of current use of BIB polishing systems has been for academic and other non-commercial applications. Thus, it is desirable to have a new BIB polishing system that is able to efficiently and accurately process many samples in a shorter period of time. SUMMARY

[0003] Systems and methods for pre-aligning samples for more efficient processing of multiple samples with a broad ion beam (BIB) system are disclosed. An example method for pre-aligning samples for more efficient processing of multiple samples by a BIB system in accordance with the present invention includes securing a sample to an adjustable portion of a sample holder, nesting the sample holder with a first mask having a first mask edge, where the first mask is positioned outside of the BIB system, and aligning the sample so that it has a desired geometric relationship with the first mask edge. The first mask and a second mask within the BIB system having a second mask edge can be geometrically similar so that the geometric relationship between the first mask edge and the sample when the sample holder is nested with the first mask is the same as the geometric relationship between the second mask edge and the sample when the sample holder is nested with the second mask. In this way, the sample holder can be nested within the second mask and immediately processed by a broad ion beam emitted from a BIB source component of the BIB system without needing to align the sample within the BIB system. BRIEF DESCRIPTION OF DRAWINGS

[0004] The detailed description is described with reference to the accompanying figures. In the figures, the left-most digit(s) of each reference number identifies the figure in which that reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items.

[0005] Figure 1 A cross-section of an exemplary BIB system according to the present disclosure is depicted, configured to more efficiently process multiple samples.

[0006] Figure 2 An exemplary environment for more efficiently processing multiple samples within a sample preparation workflow is shown.

[0007] Figure 3 An exemplary process for processing samples through a dual BIB system according to the present disclosure is depicted, implementing increased system uptime.

[0008] Figure 4 An exemplary process for processing samples through a dual mode, optical and BIB milling system for more efficient sample processing according to the present disclosure is described.

[0009] Figure 5 An exemplary process for processing multiple samples through a reduced downtime within a dual BIB system according to the present disclosure is depicted.

[0010] Figure 6 An exemplary process for processing samples through a BIB system according to the present disclosure is described, implementing increased system uptime.

[0011] Figure 7A And Figure 7B is an exemplary illustration showing a sample pre-aligned with a first mask, and subsequently processed through a BIB system containing a second mask.

[0012] In the several views of the drawings, like reference numerals will be used to refer to like or identical parts throughout the several views of the drawings. Typically, in the drawings, elements that can be included in a given example are shown in solid lines, while elements that are optional for a given example are shown in dashed lines. However, elements shown in solid lines are not essential for all examples of the disclosure, and elements shown in solid lines can be omitted from a particular example without departing from the scope of the disclosure.

[0013] DETAILED DESCRIPTION OF EMBODIMENTS

[0014] Disclosed herein are systems and methods for more efficiently processing multiple samples using a broad ion beam (BIB) system. More specifically, the present disclosure includes a BIB system configured to receive and process one or more samples, the BIB system having increased throughput and / or uptime as compared to current BIB systems.

[0015] Figure 1 is an illustration of a cross-section 100 of an example BIB system 102 according to the present disclosure, the BIB system configured to more efficiently process multiple samples 104. The BIB system 102 includes a BIB source 106 configured to emit a wide ion beam 108 along a BIB axis 110 toward a sample stage region 112. The wide ion beam 108 is configured such that when portions of the wide ion beam 108 are incident upward onto a sample 104, the material of the sample on which the wide ion beam is incident is milled or otherwise removed from the sample. For example, in some embodiments, the BIB source 106 can be an Ar ion source configured to emit an argon ion beam toward the sample stage 112.

[0016] The sample stage region 112 can include a mask 114 configured to block a portion of the wide ion beam 108 such that the sample material corresponding to the portion of interest is not milled or otherwise removed from the sample 104 by the incident ions. For example, Figure 1 A first portion of a cross-section of the wide ion beam 108(a) incident on the mask 114 is shown, as well as a second portion of the cross-section of the wide ion beam 108(a) partially incident on a portion of the sample 104, the material of which is to be milled or otherwise removed by the wide ion beam 108. The mask 114 is composed of a hard material that is not degraded by the wide ion beam 108, thereby allowing it to be used to process multiple samples.

[0017] The sample stage region 112 can also include a holder interface configured to receive a sample holder 116 such that it can be positioned and held relative to the mask 114 during processing of the sample 104, thereby causing the mask to protect the portion of interest in the sample. In some embodiments, the sample stage region 112 can include a stage element capable of translating, tilting, or rotating the sample 104 / sample holder 116. Additionally, in such embodiments, the stage element can also be configured to translate, pan, or rotate the sample 104 / sample holder 116 as the BIB source 106 emits the wide ion beam 108 toward the sample 104. For example, the stage element can be configured to periodically or continuously rotate the sample 104 / sample holder 116 through a series of predefined angular positions, and / or to oscillate the sample 104 / sample holder 116 between two angular positions during milling with the wide ion beam. Such translation / tilting / rotation can be performed at a constant or varying speed. In this manner, the stage element can dynamically change the portion of the sample 104 illuminated by the wide ion beam 108 to allow more efficient or otherwise optimized removal of sample material and / or polishing of the region of interest by the BIB system 102.

[0018] The sample holder 116 is configured to hold the sample 104 during processing and during transport into, out of, and / or within the BIB system 102. Figure 1 The BIB system 102 is also shown to include one or more additional samples 104(a) held by a corresponding additional sample holder 116(a). In some embodiments, the BIB system 102 has one or more optional sample storage volumes / areas 118 where the sample holder can be parked within the BIB system 102 when the sample 104 it holds is not currently being processed. Figure 1 The BIB system 102 is also shown to include a storage cassette 120 configured to hold a plurality of sample holders 116 positioned within a cassette storage volume 122. The storage cassette 120 is configured to allow many samples 104 and their corresponding sample holders 116 to be transported to and / or loaded into the BIB system 102.

[0019] In some embodiments, the sample holder 116 can include one or more optional adjustment elements 124 that allow the sample 104 to be translated, tilted, rotated, or otherwise repositioned relative to the sample holder 116, the wide ion beam 108, and / or the mask 114. In embodiments having such adjustment elements 118, the BIB system 112 can include one or more interface elements that allow a user to manipulate the adjustment elements or the sample holder 116 itself to bring the sample 104 into a desired geometric relationship with the mask 114 or a feature of the mask (e.g., a mask edge 114(a)). Although Figure 1 The adjustment elements 124 are shown as screws, but one of ordinary skill in the art will appreciate that there are many types of known adjustment elements that are capable of translating, tilting, rotating, or otherwise repositioning a sample relative to various types of sample holders. Figure 1 A sample holder manipulator 126 configured to reposition the sample holder 116 within the BIB system 102 is also shown. For example, the sample holder manipulator 126 can be configured to move the sample holder between the sample holder storage volume 118 and the sample stage area 112. Further, in some embodiments, the sample holder manipulator 126 can be further configured to engage with the adjustment elements 124 to cause translation, tilting, rotation, etc. of the sample 104.

[0020] The BIB system 102 also includes a housing 128 that defines an interior volume 130. In some embodiments, the interior volume can be a sealed volume that does not allow passage of gases within the exterior environment. In such embodiments, the interior volume can include a pump system 132 configured to adjust the pressure of the interior volume 130 and / or change the gas composition of the environment within the interior volume. For example, the pump system 132 can cause the interior volume 130 to be at a lower pressure than outside the environment and / or to be at a vacuum. While Figure 1 At least a portion of the pump system 132 is shown as optionally included within the interior volume, but one of skill in the art will appreciate that some or all of such a pump system 132 can be located outside of the interior volume 130. Alternatively, the pump system 132 can cause the gas composition of the environment within the interior volume 130 to be composed of an inert gas (e.g., a gas that does not interact with the broad ion beam 108 and / or the sample 104 material during processing). The BIB system 102 is also shown as having a sample holder port 134 through which the sample holder 116 can be inserted into and / or removed from the BIB system 102. Further, Figure 1 The BIB system 102 is also shown as having an optional cassette port 136 configured to allow the storage cassette 120 to be inserted into and / or removed from the BIB system 102.

[0021] Figure 1 The BIB system 102 is also shown as including a source housing 138 that defines a source volume 140 configured to contain the BIB source 106. The source housing 138 also defines a BIB aperture 142 that connects the source volume 140 with the interior volume 130 and a BIB source maintenance aperture 144 (e.g., a flange, a door, or other type of sealable component that allows the source housing 138 to be switched between a sealed and an unsealed state relative to the exterior environment) that allows the BIB source 106 to be removed from or reinstalled within the source volume 140 (i.e., the source maintenance aperture 144 allows the BIB source 106 to be removed or accessed via the aperture 144 when unsealed). The BIB system 102 can also include a valve 146 configured to be switched between an open state in which ions emitted from the BIB source 106 are allowed to pass from the source volume 140 to the interior volume 130 via the BIB aperture 142 and a sealed state in which the valve 146 prevents passage of ions or emissions from the sample 104 from the interior volume 130 to the source volume 130. One of skill in the art will appreciate that the valve 146 can correspond to any of a shutter, a valve, a door, or other sealing mechanism capable of being switched between open and closed states.

[0022] Figure 1Valve 146 is shown in an open state such that the wide ion beam 108 is allowed to enter the interior volume so as to be incident on the sample 104 and the mask 114. In some embodiments, when the valve 146 is in a closed state, the source volume 140 can be open to the external environment (e.g., via the BIB source maintenance aperture 144) without affecting the pressure within the interior volume. In this way, when the valve 146 is in a closed state, the BIB source maintenance aperture 144 can be opened to allow the BIB source 106 to be cleaned, adjusted, removed, replaced, and / or otherwise maintained without affecting the pressure or gas composition of the interior volume 130. In such embodiments, the source volume 140 can also include an optional pump system capable of reestablishing the pressure and / or gas composition to match that of the interior volume 130. The BIB source maintenance aperture 144 can include a port configured to be switched between an open state in which the first BIB source 106 can be removed from or reinstalled within the source volume 140, and a closed state in which the source volume 140 is sealed from the external environment.

[0023] Unlike a focused ion beam (FIB) system, the BIB system 102 does not include an optical column that includes optical elements configured to focus the ions emitted by the BIB source 106 to have a small spot size in and around the sample plane of the sample 104. Because such optical elements are only able to focus, correct, tune, and / or otherwise manipulate ion beams below a certain intensity threshold, and because such optical elements are not needed to focus the ions emitted by the BIB source 106, the intensity of the wide ion beam (i.e., the primary beam current) used in the BIB system 102 can be much greater than in a FIB system. This increase in beam current allows the BIB system 102 to remove sample material much faster than a FIB system. Applicants note that one skilled in the art will appreciate that some optical elements can be included to focus the wide ion beam in the BIB system 102, however the inclusion of such elements would impose a smaller beam current limit on the BIB system 102 (as compared to a FIB system).

[0024] Due to the increased beam intensity of the wide ion beam 108, the material of the sample 104 that the wide ion beam 108 is incident upon is removed at a faster rate than the FIB milling process. Specifically, because the wide ion beam 108 has a higher beam intensity and is incident on a large area of the sample, the rate of material removal from the sample 104 is much higher than in a FIB system. Unfortunately, due to this increase in sample material removal, material redeposition increases proportionally as the portions of the sample 104 removed by the wide ion beam 108 redeposits on surfaces within the interior volume 130 and / or the source volume 140. In current BIB systems, this redeposition results in a large efficiency reduction, as the redeposition on the BIB source 106 forces the user to frequently remove and / or otherwise access the BIB source 106 for cleaning and maintenance. Due to this cleaning and maintenance, current BIB systems have high down time, where they cannot be used for sample processing.

[0025] Figure 1 The BIB system 102 is shown to include an optional additional BIB source 148 configured to emit an additional wide ion beam along an emission axis 150. The additional BIB source 148 is shown to be positioned within an additional source volume 152 defined by an additional source housing 154. The additional source housing 154 also defines an additional BIB aperture 156 connecting the additional source volume 148 with the interior volume 130, and an additional BIB source maintenance aperture 158 allowing the additional BIB source 148 to be removed from or reinstalled within the additional source volume 148.

[0026] The BIB system 102 can also include an additional valve 160 configured to switch between an open state in which ions emitted from the additional BIB source 148 are allowed to pass from the additional source volume 152 to the interior volume 130 through the additional BIB aperture 156, and a sealed state in which the additional valve 160 prevents ions or emissions from the sample 104 from passing from the interior volume 130 to the additional source volume 152. When the valve 160 is in the closed state, the additional source volume 152 can be open to the external environment (e.g., via the additional BIB source maintenance aperture 158) without affecting the pressure within the interior volume 130. Thus, when the valve 160 is in the closed state, the BIB source maintenance aperture 158 can be removed to allow the additional BIB source 148 to be cleaned, adjusted, removed, replaced, and / or otherwise maintained without affecting the pressure or gas composition of the interior volume 130.

[0027] Figure 1The valve 160 is shown in a closed state such that sample material removed from the sample 104 via the wide ion beam 108 is not allowed to enter the additional source volume 152 and / or re-deposit on the additional BIB source 148. In accordance with the present disclosure, because no re-deposition occurs on the additional BIB source 148 when the BIB source 130 is in use, the additional BIB source 148 will be available for processing the sample 104 (or an additional sample) when the BIB source 140 needs to be removed and / or accessed for cleaning and / or maintenance. Thus, because the valve 146 can be closed to seal the source volume 140 from the interior volume 130, the valve 160 can be opened such that the additional BIB source 148 can be used to emit an additional wide ion beam through the additional BIB aperture 156 to process a sample. Thus, in some embodiments of the present disclosure, the BIB system 102 is able to continuously process samples without downtime, greatly increasing its efficiency. Additionally, while not shown in FIG. 1, in various embodiments, the BIB system 102 can include only one BIB source or can include three or more BIB sources. Figure 1

[0028] Figure 1 The BIB system 102 is also shown as optionally including a laser source 162 positioned within a laser volume 164 that can be configured to emit a light beam through a laser aperture 166 defined by a laser housing 168. The light beam emitted by the laser source 162 has a higher beam energy and / or intensity than the wide ion beam 108, allowing the light beam to remove sample material at a rate 10-50x greater than what can be achieved by the wide ion beam. For example, in less than 10 minutes, an optical laser can remove as much nickel or cobalt as the wide ion beam can remove in 90 minutes. Furthermore, for harder materials such as graphite, the wide ion beam currently requires up to four hours to remove the same amount of material that the light beam can remove in less than 10 minutes.

[0029] However, while the removal of sample material by the light beam is faster, the milling and / or processing by the light beam also causes damage / burning on the remaining sample surface. Thus, in embodiments of the present disclosure, the BIB system 102 can use the light beam to quickly remove an initial portion of the sample 104, with the final portion of the sample 104 that needs to be removed being removed using a wide ion beam from a BIB source (e.g., the BIB source 106, the additional BIB source 148, or another BIB source within the BIB system 102). In this way, the light beam can be used to remove a large portion of the sample 104, with the wide ion beam being used subsequently to expose the region of interest and / or to create a smoother or undamaged surface.

[0030] Figure 1 A computing device 170 associated with the BIB system 102 is also shown. Figure 1 ​The computing device 170 is shown separate from the external device 112, however in various embodiments, one or more of these elements can be combined. That is, Applicant notes that the computing device 170 can be a component of the BIB system 102, can be a device separate from the BIB system 102 that communicates via a network communication interface, or a combination thereof.

[0031] Those skilled in the art will appreciate that Figure 1 The computing device 170 depicted in FIG. 1 is merely illustrative and is not intended to limit the scope of the disclosure. Computing systems and devices can include any combination of hardware or software that can perform the indicated functions, including computers, network devices, internet appliances, PDAs, wireless telephones, controllers, etc. The computing device 170 can also be connected to other devices that are not shown, or can operate as a stand-alone system. Additionally, in some embodiments, the functionality provided by the illustrated components can be combined in fewer components or distributed in additional components. Similarly, in some embodiments, the functionality provided by some of the illustrated components can not be provided and / or other additional functionality can be available.

[0032] Figure 3 to Figure 6 Also included is a diagram showing an exemplary computing architecture 180 of the computing device 170. The exemplary computing architecture 180 illustrates additional details of hardware and software components that can be used to implement the techniques described in the present disclosure. In the exemplary computing architecture 180, the computing hardware 170 of the BIB system 102 includes one or more processors 182 and a memory 184 communicatively coupled to the one or more processors 182.

[0033] The exemplary computing architecture 180 can include at least a control module 188 and a sample processing module 190 stored in the memory 184. The exemplary computing architecture 180 is further shown as including sample information 192 and a processing schedule 194 stored on the memory 184. The sample information 192 can correspond to data describing characteristics of a sample, identifying information of a sample, history of a sample, status of a sample, location of a sample on a sample holder, composition of a sample, regions of interest within a sample, and surfaces of interest on a sample, etc. The processing schedule 194 can include one or more methods, settings, or instructions for processing a sample 104 by the BIB system 102 to achieve a desired result (i.e., to expose and polish a surface of interest within a sample 104 so that it can be examined using a charged particle microscope system). For example, the processing schedule 194 can include a recipe for exposing and polishing a surface of interest within a sample 104 using the BIB system 102 in combination with the sample information 192. Figure 3 to Figure 6The steps of one or more methods are shown and described. A sample processing schedule 194 for a sample can include laser intensity, laser milling time, a portion of the sample to be removed by the laser, BIB intensity, BIB milling time, a portion of the sample to be removed by the BIB, a surface of interest, a processing order, sample identification information, a region of the sample to be removed, or a combination thereof. For example, the sample processing schedule 194 can be a data structure that identifies a plurality of steps to be performed by components of the BIB system 102 in a particular order, where the data structure can also identify various parameters for the components and / or individual steps. In some embodiments, such a processing schedule 194 can be presented at least in part to a user of the BIB system 102 to guide processing of the sample, can be used at least in part by the computing device 170 to automate and / or adjust settings associated with processing of the sample, or a combination thereof.

[0034] In some embodiments, the sample information 192 and / or individual processing schedules 194 can be input into the computing device 170 by a user (e.g., using a keypad, keyboard, mouse, voice commands, touch screen, etc.), received via a hardware connection (e.g., CD / DVD, USB, HDMI, portable memory, etc.), received over a network connection (e.g., Bluetooth, Wi-Fi, the Internet, etc.), received in association with a sample being inserted into the BIB system 102 (e.g., accessible memory on the sample holder 116), generated based on sensor information or the sample information 192, or a combination thereof. For example, in an example embodiment, the BIB system 102 can be configured to receive an identifier via an RFID on the sample holder 116, access sample information 192 associated with the identifier over a network connection, and then identify or generate a processing schedule 194 for the sample 104 based on the identifier, the sample information, or both.

[0035] As used herein, the term "module" is intended to represent an exemplary partitioning of executable instructions for discussion purposes, and is not intended to represent any type of requirement or required method, manner, or organization. Thus, while various "modules" are described, their functionality and / or similar functionality can be arranged in different ways (e.g., combined into a fewer number of modules, broken into a larger number of modules, etc.). Moreover, while particular functions and modules are described herein as being implemented by software and / or firmware executable on a processor, in other examples any or all of the modules can be implemented in whole or in part by hardware (e.g., special purpose processing units, etc.) to perform the described functions.

[0036] The control module 188 can be executed by the processor 182 to cause the computing device 170 and / or the BIB system 102 to take one or more actions and / or perform steps of a sample processing protocol. In some embodiments, the control module 188 can be executable to adjust settings of individual components of the BIB system 102 (e.g., the BIB source, the laser source, etc.), cause individual components of the BIB system 102 to perform particular operations (e.g., move a sample holder within the BIB system 102, open or close a valve, emit a wide ion beam, emit a light beam, align a sample, adjust a pressure setting or gas present in the volumes 130, 140, and / or 152, etc.), or a combination thereof. For example, the control module 188 can be executable to cause the sample holder manipulator 126 to engage a desired sample holder 116 stored within the BIB system 102 (e.g., stored in a storage cassette 120 located within the cassette storage volume 122, stored in the sample holder storage volume 118, etc.) and translate, tilt, and / or rotate the engaged sample holder 116 to the sample stage region 112 such that it nests with the mask 114 and the sample 104 has a desired geometric relationship with the mask 114. In such examples, the control module 118 can be further executable to return the sample holder 116 to its location stored within the BIB system 102 once the sample 104 has been processed and then engage an additional sample holder 116 and then translate the additional sample holder 116 to the sample stage region 112 to enable an additional sample 104 to be processed.

[0037] Alternatively or additionally, the control module 188 can cause the display 186 to present a processing protocol to a user, present information about a sample being processed, etc. For example, the control module 188 can present video / image information of an alignment of a sample with the mask 114, a surface of the sample 104 being removed / polished / processed, etc. In some embodiments, the control module 188 can cause the display 186 to present a graphical user interface including selectable interfaces that allow a user to input and / or change data associated with the sample 104 and / or select protocol steps or component configurations to use when processing the sample 104.

[0038] The sample processing module 190 can be executed by the processor 182 to at least partially automate processing of the samples 104 by the BIB system 102. For example, the sample processing module 190 can be executed to reposition the sample holder 116 in the BIB system 102, access sample information 192 of the sample, determine a processing schedule 194 for the sample 104, adjust a configuration of components of the BIB system 102 drive, and / or cause components of the BIB system 102 to perform processing of the sample 104. In accordance with the present disclosure, the sample processing module 190 can obtain sample information 192 of a sample 104 to be processed. In various embodiments, the sample processing module 190 can obtain information by receiving information from user input via a hardwired or wireless connection. Alternatively or additionally, the sample processing module 190 can obtain information by determining information based on sensor information.

[0039] The sample processing module 190 can also be executed to determine a desired component configuration of components of the BIB system 102 based on user input, sample information 192 of the sample 104, a processing schedule 194 associated with the sample 104, or a combination thereof. For example, based on sample information 192 indicating a composition of sample material to be removed and an amount of material to be removed, the sample processing module 190 can determine a desired wide ion beam intensity (e.g., BIB current, acceleration voltage, stage motion, etc.) and a time of irradiation with the wide ion beam required to process the sample 104, and can adjust the BIB source 106 configuration and / or an associated processing schedule 194 accordingly.

[0040] Additionally, the sample processing module 190 can also be executed to obtain a processing schedule 194 associated with a sample 104 to be processed. Obtaining the processing schedule 194 can correspond to accessing a predetermined processing schedule from an accessible data structure, modifying the predetermined processing schedule, generating a processing schedule for the sample, or a combination thereof. For example, after determining an identifier of the sample (e.g., by scanning a barcode on the sample holder 116), the sample processing module 190 can use the identifier to access sample information 192 and / or a processing schedule 194 from a data structure stored on an accessible memory. Alternatively or additionally, a user can input an identifier of the sample, sample information 194, a desired processing result, a like of processing to occur, etc., which the sample processing module 190 can use to generate a custom processing schedule 194 that will cause the BIB system 102 to perform the desired sample processing. For example, based on specifications of the processing schedule 194, the sample processing module 190 can cause the BIB system 102 to use a wide ion beam of a desired intensity to irradiate the sample 104 for a desired amount of time, and / or to use a narrow ion beam of a desired intensity to irradiate the sample 104 for a desired amount of time. Figure 2Any of the methods shown can be performed by the sample processing module 190. In some embodiments, the sample processing module 190 can provide a series of GUIs on the display 186 that allow a user to approve and / or give instructions to perform the steps of the processing schedule 194. The sample processing module 190 can further be executed to perform some or all of the steps of the processing schedule 194 independently of user input.

[0041] The sample processing module 190 can be further executed by the processor 182 to automatically move the sample holders 116 within the BIB system 102 such that a number of samples 104 can be processed in succession. For example, based on user input identifying a plurality of samples to be processed, the sample processing module 190 can cause the sample holder manipulator 126 to sequentially move the associated sample holders 116 between storage locations (e.g., storage cartridges 120 positioned within the cartridge storage volume 122, sample holder storage volume 118, etc.) and the sample stage area 112 such that each identified sample can be processed. Because the sample processing module 190 is further configured to cause the BIB system 102 to perform some or all of the processing steps without user input, the sample processing module 190 allows the BIB system 102 to rapidly and continuously process a plurality of samples automatically without user supervision. In this way, the BIB system 102 of the present disclosure allows a single user to monitor sample processing of many samples across multiple BIB systems 102 and / or to leave the BIB system 102 without user supervision to process a series of samples over a long period of time.

[0042] The computing device 170 includes one or more processors configured to execute instructions, applications, or programs stored in a memory accessible to the one or more processors. In some instances, the one or more processors can include hardware processors including, but not limited to, a hardware central processing unit (CPU), a graphics processing unit (GPU), and the like. Although in many cases these techniques are described herein as being performed by one or more processors, in some cases these techniques can be implemented by one or more hardware logic components, such as a field-programmable gate array (FPGA), a complex programmable logic device (CPLD), an application-specific integrated circuit (ASIC), a system on a chip (SoC), or a combination thereof.

[0043] The memory accessible to the one or more processors is an example of computer-readable media. Computer-readable media can include both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media can be any available media that can be accessed by a general purpose or special purpose computing device. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, FLASH memory, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other storage medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a general-purpose or special-purpose computing device, also referred to

[0044] Those skilled in the art will further appreciate that items or portions of items can be transferred between computer storage and other storage in memory as necessary, for purposes of memory management and data integrity. Alternatively, in other specific implementations, some or all of the software components can execute in memory on another device and communicate with the computing device 170 via communication. Some or all of the system components or data structures can also be stored (e.g., as instructions or structured data) on a non-transitory computer-accessible medium or a portable article to be read by an appropriate drive, various examples of which are described above. In some implementations, instructions stored on a computer-accessible medium separate from the computing device 170 can be transmitted to a computing hardware and the computing device 170 via a transmission medium or signal, such as an electronic, electromagnetic, or digital signal, conveyed via a communication medium such as a wireless link. Various implementations can further include receiving, sending or storing instructions and / or data implemented in accordance with the foregoing description on a computer-accessible medium.

[0045] Figure 2 is an illustration of an example environment 200 in which the BIB system 102 is used to more efficiently process multiple samples within a sample preparation workflow. In particular, Figure 3 to Figure 6Environment 200 is shown as including sample preparation station 202, sample transport device 250, BIB system 102, and charged particle microscope 260. However, those skilled in the art will understand that different stations, components, and devices may be used to allow efficient sample processing by the BIB system 102 according to this disclosure. For example, exemplary environment 200 or its component elements / stations / devices can be used in practice. Figure 2 The methods described herein and other processes described herein.

[0046] Figure 2 Sample preparation station 202 is shown as a covered work area with controlled pressure and atmospheric gas composition. Specifically, Figure 2 The illustration shows a sample preparation station 202 including a barrier material 204 defining a working volume 206, and one or more optionally sealable orifices 208 through which components can pass between the working volume 206 and the external environment. However, those skilled in the art will understand that the sample preparation station 202 may correspond to an open environment. Additionally, while the sample preparation station 202 is in... Figure 2 While shown as separate from the BIB system 102, those skilled in the art will understand that in some embodiments, the sample preparation station 202 may be included in a chamber separate from the internal volume of the BIB system 102, such that samples can be aligned on a sample holder in the sample preparation station 202 while different samples are processed by the BIB source within the internal volume of the BIB system 102.

[0047] In some implementations, the user can select the pressure and atmospheric gas composition within the working volume 206 such that they are optimal for the preparation of the desired sample type 210. The working volume 206 is depicted as containing exemplary elements for preparing samples 210 for processing in the BIB system 102. For example, the working volume 206 is shown as including a plurality of samples 210 that have been harvested / generated and are ready for examination, a plurality of empty sample holders 212 on which the samples 210 can be positioned, exemplary aids 214 for aligning / positioning the samples on the sample holders, and a sample holder 216 containing the samples. While the exemplary aid 214 is shown as an optical microscope system, those skilled in the art will understand that different types of sample 210 / preparation workflows may require different types of aids to optimally align / position the samples on the sample holders.

[0048] In some embodiments of the application, the preparation station further includes an additional mask 218 for aligning the sample 210 on the sample holder 212. The additional mask 218 is geometrically configured such that when the sample is aligned and / or positioned to have a particular geometric relationship between the sample and the edge of the additional mask 218 when the sample holder is nested with the additional mask 218, then the sample 210 will have the same particular geometric relationship between the sample and the edge of the mask 114 (a) when the sample holder is nested with the mask 114 within the BIB system 102. This geometric similarity between the mask 114 and the additional mask 218 allows the samples to be aligned on their respective sample holders without occupying the potential time that the BIB system 102 can process the samples with a wide ion and / or light beam. In some embodiments, aligning the samples within the sample preparation station 202 can correspond to optically aligning the samples without using the additional mask 218. For example, the samples can be optically aligned with respect to the sample holder by adjusting an adjustable portion of the sample holder such that the sample will be in the desired position, where the sample holder is nested with the mask 114 within the BIB system 102. Exemplary methods for optically aligning the samples in this manner include, but are not limited to, adjusting the sample edge to a marker position (e.g., using an optical microscope and / or image recognition algorithms), using laser gate sensing to determine the desired position, etc.

[0049] Additionally, Figure 2 The sample preparation system is shown to include a storage cartridge 220 configured to hold a plurality of sample holders 216. The storage cartridge 220 is configured to allow many samples 204 and their corresponding sample holders 216 to be transported to and / or loaded into the BIB system 102. In this manner, a user can pre-align each of a plurality of samples 210 using the additional column 218 and then load them within the storage cartridge 220.

[0050] Figure 2 An optional sample transport apparatus 204 is also shown, which is configured to transport the sample holders 216 between the sample preparation station 202 and the BIB system 102 and / or between the BIB system 102 and the charged particle microscope 206. In some embodiments, the sample transport apparatus 204 can maintain a desired pressure and / or gas environment around the sample holders 216 during transport. In such embodiments, the sample transport apparatus 204 allows the samples to be prepared in the sample preparation station 202, processed in the BIB system 102, and investigated in the charged particle microscope 206 without being exposed to pressures or gases other than the desired pressure and / or gas environment. Alternatively, the sample holders 216 or the storage cartridge 220 itself can be transported between the sample preparation station 202 and the BIB system 102. In some embodiments, the storage cartridge 220 can be capable of maintaining the plurality of sample holders 216 it contains in a desired pressure and / or gas environment.

[0051] Figure 1 The example environment 200 is also shown to include an example BIB system 102 as described in connection with Figure 1 The BIB system 102 includes a BIB source 106 and optionally additional BIB sources 148 configured to emit a wide ion beam along a BIB axis toward a sample stage region 112. The wide ion beam is configured such that when portions of the wide ion beam are incident upward onto a sample 210, material of the sample on which the wide ion beam is incident is milled or otherwise removed from the sample. The sample stage region 112 can include a mask 114 configured to block a portion of the wide ion beam such that sample material corresponding to a portion of interest is not milled or otherwise removed from the sample 210 by the incident ions. The sample stage region 112 can also include a holder interface configured to receive a sample holder 216 such that it can be positioned and held relative to the mask 114 during processing of the sample 210, such that the mask protects the portion of interest in the sample. The BIB system 102 is also shown to include an optional laser source 162. The BIB system 102 is configured to process a sample as described in the discussion of Figure 3 to Figure 6 and / or according to the methods described in Figure 2 and other processes described herein.

[0052] The example environment 200 is also depicted as including a charged particle microscope system 206 for inspecting a sample 210 that has been processed by a BIB system 102 according to the present application. The example charged particle microscope system 206 can include an electron microscope (EM) setup or electron lithography setup configured to irradiate and / or otherwise impinge the sample 210 with a charged particle beam 222 (typically an electron beam or an ion beam). In various embodiments, the charged particle microscope system 206 can be or include one or more different types of EM and / or charged particle microscopes such as, but not limited to, a scanning electron microscope (SEM), a scanning transmission electron microscope (STEM), a transmission electron microscope (TEM), a charged particle microscope (CPM), a dual-beam microscope system, etc. Additionally, in some embodiments, a TEM is also capable of operating as a STEM. Figure 3 The example charged particle microscope system 206 is shown as a scanning electron microscope (SEM) 224.

[0053] Figure 3 An example process 300 for processing a sample by a dual BIB system according to the present application to achieve increased system uptime is depicted. The process 300 can be implemented in any environment, including any example environment 200 for more efficiently processing multiple samples within a sample preparation workflow, by any of the BIB systems 102.

[0054] At step 302, a sample to be processed is optionally determined. For example, the sample to be processed can be determined based on input received from a user via an interface on the BIB system or via an associated computing device. Alternatively, the sample to be processed can be determined by the BIB system or an associated computing device executing instructions that result in determining the next sample to be processed. For example, the BIB system can be configured such that it sequentially accesses a plurality of sample holders stored within it, allowing a user to pre-load a plurality of samples into the BIB system to be processed automatically in succession. In such an example, the BIB system of the associated computing device will keep track of the order in which samples are to be processed, which of the plurality of samples is next to be processed.

[0055] At step 304, a processing schedule for the sample is determined. The processing schedule for the sample corresponds to a BIB system configuration and workflow settings that are to be followed to achieve a desired processing result for the sample (e.g., BIB intensity, BIB milling time, a portion of the sample to be removed by the BIB, a surface of interest, or a combination thereof). In some embodiments, the processing schedule can be input by a user by selecting a processing schedule from a list of pre-made processing schedules, inputting / generating a new processing schedule, inputting individual steps or configuration instructions, or a combination thereof. For example, the associated computer can present a graphical user interface that includes selectable interfaces that allow a user to input and / or change data associated with the sample and / or select protocol steps or component configurations to be used in processing the sample. In another example, where the BIB system is frequently used to process a particular type of sample to prepare it for a particular inspection modality, the BIB system or associated computer can have stored an associated processing schedule that a user can select (manually or via metadata associated with the sample, sample holder, etc.) to initiate the frequently used processing configuration / workflow.

[0056] In some embodiments, a processing schedule can be received along with sample information associated with the sample to be processed. The sample information includes one or more of sample identification information, sample composition, region of interest, surface of interest, associated processing schedule, etc. Alternatively or in addition, the BIB system or associated computing system can use predefined rules / instructions to determine a processing schedule for the sample based on the sample information. For example, a user can input an identifier for the sample, the BIB system can use the identifier to access a data structure that specifies relevant sample information, and then the BIB system uses predefined rules to create a custom processing schedule that will cause the BIB system to perform a desired processing of the sample. For example, the BIB system can set a beam intensity of a wide ion beam based on a material composition to be removed, and / or adjust a milling time based on an amount of material to be removed.

[0057] At step 306, the sample is prepared for processing. Preparing the sample for processing can include harvesting the sample from a larger sample or otherwise generating the sample (e.g., growing or depositing a portion of the sample), loading the sample onto a sample holder, aligning the sample, transporting the sample to the BIB system, transporting the sample rack to a sample table area within the BIB system, etc. For example, the BIB system can cause a component sample holder transport element to retrieve a sample holder associated with the sample to be processed from a storage area and translate, tilt, and / or rotate the sample holder such that the geometric relationship between the sample and the protective mask is such that the mask will protect the desired portion of the sample during irradiation / milling.

[0058] At step 308, the BIB source is caused to emit a wide ion beam toward the sample. Figure 4 Step 310 is also shown as being performed while the wide ion beam is emitted toward the sample. At step 310, an additional BIB source is accessed. According to the present disclosure, the additional BIB source is positioned within a volume that can be selectively sealed from the interior of the BIB system via a valve. In this way, when the valve is closed, milled material from the sample cannot enter the volume containing the additional BIB source. Additionally, in some embodiments, the pressure and / or gas composition are not affected when the additional BIB source is accessed. In various embodiments, accessing the additional BIB source at 310 can include one or more of removing the additional BIB source from the BIB system 312 (e.g., for cleaning, adjustment, repair, etc.), performing maintenance on the additional BIB system 314 (e.g., cleaning, alignment, etc.), replacing the additional BIB source 316 (e.g., reinstalling the BIB source after cleaning / maintenance), and / or installing a new BIB source in the BIB system 318.

[0059] At step 320, a portion of the sample is removed by the wide ion beam. According to the present disclosure, step 320 can include milling by a source different from the wide ion beam, such as the dual optical and ion milling process described in U.S. Patent No. 9, 1 1 1, 1 1 1, the disclosure of which is incorporated by reference herein in its entirety. Figure 4 At step 320, the portion of the sample not masked by the protective mask is removed from the sample. In this way, the region and / or portion of the sample that will be subjected to additional processing can be quickly exposed.

[0060] At step 322, it is determined whether another sample will be milled. If the answer at 322 is yes, the process returns to step 302 and a sample to be processed is determined. In this way, a large number of samples can be processed while the additional BIB system is accessed. If the answer at 322 is no, the process 300 can end.

[0061] Figure 5A sample process 400 for processing a sample by a dual-mode, optical and BIB milling system for more efficient sample processing according to the present application is described. Process 400 can be implemented by any of BIB systems 102 in any environment, including any exemplary environment 200 for more efficiently processing multiple samples within a sample preparation workflow.

[0062] At step 402, a sample to be processed is optionally determined. For example, the sample to be processed can be determined based on input received from a user via an interface on the BIB system or via an associated computing device. Alternatively, the sample to be processed can be determined by the BIB system or an associated computing device executing instructions that result in determining the next sample to be processed, accessing a data structure (i.e., table, schedule, metadata, etc.), and / or the like.

[0063] At step 404, a processing schedule for the sample is determined. The processing schedule for the sample corresponds to a BIB system configuration and workflow settings that are to be followed to achieve a desired processing result for the sample (e.g., BIB intensity, BIB milling time, a portion of the sample to be removed by the BIB, a surface of interest, or a combination thereof). In various embodiments, the processing schedule can be input by a user, received with sample information associated with the sample to be processed, or determined by the BIB system (e.g., based on the sample information).

[0064] At step 406, the sample is prepared for processing. Preparing the sample for processing can include harvesting the sample from a larger sample or otherwise generating the sample (e.g., growing or depositing a portion of the sample), loading the sample onto a sample holder, aligning the sample, transporting the sample to the BIB system, transporting the sample rack to a sample table region within the BIB system, and the like. For example, the BIB system can cause a component sample holder transport element to retrieve a sample holder associated with the sample to be processed from a storage region and translate, tilt, and / or rotate the sample holder such that the geometric relationship between the sample and a protective mask is such that the mask will protect a desired portion of the sample during illumination / milling.

[0065] At step 408, a laser source is caused to emit a beam (e.g., a laser) toward the sample. The beam emitted by the laser source has a higher beam energy and / or intensity than a wide ion beam. At step 410, a first portion of the sample is removed by the beam. Due to the increased intensity of the beam, the beam can remove sample material at a rate that is 10-50x greater than what can be achieved by a wide ion beam at which the beam is incident. However, while the removal of sample material by the beam is faster, the milling and / or processing by the beam also causes damage / burning on the remaining sample surface.

[0066] At step 412, the BIB source is caused to emit a wide ion beam toward the sample, and at step 414, a second portion of the sample is removed by the wide ion beam. Because the wide ion beam is able to remove sample material without damaging the sample surface, the wide ion beam is able to remove a final portion of the sample (i.e., the damaged portion of the sample) without causing further damage to the sample. In this way, once the bulk of the material is quickly removed by the light beam, the wide ion beam can be used to remove the final portion of the sample to expose the region of interest.

[0067] Figure 6 A sample process 500 for processing multiple samples within a dual BIB system with reduced downtime in accordance with the present disclosure is depicted. Process 500 can be implemented by any of the BIB systems 102 in any environment, including any of the example environments 200 for more efficiently processing multiple samples within a sample preparation workflow.

[0068] At step 502, a sample to be processed is optionally determined. For example, the sample to be processed can be determined based on input received from a user via an interface on the BIB system or via an associated computing device. Alternatively, the sample to be processed can be determined by the BIB system or an associated computing device executing instructions that result in determining the next sample to be processed, accessing a data structure (i.e., a table, a schedule, metadata, etc.), and / or the like.

[0069] At step 504, a processing schedule for the sample is determined. The processing schedule for the sample corresponds to a BIB system configuration and workflow settings that are to be followed to achieve a desired processing result for the sample (e.g., BIB intensity, BIB milling time, a portion of the sample to be removed by the BIB, a surface of interest, or a combination thereof). In various embodiments, the processing schedule can be input by a user, received with sample information associated with the sample to be processed, or determined by the BIB system (e.g., based on the sample information).

[0070] At step 506, a sample holder associated with the sample to be processed is removed from a storage location within the BIB system. For example, the BIB system can cause a component sample holder transport element (e.g., a sample holder manipulator) to retrieve the sample holder associated with the sample to be processed from a storage area within the BIB system and / or from a sample storage / transport device (e.g., a storage cassette).

[0071] At step 508, the sample holder is positioned in a sample table region. In particular, the sample holder transport element can translate, tilt, and / or rotate the sample holder such that the geometric relationship between the sample and the protective mask is such that the mask will protect the desired portion of the sample during irradiation / milling. In some embodiments, the sample can also be aligned with the mask based on user and / or sensor input. Alternatively or additionally, a workflow such as the one described above with respect to FIG. 4 can be used to position the sample holder in the sample table region.Figure 6 The sample is realigned (e.g., using the workflow described in the Background section).

[0072] At step 510, the sample is processed. Specifically, the BIB source is caused to emit a wide ion beam toward the sample. The first portion of the sample that the wide ion beam is incident upon is milled away, while the second portion of the sample that is blocked by the protective mask of the BIB source is not milled away. Alternatively or additionally, other sample preparation workflows (including but not limited to the processes described herein) can be used to process the sample in the BIB system.

[0073] At step 512, the sample holder is removed from the sample stage area. That is, the sample holder transport element translates, tilts, and / or rotates the sample holder so that it is stored in a storage location, in a sample transport device, or transported outside of the BIB system through a port.

[0074] At step 514, it is determined whether another sample is to be processed. If the answer at 514 is yes, the process returns to step 502 and a sample to be processed is determined. If the answer at 514 is no, the process 500 can end.

[0075] Figure 7A An exemplary process 300 for processing a sample through a BIB system that implements increased system uptime in accordance with implementations of the present application is depicted. The process 600 can be implemented in any environment (including any of the exemplary environments 200 for more efficiently processing multiple samples within a sample preparation workflow) through any of the BIB systems 102.

[0076] At step 602, a sample is obtained. Specifically, the sample can be obtained by harvesting the sample from a larger sample, growing or depositing a portion of the sample, milling away a portion of the larger sample, or a combination thereof.

[0077] At step 604, the sample is affixed to a sample holder, and at step 606, the sample holder is nested with a first mask. The first mask is geometrically similar to a second protective mask within the BIB system, such that a sample that is in a desired alignment with respect to the first mask will also be in a desired alignment with the second sample. That is, when the sample is aligned with the first mask to a desired position on the sample holder, it does not need to be further aligned when the sample holder is subsequently nested in the second mask in the BIB system.

[0078] At step 608, the sample is aligned with the first mask. For example, a user can use an optical microscope, a sensor, or vision to manipulate the sample alignment elements on the sample holder so that the sample is translated, tilted, or rotated until it is in the desired alignment position. Once the sample is aligned, the sample holder can be translated into a sample storage area within the BIB system and / or from a sample storage / conveyance device (e.g., a storage cassette). For example, after the sample is pre-aligned in this way, the sample holder can be conveyed to a storage location in the BIB system where the sample will be processed. In some embodiments, the BIB system can have a separate sample alignment chamber where some or all of steps 602-608 can be performed, and the sample manipulation elements can convey the sample holder containing the aligned sample into a storage location within the BIB system. In this way, when the user aligns the sample with the first mask, the BIB system can process the pre-aligned sample using the second mask.

[0079] In an alternative example, once the sample is aligned with the first mask, the sample can be loaded onto a sample conveyance device that protects the sample during conveyance / loading into the BIB system where the sample will be processed. Such a conveyance device can be configured to convey a single sample holder or many sample holders. In some embodiments, the conveyance device can maintain a pressure or gas environment around the sample during conveyance. In this way, the sample can be prepared in a sample preparation area with a controlled pressure and / or gas composition, and then conveyed to the BIB system without exposing the sample to a new pressure / gas composition.

[0080] At step 610, it is determined whether another sample will be aligned. If the answer at 610 is yes, the process returns to step 602 and another sample is obtained. In this way, multiple samples can be pre-aligned and loaded into a sample storage area within the BIB system and / or from a sample storage / conveyance device. Because the user can align many samples in a continuous fashion, the throughput of sample preparation across multiple samples using this method can be greatly simplified.

[0081] If the answer at 610 is no, the process 600 continues at step 612 where the sample holder is nested with a second mask within the BIB system. Because the sample was pre-aligned with the first mask, it does not need to be further aligned when the sample holder is nested with the second mask. This greatly increases the speed at which the sample can be processed within the system.

[0082] At step 614, the sample is processed by the BIB system. For example, portions of the sample can be removed by a beam or wide ion beam according to any of the processes described herein. Additionally, since much of the user input currently required by BIB systems is related to the alignment process, by pre-aligning the sample using this process, the required user input can be performed all at once during alignment of multiple samples, and the remaining processing steps can be at least partially automated, such that a BIB system according to the present invention is able to process multiple pre-aligned samples with little or no user input / supervision.

[0083] At step 616, it is determined whether another sample is to be processed. If the answer at 616 is yes, the process returns to step 612 and nests another sample holder with the second mask. If the answer at 616 is no, the process 600 can end.

[0084] Figure 7B and Figure 7A are exemplary illustrations showing a sample 702 pre-aligned with a first mask 704, and subsequently processed by a BIB system containing a second mask 706. Specifically, Figure 7B shows the sample 702 aligned on a sample holder 708 using an optical microscope 710. ​ shows the sample 704 processed within the BIB system using a wide ion beam 712 from a BIB source 714. Because the sample 702 was pre-aligned with the first mask 704, and because the second mask 706 is geometrically similar to the first mask 704, the sample 702 does not need to be aligned / positioned within the BIB system.

[0085] Embodiments of the inventive subject matter according to the present disclosure are described in the following enumerated paragraphs.

[0086] A1. A wide ion beam (BIB) sample preparation system with improved uptime, the BIB sample preparation system comprising: a housing defining an interior volume; a sample stage positioned within the interior volume, wherein the sample stage is configured to hold a sample holder during polishing of a sample held by the sample holder; a first BIB source configured to emit a first wide ion beam toward the sample when in use, wherein the first BIB source is positioned within a first source housing; and a second BIB source configured to emit a second wide ion beam toward the sample when in use, wherein the first BIB source is positioned within a first source housing, wherein the second BIB source is configured to be removed while the first BIB source emits the first wide ion beam toward the sample.

[0087] A2. The BIB sample preparation system of paragraph Al, wherein the second source is further configured to be reinstalled while the first BIB source emits the first wide ion beam toward the sample.

[0088] A2.1. The BIB sample preparation system of paragraph A2, wherein the first source is configured to be removed while the second source emits the second wide ion beam toward the sample.

[0089] A2.2. The BIB sample preparation system of any of paragraphs A2-A2.2, wherein the first source is configured to be reinstalled while the second BIB source emits the second wide ion beam toward the sample.

[0090] A3. The BIB sample preparation system of any of paragraphs Al-A2.2, wherein the first source housing and the second source housing are each at least partially located within the interior volume.

[0091] A4. The BIB sample preparation system of any of paragraphs Al-A3, wherein the first source housing at least partially defines: a first volume comprising the first BIB source; and a first aperture connecting the first volume with the interior volume.

[0092] A4.1. The BIB sample preparation system of paragraph A4, further comprising a first valve configured to switch between: an open state in which the ions emitted from the first BIB source are allowed to pass from the first volume to the interior volume through the first aperture; and a sealed state in which the first valve prevents ions or emissions from the sample from passing from the interior volume to the first volume.

[0093] A4.1.1. The BIB sample preparation system of paragraph A4.1, wherein when the first valve is in the sealed state, the first volume is openable to an external environment without affecting the pressure within the interior volume.

[0094] A4.1.2. The BIB sample preparation system of any of paragraphs A4.1-A4.1.1, wherein when the first valve is in the sealed state, the first volume is openable to an external environment without affecting the gas composition within the interior volume.

[0095] A4.1.3. The BIB sample preparation system of any of paragraphs A4.1-A4.1.2, wherein the first BIB source is capable of at least one of removal and reinstallation from the BIB sample preparation system without affecting the pressure or gas composition within the interior volume when the first valve is in the sealed state.

[0096] A4.1.4. The BIB sample preparation system of any of paragraphs A4.1-A4.1.3, wherein the first volume is capable of being vented to an external environment without breaking a vacuum in the interior volume when the first valve is in the sealed state.

[0097] A4.1.5. The BIB sample preparation system of any of paragraphs A4.1-A4.1.4, wherein the first valve corresponds to one of a shutter, a valve, or a door.

[0098] A4.2. The BIB sample preparation system of any of paragraphs A4-A4.1.5, wherein the first housing further defines a first BIB source maintenance aperture that allows the first BIB source to be removed from or reinstalled within the first volume.

[0099] A4.2.1. The BIB sample preparation system of paragraph A4.1, further comprising a first access port configured to switch between: an open state in which the first BIB source is removable from or re installable within the first volume; and a closed state in which the first volume is sealed from the external environment.

[0100] A4.2.2. The BIB sample preparation system of paragraph A4.2.1, wherein the first housing is configured to allow the first volume to be pressurized independently of the interior volume or the second volume when the first valve and the first access port are each in the closed state.

[0101] A5. The BIB sample preparation system of any of paragraphs A1-A4.2.2, wherein the second source housing at least partially defines: a second volume comprising the second BIB source; and a second aperture connecting the second volume with the interior volume.

[0102] A5.1. The BIB sample preparation system of paragraph A5, further comprising a second valve configured to switch between: an open state in which the ions emitted from the second BIB source are allowed to pass from the second volume to an interior volume through the second orifice; and a sealed state in which the second valve prevents the passage of ions or emissions from the sample from the interior volume to the second volume.

[0103] A5.1.1. The BIB sample preparation system of paragraph A5.1, wherein when the first valve is in the sealed state, the first volume can be open to an external environment without affecting the pressure within the interior volume.

[0104] A5.1.2. The BIB sample preparation system of any of paragraphs A5.1-A5.1.1, wherein when the first valve is in the sealed state, the first volume can be open to an external environment without affecting the gas composition within the interior volume.

[0105] A5.1.3. The BIB sample preparation system of any of paragraphs A5.1-A5.1.21, wherein when the first valve is in the sealed state, the first BIB source can be at least one of removed and reinstalled from the BIB sample preparation system without affecting the pressure or gas composition within the interior volume.

[0106] A5.1.4. The BIB sample preparation system of any of paragraphs A5.1-A5.1.3, wherein when the first valve is in the sealed state, the first volume can be open to an external environment without breaking a vacuum in the interior volume.

[0107] A5.1.5. The BIB sample preparation system of any of paragraphs A5.1-A5.1.4, wherein the second valve corresponds to one of a shutter, a valve, or a door.

[0108] A5.2. The BIB sample preparation system of any of paragraphs A5-A5.1.5, wherein the second housing further defines a second BIB source maintenance orifice that allows the second BIB source to be removed from or reinstalled within the second volume.

[0109] A5.2.1. The BIB sample preparation system of paragraph A5.1, further comprising a second access port configured to switch between: an open state in which the second BIB source can be removed from or reinstalled within the second volume; and a closed state in which the second volume is sealed from the external environment.

[0110] A5.2.2. The BIB sample preparation system of paragraph A5.2.1, wherein the second housing is configured to allow the second volume to be pressurized independently of the interior volume or the first volume when the second valve and the second access port are each in the closed state.

[0111] A6. The BIB sample preparation system of any of paragraphs Al-A5.2.2, further comprising one or more additional BIB sources.

[0112] A7. The BIB sample preparation system of any of paragraphs Al-A5.2.2, wherein the first BIB source emits the first wide ion beam toward the sample along a first axis, the second BIB source emits the second wide ion beam toward the sample along a second axis, and an angle between the first source and the second source is between 60 degrees and 120 degrees.

[0113] A8. The BIB sample preparation system of any of paragraphs Al-A7, further comprising: a processor; and a memory storing computer-readable instructions that, when executed on the processor, cause the processor to initiate performance of the method of any of paragraphs Bl-B7.2.1.

[0114] B1. A method for operating a wide ion beam (BIB) polisher having improved uptime, the method comprising: causing a first BIB source to emit a first wide ion beam toward a sample positioned within an interior volume of the BIB polisher, wherein the first wide ion beam causes a portion of the sample on which the first wide ion beam is incident to be removed; while the first BIB source is emitting the first wide ion beam toward the sample, removing a second BIB source from the BIB polisher, wherein the second BIB source is configured to emit a second wide ion beam toward the sample when the second BIB source is in use.

[0115] B2. The method of paragraph Bl, further comprising reinstalling the second BIB source into the BIB polishing system.

[0116] B2.1. The method of paragraph B2, wherein the second BIB source is reinstalled while the first BIB source is emitting the first wide ion beam.

[0117] B2.1.1. The method of paragraph B2.1, wherein the second BIB source is reinstalled while the first BIB source is emitting the first wide ion beam toward the sample.

[0118] B2.1.2. The method of paragraph B2.1, wherein the second BIB source is reinstalled while the first BIB source is emitting the first wide ion beam toward a different sample.

[0119] B3. The method of any of paragraphs B1-B2.1, further comprising causing the second BIB source to emit the second wide ion beam.

[0120] B3.1. The method of paragraph B3, wherein the second wide ion beam is emitted toward the sample.

[0121] B3.2. The method of paragraph B3, wherein the second wide ion beam is emitted toward a different sample.

[0122] B4. The method of any of paragraphs B1-B3.2, further comprising installing a third BIB source into the BIB polishing system.

[0123] B4.1. The method of paragraph B4, wherein the third BIB source is installed while the first BIB source is emitting the first wide ion beam.

[0124] B4.1.1. The method of paragraph B4.1, wherein the third BIB source is installed while the first BIB source is emitting the first wide ion beam toward the sample.

[0125] B4.1.2. The method of paragraph B4.1, wherein the third BIB source is installed while the first BIB source is emitting the first wide ion beam toward a different sample.

[0126] B4.2. The method of any of paragraphs B4-B4.1.2, further comprising: causing the third BIB source to emit a third wide ion beam; and removing the first BIB source from the BIB polisher while the third BIB source is emitting the third wide ion beam.

[0127] B5. The method of any of paragraphs B1-B4.2, further comprising: causing the second BIB source to emit the second wide ion beam toward a new sample positioned within the interior volume of the BIB polisher, wherein the second wide ion beam causes a portion of the new sample on which the second wide ion beam is incident to be removed; and removing the first BIB source from the BIB polisher while the second BIB source is emitting the second wide ion beam toward the new sample.

[0128] B6. The method of any of paragraphs B4.2-B5, further comprising reinstalling the first BIB source into the BIB polishing system.

[0129] B6.1. The method of paragraph B6, wherein the first BIB source is reinstalled while the second BIB source emits the second wide ion beam.

[0130] B6.1.1. The method of paragraph B6.1, wherein the first BIB source is reinstalled while the second BIB source emits the second wide ion beam toward the sample.

[0131] B6.1.2. The method of paragraph B6.1, wherein the first BIB source is reinstalled while the second BIB source emits the second wide ion beam toward a different sample.

[0132] B7. The method of any of paragraphs B1-B6.1.2, wherein the BIB polisher comprises a source housing defining a housing volume and an aperture between the housing volume and an interior volume of the BIB polisher.

[0133] B7.1. The method of paragraph B7, wherein the second BIB source is positioned within the housing volume.

[0134] B7.2. The method of any of paragraphs B7-B7.1, wherein the BIB polisher further comprises a valve configured to switch between: an open state in which the ions emitted from the second BIB source are allowed to pass from the housing volume to the interior volume through the aperture; and a sealed state in which the valve prevents ions or emissions from the sample from passing from the interior volume to the housing volume.

[0135] B7.2.1. The method of paragraph B7.2, further comprising causing the valve to switch to the sealed state prior to removing the second BIB source from the BIB polisher.

[0136] C1. A method for preparing a sample by combining a wide ion beam (BIB) and a laser sample preparation system, the method comprising the steps of: positioning a sample within the interior volume of the combined sample preparation system; causing a laser source component of the combined sample preparation system to emit a light beam toward the sample, wherein the light beam causes a first portion of the sample on which the light beam is incident to be removed; and causing a BIB source component of the combined sample preparation system to emit a wide ion beam toward the sample, wherein the wide ion beam causes a second portion of the sample on which the wide ion beam is incident to be removed to reveal a region of interest.

[0137] C2. The method of paragraph C1, wherein the sample is illuminated by each of the light beam and the wide ion beam without removing the sample from the interior volume.

[0138] C2.1. The method of paragraph C2, wherein the sample is illuminated by each of the light beam and the wide ion beam without repositioning the sample.

[0139] C2.2. The method of any of paragraphs C2-C2.1, wherein the sample is illuminated by each of the light beam and the wide ion beam without repositioning the laser source.

[0140] C2.3. The method of any of paragraphs C2-C2.2, wherein the sample is illuminated by each of the light beam and the wide ion beam without repositioning the BIB source.

[0141] C3. The method of any of paragraphs C1-C2.3, wherein the laser source is configured to illuminate the sample by the light beam for a first time period and the BIB source is configured to illuminate the sample by the light beam for a first time period.

[0142] C3.1. The method of paragraph C2, wherein at least one of the first time period and the second time period is a predetermined time period.

[0143] C3.2. The method of any of paragraphs C3-C3.1, wherein at least one of the first time period and the second time period is provided via user input.

[0144] C3.3. The method of any of paragraphs C3-C3.2, wherein at least one of the first time period and the second time period is determined by accessing sample information associated with the sample.

[0145] C3.4. The method of any of paragraphs C3-C3.3, wherein at least one of the first time period and the second time period is determined based on a material of the first portion of the sample.

[0146] C3.5. The method of any of paragraphs C3-C3.4, wherein at least one of the first time period and the second time period is determined based on one or more sensors receiving information indicating that the first portion of the sample has been removed.

[0147] C3.6. The method of any of paragraphs C3-C3.5, wherein at least one of the first time period and the second time period is determined based on one or more sensors receiving information indicating that the second portion of the sample has been removed.

[0148] C3.7. The method of any of paragraphs C3-C3.6, wherein at least one of the first time period and the second time period is determined based on one or more sensors receiving information indicating that the region of interest has been exposed.

[0149] C3.8. The method of any of paragraphs C3-C3.7, wherein at least one of the first time period and the second time period is determined based on one or more of a laser intensity, a portion of the sample to be removed by the laser, a BIB intensity, a portion of the sample to be removed by the BIB, a surface of interest, or a combination thereof.

[0150] C4. The method of any of paragraphs C1-C3.8, wherein the method further comprises receiving sample information.

[0151] C4.1. The method of paragraph C4, wherein the sample information is received via user input.

[0152] C4.2. The method of paragraph C4, wherein the sample information is received by accessing a data file associated with the sample.

[0153] C4.3. The method of any of paragraphs C4-C4.2, wherein the sample information comprises one or more of a sample composition, a region of interest, and a surface of interest.

[0154] C4.4. The method of any of paragraphs C4-C4.3, wherein the sample information comprises one or more processing schedules.

[0155] C4.4.1. The method of paragraph C4.4, wherein the method further comprises determining one or more processing schedules based on the sample information.

[0156] C4.4.2. The method of paragraph C4.4, wherein the one or more processing schedules comprise one or more of a laser intensity, a laser milling time, a portion of the sample to be removed by the laser, a BIB intensity, a BIB milling time, a portion of the sample to be removed by the BIB, a surface of interest, or a combination thereof.

[0157] C5. The method of any of paragraphs CI - C4.4.2, further comprising: positioning an additional sample within the interior volume of the combined sample preparation system; causing the laser source component of the combined sample preparation system to emit an additional light beam toward the additional sample, wherein the additional light beam causes a first portion of the additional sample at which the additional light beam is incident to be removed; and causing the BIB source component of the combined sample preparation system to emit an additional wide ion beam toward the additional sample, wherein the additional wide ion beam causes a second portion of the additional sample at which the additional wide ion beam is incident to be removed to expose an additional area of interest.

[0158] C6. The method of any of paragraphs CI - C5, wherein the light beam removes sample material 20x, 30x, 50x, or faster than the wide ion beam.

[0159] D1. A combined wide ion beam (BIB) and laser sample preparation system having improved polishing throughput, the combined sample preparation system comprising: a housing defining an interior volume; a sample stage positioned within the interior volume, wherein the sample stage is configured to hold a sample holder during polishing of a sample held by the sample holder; a laser source configured to emit, in use, a light beam toward the sample, wherein the light beam causes a first portion of the sample at which the light beam is incident to be removed; and a BIB source configured to emit, in use, a wide ion beam toward the sample, wherein the wide ion beam causes a second portion of at least the sample at which the wide ion beam is incident to be removed to expose an area of interest.

[0160] D2. The combined sample preparation system of paragraph Dl, further comprising: a processor; and a memory storing computer-readable instructions that, when executed on the processor, cause the processor to initiate execution of the method of any of paragraphs CI - C6.

[0161] E1. A storage cassette for storing a plurality of samples for wide ion beam (BIB) polishing, the storage cassette comprising: a housing at least partially defining an interior storage volume; a plurality of sample holder housings within the interior storage volume, wherein each individual sample holder housing is configured to receive a sample holder comprising a corresponding sample for polishing in a BIB system; and wherein the storage cassette is configured to be inserted into the BIB system and each of the sample holder housings is further configured to allow its corresponding sample holder to be removed from the cassette when the cassette is inserted into the BIB system so that the corresponding sample can be polished by the BIB system.

[0162] F1. A broad ion beam (BIB) system for efficiently processing a plurality of samples, the BIB system comprising: a housing defining an interior volume; a sample stage positioned within the interior volume, wherein the sample stage is configured to hold a sample holder during polishing of a sample held by the sample holder; a BIB source configured to emit, in use, a first broad ion beam toward the sample, wherein the first BIB source is positioned within a first source housing; a cassette housing configured to receive and hold a storage cassette according to any of paragraphs El EXX; and a sample holder manipulator configured to: remove an individual sample holder from the storage cassette; load the individual sample holder onto the sample stage to enable processing of the corresponding sample; after the corresponding sample has been processed, remove the individual sample holder from the sample stage; and load the individual sample holder back into the storage cassette.

[0163] F2. The BIB system of paragraph Fl, further comprising: a processor; and a memory storing computer-readable instructions that, when executed on the processor, cause the processor to initiate performance of the method of any of paragraphs Gl - G6.4.2.

[0164] Gl. A method for efficiently processing a plurality of samples by a broad ion beam (BIB) system, the method comprising the steps of: removing an individual sample holder containing a sample from a storage cassette; loading the individual sample holder onto a sample stage, the sample stage being configured to hold the sample holder during polishing of the corresponding sample held by the individual sample holder; causing a BIB source to emit a broad ion beam toward the sample, wherein the broad ion beam removes at least a portion of the sample on which the broad ion beam is incident; after the corresponding sample has been processed, removing the individual sample holder from the sample stage; and loading the individual sample holder back into the storage cassette.

[0165] Gl. l. The method of paragraph Gl, further comprising receiving a storage cassette according to paragraph El for processing in a BIB system.

[0166] G2. The method of any of paragraphs Gl - Gl. l, wherein the storage cassette stores a plurality of sample holders each containing a corresponding sample.

[0167] G2.1. The method of paragraph G2, further comprising: removing, from the storage magazine, another individual sample holder containing another sample; loading the other individual sample holder onto the sample stage; causing the BIB source to emit another broad ion beam toward the sample, wherein the other broad ion beam removes at least a portion of the other sample on which the other broad ion beam is incident; removing the other individual sample holder from the sample stage after the corresponding sample has been processed; and loading the other individual sample holder back into the storage magazine.

[0168] G2.2. The method of any of paragraphs G2-G2.1, further comprising repeating the method steps described in paragraph G2.1 for one or more additional sample holders stored in the storage magazine.

[0169] G3. The method of any of paragraphs G2-G2.2, wherein the samples in the sample holders stored in the storage magazine are pre-aligned.

[0170] G3.1. The method of paragraph G2, wherein the samples are pre-aligned in their respective sample holders using the method of any of paragraphs H1-H9.

[0171] G4. The method of any of paragraphs G1-G3.1, wherein the steps of any of paragraphs G1-G3.1 are performed automatically by the BIB system.

[0172] G4.1. The method of paragraph G3.1, wherein the steps of any of paragraphs G1-G3.1 are performed without user input.

[0173] G5. The method of any of paragraphs G1-C4.1, wherein the BIB source is configured to irradiate the sample by the broad ion beam for a period of time.

[0174] G5.1. The method of paragraph G5, wherein the first period of time is a predetermined period of time.

[0175] G5.2. The method of any of paragraphs G5-G5.1, wherein the period of time is provided via user input.

[0176] G5.3. The method of any of paragraphs G5-G5.2, wherein the period of time is determined by accessing sample information associated with the sample.

[0177] G5.4. The method of any of paragraphs G5-G5.3, wherein the first period of time is determined based on a material of the portion of the sample.

[0178] G5.5. The method of any of paragraphs G5-C3.4, wherein the time period is determined based on one or more sensors receiving information indicating that the portion of the sample has been removed.

[0179] G5.7. The method of any of paragraphs G5-C3.6, wherein the time period is determined based on one or more sensors receiving information indicating that a region of interest has been exposed.

[0180] G5.8. The method of any of paragraphs G5-C3.7, wherein the time period is determined based on one or more of a BIB intensity, a portion of the sample to be removed by the BIB, a surface of interest, or a combination thereof.

[0181] G6. The method of any of paragraphs G1-G5.8, wherein the method further comprises receiving sample information.

[0182] G6.1. The method of paragraph G6, wherein the sample information is received via user input.

[0183] G6.2. The method of paragraph G6, wherein the sample information is received by accessing a data file associated with the corresponding sample.

[0184] G6.2.1. The method of paragraph G6.2, wherein the data file is stored on a memory component of the storage cartridge.

[0185] G6.3. The method of any of paragraphs G6-G6.2, wherein the sample information comprises one or more of a sample composition, a region of interest, and a surface of interest.

[0186] G6.4. The method of any of paragraphs G6-G6.3, wherein the sample information comprises one or more processing schedules.

[0187] G6.4.1. The method of paragraph G6.4, wherein the method further comprises determining one or more processing schedules based on the sample information.

[0188] G6.4.2. The method of paragraph G6.4, wherein the one or more processing schedules comprise one or more of a BIB intensity, a BIB milling time, a portion of the sample to be removed by the BIB, a surface of interest, or a combination thereof.

[0189] H1. A method for pre-aligning a sample for more efficient processing of multiple samples by a broad ion beam (BIB) system, the method comprising the steps of: securing a sample to an adjustable portion of a sample holder; nesting the sample holder with a first mask having a first mask edge, wherein the first mask is positioned outside of a broad ion beam (BIB) system; aligning the sample so that it has a desired geometric relationship with the first mask edge; and nesting the sample holder with a second mask having a second mask edge, wherein the second mask is positioned within the BIB system, and wherein the first mask and the second mask are geometrically similar such that the geometric relationship between the first mask edge and the sample when the sample holder is nested with the first mask is the same as the geometric relationship between the second mask edge and the sample when the sample holder is nested with the second mask.

[0190] H2. The method of paragraph H1, wherein the sample has the desired geometric relationship with the second edge when the sample holder is nested with the second mask without any alignment of the sample within the BIB system.

[0191] H3. The method of any of paragraphs H1-H2, further comprising removing a portion of the sample by broad ion beam irradiation of a portion of the second mask and a portion of the sample.

[0192] H3.1. The method of paragraph H3.1, wherein the second mask is made of a hard material that will not be degraded by the broad ion beam.

[0193] H3.2. The method of any of paragraphs H3-H3.1, wherein the second mask blocks a portion of the broad ion beam such that a portion of interest of the sample is not removed from the sample.

[0194] H4. The method of any of paragraphs H1-H3.2, wherein aligning corresponds to adjusting the adjustable portion of the sample holder so that the sample is positioned so that it has a desired geometric relationship with the first mask edge.

[0195] H5. The method of any of paragraphs H1-H4, wherein the first mask and the second mask are geometrically identical.

[0196] H6. The method of any of paragraphs H1-H5, wherein the sample is secured to the sample and aligned within a closed environment.

[0197] H6.1. The method of paragraph H6, wherein the closed environment has an inert gas atmosphere.

[0198] H6.2. The method of any of paragraphs H6-H6.1, wherein the closed environment has a reduced pressure.

[0199] H6.3. The method of any of paragraphs H6-H6.2, wherein the closed environment has a vacuum pressure level.

[0200] H7. The method of any of paragraphs H1-H6.3, further comprising transferring the sample holder and the aligned sample from a preparation station to a BIB system.

[0201] H7.1. The method of paragraph H7, wherein the BIB system is the BIB system of any of paragraphs A1-A8, D1-D2, and / or F1-F2.

[0202] H7.2. The method of any of paragraphs H7-H7.1, wherein the preparation station is the closed environment of paragraphs H6-H6.3.

[0203] H7.3. The method of any of paragraphs H7-H7.2, wherein transferring the sample comprises loading the sample into a transfer device configured to interface with both the sample preparation region and the BIB system.

[0204] H7.3.1. The method of paragraph H7.3, wherein the transfer device is a sealed compartment for holding the sample holder such that it is sealed off from the environment.

[0205] H7.3.1.1. The method of paragraph H7.3.1, the sealed compartment having an inert gas.

[0206] H7.3.2. The method of any of paragraphs H7.3-H7.3.1.1, wherein the transfer device is the storage cartridge of paragraph E1.

[0207] H8. The method of any of paragraphs H1-H7.3.2, further comprising repeating the method for a plurality of samples on corresponding sample holders.

[0208] H9. The method of any of paragraphs H1-H8, wherein further comprising processing the sample using the method of any of paragraphs C1-C6 and / or G1-G6.4.2.

[0209] I1. Performing the method of any of paragraphs C1-C6, G1-G6.4.2, and / or H1-H9 using the system of any of paragraphs A1-A8, D1-D2, E1, and / or F1-F2.

[0210] J1. A non-transitory computer-readable medium storing instructions that, when executed on a processor, cause the processor to initiate performance of a method according to any of paragraphs C1-C6, G1-G6.4.2, and / or H1-H9.

Claims

1. A method for pre-aligning a sample for more efficient processing of multiple samples by a broad ion beam (BIB) system, the method comprising the steps of: securing a sample to an adjustable portion of a sample holder; nesting the sample holder with a first mask having a first mask edge, wherein the first mask is positioned outside of a broad ion beam (BIB) system; aligning the sample so that the sample has a desired geometric relationship with the first mask edge; and nesting the sample holder with a second mask having a second mask edge, wherein the second mask is positioned within the BIB system, and wherein the first mask and the second mask are geometrically similar so that the geometric relationship between the first mask edge and the sample when the sample holder is nested with the first mask is the same as the geometric relationship between the second mask edge and the sample when the sample holder is nested with the second mask.

2. The method of claim 1, wherein the sample has the desired geometric relationship with the second mask edge when the sample holder is nested with the second mask without any alignment of the sample within the BIB system.

3. The method of claim 1, further comprising removing portions of the sample with a broad ion beam by irradiating a portion of the second mask and a portion of the sample with a broad ion beam from a BIB source component of the BIB system.

4. The method of claim 3, wherein the second mask blocks a portion of the broad ion beam so that a portion of the sample of interest is not removed from the sample.

5. The method of claim 1, wherein aligning corresponds to adjusting the adjustable portion of the sample holder so that the sample is positioned so that the sample has a desired geometric relationship with the first mask edge.

6. The method of claim 1, wherein the sample is secured to the sample holder and aligned within a closed environment.

7. The method of claim 1, further comprising transferring the sample holder and the aligned sample from a preparation station to a BIB system.

8. The method of claim 7, wherein the sample holder is transferred from the preparation station to the BIB system using a transfer apparatus comprising a sealed compartment for holding the sample holder so that the sample is sealed off from an external environment during transport.

9. The method of claim 7, wherein the sample holder is transferred from the preparation station to the BIB system using a storage cassette configured to store a plurality of samples for broad ion beam (BIB) polishing, the storage cassette comprising: a housing at least partially defining an interior storage volume; a plurality of sample holder housings within the interior storage volume, wherein each individual sample holder housing is configured to receive a sample holder comprising a corresponding sample for polishing in a BIB system; and wherein the storage cassette is configured to be inserted into the BIB system, and each of the sample holder housings is further configured to allow a corresponding sample holder of each of the sample holder housings to be removed from the storage cassette when the storage cassette is inserted into the BIB system, such that the corresponding sample can be polished by the BIB system.

10. The method of claim 9, further comprising repeating the method for a plurality of samples on a corresponding sample holder, securing an additional sample to an adjustable portion of an additional sample holder; nesting the additional sample holder with a first mask having a first mask edge; aligning the additional sample such that the additional sample has a desired geometric relationship with the first mask edge; and storing the sample holder and the additional sample holder in the storage cassette for shipping to the BIB system.

Citation Information

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