Light-emitting element

Abstract

A light-emitting element includes a light-emitting array, multiple coating layers, and an insulating photosensitive material layer. The light-emitting array includes a first organic light-emitting unit and a second organic light-emitting unit, wherein the first organic light-emitting unit includes a first electrode, and the second organic light-emitting unit includes a second electrode. The multiple coating layers include a first coating layer and a second coating layer. The first coating layer covers a portion of the upper surface of the first electrode and a sidewall of the first electrode, and the second coating layer covers a portion of the upper surface of the second electrode and a sidewall of the second electrode. The insulating photosensitive material layer is located between the sidewall of the first electrode and the sidewall of the second electrode, wherein the insulating photosensitive material layer partially covers the upper surface of the first electrode.

Description

Technical Field

[0001] This disclosure relates to a light-emitting element, and more particularly to an organic light-emitting element. Background Technology

[0002] Organic light-emitting displays (OLEDs) are widely used in high-end electronic devices. However, due to limitations in current technology, the luminous efficiency and quality of light-emitting materials cannot be effectively controlled, resulting in less-than-expected optical performance of the devices. Summary of the Invention

[0003] In this disclosure, a light-emitting element includes a light-emitting array, multiple coating layers, and an insulating photosensitive material layer. The light-emitting array includes a first organic light-emitting unit and a second organic light-emitting unit, wherein the first organic light-emitting unit includes a first electrode, and the second organic light-emitting unit includes a second electrode. The multiple coating layers include a first coating layer and a second coating layer. The first coating layer covers a portion of the upper surface of the first electrode and a sidewall of the first electrode, and the second coating layer covers a portion of the upper surface of the second electrode and a sidewall of the second electrode. The insulating photosensitive material layer is located between the sidewall of the first electrode and the sidewall of the second electrode, wherein the insulating photosensitive material layer partially covers the upper surface of the first electrode.

[0004] In this disclosure, a light-emitting element includes a plurality of organic light-emitting units, an insulating photosensitive material layer, and a plurality of coating layers. The insulating photosensitive material layer covers the organic light-emitting units, wherein the insulating photosensitive material layer has a plurality of recesses for exposing a plurality of effective light-emitting regions of the organic light-emitting units. Each coating layer surrounds the sidewall of each organic light-emitting unit, and each coating layer is located between the sidewalls of two adjacent organic light-emitting units.

[0005] In this disclosure, a method for fabricating a light-emitting element includes: providing a substrate; forming a plurality of electrodes on the substrate; forming a coating material layer on the electrodes; patterning the coating material layer to form a plurality of coating layers surrounding a plurality of sidewalls of the electrodes and exposing a plurality of upper surfaces of the electrodes, wherein the coating layers are discontinuous between the electrodes; disposing an insulating photosensitive material on the electrodes and the coating layer; patterning the insulating photosensitive material to form an insulating photosensitive material layer that exposes a plurality of effective light-emitting regions on the upper surfaces of the electrodes; and disposing an organic light-emitting material on the effective light-emitting regions of the electrodes.

[0006] In some embodiments, the light absorption rate of the coating layer is greater than that of the insulating photosensitive material layer.

[0007] In some embodiments, the covering layer and the insulating photosensitive material layer are integrally formed and made of the same material.

[0008] In some embodiments, the coating layer includes a conductor, and the plurality of coating layers are spaced apart from each other.

[0009] In some embodiments, the coating layer comprises metal, resin, graphite, or any combination thereof.

[0010] In some embodiments, the coating layer includes a photosensitive material.

[0011] In some embodiments, the light-emitting element further includes a transparent substrate, wherein the organic light-emitting unit is disposed on the transparent substrate.

[0012] In some embodiments, the first electrode has a first edge and a second edge opposite to or adjacent to the first edge, a portion of the upper surface extends inward from the first edge by a first distance, a portion of the upper surface extends inward from the second edge by a second distance, and the first distance is greater than the second distance.

[0013] In some embodiments, the first electrode has a first edge and a second edge opposite to or adjacent to the first edge. An insulating photosensitive material layer contacts a first region adjacent to the first edge and a second region adjacent to the second edge on the upper surface of the first electrode. The width of the first region is not equal to the width of the second region, and / or the area of ​​the first region is not equal to the area of ​​the second region.

[0014] In some embodiments, the first electrode and the second electrode are anodes, and / or the first electrode and the second electrode comprise transparent conductive materials.

[0015] In some embodiments, the first organic light-emitting unit and the second organic light-emitting unit emit light of the same wavelength.

[0016] In some embodiments, the organic light-emitting material includes an electron transport layer (ETL), an electron injection layer (EIL), an emission layer (EM), a hole blocking layer (HBL), a hole injection layer (HIL), a hole transport layer (HTL), or any combination thereof.

[0017] In some embodiments, the coating material layer is formed by a spin coating process or a deposition process.

[0018] In some embodiments, the coating material layer is patterned using a photolithography process. Attached Figure Description

[0019] Figure 1 This is a top view illustrating an intermediate product of a light-emitting element.

[0020] Figure 2A This is a top view of a light-emitting element according to some embodiments.

[0021] Figure 2B For example, along Figure 2A A cross-sectional view of line 2B-2B' in the diagram.

[0022] Figure 3AThis is a top view of a light-emitting element according to some embodiments.

[0023] Figure 3B For example, along Figure 3A A cross-sectional view of line 3B-3B' in the diagram.

[0024] Figure 4A This is a top view of a light-emitting element according to some embodiments.

[0025] Figure 4B For example, along Figure 4A A cross-sectional view of line 4B-4B' in the diagram.

[0026] Figure 4C This is a top view of a light-emitting element according to some embodiments.

[0027] Figure 4D For example, along Figure 4C The cross-sectional view of line 4D-4D' in the middle.

[0028] Figure 5A This is a cross-sectional view of a light-emitting element according to some embodiments.

[0029] Figure 5B This is a cross-sectional view of a light-emitting element according to some embodiments.

[0030] Figure 6A This is a top view of a light-emitting element according to some embodiments.

[0031] Figure 6B For example, along Figure 6A A cross-sectional view of line 6B-6B' in the diagram.

[0032] Figure 7A This is a top view of a light-emitting element according to some embodiments.

[0033] Figure 7B For example, along Figure 7A A cross-sectional view of line 7B-7B' in the diagram.

[0034] Figures 8A to 13B The illustration depicts a method for manufacturing a light-emitting element according to some embodiments. Detailed Implementation

[0035] Figure 1 This is a top view illustrating an intermediate product of the light-emitting element 10. The light-emitting element 10 has a light-emitting layer 20 and a cover layer 40 located above the light-emitting layer 20. For the light-emitting layer 20, spacers 30 may be designed to provide an array of recesses for accommodating an array of light-emitting pixels. In some embodiments, the spacers 30 may comprise a photosensitizing material.

[0036] Figure 2A This is a top view of a light-emitting element according to some embodiments. Figure 2B For example, along Figure 2A A cross-sectional view of line 2B-2B' in some embodiments. Figure 2B For example, along Figure 1 A cross-sectional view of line AA is shown, illustrating only the luminescent area. In some embodiments, Figure 2B For example, along Figure 2A The diagram shows a cross-sectional view along line 2B-2B', illustrating only the light-emitting area. For simplicity, the overlay layer 40 is omitted here. The spacer 30 has several bumps 310 to define the pattern of light-emitting pixels. Recesses are located between two adjacent bumps 310 and provide space to accommodate the light-emitting pixels. Those skilled in the art will understand from... Figure 2B From the cross-sectional view, protrusion 310 is drawn as a broken section, but from... Figure 1 and Figure 2A As can be seen from the top view, they can be connected to each other via other parts of the spacer 30.

[0037] In some embodiments, such as Figure 1 , Figure 2A and Figure 2B As shown, the light-emitting element 10 includes a substrate 100, bumps 310 above the substrate 100, and a light-emitting array. In some embodiments, the light-emitting array includes a plurality of organic light-emitting units (or light-emitting pixels), such as at least organic light-emitting unit 101 (or first organic light-emitting unit) and organic light-emitting unit 102 (or second organic light-emitting unit). In some embodiments, organic light-emitting unit 101 and organic light-emitting unit 102 are located between the bumps 310 and above the substrate 100. In some embodiments, organic light-emitting unit 101 and organic light-emitting unit 102 emit light of the same wavelength.

[0038] In some embodiments, substrate 100 may include a thin-film transistor (TFT) array configured to correspond to light-emitting pixels in light-emitting layer 20. Substrate 100 may include a plurality of capacitors. In some embodiments, more than one transistor is configured to form a circuit with a capacitor and a light-emitting pixel.

[0039] In some embodiments, the organic light-emitting unit 101 includes an electrode 215 (or a first electrode), an organic layer 269 (or a light-emitting layer), and an electrode 216 (or a second electrode) on the organic layer 269. The organic light-emitting unit 102 includes an electrode 225 (or a first electrode), an organic layer 269, and an electrode 216 (or a second electrode) on the organic layer 269. In some embodiments, the electrode 216 is located above the organic layer 269.

[0040] In some embodiments, the electrode 215 of the organic light-emitting unit 101 and the electrode 225 of the organic light-emitting unit 102 are anodes. In some embodiments, the electrode 215 of the organic light-emitting unit 101 and the electrode 225 of the organic light-emitting unit 102 comprise a transparent conductive material. In some embodiments, the electrodes 215 and 225 are configured such that one side is connected to a circuit embedded in the substrate 100 and the other side contacts the organic layer 269.

[0041] In some embodiments, the second electrode 216 is patterned to cover only the effective light-emitting area of ​​each organic light-emitting unit. In some embodiments, the second electrode 216 is in contact with the organic layer 269. The second electrode 216 may be as follows: Figure 2B The continuous film shown is located above the organic layer 269 and the bump 310. In other words, the second electrode 216 is a common electrode for several organic light-emitting units. In some embodiments, the second electrode 216 is a common electrode for all organic light-emitting units in the light-emitting element.

[0042] In some embodiments, the organic layer 269 comprises one or more organic light-emitting materials. The organic light-emitting materials include an electron transport layer (ETL), an electron injection layer (EIL), an emission layer (EM), a hole blocking layer (HBL), a hole injection layer (HIL), a hole transport layer (HTL), or any combination thereof.

[0043] In some embodiments, the organic layer 269 includes a first carrier transport layer 262 above the bump 310 and the electrode 215, a second carrier transport layer 263 above the first carrier transport layer 262, and an organic emission layer 264 above the second carrier transport layer 263. In some embodiments, the organic layer 269 further includes a carrier injection layer 261 disposed between the electrode 215 and the first carrier transport layer 262. In some embodiments, the organic layer 269 further includes an organic carrier transport layer 265 disposed above the organic emission layer 264. In some embodiments, the carrier injection layer 261 may be a hole injection layer, the first carrier transport layer 262 may be a first hole transport layer, the second carrier transport layer 263 may be a second hole transport layer, and the organic carrier transport layer 265 may be an electron transport layer.

[0044] In some embodiments, the bump 310 includes a portion of the cladding layer 200A and a portion of the insulating photosensitive material layer 300. In some embodiments, the bump 310 includes a portion of the cladding layer 200B and a portion of the insulating photosensitive material layer 300. In some embodiments, the bump 310 includes a portion of the cladding layer 200A, a portion of the cladding layer 200B, and a portion of the insulating photosensitive material layer 300. In some embodiments, the bump 310 is also referred to as a pixel defined layer (PDL).

[0045] In some embodiments, the coating layer 200A surrounds the sidewall of the organic light-emitting unit 101. In some embodiments, the coating layer 200A covers a portion 215P of the upper surface 215a of the electrode 215 and the sidewall 215S of the electrode 215. In some embodiments, the coating layer 200A includes a perforation 200A1 to expose a portion of the upper surface 215a of the electrode 215. In some embodiments, the coating layer 200A is located between the sidewall of an adjacent organic light-emitting unit 101 and the sidewall of an organic light-emitting unit 102.

[0046] In some embodiments, the coating layer 200B surrounds the sidewall of the organic light-emitting unit 102. In some embodiments, the coating layer 200B covers a portion 225P of the upper surface 225a of the electrode 225 and the sidewall 225S of the electrode 225. In some embodiments, the coating layer 200B includes a perforation 200B1 to expose a portion of the upper surface 225a of the electrode 225. In some embodiments, the coating layer 200B is located between the sidewall of an adjacent organic light-emitting unit 101 and the sidewall of the organic light-emitting unit 102.

[0047] In some embodiments, coating layers 200A and 200B comprise conductors and are spaced apart from each other. In some embodiments, coating layers 200A and 200B comprise metal, resin, graphite, or any combination thereof. In some embodiments, coating layers 200A and 200B comprise photosensitive materials. In some embodiments, coating layers 200A and 200B comprise quantum dots, which have excellent light absorption performance. In some embodiments, coating layers 200A and 200B comprise carbon black materials, such as carbon black nanoparticles, carbon black-containing conductive fibers, or the like. In some embodiments, coating layers 200A and 200B comprise blackbody materials that have an absorption rate of 90%, 95%, 99%, 99.5%, or 99.9% or higher for visible light.

[0048] In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 50%. In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 60%. In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 70%. In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 80%. In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 90%. In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 95%. In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 99%. In some embodiments, the absorption rates of the coating layers 200A and 200B for a specific wavelength are greater than or equal to 99.5%. In some embodiments, the absorption rate of the coating layers 200A and 200B for a specific wavelength is greater than or equal to 99.9%. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

[0049] In some embodiments, electrode 215 has an edge 2151 and an edge 2152 opposite to edge 2151. A portion 215P of the upper surface 215a of electrode 215 extends inward from edge 2151 by a distance D1, and a portion 215P of the upper surface 215a of electrode 215 extends inward from edge 2152 by a distance D2, wherein distance D1 is greater than distance D2. In some embodiments, electrode 215 has an edge 2153 adjacent to edge 2151, and a portion 215P of the upper surface 215a of electrode 215 extends inward from edge 2153 by a distance D3, wherein distance D1 is greater than distance D3. In some embodiments, electrode 215 has an edge 2154 adjacent to edge 2151, and a portion 215P of the upper surface 215a of electrode 215 extends inward from edge 2154 by a distance D4, wherein distance D1 is greater than distance D4. In some embodiments, distances D1, D2, D3, and D4 may all be different. In some embodiments, at least two of distances D1, D2, D3, and D4 are the same.

[0050] In some embodiments, electrode 225 has an edge 2251 and an edge 2252 opposite to edge 2251. A portion 225P of the upper surface 225a of electrode 225 extends inward from edge 2251 by a distance D5, and a portion 225P of the upper surface 225a of electrode 225 extends inward from edge 2252 by a distance D6, wherein distance D5 is greater than distance D6. In some embodiments, electrode 225 has an edge 2153 adjacent to edge 2251. A portion 225P of the upper surface 225a of electrode 225 extends inward from edge 2153 by a distance D7, wherein distance D5 is greater than distance D7. In some embodiments, electrode 225 has an edge 2154 adjacent to edge 2251. A portion 225P of the upper surface 225a of electrode 225 extends inward from edge 2154 by a distance D8, wherein distance D5 is greater than distance D8. In some embodiments, distances D5, D6, D7, and D8 may all be different. In some embodiments, at least two of distances D5, D6, D7, and D8 are the same.

[0051] In some embodiments, the insulating photosensitive material layer 300 is located between the sidewall 215S of electrode 215 and the sidewall 225S of electrode 225. In some embodiments, the insulating photosensitive material layer 300 partially covers the upper surface 215a of electrode 215. In some embodiments, the insulating photosensitive material layer 300 partially covers the upper surface 225a of electrode 225. In some embodiments, the insulating photosensitive material layer 300 covers organic light-emitting units 101 and 102, and the insulating photosensitive material layer 300 has a plurality of recesses 300C for exposing a plurality of effective light-emitting regions of the plurality of organic light-emitting units, such as the effective light-emitting regions of organic light-emitting unit 101 and organic light-emitting unit 102.

[0052] In some embodiments, the covering layers 200A and 200B are located below the insulating photosensitive material layer 300. In some embodiments, the covering layers 200A and 200B are embedded in the insulating photosensitive material layer 300. In some embodiments, the covering layer 200A is located between the area surrounding the upper surface 215a of the electrode 215 (partial 215P and sidewall 215S) and the insulating photosensitive material layer 300. In some embodiments, the covering layer 200B is located between the area surrounding the upper surface 225a of the electrode 225 (partial 225P and sidewall 225S) and the insulating photosensitive material layer 300.

[0053] In some embodiments, the center of electrode 215 is not aligned with the center of the recess 300C above electrode 215. In some embodiments, the center of electrode 215 is not aligned with the center of the perforation 200A1 of the covering layer 200A. In some embodiments, the center of electrode 225 is not aligned with the center of the recess 300C above electrode 225. In some embodiments, the center of electrode 225 is not aligned with the center of the perforation 200B1 of the covering layer 200B.

[0054] In some embodiments, the absorbance of the insulating photosensitive material layer 300 for a specific wavelength is greater than or equal to 50%. In some embodiments, the absorbance of the insulating photosensitive material layer 300 for a specific wavelength is greater than or equal to 60%. In some embodiments, the absorbance of the insulating photosensitive material layer 300 for a specific wavelength is greater than or equal to 70%. In some embodiments, the absorbance of the insulating photosensitive material layer 300 for a specific wavelength is greater than or equal to 80%. In some embodiments, the absorbance of the insulating photosensitive material layer 300 for a specific wavelength is greater than or equal to 90%. In some embodiments, the absorbance of the insulating photosensitive material layer 300 for a specific wavelength is greater than or equal to 95%. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm. In some embodiments, the absorption rate of the covering layers 200A and 200B for light of a specific wavelength is greater than the absorption rate of the insulating photosensitive material layer 300 for the light of the specific wavelength.

[0055] In some embodiments, the region R11 adjacent to the edge 2151 of the upper surface 215a of the insulating photosensitive material layer 300 contacting the electrode 215, and the region R12 adjacent to the edge 2152 of the upper surface 215a of the insulating photosensitive material layer 300 contacting the electrode 215, have a width W1 that is not equal to the width W2 of the region R12. In some embodiments, the area of ​​the region R11 is not equal to the area of ​​the region R12. In some embodiments, the region R13 adjacent to the edge 2153 of the upper surface 215a of the insulating photosensitive material layer 300 contacting the electrode 215, and the width W1 of the region R11 is not equal to the width W3 of the region R13. In some embodiments, the area of ​​the region R11 is not equal to the area of ​​the region R13. In some embodiments, the region R14 adjacent to the edge 2154 of the upper surface 215a of the insulating photosensitive material layer 300 contacting the electrode 215, and the width W1 of the region R11 is not equal to the width W4 of the region R14. In some embodiments, the area of ​​the region R11 is not equal to the area of ​​the region R14. In some embodiments, regions R11, R12, R13, and R14 of the upper surface 215a of electrode 215 surround the effective light-emitting region of the upper surface 215a of electrode 215. In some embodiments, a portion 215P of the upper surface 215a of electrode 215 surrounds regions R11, R12, R13, and R14. In some embodiments, a portion of the insulating photosensitive material layer 300 surrounds the effective light-emitting region of the upper surface 215a of electrode 215. In some embodiments, a portion of the insulating photosensitive material layer 300 contacts the annular region (i.e., regions R11, R12, R13, and R14) between the effective light-emitting region and the portion 215P of the upper surface 215a of electrode 215.

[0056] In some embodiments, the width W5 of region R21, adjacent to the edge 2251 of the upper surface 225a of the insulating photosensitive material layer 300 contacting electrode 225, and region R22, adjacent to the edge 2252 of the upper surface 225a of the insulating photosensitive material layer 300 contacting electrode 225, is not equal to the width W6 of region R22. In some embodiments, the area of ​​region R21 is not equal to the area of ​​region R22. In some embodiments, the width W5 of region R21, adjacent to the edge 2253 of the upper surface 225a of the insulating photosensitive material layer 300 contacting electrode 223, is not equal to the width W7 of region R23. In some embodiments, the area of ​​region R21 is not equal to the area of ​​region R23. In some embodiments, the width W5 of region R21, adjacent to the edge 2254 of the upper surface 225a of the insulating photosensitive material layer 300 contacting electrode 225, is not equal to the width W8 of region R24. In some embodiments, the area of ​​region R21 is not equal to the area of ​​region R24. In some embodiments, regions R21, R22, R23, and R24 of the upper surface 225a of electrode 225 surround the effective light-emitting region of the upper surface 225a of electrode 225. In some embodiments, a portion 225P of the upper surface 225a of electrode 225 surrounds regions R21, R22, R23, and R24. In some embodiments, a portion of the insulating photosensitive material layer 300 surrounds the effective light-emitting region of the upper surface 225a of electrode 225. In some embodiments, a portion of the insulating photosensitive material layer 300 contacts the annular region (i.e., regions R21, R22, R23, and R24) between the effective light-emitting region and the portion 225P of the upper surface 225a of electrode 225.

[0057] According to some embodiments disclosed herein, in the light-emitting component, multiple coating layers cover the sidewalls of multiple organic light-emitting units (e.g., the sidewalls of multiple electrodes) and are configured with an insulating photosensitive material layer. In this way, optical crosstalk between organic light-emitting units can be effectively reduced, halo problems of light-emitting patterns can be reduced, and the contrast of light-emitting patterns can be improved.

[0058] Furthermore, according to some embodiments disclosed herein, each coating layer covers the sidewalls and upper surface of the electrode (or anode) of each organic light-emitting unit, and an insulating photosensitive material layer is further disposed between the sidewalls of the electrodes of adjacent organic light-emitting units. This allows the coating layer to effectively absorb light reflected upwards or obliquely from the electrodes, thereby better reducing optical crosstalk between reflected light from adjacent electrodes and effectively improving the contrast of the light-emitting pattern. In addition to helping absorb light reflected upwards or obliquely from the electrodes, when the coating layer material includes a conductor, the insulating photosensitive material layer can also achieve electrical isolation between different organic light-emitting units, preventing short circuits caused by the conductive coating layer contacting the electrodes of adjacent organic light-emitting units.

[0059] Furthermore, according to some embodiments disclosed herein, each covering layer is embedded in an insulating photosensitive material layer, located below the insulating photosensitive material layer, and / or located between the surrounding area of ​​each electrode and the insulating photosensitive material layer. This can enhance the absorption effect of light reflected upwards or obliquely from the electrodes, thereby more effectively reducing optical crosstalk between organic light-emitting units, reducing halo problems in the light-emitting pattern, and improving the contrast of the light-emitting pattern.

[0060] Furthermore, according to some embodiments disclosed herein, multiple organic light-emitting units can emit light of the same wavelength. For example, multiple adjacent organic light-emitting units can emit light of the same wavelength, and the sidewalls of each organic light-emitting unit are covered by their respective corresponding coating layers. In this way, by designing the number of multiple organic light-emitting units, their positional arrangement, and the outline of each effective light-emitting area, a light-emitting pattern with fine pattern design and high contrast can be achieved.

[0061] Figure 3A This is a top view of a light-emitting element according to some embodiments. Figure 3B For example, along Figure 3A A cross-sectional view of line 3B-3B' in some embodiments. Figure 3B For example, along Figure 1 A cross-sectional view of line AA is shown, illustrating only the luminescent area. In some embodiments, Figure 3B For example, along Figure 3A The cross-sectional view of line 3B-3B' is shown, and only the luminescent area is illustrated. For simplicity, the overlay layer 40 is omitted here.

[0062] In some embodiments, such as Figure 3A and Figure 3BAs shown, a portion of the coating layer 200A directly contacts the portion of the organic layer 269. In some embodiments, the upper surface 215a of the electrode 215 does not have regions R11 and R14. In some embodiments, a portion of the insulating photosensitive material layer 300 contacts the upper surface 215a of the electrode 215 and is located between the effective light-emitting region and the portion 215P. In some embodiments, a portion of the insulating photosensitive material layer 300 contacts the L-shaped region (i.e., regions R11 and R14) between the effective light-emitting region and the portion 215P of the upper surface 215a of the electrode 215.

[0063] Figure 4A This is a top view of a light-emitting element according to some embodiments. Figure 4B For example, along Figure 4A A cross-sectional view of line 4B-4B' in some embodiments. Figure 4B For example, along Figure 1 A cross-sectional view of line AA is shown, illustrating only the luminescent area. In some embodiments, Figure 4B For example, along Figure 4A The cross-sectional view of line 4B-4B' is shown, and only the luminescent area is illustrated. For simplicity, the overlay layer 40 is omitted here.

[0064] In some embodiments, the overlay layer and the insulating photosensitive material layer are integrally formed and made of the same material. In some embodiments, such as Figure 4A and Figure 4B As shown, a cover layer (e.g., cover layer 200A) and an insulating photosensitive material layer (e.g., insulating photosensitive material layer 300) are integrally formed and made of the same material to form a bump 310A, and a cover layer (e.g., cover layer 200B) and an insulating photosensitive material layer (e.g., insulating photosensitive material layer 300) are integrally formed and made of the same material to form a bump 310B.

[0065] In some embodiments, bump 310A surrounds the sidewall of organic light-emitting unit 101. In some embodiments, bump 310A covers a portion 215P of the upper surface 215a of electrode 215 and the sidewall 215S of electrode 215. In some embodiments, bump 310A includes a through-hole 310A1 (or recess) to expose a portion of the upper surface 215a of electrode 215. In some embodiments, bump 310A is located between the sidewall of adjacent organic light-emitting unit 101 and the sidewall of organic light-emitting unit 102.

[0066] In some embodiments, the bump 310B surrounds the sidewall of the organic light-emitting unit 102. In some embodiments, the bump 310B covers a portion 225P of the upper surface 225a of the electrode 225 and the sidewall 225S of the electrode 225. In some embodiments, the bump 310B includes a through-hole 310B1 (or recess) to expose a portion of the upper surface 225a of the electrode 225. In some embodiments, the bump 310B is located between the sidewall of an adjacent organic light-emitting unit 101 and the sidewall of the organic light-emitting unit 102.

[0067] In some embodiments, bumps 310A and 310B include conductors, and bumps 310A and 310B are spaced apart from each other.

[0068] In some embodiments, the absorption rate of bumps 310A and 310B for a specific wavelength is greater than or equal to 80%. In some embodiments, the absorption rate of bumps 310A and 310B for a specific wavelength is greater than or equal to 90%. In some embodiments, the absorption rate of bumps 310A and 310B for a specific wavelength is greater than or equal to 95%. In some embodiments, the absorption rate of bumps 310A and 310B for a specific wavelength is greater than or equal to 99%. In some embodiments, the absorption rate of bumps 310A and 310B for a specific wavelength is greater than or equal to 99.5%. In some embodiments, the absorption rate of bumps 310A and 310B for a specific wavelength is greater than or equal to 99.9%. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

[0069] In some embodiments, the center of electrode 215 is not aligned with the center of the through hole 310A1 of bump 310A. In some embodiments, the center of electrode 225 is not aligned with the center of the through hole 310B1 of bump 310B.

[0070] Figure 4C This is a top view of a light-emitting element according to some embodiments. Figure 4D For example, along Figure 4C A cross-sectional view of line 4D-4D' in some embodiments. Figure 4D For example, along Figure 1 A cross-sectional view of line AA is shown, illustrating only the luminescent area. In some embodiments, Figure 4D For example, along Figure 4CThe diagram shows a cross-sectional view of line 4D-4D', illustrating only the luminescent region. For simplicity, the overlay layer 40 is omitted here.

[0071] In some embodiments, the cladding layer (e.g., cladding layers 200A, 200B) and the insulating photosensitive material layer (e.g., insulating photosensitive material layer 300) are integrally formed and made of the same non-conductive material to form an isolation structure 320, and the isolation structure 320 covers the non-light-emitting area of ​​the light-emitting element. In some embodiments, a plurality of bumps (e.g., bumps 310A and 310B) are connected to each other and made of the same non-conductive material to form the isolation structure 320. In some embodiments, the isolation structure 320 covers the non-light-emitting area above the substrate 100. In some embodiments, the isolation structure 320 completely covers the non-light-emitting area of ​​the light-emitting element and exposes only the effective light-emitting area of ​​the organic light-emitting unit.

[0072] Figure 5A This is a cross-sectional view of a light-emitting element according to some embodiments. In some embodiments, Figure 5A For example, along Figure 1 The diagram shows a cross-section of line AA, illustrating only the luminescent region. For simplicity, the overlay layer 40 is omitted here.

[0073] In some embodiments, the insulating photosensitive material layer 300 has a curved surface 212 protruding from the substrate 100, and a portion of the organic layer 269 is located above the curved surface 212.

[0074] In some embodiments, the covering layer 200A has a flat upper surface and inclined sidewalls. In some embodiments, the covering layer 200B has a flat upper surface and inclined sidewalls.

[0075] In some embodiments, electrode 215 has an edge 2151 and an edge 2152 opposite to the edge 2151, a portion 215P of the upper surface 215a of electrode 215 extends inward from the edge 2151 by a distance D1, and a portion 215P of the upper surface 215a of electrode 215 extends inward from the edge 2152 by a distance D2, and the distance D1 is greater than the distance D2.

[0076] In some embodiments, the insulating photosensitive material layer 300 contacts the region R11 adjacent to the edge 2151 of the upper surface 215a of the electrode 215, and the region R12 adjacent to the edge 2152 of the upper surface 215a of the electrode 215, and the width W1 of region R11 is smaller than the width W2 of region R12.

[0077] Figure 5B This is a cross-sectional view of a light-emitting element according to some embodiments. In some embodiments, Figure 5B For example, along Figure 1The diagram shows a cross-section of line AA, illustrating only the luminescent region. For simplicity, the overlay layer 40 is omitted here.

[0078] In some embodiments, the insulating photosensitive material layer 300 has a curved surface 212 protruding from the substrate 100, and a portion of the organic layer 269 is located above the curved surface 212.

[0079] In some embodiments, the electrode 215 has an edge 2151 and an edge 2152 opposite to the edge 2151, a portion 215P of the upper surface 215a of the electrode 215 extends inward from the edge 2151 by a distance D1, and a portion 215P of the upper surface 215a of the electrode 215 extends inward from the edge 2152 by a distance D2, and the distance D1 is less than the distance D2.

[0080] In some embodiments, the insulating photosensitive material layer 300 contacts the region R11 adjacent to the edge 2151 of the upper surface 215a of the electrode 215, and the region R12 adjacent to the edge 2152 of the upper surface 215a of the electrode 215, and the width W1 of region R11 is smaller than the width W2 of region R12.

[0081] Figure 6A This is a top view of a light-emitting element according to some embodiments. Figure 6B For example, along Figure 6A A cross-sectional view of lines 6B-6B' in the diagram. In some embodiments, Figure 6B For example, along Figure 1 A cross-sectional view of line AA is shown, illustrating only the luminescent area. In some embodiments, Figure 6B For example, along Figure 6A The cross-sectional view of line 6B-6B' is shown, and only the luminescent area is illustrated. For simplicity, the overlay layer 40 is omitted here.

[0082] In some embodiments, the light-emitting element further includes a transparent substrate 100, and organic light-emitting units 101 and 102 are disposed on the transparent substrate 100. Figure 6A and 6B The light-emitting element shown is a back-emitting light-emitting element. In some embodiments, the transparent substrate 100 may include a glass plate. In some embodiments, electrode 215 is a transparent electrode, and electrode 216 is a reflective electrode.

[0083] In some embodiments, electrode 215 has a cross-shaped profile when viewed from above. In some embodiments, the perforation 200A1 of the covering layer 200A has a cross-shaped profile when viewed from above. In some embodiments, the recess 300C of the insulating photosensitive material layer 300 has a cross-shaped profile when viewed from above.

[0084] In some embodiments, the center of electrode 215 is not aligned with the center of the recess 300C above electrode 215. In some embodiments, the center of electrode 215 is not aligned with the center of the perforation 200A1 of the covering layer 200A.

[0085] Figure 7A This is a top view of a light-emitting element according to some embodiments. Figure 7B For example, along Figure 7A A cross-sectional view of lines 7B-7B' in [the diagram]. In some embodiments, Figure 7B For example, along Figure 1 A cross-sectional view of line AA is shown, illustrating only the luminescent area. In some embodiments, Figure 7B For example, along Figure 7A The cross-sectional view of line 7B-7B' is shown, and only the luminescent area is illustrated. For simplicity, the overlay layer 40 is omitted here.

[0086] In some embodiments, such as Figure 7A and Figure 7B As shown, the light-emitting array includes a plurality of organic light-emitting units, such as at least organic light-emitting units 101, 102, 103, 104 and 105. In some embodiments, organic light-emitting units 101, 102, 103, 104 and 105 are located between bumps 310 and above (or below) the substrate 100.

[0087] In some embodiments, organic light-emitting unit 101 includes electrode 215, organic light-emitting unit 102 includes electrode 225, organic light-emitting unit 103 includes electrode 235, organic light-emitting unit 104 includes electrode 245, and organic light-emitting unit 105 includes electrode 255. In some embodiments, electrodes 215, 225, 235, 245, and 255 are anodes. In some embodiments, the second electrode 216 is the common electrode (or common cathode) of all organic light-emitting units in the light-emitting element.

[0088] In some embodiments, a coating layer 200A surrounds the sidewall of the organic light-emitting unit 101. In some embodiments, a coating layer 200B surrounds the sidewall of the organic light-emitting unit 102. In some embodiments, a coating layer 200C surrounds the sidewall of the organic light-emitting unit 103. In some embodiments, a coating layer 200D surrounds the sidewall of the organic light-emitting unit 104. In some embodiments, a coating layer 200E surrounds the sidewall of the organic light-emitting unit 105.

[0089] In some embodiments, at least two of electrodes 215, 225, 235, 245, and 255 have different external contours. In some embodiments, electrodes 215, 225, 235, 245, and 255 may form a specific light-emitting pattern.

[0090] In some embodiments, at least two of the organic light-emitting units 101, 102, 103, 104, and 105 emit light of the same wavelength. In some embodiments, the organic light-emitting units 101, 102, 103, 104, and 105 emit light of the same wavelength. In some embodiments, the organic light-emitting units 101, 102, 103, 104, and 105 are configured to emit light of the same color from the same group.

[0091] Figures 8A to 13B The illustration depicts a method for manufacturing a light-emitting component according to some embodiments.

[0092] like Figure 8A and 8B As shown, Figure 8A This is a top view. Figure 8B For example, along Figure 8A A cross-sectional view of line 8B-8B' in the diagram.

[0093] In some embodiments, a plurality of electrodes 215, 225, 235, 245, and 255 are formed on the substrate 100. In some embodiments, electrodes 215, 225, 235, 245, and 255 constitute an electrode array pattern. In some embodiments, the electrode array pattern may be designed with consideration of the arrangement of the light-emitting pattern.

[0094] like Figure 9A and 9B As shown, Figure 9A This is a top view. Figure 9B For example, along Figure 9A A cross-sectional view of line 9B-9B' in the middle.

[0095] In some embodiments, a coating material layer 200 is formed on electrodes 215, 225, 235, 245, and 255. In some embodiments, the coating material layer 200 is coated on electrodes 215, 225, 235, 245, and 255 and on substrate 100. In some embodiments, the coating material layer 200 may be formed by a spin coating process or a deposition process.

[0096] In some embodiments, the coating material layer 200 includes a conductor. In some embodiments, the coating material layer 200 includes a metal, resin, graphite, or any combination thereof. In some embodiments, the coating material layer 200 includes a photosensitive material. In some embodiments, the coating material layer 200 includes quantum dots. In some embodiments, the coating material layer 200 includes a carbon black material, such as carbon black nanoparticles, carbon black-containing conductive fibers, or the like. In some embodiments, the coating material layer 200 includes a blackbody material having an absorption rate of 90%, 95%, 99%, 99.5%, or 99.9% or higher for visible light.

[0097] like Figure 10A and 10B As shown, Figure 10A This is a top view. Figure 10B For example, along Figure 10A A cross-sectional view of line 10B-10B' in the middle.

[0098] In some embodiments, the cladding material layer 200 is patterned to form a plurality of cladding layers 200A, 200B, 200C, 200D, and 200E surrounding the sidewalls 215S, 225S, 235S, 245S, and 255S of electrodes 215, 225, 235, 245, and 255, and exposing the upper surfaces 215a, 225a, 235a, 245a, and 255a of electrodes 215, 225, 235, 245, and 255. In some embodiments, the cladding layers 200A, 200B, 200C, 200D, and 200E are discontinuous among electrodes 215, 225, 235, 245, and 255. In some embodiments, the cladding material layer 200 may be patterned using a photolithography process.

[0099] In some embodiments, after exposure, the coating material layer 200 is wetted in a solution for development. For example... Figure 10B As shown, a portion of the coating material layer 200 is removed to form coating layers 200A, 200B, 200C, 200D, and 200E. In some embodiments, after forming the coating layers 200A, 200B, 200C, 200D, and 200E, a cleaning operation can be performed to clean the exposed surfaces of the convex coating layers 200A, 200B, 200C, 200D, and 200E, and the electrodes 215, 225, 235, 245, and 255. In some embodiments, the cleaning operation can be performed at a temperature between 30°C and 80°C. In some embodiments, water or isopropyl alcohol (IPA) can be used as a cleaning agent, and ultrasonic waves can be used to perform the cleaning operation.

[0100] like Figure 11A and 11B As shown, Figure 11A This is a top view. Figure 11B For example, along Figure 11A A cross-sectional view of line 11B-11B' in the diagram.

[0101] In some embodiments, an insulating photosensitive material 300A is disposed on electrodes 215, 225, 235, 245, and 255 and covering layers 200A, 200B, 200C, 200D, and 200E. In some embodiments, the insulating photosensitive material 300A may be formed by a spin coating process or a deposition process.

[0102] In some embodiments, the insulating photosensitive material 300A comprises a photosensitive material. In some embodiments, the insulating photosensitive material 300A comprises a blackbody material having an absorption rate of more than 90% for visible light. In some embodiments, the absorption rates of the coating layers 200A, 200B, 200C, 200D, and 200E for light of a specific wavelength are greater than the absorption rate of the insulating photosensitive material 300A for the light of the specific wavelength. In some embodiments, the specific wavelength is not greater than 400 nm, not greater than 350 nm, not greater than 300 nm, not greater than 250 nm, not greater than 200 nm, or not greater than 150 nm.

[0103] like Figure 12A and 12B As shown, Figure 12A This is a top view. Figure 12B For example, along Figure 12A A cross-sectional view of line 12B-12B' in the diagram.

[0104] In some embodiments, the insulating photosensitive material 300A is patterned to form an insulating photosensitive material layer 300, which exposes multiple effective light-emitting regions on the upper surfaces 215a, 225a, 235a, 245a, and 255a of the electrodes 215, 225, 235, 245a, and 255a. In some embodiments, the insulating photosensitive material 300A can be patterned using a photolithography process.

[0105] In some embodiments, after exposure, the insulating photosensitive material 300A is wetted in a solution for development. For example... Figure 12B As shown, a portion of the insulating photosensitive material 300A is removed to form an insulating photosensitive material layer 300. In some embodiments, after forming the insulating photosensitive material layer 300, a cleaning operation can be performed to clean the exposed surfaces of the convex insulating photosensitive material layer 300 and electrodes 215, 225, 235, 245, and 255. In some embodiments, the cleaning operation can be performed at a temperature between 30°C and 80°C. In some embodiments, water or isopropyl alcohol (IPA) can be used as a cleaning agent, and ultrasonic waves can be used to perform the cleaning operation.

[0106] like Figure 13A and 13B As shown, Figure 13A This is a top view. Figure 13B For example, along Figure 13A A cross-sectional view of line 13B-13B' in the middle.

[0107] In some embodiments, an organic light-emitting material is disposed on the effective light-emitting areas of the upper surfaces 215a, 225a, 235a, 245a, and 255a of electrodes 215, 225, 235, 245a, and 255a. In some embodiments, an electrode 216 is disposed on the organic light-emitting material.

[0108] In some embodiments, a carrier injection layer 261, a first carrier transport layer 262, a second carrier transport layer 263, an organic emission layer 264, and an organic carrier transport layer 265 are sequentially disposed on the exposed upper surfaces 215a, 225a, 235a, 245a, and 255a of the insulating photosensitive material layer 300 and the electrodes 215, 225, 235, 245, and 255a. In some embodiments, each organic light-emitting unit has an individual second carrier transport layer 263 and an organic emission layer 264.

[0109] The foregoing outlines some features of the embodiments, thus enabling those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures to achieve the same purpose and / or the same advantages as the embodiments described in this application. Those skilled in the art should also understand that this equivalent architecture does not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this disclosure.

[0110] Symbol Explanation

[0111] 10 Light-emitting elements

[0112] 20 Light-emitting layers

[0113] 30 Spacers

[0114] 40 Covering layer

[0115] 100 substrates

[0116] 101 Organic Light Emitting Unit

[0117] 102 Organic Light Emitting Units

[0118] 103 Organic Light Emitting Units

[0119] 104 Organic Light Emitting Units

[0120] 105 Organic Light Emitting Units

[0121] 200 layers of coating material

[0122] 200A Coating

[0123] 200A1 Perforation

[0124] 200B coating

[0125] 200B1 Perforation

[0126] 200C coating layer

[0127] 200D coating

[0128] 200E coating

[0129] 215 electrode

[0130] 2151 Edge

[0131] 2152 Edge

[0132] 2153 Edge

[0133] 2154 Edge

[0134] 215a upper surface

[0135] Part 215

[0136] 215S sidewall

[0137] 216 electrode

[0138] 225 electrode

[0139] 2251 Edge

[0140] 2252 Edge

[0141] 2253 Edge

[0142] 2254 Edge

[0143] 225a upper surface

[0144] 225P Part

[0145] 225S sidewall

[0146] 235 electrode

[0147] 235a upper surface

[0148] 245 electrode

[0149] 245a upper surface

[0150] 255 electrode

[0151] 255a upper surface

[0152] 261 Carrier Injection Layer

[0153] 262 First Carrier Transport Layer

[0154] 263 Second Carrier Transport Layer

[0155] 264 Organic Emitting Layer

[0156] 265 Organic Carrier Transport Layer

[0157] 269 ​​Organic layer

[0158] 300 Insulating Photosensitive Material Layer

[0159] 300A Insulating Photosensitive Material

[0160] 300C Recess

[0161] 310 bump

[0162] 310A bump

[0163] 310A1 Perforation

[0164] 310B bump

[0165] 310B1 perforation

[0166] D1 Distance

[0167] D2 Distance

[0168] D3 Distance

[0169] D4 Distance

[0170] D5 Distance

[0171] D6 Distance

[0172] D7 Distance

[0173] D8 Distance

[0174] R11 area

[0175] R12 area

[0176] R13 area

[0177] R14 area

[0178] R21 area

[0179] R22 area

[0180] R23 area

[0181] R24 area

[0182] W1 width

[0183] W2 width

[0184] W3 width

[0185] W4 width

[0186] W5 width

[0187] W6 width

[0188] W7 width

[0189] W8 width

[0190] AA line

[0191] 2B-2B' line

[0192] 3B-3B' line

[0193] 4B-4B' line

[0194] 6B-6B' line

[0195] 7B-7B' line

[0196] 8B-8B' line

[0197] 9B-9B' line

[0198] 10B-10B' line

[0199] 11B-11B' line

[0200] 12B-12B' line

[0201] 13B-13B' line

Claims

1. A light emitting element comprising: a transparent substrate; a light emitting array over the transparent substrate and comprising a first organic light emitting unit and a second organic light emitting unit, wherein the first organic light emitting unit comprises a first electrode and the second organic light emitting unit comprises a second electrode; a plurality of cladding layers comprising: a first cladding layer cladding a portion of an upper surface of the first electrode and a sidewall of the first electrode; and a second cladding layer cladding a portion of an upper surface of the second electrode and a sidewall of the second electrode; and an insulating photoactive material layer between the sidewall of the first electrode and the sidewall of the second electrode, wherein the insulating photoactive material layer partially covers the upper surface of the first electrode, wherein the first electrode has a first edge and a second edge opposite or adjacent to the first edge, the portion of the upper surface extends inwardly from the first edge by a first distance, the portion of the upper surface extends inwardly from the second edge by a second distance, and the first distance is greater than the second distance.

2. A light emitting element comprising: a plurality of organic light emitting units comprising a first electrode and a second electrode; an insulating photoactive material layer covering the plurality of organic light emitting units, wherein the insulating photoactive material layer has a plurality of recesses to expose a plurality of active light emitting areas of the plurality of organic light emitting units; and a plurality of cladding layers, each of the cladding layers surrounding a sidewall of each of the organic light emitting units, and each of the cladding layers being between the sidewalls of two adjacent ones of the plurality of organic light emitting units, wherein the plurality of cladding layers comprises: a first cladding layer cladding a portion of an upper surface of the first electrode and a sidewall of the first electrode; and a second cladding layer cladding a portion of an upper surface of the second electrode and a sidewall of the second electrode, wherein the first electrode has a first edge and a second edge opposite or adjacent to the first edge, the portion of the upper surface extends inwardly from the first edge by a first distance, the portion of the upper surface extends inwardly from the second edge by a second distance, and the first distance is greater than the second distance.

3. The light emitting element of claim 1 or 2, wherein an absorption rate of the plurality of cladding layers for light is greater than an absorption rate of the insulating photoactive material layer for the light.

4. The light emitting element of claim 1 or 2, wherein the plurality of cladding layers and the insulating photoactive material layer are integrally formed and made of the same material.

5. The light emitting element of claim 1 or 2, wherein the plurality of cladding layers and the insulating photoactive material layer are integrally formed and made of the same non-conductive material to constitute an isolation structure covering a non-light emitting area of the light emitting element.

6. The light emitting element of claim 1 or 2, wherein the plurality of cladding layers comprise conductors and are separated from each other.

7. The light emitting element of claim 1 or 2, wherein the plurality of cladding layers comprise metal, resin, graphite, or any combination thereof. ​ ​ 8. The light emitting element according to claim 1 or 2, wherein the plurality of cladding layers comprise a photosensitive material.

9. The light emitting element according to claim 2, further comprising a transparent substrate, wherein the plurality of organic light emitting units are disposed on the transparent substrate.

10. The light emitting element according to claim 1, wherein the first cladding layer is between a peripheral region of the first electrode and the insulating photosensitive material layer, the second cladding layer is between a peripheral region of the second electrode and the insulating photosensitive material layer, and the first cladding layer and the second cladding layer have an absorption rate of light that is greater than an absorption rate of the insulating photosensitive material layer.

11. The light emitting element according to claim 1, wherein the insulating photosensitive material layer contacts a first region of the upper surface of the first electrode adjacent to the first edge and a second region of the upper surface of the first electrode adjacent to the second edge, a width of the first region is not equal to a width of the second region, and / or an area of the first region is not equal to an area of the second region.

12. The light emitting element according to claim 1, wherein the first electrode and the second electrode are anodes, and / or the first electrode and the second electrode comprise a transparent conductive material.

13. The light emitting element according to claim 1, wherein the first organic light emitting unit and the second organic light emitting unit emit light of the same wavelength.

14. A method of fabricating a light emitting element, comprising: providing a substrate; forming a plurality of electrodes on the substrate, the plurality of electrodes comprising a first electrode and a second electrode; forming a cladding material layer on the plurality of electrodes; patterning the cladding material layer to form a plurality of cladding layers around sidewalls of the plurality of electrodes and to expose a plurality of upper surfaces of the plurality of electrodes, the plurality of cladding layers being discontinuous from each other between the plurality of electrodes; disposing an insulating photosensitive material on the plurality of electrodes and the plurality of cladding layers; patterning the insulating photosensitive material to form an insulating photosensitive material layer that exposes a plurality of active light emitting regions of the plurality of upper surfaces of the plurality of electrodes; and disposing an organic light emitting material on the plurality of active light emitting regions of the plurality of electrodes, wherein the plurality of cladding layers comprise: a first cladding layer that clads a portion of an upper surface of the first electrode and a sidewall of the first electrode; and a second cladding layer that clads a portion of an upper surface of the second electrode and a sidewall of the second electrode, wherein the first electrode has a first edge and a second edge opposite or adjacent to the first edge, the portion of the upper surface extends inwardly from the first edge by a first distance, the portion of the upper surface extends inwardly from the second edge by a second distance, and the first distance is greater than the second distance.

15. The method of fabricating according to claim 14, wherein the organic light emitting material comprises an electron transport layer (ETL), an electron injection layer (EIL), an emission layer (EM), a hole blocking layer (HBL), a hole injection layer (HIL), a hole transport layer (HTL), or any combination thereof. ​ ​ 16. The manufacturing method of claim 14, wherein the cladding material layer is formed by a spin-coating process or a deposition process.

17. The manufacturing method of claim 14, wherein the cladding material layer is patterned by a photolithography process.

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