A hole position condition intelligent detection system on a PCB

Abstract

The application discloses a kind of intelligent detection systems of hole position condition on PCB, belong to PCB field, for solving the problem of error and low detection efficiency that hole position detection mode in current multilayer PCB is prone to, including limiting drilling module, preliminary processing detection module, processing sorting module, hole wall detection module and laminated pressing module, the limiting drilling module is used to process the hole position of multilayer PCB, the preliminary processing detection module is used to carry out quality detection to preliminary processing PCB, the processing sorting module is used to sort PCB according to preliminary processing detection result, the hole wall detection module is used to detect the inner wall condition of hole position on PCB, the processing sorting module is also used to sort PCB to be grouped according to hole wall detection result, the laminated pressing module is used to assemble the multilayer PCB of PCB to be grouped according to positioning hole, and the intelligent detection of hole position condition on PCB is realized.

Description

Technical Field

[0001] This invention belongs to the field of PCB boards, specifically an intelligent detection system for hole positions on PCB boards. Background Technology

[0002] A PCB, or Printed Circuit Board, is a crucial component of the electronics industry. Almost every electronic device, from small items like watches and calculators to large systems like computers, communication devices, and military weaponry, utilizes PCBs to ensure electrical interconnection between integrated circuits and other electronic components. A PCB consists of an insulating substrate, connecting wires, and solder pads for mounting and soldering electronic components, serving the dual function of conductive lines and an insulating base. It replaces complex wiring, enabling electrical connections between components in a circuit. This simplifies assembly and soldering, reduces the amount of wiring work required by traditional methods, significantly lessening the workload for workers; it also reduces overall size, lowers costs, and improves the quality and reliability of electronic devices. PCBs offer excellent product consistency, allowing for standardized designs that facilitate mechanization and automation in production. Furthermore, a fully assembled and tested PCB can serve as a spare part, facilitating interchangeability and maintenance of the entire product.

[0003] Current inspection of multilayer PCBs focuses on electrical and performance aspects, neglecting the inspection of hole positions. Furthermore, the current method of hole position inspection in multilayer PCBs mostly relies on measuring tools, which is prone to significant errors and has low efficiency. Therefore, how to achieve intelligent inspection of hole positions on PCBs is a major challenge we need to solve. To address this, we propose an intelligent inspection system for hole positions on PCBs. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide an intelligent detection system for hole positions on PCB boards.

[0005] The technical problem to be solved by this invention is:

[0006] How to achieve intelligent detection of hole positions on PCB boards.

[0007] The objective of this invention can be achieved through the following technical solutions:

[0008] A smart detection system for hole positions on a PCB board includes a user input terminal, a data acquisition module, a limit drilling module, a preliminary processing detection module, a processing sorting module, a hole wall detection module, a lamination module, and a server.

[0009] The user import terminal is used to import the preset drilling data of the multilayer PCB board, and send the preset drilling data of the multilayer PCB board to the limit drilling module and the preliminary processing inspection module via the server.

[0010] The limiting drilling module is used to process the holes of the multilayer PCB board and to package and transport several pre-processed PCB boards in batches to the pre-processing inspection module.

[0011] The data acquisition module is used to collect the actual drill hole diameter and the actual center distance between drill holes of the multilayer PCB board and send them to the initial processing inspection module and the hole wall inspection module via the server.

[0012] The initial processing inspection module is used to perform quality inspection on the initial processing PCB board and generate drilling omission signals, drilling error signals and drilling normal signals, which are sent to the processing and sorting module.

[0013] The processing and sorting module is used to sort PCB boards according to the initial processing inspection results;

[0014] The hole wall detection module is used to detect the inner wall condition of the holes on the PCB board, and the hole wall detection results of the PCB board to be assembled are sent to the processing and sorting module by the server.

[0015] The processing and sorting module is also used to sort the PCB boards to be assembled based on the hole wall detection results;

[0016] The lamination module is used to assemble the PCB board to be assembled according to the positioning holes on the PCB board to obtain a multi-layer PCB board.

[0017] Furthermore, the preset drilling data includes preset drilling areas, preset drilling types, preset drilling positions, preset drilling diameters, and preset washer widths for the multilayer PCB board.

[0018] Furthermore, the specific processing procedure for the limiting drilling module is as follows:

[0019] Step A1: Read the preset drilling data of the multilayer PCB board to obtain the preset drilling area, preset drilling type, preset drilling position and preset drilling diameter of the multilayer PCB board;

[0020] Step A2: Set the positioning holes for the multilayer PCB board according to the preset drilling area;

[0021] Step A3: Drill holes in each PCB board according to the preset drilling type, preset drilling position and preset drilling diameter to obtain the initial processed PCB board.

[0022] Furthermore, the preset drilling types include through holes, blind holes, and buried holes. Through holes penetrate the entire multilayer PCB board, blind holes are used for the connection between the outer and inner layers of the multilayer PCB board, and buried holes are used for the linkage between the inner layers of the multilayer PCB board.

[0023] Furthermore, the detection process of the initial processing detection module is as follows:

[0024] Read the preset drilling data of the multilayer PCB board to obtain the preset drilling area, preset drilling type, preset drilling position, preset drilling diameter and preset washer width of the multilayer PCB board;

[0025] Based on the mapping relationship between the multilayer PCB board and the pre-processed PCB board, the preset drilling area, preset drilling position, preset drilling diameter and preset washer width of the pre-processed PCB board are obtained.

[0026] The pre-drilling area of ​​the PCB board is inspected according to the pre-drilling area of ​​the PCB board. If there are no drill holes other than the positioning holes outside the pre-drilling area, the subsequent steps are performed. If there are any drill holes other than the positioning holes outside the pre-drilling area, a drilling error signal is generated.

[0027] The drill holes on the initial PCB board are checked one by one according to the preset drilling positions. If there are actual drill holes at all the preset drilling positions on the initial PCB board, and there are no actual drill holes at the non-preset drilling positions, then the next step is performed. If there are no actual drill holes at any preset drilling position on the initial PCB board, and there are no actual drill holes at any non-preset drilling position, then a drill hole omission signal is generated. If there are actual drill holes at any non-preset drilling position on the initial PCB board, then a drill hole error signal is generated.

[0028] The actual drill hole diameter on the pre-processed PCB board is detected according to the preset drill hole diameter; a qualified hole diameter range is set according to the preset drill hole diameter; the actual drill hole diameter on the pre-processed PCB board is compared with the corresponding qualified hole diameter range; if the value of the actual drill hole diameter belongs to the qualified hole diameter range, the subsequent steps are performed; if the value of the actual drill hole diameter does not belong to the qualified hole diameter range, a drilling error signal is generated.

[0029] Determine whether the actual distance between drilled holes is sufficient to install washers based on the preset washer width of the initial PCB board.

[0030] Calculate the preset drilling radius; sum the preset drilling radius with the corresponding preset washer width to obtain the estimated outer radius of the drilling hole; sum the estimated outer radii of each drilling hole pairwise to obtain the estimated center distance between the drilling holes; iterate and compare the actual center distance between each drilling hole with the corresponding estimated center distance.

[0031] If the actual center distance between all boreholes is greater than or equal to the corresponding estimated center distance, a normal borehole signal is generated; if the actual center distance between any borehole is less than the corresponding estimated center distance, a borehole error signal is generated.

[0032] Furthermore, the specific process of the processing and sorting module is as follows:

[0033] If a drilling omission signal is received, the pre-processed PCB board with that number is identified as a PCB board to be drilled, and the pre-processed PCB board is transferred to the limit drilling module for drilling. If a drilling error signal is received, the pre-processed PCB board with that number is identified as a defective PCB board, and the pre-processed PCB board is transferred to the waste storage area to await disposal. If a drilling normal signal is received, the pre-processed PCB board with that number is identified as a PCB board to be assembled, and after processing, it is transferred to the hole wall detection module.

[0034] Furthermore, the detection process of the hole wall detection module is as follows:

[0035] The hole wall detection module includes a light-emitting element and a light-receiving element; the light-emitting element illuminates the actual drilled holes on the PCB to be assembled in sequence from left to right and from top to bottom, and the light-receiving element receives the light beams from the light-emitting element through the drilled holes to obtain the light beam image of the drilled holes on the PCB to be assembled.

[0036] Extract the beam image contour of the hole to be drilled on the PCB board to obtain the actual hole contour; generate the preset hole contour based on the preset hole diameter of the multilayer PCB board.

[0037] Compare several actual borehole profiles with their corresponding preset borehole profiles one by one;

[0038] If the actual drilled hole contour and the corresponding preset drilled hole contour can be completely overlapped, the hole wall inspection result of the PCB board to be assembled is deemed qualified; if any actual drilled hole contour and the corresponding preset drilled hole contour do not completely overlap, the hole wall inspection result of the PCB board to be assembled is deemed unqualified.

[0039] Furthermore, the center point of the light beam emitted by the light-emitting element is on the same vertical line as the center of the actual drilled hole, the width of the light beam is greater than or equal to the maximum value of the actual drilled hole diameter, and the area of ​​the light receiving element is greater than the area of ​​the PCB board.

[0040] Furthermore, another sorting process of the processing and sorting module is as follows:

[0041] PCBs with qualified hole wall inspection results are transferred to the lamination module, while PCBs with unqualified hole wall inspection results are transferred to the waste storage area for disposal.

[0042] Compared with the prior art, the beneficial effects of the present invention are:

[0043] This invention first performs preliminary inspection on the pre-processed PCB board using a preliminary processing inspection module. The inspection items include whether the positioning hole settings are standardized, whether there are any drill holes outside the positioning holes around the drilling area, whether the drilling position and diameter inside the drilling area meet the specifications, and whether the drilling spacing is sufficient to install washers. Based on the inspection results, drilling omission signals, drilling error signals, and drilling normal signals are generated. Then, the PCB board that has passed the preliminary processing inspection is transferred and processed by the processing and sorting module to obtain the PCB board to be assembled. Next, the hole wall inspection module is used to inspect the inner wall condition of the holes on the PCB board to be assembled to obtain the hole wall inspection results of the PCB board to be assembled. Finally, the PCB board is sorted by the processing and sorting module according to the hole wall inspection results. This invention realizes intelligent inspection of the hole position condition on the PCB board. Attached Figure Description

[0044] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0045] Figure 1 This is an overall system block diagram of the present invention;

[0046] Figure 2 This is a schematic diagram illustrating the working principle of the limiting drilling module in this invention.

[0047] Figure 3 This is another working principle diagram of the limiting drilling module in this invention;

[0048] Figure 4 This is a schematic diagram of the operation of the hole wall detection module in this invention;

[0049] Figure 5 This is a schematic diagram of the hole wall detection module in this invention;

[0050] Figure 6 This is a flowchart of the method of the present invention. Detailed Implementation

[0051] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] Example 1: Please refer to Figures 1-5As shown, an intelligent detection system for hole positions on a PCB board can be used to detect hole positions on single-layer and multi-layer PCB boards in actual operation. In this embodiment, multi-layer PCB boards are preferred as the detection object. The system includes a user import terminal, a data acquisition module, a limit drilling module, a preliminary processing detection module, a processing sorting module, a hole wall detection module, a lamination module, and a server.

[0053] In this embodiment, the multilayer PCB board i is assembled from PCB board Ai, PCB board Bi, PCB board Ci, PCB board Di, etc., where i is the number of the multilayer PCB board, i=1, 2, ..., z, and z is a positive integer; for example, the four-layer PCB board 1 is assembled from PCB board A1, PCB board B1, PCB board C1 and PCB board D1. The number of layers of the multilayer PCB board is correlated with the letter number of the PCB board, and the PCB boards are arranged and assembled from top to bottom in alphabetical order.

[0054] The user import terminal is used to import preset drilling data of multilayer PCBs and send the preset drilling data of multilayer PCBs to the server. The server then sends the preset drilling data of multilayer PCBs to the limit drilling module and the preliminary processing inspection module. Specifically, the preset drilling data includes the preset drilling area, preset drilling type, preset drilling position, preset drilling diameter, and preset washer width of the multilayer PCB. In actual operation, users can import high-resolution scan files of multilayer PCB design drawings or CAD files of multilayer PCBs through the terminal to obtain the preset drilling data of multilayer PCBs.

[0055] Please see Figure 2 and Figure 3 As shown, the limiting drilling module is used to process the holes in a multilayer PCB board. The specific processing procedure is as follows:

[0056] Step A1: Read the preset drilling data of the multilayer PCB board to obtain the preset drilling area, preset drilling type, preset drilling position and preset drilling diameter of the multilayer PCB board;

[0057] Step A2: Please refer to Figure 2 As shown, positioning holes for a multilayer PCB are set according to a preset drilling area; in this embodiment, the diameter of the positioning hole is 3.2mm, the tangent distance between the apex of the preset drilling area and the positioning hole is 1mm, and the diagonal of the preset drilling area passes through the center of the positioning hole.

[0058] It should be specifically noted that the edge line of the preset drilling area of ​​the PCB board is determined by the positioning holes of the PCB board. In actual work, at least two positioning holes should be set on the PCB board and set diagonally. The positioning holes should be set without affecting the normal operation of the PCB board circuit.

[0059] Step A3: Please refer to Figure 3 As shown, holes are drilled into each PCB board according to the preset drilling type, preset drilling position and preset drilling diameter of the multilayer PCB board to obtain the initial PCB board.

[0060] Specifically, the preset drilling types include through holes, blind holes, and buried holes. Through holes penetrate the entire multilayer PCB board, blind holes are used to connect the outer and inner layers of the multilayer PCB board, and buried holes are used to connect the inner layers of the multilayer PCB board. The preset drilling position is the relative coordinate position of each preset drilling hole in the preset drilling area, and the diameter of the drill bit used for drilling is equal to the preset drilling hole diameter.

[0061] The limiting drilling module packages and transports several pre-processed PCBs in batches according to the multi-layer PCB board number to the pre-processing inspection module.

[0062] The data acquisition module is used to acquire the actual drill hole diameter and the actual center distance between drill holes of the multilayer PCB board, and the server sends the actual drill hole diameter and the actual center distance between drill holes of the multilayer PCB board to the initial processing inspection module and the hole wall inspection module.

[0063] The initial processing inspection module is used to inspect the quality of the initial processed PCB board. The inspection process is as follows:

[0064] Read the preset drilling data of the multilayer PCB board to obtain the preset drilling area, preset drilling type, preset drilling position, preset drilling diameter and preset washer width of the multilayer PCB board;

[0065] Based on the mapping relationship between the multilayer PCB board and the pre-processed PCB board, the preset drilling area, preset drilling position, preset drilling diameter and preset washer width of the pre-processed PCB board are obtained.

[0066] For example, the preset drilling area of ​​the multilayer PCB board 1 has 3 holes: hole 1 is a through hole, hole 2 is a blind hole, and hole 3 is a buried hole.

[0067] Hole 1 of multilayer PCB 1 corresponds to hole 1 on PCB A1, PCB B1, PCB C1 and PCB D1; Hole 2 of multilayer PCB 1 corresponds to hole 2 on PCB A1 and PCB D1; Hole 3 of multilayer PCB 1 corresponds to hole 2 on PCB B1 and PCB C1.

[0068] Step B1: Inspect the periphery of the pre-drilled area of ​​the PCB board according to the pre-drilled area of ​​the initial PCB board.

[0069] If there are no holes other than the positioning hole outside the pre-defined drilling area, proceed to the next step;

[0070] If any borehole other than the positioning hole exists outside the preset drilling area, a drilling error signal will be generated.

[0071] Step B2: Inspect each hole on the initial PCB board according to the preset drilling positions.

[0072] If all the preset drilling positions on the initial PCB board have actual drill holes, and there are no actual drill holes at the non-preset drilling positions, then proceed to the next step.

[0073] If no actual drill hole is found at any of the preset drill hole positions on the initial PCB board, and no actual drill hole is found at any of the non-preset drill hole positions, a drill hole omission signal is generated.

[0074] If an actual drill hole exists at any non-preset drill location on the initial PCB board, a drill error signal is generated.

[0075] Step B3: Detect the actual drill hole diameter on the pre-processed PCB board according to the preset drill hole diameter;

[0076] Set the acceptable borehole diameter range according to the preset borehole diameter; for example, if the preset borehole diameter is 0.1mm, then set the acceptable borehole diameter range to [0.1mm-0.05mm, 0.1mm+0.05mm].

[0077] The actual drilled hole diameters of the initial PCB board are compared with the corresponding qualified hole diameter ranges.

[0078] If the actual borehole diameter falls within the acceptable range, proceed to the next step.

[0079] If the actual borehole diameter does not fall within the acceptable borehole diameter range, a borehole error signal is generated.

[0080] Step B4: Determine whether the distance between drilled holes is sufficient to install washers based on the preset washer width of the initial PCB board.

[0081] For example, preset drill hole number one corresponds to actual drill hole number one, and preset drill hole number two corresponds to actual drill hole number two; divide the preset drill hole diameter by two to obtain the preset drill hole radius; add the preset drill hole radius one value to the corresponding preset washer width value to obtain the estimated outer radius of preset drill hole number one; similarly, add the preset drill hole radius two value to the corresponding preset washer width value to obtain the estimated outer radius of preset drill hole number two; calculate the estimated center distance between preset drill hole number one and preset drill hole number two according to the formula. The specific formula is... The following steps apply: Estimated center distance = Estimated outer radius of pre-drilled hole No. 1 + Estimated outer radius of pre-drilled hole No. 2; Compare the estimated center distance between pre-drilled hole No. 1 and pre-drilled hole No. 2 with the actual center distance between actual hole No. 1 and actual hole No. 2; If the estimated center distance is less than or equal to the actual center distance, the distance between actual hole No. 1 and actual hole No. 2 is sufficient to install a washer; If the estimated center distance is greater than the actual center distance, the distance between actual hole No. 1 and actual hole No. 2 is insufficient to install a washer.

[0082] Iterate through and compare the actual center distances between each borehole with the corresponding estimated center distances;

[0083] If the actual center distance between each borehole is greater than or equal to the corresponding estimated center distance, a normal borehole signal is generated.

[0084] If the actual center distance between any two boreholes is less than the corresponding estimated center distance, a borehole error signal is generated.

[0085] The initial processing detection module sends drilling omission signals, drilling error signals, and drilling normal signals to the processing and sorting module.

[0086] The processing and sorting module is used to sort PCB boards according to the initial processing inspection results. The sorting process is as follows:

[0087] If a drilling omission signal is received, the pre-processed PCB board with that number is identified as a PCB board to be drilled, and the pre-processed PCB board is transferred to the limit drilling module for drilling and supplementary drilling.

[0088] If a drilling error signal is received, the pre-processed PCB board with that number will be identified as a defective PCB board and transferred to the waste storage area to await disposal.

[0089] If a normal drilling signal is received, the PCB board with that number is identified as the PCB board to be assembled.

[0090] In actual work, before assembling the PCB board to be assembled into a multilayer PCB board, it is necessary to etch the circuits on the PCB board to be assembled, and to ensure that the PCB board to be assembled can be put into normal use through processes such as copper plating and soldering.

[0091] Please see Figure 4 and Figure 5 As shown, the hole wall detection module is used to detect the inner wall condition of holes on a PCB board. In this embodiment, the PCB board to be assembled after etching, copper plating, and soldering processes is preferably selected as the detection object. The detection process is as follows:

[0092] The light-emitting element illuminates the actual drilled holes on the PCB board to be assembled in sequence from left to right and from top to bottom. During illumination, the center point of the beam emitted by the light-emitting element is on the same vertical line as the center of the actual drilled hole, and the beam width is greater than or equal to the maximum value of the actual drilled hole diameter. The beam of light emitted by the light-emitting element passing through the drilled hole is received by the light receiving element to obtain the beam image of the drilled hole on the PCB board to be assembled. In this embodiment, a spotlight is used as the light-emitting element, and a light-colored projection board is used as the light receiving element. To avoid incomplete beam image display, it is necessary to ensure that the beam completely covers the actual drilled hole and that the area of ​​the light receiving element is much larger than the area of ​​the PCB board. The beam image presented by the light-colored projection board is clearer than that presented by the dark-colored projection board.

[0093] The actual drilling contour is obtained by extracting the beam image contour of the drilled hole on the PCB board to be assembled using OpenCV technology.

[0094] Read the preset drilling data of the multilayer PCB board to obtain the preset drilling diameter of the multilayer PCB board, and generate the preset drilling profile based on the preset drilling diameter of the multilayer PCB board.

[0095] Compare several actual borehole profiles with their corresponding preset borehole profiles one by one;

[0096] If the actual drilled hole contour and the corresponding preset drilled hole contour can be completely overlapped, the hole wall inspection result of the PCB board to be assembled is deemed to be qualified; if any actual drilled hole contour and the corresponding preset drilled hole contour are not completely overlapped, the hole wall inspection result of the PCB board to be assembled is deemed to be unqualified.

[0097] Understandably, if the actual drilling profile and the corresponding preset drilling profile can be completely overlapped, the hole wall of the hole on the PCB to be assembled is considered to be smooth and flat. Similarly, if the actual drilling profile and the corresponding preset drilling profile cannot be completely overlapped, the hole wall of the hole on the PCB to be assembled may have burrs, defects and solder overflow.

[0098] The hole wall detection module sends the hole wall detection results of the PCB board to be assembled to the server, and the server sends the hole wall detection results of the PCB board to be assembled to the processing and sorting module.

[0099] The processing and sorting module is also used to sort the PCB boards to be assembled according to the hole wall detection results; specifically, the PCB boards to be assembled with qualified hole wall detection results are transferred to the lamination and pressing module, and the PCB boards to be assembled with unqualified hole wall detection results are transferred to the waste storage area to await disposal.

[0100] The lamination module is used to assemble multi-layer PCBs. Specifically, the PCBs to be assembled are laminated according to the positioning holes on the PCBs to obtain multi-layer PCBs.

[0101] In this application, if a corresponding calculation formula appears, the above calculation formula is a dimensionless calculation. The weighting coefficient, proportional coefficient and other coefficients in the formula are set to quantify each parameter to obtain a result value. The size of the weighting coefficient and proportional coefficient is only required to not affect the proportional relationship between the parameter and the result value.

[0102] Example 2: Please refer to Figure 6 As shown, based on another concept of the present invention, a method for intelligent detection of hole positions on a PCB board is proposed, the method comprising:

[0103] Step S100: The user imports the preset drilling data of the multilayer PCB board into the terminal and sends the preset drilling data of the multilayer PCB board to the limit drilling module and the preliminary processing inspection module via the server.

[0104] Step S200: The limiting drilling module processes the holes of the multilayer PCB board according to the preset drilling data of the multilayer PCB board to obtain the preliminary PCB board, and then transfers the preliminary PCB board to the preliminary processing inspection module.

[0105] Step S300: The data acquisition module acquires the actual drill hole diameter and the actual center distance between drill holes of the multilayer PCB board. The actual drill hole diameter and the actual center distance between drill holes are sent to the initial processing inspection module and the hole wall inspection module via the server.

[0106] Step S400: The initial processing inspection module performs quality inspection on the initial processing PCB board and generates drilling omission signal, drilling error signal and drilling normal signal, which are sent to the processing and sorting module. The processing and sorting module sorts the PCB board according to the initial processing inspection results.

[0107] Step S500: The hole wall detection module detects the inner wall condition of the holes on the PCB board and sends the hole wall detection results of the PCB board to be assembled to the processing and sorting module via the server.

[0108] Step S600: The processing and sorting module sorts the PCB boards to be assembled according to the hole wall detection results, and the stacking and laminating module stacks and laminates the PCB boards to be assembled according to the positioning holes on the PCB boards to obtain multi-layer PCB boards.

[0109] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A PCB hole site condition intelligent detection system, characterized in that, The application relates to a multi-layer PCB drilling and processing system. The system comprises a user import terminal, a limiting drilling module, a data acquisition module, a primary processing detection module, a processing sorting module and a laminated pressing module. The user import terminal is used for importing preset drilling data of a multi-layer PCB and sending the preset drilling data of the multi-layer PCB to the limiting drilling module and the primary processing detection module through a server; the preset drilling data comprises preset drilling areas, preset drilling types, preset drilling positions, preset drilling diameters and preset gasket widths of the multi-layer PCB. The limiting drilling module is used for processing hole positions of the multi-layer PCB and batch-packaging and transferring a plurality of primary processing PCBs to the primary processing detection module. The data acquisition module is used for acquiring actual drilling diameters and actual center distances between the drillings of the multi-layer PCB and sending the actual drilling diameters and the actual center distances between the drillings to the primary processing detection module and a hole wall detection module through the server. The primary processing detection module is used for performing quality detection on the primary processing PCBs, generating drilling omission signals, drilling error signals and drilling normal signals and sending the drilling omission signals, the drilling error signals and the drilling normal signals to the processing sorting module. The detection process of the primary processing detection module is as follows: When the following conditions are met, that is, the periphery of the preset drilling area does not exist drilling holes except the positioning hole, the preset drilling positions of the primary processing PCBs all exist actual drillings, the non-preset drilling positions do not exist actual drillings, and the numerical value of the actual drilling diameter belongs to a qualified diameter interval, the distance between the actual drillings is determined according to the preset gasket width of the primary processing PCB whether the distance between the actual drillings can be equipped with a gasket. The preset drilling radius of the drilling is calculated; the preset drilling radius and the corresponding preset gasket width are added to obtain the estimated drilling periphery radius of the drilling. The estimated center distances between the drillings are obtained by adding the estimated drilling periphery radius of each drilling to each other; the actual center distances between the drillings and the corresponding estimated center distances are compared. If the numerical value of the actual center distance between each drilling is greater than or equal to the numerical value of the corresponding estimated center distance, the drilling normal signal is generated; if the numerical value of the actual center distance between any drilling is less than the numerical value of the corresponding estimated center distance, the drilling error signal is generated. The hole wall detection module is used for detecting the inner wall conditions of the hole positions on the PCBs, obtaining hole wall detection results of the to-be-assembled PCBs and sending the hole wall detection results to the processing sorting module through the server. The processing sorting module is used for sorting the PCBs according to the primary processing detection results and the hole wall detection results.

2. The intelligent detection system for hole condition on PCB according to claim 1, characterized in that, The laminated pressing module is used for assembling the to-be-assembled PCBs according to the positioning holes on the PCBs to obtain the multi-layer PCB. The processing process of the limiting drilling module is as follows: Step A1: reading the preset drilling data of the multi-layer PCB to obtain the preset drilling areas, the preset drilling types, the preset drilling positions and the preset drilling diameters of the multi-layer PCB; Step A2: setting the positioning holes of the multi-layer PCB according to the preset drilling areas; 3.The intelligent detection system for hole condition on a PCB according to claim 2, characterized in that, Step A3: drilling each PCB according to the preset drilling types, the preset drilling positions and the preset drilling diameters of the multi-layer PCB to obtain the primary processing PCBs.

4. The intelligent detection system for hole condition on PCB according to claim 2, characterized in that, The preset drilling types comprise through holes, blind holes and buried holes; the through holes penetrate through the whole multi-layer PCB; the blind holes are used for connecting the outer layer and the inner layer of the multi-layer PCB; and the buried holes are used for connecting the inner layers of the multi-layer PCB. The detection process of the primary processing detection module is as follows: Read the preset drilling data of the multi-layer PCB board to obtain the preset drilling area, the preset drilling type, the preset drilling position, the preset drilling diameter and the preset gasket width of the multi-layer PCB board; According to the mapping relationship between the multi-layer PCB board and the primary processing PCB board, the preset drilling area, the preset drilling position, the preset drilling diameter and the preset gasket width of the primary processing PCB board are obtained; According to the preset drilling area of the primary processing PCB board, the periphery of the preset drilling area of the PCB board is detected; If there is any drilling other than the positioning hole in the periphery of the preset drilling area, a drilling error signal is generated; If there is no drilling other than the positioning hole in the periphery of the preset drilling area, the drilling on the primary processing PCB board is detected one by one according to the preset drilling position of the primary processing PCB board; If there is no actual drilling in any preset drilling position of the primary processing PCB board, and there is no actual drilling in the non-preset drilling position, a drilling omission signal is generated; If there is actual drilling in any non-preset drilling position of the primary processing PCB board, a drilling error signal is generated; If there is actual drilling in the preset drilling position of the primary processing PCB board, and there is no actual drilling in the non-preset drilling position, the actual drilling diameter of the primary processing PCB board is detected according to the preset drilling diameter of the primary processing PCB board; According to the preset drilling diameter, the qualified diameter interval is set, and the actual drilling diameter of the primary processing PCB board is compared with the corresponding qualified diameter interval; If the value of the actual drilling diameter is not in the qualified diameter interval, a drilling error signal is generated; If the value of the actual drilling diameter is in the qualified diameter interval, it is determined whether the distance between the actual drillings can be equipped with a gasket according to the preset gasket width of the primary processing PCB board; The preset drilling radius of the drilling is calculated; The preset drilling radius and the corresponding preset gasket width are added to obtain the estimated drilling periphery radius of the drilling; The estimated center distance between the drillings is obtained by adding the estimated drilling periphery radius of each drilling; The actual center distance between the drillings and the corresponding estimated center distance are compared; If the value of the actual center distance between the drillings is greater than or equal to the value of the corresponding estimated center distance, a drilling normal signal is generated; 5. The intelligent detection system for hole condition on PCB according to claim 4, characterized in that, If the value of the actual center distance between any drilling is less than the value of the corresponding estimated center distance, a drilling error signal is generated. The process of the processing sorting module is as follows:

6. The intelligent PCB hole condition detection system of claim 5, wherein, If the drilling omission signal is received, the numbered primary processing PCB board is determined as a drilling PCB board, and the primary processing PCB board is transferred to the limiting drilling module for drilling and drilling; if the drilling error signal is received, the numbered primary processing PCB board is determined as a defective PCB board, and the primary processing PCB board is transferred to the waste temporary storage area for waste disposal; if the drilling normal signal is received, the numbered primary processing PCB board is determined as a to-be-assembled PCB board which is transferred to the hole wall detection module after process processing. The detection process of the hole wall detection module is as follows: The light emitting element irradiates the actual drillings on the to-be-assembled PCB board in order from left to right and from top to bottom, and the light receiving element receives the light beam of the light emitting element through the drillings to obtain the light beam image of the drillings on the to-be-assembled PCB board; extracting a light beam image profile of a drill hole on the PCB board to obtain an actual drill hole profile; generating a preset drill hole profile according to a preset drill hole diameter of the multilayer PCB board; comparing the actual drill hole profile with the corresponding preset drill hole profile one by one; if the actual drill hole profile and the corresponding preset drill hole profile can completely coincide, determining that the hole wall detection result of the PCB board is qualified; if any actual drill hole profile and the corresponding preset drill hole profile do not completely coincide, determining that the hole wall detection result of the PCB board is unqualified.

7. The intelligent PCB hole condition detection system of claim 6, wherein, the center point of the light beam irradiated by the light emitting element and the center of the actual drill hole are on the same vertical line; the numerical value of the light beam width is greater than or equal to the maximum value of the actual drill hole diameter; the area of the light receiving element is greater than the area of the PCB board. 8.The intelligent PCB hole condition detection system of claim 7, wherein, The sorting process of the processing and sorting module further includes: transporting the PCB board with a qualified hole wall detection result to a lamination module; transporting the PCB board with an unqualified hole wall detection result to a waste temporary storage area for waste disposal.

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