A temperature control method, device, equipment and medium of SCR

Abstract

The application discloses a kind of SCR temperature control method, device, equipment and medium.The SCR temperature control method includes: determining the steady-state temperature function of target post-processing element, and setting SCR first mode threshold and SCR second mode threshold;According to the steady-state temperature function, SCR first mode threshold, SCR second mode threshold and exhaust air speed data, determine carrier temperature threshold;According to the associated temperature of target post-processing element, carrier temperature threshold and deviation adjustment weight, determine temperature adjustment equivalent deviation;According to temperature adjustment equivalent deviation, control the temperature of SCR.The technical scheme of the embodiment of the application can effectively regulate and control the temperature of SCR without the help of complex estimator, and avoid a large amount of temperature overshoot.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of automobile engine technology, and particularly relates to a temperature control method, device, equipment and medium of SCR. BACKGROUND

[0002] SCR reactor is a honeycomb carrier coated with oil catalytic reaction agent, nitrogen oxides in automobile exhaust and urea after jet vaporization are reacted in the SCR to generate harmless nitrogen and water. The condition for SCR to realize catalysis is temperature, so maintaining a certain exhaust temperature is crucial for emission reduction, but this means more energy for heating and less energy for work, which will increase fuel consumption.

[0003] The difficulty of SCR temperature stable control lies in waiting for high-temperature exhaust gas to flow to the SCR position for heating, which is a relatively long distance, and there are elements with large heat capacity in the middle. The heating process has a great system delay, in order to guarantee the SCR temperature and emission, only this delay can be tolerated, which brings huge overshoot and fuel consumption loss, and a large margin is left for this, resulting in serious temperature control overshoot.

[0004] Invention patent name: a control method and device of SCR temperature, CN104131872A, discloses a control method, comprising: according to the experimental test temperature before SCR and the two-point method of delay first-order inertia link fitting, constructing SCR dynamic temperature model; according to the characteristics of SCR dynamic temperature model, the Smith predictor calculates the compensation value; the compensation value can eliminate the lag link in the SCR dynamic temperature model; calculate the difference between the preset temperature of SCR and the sum of the output of SCR dynamic temperature model and the compensation value; receiving the feedback signal containing the difference, calculating the post-injection amount of the engine according to the difference, and sending the signal with the post-injection amount of the engine to the engine, controlling the engine to post-inject according to the post-injection amount, to control the temperature of SCR. However, the Smith predictor model requires high enough accuracy, in order to better control the temperature of SCR, but the model accuracy is difficult to be accurate. SUMMARY

[0005] The present application provides a temperature control method, device, equipment and medium of SCR, to solve the problem of difficult SCR temperature overshoot control.

[0006] According to one aspect of the present application, a temperature control method of SCR is provided, comprising:

[0007] determining the steady-state temperature function of the target aftertreatment element, and setting the SCR first mode threshold and the SCR second mode threshold;

[0008] determine a carrier temperature threshold according to the steady state temperature function, the SCR first mode threshold, the SCR second mode threshold, and exhaust gas air speed data;

[0009] determine a temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold, and a deviation adjustment weight;

[0010] control the temperature of the SCR according to the temperature adjustment equivalent deviation.

[0011] According to another aspect of the present application, there is provided a temperature control device for an SCR, comprising:

[0012] a data configuration module configured to determine a steady state temperature function of a target aftertreatment element, and set a SCR first mode threshold and a SCR second mode threshold;

[0013] a carrier temperature threshold determination module configured to determine a carrier temperature threshold according to the steady state temperature function, the SCR first mode threshold, the SCR second mode threshold, and exhaust gas air speed data;

[0014] a temperature adjustment equivalent deviation determination module configured to determine a temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold, and a deviation adjustment weight;

[0015] a SCR first temperature control module configured to control the temperature of the SCR according to the temperature adjustment equivalent deviation.

[0016] According to another aspect of the present application, there is provided an electronic device, comprising:

[0017] at least one processor; and

[0018] a memory communicatively connected to the at least one processor; wherein

[0019] the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to perform the temperature control method for an SCR according to any one of the embodiments of the present application.

[0020] According to another aspect of the present application, there is provided a computer readable storage medium storing computer instructions for causing a processor to perform the temperature control method for an SCR according to any one of the embodiments of the present application when executed by the processor.

[0021] The technical scheme of the embodiment of the application determines the steady-state temperature function of the target aftertreatment element, sets the SCR first mode threshold and the SCR second mode threshold, determines the carrier temperature threshold according to the steady-state temperature function, the SCR first mode threshold, the SCR second mode threshold and the exhaust air speed data, determines the temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight, and further controls the temperature of the SCR according to the temperature adjustment equivalent deviation. In the scheme, the steady-state temperature function of the target aftertreatment element can reflect the potential correlation between the temperature of some large heat capacity elements through which the exhaust gas flows and the temperature of the SCR. The carrier temperature threshold determined in combination with the steady-state temperature function can determine the temperature threshold at which some large heat capacity elements through which the exhaust gas flows have an impact on the over-regulation of the temperature of the SCR. According to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight, the temperature adjustment equivalent deviation can be determined without the aid of a Smith predictor, so as to excavate the deviation from the exhaust gas reaction temperature through the temperature adjustment equivalent deviation, realize accurate control of the temperature of the SCR, improve the reaction efficiency of the exhaust gas, solve the problem of difficulty in realizing over-regulation control of the temperature of the SCR, and effectively control the temperature of the SCR without the aid of a complex predictor, thereby avoiding a large amount of over-regulation of the temperature.

[0022] It should be understood that the content described in this part is not intended to identify key or important features of the embodiments of the application, nor is it used to limit the scope of the application. Other features of the application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 A flow chart of a temperature control method of an SCR provided for the first embodiment of the application;

[0025] Figure 2 A flow chart of a temperature control method of an SCR provided for the second embodiment of the application;

[0026] Figure 3 A position schematic diagram of a temperature acquisition point provided for the second embodiment of the application;

[0027] Figure 4 A structural schematic diagram of a temperature control device of an SCR provided for the third embodiment of the application;

[0028] Figure 5 A structural schematic of an electronic device that can be used to implement embodiments of the present application is shown. DETAILED DESCRIPTION

[0029] In order to make the person skilled in the art better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work should belong to the scope of protection of the present application.

[0030] It should be noted that the terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to include only those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] Embodiment One

[0032] Figure 1 A flowchart of a temperature control method of an SCR provided for the first embodiment of the present application, the present embodiment can be applicable to effectively control the temperature overshoot of the SCR, the method can be executed by a temperature control device of the SCR, the temperature control device of the SCR can be realized in the form of hardware and / or software, and the temperature control device of the SCR can be configured in an electronic device. As shown in the figure, the method comprises: Figure 1

[0033] Step 110, determining a steady-state temperature function of a target post-processing element, and setting an SCR first mode threshold and an SCR second mode threshold.

[0034] ​The target after-treatment element can be an element associated with after-treatment of exhaust gas of a vehicle. The target after-treatment element can include a DOC (diesel oxidation catalyst), a DPF (diesel particulate filter), and an SCR (selective catalytic reduction). The steady-state temperature function can be a function of predicting temperature of exhaust gas flowing through the corresponding element according to space velocity of the exhaust gas flowing through the element and SCR catalyst temperature. The SCR first mode threshold and the SCR second mode threshold are both preset temperature thresholds of the SCR, and the SCR first mode threshold is greater than the SCR second mode threshold. The SCR first mode threshold corresponds to a high temperature threshold of the SCR, and the SCR second mode threshold corresponds to a low temperature threshold of the SCR.

[0035] In the embodiments of the present application, the steady-state temperature function of the target after-treatment element can be determined according to vehicle working condition data before factory shipment or working condition data during actual operation of the vehicle, and the SCR first mode threshold and the SCR second mode threshold can be set according to requirements of SCR catalysis.

[0036] In step 120, the catalyst temperature threshold is determined according to the steady-state temperature function, the SCR first mode threshold, the SCR second mode threshold, and the exhaust gas space velocity data.

[0037] The exhaust gas space velocity data can be data describing space velocity of exhaust gas flowing through the element. The space velocity is a multiple of volume flow rate per unit time passing through the catalyst with respect to volume of the catalyst. The catalyst temperature threshold can be a temperature threshold referenced when temperature control is performed on the SCR.

[0038] In the embodiments of the present application, the catalyst temperature threshold corresponding to the SCR first mode threshold can be determined according to the steady-state temperature function, the SCR first mode threshold, and the exhaust gas space velocity data, and the catalyst temperature threshold corresponding to the SCR second mode threshold can be determined according to the steady-state temperature function, the SCR second mode threshold, and the exhaust gas space velocity data.

[0039] Optionally, the catalyst temperature threshold corresponding to the SCR first mode threshold includes the SCR first mode threshold, a DOC temperature threshold when the temperature of the SCR is the SCR first mode threshold, and a DPF temperature threshold. The catalyst temperature threshold corresponding to the SCR second mode threshold includes the SCR second mode threshold, a DOC temperature threshold when the temperature of the SCR is the SCR second mode threshold, and a DPF temperature threshold.

[0040] In step 130, the temperature adjustment equivalent deviation is determined according to the associated temperature of the target after-treatment element, the catalyst temperature threshold, and the deviation adjustment weight.

[0041] The associated temperature of the target post-processing element can be a measured temperature of a temperature sensor of the target post-processing element. The deviation adjustment weight can be a weight value set for the element corresponding to the carrier temperature threshold. The temperature adjustment equivalent deviation can be used to describe the comprehensive deviation of the associated temperature of the target post-processing element and the carrier temperature threshold.

[0042] In the embodiment of the present application, the associated temperature of the target post-processing element can be obtained, and the corresponding deviation adjustment weight of each element of the target post-processing element can be set based on the temperature overshoot of the SCR under different working conditions, so as to determine the temperature adjustment equivalent deviation of the current element according to the associated temperature of the current element in the target post-processing element, the difference between the carrier temperature threshold of the current element and the associated temperature of the current element, and the deviation adjustment weight corresponding to the current element, and so on, to obtain the temperature adjustment equivalent deviation of all elements in the target post-processing element, so as to sum the temperature adjustment equivalent deviations of all elements in the target post-processing element to obtain the temperature adjustment equivalent deviation.

[0043] Since the carrier temperature threshold corresponding to the SCR first mode threshold and the carrier temperature threshold corresponding to the SCR second mode threshold are different, the temperature adjustment equivalent deviation corresponding to the SCR first mode threshold can be calculated based on the carrier temperature threshold corresponding to the SCR first mode threshold according to the above logic, and the temperature adjustment equivalent deviation corresponding to the SCR second mode threshold can be calculated based on the carrier temperature threshold corresponding to the SCR second mode threshold according to the above logic.

[0044] Step 140, controlling the temperature of the SCR according to the temperature adjustment equivalent deviation.

[0045] In the embodiment of the present application, the preset temperature control strategy can be obtained, and the temperature adjustment equivalent deviation can be matched with the preset temperature control strategy, and then the temperature of the SCR can be controlled based on the successfully matched temperature control strategy.

[0046] The technical scheme of the embodiment of the present application determines the steady-state temperature function of the target aftertreatment element, sets the SCR first mode threshold and the SCR second mode threshold, determines the carrier temperature threshold according to the steady-state temperature function, the SCR first mode threshold, the SCR second mode threshold and the exhaust gas space velocity data, and then determines the temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight, and further controls the temperature of the SCR according to the temperature adjustment equivalent deviation. In the present scheme, the steady-state temperature function of the target aftertreatment element can reflect the potential correlation between the temperature of some large heat capacity elements through which the exhaust gas flows and the temperature of the SCR. The carrier temperature threshold determined in combination with the steady-state temperature function can determine the temperature threshold at which some large heat capacity elements through which the exhaust gas flows have an impact on the over-regulation of the temperature of the SCR, and the temperature adjustment equivalent deviation determined according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight can excavate the deviation from the exhaust gas reaction temperature through the temperature adjustment equivalent deviation without the aid of a Smith predictor, so as to realize accurate control of the temperature of the SCR, improve the reaction efficiency of the exhaust gas, solve the problem of difficulty in realizing over-regulation control of the temperature of the SCR, and effectively control the temperature of the SCR without the aid of a complex predictor, thereby avoiding a large amount of over-regulation of the temperature.

[0047] Embodiment Two

[0048] Figure 2 A flowchart of a temperature control method of an SCR provided by Embodiment Two of the present application is based on the above-mentioned embodiment and gives a specific optional implementation of determining the steady-state temperature function of the target aftertreatment element. As shown in the figure, the method comprises: Figure 2

[0049] Step 210: acquiring the associated temperature of the target aftertreatment element and the exhaust gas flow data under a plurality of exhaust temperature management working conditions.

[0050] The exhaust gas flow data can be data representing the exhaust emission flow.

[0051] In the embodiment of the present application, the working condition range requiring temperature management can be determined from the engine universal characteristic, and then a required number of exhaust temperature management working conditions can be selected from the working condition range requiring temperature management, so as to acquire the sensor values (i.e. the associated temperature of the target aftertreatment element under the exhaust temperature management working condition) of the target aftertreatment element collected by the sensor and the exhaust gas flow data under the selected plurality of exhaust temperature management working conditions.

[0052] ​In step 220, a steady-state temperature function of the target after-treatment element is determined according to an interpolation algorithm, the associated temperature of the target after-treatment element under the plurality of exhaust temperature management working conditions, and the exhaust flow data, and a first SCR mode threshold value and a second SCR mode threshold value are set.

[0053] The steady-state temperature function can include a DOC steady-state temperature function (denoted as f1) and a DPF steady-state temperature function (denoted as f2).

[0054] In the embodiment of the application, the exhaust flow data and the sensor values can be analyzed and fitted by using any known interpolation algorithm to obtain the DOC steady-state temperature function and the DPF steady-state temperature function, and the first SCR mode threshold value and the second SCR mode threshold value are set.

[0055] For example, four exhaust temperature management working conditions (i.e., different combinations of rotational speed and torque) can be selected, different exhaust temperature related actuator control degrees are given to produce different exhaust temperatures, each exhaust temperature is stable for 15 minutes, the exhaust flow data and the sensor values at this time are recorded, the space velocity of the target after-treatment element is calculated based on the exhaust flow data, the relationship between the space velocity and the exhaust temperature is fitted, and the two-dimensional MAPs of f1 and f2 are calculated by interpolation.

[0056] For example, the steady-state temperature function of the target after-treatment element can be determined based on the following formula: T DOC = f1(T SCR , SV DOC ); T DPF = f2(T SCR , SV DPF ). Wherein, T DOC represents the DOC carrier temperature, T DPF represents the DPF carrier temperature, T SCR represents the SCR carrier temperature, SV DOC represents the space velocity of the exhaust gas flowing through the DOC, and SV DPF represents the space velocity of the exhaust gas flowing through the DPF.

[0057] In an optional embodiment of the application, setting the first SCR mode threshold value and the second SCR mode threshold value can include: setting a target SCR reaction temperature and a temperature control adjustment calibration value; performing addition processing on the target SCR reaction temperature and the temperature control adjustment calibration value to obtain the first SCR mode threshold value; and performing subtraction processing on the target SCR reaction temperature and the temperature control adjustment calibration value to obtain the second SCR mode threshold value.

[0058] The target SCR reaction temperature can be the lower limit of the temperature at which the SCR eliminates nitrogen oxides. The temperature control adjustment calibration value can be a pre-set compensation calibration value.

[0059] In the embodiment of the present application, the lower limit of the temperature at which the SCR eliminates nitrogen oxides can be taken as the SCR target reaction temperature, and a temperature control adjustment calibration value can be set, so that the SCR target reaction temperature and the temperature control adjustment calibration value are added to obtain a sum value as the SCR first mode threshold value, and the SCR target reaction temperature and the temperature control adjustment calibration value are subtracted to obtain a difference value as the SCR second mode threshold value.

[0060] In step 230, a carrier temperature threshold value is determined according to the steady-state temperature function, the SCR first mode threshold value, the SCR second mode threshold value, and the exhaust gas space velocity data.

[0061] In an optional embodiment of the present application, determining the carrier temperature threshold value according to the steady-state temperature function, the SCR first mode threshold value, the SCR second mode threshold value, and the exhaust gas space velocity data can include: determining a DOC exhaust gas space velocity and a DPF exhaust gas space velocity according to the exhaust gas space velocity data; determining a DOC first carrier temperature threshold value according to the DOC exhaust gas space velocity, the SCR first mode threshold value, and a DOC steady-state temperature function, and determining a DOC second carrier temperature threshold value according to the DOC exhaust gas space velocity, the SCR second mode threshold value, and the DOC steady-state temperature function; and determining a DPF first carrier temperature threshold value according to the DPF exhaust gas space velocity, the SCR first mode threshold value, and a DPF steady-state temperature function, and determining a DPF second carrier temperature threshold value according to the DPF exhaust gas space velocity, the SCR second mode threshold value, and the DPF steady-state temperature function.

[0062] The DOC exhaust gas space velocity can be the space velocity of the exhaust gas flowing through the DOC. The DPF exhaust gas space velocity can be the space velocity of the exhaust gas flowing through the DPF. The DOC first carrier temperature threshold value can be a DOC temperature threshold value corresponding to the SCR first mode threshold value determined according to the DOC exhaust gas space velocity, the SCR first mode threshold value, and the DOC steady-state temperature function. The DOC second carrier temperature threshold value can be a DOC temperature threshold value corresponding to the SCR second mode threshold value determined according to the DOC exhaust gas space velocity, the SCR second mode threshold value, and the DOC steady-state temperature function. The DPF first carrier temperature threshold value can be a DPF temperature threshold value corresponding to the SCR first mode threshold value determined according to the DPF exhaust gas space velocity, the SCR first mode threshold value, and the DPF steady-state temperature function. The DPF second carrier temperature threshold value can be a DPF temperature threshold value corresponding to the SCR second mode threshold value determined according to the DPF exhaust gas space velocity, the SCR second mode threshold value, and the DPF steady-state temperature function.

[0063] In the embodiments of the present application, the exhaust gas space velocity data can be analyzed to obtain the DOC exhaust gas space velocity and the DPF exhaust gas space velocity, so as to substitute the DOC exhaust gas space velocity and the SCR first mode threshold into the DOC steady state temperature function to obtain the DOC first carrier temperature threshold, and substitute the DOC exhaust gas space velocity and the SCR second mode threshold into the DOC steady state temperature function to obtain the DOC second carrier temperature threshold. Further, the DPF exhaust gas space velocity and the SCR first mode threshold can be input into the DPF steady state temperature function to obtain the DPF first carrier temperature threshold, and the DPF exhaust gas space velocity and the SCR second mode threshold can also be input into the DPF steady state temperature function to obtain the DPF second carrier temperature threshold.

[0064] Exemplarily, the carrier temperature threshold can be represented based on the following formula:

[0065]

[0066]

[0067]

[0068]

[0069]

[0070]

[0071] wherein, represents the SCR target reaction temperature. ΔT offset represents the temperature control adjustment calibration value. represents the SCR first mode threshold, represents the SCR second mode threshold. represents the DOC first carrier temperature threshold, which is the high threshold of the DOC. represents the DOC second carrier temperature threshold, which is the low threshold of the DOC. represents the DPF first carrier temperature threshold, which is the high threshold of the DPF. represents the DPF second carrier temperature threshold, which is the low threshold of the DPF. SV DOC represents the exhaust gas space velocity when the exhaust gas flows through the DOC, SV DPF is the exhaust gas space velocity when the exhaust gas flows through the DPF.

[0072] In step 240, the temperature adjustment equivalent deviation is determined according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight.

[0073] In an optional embodiment of the present application, the determining the temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment component, the carrier temperature threshold and the deviation adjustment weight can comprise: determining a first temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment component, the SCR first mode threshold, the DOC first carrier temperature threshold, the DPF first carrier temperature threshold and the deviation adjustment weight; and determining a second temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment component, the SCR second mode threshold, the DOC second carrier temperature threshold, the DPF second carrier temperature threshold and the deviation adjustment weight.

[0074] The first temperature adjustment equivalent deviation can be a temperature adjustment equivalent deviation calculated according to the carrier temperature threshold corresponding to the SCR first mode threshold. The second temperature adjustment equivalent deviation can be a temperature adjustment equivalent deviation calculated according to the carrier temperature threshold corresponding to the SCR second mode threshold.

[0075] In the embodiment of the present application, the inlet temperature of the DOC, the inlet temperature of the DPF and the port temperature of the SCR can be determined according to the associated temperature of the target aftertreatment component, and then the first temperature adjustment equivalent deviation can be determined according to the port temperature of the SCR, the inlet temperature of the DOC, the inlet temperature of the DPF, the DOC first carrier temperature threshold, the DPF first carrier temperature threshold, the SCR first mode threshold and the deviation adjustment weight, and the second temperature adjustment equivalent deviation can be determined according to the port temperature of the SCR, the inlet temperature of the DOC, the inlet temperature of the DPF, the DOC second carrier temperature threshold, the DPF second carrier temperature threshold, the SCR second mode threshold and the deviation adjustment weight.

[0076] For example, the first temperature adjustment equivalent deviation can be calculated based on the following formula:

[0077]

[0078] Wherein, T1 represents the inlet temperature of the DOC, T2 represents the inlet temperature of the DPF, wt1 represents the deviation adjustment weight corresponding to the DOC, T3 represents the inlet temperature in the port temperature of the SCR, and T4 represents the outlet temperature in the port temperature of the SCR. represents the DOC first carrier temperature threshold. represents the DPF first carrier temperature threshold. represents the SCR first mode threshold, wt2 represents the deviation adjustment weight corresponding to the DPF, and wt3 represents the deviation adjustment weight corresponding to the SCR. The collection positions of T1, T2, T3 and T4 correspond to a1, a2, a3 and a4 in sequence, which can be specifically referred to in Figure 3 Wherein, T1 and T2 are collected in a low-pass filtering manner.

[0079] Exemplarily, the second temperature adjustment equivalent deviation can be calculated based on the following formula:

[0080]

[0081] wherein, represents a DOC second carrier temperature threshold. represents a DPF second carrier temperature threshold. represents a SCR second mode threshold.

[0082] Step 250, controlling the temperature of the SCR according to the temperature adjustment equivalent deviation.

[0083] In an optional embodiment of the present application, when the first temperature adjustment equivalent deviation is not less than zero, the temperature of the SCR is not raised; or when the second temperature adjustment equivalent deviation is less than zero, the temperature of the SCR is raised.

[0084] In the embodiment of the present application, if the first temperature adjustment equivalent deviation is not less than zero, it indicates that the temperature of the exhaust gas predicted to arrive at the SCR after considering the system delay is greater than the first mode threshold of the SCR, and the SCR can normally eliminate nitrogen oxides, so the temperature of the SCR is not raised. If the second temperature adjustment equivalent deviation is less than zero, it indicates that the temperature of the exhaust gas predicted to arrive at the SCR after considering the system delay is less than the second mode threshold of the SCR, and the SCR cannot normally eliminate nitrogen oxides due to the low temperature, so the temperature of the SCR is raised.

[0085] In an optional embodiment of the present application, the temperature control of the SCR can further include: when the absolute value of the second temperature adjustment equivalent deviation is greater than a first multiple of the temperature control adjustment calibration value and less than a second multiple of the temperature control adjustment calibration value, the temperature of the SCR is raised in a feedforward control mode; when the absolute value of the second temperature adjustment equivalent deviation is less than the first multiple of the temperature control adjustment calibration value or greater than the second multiple of the temperature control adjustment calibration value, the temperature of the SCR is raised in a PD control mode.

[0086] wherein, the ratio of the first multiple of the temperature control adjustment calibration value to the number of the temperature control adjustment calibration value is less than 1, and the ratio of the second multiple of the temperature control adjustment calibration value to the number of the temperature control adjustment calibration value is greater than 1. Exemplarily, the first multiple of the temperature control adjustment calibration value can be 0.75 times of the number of the temperature control adjustment calibration value, and the second multiple of the temperature control adjustment calibration value can be 1.25 times of the number of the temperature control adjustment calibration value. The PD control mode is a proportional and differential control mode.

[0087] In the embodiment of the present application, if the second temperature adjustment equivalent deviation is greater than the first multiple temperature control adjustment calibration value and less than the second multiple temperature control adjustment calibration value, it indicates that the temperature of the SCR for eliminating nitrogen oxides is relatively small, and the feedforward control mode can be used to improve the temperature of the SCR and reduce the temperature overshoot. If the second temperature adjustment equivalent deviation is less than the first multiple temperature control adjustment calibration value or greater than the second multiple temperature control adjustment calibration value, it indicates that the temperature of the SCR for eliminating nitrogen oxides is relatively large, and the PD control mode can be used to improve the temperature of the SCR and reduce the temperature overshoot.

[0088] For example, when ΔT Threslo <0, the temperature rising heating mode is entered; when 0<ΔT Threslo <2×ΔT offset , the PD control heating mode is entered. When the temperature rising heating mode is entered, the stable SCR temperature is higher than When the PD control heating mode is entered, only the feedforward control is used to make the stable SCR temperature equal to However, since there is a difference between the actual vehicle working condition and the bench calibration, the vehicle has a dispersion, and the environment also affects the calibration accuracy, when the PD control heating mode is entered, the PD control, i.e. the proportional + differential element controller, is introduced at the same time. The purpose of the proportion is to quickly reduce the target deviation, and here the temperature control adjustment calibration value is usually 20℃, which is still far from the target deviation of 0. In addition, since the system has a large inertia, the use of a certain D differential environment can effectively prevent overshoot. When 0.75×ΔT offset <ΔT Threslo <1.25×ΔT offset , the PD controller is closed, and only the feedforward is used.

[0089] In the present scheme, the difference between the current temperature of the SCR and the target reaction temperature of the SCR can be converted into the difference between the current temperature of the large heat capacity element through which the exhaust gas flows and the corresponding carrier temperature threshold, and the deviation adjustment weight of the element is combined to determine the temperature adjustment equivalent deviation, and then the SCR is heat managed according to the temperature adjustment equivalent deviation.

[0090] The technical scheme of the embodiment of the present application acquires the associated temperature of the target aftertreatment element and the exhaust flow data under multiple exhaust temperature management working conditions, then determines the steady-state temperature function of the target aftertreatment element according to the interpolation algorithm, the associated temperature of the target aftertreatment element and the exhaust flow data under multiple exhaust temperature management working conditions, sets the SCR first mode threshold and the SCR second mode threshold, determines the carrier temperature threshold according to the steady-state temperature function, the SCR first mode threshold, the SCR second mode threshold and the exhaust air speed data, and determines the temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight, and further controls the temperature of the SCR according to the temperature adjustment equivalent deviation. In the present scheme, the steady-state temperature function of the target aftertreatment element can reflect the potential correlation between the temperature of some large heat capacity elements through which the exhaust gas flows and the temperature of the SCR, and the carrier temperature threshold can be determined by combining the steady-state temperature function to determine the temperature threshold when some large heat capacity elements through which the exhaust gas flows have an impact on the over-regulation of the temperature of the SCR. According to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight, the temperature adjustment equivalent deviation can be determined without the aid of a Smith predictor, and the deviation from the exhaust gas reaction temperature can be excavated through the temperature adjustment equivalent deviation to realize accurate control of the temperature of the SCR, improve the reaction efficiency of the exhaust gas, solve the problem of difficult realization of over-regulation control of the temperature of the SCR, and effectively regulate the temperature of the SCR without the aid of a complex predictor, thereby avoiding a large amount of over-regulation of the temperature.

[0091] Embodiment three

[0092] Figure 4 A structural schematic diagram of an SCR temperature control device provided by the third embodiment of the present application is shown in FIG. 3. As shown in the figure, the device comprises: Figure 4 A data configuration module 310 is configured to determine the steady-state temperature function of the target aftertreatment element and set the SCR first mode threshold and the SCR second mode threshold.

[0093] A carrier temperature threshold determination module 320 is configured to determine the carrier temperature threshold according to the steady-state temperature function, the SCR first mode threshold, the SCR second mode threshold and the exhaust air speed data.

[0094] A temperature adjustment equivalent deviation determination module 330 is configured to determine the temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight.

[0095] An SCR first temperature control module 340 is configured to control the temperature of the SCR according to the temperature adjustment equivalent deviation.

[0096]

[0097] ​The technical scheme of the embodiment of the present application determines the steady-state temperature function of the target aftertreatment element, sets the SCR first mode threshold and the SCR second mode threshold, determines the carrier temperature threshold according to the steady-state temperature function, the SCR first mode threshold, the SCR second mode threshold and the exhaust air speed data, and then determines the temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight, and further controls the temperature of the SCR according to the temperature adjustment equivalent deviation. In the present scheme, the steady-state temperature function of the target aftertreatment element can reflect the potential correlation between the temperature of some large heat capacity elements through which the exhaust gas flows and the temperature of the SCR. The carrier temperature threshold determined in combination with the steady-state temperature function can determine the temperature threshold at which some large heat capacity elements through which the exhaust gas flows have an impact on the over-regulation of the temperature of the SCR, and the temperature adjustment equivalent deviation determined according to the associated temperature of the target aftertreatment element, the carrier temperature threshold and the deviation adjustment weight can excavate the deviation from the exhaust gas reaction temperature through the temperature adjustment equivalent deviation without the aid of a Smith predictor, so as to realize accurate control of the temperature of the SCR, improve the reaction efficiency of the exhaust gas, solve the problem of difficulty in realizing over-regulation control of the temperature of the SCR, and effectively regulate the temperature of the SCR without the aid of a complex predictor, thereby avoiding a large amount of over-regulation of the temperature.

[0098] Optionally, the data configuration module 310 is configured to obtain the associated temperature of the target aftertreatment element and the exhaust flow data under a plurality of exhaust temperature management working conditions; determine the steady-state temperature function of the target aftertreatment element according to an interpolation algorithm, the associated temperature of the target aftertreatment element and the exhaust flow data under the plurality of exhaust temperature management working conditions; wherein the steady-state temperature function comprises a honeycomb ceramic carrier DOC steady-state temperature function and a particulate filter DPF steady-state temperature function.

[0099] Optionally, the data configuration module 310 is configured to set the SCR target reaction temperature and the temperature control adjustment calibration value; perform addition processing on the SCR target reaction temperature and the temperature control adjustment calibration value to obtain the SCR first mode threshold; and perform subtraction processing on the SCR target reaction temperature and the temperature control adjustment calibration value to obtain the SCR second mode threshold.

[0100] Optionally, the carrier temperature threshold determination module 320 is configured to determine a DOC exhaust air speed and a DPF exhaust air speed according to the exhaust air speed data; determine a DOC first carrier temperature threshold according to the DOC exhaust air speed, the SCR first mode threshold and the DOC steady state temperature function, and determine a DOC second carrier temperature threshold according to the DOC exhaust air speed, the SCR second mode threshold and the DOC steady state temperature function; determine a DPF first carrier temperature threshold according to the DPF exhaust air speed, the SCR first mode threshold and the DPF steady state temperature function, and determine a DPF second carrier temperature threshold according to the DPF exhaust air speed, the SCR second mode threshold and the DPF steady state temperature function.

[0101] Optionally, the temperature adjustment equivalent deviation determination module 330 is configured to determine a first temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the SCR first mode threshold, the DOC first carrier temperature threshold, the DPF first carrier temperature threshold and the deviation adjustment weight; and determine a second temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the SCR second mode threshold, the DOC second carrier temperature threshold, the DPF second carrier temperature threshold and the deviation adjustment weight.

[0102] The SCR first temperature control module 340 is configured to not perform temperature promotion of the SCR when the first temperature adjustment equivalent deviation is not less than zero, or promote the temperature of the SCR when the second temperature adjustment equivalent deviation is less than zero.

[0103] Optionally, the SCR temperature control device further comprises a SCR second temperature control module configured to promote the temperature of the SCR in a feedforward control mode when the second temperature adjustment equivalent deviation is greater than a first multiple of a temperature control adjustment calibration value and less than a second multiple of the temperature control adjustment calibration value, and promote the temperature of the SCR in a PD control mode when the second temperature adjustment equivalent deviation is less than the first temperature control adjustment calibration value or greater than the second multiple of the temperature control adjustment calibration value.

[0104] The SCR temperature control device provided by the embodiments of the present application can perform the SCR temperature control method provided by any of the embodiments of the present application, and has the corresponding function modules and beneficial effects of performing the method.

[0105] Embodiment Four

[0106] Figure 5A schematic diagram of an electronic device that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0107] like Figure 5 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0108] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0109] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the temperature control method of SCR.

[0110] In some embodiments, the temperature control method of the SCR can be implemented as a computer program tangibly embodied in a computer readable storage medium, e.g., storage unit 18. In some embodiments, parts or all of the computer program can be loaded and / or installed onto electronic device 10 via, e.g., ROM 12 and / or communication unit 19. When the computer program is loaded onto RAM 13 and executed by processor 11, one or more steps of the above-described temperature control method of the SCR can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the temperature control method of the SCR by other means, e.g., with the aid of firmware.

[0111] Various implementations of the systems and techniques described above can be realized in digital electronic circuitry, integrated circuitry, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on a chip (SOC), a programmable logic device (PLD), a computer hardware, firmware, software, and / or combinations thereof. These various implementations can include implementation in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.

[0112] Computer programs used to implement the processes of the present application can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the computer program, when executed by the processor, implements the functions / acts specified in the flowcharts and / or block diagrams. The computer program can be executed entirely on a machine, partially on a machine, partially on a machine as a stand-alone software package, partially on a machine and partially on a remote machine or entirely on a remote machine or server.

[0113] In the context of the present application, a computer-readable storage medium can be a tangible medium that can contain or store computer programs for use by or in connection with an instruction execution system, apparatus, or device. Computer-readable storage media can include, but are not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium can be a machine-readable signal medium. More specific examples of a machine-readable storage medium will include one or more lines of a program of instructions in a transitory signal, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0114] To provide for interaction with a user, the systems and techniques described here can be implemented on an electronic device having a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the electronic device. Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form, including acoustic, speech, or tactile input.

[0115] The systems and techniques described here can be implemented in a computing system that includes a back end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front end component (e.g., a user computer having a graphical user interface or a Web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back end, middleware, or front end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0116] The computing system can include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system, to solve the defects of large management difficulty and weak business scalability in traditional physical host and VPS service.

[0117] It should be understood that the various forms of flow shown above can be reordered, added to, or have steps deleted. For example, the steps described in the present application can be performed in parallel, in series, or in a different order, as long as the desired results of the technical solutions of the present application can be achieved, which are not limited herein.

[0118] The above detailed description does not constitute a limitation on the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature control method of an SCR, characterized by, The method comprises: determining a steady-state temperature function of a target aftertreatment element, and setting a SCR first mode threshold value and a SCR second mode threshold value; wherein the steady-state temperature function is a function of predicting the temperature of the exhaust gas flowing through the corresponding element according to the space velocity of the exhaust gas flowing through the element and the SCR carrier temperature; the SCR first mode threshold value and the SCR second mode threshold value are both pre-set temperature threshold values of the SCR; determining a carrier temperature threshold value according to the steady-state temperature function, the SCR first mode threshold value, the SCR second mode threshold value, and exhaust gas space velocity data; wherein the carrier temperature threshold value is a temperature threshold value for reference when controlling the temperature of the SCR; the carrier temperature threshold value corresponding to the SCR first mode threshold value comprises the SCR first mode threshold value, the temperature threshold value of the DOC when the temperature of the SCR is the SCR first mode threshold value, and the temperature threshold value of the DPF; the carrier temperature threshold value corresponding to the SCR second mode threshold value comprises the SCR second mode threshold value, the temperature threshold value of the DOC when the temperature of the SCR is the SCR second mode threshold value, and the temperature threshold value of the DPF; determining a temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold value, and a deviation adjustment weight; wherein the deviation adjustment weight is a weight value set for the element corresponding to the carrier temperature threshold value; the temperature adjustment equivalent deviation is a comprehensive deviation for describing the associated temperature of the target aftertreatment element and the carrier temperature threshold value; controlling the temperature of the SCR according to the temperature adjustment equivalent deviation.

2. The method of claim 1, wherein, The method comprises: obtaining the associated temperature of the target aftertreatment element and the exhaust gas flow data under a plurality of exhaust temperature management working conditions; determining the steady-state temperature function of the target aftertreatment element according to an interpolation algorithm, the associated temperature of the target aftertreatment element, and the exhaust gas flow data under a plurality of exhaust temperature management working conditions; wherein the steady-state temperature function comprises a honeycomb ceramic carrier DOC steady-state temperature function and a particulate filter DPF steady-state temperature function.

3. The method of claim 2, wherein, The method comprises: setting a SCR target reaction temperature and a temperature control adjustment calibration value; performing addition processing on the SCR target reaction temperature and the temperature control adjustment calibration value to obtain the SCR first mode threshold value; performing subtraction processing on the SCR target reaction temperature and the temperature control adjustment calibration value to obtain the SCR second mode threshold value.

4. The method of claim 3, wherein, The method comprises: determining a DOC exhaust gas space velocity and a DPF exhaust gas space velocity according to the exhaust gas space velocity data; determining a DOC first carrier temperature threshold value according to the DOC exhaust gas space velocity, the SCR first mode threshold value, and the DOC steady-state temperature function, and determining a DOC second carrier temperature threshold value according to the DOC exhaust gas space velocity, the SCR second mode threshold value, and the DOC steady-state temperature function; A DPF first carrier temperature threshold is determined according to the DPF exhaust gas space velocity, the SCR first mode threshold, and the DPF steady state temperature function, and a DPF second carrier temperature threshold is determined according to the DPF exhaust gas space velocity, the SCR second mode threshold, and the DPF steady state temperature function.

5. The method of claim 4, wherein, The determining the temperature adjustment equivalent deviation according to the associated temperature of the target aftertreatment element, the carrier temperature threshold, and the deviation adjustment weight comprises: A first temperature adjustment equivalent deviation is determined according to the associated temperature of the target aftertreatment element, the SCR first mode threshold, the DOC first carrier temperature threshold, the DPF first carrier temperature threshold, and the deviation adjustment weight; A second temperature adjustment equivalent deviation is determined according to the associated temperature of the target aftertreatment element, the SCR second mode threshold, the DOC second carrier temperature threshold, the DPF second carrier temperature threshold, and the deviation adjustment weight.

6. The method of claim 5, wherein, The controlling the temperature of the SCR according to the temperature adjustment equivalent deviation comprises: When the first temperature adjustment equivalent deviation is not less than zero, the temperature of the SCR is not raised; or, When the second temperature adjustment equivalent deviation is less than zero, the temperature of the SCR is raised.

7. The method of claim 6, wherein, Further comprising: When the second temperature adjustment equivalent deviation is greater than a first multiple temperature control adjustment calibration value and less than a second multiple temperature control adjustment calibration value, a feedforward control mode is adopted to raise the temperature of the SCR; When the second temperature adjustment equivalent deviation is less than a first temperature control adjustment calibration value or greater than a second multiple temperature control adjustment calibration value, a PD control mode is adopted to raise the temperature of the SCR.

8. A temperature control device for an SCR, characterized by Comprise: A data configuration module is configured to determine a steady state temperature function of a target aftertreatment element, and set a SCR first mode threshold and a SCR second mode threshold; wherein the steady state temperature function is a function of predicting the temperature of exhaust gas flowing through a corresponding element according to the space velocity of the exhaust gas flowing through the element and the SCR carrier temperature; the SCR first mode threshold and the SCR second mode threshold are both pre-set temperature thresholds of the SCR; A carrier temperature threshold determination module is configured to determine a carrier temperature threshold according to the steady state temperature function, the SCR first mode threshold, the SCR second mode threshold, and exhaust gas space velocity data; wherein the carrier temperature threshold is a temperature threshold referenced when controlling the temperature of the SCR; the carrier temperature threshold corresponding to the SCR first mode threshold comprises the SCR first mode threshold, the temperature threshold of the DOC when the temperature of the SCR is the SCR first mode threshold, and the temperature threshold of the DPF; the carrier temperature threshold corresponding to the SCR second mode threshold comprises the SCR second mode threshold, the temperature threshold of the DOC when the temperature of the SCR is the SCR second mode threshold, and the temperature threshold of the DPF. The temperature adjustment equivalent deviation determination module is configured to determine a temperature adjustment equivalent deviation according to the associated temperature of the target post-processing element, the carrier temperature threshold, and a deviation adjustment weight. The deviation adjustment weight is a weight value set for the element corresponding to the carrier temperature threshold. The temperature adjustment equivalent deviation is used to describe the comprehensive deviation between the associated temperature of the target post-processing element and the carrier temperature threshold. The SCR first temperature control module is configured to control the temperature of the SCR according to the temperature adjustment equivalent deviation.

9. An electronic device, comprising: The electronic device comprises: at least one processor; and a memory connected to the at least one processor in communication; wherein The memory stores a computer program executable by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to execute the SCR temperature control method of any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions for enabling the processor to implement the SCR temperature control method of any one of claims 1-7 when executed.

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