A lamp drive integrated LED drive package

Abstract

The application relates to a lamp and driver integrated LED driving package. The package comprises a substrate, an inductor arranged on the substrate, an LED lamp group, and a driving chip, wherein the inductor is made when the substrate is etched, and the inductor, the LED lamp group and the driving chip are all packaged on the substrate. After the inductor is made, a magnetic conductive glue is made on the surface of the inductor. By making the inductor on the lamp and driver integrated substrate, energy loss is reduced, the starting end device is lowered in heat generation, and the serial number of the LED is increased.

Description

Technical Field

[0001] This invention relates to the field of LED driver packaging technology, and in particular to an integrated lamp and driver LED driver package. Background Technology

[0002] With the continuous development of LED display driving technology, LED displays are being used more and more widely, and users' requirements for the display effects of LED displays are also increasing. Currently, the technology of packaging LED lamps and driver chips together is called integrated lamp-driver packaging, and products packaged in integrated lamp-driver packaging are called integrated lamp-driver products. Due to their convenience and ability to achieve full-color adjustment, integrated lamp-driver products are now widely used, for example, in indicator lights in instruments, equipment, and home appliances. Integrated lamp-driver products are also widely used in various LED display fields.

[0003] Traditional integrated lamp driver package, such as Figure 1 As shown, Figure 1 a is a schematic diagram of the integrated lamp driver package. Figure 1 b is the circuit connection diagram of the integrated lamp driver package. In the diagram, 100 is the substrate, 101, 102, and 103 are red, green, and blue (RGB) LEDs, 104 is the IC driver chip, 105 is the constant current driver, 106 is the control signal input, 107 is the control signal output, Ir1, Ig1, and Ib1 are the currents flowing through the RGB LEDs, Vcc is the power supply voltage, and Io1 is the current under the chip's static power consumption.

[0004] As is well known, the forward voltage (Vf) of red, green, and blue LEDs differs significantly. Red LEDs have a forward voltage (Vfr) of approximately 2V, green LEDs approximately 2.4V, and blue LEDs approximately 3.2V. Based on typical white balance requirements, the current ratio of red, green, and blue LEDs is approximately 7:3:2, meaning the red LED current accounts for over 58% of the total current. However, to ensure the normal operation of the blue LEDs and the driver chip, the power supply voltage (Vcc) must be greater than Vfb + Von (driver chip voltage drop). Typically, Vcc needs to be greater than 3.8V. In some applications, such as serial displays, considering line loss, a higher voltage, such as 5.5V, is required for Vcc. Figure 2A serial display bar is composed of a group of n lamps and drivers. As shown in the figure, 201 is a group of RGB three-color LED lamps and related driving circuit, Vcc is the starting voltage of power supply, and Vcce is the voltage of the last end of power supply. Since there is line loss in the serial, Vcc will continue to decrease with the increase of the serial number. In order to ensure that the last end Vcce meets the normal voltage, the starting end of the power supply must consider the line loss margin. In this way, the starting end Vcc must be much higher than the end Vcce, which causes the three technical problems existing in the existing products, 1, great energy waste; 2, the starting end device generates a lot of heat, which affects the reliability and service life of the device; 3, the serial number of LED is limited. SUMMARY

[0005] (I) Technical problems to be solved

[0006] In view of some or all of the problems in the prior art, the purpose of the present application is to provide a LED driving package of lamp and driver in one, which reduces the loss of energy, reduces the heat generation of the starting end device, and is beneficial to increase the serial number of LED.

[0007] (II) Technical solutions

[0008] In order to achieve the above purpose, the main technical solutions adopted by the present application include:

[0009] The present application provides a LED driving package of lamp and driver in one,

[0010] including a substrate, an inductor arranged on the substrate, a group of LED lamps, and a driving chip, wherein the inductor is made when the substrate is etched, and the inductor, the group of LED lamps and the driving chip are all packaged on the substrate.

[0011] Further, the substrate is a PCB substrate, a BT substrate, an aluminum substrate, a silicon substrate or a glass substrate.

[0012] Further, after the inductor is made, a magnetic conductive glue is made on the surface of the inductor, including only making the magnetic conductive glue on the upper surface of the inductor, or only making the magnetic conductive glue on the lower surface of the inductor, or making the magnetic conductive glue on both the upper surface and the lower surface of the inductor.

[0013] Further, the magnetic conductive glue is organic silicon magnetic conductive glue or epoxy magnetic conductive glue; and / or

[0014] The shape of the inductor is circular, square, snake-shaped or oval.

[0015] Further, the driving chip is arranged on the front surface of the substrate, and the inductor is arranged on the front surface or the back surface of the substrate.

[0016] The inductor on the front surface of the substrate is made by dropping the magnetic conductive glue, and the inductor on the back surface of the substrate is made by brushing the magnetic conductive glue.

[0017] Further, the driving chip comprises a DC / DC function, or a special DC / DC function chip is added.

[0018] Further, the DC / DC function is a step-down type or a step-up type.

[0019] Further, a filter capacitor is further included on the substrate.

[0020] Further, the filter capacitor is directly attached on the substrate, or an external capacitor is connected through the pins of the substrate.

[0021] Further, the circuit connection mode of the substrate is that the positive pole of the GB LED lamp in the LED lamp group is connected to the power supply voltage Vcc, the negative pole of the GB LED lamp and the negative pole of the R LED lamp are connected to the driving end of the driving circuit respectively, the power supply voltage Vcc is connected to the source pole of the control switch, the gate pole of the control switch is connected to the control signal, the drain pole of the control switch is connected to one end of the inductor, the other end of the inductor is connected to the positive pole of the R LED lamp and one end of the capacitor Cr, and the other end of the capacitor Cr is connected to the ground.

[0022] Further, the circuit connection mode of the substrate is that the positive pole of the GB LED lamp in the LED lamp group is connected to the ground, the negative pole of the GB LED lamp and the negative pole of the R LED lamp are connected to the driving end of the driving circuit respectively, the ground is connected to the source pole of the control switch, the gate pole of the control switch is connected to the control signal, the drain pole of the control switch is connected to one end of the inductor, the other end of the inductor is connected to the positive pole of the R LED lamp and one end of the capacitor Cr, and the other end of the capacitor Cr is connected to the negative power supply voltage -Vcc.

[0023] (Three) beneficial effects

[0024] The LED driving package provided by the application reduces the energy loss, reduces the heat of the starting end device, and is beneficial to increasing the serial number of the LED. BRIEF DESCRIPTION OF DRAWINGS

[0025] To further clarify the above and other advantages and features of the embodiments of the present application, a more particular description of embodiments of the application will be rendered by reference to specific drawings. It is appreciated that these drawings depict only typical embodiments of the application and are therefore not to be considered limiting of its scope. The same or corresponding elements in the drawings are denoted by the same or similar reference signs.

[0026] Figure 1 The structure schematic diagram of the traditional lamp driving package;

[0027] Figure 2 A schematic diagram of a serial display bar composed of a traditional n-lamp driver;

[0028] Figure 3 A schematic diagram of a substrate structure of an LED driver package according to an embodiment of the present application;

[0029] Figure 4 A schematic diagram of an inductor structure according to an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a circuit structure of an LED driver package according to an embodiment of the present application. DETAILED DESCRIPTION

[0031] In the following description, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration various embodiments for practicing the present application. It is to be understood that other embodiments can be utilized and structural or operational changes can be made without departing from the scope of the present application. The following detailed description, therefore, is not to be taken in a limiting sense, as the scope of the present application is defined by the appended claims.

[0032] In this specification, reference to "one embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

[0033] It should be noted that the embodiments of the present application are described in a specific order of method steps, however this is only for the purpose of illustrating the specific embodiment, and does not limit the order of the steps. Instead, in different embodiments of the present application, the order of the steps can be adjusted according to the actual needs of adjustment.

[0034] The scheme of the present application is further described below in conjunction with the embodiment drawings.

[0035] Figure 3 A schematic diagram of a substrate structure of an LED driver package according to an embodiment of the present application;

[0036] As Figure 3As shown in the figure, the LED driving package combined with a lamp includes a substrate 300, an inductor 305 arranged on the substrate, an LED lamp group, and a driving chip 304. The LED lamp group includes a red LED lamp chip 301, a green LED lamp chip 302, and a blue LED lamp chip 303. The inductor is made when the substrate is etched, and the inductor, the LED lamp group, and the driving chip are all packaged on the substrate. The substrate can be a PCB substrate, a BT substrate, an aluminum substrate, a silicon substrate, or a glass substrate, or other substrates suitable for making LED packages.

[0037] The inductor etched on the substrate has only a coil without a magnetic core, and has a small magnetic permeability. The inductance of the etched inductor is also small. For example, the inductance of a long solenoid (ignoring the end effect and the radial size of the coil) is calculated as follows,

[0038] L = μN 2 S / l

[0039] wherein μ is the magnetic permeability of the core column, N is the total number of turns of the coil, S is the cross-sectional area of the coil, and l is the longitudinal length of the coil.

[0040] The etched inductor has only a coil without a magnetic core, and has an air magnetic permeability. The air magnetic permeability is about 4π×10 -7 H / m. The inductance of the inductor without a magnetic core is small. In an embodiment of the present application, after the inductor on the substrate is made, a magnetic conductive glue is made on the surface of the inductor, so as to increase the magnetic permeability of the inductor and increase the inductance of the etched inductor.

[0041] Figure 4 The figure is a schematic diagram of the inductor structure of an embodiment of the present application. Figure 4 The figure is a schematic diagram of the inductor structure of an embodiment of the present application. Figure 3 The figure is a side view of the substrate structure. As shown in the figure, Figure 4As shown, 401 is an inductor, and 402 is a magnetic conductive glue. The magnetic conductive glue is made on the surface of the finished inductor and is cured. Making the magnetic conductive glue on the surface of the inductor includes making the magnetic conductive glue only on the upper surface of the inductor, or making the magnetic conductive glue only on the lower surface of the inductor, or making the magnetic conductive glue on both the upper surface and the lower surface of the inductor. The way of making the magnetic conductive glue can be glue dropping, glue coating, glue brushing, or other ways of making the magnetic conductive glue according to the process requirements, which are not described here. The way of curing the magnetic conductive glue can be high-temperature curing, UV curing, or other curing ways according to the process requirements. The magnetic conductive glue is made by adding magnetic conductive fillers (such as ferrite, carbonyl iron powder, etc.) in the adhesive, so that the adhesive has the magnetic conductive property. It is commonly used for bonding magnetic steel, ferrite, transformer core, etc. In an embodiment of the present application, the magnetic conductive glue is a silicone magnetic conductive glue or an epoxy magnetic conductive glue. The inductor 401 can be arranged on the same side of the substrate (i.e. the front surface of the substrate) as the driving chip, or a plurality of inductors 401 can be arranged on both sides of the substrate (i.e. the front surface and the back surface of the substrate). In some embodiments of the present application, the inductor on the front surface of the substrate is made by glue dropping, and the inductor on the back surface of the substrate is made by glue brushing, so as to obtain a flat back surface.

[0042] The shape of the etched inductor can be various, such as circular, square, snake-shaped, or oval, or other shapes, which can be determined according to actual requirements and production processes.

[0043] The driving chip contains a DC / DC function, or a special DC / DC function chip is added, which is used to adjust the input voltage of the LED lamp chip. The DC / DC function refers to the use of the energy storage characteristics of the inductor to store the input electric energy in the inductor through the action of a controllable switch (MOSFET, etc.). When the switch is turned off, the electric energy is released to the load to provide energy. The switching power supply can be used for voltage boosting and voltage reduction. The DC / DC function can be a voltage reduction type or a voltage boosting type.

[0044] The substrate can also include a filter capacitor for improving the output of efficient and smooth direct current. The filter capacitor can be directly attached to the substrate, and the inductor, the LED lamp group, and the driving chip are packaged on the substrate. The filter capacitor can also be an external capacitor connected through the pins of the substrate.

[0045] The beneficial effects of making the inductor on the lamp driving integrated substrate will be described below. Figure 5

[0046] Figure 5 The circuit structure schematic diagram of the LED driving package of an embodiment of the present application is shown in FIG. 1. As shown in FIG. 1, the LED driving package includes a substrate 100, an inductor 401, a driving chip 402, an LED lamp group 403, and a filter capacitor 404. Figure 5 ​As shown, Vcc is the power voltage, I r2, I g2, I b2 are the currents flowing through the RGB LED lamp respectively, 505 is the control switch, 506 is the control signal input, and 507 is the control signal output. The control switch 505 and the three constant current sources are in the same driving chip and are packaged on the substrate. As shown in Figure 5 As shown, the circuit connection mode of the substrate is that the anode of the GB LED lamp in the LED lamp group is connected to the power voltage Vcc, the cathode of the GB LED lamp and the cathode of the R LED lamp are connected to the driving end of the driving circuit respectively, the power voltage Vcc is connected to the source of the control switch, the gate of the control switch is connected to the control signal, and the drain of the control switch is connected to one end of the inductor. The other end of the inductor is connected to the anode of the R LED lamp and one end of the capacitor Cr, and the other end of the capacitor Cr is connected to the ground. The driving circuit includes the control signal input, the control signal output, the constant current source of the RGB LED lamp group, and the control switch.

[0047] Figure 5 As shown, the circuit connection mode of the substrate is that the anode of the GB LED lamp in the LED lamp group is connected to the ground, the cathode of the GB LED lamp and the cathode of the R LED lamp are connected to the driving end of the driving circuit respectively, the ground is connected to the source of the control switch, the gate of the control switch is connected to the control signal, and the drain of the control switch is connected to one end of the inductor. The other end of the inductor is connected to the anode of the R LED lamp and one end of the capacitor Cr, and the other end of the capacitor Cr is connected to the negative power voltage -Vcc.

[0048] The power voltage Vcc is set to 5V, and the power consumption under the traditional lamp-driving-in-one package mode is calculated as shown in Figure 1 As shown in Figure 1 As shown in b, 105 is the constant current drive, 106 is the control signal input, 107 is the control signal output, I r1, I g1, I b1 are the currents flowing through the RGB LED lamp respectively, Vcc is the power voltage, and I o1 is the current under the static power consumption of the chip. As shown in Figure 1 As shown in b, the circuit connection mode of the substrate is that the anode of the RGB LED lamp group is connected to the power voltage Vcc, and the cathode of the RGB LED lamp group is connected to the driving end of the constant current drive respectively. The current ratio of the red, green, and blue LEDs under the traditional lamp-driving-in-one package mode is set to 7:3:2. Setting the size of one current to i, the red lamp current I r1=7i, the green lamp current I g1=3i, and the blue lamp current I b1=2i can be obtained. As shown in Figure 1As shown in FIG. 1, the total current I1 of the power supply is equal to the sum of the red, green and blue LED currents plus the current I01 under the static power consumption of the chip, i.e. I1=Ir1+Ig1+Ib1+I01. Under the static power consumption, the current of the chip is equivalent to the red, green and blue LED currents which can be ignored. Therefore, I1=Ir1+Ig1+Ib1=7i+3i+2i=12i, and the power consumption of the power supply is P1=Vcc*I1=5*12i=60i, wherein * represents multiplication.

[0049] Suppose the power supply voltage Vcc=5V, the power consumption P1 of the LED driving package circuit of an embodiment of the present application is calculated as shown in FIG. 1. Figure 5 As shown in FIG. 1, the total current I1 of the power supply is equal to the sum of the red, green and blue LED currents plus the current I01 under the static power consumption of the chip, i.e. I1=Ir1+Ig1+Ib1+I01. Under the static power consumption, the current of the chip is equivalent to the red, green and blue LED currents which can be ignored. Therefore, I1=Ir1+Ig1+Ib1=7i+3i+2i=12i, and the power consumption of the power supply is P1=Vcc*I1=5*12i=60i, wherein * represents multiplication. Figure 5 As shown in FIG. 1, the total current I1 of the power supply is equal to the sum of the red, green and blue LED currents plus the current I01 under the static power consumption of the chip, i.e. I1=Ir1+Ig1+Ib1+I01. Under the static power consumption, the current of the chip is equivalent to the red, green and blue LED currents which can be ignored. Therefore, I1=Ir1+Ig1+Ib1=7i+3i+2i=12i, and the power consumption of the power supply is P1=Vcc*I1=5*12i=60i, wherein * represents multiplication.

[0050] The LED driving package of the present application can reduce the power energy loss by making the inductor on the substrate of the lamp driving package, thereby reducing the heat of the starting end device and increasing the serial number of the LED.

[0051] Although the above describes the embodiments of the present application, it should be understood that they are only presented as examples and not as limitations. It is obvious to those skilled in the relevant art that various combinations, variations and changes can be made without departing from the spirit and scope of the present application. Therefore, the width and scope of the present application disclosed herein should not be limited by the above disclosed exemplary embodiments, but should only be defined according to the appended claims and their equivalent replacements.

Claims

1. An integrated LED driver package, characterized in that, include: substrate; Inductor, wherein the inductor is disposed on the substrate; LED light assembly; as well as Driver chip; The inductor is fabricated during substrate etching, and the inductor, LED assembly, and driver chip are all packaged on the substrate. The substrate is a PCB substrate, BT substrate, aluminum substrate, silicon substrate or glass substrate; The circuit connection of the substrate is as follows: the positive terminal of the GB LED in the LED group is connected to the power supply voltage Vcc; the negative terminals of the GB LED and the R LED are connected to their respective driving terminals in the driving circuit; the power supply voltage Vcc is connected to the source of the control switch; the gate of the control switch is connected to the control signal; the drain of the control switch is connected to one end of an inductor; the other end of the inductor is connected to the positive terminal of the R LED and one end of a capacitor Cr; the other end of the capacitor Cr is grounded; or The positive terminal of the GB LED in the LED group is connected to ground, the negative terminals of the GB LED and the R LED are connected to their respective driving terminals in the driving circuit, the ground is connected to the source of the control switch, the gate of the control switch is connected to the control signal, the drain of the control switch is connected to one end of an inductor, the other end of the inductor is connected to the positive terminal of the R LED and one end of the capacitor Cr, and the other end of the capacitor Cr is connected to the negative power supply voltage –Vcc.

2. The LED driver package integrating lamp and driver functions according to claim 1, characterized in that: After the inductor is manufactured, a magnetic adhesive is applied to the surface of the inductor, including applying the magnetic adhesive only to the upper surface of the inductor, applying the magnetic adhesive only to the lower surface of the inductor, or applying the magnetic adhesive to both the upper and lower surfaces of the inductor.

3. The LED driver package integrating lamp and driver functions according to claim 2, characterized in that: The magnetic adhesive is a silicone magnetic adhesive or an epoxy magnetic adhesive; and / or The inductor can be circular, square, serpentine, or elliptical in shape.

4. The LED driver package integrating lamp and driver functions according to claim 1, characterized in that: The driving chip is disposed on the front side of the substrate, and the inductor is disposed on the front or back side of the substrate. The inductors on the front side of the substrate are made with magnetic adhesive using a dripping method, while the inductors on the back side of the substrate are made with magnetic adhesive using a brushing method.

5. The LED driver package integrating lamp and driver functions according to claim 1, characterized in that: The driver chip includes DC / DC functionality, or an additional dedicated DC / DC function chip can be added.

6. The LED driver package integrating lamp and driver functions according to claim 5, characterized in that: The DC / DC function is either a step-down or step-up type.

7. The LED driver package integrating lamp and driver functions according to claim 1, characterized in that: The substrate also includes a filter capacitor.

8. The LED driver package integrating lamp and driver functions according to claim 7, characterized in that: The filter capacitor is directly attached to the substrate, or an external capacitor is connected through the pins of the substrate.

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