An automated electroless plating platform for IPMC electroless plating process
By designing an automated electroless plating platform, the instability problem caused by human intervention in the electroless plating process of IPMC was solved, and automated chemical dosing and temperature control were achieved, thereby improving the preparation stability and performance consistency of IPMC materials.
Patent Information
- Application Number
- CN202310943981.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-31
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2043-07-31
AI Technical Summary
The existing IPMC electroless plating process involves a lot of human intervention, which leads to instability in the preparation process and affects the material properties.
Design an automated chemical plating platform for IPMC electroless plating process, including an automatic chemical dosing device, a temperature control device, and a main control device. Automated chemical dosing and temperature control are achieved through a height position adjustment mechanism, a horizontal position adjustment mechanism, and a pipette chemical dosing control mechanism.
The process of IPMC electroless plating has been automated and stabilized, improving the reliability and consistency of material properties.
Smart Images

Figure CN117165928B_ABST
Abstract
Description
Technical Field
[0001] This specification relates to one or more embodiments in the field of electroless plating processes, specifically an automated electroless plating platform for IPMC electroless plating processes. Background Technology
[0002] Ionic polymer-metal composite (IPMC) is a novel ionic electroactive polymer material composed of an ion exchange membrane in the middle and noble metal electrodes on both sides. It has the characteristics of low driving voltage, fast response speed and high energy conversion rate, and has good development potential in micro and lightweight driving applications.
[0003] IPMC is prepared by depositing inert metals on both sides of an ion exchange membrane. The preparation process mainly includes base film roughening, ion adsorption, primary electroless plating, secondary electroless plating, and ion exchange. The preparation process of IPMC involves many uncertainties, especially the significant human intervention in the primary and secondary electroless plating processes, leading to instability and affecting the material properties of IPMC. Therefore, there is an urgent need to design an automated electroless plating device to stabilize the preparation process. Summary of the Invention
[0004] In view of this, the purpose of this invention is to propose an automated electroless plating platform for IPMC electroless plating processes, in order to solve the problem mentioned in the background art that there is a lot of human intervention in the existing IPMC electroless plating processes, which leads to the instability of the IPMC preparation process and thus affects the material properties of IPMC.
[0005] An automated chemical plating platform for IPMC electroless plating process includes an automatic chemical dosing device, a temperature control device, and a main control device. The automatic chemical dosing device includes a height position adjustment mechanism, a horizontal position adjustment mechanism, a pipette dosing control mechanism, and a support.
[0006] The height adjustment mechanism is located at the top of the bracket to adjust the height of the pipette dosing control mechanism;
[0007] The horizontal position adjustment mechanism is located in the middle section of the support to adjust the position of the pipette dosing control mechanism;
[0008] The height position adjustment mechanism includes a top drive mechanism, a bottom support mechanism, a middle slider mechanism, and a position control mechanism.
[0009] As one embodiment of the present invention, the top drive mechanism includes
[0010] Top plate, top plate fixing bracket, top cover, height position adjustment motor, lead screw, coupling, top optical shaft fixing seat, lead screw support nut, thrust ball bearing;
[0011] The top plate fixing bracket is installed on the bracket by T-nuts. The top plate is fixedly connected to the bracket by the top plate fixing bracket. The four mounting holes at the four corners of the top plate are fixedly connected to the top plate fixing bracket by bolts. The top cover is installed on the five top cover mounting holes of the top plate by mounting nuts in its internal groove. The height position adjustment motor is installed on the four motor mounting holes at the front end of the top plate by bolts. The lead screw is connected to the output shaft of the height position adjustment motor by a coupling. The top optical shaft fixing seat is installed on four sets of fixing seat mounting holes evenly distributed around the circumference of the top plate by bolts. The lead screw support nut is fixedly connected to the lead screw by thread to realize the synchronous rotation of the lead screw support nut and the lead screw. The thrust ball bearing is installed in the bearing seat of the top cover. The lead screw support nut and the thrust ball bearing bear the axial load of the lead screw.
[0012] As an embodiment of the present invention, the bottom support mechanism includes a bottom plate fixing bracket, a bottom plate, a bottom end bearing seat, a bottom end optical axis fixing seat, an optical axis, a bottom cover, and a lead screw bearing;
[0013] The base plate fixing bracket is installed on the bracket by T-nuts. The base plate is connected to the four mounting holes at the four corners of the base plate by the base plate fixing bracket and is installed on the bracket by bolts. The four positioning holes around the bottom bearing seat are installed on the base plate by bolts to the four bearing seat mounting holes of the base plate. The bottom optical axis fixing seat is installed on the bottom bearing seat by bolts on the four sets of fixing seat mounting holes evenly distributed around the circumference of the bottom bearing seat. The optical axis is installed in the optical axis fixing blind hole of the base plate and is positioned by the top optical axis fixing seat. The bottom cover passes through the optical axis and covers the bottom bearing seat. The lead screw bearing is installed on the bearing seat hole of the bottom bearing seat to make the lead screw centered and ensure the verticality of the lead screw.
[0014] As an embodiment of the present invention, the central slider mechanism includes a horizontal motor mounting base, a lead screw nut, and a linear bearing;
[0015] The lead screw nut is bolted to the lead screw nut mounting hole at the front end of the horizontal motor mounting base and engages with the lead screw thread. The linear bearing is installed in the bearing seat hole opened on the horizontal motor mounting base and passes through the optical shaft. The horizontal motor mounting base moves up and down by rotating the lead screw.
[0016] As an embodiment of the present invention, the position control mechanism includes an upper limit switch adjusting bolt, an upper limit switch fixing nut, an upper limit switch fixing piece, an upper limit switch, a lower limit switch adjusting bolt, a lower limit switch fixing nut, a lower limit switch fixing piece, and a lower limit switch;
[0017] The upper limit switch fixing nut is bolted into the fixing nut mounting hole in the top plate. The upper limit switch adjusting bolt is threaded into the upper limit switch fixing nut. The upper limit switch fixing plate is mounted on the upper limit switch adjusting bolt. The upper limit switch is mounted on the upper limit switch fixing plate. The lower limit switch fixing nut is bolted into the fixing nut mounting hole in the bottom bearing seat. The lower limit switch adjusting bolt is threaded into the lower limit switch fixing nut. The lower limit switch fixing plate is mounted on the lower limit switch adjusting bolt through its blind mounting hole. The lower limit switch is mounted on the lower limit switch fixing plate.
[0018] As an embodiment of the present invention, the horizontal position adjustment mechanism includes a horizontal position adjustment motor, an extension arm, a small pulley, a double pulley, a double pulley fixing bolt, a double pulley fixing nut, a double pulley radial bearing, a lower radial bearing, a large pulley, a large pulley axial bearing, a large pulley radial bearing, an output connector, an output connector axial bearing, a connecting bolt, a timing belt one, a timing belt two, and an extension arm cover.
[0019] The horizontal position adjustment motor is mounted on the motor mounting hole of the horizontal motor mounting base. The small pulley is mounted on the output shaft of the horizontal position adjustment motor through the fastening bolts on it. The extension arm is mounted on the extension arm mounting hole of the horizontal motor mounting base through the mounting hole at its end. The double pulley radial bearing is mounted in the bearing seat hole in the middle of the extension arm. The lower radial bearing is mounted in the bearing seat hole in the middle of the bottom surface of the extension arm. The double pulley fixing bolt is mounted in the inner ring of the double pulley radial bearing and the lower radial bearing. The double pulley is fixed by the threaded engagement between the double pulley fixing bolt and the double pulley fixing nut. The large pulley radial bearing is mounted in the bearing seat hole at the inner end of the extension arm. The large pulley, the large pulley axial bearing, the output connector, and the output connector axial bearing are fixed by connecting bolts.
[0020] As an embodiment of the present invention, the pipette dosing control mechanism includes a support plate, a dosing control motor, a connecting rod, a coupling, a lead screw nut, a lead screw, an optical axis fixing seat, an optical axis, a linear bearing, a pressure plate, a pipette circumferential fixing block, a pipette axial fixing, a pressure plate upper limit switch, a pressure plate lower limit switch, and a pipette.
[0021] The support plate is fixed to the connection hole of the output connector by bolts and fixing holes. The dosing control motor is installed in the motor mounting hole of the support plate. The connecting rod is installed in the connecting rod mounting hole by bolts. The coupling is fixed to the output shaft of the dosing control motor for connecting the output shaft and the lead screw. The lead screw nut is installed in the lead screw nut mounting hole of the pressure plate. The lead screw and lead screw nut are threaded together and aligned by the lead screw guide hole of the pipette circumferential fixing block. The optical axis fixing seat is installed in the fixing seat mounting hole by bolts. The optical axis is fixed by the optical axis fixing seat and the optical axis guide hole on the pipette circumferential fixing block. The linear bearing is installed in the bearing mounting hole of the pressure plate. The pipette circumferential fixing block is installed in the middle hole of the connecting rod by bolts. The axial fixing of the pipette is installed in the bottom hole of the connecting rod by bolts. The lower limit switch of the pressure plate is installed in the lower limit switch mounting hole of the connecting rod by bolts. The upper limit switch of the pressure plate is installed in the upper limit switch mounting hole of the connecting rod by bolts.
[0022] As one embodiment of the present invention, the bracket includes a top support portion, a middle support portion, and a bottom support portion;
[0023] The top support section supports the top drive mechanism in the height position adjustment mechanism, the middle support section supports the bottom support mechanism in the height position adjustment mechanism, and the bottom support section supports all parts of the automatic dosing device and has a housing for placing the main control device.
[0024] As an embodiment of the present invention, the temperature control device includes a heating table, a temperature controller, and a temperature sensor;
[0025] The temperature controller uses a temperature sensor to detect the temperature in the reaction vessel to control the operation and shutdown of the heating platform.
[0026] The main control unit includes a main control board, a touch screen, a timing module, and a motor control module;
[0027] The main control board communicates with the temperature controller to set and read the temperature, controls the reaction time through the timing module, controls the height adjustment motor, the horizontal adjustment motor, and the dosing control motor through the motor control module, controls the movement limit of the horizontal motor fixing seat through the upper and lower limit switches, controls the movement limit of the pressure plate through the upper and lower limit switches of the pressure plate, and communicates with the touch screen to set initial parameters such as process route, dosing times, and motor position, start and stop the preparation process, and display the process in real time.
[0028] The beneficial effects of this invention are as follows: When using the automated electroplating platform of this invention, two beakers containing reducing agent 1 and reducing agent 2 are placed on stations 1 and 2 respectively, and a heating platform is placed on station 3, with the reaction vessel placed on the heating platform. The position of the horizontal motor mounting bracket is adjusted via the touchscreen, and the positions of the upper and lower limit switches are adjusted by rotating the upper and lower limit switch adjusting bolts. The process route and the number of chemical additions are set on the touchscreen, and then the reaction is started via the touchscreen control. After receiving serial port commands from the touchscreen, the main control board controls the temperature controller via the RS485 interface using the Modbus-RTU protocol to set the reaction temperature. Once the container temperature reaches the set temperature, the board controls the dosing motor, which in turn moves the pressure plate to its lower limit switch to purge air from the two pipettes. The stepper motor driver then controls the height control stepper motor, which in turn moves the horizontal motor mount to its lower limit switch. The pressure plate moves to its upper limit switch, controlling the two pipettes to draw in reducing agents 1 and 2. Afterward, the horizontal motor mount moves to its upper limit, and the horizontal position control motor begins to rotate the two pipettes to the top of the reaction container. The pressure plate then moves to its lower limit to add the two reducing agents. This process is repeated multiple times, the number of times set by the touchscreen. Finally, the horizontal motor mount moves to its upper limit. After the reducing agents are added, the main control board controls the DS3231 timing module via the I2C protocol to control the reaction time. During the reaction, the main control board sends serial port commands to the touchscreen for real-time display of the process steps. Attached Figure Description
[0029] Figure 1 A schematic diagram of the IPMC automated chemical plating platform;
[0030] Figure 2 A three-dimensional view of an automatic dosing device;
[0031] Figure 3 Exploded view of the top drive mechanism assembly;
[0032] Figure 4 for Figure 3 Schematic diagram of the structure of the top cover;
[0033] Figure 5 for Figure 3 Schematic diagram of the top slab structure;
[0034] Figure 6 An exploded view of the assembly of the central slider mechanism;
[0035] Figure 7 for Figure 6 Schematic diagram of the structure of the horizontal motor mounting base;
[0036] Figure 8 Exploded view of the bottom support mechanism assembly;
[0037] Figure 9 for Figure 8 Schematic diagram of the structure of the bottom bearing housing;
[0038] Figure 10 for Figure 8 Schematic diagram of the midsole plate;
[0039] Figure 11 An exploded view of the horizontal position adjustment mechanism assembly;
[0040] Figure 12 for Figure 11 Schematic diagram of the extended arm structure;
[0041] Figure 13 A three-dimensional view of the pipette dosing control mechanism;
[0042] Figure 14 for Figure 13 Schematic diagram of the middle support plate;
[0043] Figure 15 for Figure 13 Schematic diagram of the middle connecting rod;
[0044] Figure 16 for Figure 13 Schematic diagram of the intermediate pressure plate;
[0045] Figure 17 This is a schematic diagram of the overall control framework;
[0046] Figure 18 This is a schematic diagram of the workstation layout. Detailed Implementation
[0047] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.
[0048] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this invention should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0049] like Figure 1 As shown, an automated electroless plating platform for IPMC electroless plating includes an automatic dosing device 1, a temperature control device 2, and a main control device 3. The automatic dosing device 1 controls the height and horizontal position of the pipette and controls the pipette's absorption and addition of the reducing agent. The temperature control device 2 controls the reaction temperature and stirring rate. The main control device 3 realizes the coordinated control of temperature, reducing agent addition, and time in the electroless plating process, and displays the initial parameters and process flow through the display screen.
[0050] like Figure 3 , Figure 8 and Figure 9As shown, the top drive mechanism 1-1-1 includes a top plate 1-1-1-1, a top plate fixing bracket 1-1-1-2, a top cover 1-1-1-3, a height position adjustment motor 1-1-1-4, a lead screw 1-1-1-5, a coupling 1-1-1-6, a top optical shaft fixing seat 1-1-1-7, a lead screw support nut 1-1-1-8, and a thrust ball bearing 1-1-1-9. The top plate fixing bracket 1-1-1-2 is installed on the bracket 1-4 using T-nuts. The top plate 1-1-1-1 is fixedly connected to the bracket 1-4 via the top plate fixing bracket 1-1-1-2. The top plate 1-1-1-1 is also fixedly connected to the top plate fixing bracket via bolts through the four mounting holes 1-1-1-1-1 at the four corners of the top plate 1-1-1-1. The top cover 1-1-1-3 is installed on the five top cover mounting holes 1-1-1-1-2 of the top plate 1-1-1-1 using mounting nuts in its internal groove 1-1-1-3-1. The height position adjustment motor 1-1-1-4 is installed on the four motor mounting holes 1-1-1-1-3 at the front end of the top plate via bolts. On the top, the lead screw 1-1-1-5 is connected to the output shaft of the height position adjustment motor 1-1-1-4 via the coupling 1-1-1-6. The top optical shaft fixing seat 1-1-1-7 is bolted onto four sets of fixing seat mounting holes 1-1-1-1-4 evenly distributed around the circumference of the top plate. The lead screw support nut 1-1-1-8 is fixedly connected to the lead screw 1-1-1-5 via threaded engagement to achieve synchronous rotation of the lead screw support nut and the lead screw. The thrust ball bearing 1-1-1-9 is installed in the bearing seat 1-1-1-3-2 of the top cover. The lead screw support nut 1-1-1-8 and the thrust ball bearing 1-1-1-9 bear the axial load of the lead screw.
[0051] like Figure 5 , Figure 11 and Figure 12As shown, the bottom support mechanism includes a base plate fixing bracket 1-1-2-1, a base plate 1-1-2-2, a bottom bearing seat 1-1-2-3, a bottom optical axis fixing seat 1-1-2-4, an optical axis 1-1-2-5, a bottom cover 1-1-2-6, and a lead screw bearing 1-1-2-7. The base plate fixing bracket 1-1-2-1 is mounted on the bracket 1-4 using T-nuts. The base plate 1-1-2-2 is connected to the four mounting holes 1-1-2-2-1 at the four corners of the base plate via the base plate fixing bracket 1-1-2-1, and is bolted to the bracket 1-4. The bottom bearing seat 1-1-2-3 is bolted to the base plate via its four positioning holes 1-1-2-3-1 and the four bearing seat mounting holes 1-1-2-2-2 on the base plate. The bottom optical axis fixing seat 1-1-2-4... 4. The optical axis 1-1-2-3-2 is installed on the four sets of mounting holes 1-1-2-3-2 evenly distributed around the circumference of the bottom bearing seat by bolts. The optical axis 1-1-2-5 is installed in the optical axis fixing blind hole 1-1-2-2-3 on the bottom plate and positioned by the top optical axis fixing seat 1-1-1-7. The bottom cover 1-1-2-6 passes through the optical axis and covers the bottom bearing seat 1-1-2-3. The lead screw bearing 1-1-2-7 is installed on the bearing seat hole 1-1-2-3-3 of the bottom bearing seat to make the lead screw centered and ensure the verticality of the lead screw.
[0052] like Figure 4 and Figure 10 As shown, the central slider mechanism includes a horizontal motor mounting base 1-1-3-1, a lead screw nut 1-1-3-2, and a linear bearing 1-1-3-3. The lead screw nut 1-1-3-2 is bolted onto the lead screw nut mounting hole 1-1-3-1-1 at the upper front end of the horizontal motor mounting base and is threaded into the lead screw 1-1-1-5. The linear bearing 1-1-3-3 is installed in the bearing seat hole 1-1-3-1-2 of the horizontal motor mounting base and passes through the optical shaft 1-1-2-5. The horizontal motor mounting base 1-1-3-1 moves up and down through the rotation of the lead screw 1-1-1-5.
[0053] like Figure 3 and Figure 5As shown, the position control mechanism includes an upper limit switch adjusting bolt 1-1-4-1, an upper limit switch fixing nut 1-1-4-2, an upper limit switch fixing piece 1-1-4-3, an upper limit switch 1-1-4-4, a lower limit switch adjusting bolt 1-1-4-5, a lower limit switch fixing nut 1-1-4-6, a lower limit switch fixing piece 1-1-4-7, and a lower limit switch 1-1-4-8. The upper limit switch fixing nut 1-1-4-2 is bolted onto the fixing nut mounting hole 1-1-1-1-5 on the top plate. The upper limit switch adjusting bolt 1-1-4-1 is threaded onto the upper limit switch fixing nut 1-1-4-2. The upper limit switch fixing plate is mounted on the upper limit switch adjusting bolt 1-1-4-1. The upper limit switch 1-1-4-4 is mounted on the upper limit switch fixing plate. The lower limit switch fixing nut 1-1-4-6 is bolted onto the fixing nut mounting hole 1-1-2-3-4 on the bottom bearing seat. The lower limit switch adjusting bolt 1-1-4-5 is threaded onto the lower limit switch fixing nut 1-1-4-6. The lower limit switch fixing plate 1-1-4-7 is mounted on the lower limit switch adjusting bolt 1-1-4-5 through its blind mounting hole 1-1-4-7-1. The lower limit switch 1-1-4-8 is mounted on the lower limit switch fixing plate.
[0054] like Figure 4 , Figure 6 , Figure 10 and Figure 13As shown, the horizontal position adjustment mechanism includes a horizontal position adjustment motor 1-2-1, an extension arm 1-2-2, a small pulley 1-2-3, a double pulley 1-2-4, a double pulley fixing bolt 1-2-5, a double pulley fixing nut 1-2-6, a double pulley radial bearing 1-2-7, a lower radial bearing 1-2-8, a large pulley 1-2-9, a large pulley axial bearing 1-2-10, a large pulley radial bearing 1-2-11, an output connector 1-2-12, an output connector axial bearing 1-2-13, a connecting bolt 1-2-14, a synchronous belt 11-2-15, a synchronous belt 21-2-16, and an extension arm cover 1-2-17. The horizontal position adjusting motor 1-2-1 is mounted on the motor mounting hole 1-1-3-1-3 of the horizontal motor mounting base. The small pulley 1-2-2 is mounted on the output shaft of the horizontal position adjusting motor 1-2-1 by fastening bolts. The extension arm 1-2-2 is mounted on the extension arm mounting hole 1-1-3-1-4 of the horizontal motor mounting base through the mounting hole 1-2-2-1 at its end. The double pulley radial bearing 1-2-7 is mounted in the bearing seat hole 1-2-2-2 in the middle of the extension arm. The lower radial bearing 1-2-8 is mounted in the bearing seat hole 1-2-2-3 in the middle of the bottom surface of the extension arm. In this configuration, the double pulley fixing bolt 1-2-5 is installed in the inner rings of the double pulley radial bearing 1-2-7 and the lower radial bearing 1-2-8. The double pulley 1-2-4 is fixed by the threaded engagement between the double pulley fixing bolt 1-2-5 and the double pulley fixing nut 1-2-6. The large pulley radial bearing 1-2-11 is installed in the bearing seat hole 1-2-2-4 at the inner end of the extended arm. The large pulley 1-2-9, the large pulley axial bearing 1-2-10, the output connector 1-2-12, and the output connector axial bearing 1-2-13 are fixed by the connecting bolt 1-2-14. The output shaft of the horizontal position adjusting motor 1-2-1 drives the small pulley 1-2-2 to rotate, which in turn drives the double pulley 1-2-4 to rotate, thereby driving the large pulley 1-2-9 and the output connector 1-2-12 to rotate, ultimately achieving the adjustment of the pipette's horizontal position.
[0055] like Figure 7 , Figure 14 , Figure 15 and Figure 16As shown, the pipette dosing control mechanism includes a support plate 1-3-1, a dosing control motor 1-3-2, a connecting rod 1-3-3, a coupling 1-3-4, a lead screw nut 1-3-5, a lead screw 1-3-6, a shaft fixing seat 1-3-7, a shaft 1-3-8, a linear bearing 1-3-9, a pressure plate 1-3-10, a pipette circumferential fixing 1-3-11, a pipette axial fixing 1-3-12, a pressure plate upper limit switch 1-3-13, a pressure plate lower limit switch 1-3-14, and a pipette 1-3-15. Support plate 1-3-1 is fixed to connection hole 1-2-12-1 of output connector 1-2-12 by bolts and fixing hole 1-3-1-1. Dosing control motor 1-3-2 is installed in motor mounting hole 1-3-1-2 of support plate. Connecting rod 1-3-3 is installed in connecting rod mounting hole 1-3-1-3 by bolts. Coupling 1-3-4 is fixed to output shaft of dosing control motor 1-3-2 for connection of output shaft and lead screw. Lead screw nut 1-3-5 is installed in lead screw nut mounting hole 1-3-10-1 of pressure plate. Lead screw 1-3-6 is threaded with lead screw nut 1-3-5 and is aligned by lead screw guide hole 1-3-11-1 circumferentially fixed to pipette. Optical shaft fixing seat 1-3-7 The optical axis 1-3-8 is fixed to the mounting hole 1-3-1-4 of the fixed base by bolts. The optical axis 1-3-8 is fixed to the optical axis guide hole 1-3-11-2 on the optical axis fixed base 1-3-7 and the circumferential fixed base of the pipette. The linear bearing 1-3-9 is installed in the bearing mounting hole 1-3-10-2 of the pressure plate. The circumferential fixed base 1-3-11 of the pipette is fixed to the middle hole 1-3-3-1 of the connecting rod by bolts. The axial fixed base 1-3-12 of the pipette is fixed to the bottom hole 1-3-3-2 of the connecting rod by bolts. The lower limit switch 1-3-14 of the pressure plate is fixed to the lower limit switch mounting hole 1-3-3-3 of the connecting rod by bolts. The upper limit switch 1-3-13 of the pressure plate is fixed to the upper limit switch mounting hole 1-3-3-4 of the connecting rod by bolts. The output shaft of the dosing control motor 1-3-11 rotates, which drives the lead screw 1-3-6 to rotate. Through the lead screw nut 1-3-5, the pressure plate 1-3-10 performs linear reciprocating motion, realizing the pressing and releasing of the pipette button.
[0056] like Figure 2 As shown, the bracket includes a top support portion 1-4-1, a middle support portion 1-4-2, and a bottom support portion 1-4-3. The top support portion supports the top drive mechanism 1-1-1 in the height position adjustment mechanism, the middle support portion supports the bottom support mechanism 1-1-2 in the height position adjustment mechanism, and the bottom support portion supports all parts of the automatic dosing device and has a housing for placing the main control device.
[0057] like Figure 1As shown, the temperature control device includes a heating platform 2-1, a temperature controller 2-2, and a temperature sensor 2-3. The temperature controller 2-2 controls the operation and shutdown of the heating platform 2-1 by detecting the temperature in the reaction vessel through the temperature sensor 2-3.
[0058] like Figure 1 As shown, the main control device includes a main control board 3-1, a touch screen 3-2, a timing module 3-3, and a motor control module 3-4. The main control board 3-1 can communicate with the temperature controller 2-2 to set and read the temperature; the timing module 3-3 controls the reaction time; the motor control module 3-4 controls the height adjustment motor 1-1-1-4, the horizontal position adjustment motor 1-2-1, and the dosing control motor 1-3-2; the upper limit switch 1-1-4-4 and the lower limit switch 1-1-4-8 control the movement limit of the horizontal motor mounting base 1-1-3-1; and the upper limit switch 1-3-13 and the lower limit switch 1-3-14 control the movement limit of the pressure plate 1-3-10. It also communicates with the touch screen 3-2 to set initial parameters such as the process route, the number of dosing cycles, and the motor position, as well as to start and stop the preparation process and display the process in real time.
[0059] When using the automated electroplating platform of the present invention, as follows: Figure 17 and Figure 18 As shown, two beakers containing reducing agent 1 and reducing agent 2 are placed on stations 1 and 2 respectively. The heating platform is placed on station 3, and the reaction vessel is placed on the heating platform. The position of the horizontal motor mounting bracket is adjusted via the touchscreen, and the positions of the upper and lower limit switches are adjusted by rotating the upper and lower limit switch adjusting bolts. The process route and the number of chemical additions are set on the touchscreen, and then the reaction is started via the touchscreen control. After receiving serial port commands from the touchscreen, the main control board controls the temperature controller via the RS485 interface using the Modbus-RTU protocol to set the reaction temperature. Once the container temperature reaches the set temperature, the board controls the dosing motor, which in turn moves the pressure plate to its lower limit switch to purge air from the two pipettes. The stepper motor driver then controls the height control stepper motor, which in turn moves the horizontal motor mount to its lower limit switch. The pressure plate moves to its upper limit switch, controlling the two pipettes to draw in reducing agents 1 and 2. Afterward, the horizontal motor mount moves to its upper limit, and the horizontal position control motor begins to rotate the two pipettes to the top of the reaction container. The pressure plate then moves to its lower limit to add the two reducing agents. This process is repeated multiple times, the number of times set by the touchscreen. Finally, the horizontal motor mount moves to its upper limit. After the reducing agents are added, the main control board controls the DS3231 timing module via the I2C protocol to control the reaction time. During the reaction, the main control board sends serial port commands to the touchscreen for real-time display of the process steps.
[0060] Preferably, the main control chip of the main control board is an STM32F407ZGT6.
[0061] Preferably, the height position adjustment motor, the horizontal position adjustment motor, and the dosing control motor are stepper motors.
[0062] Preferably, the timing module is a DS3231, which communicates with the main control board via the I2C protocol.
[0063] Preferably, the communication protocol between the temperature controller and the main control board uses an RS485 interface equipped with the Modbus-RTU protocol.
[0064] Preferably, the touch screen is a serial port screen, which enables serial communication with the main control board.
[0065] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.
[0066] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure (including the claims) is limited to these examples; within the framework of this invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in the details for the sake of brevity.
[0067] The embodiments of this invention are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the scope of protection of this invention.
Claims
1. An automated chemical plating platform for IPMC electroless plating process, comprising an automatic chemical dosing device (1), a temperature control device (2), and a main control device (3), characterized in that, The automatic dosing device includes a height position adjustment mechanism (1-1), a horizontal position adjustment mechanism (1-2), a pipette dosing control mechanism (1-3), and a support (1-4). The height adjustment mechanism (1-1) is located at the top of the bracket (1-4) to adjust the height of the pipette dosing control mechanism (1-3); The horizontal position adjustment mechanism (1-2) is located in the middle section of the support (1-4) to adjust the position of the pipette dosing control mechanism (1-3); The height position adjustment mechanism (1-1) includes a top drive mechanism (1-1-1), a bottom support mechanism (1-1-2), a middle slider mechanism (1-1-3), and a position control mechanism (1-1-4). The top drive mechanism (1-1-1) includes a top plate (1-1-1-1), a top plate fixing bracket (1-1-1-2), a top cover (1-1-1-3), a height position adjustment motor (1-1-1-4), a lead screw (1-1-1-5), a coupling (1-1-1-6), a top optical shaft fixing seat (1-1-1-7), a lead screw support nut (1-1-1-8), and a thrust ball bearing (1-1-1-9). The bottom support mechanism (1-1-2) includes a bottom plate fixing bracket (1-1-2-1), a bottom plate (1-1-2-2), a bottom end bearing seat (1-1-2-3), a bottom end optical axis fixing seat (1-1-2-4), an optical axis (1-1-2-5), a bottom cover (1-1-2-6), and a lead screw bearing (1-1-2-7). The middle slider mechanism (1-1-3) includes a horizontal motor mounting base (1-1-3-1), a lead screw nut (1-1-3-2), and a linear bearing (1-1-3-3). The position control mechanism (1-1-4) includes an upper limit switch adjusting bolt (1-1-4-1), an upper limit switch fixing nut (1-1-4-2), an upper limit switch fixing piece (1-1-4-3), an upper limit switch (1-1-4-4), a lower limit switch adjusting bolt (1-1-4-5), a lower limit switch fixing nut (1-1-4-6), a lower limit switch fixing piece (1-1-4-7), and a lower limit switch (1-1-4-8). The horizontal position adjustment mechanism (1-2) includes a horizontal position adjustment motor (1-2-1), an extension arm (1-2-2), a small pulley (1-2-3), a double pulley (1-2-4), a double pulley fixing bolt (1-2-5), a double pulley fixing nut (1-2-6), a double pulley radial bearing (1-2-7), a lower radial bearing (1-2-8), a large pulley (1-2-9), a large pulley axial bearing (1-2-10), a large pulley radial bearing (1-2-11), an output connector (1-2-12), an output connector axial bearing (1-2-13), a connecting bolt (1-2-14), a timing belt one (1-2-15), a timing belt two (1-2-16), and an extension arm cover (1-2-17). The pipette dosing control mechanism includes a support plate (1-3-1), a dosing control motor (1-3-2), a connecting rod (1-3-3), a coupling (1-3-4), a lead screw nut (1-3-5), a lead screw (1-3-6), a shaft fixing seat (1-3-7), a shaft (1-3-8), a linear bearing (1-3-9), a pressure plate (1-3-10), a pipette circumferential fixing block (1-3-11), a pipette axial fixing (1-3-12), a pressure plate upper limit switch (1-3-13), a pressure plate lower limit switch (1-3-14), and a pipette (1-3-15).
2. The automated electroless plating platform for IPMC electroless plating process according to claim 1, characterized in that, The top plate fixing bracket (1-1-1-2) is installed on the bracket (1-4) by T-nuts. The top plate (1-1-1-1) is fixedly connected to the bracket (1-4) by the top plate fixing bracket (1-1-1-2). The four mounting holes (1-1-1-1-1) at the four corners of the top plate (1-1-1-1) are fixedly connected to the top plate fixing bracket by bolts. The top cover (1-1-1-3) is installed on the five top cover mounting holes (1-1-1-1-2) of the top plate (1-1-1-1) by mounting nuts in its internal groove (1-1-1-3-1). The height position adjustment motor (1-1-1-4) is installed on the four motor mounting holes (1-1-1-1-2) at the front end of the top plate by bolts. 3) The lead screw (1-1-1-5) is connected to the output shaft of the height position adjustment motor (1-1-1-4) through a coupling (1-1-1-6). The top optical shaft fixing seat (1-1-1-7) is bolted to four sets of fixing seat mounting holes (1-1-1-1-4) evenly distributed around the circumference of the top plate. The lead screw support nut (1-1-1-8) is fixedly connected to the lead screw (1-1-1-5) through threaded connection to achieve synchronous rotation of the lead screw support nut and the lead screw. The thrust ball bearing (1-1-1-9) is installed in the bearing seat (1-1-1-3-2) of the top cover. The lead screw support nut (1-1-1-8) and the thrust ball bearing (1-1-1-9) bear the axial load of the lead screw.
3. An automated electroless plating platform for IPMC electroless plating process according to claim 2, characterized in that, The base plate fixing bracket (1-1-2-1) is installed on the bracket (1-4) by T-nuts. The base plate (1-1-2-2) is connected to the four mounting holes (1-1-2-2-1) at the four corners of the base plate by the base plate fixing bracket (1-1-2-1) and is installed on the bracket (1-4) by bolts. The four positioning holes (1-1-2-3-1) around the bottom bearing seat (1-1-2-3) are installed on the base plate (1-1-2-2) by bolts to the four bearing seat mounting holes (1-1-2-2-2) on the base plate. The bottom optical axis fixing seat (1-1-2- 4) The optical axis (1-1-2-3-2) is installed on the four sets of mounting holes (1-1-2-3-2) evenly distributed around the circumference of the bottom bearing seat by bolts. The optical axis (1-1-2-5) is installed in the optical axis fixing blind hole (1-1-2-2-3) on the bottom plate and positioned by the top optical axis fixing seat (1-1-1-7). The bottom cover (1-1-2-6) passes through the optical axis and covers the bottom bearing seat (1-1-2-3). The lead screw bearing (1-1-2-7) is installed on the bearing seat hole (1-1-2-3-3) of the bottom bearing seat (1-1-2-3) to make the lead screw centered and ensure the verticality of the lead screw.
4. An automated electroless plating platform for IPMC electroless plating process according to claim 3, characterized in that, The lead screw nut (1-1-3-2) is bolted onto the lead screw nut mounting hole (1-1-3-1-1) at the front end of the horizontal motor mounting base (1-1-3-1) and threaded into the lead screw (1-1-1-5). The linear bearing (1-1-3-3) is installed in the bearing seat hole (1-1-3-1-2) on the horizontal motor mounting base (1-1-3-1) and passes through the optical shaft (1-1-2-5). The horizontal motor mounting base (1-1-3-1) moves up and down by rotating the lead screw (1-1-1-5).
5. An automated electroless plating platform for IPMC electroless plating process according to claim 4, characterized in that, The upper limit switch fixing nut (1-1-4-2) is bolted into the fixing nut mounting hole (1-1-1-1-5) on the top plate. The upper limit switch adjusting bolt (1-1-4-1) is threaded into the upper limit switch fixing nut (1-1-4-2). The upper limit switch fixing plate is mounted on the upper limit switch adjusting bolt (1-1-4-1). The upper limit switch (1-1-4-4) is mounted on the upper limit switch fixing plate (1-1-4-3). The lower limit switch fixing nut (1-1... -4-6) is installed on the fixing nut mounting hole (1-1-2-3-4) of the bottom bearing seat (1-1-2-3) by bolts. The lower limit switch adjusting bolt (1-1-4-5) is installed in the lower limit switch fixing nut (1-1-4-6) by thread engagement. The lower limit switch fixing plate (1-1-4-7) is installed on the lower limit switch adjusting bolt (1-1-4-5) through its mounting blind hole (1-1-4-7-1). The lower limit switch (1-1-4-8) is installed on the lower limit switch fixing plate.
6. An automated electroless plating platform for IPMC electroless plating process according to claim 1, characterized in that, The horizontal position adjusting motor (1-2-1) is mounted on the motor mounting hole (1-1-3-1-3) of the horizontal motor mounting base. The small pulley (1-2-3) is mounted on the output shaft of the horizontal position adjusting motor (1-2-1) by fastening bolts. The extension arm (1-2-2) is mounted on the extension arm mounting hole (1-1-3-1-4) of the horizontal motor mounting base through the mounting hole (1-2-2-1) at its end. The double pulley radial bearing (1-2-7) is installed in the bearing seat hole (1-2-2-2) in the middle of the extension arm. The lower radial bearing (1-2-8) is installed in the bearing seat hole (1-2-2-3) in the middle of the bottom surface of the extension arm. The connecting pulley fixing bolt (1-2-5) is installed in the inner ring of the double-pulley radial bearing (1-2-7) and the lower radial bearing (1-2-8). The double pulley (1-2-4) is fixed by the threaded engagement between the double-pulley fixing bolt (1-2-5) and the double-pulley fixing nut (1-2-6). The large pulley radial bearing (1-2-11) is installed in the bearing seat hole (1-2-2-4) at the inner end of the extended arm. The large pulley (1-2-9), the large pulley axial bearing (1-2-10), the output connector (1-2-12), and the output connector axial bearing (1-2-13) are fixed by the connecting bolt (1-2-14).
7. An automated electroless plating platform for IPMC electroless plating process according to claim 6, characterized in that, The support plate (1-3-1) is fixed to the connection hole (1-2-12-1) of the output connector (1-2-12) by bolts and fixing holes (1-3-1-1). The dosing control motor (1-3-2) is installed on the motor mounting hole (1-3-1-2) of the support plate. The connecting rod (1-3-3) is installed on the connecting rod mounting hole (1-3-1-3) by bolts. The coupling (1-3-4) is fixed on the output shaft of the dosing control motor (1-3-2) for connecting the output shaft and the lead screw. The lead screw nut (1-3-5) is installed on the lead screw nut mounting hole (1-3-10-1) of the pressure plate. The lead screw (1-3-6) and the lead screw nut (1-3-5) are threaded together and aligned through the lead screw guide hole (1-3-11-1) of the pipette circumferential fixing block (1-3-11). The optical shaft fixing seat (1-3- 7) The optical axis (1-3-8) is fixed on the mounting hole (1-3-1-4) of the fixed seat by bolts. The optical axis (1-3-8) is fixed by the optical axis fixed seat (1-3-7) and the optical axis guide hole (1-3-11-2) on the pipette circumferential fixing block (1-3-11). The linear bearing (1-3-9) is installed in the bearing mounting hole (1-3-10-2) of the pressure plate. The pipette circumferential fixing block (1-3-11) is installed on the middle hole (1-3-3-1) of the connecting rod by bolts. The pipette axial fixing (1-3-12) is installed on the bottom hole (1-3-3-2) of the connecting rod by bolts. The lower limit switch (1-3-14) of the pressure plate is installed on the lower limit switch mounting hole (1-3-3-3) of the connecting rod by bolts. The upper limit switch (1-3-13) of the pressure plate is installed on the upper limit switch mounting hole (1-3-3-4) of the connecting rod by bolts.
8. An automated electroless plating platform for IPMC electroless plating process according to claim 7, characterized in that, The bracket includes a top support portion (1-4-1), a middle support portion (1-4-2), and a bottom support portion (1-4-3). The top support part (1-4-1) supports the top drive mechanism (1-1-1) in the height position adjustment mechanism, the middle support part supports the bottom support mechanism (1-1-2) in the height position adjustment mechanism, and the bottom support part supports all parts of the automatic dosing device and has a housing for placing the main control device.
9. An automated electroless plating platform for IPMC electroless plating process according to claim 8, characterized in that, The temperature control device includes a heating table (2-1), a temperature controller (2-2), and a temperature sensor (2-3). The temperature controller (2-2) detects the temperature in the reaction vessel through the temperature sensor (2-3) to control the operation and shutdown of the heating platform (2-1).
10. An automated electroless plating platform for IPMC electroless plating process according to claim 9, characterized in that, The main control unit includes a main control board (3-1), a touch screen (3-2), a timing module (3-3), and a motor control module (3-4). The main control board (3-1) communicates with the temperature controller (2-2) to set and read the temperature, controls the reaction time through the timing module (3-3), controls the height position adjustment motor (1-1-1-4), the horizontal position adjustment motor (1-2-1) and the dosing control motor (1-3-2) through the motor control module (3-4), controls the movement limit of the horizontal motor fixing seat (1-1-3-1) through the upper limit switch (1-1-4-4) and the lower limit switch (1-1-4-8), controls the movement limit of the pressure plate (1-3-10) through the upper limit switch (1-3-13) and the lower limit switch (1-3-14), and communicates with the touch screen (3-2) to set the process route, the number of dosing times, the initial parameters of the motor position, start and stop of the preparation process, and display the process in real time.
Citation Information
Patent Citations
System and method for electroplating of hole surfaces
US20150191844A1