Integrated wafer debonding and cleaning apparatus and debonding and cleaning method

Abstract

The application provides an integrated wafer debonding and cleaning device and a debonding and cleaning method. The integrated wafer debonding and cleaning device comprises an input port, a debonding module, a wafer cleaning device and a conveying device. The input port is configured to input a substrate to be processed into the interior of the integrated wafer debonding and cleaning device. The substrate to be processed comprises a bonded wafer and a carrier plate. The debonding module is configured to debond the substrate to be processed and separate the wafer and the carrier plate from each other. The wafer cleaning device is configured to clean the wafer. The conveying device is configured to convey the substrate to be processed, the wafer and the carrier plate. The conveying device operates between the input port, the debonding module and the wafer cleaning device. The application integrates the debonding module and the wafer cleaning module in the same device to form a continuous process.

Description

TECHNICAL FIELD

[0001] The present application relates to a wafer debonding device, and in particular to an integrated wafer debonding and cleaning device and method. BACKGROUND

[0002] With the development of consumer electronics, such as 5G communication, CPU / GPU, etc. high-level chips are developing towards high frequency, high speed, multi-function, high performance, small size and high reliability. In order to meet the requirements of chip miniaturization, multi-function and intelligentization, the development of Moore's law has reached the physical limit. Packaging technology will play an important role in the development of integrated circuit chips. The development of advanced packaging technology mainly focuses on 3D-IC stacked packaging, which not only reduces the size of the package, but also improves the performance of the circuit, reduces parasitic effects and time delay. Currently, integrated circuits have two important features: one is that the front-end IC manufacturing is close to the physical limit, and Moore's law is developing slowly; the other is the diversification of microelectronic products, such as mobile computing and cloud data centers, Internet of Things, artificial intelligence, 5G communication, etc.

[0003] In order to meet the requirements of integrated circuit multi-function and product thinning, and to promote the development of 3D-IC, system-level packaging, heterogeneous integration and other new technologies, wafer thinning and thin wafer holding technology become more and more important. Therefore, temporary bonding and debonding technology has become a key process in advanced manufacturing and packaging. With the shrinking of chip size in advanced packaging, the wafer is getting thinner and thinner, and when the wafer thickness is less than 200μm, warpage and even chip breakage phenomenon may occur. SUMMARY

[0004] In order to solve the problems of the prior art, the purpose of the present application is to provide an integrated wafer debonding and cleaning device and method, which integrates the debonding module and the wafer cleaning module in the same device to form a continuous process.

[0005] To achieve the above object, the present application provides an integrated wafer debonding and cleaning device, comprising: an input port configured to input a substrate to be processed into the interior of the integrated wafer debonding and cleaning device, wherein the substrate to be processed comprises a bonded wafer and a carrier plate; a debonding module configured to debond the substrate to be processed and separate the wafer and the carrier plate from each other; a wafer cleaning device configured to clean the wafer; a first output port configured to output the cleaned wafer to the outside of the integrated wafer debonding and cleaning device; a second output port configured to output the carrier plate to the outside of the integrated wafer debonding and cleaning device; and a conveying device configured to convey the substrate to be processed, the wafer and the carrier plate, wherein the conveying device operates between the input port, the debonding module, the wafer cleaning device, the first output port and the second output port.

[0006] In some embodiments, the debonding module comprises a moving stage and a debonding area, wherein the debonding module further comprises a debonding device in the debonding area, and when the conveying device places the substrate to be processed on the moving stage and the moving stage is located in the debonding area, the debonding device is configured to debond the substrate to be processed.

[0007] In some embodiments, the debonding module further comprises a first optical detection device in the debonding area, and the first optical detection device is configured to detect the substrate to be processed before debonding the substrate to be processed.

[0008] In some embodiments, when the debonding device debonds the substrate to be processed, the substrate to be processed is arranged between the moving stage and the debonding device, and the carrier plate of the substrate to be processed is located on the side close to the debonding device, and the wafer is located on the side away from the debonding device.

[0009] In some embodiments, the debonding module further comprises a separation area, wherein the moving stage moves between the debonding area and the separation area, and the debonding module further comprises a separation device in the separation area, and when the moving stage moves the debonded substrate to be processed to the separation area, the separation device is configured to separate the carrier plate of the substrate to be processed from the wafer.

[0010] In some embodiments, the debonding module further comprises a second optical detection device in the separation area, and the second optical detection device is configured to detect the carrier plate after the separation device separates the carrier plate from the wafer.

[0011] In some embodiments, the debonding module further comprises a temporary storage area configured to store the separated carrier plate.

[0012] In some embodiments, the wafer cleaning device comprises a first chamber and a second chamber, and the first chamber and the second chamber are respectively configured to clean opposite surfaces of the wafer.

[0013] In some embodiments, the integrated wafer debonding and cleaning apparatus further comprises a positioning device configured to position the center point of the substrate to be processed, and a flipping mechanism configured to flip the substrate to be processed or the wafer.

[0014] The present application provides a wafer debonding and cleaning method, which is applicable to an integrated wafer debonding and cleaning apparatus comprising an input port, a debonding module, a wafer cleaning device, a first output port, a second output port and a conveying device, and wherein the wafer debonding and cleaning method comprises: inputting a substrate to be processed into the interior of the integrated wafer debonding and cleaning apparatus through the input port, wherein the substrate to be processed comprises a wafer and a carrier plate bonded together; conveying the substrate to be processed to the debonding module by the conveying device; debonding the substrate to be processed and separating the wafer and the carrier plate from each other by the debonding module; conveying the separated wafer to the wafer cleaning device by the conveying device; cleaning the wafer by the wafer cleaning device; conveying the cleaned wafer and the carrier plate to the first output port and the second output port, respectively, by the conveying device; and outputting the wafer and the carrier plate from the integrated wafer debonding and cleaning apparatus to the outside by the first output port and the second output port, respectively.

[0015] In some embodiments, the debonding module comprises a moving platform and a debonding area, and in the debonding area, the debonding module further comprises a debonding device, and the wafer debonding and cleaning method comprises: debonding the substrate to be processed by the debonding device when the conveying device places the substrate to be processed on the moving platform and the moving platform is located in the debonding area.

[0016] In some embodiments, in the debonding area, the debonding module further comprises a first optical detection device, and the wafer debonding and cleaning method comprises: detecting the substrate to be processed by the first optical detection device before debonding the substrate to be processed.

[0017] In some embodiments, when the debonding device debonds the substrate to be processed, the substrate to be processed is disposed between the moving stage and the debonding device, and the carrier plate of the substrate to be processed is located on a side close to the debonding device, and the wafer is located on a side away from the debonding device.

[0018] In some embodiments, the debonding module further comprises a separation zone, the moving stage moves between the debonding zone and the separation zone, in the separation zone, the debonding module further comprises a separation device, and the wafer debonding and cleaning method comprises: when the moving stage moves the substrate to be processed after debonding to the separation zone, the carrier plate of the substrate to be processed is separated from the wafer by the separation device.

[0019] In some embodiments, in the separation zone, the debonding module further comprises a second optical detection device, and the wafer debonding and cleaning method comprises: after the carrier plate is separated from the wafer by the separation device, the carrier plate is detected by the second optical detection device.

[0020] In some embodiments, the debonding module further comprises a temporary storage zone configured to place the separated carrier plate.

[0021] In some embodiments, the wafer cleaning device comprises a first cavity and a second cavity, and the wafer debonding and cleaning method comprises: the wafer is transferred to the first cavity; a first surface of the wafer is cleaned by the first cavity; the wafer is taken out from the first cavity and flipped; the flipped wafer is transferred to the second cavity; and a second surface of the wafer is cleaned by the second cavity.

[0022] In some embodiments, the integrated wafer debonding and cleaning apparatus further comprises a positioning device configured to center the substrate to be processed, and a flipping mechanism configured to flip the substrate to be processed or the wafer.

[0023] Compared with the prior art, the present application forms a continuous process by directly cleaning the debonded wafer on both sides, thereby saving process time and improving productivity. Furthermore, the on-line optical detection device is used to monitor whether the carrier plate is broken or damaged in real time, so as to quickly remove the carrier plate and eliminate process interference. Therefore, the moving stage of the debonding module can maintain cleanliness and improve operation continuity, and keep the debonding module operating smoothly. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A schematic diagram of an integrated wafer debonding and cleaning apparatus of an embodiment of the present application is shown.

[0025] Figure 2 Figure 1 shows a schematic diagram of a de-bonding module according to an embodiment of the present application; and

[0026] Figures 3A to 3C Figure 2 shows a schematic diagram of a wafer separation process according to an embodiment of the present application. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be apparently and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by a person skilled in the art without any creative work fall within the protection scope of the present application.

[0028] In the wafer thinning process, in order to smoothly handle the ultra-thin wafer, a temporary bonding technology is used to bond the thinned wafer to a thick carrier to provide sufficient mechanical support and ensure that the device wafer can smoothly complete subsequent processing processes, such as lithography, etching, passivation, sputtering, plating, and reflow, etc. After the above processing processes are completed, the wafer and the carrier are de-bonded to separate the wafer and the carrier.

[0029] The surface of the wafer after de-bonding has foreign matter such as residue. In the prior art, the wafer is conveyed to the downstream cleaning equipment through the transmission port of the de-bonding module. However, the transmission port temporarily placing the wafer is easily contaminated by the residue of the wafer. In addition, the long-stroke conveying from the de-bonding module to the cleaning equipment will cause the wafer to easily attach additional foreign matter, thereby causing the wafer to be difficult to clean. In order to avoid problems such as the above, the present application provides an integrated wafer de-bonding and cleaning equipment and a wafer de-bonding and cleaning method.

[0030] Referring to Figure 1 , a schematic diagram of an integrated wafer de-bonding and cleaning equipment according to an embodiment of the present application is shown. The integrated wafer de-bonding and cleaning equipment 10 includes an in-out area 110, a conveying device 120, a positioning device 130, a turnover mechanism 140, a de-bonding module 150, and a wafer cleaning device 160. The integrated wafer de-bonding and cleaning equipment 10 is a single, independent, and closed workstation, and the conveying device 120 is within the range of the workstation, and runs in the in-out area 110, the positioning device 130, the turnover mechanism 140, the de-bonding module 150, and the wafer cleaning device 160 through the track inside the integrated wafer de-bonding and cleaning equipment 10.

[0031] As shown in Figure 1 , the in-out area 110 comprises at least three input / output ports, which can be selectively designated as an input port 111, a first output port 112 and a second output port 113. The input port 111 is configured to allow a substrate to be processed to enter the interior of the integrated wafer debonding and cleaning apparatus 10. Please refer to Figure 3A , which shows a schematic view of a substrate to be processed. The substrate to be processed 20 comprises a wafer 21 and a carrier 22. For example, the wafer 21 and the carrier 22 can be bonded by a separation layer 23 and an adhesive layer 24. After being processed by the integrated wafer debonding and cleaning apparatus 10, the substrate to be processed 20 is separated into the independent wafer 21 and the carrier 22. The first output port 112 is configured to allow the cleaned wafer 21 to exit the integrated wafer debonding and cleaning apparatus 10. The second output port 113 is configured to allow the carrier 22 to exit the integrated wafer debonding and cleaning apparatus 10.

[0032] As shown in Figure 1 , the conveying device 120 is configured to convey the substrate to be processed 20, the wafer 21 and the carrier 22. Moreover, the conveying device 120 operates between the input port 111, the first output port 112 and the second output port 113, the positioning device 130, the turnover mechanism 140, the debonding module 150 and the wafer cleaning device 160. In some embodiments, the conveying device 120 comprises a robot arm.

[0033] As shown in Figure 1 , when the substrate to be processed 20 enters the input port 111, the substrate to be processed 20 is first conveyed by the conveying device 120 to the positioning device 130 for center point positioning, and then the substrate to be processed 20 is turned over by the turnover mechanism 140 so that the carrier 22 of the substrate to be processed 20 faces upward.

[0034] As shown in Figure 1 , the turned-over substrate to be processed 20 is conveyed to the debonding module 150. The debonding module 150 is configured to debond the substrate to be processed 20 and separate it into the independent wafer 21 and the carrier 22.

[0035] Please refer to Figure 1 and Figure 2 , Figure 2This diagram illustrates a debonding module according to an embodiment of this application. The debonding module 150 defines a debonding area R1, a separation area R2, and a temporary storage area R3. Furthermore, the debonding module 150 includes a moving stage 151, a debonding device 152, a separation device 153, a platform 154, a first optical inspection device 155, and a second optical inspection device 156. The moving stage 151 is movable between the debonding area R1 and the separation area R2. The debonding device 152 and the first optical inspection device 155 are disposed in the debonding area R1. The separation device 153 is movable between the separation area R2 and the temporary storage area R3. The second optical inspection device 156 is disposed in the separation area R2. The platform 154 is disposed in the temporary storage area R3.

[0036] like Figure 1 and Figure 2 As shown, when the transfer device 120 places the substrate 20 to be processed on the moving stage 151 and the moving stage 151 is located in the debonding area R1, the debonding device 152 is configured to debond the substrate 20 to be processed. At this time, the carrier plate 22 of the substrate 20 to be processed is located at the uppermost position. That is, when the debonding device 152 debonds the substrate 20 to be processed, the substrate 20 to be processed is disposed between the moving stage 151 and the debonding device 152, and the carrier plate 22 of the substrate 20 to be processed is located on the side closer to the debonding device 150, and the wafer 21 is located on the side away from the debonding device 152.

[0037] In some embodiments, the debonding device 152 includes a laser head. Laser light is used to irradiate the carrier plate 22 of the substrate 20 to be processed, thereby generating a debonding effect and causing the bonded adhesive to lose its adhesiveness. In other embodiments, other types of debonding devices may be used, and the method is not limited thereto. Preferably, the debonding area R1 is provided with a protective cover. The upper part of the debonding area R1 is connected to the plant's exhaust system, and the lower part of the debonding area R1 is accessible for linear movement by the movable stage 151. In this application, since the debonding device 152 remains stationary while the substrate 20 to be processed is moved by the movable stage 151, the parameters of the debonding device 152 (such as focal length) do not change, thereby improving the accuracy and stability of the process.

[0038] In some embodiments, before debonding the substrate 20 to be processed, a first optical inspection device 155 (e.g., an AOI instrument) can be used to detect whether the substrate 20 to be processed is cracked. If the substrate 20 to be processed is not cracked, the debonding process can be performed. If the substrate 20 to be processed is cracked, the debonding process is not performed, and the integrated wafer debonding and cleaning equipment 10 can issue an alarm accordingly, controlling the transfer device 120 to automatically remove the substrate 20 to be processed.

[0039] like Figure 1 and Figure 2As shown, when the mobile stage 151 moves the debonded substrate 20 to the separation zone R2, the separation device 153 is configured to separate the carrier 22 from the wafer 21 of the substrate 20. Specifically, after debonding, the mobile stage 151 moves in a straight line from the debonding zone R1 to the separation zone R2 to perform a pull action on the carrier 22, causing the wafer 21 to separate from the carrier 22.

[0040] Referring to Figures 3A to 3C , a schematic diagram of a separation process of a wafer and a substrate according to an embodiment of the present application is shown. As Figure 3A shown, the substrate 20 to be processed includes a wafer 21 and a carrier 22 bonded by a separation layer 23 and an adhesive layer 24. After the separation device 153 is lowered to contact the substrate 20 to be processed, it is fixed to the carrier 22 by suction or clamping, etc. As Figure 3B shown, the separation device 153 performs a pull action on the carrier 22, causing the carrier 22 to separate from the wafer 21 through the separation layer 23. As Figure 3C shown, a secondary separation action is then performed to remove the separation layer 23 and the adhesive layer 24 from the wafer 21. Alternatively, the separation layer 23 and the adhesive layer 24 can also be removed by a subsequent wafer cleaning device 160.

[0041] In some embodiments, the separation zone R2 is provided with a second optical detection device 156 (e.g. an AOI instrument). The second optical detection device 156 is configured to detect whether the pulled carrier 22 has cracks. If the carrier 22 has no cracks, the carrier 22 is moved by the separation device 153 to the temporary storage zone R3, and the separated carrier 22 is placed on the platform 154. The carrier 22 on the platform 154 can be transported by the transport device 120 to the second output port 113. On the other hand, when the second optical detection device 156 detects that the pulled carrier 22 has cracks, the integrated wafer debonding and cleaning apparatus 10 can accordingly issue a fault alarm, and the fault can be subsequently eliminated by manual or automated equipment, etc. (such as removing the cracked carrier 22).

[0042] As Figure 1As shown, the wafer cleaning apparatus 160 includes a first chamber 161 and a second chamber 162. The first chamber 161 and the second chamber 162 are respectively configured to clean the two opposing surfaces of the wafer 21. Specifically, after the wafer 21 is separated from the carrier 22, the transfer device 120 transfers the wafer 21 to the first chamber 161 to clean the first surface of the wafer 21 with residual adhesive (separation layer 23 and adhesive layer 24). Next, the transfer device 120 transfers the wafer 21 from the first chamber 161 to the flipping mechanism 140. The flipping mechanism 140 flips the wafer 21 so that the second surface of the wafer 21 faces upward. Next, the transfer device 120 transfers the wafer 21 from the flipping mechanism 140 to the second chamber 162 to clean the second surface of the wafer. After the wafer is cleaned on both sides, it is shipped out through the transfer device 120 to the first output port 112.

[0043] On the other hand, this application also provides a wafer debonding and cleaning method. This wafer debonding and cleaning method is applicable to the aforementioned integrated wafer debonding and cleaning equipment. For example... Figure 1 As shown, the integrated wafer debonding and cleaning equipment 10 includes an inlet / outlet area 110, a conveying device 120, a positioning device 130, a flipping mechanism 140, a debonding module 150, and a wafer cleaning device 160. The inlet / outlet area 110 includes at least three input / output ports, wherein the at least three input / output ports are selectively designated as an input port 111, a first output port 112, and a second output port 113.

[0044] like Figure 1 As shown, the wafer debonding and cleaning method of this application includes the following steps. First, the substrate 20 to be processed is input into the integrated wafer debonding and cleaning equipment 10 through the input port 111. Figure 2 As shown, the substrate to be processed 20 includes a bonded wafer 21 and a carrier 22. Next, the substrate to be processed 20 is transferred to the debonding module 150 via the transfer device 120.

[0045] like Figure 1 As shown, when the substrate 20 to be processed is located in the debonding module 150, the substrate 20 to be processed is debonded and separated into independent wafers 21 and carriers 22 by the debonding device 152. Next, after the substrate 20 to be processed is debonded and separated, the separated wafers 21 are transferred to the wafer cleaning device 160 by the transfer device 120, and the wafers 21 are cleaned by the wafer cleaning device 160.

[0046] like Figure 1As shown, after both sides of the wafer 21 are cleaned, the cleaned wafer 21 and carrier 22 are conveyed to the first output port 112 and the second output port 113 respectively through the conveying device 120. Then, the wafer 21 and carrier 22 are output to the outside of the integrated wafer debonding and cleaning equipment 10 through the first output port 112 and the second output port 113 respectively.

[0047] like Figure 1 and Figure 2 As shown, the debonding module 150 defines a debonding area R1, a separation area R2, and a temporary storage area R3. Furthermore, the debonding module 150 includes a moving stage 151, a debonding device 152, a separation device 153, a platform 154, a first optical inspection device 155, and a second optical inspection device 156. The moving stage 151 can move between the debonding area R1 and the separation area R2. The debonding device 152 and the first optical inspection device 155 are disposed in the debonding area R1. The separation device 153 can move between the separation area R2 and the temporary storage area R3. The second optical inspection device 156 is disposed in the separation area R2. The platform 154 is disposed in the temporary storage area R3.

[0048] In some embodiments, when the transfer device 120 places the substrate 20 to be processed on the moving stage 151 and the moving stage 151 is located in the debonding area R1, the wafer debonding and cleaning method of this application includes: debonding the substrate 20 to be processed by the debonding device 152. When the debonding device 152 debonds the substrate 20 to be processed, the substrate 20 to be processed is disposed between the moving stage 151 and the debonding device 152, and the carrier plate 22 of the substrate 20 to be processed is located on the side closer to the debonding device 152, and the wafer 21 is located on the side away from the debonding device 152.

[0049] In some embodiments, before debonding the substrate 20 to be processed, the wafer debonding and cleaning method of this application includes: detecting the substrate 20 to be processed by a first optical detection device 155.

[0050] In some embodiments, when the moving stage 151 moves the debonded substrate 20 to the separation area R2, the wafer debonding and cleaning method of this application includes: separating the carrier plate 22 of the substrate 20 from the wafer 21 by the separation device 153. Preferably, the separation device 153 moves the carrier plate 22 to the temporary storage area R3 and places the separated carrier plate 22 on the platform 154.

[0051] In some embodiments, after the separation device 153 separates the carrier plate 22 from the wafer 21, the carrier plate 22 is detected by the second optical detection device 156.

[0052] like Figure 1As shown, the wafer cleaning device 160 comprises a first chamber 161 and a second chamber 162. The first chamber 161 and the second chamber 162 are respectively configured to clean two opposite surfaces of the wafer 21. Specifically, after the wafer 21 is separated from the carrier plate 22, the conveying device 120 conveys the wafer 21 to the first chamber 161. The wafer 21 with the first surface having the residual glue (the separation layer 23 and the adhesive layer 24) is cleaned by the first chamber 161. Then, the conveying device 120 takes the wafer 21 out of the first chamber 161 and conveys the wafer 21 to the flipping mechanism 140. The wafer 21 is flipped by the flipping mechanism 140 so that the second surface of the wafer 21 faces upward. Then, the conveying device 120 conveys the wafer 21 from the flipping mechanism 140 to the second chamber 162. The second surface of the wafer is cleaned by the second chamber 162. After the wafer is cleaned on both surfaces, the wafer 21 is conveyed by the conveying device 120 to the first output port 112 for delivery.

[0053] It should be understood that, in the wafer debonding and cleaning method of the present application, the specific debonding step, cleaning step, conveying step, detecting step, relative component arrangement and related advantages are as described in the corresponding paragraphs of the integrated wafer debonding and cleaning device 10, which will not be repeated here.

[0054] In summary, the present application provides an integrated wafer debonding and cleaning device and a wafer debonding and cleaning method. In the present application, the bonded wafer and carrier plate are conveyed to the moving stage of the debonding module, and the adhesive debonding process is performed by the debonding device in the debonding area. After the adhesive debonding, the moving stage moves back and forth along a straight line between the debonding area and the separation area. In the separation area, the carrier plate is pulled out by the separation device to separate the wafer from the carrier plate. Compared with the prior art, the present application directly performs the double-sided cleaning process on the debonded wafer to form a continuous process, thereby saving process time and improving productivity. Furthermore, the online optical detection device is used to monitor whether the carrier plate is broken or damaged in real time, so as to quickly remove the carrier plate and eliminate process interference. Therefore, the moving stage of the debonding module can maintain cleanliness and improve operation continuity, and the operation of the debonding module is smooth.

[0055] The above describes in detail an integrated wafer debonding and cleaning device and a debonding and cleaning method provided by an embodiment of the present application. The principles and implementation manners of the present application are described by using specific embodiments. The above descriptions of the embodiments are only used to help understand the technical solutions and core ideas of the present application. Those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents. The modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An integrated wafer debonding and cleaning device, characterized in that, The integrated wafer debonding and cleaning apparatus comprises: an input port configured to input a substrate to be processed into the interior of the integrated wafer debonding and cleaning apparatus, wherein the substrate to be processed comprises a wafer bonded to a carrier plate; a debonding module configured to debond the substrate to be processed and separate the wafer and the carrier plate from each other; a wafer cleaning device configured to clean the wafer; a first output port configured to output the cleaned wafer to the exterior of the integrated wafer debonding and cleaning apparatus; a second output port configured to output the carrier plate to the exterior of the integrated wafer debonding and cleaning apparatus; a conveying device configured to convey the substrate to be processed, the wafer and the carrier plate, wherein the conveying device operates between the input port, the debonding module, the wafer cleaning device, the first output port and the second output port; wherein the debonding module defines a debonding area and a separating area, and the debonding module comprises a moving stage and a debonding device, the moving stage moves between the debonding area and the separating area, the debonding device comprises a laser head, and the debonding device generates a debonding effect by irradiating the carrier plate of the substrate to be processed with laser, wherein the debonding device remains stationary, and the moving stage moves the substrate to be processed; wherein in the separating area, the debonding module further comprises a separating device and a second optical detection device, and after the separating device separates the carrier plate from the wafer, the second optical detection device is configured to detect the carrier plate.

2. The integrated wafer debonding and cleaning apparatus of claim 1, wherein, In the debonding area, when the conveying device places the substrate to be processed on the moving stage and the moving stage is located in the debonding area, the debonding device is configured to debond the substrate to be processed.

3. The integrated wafer debonding and cleaning apparatus of claim 2, wherein, In the debonding area, the debonding module further comprises a first optical detection device, and before debonding the substrate to be processed, the first optical detection device is configured to detect the substrate to be processed.

4. The integrated wafer debonding and cleaning apparatus of claim 2, wherein, When the debonding device debonds the substrate to be processed, the substrate to be processed is arranged between the moving stage and the debonding device, and the carrier plate of the substrate to be processed is located on the side close to the debonding device, and the wafer is located on the side away from the debonding device.

5. The integrated wafer debonding and cleaning apparatus of claim 2, wherein, When the moving stage moves the debonded substrate to be processed to the separating area, the separating device is configured to separate the carrier plate of the substrate to be processed from the wafer.

6. The integrated wafer debonding and cleaning apparatus of claim 1, wherein, The debonding module further comprises a temporary storage area configured to place the separated carrier plate.

7. The integrated wafer debonding and cleaning apparatus of claim 1, wherein, The wafer cleaning device comprises a first cavity and a second cavity, and the first cavity and the second cavity are respectively configured to clean opposite surfaces of the wafer.

8. The integrated wafer debonding and cleaning apparatus of claim 1, wherein, The integrated wafer debonding and cleaning apparatus further comprises a positioning device configured to center the substrate to be processed, and a turnover mechanism configured to turn over the substrate to be processed or the wafer.

9. A method for debonding and cleaning a wafer, the method comprising: The wafer debonding and cleaning method is suitable for an integrated wafer debonding and cleaning device, and the integrated wafer debonding and cleaning device comprises an input port, a debonding module, a wafer cleaning device, a first output port, a second output port and a conveying device, and the wafer debonding and cleaning method comprises the following steps: an input port is used to input a substrate to be processed into the integrated wafer debonding and cleaning device, wherein the substrate to be processed comprises a wafer and a carrier plate which are bonded together; the conveying device is used to convey the substrate to be processed to the debonding module; the debonding module is used to debond the substrate to be processed and separate the wafer and the carrier plate from each other, wherein the debonding module defines a debonding area and a separation area, and the debonding module comprises a moving platform and a debonding device, the moving platform moves between the debonding area and the separation area, the debonding device comprises a laser head, and the carrier plate of the substrate to be processed is irradiated by laser to generate a debonding effect, wherein the debonding device remains stationary, and the substrate to be processed is moved by the moving platform; the conveying device is used to convey the separated wafer to the wafer cleaning device; the wafer cleaning device is used to clean the wafer; the conveying device is used to convey the cleaned wafer and the carrier plate to the first output port and the second output port, respectively; and the first output port and the second output port are used to output the wafer and the carrier plate to the outside of the integrated wafer debonding and cleaning device, respectively; wherein in the separation area, the debonding module further comprises a separation device and a second optical detection device, and the wafer debonding and cleaning method comprises the following steps: after the separation device separates the carrier plate from the wafer, the second optical detection device is used to detect the carrier plate.

10. The wafer debonding and cleaning method of claim 9, wherein, The wafer debonding and cleaning method comprises the following steps: when the conveying device places the substrate to be processed on the moving platform and the moving platform is located in the debonding area, the debonding device is used to debond the substrate to be processed.

11. The wafer debonding and cleaning method of claim 10, wherein, In the debonding area, the debonding module further comprises a first optical detection device, and the wafer debonding and cleaning method comprises the following steps: before debonding the substrate to be processed, the first optical detection device is used to detect the substrate to be processed.

12. The wafer debonding and cleaning method of claim 10, wherein, When the debonding device debonds the substrate to be processed, the substrate to be processed is arranged between the moving platform and the debonding device, the carrier plate of the substrate to be processed is located on the side close to the debonding device, and the wafer is located on the side away from the debonding device.

13. The wafer debonding and cleaning method of claim 10, wherein, The wafer debonding and cleaning method comprises the following steps: when the moving platform moves the debonded substrate to be processed to the separation area, the separation device is used to separate the carrier plate from the wafer of the substrate to be processed.

14. The wafer debonding and cleaning method of claim 9, wherein, The debonding module further comprises a temporary storage area configured to place the separated carrier plate.

15. The wafer debonding and cleaning method of claim 9, wherein, The wafer cleaning apparatus includes a first chamber and a second chamber, and the wafer debonding and cleaning method includes: transferring the wafer to the first chamber; cleaning a first surface of the wafer by the first chamber; taking out the wafer from the first chamber and turning over; transferring the turned-over wafer to the second chamber; and cleaning a second surface of the wafer by the second chamber.

16. The wafer debonding and cleaning method of claim 9, wherein, The integrated wafer debonding and cleaning apparatus further includes a positioning device and a turning-over mechanism, the positioning device is configured to position a center point of the substrate to be processed, and the turning-over mechanism is configured to turn over the substrate to be processed or the wafer.

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