An image detection system for high voltage cable semi-conductive tape

Abstract

This invention relates to the field of cable material testing technology, and in particular to an image detection system for semiconducting strips in high-voltage cables. The invention comprises a detection device and a data processing module. The data processing module calculates vibration characterization parameters based on the amplitude data and noise level collected by the detection device. Under preset conditions, the operating parameters of the detection device are adjusted based on the vibration characterization parameters, and the vibration state of the detection device is re-determined based on the vibration characterization parameters. In the first vibration state, the time interval between image captures by the image detection unit is reduced, and the images are fitted to determine a fitted contour. The area of ​​the fitted contour is used to determine whether the semiconducting strip to be detected is abnormal. In the second vibration state, the area of ​​the feature contour in the image is used to determine whether the semiconducting strip to be detected is abnormal. This improves the detection accuracy and efficiency of the monitoring system for abnormal semiconducting strips.

Description

Technical Field

[0001] The invention relates to the technical field of cable material detection, and in particular to an image detection system for a semi-conductive belt of a high-voltage cable. Background Art

[0002] High-voltage cables are an important part of the power system. Semi-conductive tapes play an important role in high-voltage cables. The emergence of abnormality detection technology for semi-conductive tapes provides an important guarantee for the operation safety and reliability of high-voltage cables. Through real-time monitoring and abnormality detection, potential problems can be discovered and solved in time, avoiding failures and damage to the power system and improving the reliability and stability of the power system.

[0003] China Patent Publication No.: CN113183434A, discloses the following content: This invention discloses a detection system and method for protrusions on the surface of a semi-conductive shielding material strip of a high-voltage cable, belonging to the field of cable material detection technology. It includes a CCD industrial camera, a light source and a high-precision measuring roller, the CCD industrial camera and the light source are respectively arranged on both sides of the high-precision measuring roller, the center line of the light inlet of the CCD industrial camera and the center line of the light outlet of the light source are parallel, and the center line of the light inlet of the CCD industrial camera along the length direction of the CCD industrial camera and the center line of the light outlet of the light source along the length direction of the light source are both parallel to the measuring roller, and the high-precision measuring roller is tangent to the light emitted by the light source. This invention replaces complex manual detection, such as manual preliminary screening with a magnifying glass after extruding the strip, and then taking samples to measure the size of the protrusion under a microscope, which saves time and effort, and the optical detection method makes the detection result more accurate and can restore the size of the protrusion.

[0004] However, the prior art still has the following problems:

[0005] In the prior art, jitter will occur in the area where the semi-conductive belt of the high-voltage cable is detected due to the influence of the factory environment, and the jitter will cause poor detection effect of the detection device. The existing detection technology does not take the above factors into consideration, and adaptively adjusts the detection method of the system based on the jitter of the semi-conductive belt to improve the detection accuracy of the detection device and improve the detection efficiency. Summary of the invention

[0006] In order to solve the above problems, the present invention provides an image detection system for a high-voltage cable semi-conductive tape, which comprises:

[0007] The detection device comprises a detection channel for allowing the semi-conductive belt to be detected to pass through, an image detection unit arranged around the detection channel, a vibration detection unit arranged on the detection channel for detecting amplitude data of the detection channel, and at least two driving units arranged at both ends of the detection channel through slide rails for driving the semi-conductive belt to move;

[0008] A data processing module is connected to the detection device and includes a control unit, a first computing unit and a second computing unit connected to each other.

[0009] The control unit is used to obtain the image collected by the image detection unit and the amplitude data detected by the vibration detection unit, determine the number of noise points in the image, and calculate the vibration characterization parameter based on the amplitude data and the number of noise points to determine whether it is necessary to adjust the operating parameters of the detection device, and under preset conditions, re-acquire the amplitude data and characteristic parameters and calculate the vibration characterization parameter, and determine the vibration state of the detection device based on the vibration characterization parameter;

[0010] The first operation unit is used to reduce the time interval of the image detection unit taking images in the first vibration state, fit the images acquired by the image detection unit at a preset time interval, determine the fitting contour based on the fitting result, and determine whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the fitting contour;

[0011] The second computing unit is used to obtain the image captured by the image detection unit at a preset time interval in the second vibration state, determine the area of ​​the characteristic contour in the image, and determine whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the characteristic contour;

[0012] The preset condition is after adjusting the operating parameters of the detection device.

[0013] Furthermore, the control unit calculates the vibration characterization parameter based on the amplitude data and the number of noise points, wherein:

[0014] The control unit calculates the vibration characteristic parameter P according to formula (1):

[0015] (1)

[0016] In formula (1), N represents the number of noise points in the image, N0 represents a preset number comparison parameter, H represents the amplitude of the detection channel, and H0 represents a preset amplitude comparison parameter.

[0017] Furthermore, the control unit determines whether it is necessary to adjust the operating parameters of the detection device based on the vibration characterization parameter, wherein:

[0018] The control unit compares the vibration characterization parameter with a preset first parameter comparison threshold value,

[0019] If the comparison result satisfies the first vibration condition, the control unit determines that the operating parameters of the detection device need to be adjusted;

[0020] Among them, the first vibration condition is that the vibration characterization parameter is greater than or equal to the first parameter comparison threshold.

[0021] Furthermore, the control unit adjusts the operating parameters of the detection device based on the vibration characterization parameter, wherein:

[0022] The operating parameters include the moving speed of the semi-conductive belt driven by the driving unit and the spacing of the driving units;

[0023] The control unit adjusts the operating parameters of the detection device, and the adjustment amount of the operating parameters of the detection device is determined by the control unit based on the vibration characterization parameter.

[0024] Further, the control unit determines the vibration state of the detection device based on the vibration characterization parameter, wherein:

[0025] The control unit compares the vibration characterization parameter with a preset first parameter comparison threshold value,

[0026] If the vibration characteristic parameter is greater than or equal to the first parameter comparison threshold, the control unit determines that the vibration state of the detection device is a first vibration state;

[0027] If the vibration characteristic parameter is less than the first parameter comparison threshold, the control unit determines that the vibration state of the detection device is a second vibration state.

[0028] Furthermore, the first operation unit reduces the time interval for the image detection unit to capture images, wherein:

[0029] The first operation unit reduces the time interval for the image detection unit to capture images by a preset interval adjustment parameter.

[0030] Furthermore, the first operation unit fits the image acquired by the image detection unit at a preset time interval, and determines a fitting profile based on the fitting result, wherein:

[0031] The fitting process includes extracting characteristic contours from each image, determining the same parts in each characteristic contour, aligning and superimposing the same parts in each characteristic contour, and determining the contour generated by the superposition as the fitting contour.

[0032] Furthermore, the characteristic profile includes a wrinkle profile and a convex profile.

[0033] Further, determining whether the semi-conductive belt to be detected has an abnormality includes:

[0034] The first operation unit determines whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the fitting contour, wherein:

[0035] The first computing unit compares the area of ​​the fitted contour with a preset area comparison threshold.

[0036] Based on the first area comparison result, the first operation unit determines that the semi-conductive strip to be detected has an abnormality;

[0037] Or, the second operation unit determines whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the characteristic contour, wherein:

[0038] The second computing unit compares the area of ​​the feature contour with a preset area comparison threshold.

[0039] Based on the second area comparison result, the second operation unit determines that the semi-conductive belt to be detected is abnormal;

[0040] The first area comparison result is that the area of ​​the fitting contour is greater than or equal to the area comparison threshold, and the second area comparison result is that the area of ​​the characteristic contour is greater than or equal to the area comparison threshold.

[0041] Furthermore, the detection device also includes a warning light, which is connected to the control unit and is configured to light up when the first operation unit or the second operation unit determines that there is an abnormality in the semi-conductive belt to be detected.

[0042] Compared with the prior art, the present invention provides a detection device and a data processing module. The data processing module calculates vibration characterization parameters based on the amplitude data and the number of noise points collected by the detection device. After adjusting the operating parameters of the detection device based on the vibration characterization parameters under preset conditions, the vibration state of the detection device is re-determined based on the vibration characterization parameters. In the first vibration state, the time interval for taking images by the image detection unit is reduced, and the image is fitted to determine a fitting contour. Based on the area of ​​the fitting contour, it is determined whether the semi-conductive belt to be detected has an abnormality. In the second vibration state, it is determined whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the characteristic contour in the image. This improves the detection accuracy and efficiency of the monitoring system for abnormal semi-conductive belts.

[0043] In particular, in the present invention, vibration characterization parameters are calculated based on amplitude data and the number of noise points. The vibration characterization parameters take into account the amplitude data of the detection channel and the number of noise points in the image. The amplitude data characterizes the vibration degree of the detection channel, and the number of noise points characterizes the clarity of the image. In actual situations, if the vibration of the detection channel is large, the image detection unit will shake, and the clarity of the captured image will be low, resulting in poor detection effect. Therefore, the present invention digitizes the above process by calculating the vibration characterization parameters, which is convenient for the subsequent adaptive adjustment of the operating parameters of the detection device according to the vibration characterization parameters, thereby improving the detection accuracy of the monitoring system for abnormal semi-conductive belts.

[0044] In particular, in the present invention, the operating parameters of the detection device are adjusted based on the vibration characterization parameters. In actual situations, if the vibration characterization parameters are large, the moving speed of the semi-conductive belt driven by the driving unit should be adaptively reduced so that the semi-conductive belt to be detected moves at a slower speed to reduce the interference of vibration on the effect of the captured image, and the spacing of the driving units should be adaptively increased to increase the tension of the semi-conductive belt to be detected, further reducing the interference of vibration on the effect of the captured image, thereby ensuring the detection accuracy of the monitoring system for abnormal semi-conductive belts.

[0045] In particular, in the present invention, in the first vibration state, the time interval for the image detection unit to capture images is reduced, and whether the semi-conductive belt to be detected has an abnormality is determined based on the area of ​​the fitted contour. In the second vibration state, whether the semi-conductive belt to be detected has an abnormality is determined based on the area of ​​the characteristic contour in the image. The first vibration state indicates that the vibration degree of the detection channel is relatively large, so the time interval for the image detection unit to capture images is reduced to increase the number of images captured per unit time, and the blurred part of the characteristic contour in the image caused by the vibration is restored by superimposing the characteristic contours in the image to obtain the fitted contour, and whether the semi-conductive belt to be detected has an abnormality is determined by the area of ​​the fitted contour. The second vibration state indicates that the vibration degree of the detection channel is relatively small, and the clarity of the captured image is relatively high. Whether the semi-conductive belt to be detected has an abnormality is determined directly by the area of ​​the characteristic contour in the image at preset time intervals, thereby improving the detection efficiency while ensuring the detection accuracy of the monitoring system for abnormal semi-conductive belts. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 This is a schematic structural diagram of an image detection system for a semi-conductive belt of a high-voltage cable according to an embodiment of the invention;

[0047] Figure 2 It is a schematic diagram of the structure of a detection device according to an embodiment of the invention;

[0048] Figure 3 A schematic diagram of the structure of a driving unit according to an embodiment of the invention;

[0049] In the figure, 1: driving unit, 11: fixed vertical rod, 12: fixed horizontal rod, 2: vibration detection unit, 3: detection channel, 4: image detection unit. DETAILED DESCRIPTION

[0050] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0051] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0052] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0053] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] See also Figure 1 , Figure 2 as well as Figure 3 As shown in the figure, they are respectively a schematic diagram of the structure of an image detection system for a high-voltage cable semi-conductive belt, a schematic diagram of the structure of a detection device, and a schematic diagram of the structure of a driving unit according to an embodiment of the present invention. The image detection system for a high-voltage cable semi-conductive belt of the present invention comprises:

[0055] The detection device comprises a detection channel 3 for allowing the semi-conductive belt to be detected to pass through, an image detection unit 4 arranged around the detection channel 3, a vibration detection unit 2 arranged on the detection channel 3 for detecting amplitude data of the detection channel 3, and at least two driving units 1 arranged at both ends of the detection channel 3 through a slide rail for driving the semi-conductive belt to move;

[0056] A data processing module is connected to the detection device and includes a control unit, a first computing unit and a second computing unit connected to each other.

[0057] The control unit is used to obtain the image collected by the image detection unit 4 and the amplitude data detected by the vibration detection unit 2, determine the number of noise points in the image, and calculate the vibration characterization parameter based on the amplitude data and the number of noise points to determine whether it is necessary to adjust the operating parameters of the detection device, and under preset conditions, re-acquire the amplitude data and characteristic parameters and calculate the vibration characterization parameter, and determine the vibration state of the detection device based on the vibration characterization parameter;

[0058] The first operation unit is used to reduce the time interval of the image detection unit 4 taking images in the first vibration state, fit the image acquired by the image detection unit 4 every preset time period T, determine the fitting contour based on the fitting result, and determine whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the fitting contour;

[0059] The second computing unit is used to obtain the image captured by the image detection unit 4 at a preset time interval T in the second vibration state, determine the area of ​​the characteristic contour in the image, and determine whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the characteristic contour;

[0060] The preset condition is after adjusting the operating parameters of the detection device.

[0061] Specifically, in this embodiment, T is selected from the interval [1, 3], and the unit of the interval is seconds.

[0062] For more details, please refer to Figure 3 As shown, the driving unit 1 includes a fixed vertical rod 11 arranged on a slide rail and two fixed cross rods 12 arranged on the fixed vertical rod 11 through the slide rail. Each of the fixed cross rods 12 is provided with a driving wheel so that a certain gap is retained between the driving wheels, and the size of the gap can be changed, so that when the semi-conductive belt is in the gap, the driving wheel generates an extrusion force on the semi-conductive belt, and then drives the semi-conductive belt to move after the driving wheel rotates. When the driving unit 1 changes the spacing, the gap between the driving wheels can be increased to avoid damage to the semi-conductive belt.

[0063] Specifically, the present invention does not limit the specific structure of the detection channel 3. It only needs to be able to complete the function of allowing the semi-conductive strip to be detected to pass through, and no further details will be given.

[0064] Specifically, the present invention does not limit the specific structure of the image detection unit 4, which can be a combination of a 3D camera and a processor. It only needs to be able to complete the function of capturing depth images, which will not be described in detail.

[0065] Specifically, the present invention does not limit the specific structure of the vibration detection unit 2, which can be a collection module of a vibration sensor and a transceiver. The transceiver sends the acquired amplitude data of the vibration sensor to the data processing module, which only needs to complete the function of detecting the amplitude data of the detection channel 3, and will not be repeated.

[0066] Specifically, the present invention does not limit the specific form of the data processing module, which can be an external computer, wherein each unit is a different functional program in the computer, which only needs to complete the functions of data exchange and data processing, and will not be elaborated.

[0067] Specifically, the present invention does not limit the specific method by which the control unit determines the number of noise points in the image and the area of ​​the characteristic contour. It can be achieved by presetting an image processing algorithm in the control unit. It only needs to be able to complete the function of determining the number of noise points in the image, and will not be elaborated on.

[0068] Specifically, the present invention does not limit the specific manner in which the first operating unit and the second operating unit identify the characteristic contour in the image. It may be by comparing the contour of the semi-conductive tape to be detected in the image with a number of wrinkle contours and convex contours preset in the database, and determining the contour in the image whose coincidence with the wrinkle contour and convex contour in the database is higher than a preset coincidence comparison threshold as the characteristic contour. It may also be other manners, which only need to complete the function of identifying the characteristic contour in the image. There are many specific calculation methods for the coincidence of contours, which are not limited here. It is an existing mature technology and will not be described in detail.

[0069] Specifically, in the present invention, in the first vibration state, the time interval for the image detection unit 4 to take images is reduced, and whether the semi-conductive belt to be detected has an abnormality is determined based on the area of ​​the fitted contour. In the second vibration state, whether the semi-conductive belt to be detected has an abnormality is determined based on the area of ​​the characteristic contour in the image. The first vibration state indicates that the vibration degree of the detection channel 3 is relatively large. Therefore, the time interval for the image detection unit 4 to take images is reduced to increase the number of images taken per unit time, and the blurred part of the characteristic contour in the image caused by the vibration is restored by superimposing the characteristic contours in the image to obtain the fitted contour, and whether the semi-conductive belt to be detected has an abnormality is determined by the area of ​​the fitted contour. The second vibration state indicates that the vibration degree of the detection channel 3 is relatively small, and the clarity of the captured image is relatively high. Whether the semi-conductive belt to be detected has an abnormality is determined directly by the area of ​​the characteristic contour in the image at preset time intervals. On the basis of ensuring the detection accuracy of the monitoring system for abnormal semi-conductive belts, the detection efficiency is improved.

[0070] Specifically, the control unit calculates the vibration characterization parameter based on the amplitude data and the number of noise points, wherein:

[0071] The control unit calculates the vibration characteristic parameter P according to formula (1):

[0072] (1)

[0073] In formula (1), N represents the number of noise points in the image, N0 represents a preset number comparison parameter, H represents the amplitude of the detection channel 3, and H0 represents a preset amplitude comparison parameter.

[0074] Specifically, in this embodiment, N0 is selected from the interval [200, 300], and the interval unit is pieces.

[0075] Specifically, in this embodiment, H0 is selected from the interval [0.5, 1.5], and the unit of the interval is millimeter.

[0076] Specifically, in the present invention, the vibration characterization parameter is calculated based on the amplitude data and the number of noise points. The vibration characterization parameter takes into account the amplitude data of the detection channel 3 and the number of noise points in the image. The amplitude data characterizes the vibration degree of the detection channel 3, and the number of noise points characterizes the clarity of the image. In actual situations, if the vibration of the detection channel 3 is large, the image detection unit 4 will shake, and the clarity of the captured image will be low, resulting in poor detection effect. Therefore, the present invention digitizes the above process by calculating the vibration characterization parameter, which is convenient for the subsequent adaptive adjustment of the operating parameters of the detection device according to the vibration characterization parameter, thereby improving the detection accuracy of the monitoring system for abnormal semi-conductive belts.

[0077] Specifically, the control unit determines whether it is necessary to adjust the operating parameters of the detection device based on the vibration characterization parameter, wherein:

[0078] The control unit compares the vibration characterization parameter P with a preset first parameter comparison threshold value P1,

[0079] If the comparison result satisfies the first vibration condition, the control unit determines that the operating parameters of the detection device need to be adjusted;

[0080] Wherein, the first vibration condition is P≥P1.

[0081] Specifically, in this embodiment, P1 is calculated based on the vibration characterization parameter P0 calculated when N=N0 and H=H0, and 1.1P0<P1<1.3P0 is set.

[0082] Specifically, the control unit adjusts the operating parameters of the detection device based on the vibration characterization parameter, wherein:

[0083] The operating parameters include the moving speed of the semi-conductive belt driven by the driving unit 1 and the spacing of the driving unit 1;

[0084] The control unit adjusts the operating parameters of the detection device, and the adjustment amount of the operating parameters of the detection device is determined by the control unit based on the vibration characterization parameter;

[0085] The control unit compares the vibration characterization parameter P with a preset second parameter comparison threshold value P2 and a third parameter comparison threshold value P3, where P1<P2<P3.

[0086] If the comparison result satisfies the second vibration condition, the control unit adjusts the moving speed of the semi-conductive belt driven by the driving unit 1 to a first moving speed value V1 according to a preset first speed adjustment parameter v1, setting V1=v0-v1, and adjusts the spacing of the driving unit 1 to a first spacing value D1 according to a preset first spacing adjustment parameter d1, setting D1=d0+d1;

[0087] If the comparison result satisfies the third vibration condition, the control unit adjusts the moving speed of the semi-conductive belt driven by the driving unit 1 to a second moving speed value V2 according to a preset second speed adjustment parameter v2, setting V2=v0-v2, and adjusts the spacing of the driving unit 1 to a second spacing value D2 according to a preset second spacing adjustment parameter d2, setting D2=d0+d2;

[0088] If the comparison result satisfies the fourth vibration condition, the control unit adjusts the moving speed of the semi-conductive belt driven by the driving unit 1 to a third moving speed value V3 according to a preset third speed adjustment parameter v3, setting V3=v0-v3, and adjusts the spacing of the driving unit 1 to a third spacing value D3 according to a preset third spacing adjustment parameter d3, setting D3=d0+d3;

[0089] Among them, the second vibration condition is P≥P3, the third vibration condition is P2≤P<P3, the fourth vibration condition is P<P2, v1>v2>v3, V1<V2<V3, d1>d2>d3, D1>D2>D3, v0 represents the initial moving speed of the semi-conductive belt driven by the driving unit 1, and d0 represents the initial spacing of the driving unit 1.

[0090] Specifically, in this embodiment, P2 and P3 are calculated based on P1, and 1.2P1<P2<1.4P1<P3<1.6P1 is set.

[0091] Specifically, in this embodiment, v1, v2 and v3 are calculated based on v0, and are set to 0.1v0<v3<0.15v0<v2<0.2v0<v1<0.25v0.

[0092] Specifically, in this embodiment, d1, d2, and d3 are calculated based on d0, and 0.02d0<d3<0.04d0<d2<0.06d0<d1<0.08d0 is set.

[0093] Specifically, in the present invention, the operating parameters of the detection device are adjusted based on the vibration characterization parameters. In actual situations, if the vibration characterization parameters are large, the moving speed of the semi-conductive belt driven by the driving unit 1 should be adaptively reduced so that the semi-conductive belt to be detected moves at a slower speed to reduce the interference of vibration on the effect of the captured image, and the spacing of the driving units 1 should be adaptively increased to increase the tension of the semi-conductive belt to be detected, further reducing the interference of vibration on the effect of the captured image, thereby ensuring the detection accuracy of the monitoring system for abnormal semi-conductive belts.

[0094] Specifically, the control unit determines the vibration state of the detection device based on the vibration characterization parameter, wherein:

[0095] The control unit compares the vibration characterization parameter P with a preset first parameter comparison threshold value P1,

[0096] If P≥P1, the control unit determines that the vibration state of the detection device is a first vibration state;

[0097] If P<P1, the control unit determines that the vibration state of the detection device is the second vibration state.

[0098] Specifically, the first operation unit reduces the time interval for the image detection unit 4 to capture images, wherein:

[0099] The first operation unit reduces the time interval for the image detection unit 4 to capture images by a preset interval adjustment parameter t0.

[0100] Specifically, in this embodiment, t0 is calculated based on the time interval te at which the image detection unit 4 initially captures the image, and te=0.1t0 is set.

[0101] Specifically, the first operation unit fits the image acquired by the image detection unit 4 at a preset time interval T, and determines a fitting profile based on the fitting result, wherein:

[0102] The fitting process includes extracting characteristic contours from each image, determining the same parts in each characteristic contour, aligning and superimposing the same parts in each characteristic contour, and determining the contour generated by the superposition as the fitting contour.

[0103] Specifically, the characteristic contour includes a wrinkle contour and a convex contour.

[0104] Specifically, determining whether the semi-conductive belt to be detected has an abnormality includes:

[0105] The first operation unit determines whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the fitting contour, wherein:

[0106] The first computing unit compares the area A1 of the fitted contour with a preset area comparison threshold A0.

[0107] Based on the first area comparison result, the first operation unit determines that the semi-conductive strip to be detected has an abnormality;

[0108] Or, the second operation unit determines whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the characteristic contour, wherein:

[0109] The second computing unit compares the area A2 of the feature contour with a preset area comparison threshold A0.

[0110] Based on the second area comparison result, the second operation unit determines that the semi-conductive belt to be detected is abnormal;

[0111] The first area comparison result is A1≥A0, and the second area comparison result is A2≥A0.

[0112] Specifically, in this embodiment, A0 is calculated based on the area AE of the contour of the semi-conductive strip to be detected in the image, and 0.001AE<A0<0.003AE is set.

[0113] Specifically, the detection device further includes a warning light, which is connected to the control unit and is configured to light up when the first operation unit or the second operation unit determines that the semi-conductive belt to be detected has an abnormality.

[0114] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. An image detection system for a high voltage cable semi-conductive tape, characterized in that: include: The detection device comprises a detection channel for allowing the semi-conductive belt to be detected to pass through, an image detection unit arranged around the detection channel, a vibration detection unit arranged on the detection channel for detecting amplitude data of the detection channel, and at least two driving units arranged at both ends of the detection channel through slide rails for driving the semi-conductive belt to move; A data processing module is connected to the detection device and includes a control unit, a first computing unit and a second computing unit connected to each other. The control unit is used to obtain the image collected by the image detection unit and the amplitude data detected by the vibration detection unit, determine the number of noise points in the image, and calculate the vibration characterization parameter based on the amplitude data and the number of noise points to determine whether it is necessary to adjust the operating parameters of the detection device, and under preset conditions, re-acquire the amplitude data and characteristic parameters and calculate the vibration characterization parameter, and determine the vibration state of the detection device based on the vibration characterization parameter; The first operation unit is used to reduce the time interval of the image detection unit taking images in the first vibration state, fit the images acquired by the image detection unit at a preset time interval, determine the fitting contour based on the fitting result, and determine whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the fitting contour; The second computing unit is used to obtain the image captured by the image detection unit at a preset time interval in the second vibration state, determine the area of ​​the characteristic contour in the image, and determine whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the characteristic contour; The preset condition is after adjusting the operating parameters of the detection device; The control unit calculates the vibration characterization parameter based on the amplitude data and the number of noise points, wherein: The control unit calculates the vibration characteristic parameter P according to formula (1): (1) In formula (1), N represents the number of noise points in the image, N0 represents a preset number comparison parameter, H represents the amplitude of the detection channel, and H0 represents a preset amplitude comparison parameter.

2. The image detection system for high-voltage cable semi-conductive tape according to claim 1, characterized in that: The control unit determines whether the operating parameters of the detection device need to be adjusted based on the vibration characterization parameter, wherein: The control unit compares the vibration characterization parameter with a preset first parameter comparison threshold value, If the comparison result satisfies the first vibration condition, the control unit determines that the operating parameters of the detection device need to be adjusted; Among them, the first vibration condition is that the vibration characterization parameter is greater than or equal to the first parameter comparison threshold.

3. The image detection system for the high-voltage cable semi-conductive tape according to claim 2 is characterized in that: The control unit adjusts the operating parameters of the detection device based on the vibration characterization parameter, wherein: The operating parameters include the moving speed of the semi-conductive belt driven by the driving unit and the spacing of the driving units; The control unit adjusts the operating parameters of the detection device, and the adjustment amount of the operating parameters of the detection device is determined by the control unit based on the vibration characterization parameter.

4. The image detection system for high-voltage cable semi-conductive tape according to claim 1, characterized in that: The control unit determines the vibration state of the detection device based on the vibration characterization parameter, wherein: The control unit compares the vibration characterization parameter with a preset first parameter comparison threshold value, If the vibration characteristic parameter is greater than or equal to the first parameter comparison threshold, the control unit determines that the vibration state of the detection device is a first vibration state; If the vibration characteristic parameter is less than the first parameter comparison threshold, the control unit determines that the vibration state of the detection device is a second vibration state.

5. The image detection system for high-voltage cable semi-conductive tape according to claim 1, characterized in that: The first operation unit reduces the time interval for the image detection unit to capture images, wherein: The first operation unit reduces the time interval for the image detection unit to capture images by a preset interval adjustment parameter.

6. The image detection system for high-voltage cable semi-conductive tape according to claim 1, characterized in that: The first operation unit fits the image acquired by the image detection unit at a preset time interval, and determines a fitting profile based on the fitting result, wherein: The fitting process includes extracting characteristic contours from each image, determining the same parts in each characteristic contour, aligning and superimposing the same parts in each characteristic contour, and determining the contour generated by the superposition as the fitting contour.

7. The image detection system for high-voltage cable semi-conductive tape according to claim 1, characterized in that: The characteristic profile includes a wrinkle profile and a convex profile.

8. The image detection system for high voltage cable semi-conductive tape according to claim 1, characterized in that: Determining whether the semi-conductive belt to be detected has an abnormality includes: The first operation unit determines whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the fitting contour, wherein: The first computing unit compares the area of ​​the fitted contour with a preset area comparison threshold. Based on the first area comparison result, the first operation unit determines that the semi-conductive strip to be detected has an abnormality; Or, the second operation unit determines whether the semi-conductive belt to be detected has an abnormality based on the area of ​​the characteristic contour, wherein: The second computing unit compares the area of ​​the feature contour with a preset area comparison threshold. Based on the second area comparison result, the second operation unit determines that the semi-conductive belt to be detected is abnormal; The first area comparison result is that the area of ​​the fitting contour is greater than or equal to the area comparison threshold, and the second area comparison result is that the area of ​​the characteristic contour is greater than or equal to the area comparison threshold.

9. The image detection system for high voltage cable semi-conductive tape according to claim 1, characterized in that: The detection device further comprises an early warning light, which is connected to the control unit and is configured to light up when the first operation unit or the second operation unit determines that the semi-conductive belt to be detected has an abnormality.

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