Diamond grinding wheel laser dressing device and method

Abstract

This invention belongs to the field of laser dressing technology for superhard abrasive wheels, specifically relating to a laser dressing device and method for diamond grinding wheels. The device includes: an X-axis movable worktable, a force gauge, a fixture, a workpiece, and a diamond grinding wheel. A laser displacement sensor is positioned directly above the diamond grinding wheel, and a laser is positioned on the outer periphery of the diamond grinding wheel. This invention uses a small-diameter laser beam emitted from the laser to irradiate the bottom of the outer periphery of the diamond grinding wheel, rounding the wheel. The laser displacement sensor measures the surface morphology of the outer periphery of the diamond grinding wheel, and the root mean square error σ is calculated and analyzed from the measured data. i , will σ i Compared with the maximum permissible value of the mean square error σ0, and by comparing |σ i -σ i‑1 | Maximum deviation ε from the mean square error of peak height σ By making comparisons, it can be determined whether the diamond grinding wheel has been properly dressed. This allows for highly efficient and precise shaping of the diamond grinding wheel surface, accurately determining the optimal state of the dressed diamond grinding wheel.

Description

Technical Field

[0001] This invention belongs to the field of laser dressing technology for superhard abrasive wheels, specifically relating to a laser dressing device and method for diamond wheels. Background Technology

[0002] Diamond is the hardest material found in nature, and diamond grinding wheels, made from diamond abrasives, are widely used in precision / ultra-precision machining of high-hardness, brittle, and difficult-to-machine materials in aerospace, optics, and other fields. To ensure sufficient sharpness and shape accuracy, the grinding wheel needs to be dressed, i.e., its surface is shaped, rounded, and sharpened. Common dressing methods include mechanical grinding, laser treatment, electrolysis, electrical discharge machining, or abrasive waterjet to remove worn abrasive grains or adhering substances from the wheel surface, exposing new grinding edges and ensuring the wheel remains sharp. However, current laser dressing methods often rely on empirical estimations of the final dressing effect, leading to drawbacks such as over-dressing or under-dressing. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing technologies where empirical estimation of correction effects often results in over-dressing or under-dressing of the grinding wheel, and to provide a laser dressing device and method for diamond grinding wheels that can accurately evaluate the dressing effect.

[0004] The technical solution adopted by this invention to solve its technical problem is:

[0005] A laser dressing device for diamond grinding wheels is characterized by comprising: an X-axis movable work slide, a force gauge mounted on the X-axis movable work slide, a clamp mounted on the force gauge, a workpiece clamped by the clamp, a diamond grinding wheel disposed above the clamp, and a spindle coaxially connected to the diamond grinding wheel; a drive mechanism for driving the spindle to rotate is mounted on a YZ-axis movable platform; a laser displacement sensor is disposed directly above the diamond grinding wheel; a laser is disposed on the outer side of the outer circumference of the diamond grinding wheel, and the laser emits an X-axis laser beam toward the outer side of the diamond grinding wheel; wherein the central axis of the spindle is in the Y direction.

[0006] Furthermore, the laser and displacement sensor are connected to the computer via cables, and the force gauge is connected to the computer via cables.

[0007] This invention also discloses a method for laser dressing of diamond grinding wheels, characterized by: using the above-mentioned apparatus, including the following steps:

[0008] S1. Adjust the bottom of the outer circumference of the diamond grinding wheel to be in contact with the laser emitted by the laser; adjust the position of the diamond grinding wheel by moving the YZ axis forward and backward and up and down to make the laser emitted by the laser just in contact with the bottom of the outer circumference of the diamond grinding wheel.

[0009] S2. Round the diamond grinding wheel; drive the spindle to rotate the diamond grinding wheel, and move the YZ-axis moving platform along the Y-axis at a speed of [missing information]. S 1 Turn on the laser and set the laser spot diameter to [value missing]. d 1 The laser beam is used to dress the outer circumference of the diamond grinding wheel.

[0010] S3. Obtain the peak height sequence of the outer peripheral surface of the diamond grinding wheel; after dressing, activate the laser displacement sensor to drive the spindle to rotate the diamond grinding wheel. The YZ-axis moving platform moves the diamond grinding wheel along the Y direction, allowing the laser displacement sensor to measure the morphology of the outer peripheral surface of the diamond grinding wheel, and obtain the diamond grinding wheel's morphology. k Peaks on the surface

[0011] height sequence h ik ,in i To correct the sequence number, k For series number, k =1, 2, ..., n 0; n 0 is a constant value;

[0012] S4. Calculate the root mean square error of the peak height sequence after diamond wheel correction. The formula is:

[0013] (1)

[0014] In the formula, Peak height sequence h ik The average value;

[0015] S5. Determine if the diamond grinding wheel has been properly rounded; Set This represents the maximum permissible value for the root mean square error of the peak height. This represents the maximum deviation of the root mean square error of the peak height; if and If the diamond grinding wheel is rounded, then it is determined that the diamond grinding wheel has been rounded; otherwise, YZ moves downwards a certain distance towards the moving platform. Z 0, and return to step S2.

[0016] Furthermore, it also includes the following steps:

[0017] S6. Adjust the laser emitted by the laser to be perpendicular to the outer circumferential surface of the diamond grinding wheel; adjust the position of the diamond grinding wheel by moving the YZ axis forward and backward and up and down to make the laser emitted by the laser perpendicular to the outer circumferential surface of the diamond grinding wheel.

[0018] S7. Sharpen the diamond grinding wheel; drive the spindle to rotate the diamond grinding wheel, and move the YZ-axis moving platform along the Y-axis at a speed of [missing information]. S 2 Turn on the laser and set the laser spot diameter to [value missing]. d 2 The laser beam dresses the outer circumference of the diamond grinding wheel; among which... d 1 < d 2 ; S 1 < S 2 ;

[0019] S8. Obtain the grinding force signal; adjust the relative position of the diamond wheel and the workpiece, and perform single-stroke grinding on the workpiece, wherein the grinding speed is... v s The feed rate is v w The grinding depth is a p ;

[0020] S9. Calculate the grinding force signal in the Z-axis direction; select the force signal measured by the force gauge during the stable grinding stage, filter it, and take its average value to obtain the grinding force in the stable stage. The grinding force per unit width during the steady-state phase is obtained according to the formula. F j ;

[0021] (2)

[0022] In the formula, b This represents the width of the workpiece.

[0023] S10, when F j < F 0 and If the diamond grinding wheel is sharpened, it is determined that the diamond grinding wheel has been sharpened; otherwise, return to step S7.

[0024] Furthermore, in step S2, the diamond grinding wheel rotates at a speed of 200 rpm, the laser pulse frequency is 40 kHz, and the power is 40 W. d 1= 0.1mm; S 1= 0.1 mm / s.

[0025] Furthermore, in step S7, the diamond grinding wheel rotates at a speed of 200 rpm, the laser pulse frequency is 40 kHz, and the power is 20 W. d 2= 1mm; S 2= 0.5mm / s.

[0026] Furthermore, in step S8, v s Value range 10~30m / s, feed rate v w The value range is 5~15 m / min, and the grinding depth is... a p The value range is 5~20μm.

[0027] Furthermore, the workpiece is silicon carbide ceramic.

[0028] Furthermore, in step S3, the diamond grinding wheel rotates at a speed of 10 rpm; the Y-axis movement speed is 1 mm / s.

[0029] Furthermore, n0 is not less than 200; The value range is 0.01 to 0.07. The value ranges from 0.005 to 0.02, and ; F The value of 0 ranges from 0.5 to 4.0. The value range is 0.05 to 0.2.

[0030] The beneficial effects of the laser dressing device and method for diamond grinding wheels of the present invention are as follows:

[0031] 1. This invention first uses a small-diameter laser beam emitted by a laser to irradiate the bottom of the outer circumference of a diamond grinding wheel, thus rounding the diamond grinding wheel. A laser displacement sensor is then used to measure the surface morphology of the outer circumference of the diamond grinding wheel. The root mean square error is calculated and analyzed from the measured data. ,Will With the maximum allowable value of the mean square deviation Comparison, and Maximum deviation from the root mean square of peak height By making comparisons, it can be determined whether the diamond grinding wheel has been properly dressed. This allows for highly efficient and precise shaping of the diamond grinding wheel surface, accurately determining the optimal state of the dressed diamond grinding wheel.

[0032] 2. This invention also uses a large-spot-diameter laser beam emitted by a laser to vertically irradiate the outer circumferential surface of a diamond grinding wheel, sharpening the wheel. Analysis of the grinding force during workpiece processing determines that the sharpness of the diamond grinding wheel has been adjusted to an optimal state. This achieves high-quality cutting of the diamond abrasive grains on the diamond grinding wheel surface. Attached Figure Description

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0034] Figure 1 This is a schematic diagram of the laser dressing device for diamond grinding wheels of the present invention;

[0035] Figure 2 This is a schematic diagram of the tool setting position when the laser beam rounds the diamond grinding wheel in an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the scanning path of the laser on the diamond grinding wheel in an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the tool setting position for laser sharpening of a diamond grinding wheel in an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of the scanning path for laser sharpening of a diamond grinding wheel in an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the path by which the laser displacement sensor measures the surface morphology of the diamond grinding wheel in an embodiment of the present invention;

[0040] Figure 7 This refers to the original signal of the grinding force in the Z-axis direction obtained by the force measuring instrument in this embodiment of the invention;

[0041] Figure 8 The grinding force signal in this embodiment of the invention is the original grinding force signal after filtering.

[0042] In the diagram: 1. X-axis moving worktable, 2. Force gauge, 3. Fixture, 4. Workpiece, 5. Diamond grinding wheel, 6. Spindle, 7. Laser displacement sensor, 8. Laser, 9. Computer. Detailed Implementation

[0043] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0044] like Figures 1-8The embodiment of the laser dressing device for diamond grinding wheels of the present invention shown includes an X-axis movable worktable 1, a force gauge 2 mounted on the X-axis movable worktable 1, a clamp 3 mounted on the force gauge 2, a workpiece 4 clamped by the clamp 3, a diamond grinding wheel 5 disposed above the clamp 3, and a spindle 6 coaxially connected to the diamond grinding wheel 5. A drive mechanism for driving the spindle 6 to rotate is mounted on a YZ-axis movable platform. A laser displacement sensor 7 is disposed directly above the diamond grinding wheel 5, and a laser 8 is disposed on the outer side of the outer circumference of the diamond grinding wheel 5, emitting X-axis laser light towards the outer side of the diamond grinding wheel 5. The central axis of the spindle 6 is in the Y direction. The laser displacement sensor 7 can be mounted on the frame, and the measuring window of the laser displacement sensor 7 points towards the diamond grinding wheel 5. Both the laser displacement sensor 7 and the force gauge 2 are connected to a computer 9 via cables. The laser 8 is also connected to the computer 9, and the computer 9 adjusts parameters such as the laser spot diameter, frequency, and power of the laser 8.

[0045] The workpiece 4 is made of silicon carbide ceramic and is in block shape. In this embodiment of the invention, the dimensions of workpiece 4 are 50mm × 8mm × 40mm. The width of workpiece 4 is 1-2mm smaller than the width of diamond grinding wheel 5. Workpiece 4 is fixed in fixture 3, and the X-axis moving slide 1 can move in the X direction under the drive of a servo motor. Diamond grinding wheel 5 can rotate around the Y-axis under the drive of a servo motor.

[0046] The laser 8 used in this embodiment emits pulsed laser light with a frequency of 30~50kHz, a power of 10~60W, and a spot diameter of 0.05~2mm.

[0047] In this embodiment of the invention, the minimum resolution of X-axis and Z-axis motion does not exceed 1 μm, and the minimum resolution of Y-axis motion does not exceed 10 μm.

[0048] In this embodiment of the invention, the diamond grinding wheel 5 can be a resin-bonded multilayer diamond grinding wheel, a metal-bonded multilayer diamond grinding wheel, or a ceramic-bonded multilayer diamond grinding wheel, with a diameter ranging from 20mm to 400mm.

[0049] The specific dressing method for the diamond grinding wheel in this embodiment of the invention is as follows:

[0050] S1. Adjust the bottom of the outer circumference of the diamond grinding wheel 5 to be in just contact with the laser emitted by the laser 8; see [link / reference]. Figure 2 The position of the diamond grinding wheel 5 is adjusted by moving the YZ axis forward and backward and up and down, so that the laser emitted by the laser 8 comes into contact with the bottom of the outer circumference of the diamond grinding wheel 5.

[0051] S2. Round the diamond grinding wheel 5; see [link / reference] Figure 3 The drive spindle 6 drives the diamond grinding wheel 5 to rotate, and the YZ-axis moving platform moves along the Y-axis at a speed of [missing information].S 1 Start laser 8 and set the laser spot diameter of laser 8 to [value missing]. d 1 The laser beam 8 is used to trim the outer circumference of the diamond grinding wheel 5. In this embodiment, the rotational speed of the diamond grinding wheel 5 is set to 200 rpm, the laser pulse frequency is 40 kHz, and the power is 40 W. A larger laser beam is used to round the diamond grinding wheel 5; in this embodiment, a larger laser beam is used... d 1= 0.1mm; The YZ-axis moving platform moves slowly along the Y direction for at least one single pass to ensure that the outer circumference of the diamond grinding wheel 5 is rounded. The moving speed is... S 1= 0.1 mm / s.

[0052] S3. Obtain the peak height sequence on the outer peripheral surface of diamond grinding wheel 5; see [link / reference] Figure 6 After finishing, the laser displacement sensor 7 is activated, driving the spindle 6 to rotate the diamond wheel 5 at 10 rpm. The YZ-axis moving platform carries the diamond wheel 5 slowly along the Y direction at a speed of 1 mm / s, allowing the laser displacement sensor 7 to measure the morphology of the outer circumferential surface of the diamond wheel 5, and the measured diamond... k Peak height sequence of the surface h ik ,in i To correct the sequence number, k For series number, k =1, 2, ..., n 0; n 0 is a constant value and is not less than 200. In this embodiment... n 0 = 200.

[0053] Table 1. Peak height sequence of diamond grinding wheel surface 5 when i=1

[0054] Serial Number <![CDATA[ h 1k (mm)]]> Serial Number <![CDATA[ h 1k (mm)]]> Serial Number <![CDATA[ h 1k m(m)]]> Serial Number <![CDATA[ h 1k (mm)]]> 1 0.488 51 0.167 101 0.182 151 0.223 2 0.276 52 0.444 102 0.312 152 0.438 3 0.318 53 0.241 103 0.362 153 0.177 4 0.229 54 0.248 104 0.249 154 0.15 5 0.312 55 0.343 105 0.416 155 0.27 6 0.32 56 0.15 106 0.421 156 0.483 7 0.42 57 0.185 107 0.253 157 0.484 8 0.194 58 0.165 108 0.154 158 0.393 9 0.338 59 0.151 109 0.2 159 0.533 10 0.446 60 0.171 110 0.312 160 0.18 11 0.337 61 0.236 111 0.343 161 0.359 12 0.39 62 0.169 112 0.429 162 0.36 13 0.506 63 0.179 113 0.235 163 0.41 14 0.384 64 0.277 114 0.466 164 0.378 15 0.458 65 0.463 115 0.31 165 0.394 16 0.335 66 0.127 116 0.402 166 0.184 17 0.453 67 0.498 117 0.249 167 0.221 18 0.271 68 0.313 118 0.228 168 0.339 19 0.43 69 0.19 119 0.268 169 0.221 20 0.214 70 0.161 120 0.163 170 0.37 21 0.3 71 0.18 121 0.196 171 0.289 22 0.301 72 0.254 122 0.103 172 0.37 23 0.456 73 0.346 123 0.195 173 0.273 24 0.202 74 0.286 124 0.183 174 0.252 25 0.413 75 0.471 125 0.452 175 0.41 26 0.157 76 0.163 126 0.472 176 0.437 27 0.375 77 0.455 127 0.399 177 0.239 28 0.238 78 0.463 128 0.349 178 0.335 29 0.201 79 0.317 129 0.23 179 0.389 30 0.272 80 0.463 130 0.446 180 0.236 31 0.427 81 0.273 131 0.214 181 0.384 32 0.24 82 0.157 132 0.388 182 0.261 33 0.266 83 0.193 133 0.47 183 0.318 34 0.15 84 0.255 134 0.401 184 0.493 35 0.488 85 0.347 135 0.332 185 0.252 36 0.344 86 0.327 136 0.168 186 0.418 37 0.441 87 0.381 137 0.497 187 0.151 38 0.363 88 0.19 138 0.322 188 0.262 39 0.209 89 0.236 139 0.157 189 0.207 40 0.332 90 0.179 140 0.392 190 0.358 41 0.257 91 0.395 141 0.491 191 0.413 42 0.295 92 0.341 142 0.479 192 0.234 43 0.302 93 0.3 143 0.161 193 0.451 44 0.453 94 0.448 144 0.459 194 0.389 45 0.252 95 0.454 145 0.156 195 0.21 46 0.403 96 0.26 146 0.151 196 0.343 47 0.445 97 0.326 147 0.287 197 0.228 48 0.223 98 0.173 148 0.176 198 0.279 49 0.242 99 0.302 149 0.313 199 0.233 50 0.153 100 0.276 150 0.493 200 0.234

[0055] S4. Calculate the root mean square error of the peak height sequence after diamond wheel correction. The formula is:

[0056] (1)

[0057] In the formula, Peak height sequence h ik The average value.

[0058] Calculate using the values ​​in Table 1 =0.1068mm.

[0059] S5. Determine if diamond grinding wheel 5 has been rounded; set This represents the maximum permissible value for the root mean square error of the peak height. This represents the maximum deviation of the root mean square error of the peak height; if and If the diamond grinding wheel 5 is rounded, then it is determined that YZ has moved downwards a certain distance; otherwise, the moving platform moves downwards a certain distance. Z 0, and return to step S2.

[0060] In this embodiment, the following is taken , ,because YZ moves 50mm downwards on the moving platform and returns to step S2 to continue trimming.

[0061] Move down 50mm and return to step S2 to continue trimming.

[0062] Repeat the process from S2 to S5, and calculate sequentially. As shown in Table 2. Because and This indicates that the diamond grinding wheel 5 has been rounded.

[0063] Table 2

[0064]

[0065] S6. Adjust the laser emitted by laser 8 to be perpendicular to the outer circumferential surface of diamond grinding wheel 5; see [link / reference] Figure 4 The position of the diamond grinding wheel 5 is adjusted by moving the YZ axis forward and backward and up and down, so that the laser emitted by the laser 8 is perpendicular to the outer circumferential surface of the diamond grinding wheel 5.

[0066] S7. Sharpen diamond grinding wheel 5; see [link / reference] Figure 5 The drive spindle 6 drives the diamond grinding wheel 5 to rotate, and the YZ-axis moving platform moves slowly along the Y direction at a speed of [missing information]. S 2 In this embodiment S 2= 0.5mm / s, start laser 8, set the spot diameter of laser 8 to [value missing]. d 2 In this embodiment d 2= 1mm; the large spot size of laser 8 is used to dress the outer circumferential surface of diamond grinding wheel 5; under normal circumstances, d 1 < d 2 ; S 1 < S 2The diamond grinding wheel 5 is rounded by a small spot laser beam and sharpened by a large spot laser beam.

[0067] S8. Obtain the grinding force signal; adjust the relative position of the diamond grinding wheel 5 and the workpiece 4, and perform single-stroke grinding on the workpiece 4, wherein the grinding speed is... v s The feed rate is v w The grinding depth is a p Grinding speed v s The value range is 10~30m / s, and the feed rate is... v w The value range is 5~15 m / min, and the grinding depth is... a p The value range is 5~20μm. In this embodiment, the selected value is... v s =30m / s, feed rate v w =10m / min, grinding depth a p =10μm, single-pass grinding was performed on silicon carbide workpiece 4.

[0068] S9. Calculate the grinding force signal in the Z-axis direction; see [link / reference] Figure 7 and Figure 8 The force signal measured by force gauge 2 during the stable grinding stage (i.e., the time period of 10s to 16s) was filtered at a frequency of 10Hz, and the average value was taken to obtain the grinding force during the stable stage. In this embodiment And the grinding force per unit width in the steady-state stage is obtained according to Formula 2. F j ( j (The number of times the repair was performed);

[0069] (2)

[0070] In the formula, b The workpiece width is 4, in this embodiment b=8mm .

[0071] The grinding force per unit width during the stable phase can be obtained. F 1 =1.46 N / mm;

[0072] S10, when F j < F 0 and hour F 0 represents the maximum allowable grinding force; If the value is the maximum deviation of the grinding force, it is determined that the diamond grinding wheel 5 has been sharpened; otherwise, return to step S7.

[0073] In this implementation, take F 0 = 0.8 ,because F 1> F 0, therefore return to step S7 to continue the adjustment.

[0074] Repeat steps S7-S10 above and calculate sequentially. F j The results are shown in Table 3. Because... F 6< F 0 and This indicates that the diamond grinding wheel 5 has been sharpened, and the entire dressing process is complete.

[0075] Table 3

[0076]

[0077] It should be understood that the specific embodiments described above are for illustrative purposes only and are not intended to limit the scope of the invention. Obvious variations or modifications derived from the spirit of the invention are still within the protection scope of the invention.

Claims

1. A method for laser dressing of diamond grinding wheels, characterized in that: A laser dressing device for diamond grinding wheels includes: an X-axis movable working slide (1), a force gauge (2) mounted on the X-axis movable working slide (1), a clamp (3) mounted on the force gauge (2), a workpiece (4) clamped by the clamp (3), a diamond grinding wheel (5) disposed above the clamp (3), and a spindle (6) coaxially connected to the diamond grinding wheel (5); a drive mechanism for driving the spindle (6) to rotate is mounted on a YZ-axis movable platform; a laser displacement sensor (7) is disposed directly above the diamond grinding wheel (5); a laser (8) is disposed on the outer side of the outer circumference of the diamond grinding wheel (5); the laser (8) emits an X-axis laser toward the outer side of the diamond grinding wheel (5); wherein the central axis of the spindle (6) is in the Y direction; The laser dressing method for diamond grinding wheels includes the following steps: S1. Adjust the bottom of the outer circumference of the diamond grinding wheel (5) to just contact the laser emitted by the laser (8); adjust the position of the diamond grinding wheel (5) by moving the YZ axis forward and backward and up and down to make the laser emitted by the laser (8) just contact the bottom of the outer circumference of the diamond grinding wheel (5). S2. Round the diamond grinding wheel (5); drive the spindle (6) to rotate the diamond grinding wheel (5), and move the YZ-axis moving platform along the Y direction at a speed of . S 1 Start the laser (8) and set the laser spot diameter of the laser (8) to be [value missing]. d 1 The laser spot (8) trims the outer circumference of the diamond grinding wheel (5); S3. Obtain the peak height sequence of the outer peripheral surface of the diamond grinding wheel (5); after dressing, start the laser displacement sensor (7) to drive the spindle (6) to rotate the diamond grinding wheel (5), and move the YZ-axis moving platform along the Y direction with the diamond grinding wheel (5) so that the laser displacement sensor (7) can measure the morphology of the outer peripheral surface of the diamond grinding wheel (5) and obtain the peak height sequence of the diamond grinding wheel surface. h ik ,in i To correct the sequence number, k For series number, k =1, 2, ..., n 0; n 0 is a constant value; S4. Calculate the root mean square error of the peak height sequence after correction of the diamond grinding wheel (5). The formula is: ， In the formula, Peak height sequence h ik The average value; S5. Determine whether the diamond grinding wheel (5) has been rounded; set This represents the maximum permissible value for the root mean square error of the peak height. This represents the maximum deviation of the root mean square error of the peak height; if and If the diamond grinding wheel (5) is rounded, then YZ moves downwards a certain distance from the moving platform. Z 0, and return to step S2; S6. Adjust the laser emitted by the laser (8) to be perpendicular to the outer circumferential surface of the diamond grinding wheel (5); adjust the position of the diamond grinding wheel (5) by moving the YZ axis forward and backward and up and down to make the laser emitted by the laser (8) perpendicular to the outer circumferential surface of the diamond grinding wheel (5); S7. Sharpen the diamond grinding wheel (5); drive the spindle (6) to rotate the diamond grinding wheel (5), and move the YZ-axis moving platform along the Y direction at a speed of [missing value]. S 2 Start the laser (8) and set the laser spot diameter of the laser (8) to be [value missing]. d 2 The laser spot (8) dresses the outer circumferential surface of the diamond grinding wheel (5); whereby... d 1 < d 2 ; S 1 < S 2 ; S8. Obtain the grinding force signal; adjust the relative position of the diamond wheel and the workpiece (4), and perform single-stroke grinding on the workpiece (4), wherein the grinding speed is v s The feed rate is v w The grinding depth is a p ; S9. Calculate the grinding force signal in the Z-axis direction; select the force signal measured by the force gauge (2) during the stable grinding stage, filter it, and take its average value to obtain the grinding force in the stable stage. The grinding force per unit width during the steady-state phase is obtained using the following formula. F j ; ， In the formula, b The width of the workpiece (4); j This is the sequence number of the repairs; S10, when F j < F 0 and hour, F 0 represents the maximum allowable grinding force; If the maximum deviation of the grinding force is found, it is determined that the diamond grinding wheel (5) has been sharpened; otherwise, return to step S7.

2. The method for laser dressing of diamond grinding wheels according to claim 1, characterized in that: The laser displacement sensor is connected to the computer (9) via a cable, and the force measuring instrument (2) is connected to the computer (9) via a cable.

3. The laser dressing method for diamond grinding wheels according to claim 1, characterized in that: In step S2, the diamond grinding wheel (5) rotates at a speed of 200 rpm, the laser pulse frequency is 40 kHz, and the power is 40 W. d 1= 0.1mm; S 1= 0.1 mm / s.

4. The laser dressing method for diamond grinding wheels according to claim 3, characterized in that: In step S7, the rotational speed of the diamond grinding wheel (5) is 200 rpm, the laser pulse frequency is 40 kHz, and the power is 20 W. d 2= 1mm; S 2= 0.5mm / s.

5. The laser dressing method for diamond grinding wheels according to claim 3, characterized in that: In step S8, v s Value range 10~30m / s, feed rate v w The value range is 5~15 m / min, and the grinding depth is... a p The value range is 5~20μm.

6. The laser dressing method for diamond grinding wheels according to claim 5, characterized in that: The workpiece is made of silicon carbide ceramic.

7. The laser dressing method for diamond grinding wheels according to claim 4, characterized in that: In step S3, the diamond grinding wheel rotates at 10 rpm; the Y-axis movement speed is 1 mm / s.

8. The laser dressing method for diamond grinding wheels according to claim 1, characterized in that: n0 is not less than 200; The value range is 0.01 to 0.

07. The value ranges from 0.005 to 0.02, and ; F The value of 0 ranges from 0.5 to 4.

0. The value range is 0.05 to 0.2.

Images