CLIP chip heat dissipation packaging structure and manufacturing process

Abstract

This invention relates to a CLIP chip package copper sheet, comprising a copper sheet body with a first end face and a second end face at both ends, and a protrusion on the second end face; it also includes a CLIP chip heat dissipation package structure, comprising the aforementioned CLIP chip package copper sheet, a lead frame, a chip, a first pin, and a molding compound, wherein the chip is connected to the upper end face of the lead frame, the upper end face of the chip is connected to the lower end face of the protrusion, the bottom end of the bent portion on the CLIP chip package copper sheet is connected to the first pin, and the lead frame, chip, first pin, and CLIP chip package copper sheet are all encapsulated in the molding compound, with the first end face protruding outside the molding compound and flush with the upper end of the molding compound; it also includes a manufacturing process for the CLIP chip package copper sheet and the package structure, wherein the aforementioned CLIP chip package copper sheet is processed by rough cutting, cold heading, and precision cutting, and then the aforementioned package structure is processed from the CLIP chip package copper sheet, thereby solving the technical problem of poor heat dissipation in existing chip package structures.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a CLIP chip heat dissipation packaging structure and a manufacturing process. Background Art

[0002] The lead frame is a carrier that provides mechanical support for the chip. As a conductive medium, the lead frame acts as a bridge connecting the chip to external wires. The lead frame and the package shell together dissipate the heat generated by the chip when it is working, forming a heat dissipation channel. Lead frames are required in most semiconductor integrated blocks. Lead frames are important basic materials in the electronic information industry. The lead frame has the functions of carrying chips, connecting internal chips with external circuit board electrical signals, and installing and fixing electronic devices. The CLIP chip package copper sheet is a bridge structure used to connect the lead frame and the chip. It replaces the standard wire bonding method between the chip and the pin to a certain extent, and can obtain a unique package resistance value, higher current, and better thermal conductivity. The current chip lead frame packaging structure generally includes a CLIP chip packaging copper sheet, a lead frame, a chip and pins. The chip is connected to the lead frame, and the CLIP chip packaging copper sheet is connected to the chip and the pins. The CLIP chip packaging copper sheet, lead frame, chip and pins are all encapsulated in a plastic encapsulation body, wherein the end faces of the lead frame and the pins are exposed outside the plastic encapsulation body. The overall heat dissipation of this packaging structure is poor. Summary of the invention

[0003] In view of the shortcomings of the prior art, the first object of the present invention is to provide a CLIP chip packaging copper sheet to solve the technical problem of poor heat dissipation of the chip packaging structure in the prior art.

[0004] In order to solve the above technical problems, the present invention provides a CLIP chip packaging copper sheet, including a copper sheet body, wherein the upper and lower ends of the copper sheet body along the thickness direction are respectively provided with a first end face and a second end face parallel to each other, and the second end face is provided with a protrusion, the cross-sectional area of ​​the protrusion is smaller than the cross-sectional area of ​​the copper sheet body, and the sum of the thickness of the protrusion and the copper sheet body is greater than or equal to the distance between the upper surface of the plastic packaging colloid in the chip packaging structure and the upper surface of the solder paste on the chip, so that when the CLIP chip packaging copper sheet is installed in the chip packaging structure, the protrusion is connected to the chip and the first end face is exposed outside the plastic packaging colloid.

[0005] After adopting the above structure, the CLIP chip packaging copper sheet in the present invention has the following advantages: a protrusion is provided on the second end surface of the copper sheet body to increase the thickness of this part, so that when the CLIP chip packaging copper sheet is packaged in the packaging structure, the first end surface can be exposed outside the plastic packaging colloid; because the CLIP chip packaging copper sheet has good thermal conductivity, the exposed first end surface can improve the heat dissipation of the CLIP chip packaging copper sheet and even the entire packaging structure; and the thickness of the protrusion is thickened, the resistance is reduced, and the heat generation is correspondingly reduced.

[0006] As an improvement, the thickness of the copper sheet body is 0.1-0.5mm, and the sum of the thickness of the copper sheet body and the protrusion is 0.4-2.0mm; with this structure, compared with the CLIP chip packaging copper sheet in the prior art, the thickness at the copper sheet body and the protrusion is greater, which reduces the heat generated by the CLIP chip packaging copper sheet.

[0007] As an improvement, a bending portion extending away from the protrusion is provided at the edge of the second end face. The thickness of the bending portion is the same as that of the copper sheet body. The upper and lower end faces of the bending portion are parallel to the first end face. When the CLIP chip packaging copper sheet is installed in the chip packaging structure, the bending portion is connected to the pin.

[0008] As an improvement, the copper sheet body, the protruding portion and the bent portion are integrally formed; with this structure, the CLIP chip packaging copper sheet is an integral structure with a simple structure and better performance.

[0009] As an improvement, the width of the protrusion gradually decreases in the direction away from the second end face; this structure is convenient for production and processing.

[0010] The second object of the present invention is to provide a CLIP chip heat dissipation packaging structure, including the above-mentioned CLIP chip packaging copper sheet, and also including a lead frame, a chip, a first pin and a plastic packaging colloid, the upper end surface of the lead frame is connected to the chip through solder paste, the upper end surface of the chip is connected to the lower end surface of the protrusion through solder paste, the bottom end of the bent portion on the CLIP chip packaging copper sheet is connected to the first pin through solder paste, the lead frame, the chip, the first pin and the CLIP chip packaging copper sheet are all encapsulated in the plastic packaging colloid, and the first end surface is exposed outside the plastic packaging colloid and is flush with the upper end surface of the plastic packaging colloid.

[0011] After adopting the above structure, the CLIP chip heat dissipation packaging structure in the present invention has the following advantages: when the CLIP chip packaging copper sheet is packaged in the packaging structure, the first end surface is exposed outside the plastic packaging colloid. Since the CLIP chip packaging copper sheet has good thermal conductivity, the exposed first end surface can improve the heat dissipation of the CLIP chip packaging copper sheet and even the entire packaging structure. In addition, the thickness of the protruding part is thickened, the resistance is reduced, and the heat generation is correspondingly reduced.

[0012] As an improvement, a second pin is integrally formed on one side of the lead frame away from the first pin, the second pin is encapsulated in the plastic encapsulation body, the first pin and the second pin are exposed on both sides of the plastic encapsulation body, and the lower end surface of the lead frame is exposed on the lower end surface of the plastic encapsulation body.

[0013] The third object of the present invention is to provide a CLIP chip package copper sheet manufacturing process, which is used to manufacture the above-mentioned CLIP chip package copper sheet, including a copper sheet strip, and further comprising the following steps:

[0014] S1. Roughly cutting a copper sheet strip according to the outline of the CLIP chip package copper sheet to form a blank for manufacturing the CLIP chip package copper sheet, wherein the blank size is larger than the CLIP chip package copper sheet size to leave a processing allowance, and at least a portion of the blank is connected to the copper sheet strip;

[0015] S2, the thickness of the cold heading blank from other positions except for the protruding parts to the copper sheet body;

[0016] S3. Precision cutting is performed on the blank according to the actual size of the CLIP chip packaging copper sheet to obtain the CLIP chip packaging copper sheet, and at least a portion of the CLIP chip packaging copper sheet is connected to the copper sheet strip.

[0017] After adopting the above process, the manufacturing process of the CLIP chip packaging copper sheet in the present invention has the following advantages: in step S1, the rough cutting to form the blank leaves a processing allowance, ensuring that the CLIP chip packaging copper sheet with the required size is processed, and at least a part of the blank and the CLIP chip packaging copper sheet are connected to the copper sheet material strip, so that the processed CLIP chip packaging copper sheet and the copper sheet material strip are still an integral structure, and the copper sheet material strip can be packaged and transported in the form of a coil, which is more convenient. A protrusion is provided on the CLIP chip packaging copper sheet processed in this way to increase the thickness of this part, so that the first end face of the CLIP chip packaging copper sheet can be exposed outside the plastic packaging colloid when the CLIP chip packaging copper sheet is packaged in the packaging structure. Since the CLIP chip packaging copper sheet has good thermal conductivity, the exposed first end face can improve the heat dissipation of the CLIP chip packaging copper sheet and even the entire packaging structure, and the thickness of the protrusion is thickened, the resistance is reduced, and the heat generation is also reduced accordingly.

[0018] As an improvement, the opposite ends of the blank in step S1 are connected to the copper sheet material strip, and the opposite ends of the CLIP chip packaging copper sheet in step S3 are connected to the copper sheet material strip; in this way, the two ends of the processed CLIP chip packaging copper sheet are connected to the copper sheet material strip, so that the position of the CLIP chip packaging copper sheet on the copper sheet material strip can be relatively fixed, and it is not easy to curl, bend, etc.

[0019] The fourth object of the present invention is to provide a manufacturing process for a CLIP chip heat dissipation packaging structure, comprising a pin strip, a plurality of pin modules are arranged on the pin strip, each pin module comprises a first pin connected to the pin strip and a lead frame connected to the pin strip, and also comprises the above-mentioned CLIP chip packaging copper sheet manufacturing process and the following steps:

[0020] S1. Apply solder paste on the lead frame;

[0021] S2, placing the chip on the solder paste of the lead frame;

[0022] S3, applying solder paste on the upper end surface of the chip and the upper end surface of the first pin;

[0023] S4, taking the CLIP chip packaging copper sheet from the copper sheet strip, connecting the protruding portion of the CLIP chip packaging copper sheet to the solder paste on the chip, and connecting the bent portion on the CLIP chip packaging copper sheet to the solder paste on the first pin;

[0024] S5, connecting the chip to the first pin through a wire;

[0025] S6. Use plastic encapsulation colloid to encapsulate the lead frame, the first pin, the chip and the CLIP chip encapsulation copper sheet.

[0026] After adopting the above process, the manufacturing process of the CLIP chip heat dissipation packaging structure in the present invention has the following advantages: the first end surface of the processed packaging structure is exposed outside the plastic packaging colloid, and because the CLIP chip packaging copper sheet has good thermal conductivity, the exposed first end surface can improve the heat dissipation of the CLIP chip packaging copper sheet and even the entire packaging structure, and the thickness of the protruding part is thickened, the resistance is reduced, and the heat generation is correspondingly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall three-dimensional structure in the first embodiment of the present invention.

[0028] Figure 2 It is a schematic diagram of the dissection of the packaging structure in the second embodiment of the present invention.

[0029] Figure 3 It is a schematic diagram of the overall structure of the packaging structure in the second embodiment of the present invention.

[0030] Figure 4 Schematic diagram of the structure of the blank and the copper sheet strip after step S1 in the third embodiment of the present invention.

[0031] Figure 5 This is a schematic diagram of the structure of the copper sheet strip and the CLIP chip packaging copper sheet after step S3 in the third embodiment of the present invention.

[0032] Figure 6Schematic diagram of the structure of the lead strip before processing in the fourth embodiment of the present invention.

[0033] Figure 7 It is a schematic diagram of the structure of the packaging structure on the lead strip in the fourth embodiment of the present invention.

[0034] Figure numerals: 1, copper sheet body; 101, first end face; 102, second end face; 2, protrusion; 3, bending portion; 4, lead frame; 5, chip; 6, first pin; 7, plastic encapsulation colloid; 8, second pin; 9, copper sheet strip; 10, blank; 11, pin strip; 12, pin module. DETAILED DESCRIPTION

[0035] The CLIP chip heat dissipation packaging structure and manufacturing process of the present invention are described in detail below with reference to the accompanying drawings.

[0036] like Figure 1 As shown, a CLIP chip packaging copper sheet comprises a copper sheet body 1, wherein the upper and lower ends of the copper sheet body 1 along the thickness direction thereof are respectively provided with a first end face 101 and a second end face 102 which are parallel to each other, and the second end face 102 is provided with a protrusion 2, wherein the cross-sectional area of ​​the protrusion 2 is smaller than the cross-sectional area of ​​the copper sheet body 1, and the cross-sectional area is the area of ​​the cross section in the horizontal direction, and the sum of the thickness of the protrusion 2 and the copper sheet body 1 is greater than or equal to the distance between the upper surface of the plastic encapsulation 7 in the chip packaging structure and the upper surface of the solder paste on the chip 5, wherein the thickness of the copper sheet body 1 is 0.1-0.5 mm, and the sum of the thickness of the copper sheet body 1 and the protrusion 2 is 0.4-2.0 mm. In this embodiment, the thickness of the copper sheet body 1 is 0.2 mm, and the sum of the thickness of the copper sheet body 1 and the protrusion 2 is 0.5 mm.

[0037] like Figure 1 As shown, a bending portion 3 extending away from the protrusion 2 is provided at the edge of the second end face 102, and the thickness of the bending portion 3 is the same as that of the copper sheet body 1. Specifically, a notch is provided at one of the corners of the copper sheet body 1, and the bending portion 3 is provided on an extended structure formed by the notch on the copper sheet body 1. The bending portion 3 is bent toward the second end face 102, and the upper and lower end faces of the bending portion 3 are parallel to the first end face 101, and the copper sheet body 1, the protrusion 2 and the bending portion 3 are integrally formed, and the width of the protrusion 2 gradually decreases away from the second end face 102, that is, the cross-sectional shape of the protrusion 2 is an inverted isosceles trapezoid.

[0038] When the CLIP chip packaging copper sheet is installed in the chip packaging structure, the protrusion 2 is connected to the chip 5 and the first end face 101 is exposed outside the plastic encapsulation body 7, and the bent portion 3 is connected to the pin, wherein the protrusion 2 and the chip 5, and the bent portion 3 and the pin are all connected through solder paste. It should be noted that the first end face 101 exposed outside the plastic encapsulation body 7 means that the first end face 101 is not covered by the plastic encapsulation body 7, for example, the first end face 101 is flush with the end face of the plastic encapsulation body 7; in this embodiment, the first end face 101 is flush with the upper end face of the plastic encapsulation body 7, that is, the sum of the thickness of the protrusion 2 and the copper sheet body 1 is equal to the distance between the upper surface of the plastic encapsulation body 7 and the upper surface of the solder paste on the chip 5 in the chip packaging structure.

[0039] By arranging the protrusion 2 on the second end face 102 of the copper sheet body 1 to increase the thickness of this part, the first end face 101 of the CLIP chip package copper sheet can be exposed outside the plastic packaging colloid 7 when the CLIP chip package copper sheet is packaged in the packaging structure. Since the CLIP chip package copper sheet has good thermal conductivity, the exposed first end face 101 can improve the heat dissipation of the CLIP chip package copper sheet and even the entire packaging structure. In addition, the thickness of the protrusion 2 is thickened, the resistance is reduced, and the heat generation is correspondingly reduced.

[0040] Embodiment 2:

[0041] like Figure 2 and Figure 3 As shown, a CLIP chip heat dissipation packaging structure includes the CLIP chip packaging copper sheet in the first embodiment, and also includes a lead frame 4, a chip 5, a first pin 6 and a plastic packaging colloid 7, the upper end surface of the lead frame 4 is connected to the chip 5 through solder paste, the upper end surface of the chip 5 is connected to the lower end surface of the protrusion 2 through solder paste, the bottom end of the bent portion 3 on the CLIP chip packaging copper sheet is connected to the first pin 6 through solder paste, and a second pin 8 is integrally formed on the side of the lead frame 4 away from the first pin 6, wherein the specific structures of the lead frame 4, the first pin 6 and the second pin 8 are all prior art and are not repeated here; the lead frame 4. The chip 5, the first pin 6, the CLIP chip packaging copper sheet and the second pin 8 are all encapsulated in the plastic encapsulation body 7, and the first end face 101 is exposed outside the plastic encapsulation body 7 and is flush with the upper end face of the plastic encapsulation body 7, the first pin 6 and the second pin 8 are exposed on both side faces of the plastic encapsulation body 7, the lower end face of the first pin 6, the lower end face of the second pin 8 and the lower end face of the lead frame 4 are all exposed on the lower end face of the plastic encapsulation body 7, and the side end faces of the first pin 6 and the second pin 8 are respectively flush with the two side faces of the plastic encapsulation body 7, and the lower end face of the first pin 6, the lower end face of the second pin 8 and the lower end face of the lead frame 4 are all flush with the lower end face of the plastic encapsulation body 7.

[0042] In addition, in this embodiment, there are four first pins 6 and four second pins 8, totaling eight pins, wherein the first pin 6 is located on the left side of the lead frame 4, and the end of the first pin 6 away from the lead frame 4 is bent downward and is basically at the same height as the lead frame 4, while the end of the first pin 6 close to the lead frame 4 is higher than the lead frame 4, and the four first pins 6 are spaced apart, wherein the first first pin 6 is independently provided, and is provided with an independent connecting portion, and the following three first pins 6 are integrally formed through another connecting portion, and the bending portion 3 is connected to the connecting portions of the three integrally formed first pins 6 through solder paste, and the cross-sectional area of ​​the bending portion 3 is smaller than the cross-sectional area of ​​the connecting portions of the three integrally formed first pins 6, and the chip 5 is connected to the connecting portion of the independent first pin 6 through a wire, and the cross-sectional area of ​​the copper sheet body 1 is smaller than the cross-sectional area of ​​the lead frame 4; the four second pins 8 are also spaced apart, and the positions of the four second pins 8 correspond to the positions of the four first pins 6 one by one, and are symmetrically distributed left and right, and the four second pins 8 are not bent, and are directly led out horizontally from the packaging structure 4, and the shapes and sizes of the four first pins 6 and the four second pins 8 are the same.

[0043] When the CLIP chip package copper sheet is packaged in the packaging structure, the first end surface 101 is exposed outside the plastic packaging colloid 7. Since the CLIP chip package copper sheet has good thermal conductivity, the exposed first end surface 101 can improve the heat dissipation of the CLIP chip package copper sheet and even the entire packaging structure. In addition, the thickness of the protruding portion 2 is thickened, the resistance is reduced, and the heat generation is correspondingly reduced.

[0044] Embodiment three:

[0045] A manufacturing process for a CLIP chip package copper sheet, used for manufacturing the CLIP chip package copper sheet in the first embodiment, comprises a copper sheet strip 9, and further comprises the following steps: S1, rough cutting the copper sheet strip 9 according to the outline of the CLIP chip package copper sheet to form a blank 10 for manufacturing the CLIP chip package copper sheet, the size of the blank 10 is larger than the size of the CLIP chip package copper sheet to leave a processing allowance, and at least a portion of the blank 10 is connected to the copper sheet strip 9; S2, cold heading the blank 10 except for the forming protrusion 2 to the thickness of the copper sheet body 1; S3, fine cutting the blank 10 according to the actual size of the CLIP chip package copper sheet to obtain the CLIP chip package copper sheet, and at least a portion of the CLIP chip package copper sheet is connected to the copper sheet strip 9; wherein, the opposite ends of the blank 10 in step S1 are connected to the copper sheet strip 9, and the opposite ends of the CLIP chip package copper sheet in step S3 are connected to the copper sheet strip 9.

[0046] The specific process of manufacturing copper sheet for CLIP chip packaging is as follows: first, a rough cut is made on the copper sheet material strip 9 to form a blank 10, wherein the rough cut is divided into two cuts, one above and one below, which are not connected to each other, so that a part of each of the left and right ends of the blank 10 is still connected to the copper sheet material strip 9, and the upper and lower cuts are cut through the copper sheet material strip 9 along the contour of the required CLIP chip packaging copper sheet. The result is as follows Figure 4 As shown; then, a position of the protrusion 2 is reserved on the blank 10, and the position outside the protrusion 2 is thinned by cold heading process, so that the protrusion 2 and the copper sheet body 1 are formed; finally, the CLIP chip packaging copper sheet is precisely cut according to the actual size of the required CLIP chip packaging copper sheet, and similarly, the precision cutting is also two cuts that are not connected to each other from top to bottom, so that a part of the left and right ends of the CLIP chip packaging copper sheet is still connected to the copper sheet material strip 9, and the upper and lower cutters both cut through the copper sheet material strip 9 along the actual size of the CLIP chip packaging copper sheet, and the result is as shown Figure 5 As for the processing technology of the bending portion 3, it is the prior art and will not be described in detail here.

[0047] At least a portion of the blank 10 and the CLIP chip packaging copper sheet are connected to the copper sheet material strip 9, so that the processed CLIP chip packaging copper sheet and the copper sheet material strip 9 are still an integral structure. The copper sheet material strip 9 can be packaged and transported in the form of a coil, which is more convenient. A protrusion 2 is set on the CLIP chip packaging copper sheet processed in this way to increase the thickness of this part, so that the first end face 101 of the CLIP chip packaging copper sheet can be exposed outside the plastic packaging colloid 7 when the CLIP chip packaging copper sheet is packaged in the packaging structure. Since the CLIP chip packaging copper sheet has good thermal conductivity, the exposed first end face 101 can improve the heat dissipation of the CLIP chip packaging copper sheet and even the entire packaging structure. In addition, the thickness of the protrusion 2 is thickened, the resistance is reduced, and the heat generation is correspondingly reduced.

[0048] Embodiment 4:

[0049] A manufacturing process of a CLIP chip heat dissipation packaging structure, used to manufacture the packaging structure in the second embodiment, comprises a lead strip 11, the lead strip 11 is as follows Figure 6As shown, a plurality of pin modules 12 are arranged on the pin strip 11, and each pin module 12 includes a first pin 6 connected to the pin strip 11 and a lead frame 4 connected to the pin strip 11. The specific structure thereof is prior art and will not be described in detail here. The process includes the CLIP chip package copper sheet manufacturing process in the third embodiment, and further includes the following steps: S1, applying solder paste on the lead frame 4; S2, placing the chip 5 on the solder paste of the lead frame 4; S3, applying solder paste on the upper end surface of the chip 5 and the upper end surface of the first pin 6; S4, taking the CLIP from the copper sheet strip 9 The CLIP chip encapsulation copper sheet is connected, and the protrusion 2 of the CLIP chip encapsulation copper sheet is connected to the solder paste on the chip 5, and the bent portion 3 on the CLIP chip encapsulation copper sheet is connected to the solder paste on the first pin 6; S5, the chip 5 is connected to the first pin 6 through a lead wire; S6, the lead frame 4, the first pin 6, the chip 5 and the CLIP chip encapsulation copper sheet are encapsulated with a plastic encapsulation 7, and during encapsulation, the upper end surface of the plastic encapsulation 7 is flush with the first end surface 101, and the lower end surface of the first pin 6, the lower end surface of the second pin 8 and the lower end surface of the lead frame 4 are all flush with the lower end surface of the plastic encapsulation 7. The result is as follows Figure 7 Finally, each package structure on the lead strip 11 is cut along the side wall of the plastic encapsulation body 7 , so that the side end surfaces of the first lead 6 and the second lead 8 are flush with the side surfaces of the plastic encapsulation body 7 .

[0050] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above four embodiments, and all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of the present invention.

Claims

1. A CLIP chip packaging copper sheet manufacturing process, characterized in that: Used to manufacture a CLIP chip encapsulation copper sheet, the CLIP chip encapsulation copper sheet comprising a copper sheet body (1), wherein the copper sheet body (1) is provided with a first end face (101) and a second end face (102) parallel to each other at the upper and lower ends along the thickness direction thereof, the second end face (102) is provided with a protrusion (2), the cross-sectional area of ​​the protrusion (2) is smaller than the cross-sectional area of ​​the copper sheet body (1), the sum of the thickness of the protrusion (2) and the copper sheet body (1) is greater than or equal to the distance between the upper surface of a plastic encapsulation body (7) in a chip encapsulation structure and the upper surface of solder paste on a chip (5), so that when the CLIP chip encapsulation copper sheet is installed in the chip encapsulation structure, the protrusion (2) is connected to the chip (5) and the first end face (101) is exposed outside the plastic encapsulation body (7), and further comprising a copper sheet strip (9) and the following steps: S1. Roughly cutting the copper sheet strip (9) according to the outline of the CLIP chip package copper sheet to form a blank (10) for manufacturing the CLIP chip package copper sheet, wherein the size of the blank (10) is larger than the size of the CLIP chip package copper sheet to leave a processing margin, and at least a portion of the blank (10) is connected to the copper sheet strip (9); S2, cold heading the blank (10) except for the position used to form the protrusion (2) to the thickness of the copper sheet body (1); S3. Precision cutting the CLIP chip packaging copper sheet on the blank (10) according to the actual size of the CLIP chip packaging copper sheet to obtain the CLIP chip packaging copper sheet, and connecting at least a portion of the CLIP chip packaging copper sheet to the copper sheet strip (9).

2. The CLIP chip packaging copper sheet manufacturing process according to claim 1, characterized in that: The copper sheet body (1) has a thickness of 0.1-0.5 mm, and the sum of the thicknesses of the copper sheet body (1) and the protruding portion (2) is 0.4-2.0 mm.

3. The CLIP chip packaging copper sheet manufacturing process according to claim 1, characterized in that: A bent portion (3) extending in a direction away from the protruding portion (2) is provided at the edge of the second end surface (102); the bent portion (3) has the same thickness as the copper sheet body (1); the upper and lower end surfaces of the bent portion (3) are parallel to the first end surface (101); and when the CLIP chip packaging copper sheet is installed in a chip packaging structure, the bent portion (3) is connected to a pin.

4. The CLIP chip packaging copper sheet manufacturing process according to claim 3, characterized in that: The copper sheet body (1), the protruding portion (2) and the bent portion (3) are integrally formed.

5. The CLIP chip packaging copper sheet manufacturing process according to claim 1, characterized in that: The width of the protruding portion (2) gradually decreases in a direction away from the second end surface (102).

6. The CLIP chip packaging copper sheet manufacturing process according to claim 1, characterized in that: The opposite ends of the blank (10) in step S1 are connected to the copper sheet strip (9), and the opposite ends of the CLIP chip packaging copper sheet in step S3 are connected to the copper sheet strip (9).

7. A manufacturing process for a CLIP chip heat dissipation packaging structure, comprising a lead strip (11), wherein the lead strip (11) is provided with a plurality of lead modules (12), each of the lead modules (12) comprising a first lead (6) connected to the lead strip (11) and a lead frame (4) connected to the lead strip (11), characterized in that: The method comprises the process for manufacturing the copper sheet for CLIP chip packaging according to claim 1, further comprising the following steps: S1, applying solder paste on the lead frame (4); S2, placing the chip (5) on the solder paste of the lead frame (4); S3, applying solder paste on the upper end surface of the chip (5) and the upper end surface of the first lead (6); S4, taking a CLIP chip packaging copper sheet from the copper sheet strip (9), connecting the protruding portion (2) of the CLIP chip packaging copper sheet to the solder paste on the chip (5), and connecting the bent portion (3) on the CLIP chip packaging copper sheet to the solder paste on the first pin (6); S5, connecting the chip (5) and the first pin (6) via a wire; S6. Encapsulating the lead frame (4), the first lead (6), the chip (5) and the CLIP chip encapsulation copper sheet with a plastic encapsulation colloid (7).

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