Thin-film circuit boards and keyboard devices incorporating thin-film circuit boards

Abstract

This invention provides a thin-film circuit board and a keyboard device having the thin-film circuit board. The thin-film circuit board includes a first thin-film substrate, a spacer substrate, a second thin-film substrate, and a third thin-film substrate. The first thin-film substrate has a first gas channel and a first conductive contact. The spacer substrate has a first vent and a second vent. The first gas channel communicates between the first vent and the second vent and corresponds to the first conductive contact. The second thin-film substrate has a second gas channel, a second conductive contact, a third vent, and a fourth vent. The second gas channel communicates between the third vent and the fourth vent and corresponds to the second conductive contact, and the second gas channel is connected to the first gas channel through the first vent and the second vent. The third thin-film substrate has a third gas channel. The third gas channel is connected to the second gas channel through the third vent and the fourth vent.

Description

Technical Field

[0001] This invention relates to the field of input devices, and more particularly to a thin-film circuit board for use in keyboard devices. Background Technology

[0002] With the rapid development of technology and the booming development of electronic devices, many conveniences have been brought to human life. Therefore, making the operation of electronic devices more user-friendly is an important issue. Common input devices for electronic devices include mice, keyboards, and trackballs. Among them, keyboards allow users to directly input text and symbols into the computer, and are therefore highly valued.

[0003] The keyboard device includes multiple key structures. Each key structure mainly includes keycaps stacked in sequence, a scissor-switch connector, a membrane circuit board, and a key base plate. If it is an illuminated keyboard, a backlight module is additionally located below the key base plate. Specifically, the membrane circuit board has a membrane switch, and an elastic element is disposed between the keycap and the membrane circuit board. The scissor-switch connector connects the keycap and the key base plate and includes a first frame and a second frame pivotally connected to the first frame, allowing the first and second frames to swing relative to each other. When a keycap of any key structure is pressed and moves downward relative to the key base plate, the first and second frames of the scissor-switch connector change from an open state to an overlapped state. The downward-moving keycap compresses the elastic element, causing the elastic element to abut and trigger the corresponding membrane switch, thus generating a corresponding key signal. When the keycaps of the key structure are no longer pressed, they will move upward relative to the key base plate according to the elastic restoring force of the elastic element. At this time, the first frame and the second frame will change from the overlapping state to the open state, and the keycaps will return to their original positions.

[0004] A known thin-film circuit board for a keyboard device includes an upper thin-film substrate, a lower thin-film substrate, and a middle thin-film substrate situated between the upper and lower thin-film substrates. The lower surface of the upper thin-film substrate has a first circuit pattern, which includes multiple upper contacts and multiple upper silver paste lines corresponding to the aforementioned key structures. The upper surface of the lower thin-film substrate has a second circuit pattern, which includes multiple lower contacts and multiple lower silver paste lines corresponding to the upper contacts. The middle thin-film substrate has multiple openings corresponding to the upper and lower contacts. Each upper contact and its corresponding lower contact together form the aforementioned membrane switch. Furthermore, the upper thin-film substrate is bonded to the middle thin-film substrate using an upper layer of hydrogel adhesive, and the lower thin-film substrate is bonded to the middle thin-film substrate using a lower layer of hydrogel adhesive.

[0005] When the upper contact of the thin-film circuit board contacts the lower contact through the opening of the middle thin-film substrate to form a triggered conduction state, a compressed airflow will be generated between the upper and lower thin-film substrates. In order to smoothly discharge this compressed airflow, gas channels will be formed in the upper and lower water adhesive layers respectively to discharge this compressed gas.

[0006] However, conventional thin-film circuit boards employ a three-layer structure consisting of an upper thin-film substrate, a middle thin-film substrate, and a lower thin-film substrate. To facilitate the discharge of compressed gas, large-area gas channels must be formed within the upper and lower adhesive layers. This results in a significant reduction in the area of ​​the upper and lower adhesive layers, leading to weaker structural strength. When the thin-film circuit board is submerged in water, water can easily penetrate and corrode the conductive circuitry, causing malfunctions. Therefore, how to address these problems is a key focus for those skilled in the art. Summary of the Invention

[0007] One of the objectives of this invention is to provide a thin-film circuit board with high waterproof performance.

[0008] Another object of the present invention is to provide a keyboard device having a thin-film circuit board with high waterproof performance.

[0009] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0010] To achieve one, some, or all of the above-mentioned objectives, or other objectives, the present invention provides a thin-film circuit board, comprising a first thin-film substrate, a spacer substrate, a second thin-film substrate, and a third thin-film substrate. The first thin-film substrate has a first gas channel and a first conductive contact. The first conductive contact is configured corresponding to the first gas channel. The spacer substrate is disposed below the first thin-film substrate and has a first vent and a second vent, the first gas channel connecting the first vent and the second vent. The second thin-film substrate is disposed below the spacer substrate and has a second gas channel, a second conductive contact, a third vent, and a fourth vent. The second conductive contact is configured corresponding to the second gas channel, the second gas channel connecting the third vent and the fourth vent, and the second gas channel is connected to the first gas channel through the first vent and the second vent. The third thin-film substrate is disposed below the second thin-film substrate and has a third gas channel, the third gas channel connecting to the second gas channel through the third vent and the fourth vent.

[0011] In one embodiment of the present invention, the first thin film substrate further includes a first flexible circuit board and a first adhesive layer. The first adhesive layer is located between the first flexible circuit board and the spacer substrate. A first conductive contact is disposed on the first flexible circuit board, and a first gas channel is formed on the first adhesive layer.

[0012] In one embodiment of the present invention, the second thin film substrate further includes a second flexible circuit board and a second adhesive layer. The second adhesive layer is located between the second flexible circuit board and the spacer substrate, and the spacer substrate is located between the first adhesive layer and the second adhesive layer. A second conductive contact, a third vent, and a fourth vent are disposed on the second flexible circuit board. The second conductive contact is located between the third vent and the fourth vent, and a second gas channel is formed on the second adhesive layer.

[0013] In one embodiment of the present invention, the third thin film substrate further includes a third flexible circuit board and a third adhesive layer, the third adhesive layer being located between the second flexible circuit board and the third flexible circuit board, the second flexible circuit board being located between the second adhesive layer and the third adhesive layer, and a third gas channel being formed on the third adhesive layer.

[0014] In one embodiment of the present invention, the first conductive contact or the second conductive contact is projected onto the third adhesive layer to form a projection area, and the third gas channel surrounds the projection area.

[0015] In one embodiment of the present invention, the spacer substrate is located between the first flexible circuit board and the second flexible circuit board, such that there is a gap between the first conductive contact and the second conductive contact, and the spacer substrate has an opening relative to the first conductive contact and the second conductive contact, and the first gas channel and the second gas channel are respectively connected to the opening.

[0016] In one embodiment of the present invention, the first vent and the second vent are respectively located on the first side of the spacer substrate and the second side opposite to the first side, and the third vent and the fourth vent are respectively located on the third side of the second flexible circuit board and the fourth side opposite to the third side, and the first vent is configured to correspond to the third vent, and the second vent is configured to correspond to the fourth vent.

[0017] In one embodiment of the present invention, the first gas channel includes a first central channel portion, a first side channel portion and a second side channel portion. The first central channel portion is connected between the first side channel portion and the second side channel portion. A first conductive contact is configured corresponding to the first central channel portion. The first side channel portion is connected to a first vent, and the second side channel portion is connected to a second vent.

[0018] In one embodiment of the present invention, the first thin film substrate further includes a first metal line extending from the first conductive contact, and a portion of the first metal line corresponds to the first side channel portion or the second side channel portion of the first gas channel.

[0019] In one embodiment of the present invention, the second gas channel includes a second central channel portion, a third side channel portion and a fourth side channel portion. The second central channel portion is connected between the third side channel portion and the fourth side channel portion. The second conductive contact is configured corresponding to the second central channel portion. The third side channel portion is connected to the third vent, and the fourth side channel portion is connected to the fourth vent.

[0020] In one embodiment of the present invention, the second thin film substrate further includes a second metal line extending from the second conductive contact, and a portion of the second metal line corresponds to the third side channel portion or the fourth side channel portion of the second gas channel.

[0021] In one embodiment of the present invention, the thin film circuit board further includes at least one light-emitting element, the light-emitting element is disposed on a third thin film substrate, and the third thin film substrate is made of a light-guiding material.

[0022] The present invention further provides a keyboard device including multiple key structures. Each key structure includes a keycap, a key base plate, an elastic element, a connecting component, and a thin-film circuit board. The key base plate is disposed below the keycap. The elastic element is disposed between the keycap and the key base plate. The connecting component is disposed between the keycap and the key base plate. The thin-film circuit board is disposed between the elastic element and the key base plate. The thin-film circuit board includes a first thin-film substrate, a spacer substrate, a second thin-film substrate, and a third thin-film substrate. The first thin-film substrate has a first gas channel and a first conductive contact. The first conductive contact is disposed corresponding to the first gas channel. The spacer substrate is disposed below the first thin-film substrate and has a first vent and a second vent, the first gas channel being connected between the first vent and the second vent. The second thin-film substrate is disposed below the spacer substrate and has a second gas channel, a second conductive contact, a third vent, and a fourth vent. The second conductive contact is located corresponding to the second gas channel, the second gas channel being connected between the third vent and the fourth vent, and the second gas channel being connected to the first gas channel through the first vent and the second vent. The third thin film substrate is disposed below the second thin film substrate and has a third gas channel, which is connected to the second gas channel through a third vent and a fourth vent.

[0023] The thin-film circuit board of this invention adopts a four-layer thin-film substrate architecture. Compared with the known three-layer thin-film substrate architecture of thin-film circuit boards, the thin-film circuit board of this invention adds gas channels on the third thin-film substrate. Under this structural design, the area of ​​the first gas channel formed in the first adhesive layer and the area of ​​the second gas channel formed in the second adhesive layer can be effectively and significantly reduced. With the significant reduction in the area of ​​the first and second gas channels, the area of ​​the first and second adhesive layers will inevitably increase, thereby improving the structural strength of the first and second adhesive layers and achieving high waterproof performance, thus effectively protecting the circuit traces inside the thin-film circuit board. In addition, when the first and second conductive contacts of the thin-film circuit board form a triggered conduction state to generate compressed gas, the compressed gas can be easily discharged outside the thin-film circuit board through the exhaust path formed by the interconnection of the first, second, and third gas channels. This effectively avoids electrical problems caused by trapped gas due to poor air escape in the confined space and effectively avoids electrical problems caused by high temperature and high pressure on the circuit traces due to prolonged and rapid key presses.

[0024] To make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the external structure of a keyboard device according to an embodiment of the present invention.

[0026] Figure 2 for Figure 1 The diagram shows an exploded view of the button structure.

[0027] Figure 3 for Figure 2 The diagram shows an exploded view of the components of a thin-film circuit board.

[0028] Figure 4 For along Figure 2 The diagram shows a cross-sectional view of line segment AA on the thin-film circuit board.

[0029] Figure 5 for Figure 3 The diagram shows a top view of a portion of the components assembled on a thin-film circuit board.

[0030] Figure 6 for Figure 3 The diagram shows a top view of another part of the thin-film circuit board after assembly.

[0031] Figure 7 for Figure 3 The diagram shows a top view of another part of the thin-film circuit board after assembly.

[0032] Figure 8 This is a schematic diagram of the structure of a thin-film circuit board according to another embodiment of the present invention.

[0033] The attached figures are labeled as follows:

[0034] 1: Keyboard device

[0035] 10: Button Structure

[0036] 11: Keycaps

[0037] 12: Button base plate

[0038] 13: Elastic element

[0039] 14: Connection Components

[0040] 15, 15a: Thin-film circuit boards

[0041] 151: First thin film substrate

[0042] 152: Spacer substrate

[0043] 153: Second thin film substrate

[0044] 154: Third thin film substrate

[0045] 155: Light-emitting element

[0046] 1511: The first flexible circuit board

[0047] 1512: First adhesive layer

[0048] 1520: Opening

[0049] 1531: Second Flexible Circuit Board

[0050] 1532: Second adhesive layer

[0051] 1541: Third Flexible Circuit Board

[0052] 1542: Third adhesive layer

[0053] A1, A2, A3, A3: Arrows

[0054] C1: First conductive contact

[0055] C2: Second conductive contact

[0056] D: Spacing distance

[0057] G1: First Gas Passage

[0058] G2: Second gas passage

[0059] G3: Third Gas Channel

[0060] G11: First Central Passage Section

[0061] G12: First side passage

[0062] G13: Second side passage

[0063] G21: Second Central Passage Section

[0064] G22: Third Side Passage Section

[0065] G23: Fourth Side Passage Section

[0066] H1: First pore

[0067] H2: Second pore

[0068] H3: Third pore

[0069] H4: Fourth pore

[0070] R: Projection area

[0071] S1: First side

[0072] S2: Second side

[0073] S3: Third side

[0074] S4: Fourth Side

[0075] W1: First metal circuit

[0076] W2: Second metal circuit Detailed Implementation

[0077] Please see Figures 1 to 4 , Figure 1 This is a schematic diagram of the external structure of a keyboard device according to an embodiment of the present invention. Figure 1 This is a schematic diagram of the external structure of a keyboard device according to an embodiment of the present invention. Figure 2 for Figure 1 The diagram shows an exploded view of the button structure. Figure 3 for Figure 2 The diagram shows an exploded view of the components of a thin-film circuit board. Figure 4 For along Figure 2 The diagram shows a cross-sectional view of line segment AA on the thin-film circuit board. Figure 5 for Figure 3 The diagram shows a top view of a portion of the components assembled on a thin-film circuit board. Figure 6 for Figure 3 The diagram shows a top view of another part of the thin-film circuit board after assembly. Figure 7 for Figure 3 The diagram shows a top view of another portion of the thin-film circuit board after assembly. For a clearer illustration, Figure 2 Only a single button structure and its related components are shown.

[0078] like Figure 1 and Figure 2 As shown, the keyboard device 1 of this embodiment includes multiple key structures 10. Each key structure 10 includes a keycap 11, a key base plate 12, an elastic element 13, a connecting component 14, and a membrane circuit board 15. The key base plate 12 is disposed below the keycap 11. The elastic element 13 is disposed between the keycap 11 and the membrane circuit board 15. The connecting component 14 connects the keycap 11 and the key base plate 12. The membrane circuit board 15 is disposed between the elastic element 13 and the key base plate 12. In this embodiment, these key structures 10 can be classified as general keys, number keys, function keys, etc., which are used by the user to press with their fingers to cause the keyboard device 1 to generate corresponding key input signals to the computer, thereby causing the computer to perform corresponding functions. For example, general keys are used to input symbols such as English letters, number keys are used to input numbers, and function keys are used to provide various shortcut functions, such as F1 to F12, or larger and longer space keys or shift keys.

[0079] It should be noted that the components of the above-mentioned button structure 10 and the actuation relationship between the components are known technologies, so they will not be described in detail here.

[0080] The following is a further detailed description of the structure of the thin-film circuit board 15 according to an embodiment of the present invention.

[0081] like Figures 3 to 7As shown, the thin-film circuit board 15 of this embodiment includes a first thin-film substrate 151, a spacer substrate 152, a second thin-film substrate 153, and a third thin-film substrate 154 stacked sequentially from top to bottom. The first thin-film substrate 151 has a first gas channel G1 and a first conductive contact C1. The first conductive contact C1 of the first thin-film substrate 151 is configured corresponding to the first gas channel G1. The spacer substrate 152 is disposed below the first thin-film substrate 151, and the spacer substrate 152 has a first vent H1 and a second vent H2. The first gas channel G1 of the first thin-film substrate 151 communicates between the first vent H1 and the second vent H2. The second thin-film substrate 153 is disposed below the spacer substrate 152, and the second thin-film substrate 153 has a second gas channel G2, a second conductive contact C2, a third vent H3, and a fourth vent H4. The second conductive contact C2 of the second thin film substrate 153 is configured corresponding to the second gas channel G2, which is connected between the third vent H3 and the fourth vent H4. Furthermore, the second gas channel G2 is connected to the first gas channel G1 via the first vent H1 and the second vent H2 located on the spacer substrate 152. The third thin film substrate 154 is disposed below the second thin film substrate 153 and has a third gas channel G3. The third gas channel G3 of the third thin film substrate 154 is connected to the second gas channel G2 via the third vent H3 and the fourth vent H4 located on the second thin film substrate 153.

[0082] like Figure 3 and Figure 4 As shown, the first thin-film substrate 151 in this embodiment further includes a first flexible circuit board 1511 and a first adhesive layer 1512. The first adhesive layer 1512 is located between the first flexible circuit board 1511 and the spacer substrate 152, and the first flexible circuit board 1511 is bonded to the upper surface of the spacer substrate 152 through the first adhesive layer 1512. In this embodiment, a first conductive contact C1 of the first thin-film substrate 151 is disposed on the first flexible circuit board 1511. Specifically, the first conductive contact C1 is disposed on the surface of the first flexible circuit board 1511 facing the spacer substrate 152, and a first gas channel G1 is formed on the first adhesive layer 1512.

[0083] like Figure 3 and Figure 4As shown, the second thin-film substrate 153 in this embodiment further includes a second flexible circuit board 1531 and a second adhesive layer 1532. The second adhesive layer 1532 is located between the second flexible circuit board 1531 and the spacer substrate 152, and the spacer substrate 152 is located between the first adhesive layer 1512 and the second adhesive layer 1532. The second flexible circuit board 1531 is bonded to the lower surface of the spacer substrate 152 through the second adhesive layer 1532. In this embodiment, the second conductive contact C2, the third vent H3, and the fourth vent H4 of the second thin-film substrate 153 are disposed on the second flexible circuit board 1531. Specifically, the second conductive contact C2 is disposed on the surface of the second flexible circuit board 1531 facing the spacer substrate 152, and the second conductive contact C2 is located between the third vent H3 and the fourth vent H4, while the second gas channel G2 is formed on the second adhesive layer 1532.

[0084] like Figure 3 and Figure 4 As shown, the third thin-film substrate 154 in this embodiment includes a third flexible circuit board 1541 and a third adhesive layer 1542. The third adhesive layer 1542 is located between the second flexible circuit board 1531 and the third flexible circuit board 1541, and the second flexible circuit board 1531 is located between the second adhesive layer 1532 and the third adhesive layer 1542. The third flexible circuit board 1541 is bonded to the lower surface of the second flexible circuit board 1531 through the third adhesive layer 1542. In this embodiment, a third gas channel G3 is formed on the third adhesive layer 1542.

[0085] like Figure 3 and Figure 4 As shown, in this embodiment, the spacer substrate 152 is located between the first flexible circuit board 1511 and the second flexible circuit board 1531, such that there is a gap D between the first conductive contact C1 on the first flexible circuit board 151 and the second conductive contact C2 on the second flexible circuit board. Furthermore, the spacer substrate 152 has openings 1520 relative to the first conductive contact C1 and the second conductive contact C2, and the first gas channel G1 and the second gas channel G2 are respectively connected to the openings 1520 of the spacer substrate 152. In the conductive state, the first conductive contact C1 passes through the openings 1520 of the spacer substrate 152 and contacts the second conductive contact C2.

[0086] In this embodiment, the materials of the first flexible circuit board 1511, the second flexible circuit board 1531 and the spacer substrate 152 are, for example, polyethylene terephthalate (PET), but the present invention is not limited thereto.

[0087] like Figure 3 and Figure 4As shown, in this embodiment, the first vent H1 and the second vent H2 are located on the first side S1 and the second side S2 opposite to the first side S1 of the spacer substrate 152, respectively, and the first vent H1 and the second vent H2 correspond to each other. Furthermore, in this embodiment, the third vent H3 and the fourth vent H4 are located on the third side S3 and the fourth side S4 opposite to the third side S3 of the second flexible circuit board 1531, respectively, and the third vent H3 and the fourth vent H4 correspond to each other. In this embodiment, the first vent H1 of the spacer substrate 152 corresponds to the third vent H3 of the second flexible circuit board 1531, and the second vent H2 of the spacer substrate 152 corresponds to the fourth vent H4 of the second flexible circuit board 1531. That is, the first vent H1 and the third vent H3 are concentric holes, and the second vent H2 and the fourth vent H4 are concentric holes.

[0088] like Figure 3 , Figure 4 and Figure 5 As shown, the first gas channel G1 in this embodiment includes a first central channel portion G11, a first side channel portion G12, and a second side channel portion G13. The first central channel portion G11 connects the first side channel portion G12 and the second side channel portion G13. In this embodiment, the first conductive contact C1 is configured corresponding to the first central channel portion G11, and the first side channel portion G12 connects to the first vent H1 of the spacer substrate 152, and the second side channel portion G13 connects to the second vent H2 of the spacer substrate 152. Furthermore, the first thin film substrate 151 in this embodiment also includes a first metal line W1. The first metal line W1 extends from the first conductive contact C1, and a portion of the first metal line W1 corresponds to the first side channel portion G12 of the first gas channel G1. However, the present invention is not limited thereto; in other embodiments, a portion of the first metal line W1 may also correspond to the second side channel portion G13 of the first gas channel G1.

[0089] like Figure 3 , Figure 4 and Figure 6As shown, the second gas channel G2 in this embodiment includes a second central channel portion G21, a third side channel portion G22, and a fourth side channel portion G23. The second central channel portion G21 connects the third side channel portion G22 and the fourth side channel portion G23. In this embodiment, the second conductive contact C2 is configured corresponding to the second central channel portion G21, and the third side channel portion G22 connects to the third vent H3 of the second flexible circuit board 1531, and the fourth side channel portion G23 connects to the fourth vent H4 of the second flexible circuit board 1531. Furthermore, the second thin film substrate 153 in this embodiment also includes a second metal line W2. The second metal line W2 extends from the second conductive contact C2, and a portion of the second metal line W2 corresponds to the fourth side channel portion G23 of the second gas channel G2. However, the present invention is not limited thereto; in other embodiments, a portion of the second metal line W2 may also correspond to the third side channel portion G22 of the second gas channel G2.

[0090] In this embodiment, the first metal line W1 and the second metal line W2 are, for example, silver paste lines, but the present invention is not limited thereto. Furthermore, the circuit pattern formed by the first conductive contact C1 and the first metal line W1 is, for example, formed on the first flexible circuit board 1511 by printing and according to a specified shape, and the circuit pattern formed by the second conductive contact C2 and the second metal line W2 is, for example, formed on the second flexible circuit board 1531 by printing and according to a specified shape, but the present invention is not limited thereto.

[0091] like Figure 3 , Figure 4 and Figure 7 As shown, in this embodiment, the third gas channel G3 is formed as an annular gas channel along the periphery of the third adhesive layer 1542. In this embodiment, the first conductive contact C1 or the second conductive contact C2 is projected onto the third adhesive layer 1542 to form a projection area R on the third adhesive layer 1542, and the third gas channel G3 surrounds this projection area R.

[0092] As can be seen from the above, when any button structure 10 (such as...) Figure 2As shown, when the thin-film circuit board 15 is pressed, it deforms, causing the first conductive contact C1 to contact the second conductive contact C2 and form a triggered conduction state. At this time, the compressed gas generated between the first flexible circuit board 1511 and the second flexible circuit board 1531 will be discharged from the thin-film circuit board 15 through the exhaust path formed by the interconnection of the first gas channel G1, the second gas channel G2, the first vent H1, the second vent H2, the third vent H3, the fourth vent H4, and the third gas channel G3. Specifically, the compressed gas will be discharged through the following four exhaust paths at the same time: (1) sequentially through the first central channel G11, the first side channel G12, the first vent H1, the third vent H3, and the third gas channel G3 (as shown). Figure 4 (The path indicated by arrow A1); (2) sequentially via the first central channel section G11, the second side channel section G13, the second vent H2, the fourth vent H4, and the third gas channel G3 (as shown). Figure 4 (The path indicated by arrow A2); (3) sequentially via the second central channel section G21, the third side channel section G22, the third vent H3, and the third gas channel G3 (as shown). Figure 4 (The path indicated by arrow A3); (4) sequentially via the second central channel section G21, the fourth side channel section G23, the fourth vent H4, and the third gas channel G3 (as shown). Figure 4 The path indicated by arrow A4 shown.

[0093] Please see Figure 8 This is a schematic diagram of the structure of a thin-film circuit board according to another embodiment of the present invention. Figure 8 As shown, the thin-film circuit board 15a in this embodiment and Figures 2 to 7 Similar to the thin-film circuit board 15 shown, the difference lies in that the thin-film circuit board 15 of this embodiment further includes at least one light-emitting element 155. In this embodiment, the light-emitting element 155 is disposed on the third thin-film substrate 154, and the light emitted by the light-emitting element 155 passes through the keycap 11 (such as...). Figure 2 As shown, light is emitted outwards, causing each key structure 10 of the keyboard device 1 to illuminate. Furthermore, in other embodiments, the third thin-film substrate 154 is, for example, made of a light-guiding material and, together with the light-emitting element 155, forms a backlight module.

[0094] In summary, the thin-film circuit board of this invention adopts a four-layer thin-film substrate architecture. Compared with the known three-layer thin-film substrate architecture of thin-film circuit boards, the thin-film circuit board of this invention adds gas channels on the third thin-film substrate. Under this structural design, the area of ​​the first gas channel formed in the first adhesive layer and the area of ​​the second gas channel formed in the second adhesive layer can be effectively and significantly reduced. With the significant reduction in the area of ​​the first and second gas channels, the area of ​​the first and second adhesive layers will inevitably increase, thereby improving the structural strength of the first and second adhesive layers and achieving high waterproof performance, thus effectively protecting the circuit traces inside the thin-film circuit board. In addition, when the first and second conductive contacts of the thin-film circuit board form a triggered conduction state to generate compressed gas, the compressed gas can be easily discharged outside the thin-film circuit board through the exhaust path formed by the interconnection of the first, second, and third gas channels. This effectively avoids electrical problems caused by trapped gas due to poor air escape in a confined space and effectively avoids electrical problems caused by high temperature and high pressure on the circuit traces due to prolonged and rapid key presses.

[0095] However, the above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the invention are still within the scope of this patent. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of the invention. Moreover, the terms "first," "second," etc., mentioned in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A thin-film circuit board, comprising: A first thin film substrate has a first gas channel and a first conductive contact, wherein the first conductive contact is configured corresponding to the first gas channel. A spacer substrate is disposed below the first thin film substrate and has a first pore and a second pore, wherein the first gas channel communicates between the first pore and the second pore. A second thin-film substrate, disposed below the spacer substrate, has a second gas channel, a second conductive contact, a third vent, and a fourth vent. The second conductive contact is correspondingly located within the second gas channel. The second gas channel communicates between the third vent and the fourth vent, and the second gas channel is connected to the first gas channel via the first vent and the second vent. A third thin film substrate is disposed below the second thin film substrate and has a third gas channel, which is connected to the second gas channel through a third vent and a fourth vent.

2. The thin-film circuit board as claimed in claim 1, wherein the first thin-film substrate further includes a first flexible circuit board and a first adhesive layer, the first adhesive layer being located between the first flexible circuit board and the spacer substrate, the first conductive contact being disposed on the first flexible circuit board, and the first gas channel being formed on the first adhesive layer.

3. The thin-film circuit board as claimed in claim 2, wherein the second thin-film substrate further includes a second flexible circuit board and a second adhesive layer, the second adhesive layer being located between the second flexible circuit board and the spacer substrate, the spacer substrate being located between the first adhesive layer and the second adhesive layer, the second conductive contact, the third vent and the fourth vent being disposed on the second flexible circuit board, the second conductive contact being located between the third vent and the fourth vent, and the second gas channel being formed on the second adhesive layer.

4. The thin-film circuit board as claimed in claim 3, wherein the third thin-film substrate further includes a third flexible circuit board and a third adhesive layer, the third adhesive layer being located between the second flexible circuit board and the third flexible circuit board, the second flexible circuit board being located between the second adhesive layer and the third adhesive layer, and the third gas channel being formed on the third adhesive layer.

5. The thin-film circuit board as claimed in claim 4, wherein the first conductive contact or the second conductive contact is projected onto the third adhesive layer to form a projection area, and the third gas channel surrounds the projection area.

6. The thin-film circuit board of claim 3, wherein the spacer substrate is located between the first flexible circuit board and the second flexible circuit board, such that there is a gap between the first conductive contact and the second conductive contact, and the spacer substrate has an opening relative to the first conductive contact and the second conductive contact, and the first gas channel and the second gas channel are respectively connected to the opening.

7. The thin-film circuit board as claimed in claim 3, wherein the first vent and the second vent are respectively located on a first side of the spacer substrate and a second side opposite to the first side, the third vent and the fourth vent are respectively located on a third side of the second flexible circuit board and a fourth side opposite to the third side, and the first vent is configured corresponding to the third vent, and the second vent is configured corresponding to the fourth vent.

8. The thin-film circuit board of claim 1, wherein the first gas channel includes a first central channel portion, a first side channel portion and a second side channel portion, the first central channel portion is connected between the first side channel portion and the second side channel portion, the first conductive contact is disposed corresponding to the first central channel portion, and the first side channel portion is connected to the first vent, and the second side channel portion is connected to the second vent.

9. The thin-film circuit board of claim 8, wherein the first thin-film substrate further includes a first metal line extending from the first conductive contact, and a portion of the first metal line corresponds to the first side channel portion or the second side channel portion of the first gas channel.

10. The thin-film circuit board of claim 1, wherein the second gas channel includes a second central channel portion, a third side channel portion and a fourth side channel portion, the second central channel portion is connected between the third side channel portion and the fourth side channel portion, the second conductive contact is disposed corresponding to the second central channel portion, and the third side channel portion is connected to the third vent, and the fourth side channel portion is connected to the fourth vent.

11. The thin-film circuit board of claim 10, wherein the second thin-film substrate further includes a second metal line extending from the second conductive contact, and a portion of the second metal line corresponds to the third side channel portion or the fourth side channel portion of the second gas channel.

12. The thin-film circuit board of claim 1, further comprising at least one light-emitting element disposed on the third thin-film substrate, wherein the third thin-film substrate is made of a light-guiding material.

13. A keyboard device, comprising Multiple button structures, each button structure including: One-click cap; A single-button base plate is located below the keycap; An elastic element is disposed between the keycap and the key base plate; A connecting component is disposed between the keycap and the key base plate; as well as A thin-film circuit board is disposed between the elastic element and the button base plate, the thin-film circuit board comprising: A first thin film substrate has a first gas channel and a first conductive contact, wherein the first conductive contact is configured corresponding to the first gas channel. A spacer substrate is disposed below the first thin film substrate and has a first pore and a second pore, wherein the first gas channel communicates between the first pore and the second pore. A second thin-film substrate, disposed below the spacer substrate, has a second gas channel, a second conductive contact, a third vent, and a fourth vent. The second conductive contact is correspondingly located within the second gas channel. The second gas channel communicates between the third vent and the fourth vent, and the second gas channel is connected to the first gas channel via the first vent and the second vent. A third thin film substrate is disposed below the second thin film substrate and has a third gas channel, which is connected to the second gas channel through a third vent and a fourth vent.

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