A method for loading a lithium niobate chip without a supporting chip

Abstract

The application discloses a lithium niobate chip no-accompanying piece clamping method, which comprises the following steps: preparing an accompanying grinding piece and an accompanying piece, bonding the accompanying piece to the input end and the output end of the accompanying grinding piece to obtain an accompanying grinding piece assembly; preparing a lithium niobate chip; clamping the accompanying grinding piece, the accompanying grinding piece assembly and the lithium niobate chip to obtain a chip combination; and rotating glue on the four side surfaces of the chip combination and solidifying the glue. The lithium niobate chip without the accompanying piece can be ground, and the reliability and performance of the lithium niobate device are improved.

Description

Technical Field

[0001] This invention belongs to the field of integrated optical device technology, and in particular relates to a method for mounting lithium niobate chips without a co-chip. Background Technology

[0002] When lithium niobate chips are used to manufacture high-speed electro-optic modulators, the modulators exhibit low chirp, low transmission loss, high extinction ratio, good stability, and strong resistance to optical damage. They also enable broadband modulation, with their greatest advantage being their high electro-optic coefficient. Therefore, high-speed electro-optic modulator devices are widely used and have significant development potential. For these applications, it is the most promising dielectric material. Consequently, many current microwave photonics systems use broadband lithium niobate electro-optic modulators as the core device for electro-optic conversion. The lithium niobate chip is a core component in this process. Currently, all manufactured chips have a 1mm*2mm ferrule structure at both the input and output ends. After polishing, this ferrule often detaches or lacks adhesive underneath, severely impacting the reliability of the lithium niobate chip. Summary of the Invention

[0003] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide a method for mounting lithium niobate chips without co-wafers, which can grind lithium niobate chips without co-wafers, thereby improving the reliability and performance of lithium niobate devices.

[0004] The objective of this invention is achieved through the following technical solution: a method for mounting a lithium niobate chip without a co-processor, comprising: preparing a co-processor and a co-processor; bonding the input and output ends of the co-processor to the co-processor to obtain a co-processor assembly; preparing a lithium niobate chip; mounting the co-processor, the co-processor assembly, and the lithium niobate chip to obtain a chip assembly; and applying adhesive to the four sides of the chip assembly and then curing it.

[0005] In the above-mentioned lithium niobate chip mounting method without co-sockets, the co-socket assembly includes a co-socket and two co-sockets; wherein, one co-socket is bonded to the input end of the co-socket, and the other co-socket is bonded to the output end of the co-socket; the edge of the co-socket is aligned with the edge of the co-socket.

[0006] In the above-mentioned lithium niobate chip mounting method without a die, the adhesive used for bonding is silicone rubber, which is then cured by heating after bonding; the curing conditions are 80℃ for 1 hour.

[0007] In the above-mentioned method for mounting lithium niobate chips without a die, the preparation of the lithium niobate chip includes: cutting the lithium niobate chip with a dicing machine, cleaning it, spin-coating a layer of photoresist on the surface, and curing it at room temperature for later use.

[0008] In the above-mentioned method for mounting lithium niobate chips without a supporting wafer, the mounting of the supporting wafer, the supporting wafer assembly, and the lithium niobate chip to obtain a chip assembly includes: preparing a chip bonding platform, cleaning the surface of the bonding platform, and then starting the bonding process. The first wafer is the supporting wafer, the second wafer is the supporting wafer assembly, the third wafer is the lithium niobate chip, the fourth wafer assembly, and the fifth wafer, thus obtaining the chip assembly.

[0009] In the above-mentioned lithium niobate chip mounting method without co-attached wafers, the upper side, lower side, left side and right side of the chip assembly are spin-coated with UV adhesive and then cured; wherein, the curing is performed by irradiation with a surface light source for 2 minutes.

[0010] In the above-mentioned method for mounting lithium niobate chips without a co-wafer, the co-wafer and the lithium niobate chip are of the same size.

[0011] In the above-mentioned lithium niobate chip mounting method without a supporting wafer, the width of the supporting wafer is 2mm, the thickness of the supporting wafer is 0.5mm, and the thickness of the supporting polishing wafer is 1mm.

[0012] In the above-mentioned lithium niobate chip mounting method without a co-attached die, the thickness of the lithium niobate chip is 1 mm, the curing condition of the photoresist is room temperature curing, and the thickness of the spin-coated photoresist is 50 μm-100 μm.

[0013] In the above-mentioned lithium niobate chip mounting method without a co-socket, the width of the co-socket is equal to the length of the co-socket.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] (1) The lithium niobate chip ground by the present invention has no co-attached chips at the input and output ends.

[0016] (2) The lithium niobate chips ground by the present invention have better length and verticality consistency than those with accompanying wafer mounting process.

[0017] (3) The lithium niobate chip without surfacing produced by the present invention has no stress on the chip itself caused by the surfacing adhesive, thereby improving the overall performance of the lithium niobate chip.

[0018] (4) The lithium niobate chip without co-fiber produced by the present invention is easier to clean. Attached Figure Description

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0020] Figure 1This is a schematic diagram of the mounting base provided in an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the grinding pad provided in an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the accompanying piece provided in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of a lithium niobate chip provided in an embodiment of the present invention;

[0024] Figure 5 This is an overall structural diagram of the chip after it is installed, as provided in an embodiment of the present invention. Detailed Implementation

[0025] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] This embodiment provides a method for mounting lithium niobate chips without accompanying wafers, the method comprising:

[0027] Prepare a grinding pad and a grinding pad, and glue the input and output ends of the grinding pad to the grinding pad to obtain the grinding pad assembly;

[0028] Prepare lithium niobate chips;

[0029] The grinding pad, grinding pad assembly, and lithium oxide chip are assembled to obtain a chip assembly;

[0030] Apply adhesive to all four sides of the chip assembly and then allow it to cure.

[0031] Specifically, the adhesive preparation involves three types of adhesives used in the lithium niobate chip bonding process without die-mounting. One adhesive, a UV adhesive, is used for bonding chips to each other. Another adhesive is silicone rubber, used for bonding die-mounting components to each other. The final adhesive is photoresist, used to protect the surface pattern of the final chip. The UV adhesive is a removable UV adhesive that is also abrasion resistant.

[0032] Preparation of the grinding pad: The input and output ends of the pre-cut grinding pad (the size of the grinding pad is consistent with that of the actual lithium niobate chip) are bonded to the pre-cut grinding pad to obtain a grinding pad assembly. The adhesive is silicone rubber, and the bonding is cured by heating. The width of the grinding pad is 2mm, the thickness of the grinding pad is 0.5mm, and the thickness of the grinding pad is 1mm. The grinding pad assembly includes the grinding pad and two grinding pads; wherein, one grinding pad is bonded to the input end of the grinding pad, and the other grinding pad is bonded to the output end of the grinding pad; the edges of the grinding pads are aligned with the edges of the grinding pads.

[0033] Lithium niobate chip preparation: Cut the lithium niobate chip using a dicing machine, clean it thoroughly, spin-coat a layer of photoresist onto the surface, and cure it at room temperature for later use. The thickness of the lithium niobate chip is 1mm, the photoresist is cured at room temperature, and the spin-coating thickness is 50μm-100μm.

[0034] Chip mounting: Prepare the chip bonding platform, clean the surface of the bonding platform, and then begin bonding. The first chip is a grinding pad without a matching chip, the second chip is a grinding pad with a matching chip (i.e., a grinding pad assembly), the third chip is a lithium niobate chip without a matching chip, the fourth chip is a grinding pad with a matching chip (i.e., a grinding pad assembly), and so on. The grinding pads and the actual chips are bonded alternately, and the last chip is a grinding pad without a matching chip.

[0035] Chip mounting and curing: After the actual chip and the grinding pad are placed, UV adhesive is spin-coated onto the top and bottom surfaces and cured by irradiation with a surface light source. The UV adhesive curing time is 2 minutes. At the same time, UV adhesive is also spin-coated onto the sides of the entire assembly to prevent cracking during grinding.

[0036] like Figure 1 The figure shows a schematic diagram of a chip mounting base designed according to the present invention. As can be seen from the figure, the mounting base has two main application surfaces: one is the chip back surface 1, and the other is the chip support surface 2.

[0037] After the base is prepared, the grinding pad assembly is prepared. The grinding pad assembly mainly consists of... Figure 2 grinding pads and Figure 3 The assembly consists of a grinding pad and a grinding pad. The input end 3 and the output end 4 of the grinding pad are bonded to the grinding pad with silicone rubber. Before curing, it is confirmed that the edge of the grinding pad is aligned with the edge of the grinding pad. After confirming the alignment, the grinding pad assembly with the bonding grinding pad is cured at high temperature. The curing conditions are 80℃ and 1h.

[0038] After the grinding pad assembly is prepared, prepare the lithium niobate chip, such as... Figure 4 After the lithium niobate chip is cut, a layer of photoresist is spin-coated onto its surface, and then cured at room temperature for 24 hours.

[0039] After preparing the grinding pad assembly and the lithium niobate chip, proceed with the chip assembly mounting. The first step is to place a grinding pad without a grinding pad, aligning its back with the limiting surface 1 of the mounting base. The second step is to place a grinding pad with a grinding pad, aligning its back with the previous grinding pad. The third step is to place the lithium niobate chip, aligning its input and output terminals with the upper and lower grinding pads respectively. The fourth step is to place another grinding pad with a grinding pad, aligning the upper and lower grinding pads on the front with the upper and lower surfaces of the lithium niobate chip. The fifth step is to place a grinding pad without a grinding pad, aligning its back with the previous grinding pad vertically. The sixth step is to assemble the chip assembly as follows: Figure 5 Apply a layer of UV adhesive to the top, bottom, left, and right sides, and then irradiate with a surface light source for 2 minutes.

[0040] The lithium niobate chip produced by this invention has no co-attached wafers at the input and output ends. The length and perpendicularity consistency of the lithium niobate chip produced by this invention are better than those achieved with co-attached wafers. The surface of the co-attached lithium niobate chip produced by this invention is free from stress caused by co-attached wafer adhesive, thereby improving the overall performance of the lithium niobate chip. The co-attached lithium niobate chip produced by this invention is also easier to clean.

[0041] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A method for mounting lithium niobate chips without co-chips, characterized in that... include: Prepare a grinding pad and a grinding pad, and glue the input and output ends of the grinding pad to the grinding pad to obtain the grinding pad assembly; Prepare lithium niobate chips; The grinding pad, grinding pad assembly, and lithium oxide chip are assembled to obtain a chip assembly; Spin-apply adhesive to the four sides of the chip assembly and then cure it. The grinding pad assembly includes a grinding pad and two grinding pads; wherein... One auxiliary piece is attached to the input end of the grinding pad, and another auxiliary piece is attached to the output end of the grinding pad. The edge of the auxiliary piece is aligned with the edge of the auxiliary grinding piece; The adhesive used for bonding is silicone rubber, which is cured by heating after bonding; the curing conditions are 80℃ for 1 hour. Preparing lithium niobate chips includes: The lithium niobate chip is cut open with a dicing machine, cleaned, and then coated with a layer of photoresist. After curing at room temperature, it is ready for use. The chip assembly is obtained by mounting the grinding pad, grinding pad assembly, and lithium oxide chip together, including: Prepare the chip bonding platform, clean the surface of the bonding platform, and then begin bonding. The first piece is the grinding pad, the second piece is the grinding pad assembly, the third piece is the lithium niobate chip, the fourth piece is the grinding pad assembly, and the fifth piece is the grinding pad, thus obtaining the chip assembly. The chip assembly is spin-coated with UV adhesive on its upper, lower, left, and right sides and then cured; the curing process involves irradiation with a surface light source for 2 minutes. The lithium niobate chip has a thickness of 1 mm, the photoresist is cured at room temperature, and the spin-coated photoresist thickness is 50 μm-100 μm. Adhesive preparation: The lithium niobate chip non-deck mounting process requires three types of adhesives. One adhesive is a UV adhesive used for bonding chips to chips; another adhesive is silicone rubber used for bonding dies to dies; and the last adhesive is photoresist used for protecting the surface pattern of the final chip. This UV adhesive is removable and abrasion resistant.

2. The lithium niobate chip mounting method without co-chips according to claim 1, characterized in that: The grinding pad and the lithium niobate chip are of the same size.

3. The lithium niobate chip mounting method without co-chips according to claim 1, characterized in that: The width of the auxiliary piece is 2mm, the thickness of the auxiliary piece is 0.5mm, and the thickness of the auxiliary grinding piece is 1mm.

4. The lithium niobate chip mounting method without co-chips according to claim 1, characterized in that: The width of the grinding pad is equal to the length of the grinding pad.

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