A method for collecting state parameters of IGBT devices

Abstract

The present invention relates to the field of power electronics technology, and in particular to a state parameter acquisition method for an IGBT device. The method comprises the following steps: obtaining an IGBT working circuit diagram and a PCB layout diagram; planning the light source position according to the IGBT working circuit diagram and the PCB layout diagram, thereby obtaining light source position data; planning the line connection of the IGBT working circuit diagram, thereby obtaining an optical fiber connection scheme; performing mechanical testing on the adapted optical fiber, thereby obtaining optical fiber mechanical data; performing transmission loss simulation calculation on the optical fiber mechanical data, thereby obtaining a transmission loss data set; performing optical fiber line connection according to the transmission loss data set and the optical fiber connection scheme, thereby obtaining a detection connection line; the present invention can realize high-precision, high-speed, interference-free and damage-free acquisition of the state parameters of the IGBT device.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronics, and in particular to a method for collecting state parameters of an IGBT device. Background Art

[0002] IGBT devices are important power semiconductor devices, widely used in AC drive systems, power conversion, industrial automation and other fields. In order to ensure the normal operation of IGBT devices and improve their reliability, it is crucial to accurately monitor and analyze their status. At present, a variety of methods have been proposed for collecting IGBT device status parameters, such as current sensors, voltage sensors, and temperature sensors. However, these methods have some disadvantages, such as low accuracy, slow acquisition speed, complex installation, and impact on device structure. Summary of the invention

[0003] Based on this, it is necessary for the present invention to provide a method for collecting state parameters of an IGBT device to solve at least one of the above technical problems.

[0004] To achieve the above object, a method for collecting state parameters of an IGBT device comprises the following steps:

[0005] Step S1: Obtain an IGBT working circuit diagram and a PCB layout diagram; plan the light source position according to the PCB layout diagram to obtain optimal position data; plan the line connection of the IGBT working circuit diagram to obtain an optical fiber connection solution;

[0006] Step S2: mechanically testing the adapted optical fiber to obtain optical fiber mechanical data; performing transmission loss simulation calculation on the optical fiber mechanical data to obtain a transmission loss data set; connecting the optical fiber lines according to the transmission loss data set and the optical fiber connection scheme to obtain a detection connection line; arranging the microchip laser source based on the detection connection line and the optimal position data to obtain a parameter detection circuit;

[0007] Step S4: using a single-photon detector based on germanium-silicon compounds to capture the transmission light beam of the adapter optical fiber in the parameter detection circuit, thereby obtaining a parameter digital electrical signal;

[0008] Step S5: performing signal processing on the parameter digital electrical signal to obtain state parameter data; and visualizing the state parameter data to obtain visualized state parameters.

[0009] The present invention can achieve effective coverage and connection of each extreme of the IGBT device by planning the position of the light source and the line connection scheme, which means that the voltage, current, temperature and other parameters of the collector, gate and emitter can be detected at the same time, thereby improving the coverage and reliability of parameter detection. The quality and stability of the adapted optical fiber can be guaranteed by mechanical testing, which means that signal interference or loss caused by damage, looseness, bending and other reasons of the optical fiber can be avoided, thereby improving the accuracy and stability of parameter detection. Non-contact parameter detection of IGBT devices can be achieved by using a microchip laser source, which means that no sensor or probe needs to be installed on the IGBT device, thereby avoiding problems such as poor contact or damage that may exist in traditional methods, and improving the safety and efficiency of parameter detection. High-sensitivity capture of the transmission light beam in the optical fiber can be achieved by using a single-photon detector based on germanium silicon compounds, which means that weak optical signals can be detected under low power consumption and low noise conditions, thereby improving the sensitivity and resolution of parameter detection. By using a digital signal generator and laser diode drive modulation, precise control and adjustment of the microchip laser source can be achieved, which means that the output power, wavelength, frequency and other parameters of the laser source can be adjusted according to different detection requirements and conditions, thereby improving the flexibility and adaptability of parameter detection. By processing the parameter digital electrical signal, the state parameter data of the IGBT device can be extracted and analyzed, which means that the original signal can be optimized and converted using digital signal processing technologies such as filtering, amplification, sampling, and encoding, thereby improving the intelligence and functionality of parameter detection. By visualizing the state parameter data, the state parameter data of the IGBT device can be intuitively displayed and monitored, which means that the state parameter data can be presented clearly and beautifully using graphics, charts, curves, etc., thereby improving the visibility and ease of use of parameter detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments thereof made with reference to the following drawings:

[0011] Figure 1 A schematic flow chart of the steps of a method for collecting state parameters of an IGBT device according to an embodiment is shown.

[0012] Figure 2 A detailed flow chart of step S2 of an embodiment is shown.

[0013] Figure 3 A detailed flow chart of step S29 of an embodiment is shown.

[0014] Figure 4A detailed step flow diagram of step S295 of an embodiment is shown. DETAILED DESCRIPTION

[0015] The following is a clear and complete description of the technical method of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by technicians in this field without creative work are within the scope of protection of the present invention.

[0016] In addition, the accompanying drawings are only schematic illustrations of the present invention and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and their repeated description will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. The functional entities can be implemented in software form, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor methods and / or microcontroller methods.

[0017] It should be understood that, although the terms "first", "second", etc. may be used herein to describe various units, these units should not be limited by these terms. These terms are used only to distinguish one unit from another unit. For example, without departing from the scope of the exemplary embodiments, the first unit may be referred to as the second unit, and similarly the second unit may be referred to as the first unit. The term "and / or" used herein includes any and all combinations of one or more of the listed associated items.

[0018] To achieve this, please refer to Figures 1 to 4 The present invention provides a method for collecting state parameters of an IGBT device, the method comprising the following steps:

[0019] Step S1: Obtain an IGBT working circuit diagram and a PCB layout diagram; plan the light source position according to the PCB layout diagram to obtain optimal position data; plan the line connection of the IGBT working circuit diagram to obtain an optical fiber connection solution;

[0020] Specifically, for example, the IGBT working circuit diagram and PCB layout diagram are obtained from the manufacturer or design unit of the IGBT device, and the optimal solution for the position of the light source is determined according to the structure and functional characteristics of the IGBT device, such as arranging the light source near or in the middle of the collector, gate and emitter, so as to detect and control the parameters of the IGBT device, thereby obtaining the optimal position data. Then, according to the various components and nodes in the IGBT working circuit diagram, a suitable line connection scheme is designed so that the optical fiber can be connected to each pole of the IGBT device and matched with the microchip laser source, thereby obtaining the optical fiber connection scheme.

[0021] Step S2: mechanically testing the adapted optical fiber to obtain optical fiber mechanical data; performing transmission loss simulation calculation on the optical fiber mechanical data to obtain a transmission loss data set; connecting the optical fiber lines according to the transmission loss data set and the optical fiber connection scheme to obtain a detection connection line; arranging the microchip laser source based on the detection connection line and the optimal position data to obtain a parameter detection circuit;

[0022] Specifically, for example, a dedicated mechanical testing instrument is used to perform mechanical performance tests such as stretching, bending, and torsion on the adapter optical fiber to check whether it meets the standard requirements, and its mechanical parameters, such as strength, stiffness, elasticity, etc., are recorded to obtain optical fiber mechanical data. Then, according to the optical fiber mechanical data and the optical fiber connection scheme, an appropriate welding or bonding method is used to connect the optical fiber to the collector, gate, and emitter of the IGBT device, and ensure that the connection is firm and does not affect the normal operation of the IGBT device, thereby completing the connection between the optical fiber and the IGBT device. Next, according to the optimal position data, a microchip laser source is installed on the PCB board and connected to the optical fiber, thereby completing the arrangement of the microchip laser source. Finally, the PCB board is connected to an external power supply and a controller to obtain a parameter detection circuit.

[0023] Step S4: using a single-photon detector based on germanium-silicon compounds to capture the transmission light beam of the adapter optical fiber in the parameter detection circuit, thereby obtaining a parameter digital electrical signal;

[0024] Specifically, for example, a single-photon detector based on germanium silicon compounds is used as the receiving end to capture and convert the light beam emitted from the microchip laser source in the parameter detection circuit and transmitted through the IGBT device and optical fiber. Due to the advantages of high efficiency, low noise and high sensitivity, germanium silicon compounds can effectively detect a single or a small number of incident photons and convert them into digital electrical signals. Therefore, by analyzing the amplitude, frequency, phase and other information in the digital electrical signal, the parameter data of the IGBT device, such as temperature, pressure, current, voltage, etc., can be obtained.

[0025] Step S5: performing signal processing on the parameter digital electrical signal to obtain state parameter data; and visualizing the state parameter data to obtain visualized state parameters.

[0026] Specifically, for example, dedicated signal processing software or hardware is used to filter, amplify, demodulate, encode, etc. the parameter digital electrical signal to remove or reduce noise and interference, and extract effective information to obtain state parameter data. Then, according to different needs and goals, appropriate visualization methods and tools are selected, such as charts, curves, colors, animations, etc., to convert the state parameter data into intuitive and easy-to-understand graphics or images, and display them on a screen or other device, so as to obtain visualized state parameters.

[0027] The present invention can achieve effective coverage and connection of each extreme of the IGBT device by planning the position of the light source and the line connection scheme, which means that the voltage, current, temperature and other parameters of the collector, gate and emitter can be detected at the same time, thereby improving the coverage and reliability of parameter detection. The quality and stability of the adapted optical fiber can be guaranteed by mechanical testing, which means that signal interference or loss caused by damage, looseness, bending and other reasons of the optical fiber can be avoided, thereby improving the accuracy and stability of parameter detection. Non-contact parameter detection of IGBT devices can be achieved by using a microchip laser source, which means that no sensor or probe needs to be installed on the IGBT device, thereby avoiding problems such as poor contact or damage that may exist in traditional methods, and improving the safety and efficiency of parameter detection. High-sensitivity capture of the transmission light beam in the optical fiber can be achieved by using a single-photon detector based on germanium silicon compounds, which means that weak optical signals can be detected under low power consumption and low noise conditions, thereby improving the sensitivity and resolution of parameter detection. By using a digital signal generator and laser diode drive modulation, precise control and adjustment of the microchip laser source can be achieved, which means that the output power, wavelength, frequency and other parameters of the laser source can be adjusted according to different detection requirements and conditions, thereby improving the flexibility and adaptability of parameter detection. By processing the parameter digital electrical signal, the state parameter data of the IGBT device can be extracted and analyzed, which means that the original signal can be optimized and converted using digital signal processing technologies such as filtering, amplification, sampling, and encoding, thereby improving the intelligence and functionality of parameter detection. By visualizing the state parameter data, the state parameter data of the IGBT device can be intuitively displayed and monitored, which means that the state parameter data can be presented clearly and beautifully using graphics, charts, curves, etc., thereby improving the visibility and ease of use of parameter detection.

[0028] Preferably, step S1 comprises the following steps:

[0029] Step S11: Obtaining the IGBT working circuit diagram and PCB layout diagram;

[0030] Specifically, for example, an IGBT working circuit diagram and a PCB layout diagram are obtained from a manufacturer or design unit of the IGBT device.

[0031] Step S12: Perform three-dimensional modeling on the PCB layout diagram to obtain a three-dimensional model of the PCB board;

[0032] Specifically, for example, professional 3D modeling software or tools, such as SolidWorks, AutoCAD, etc., are used to perform 3D modeling on the PCB layout drawing to generate the 3D geometric shape and structure of the PCB board, and save it in a corresponding file format, such as STL, OBJ, etc., so as to obtain the 3D model of the PCB board.

[0033] Step S13: performing simulation analysis on the optimal position of the microchip laser source according to the PCB board three-dimensional model, thereby obtaining optimal position data;

[0034] Specifically, for example, professional simulation analysis software or tools, such as ANSYS, COMSOL, etc., are used to simulate and analyze the optimal position of the microchip laser source based on the three-dimensional model of the PCB board and the performance parameters and working conditions of the microchip laser source to optimize its layout and distribution on the PCB board, and consider its lighting effect and influence on the IGBT device, so as to obtain the optimal position data.

[0035] Step S14: determining key points of the collector, gate and emitter in the IGBT working circuit diagram, thereby obtaining the detected points;

[0036] Specifically, for example, the position and connection method of the collector, gate and emitter in the IGBT working circuit diagram are observed and analyzed, key points on the IGBT device, such as endpoints, turning points, intersections, etc., are determined, and their coordinates and identifiers are recorded to obtain the detected points.

[0037] Step S15: Calculating the optical channel parameters of the microchip laser source and the detected point, thereby obtaining the optical channel parameters;

[0038] Specifically, for example, professional optical calculation software or tools, such as Zemax, OptiCAD, etc., are used to calculate the parameters of the optical channel between the microchip laser source and the detected point based on the optimal position data of the microchip laser source and the coordinates and identifiers of the detected point, such as the angle, direction, intensity, wavelength, polarization, etc. of the light beam, and consider the influencing factors such as refraction, reflection, diffraction, and scattering that may exist in the optical channel, so as to obtain the optical channel parameters.

[0039] Step S16: determining the model and specification of the optical fiber according to the optical channel parameters, thereby obtaining an adapted optical fiber;

[0040] Specifically, for example, query and compare the performance parameters and working conditions of optical fibers of different types and brands, such as core diameter, cladding, refractive index, loss, transmission rate, temperature resistance, voltage resistance, etc., and select the most suitable optical fiber model and specifications according to the optical channel parameters and the working environment of the IGBT device, so as to obtain the adapted optical fiber.

[0041] Step S17: Based on the PCB layout diagram, line connection planning is performed according to the optimal position data and the spatial distribution of the detected points, so as to obtain a fiber optic connection solution.

[0042] Specifically, for example, by using professional circuit design software or tools, such as Eagle, Altium Designer, etc., the line connection between the microchip laser source and the detection point is planned and optimized based on the PCB layout diagram, the optimal position data and the spatial distribution of the detection point, and the possible interference, impedance, electromagnetic compatibility and other problems in the line connection are considered to obtain the fiber optic connection solution.

[0043] The present invention can realize the overall design and planning of the IGBT device parameter detection system by obtaining the IGBT working circuit diagram and the PCB layout diagram, which means that the various components and connection modes of the parameter detection system can be reasonably arranged and configured according to the working principle and characteristics of the IGBT device, as well as the structure and function of the PCB board, thereby improving the integrity and consistency of the parameter detection system. The three-dimensional display and operation of the PCB board can be realized by performing three-dimensional modeling on the PCB layout diagram, which means that the shape, size, position, etc. of the PCB board can be intuitively observed and adjusted in three-dimensional space, thereby improving the visibility and ease of use of the parameter detection system. The optimal configuration and adjustment of the microchip laser source can be realized by performing simulation analysis on the optimal position of the microchip laser source according to the PCB board three-dimensional model, which means that the output direction, angle, distance, etc. of the microchip laser source can be simulated and tested in a simulation environment, thereby finding the position and parameters that are most suitable for the parameter detection system, thereby improving the efficiency and stability of the parameter detection system. By determining the key points of the collector, gate and emitter in the IGBT working circuit diagram, the precise positioning and identification of each extreme of the IGBT device can be achieved. This means that according to the circuit structure and function of the IGBT device, as well as the detection requirements and conditions of the parameter detection system, the key points on the collector, gate and emitter that need to be detected can be clearly marked and distinguished, thereby improving the accuracy and reliability of the parameter detection system. The optical channel parameters can be calculated for the microchip laser source and the detected point to achieve a reasonable design and selection of the optical channel. This means that according to the relative position, distance, angle and other factors between the microchip laser source and the detected point, as well as the sensitivity, resolution, stability and other indicators that the optical channel needs to meet, the parameters such as the type of light source, wavelength, power and other parameters required for the optical channel can be scientifically calculated and selected, thereby improving the sensitivity and resolution of the parameter detection system. By determining the model and specifications of the optical fiber according to the optical channel parameters, the reasonable selection and matching of the adapted optical fiber can be achieved, which means that the model, specification, material, etc. of the optical fiber can be appropriately determined and matched according to the transmission efficiency, loss, refractive index and other characteristics of the optical fiber determined by the optical channel parameters, as well as the ambient temperature, humidity, vibration and other conditions that the optical fiber needs to adapt to, thereby improving the adaptability and stability of the parameter detection system. By planning the line connection based on the PCB layout diagram according to the optimal position data and the spatial distribution of the detected points, the reasonable planning and arrangement of the optical fiber connection scheme can be achieved, which means that the connection method, path, length, etc. of the optical fiber can be reasonably planned and arranged according to the spatial structure and functional partition of the PCB board, the optimal position data of the microchip laser source and the spatial distribution of the detected points, thereby improving the safety and aesthetics of the parameter detection system.

[0044] Preferably, step S13 comprises the following steps:

[0045] Step S131: Obtaining optical property data corresponding to components in the 3D model of the PCB board;

[0046] Specifically, for example, the optical property data of each component in the three-dimensional model of the PCB board, such as reflectivity, refractive index, transmittance, absorptivity, etc., are queried and collected, and stored in corresponding file formats, such as TXT, CSV, etc., so as to obtain the optical property data corresponding to the components in the three-dimensional model of the PCB board.

[0047] Step S132: importing the PCB board three-dimensional model into the CAD software, and setting the PCB board three-dimensional model using the optical property numbers corresponding to the components, thereby obtaining a simulation model;

[0048] Specifically, for example, professional CAD software or tools, such as SolidWorks, AutoCAD, etc., are used to import the PCB board three-dimensional model into the CAD software, and the PCB board three-dimensional model is set using the optical property data corresponding to the components to give it corresponding optical properties and effects, and saved in a corresponding file format, such as STL, OBJ, etc., to obtain a simulation model.

[0049] Step S133: constructing a three-dimensional model of the microchip laser source and adjusting the emission mode of the microchip laser source to obtain a light source model;

[0050] Specifically, for example, a professional 3D modeling software or tool, such as SolidWorks, AutoCAD, etc., is used to construct a 3D model of the microchip laser source to generate the 3D geometric shape and structure of the microchip laser source, and save it in a corresponding file format, such as STL, OBJ, etc. Then, according to the performance parameters and working conditions of the microchip laser source, the emission mode of the microchip laser source is adjusted, such as the emission angle, direction, intensity, wavelength, polarization, etc., and saved in a corresponding file format, such as TXT, CSV, etc., to obtain a light source model.

[0051] Step S134: scanning and analyzing edge positions of key nodes in the simulation model to obtain candidate position data, wherein the candidate position data includes a plurality of candidate positions;

[0052] Specifically, for example, professional scanning analysis software or tools such as Zemax, OptiCAD, etc. are used to scan and analyze the edge positions of key nodes in the simulation model to detect whether they are suitable as the best positions for the microchip laser source, and they are evaluated and sorted according to the optical channel parameters and effects between them and the detected points, and their coordinates and identifiers are recorded to obtain candidate position data. The candidate position data includes multiple candidate positions for subsequent selection and optimization.

[0053] Step S135: importing the light source model into the simulation model according to the candidate position data, thereby obtaining a simulation model containing the light source;

[0054] Specifically, for example, using professional CAD software or tools, such as SolidWorks, AutoCAD, etc., the light source model is imported into the simulation model according to the coordinates and identifiers in the candidate position data, and it is aligned and matched with the components and PCB boards in the simulation model, and saved in a corresponding file format, such as STL, OBJ, etc., to obtain a simulation model containing a light source.

[0055] Step S136: performing optical transmission simulation on the light source simulation model, and calculating the light intensity distribution from each candidate position in the candidate position data to the key node, thereby obtaining light intensity distribution data;

[0056] Specifically, for example, professional optical transmission simulation software or tools, such as Zemax, OptiCAD, etc., are used to perform optical transmission simulation on the simulation model containing the light source, and based on the emission mode and parameters in the light source model, as well as the optical properties and effects of the components and PCB boards in the simulation model containing the light source, the light beams from each alternative position to the key nodes in the candidate position data are tracked and analyzed, and the light intensity distribution at different positions and directions is calculated and saved in corresponding file formats, such as TXT, CSV, etc., so as to obtain the light intensity distribution data.

[0057] Step S137: Optimally screening the candidate position data using the light intensity distribution data to obtain the best position data.

[0058] Specifically, for example, professional optimal screening software or tools, such as MATLAB, Excel, etc., are used to optimally screen the candidate position data using the light intensity distribution data, and according to different evaluation indicators and objective functions, such as maximizing the average light intensity of key nodes, minimizing the light intensity difference between key nodes, minimizing the output power of the microchip laser source, etc., the optimal candidate position is selected, and its coordinates and identifiers are recorded to obtain the best position data.

[0059] The present invention can realize understanding and mastering the optical characteristics and influence of each component on the PCB board by acquiring the optical property data corresponding to the components in the three-dimensional model of the PCB board, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By importing the three-dimensional model of the PCB board into the CAD software, and setting the three-dimensional model of the PCB board using the optical property numbers corresponding to the components, it is possible to simulate and display the optical effects and functions of each component on the PCB board, thereby improving the visibility and ease of use of the parameter detection system. By constructing a three-dimensional model of a microchip laser source and adjusting the emission mode of the microchip laser source, it is possible to freely control and change the parameters such as the shape, size, position, and direction of the microchip laser source, thereby improving the flexibility and adaptability of the parameter detection system. By scanning and analyzing the edge positions of key nodes in the simulation model, it is possible to quickly search and find the appropriate positions where the microchip laser source may be placed, thereby improving the efficiency and convenience of the parameter detection system. By importing the light source model into the simulation model according to the candidate position data, it is possible to observe and compare the interaction and influence between the microchip laser source and each component on the PCB board at different positions, thereby improving the accuracy and reliability of the parameter detection system. By simulating the optical transmission of the light source simulation model and calculating the light intensity distribution from each candidate position to the key node in the candidate position data, the light intensity distribution of the microchip laser source to the key node at different positions can be quantified and evaluated, thereby improving the sensitivity and resolution of the parameter detection system. By using the light intensity distribution data to optimally screen the candidate position data, the optimal position of the microchip laser source can be determined and selected, thereby improving the optimization and stability of the parameter detection system.

[0060] Preferably, in step S136, the light intensity attenuation distribution of the microchip laser source from different candidate positions to the key node is calculated by using a light intensity attenuation calculation formula, so as to obtain light intensity distribution data, and provide a basis for the preferred position of the microchip laser source according to the light intensity distribution data. The light intensity attenuation calculation formula is as follows:

[0061]

[0062] Where I(x,y,z) is the light intensity from the microchip laser source to the key node (x,y,z), I0 is the initial light intensity of the light source, α is the attenuation coefficient of light in air, λ is the wavelength of light, φ is the initial phase of light, f(t) is the transmission function of light in the z direction, t is all the positions passed by the light during transmission in the z direction, x is the distance of the key node in the horizontal direction, y is the distance of the key node in the vertical direction, and z is the distance of the key node in the depth direction.

[0063] The present invention constructs a light intensity attenuation calculation formula, which can calculate the light intensity attenuation distribution of a microchip laser source from different candidate positions to key nodes, thereby providing a basis for the preferred position of the microchip laser source. The formula comprehensively considers multiple factors that affect the light intensity, as follows: the attenuation coefficient α of light in the air, which represents the degree of loss when the light propagates in the air. The larger the attenuation coefficient, the faster the light intensity decays, and the smaller the attenuation coefficient, the slower the light intensity decays. It can be adjusted according to actual environmental conditions to adapt to different distances between light sources and receivers. The wavelength λ of light, which represents the color and frequency of light, and light of different wavelengths has different energy and penetration. It can be selected according to actual application requirements to achieve the best optical communication effect. The initial phase φ of light, which represents the initial state of light when it is emitted from the light source, and light of different phases has different interference and diffraction characteristics. It can be set according to the actual light source characteristics to increase the volatility and complexity of the light intensity. The transmission function f(t) of light in the z direction, which represents the influence of all positions passed by the light in the z direction on the light intensity, including the refraction, reflection, scattering and other phenomena of light in the medium. It can be modeled according to the actual transmission medium to more accurately reflect the changing law of light intensity. Through the combined effect of these factors, the formula can more accurately reflect the changing law of light intensity, and utilizes trigonometric functions and integral operations to increase the volatility and complexity of light intensity, making it more difficult to crack. This formula can improve the safety and reliability of microchip laser sources.

[0064] Preferably, step S2 comprises the following steps:

[0065] Step S21: performing a tensile test and measuring on the material of the adapting optical fiber, so as to obtain maximum deformation data;

[0066] Specifically, for example, a tensile test machine is used to perform a tensile test on the material of the optical fiber adapter, and a strain gauge is used to measure its deformation to obtain the maximum deformation data. During the test, the material of the optical fiber adapter is fixed at both ends of the tensile test machine, and the tension is gradually increased until the material breaks or reaches the preset maximum tension. At the same time, the strain gauge records the strain value of the material and calculates its deformation to obtain the maximum deformation data.

[0067] Step S22: performing a torsion test and measuring the material of the adapted optical fiber to obtain a maximum torsion angle;

[0068] Specifically, for example, a torsion machine is used to perform a torsion test on the material of the optical fiber adapter, and an angle meter is used to measure the torsion angle to obtain the maximum torsion angle. During the test, the material of the optical fiber adapter is fixed at one end of the torsion machine, and the torque is gradually increased until the material breaks or reaches the preset maximum torque. At the same time, the angle meter records the rotation angle of the material and calculates its torsion angle to obtain the maximum torsion angle.

[0069] Step S23: performing a bending test and measuring on the material of the adapting optical fiber, so as to obtain minimum radius data;

[0070] Specifically, for example, a bending machine is used to perform a bending test on the material of the optical fiber, and a radius meter is used to measure its bending radius to obtain the minimum radius data. During the test, the material of the optical fiber is fixed at one end of the bending machine, and the bending force is gradually increased until the material breaks or reaches the preset maximum bending force. At the same time, the radius meter records the bending degree of the material and calculates its bending radius to obtain the minimum radius data.

[0071] Step S24: sorting and merging the maximum deformation data, the maximum torsion angle and the minimum radius data to obtain optical fiber mechanical data;

[0072] Specifically, for example, the maximum deformation data, the maximum torsion angle, and the minimum radius data are collated and merged using spreadsheet software and arranged in a certain format and order to obtain optical fiber mechanical data, which can be used to evaluate the material performance and reliability of the adapted optical fiber.

[0073] Step S25: inputting the optical fiber mechanical data into a preset computer program, performing transmission loss simulation calculation on the adapted optical fiber at different bending radii, thereby obtaining a transmission loss data set, wherein the transmission loss data set includes a plurality of transmission loss data;

[0074] Specifically, for example, a preset computer program is used to simulate and calculate the transmission loss of the adapted optical fiber at different bending radii, and the calculation results are output as a transmission loss data set. The computer program simulates the transmission state of the optical fiber at different bending radii based on the mechanical data of the optical fiber and the physical properties of the optical fiber, and calculates its transmission loss. The transmission loss data set includes multiple transmission loss data, each of which corresponds to a bending radius.

[0075] Step S26: sorting and analyzing the transmission loss data set to obtain a low-loss data set;

[0076] Specifically, for example, statistical analysis software is used to sort and analyze the transmission loss data set, and transmission loss data below a preset loss threshold is screened out to obtain a low-loss data set, which reflects the excellent transmission performance of the adapted optical fiber at different bending radii.

[0077] Step S27: taking the bending radius range corresponding to the low-loss data set as the optimal radius range;

[0078] Specifically, for example, the bending radius range corresponding to the low-loss data set is used as the optimal radius range, and the range is used as the design parameter of the adapter optical fiber. The optimal radius range ensures that the adapter optical fiber will not generate excessive transmission loss when connected to the IGBT device.

[0079] Step S28: Connecting the collector, gate and emitter of the IGBT device using an adapting optical fiber according to the optical fiber connection scheme and the optimal radius range, thereby obtaining a detection connection line;

[0080] Specifically, for example, the collector, gate and emitter of the IGBT device are connected using an adapter optical fiber according to the optical fiber connection scheme and the optimal radius range, thereby obtaining a detection connection line. The detection connection line can convert the electrical parameters of the IGBT device into optical signals and transmit them to the external circuit through the adapter optical fiber.

[0081] Step S29: Arrange the microchip laser source according to the optimal position data based on the detection connection line, the preset drive circuit and the control circuit, so as to obtain a parameter detection circuit.

[0082] Specifically, for example, the microchip laser source is arranged according to the optimal position data based on the detection connection line, the preset drive circuit and the control circuit, so as to obtain a parameter detection circuit. The parameter detection circuit can emit a laser signal through the microchip laser source to drive and control the working state of the IGBT device, and receive and analyze the optical signal transmitted by the adapter optical fiber, so as to realize the parameter detection of the IGBT device.

[0083] The present invention can realize understanding and mastering the deformation of the adapting optical fiber under different tensions by performing a tensile test and measuring on the material of the adapting optical fiber, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By performing a torsion test and measuring on the material of the adapting optical fiber, it is possible to understand and master the torsion of the adapting optical fiber under different torques, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By performing a bending test and measuring on the material of the adapting optical fiber, it is possible to understand and master the bending of the adapting optical fiber under different bending radii, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By collating and merging the maximum deformation data, the maximum torsion angle and the minimum radius data, it is possible to summarize and evaluate the mechanical characteristics and performance of the adapting optical fiber, thereby improving the integrity and consistency of the parameter detection system. By inputting the optical fiber mechanical data into a preset computer program, the transmission loss simulation calculation of the adapting optical fiber under different bending radii can realize the simulation and prediction of the transmission loss of the adapting optical fiber under different bending radii, thereby improving the visibility and ease of use of the parameter detection system. By sorting and analyzing the transmission loss data set, the transmission loss of the adapter fiber at different bending radii can be compared and screened, thereby improving the accuracy and reliability of the parameter detection system. By taking the bending radius range corresponding to the low-loss data set as the optimal radius range, the optimal radius range of the adapter fiber can be determined and selected, thereby improving the optimization and stability of the parameter detection system. By connecting the collector, gate and emitter of the IGBT device with the adapter fiber according to the optical fiber connection scheme and the optimal radius range, effective coverage and connection of each extreme of the IGBT device can be achieved, thereby improving the coverage and reliability of the parameter detection system. By arranging the microchip laser source according to the light source position data based on the detection connection line, the preset drive circuit and the control circuit, the microchip laser source can be reasonably configured and adjusted, thereby improving the efficiency and stability of the parameter detection system.

[0084] Preferably, step S25 comprises the following steps:

[0085] Step S251: inputting optical fiber data into a preset computer program, wherein the optical fiber data includes maximum deformation data, maximum torsion angle, and minimum radius data;

[0086] Specifically, for example, an optical fiber sensor is used to measure the deformation, torsion and bending of a microchip laser source, and the optical fiber data output by the optical fiber sensor is input into a preset computer program to obtain optical fiber data. The optical fiber data includes maximum deformation data, maximum torsion angle and minimum radius data, which reflect the deformation degree and position change of the microchip laser source.

[0087] Step S252: Acquire the light intensity data of the microchip laser source;

[0088] Specifically, for example, an optical power meter is used to measure the output light intensity of the microchip laser source, and the electrical signal output by the optical power meter is converted into a digital signal to obtain light intensity data, wherein the light intensity data represents the output power and efficiency of the microchip laser source.

[0089] Step S253: Calculate the light energy of the light intensity data to obtain the light power value;

[0090] Specifically, for example, the output energy of the microchip laser source is calculated using the light intensity data and the surface area of ​​the microchip laser source, thereby obtaining the light irradiation power value. Through this step, specifically, for example, the output energy of the microchip laser source under different deformations and positions can be obtained.

[0091] Step S254: performing heat conduction calculation on the light irradiation power value to obtain temperature field distribution data;

[0092] Specifically, for example, the temperature change and distribution of the microchip laser source are calculated using the light irradiation power value and the thermal conductivity, volume and other parameters of the microchip laser source, thereby obtaining temperature field distribution data. Through this step, specifically, for example, the temperature distribution and change of the microchip laser source under different deformations and positions can be obtained.

[0093] Step S255: obtaining surface temperature data of the adapted optical fiber at different bending radii according to the temperature field distribution data, and performing multi-physical field coupling transmission loss calculation on the surface temperature data, thereby obtaining a temperature rise loss evaluation result;

[0094] Specifically, for example, the surface temperature data of the adapting optical fiber is extracted from the temperature field distribution data. Then, by establishing a multi-physics field coupling model, the surface temperature data is used as a boundary condition to calculate the transmission loss of the adapting optical fiber at different bending radii. Finally, by analyzing the relationship between transmission loss and temperature, the temperature rise loss evaluation result is obtained.

[0095] Step S256: performing reliability analysis on the mechanical breakage risk of the adapted optical fiber according to the maximum deformation data, thereby obtaining a breakage loss assessment result;

[0096] Specifically, for example, the maximum deformation data is used, and the reliability analysis of the mechanical fracture risk of the adapted optical fiber is performed according to the material properties and fracture criteria of the adapted optical fiber. Finally, the fracture loss evaluation result is obtained by analyzing the relationship between the fracture risk and the bending radius.

[0097] Step S257: performing optical simulation calculation of the twist misalignment effect of the adapted optical fiber using a ray tracing method according to the maximum twist angle, thereby obtaining a twist loss evaluation result;

[0098] Specifically, for example, the maximum twist angle is used, and according to the structural parameters and optical properties of the adapted optical fiber, the twist misalignment effect of the adapted optical fiber is optically simulated by ray tracing method. Finally, the twist loss evaluation result is obtained by analyzing the relationship between the twist misalignment effect and the twist angle.

[0099] Step S258: performing finite difference bound mode analysis on the refractive index polarization of the adapted optical fiber according to the minimum radius data, thereby obtaining a refractive loss evaluation result;

[0100] Specifically, for example, finite difference bound mode analysis can be a numerical calculation method, such as finite difference time domain method, finite difference frequency domain method, etc. The input of this method is the minimum radius data and the refractive index polarization of the adapted optical fiber, and the output is the refractive loss evaluation result. This method can consider the influence of optical fiber bending on the optical fiber mode, so as to estimate the refractive loss more accurately.

[0101] Step S259: taking the temperature rise loss evaluation result, the fracture loss evaluation result, the distortion loss evaluation result and the refractive loss evaluation result as the temperature loss factor, the mechanical failure loss factor, the torsional misalignment loss factor and the refractive index distortion loss factor respectively; performing weighted superposition analysis on the temperature loss factor, the mechanical failure loss factor, the torsional misalignment loss factor and the refractive index distortion loss factor, so as to obtain a comprehensive loss evaluation result;

[0102] Specifically, for example, weighted superposition analysis can be a comprehensive evaluation method, such as the analytic hierarchy process, the fuzzy comprehensive evaluation method, etc. The input of this method is the temperature rise loss evaluation result, the fracture loss evaluation result, the distortion loss evaluation result, and the refraction loss evaluation result, and the output is the comprehensive loss evaluation result. This method can give different weights according to the importance of different loss factors, thereby obtaining a comprehensive loss evaluation index.

[0103] Step S2510: performing transmission loss simulation calculation on the adapted optical fiber at different bending radii according to the comprehensive loss evaluation result, thereby obtaining a transmission loss data set, wherein the transmission loss data set includes a plurality of transmission loss data.

[0104] Specifically, for example, the transmission loss simulation calculation can be a simulation method, such as the finite element method, the Monte Carlo method, etc. The input of the method is the comprehensive loss evaluation result and the parameters of the adapted optical fiber, and the output is a transmission loss data set. The method can calculate the transmission loss data of the adapted optical fiber at different bending radii based on the comprehensive loss evaluation results at different bending radii.

[0105] The present invention can realize rapid and accurate calculation of the temperature field distribution of the adapting optical fiber under different bending radii by inputting the optical fiber data into a preset computer program, thereby improving the efficiency and accuracy of the transmission loss evaluation method; secondly, by obtaining the light intensity data of the microchip laser source, the transmission performance of the adapting optical fiber under different lighting conditions can be monitored in real time and dynamically, thereby improving the sensitivity and adaptability of the transmission loss evaluation method; then, by calculating the light energy of the light intensity data, the thermal effect of the adapting optical fiber under different lighting conditions can be quantitatively and objectively analyzed, thereby improving the scientificity and credibility of the transmission loss evaluation method; then, by calculating the heat conduction of the light irradiation power value, It is possible to simulate the temperature field distribution of the adapting optical fiber at different bending radii in a fine and detailed manner, thereby improving the accuracy and detail of the transmission loss evaluation method; next, by obtaining the surface temperature data of the adapting optical fiber at different bending radii based on the temperature field distribution data, it is possible to intuitively and clearly display the surface state of the adapting optical fiber at different bending radii, thereby improving the visibility and ease of use of the transmission loss evaluation method; thirdly, by performing multi-physical field coupled transmission loss calculation on the surface temperature data, it is possible to perform a comprehensive and systematic evaluation of the temperature rise loss of the adapting optical fiber at different bending radii, thereby improving the integrity and consistency of the transmission loss evaluation method; in addition, by performing multi-physical field coupled transmission loss calculation on the surface temperature data, it is possible to perform a comprehensive and systematic evaluation of the temperature rise loss of the adapting optical fiber at different bending radii, thereby improving the integrity and consistency of the transmission loss evaluation method; in addition, by performing multi-physical field coupled transmission loss calculation on the adapting optical fiber based on the maximum deformation data, By conducting reliability analysis on the mechanical breakage risk of the optical fiber, it is possible to prevent and control the breakage loss of the adapted optical fiber under different tensions, thereby improving the safety and stability of the transmission loss evaluation method; at the same time, by performing ray tracing optical simulation calculations on the distortion misalignment effect of the adapted optical fiber according to the maximum torsion angle, it is possible to simulate and predict the distortion loss of the adapted optical fiber under different torques, thereby improving the predictability and controllability of the transmission loss evaluation method; in addition, by performing finite difference bound mode analysis on the refractive index polarization of the adapted optical fiber according to the minimum radius data, it is possible to calculate and analyze the refractive loss of the adapted optical fiber under different bending radii, thereby improving the accuracy and reliability of the transmission loss evaluation method. ; Finally, by taking the temperature rise loss evaluation results, the break loss evaluation results, the twisting loss evaluation results and the refractive loss evaluation results as the temperature loss factor, the mechanical failure loss factor, the torsional misalignment loss factor and the refractive index distortion loss factor respectively, and by weighted superposition analysis of various loss evaluation results, it is possible to integrate and weigh the comprehensive loss of the adapted optical fiber at different bending radii, thereby improving the rationality and optimization of the transmission loss evaluation method; and, by simulating and calculating the transmission loss of the adapted optical fiber at different bending radii according to the comprehensive loss evaluation results, it is possible to simulate and predict the transmission loss of the adapted optical fiber at different bending radii, thereby improving the visibility and ease of use of the transmission loss evaluation method.

[0106] Preferably, step S29 includes the following steps:

[0107] Step S291: performing forward and reverse working voltage tests on the detection circuit to obtain forward resistance readings and reverse resistance readings;

[0108] Specifically, for example, a multimeter is used to perform a forward and reverse working voltage test on the detection circuit, and the resistance value at both ends is measured to obtain a forward resistance reading and a reverse resistance reading. During the test, the red and black test leads of the multimeter are respectively contacted with the two ends of the detection circuit, and the forward and reverse working voltages are switched, while the display value of the multimeter is recorded, thereby obtaining a forward resistance reading and a reverse resistance reading.

[0109] Step S292: performing consistency judgment on the forward resistance reading and the reverse resistance reading, thereby obtaining judgment result data;

[0110] Specifically, for example, a consistency judgment algorithm is used to judge the consistency of the forward resistance reading and the reverse resistance reading, and the judgment result data is output. The consistency judgment algorithm compares whether the forward resistance reading and the reverse resistance reading are equal or similar according to a preset error range, and outputs the judgment result data according to the comparison result. The judgment result data can be consistency data or inconsistency data.

[0111] Step S293: when it is determined that the judgment result data is inconsistent data, the insulation damage point of the entire optical fiber connection circuit is located to obtain damage position data;

[0112] Specifically, for example, when the judgment result data is determined to be inconsistent data, the insulation damage point of the entire optical fiber connection circuit is located, and the damage position data is output. The insulation damage point location method uses optical fiber sensing technology to transmit laser pulses at one end of the optical fiber connection circuit and receive the reflected laser signal at the other end, thereby calculating the position of the insulation damage point in the optical fiber connection circuit and outputting the damage position data.

[0113] Step S294: stripping the optical fiber insulation layer at the insulation damage point according to the damage position data, and re-insulating the location where the insulation damage point is located;

[0114] Specifically, for example, stripping the optical fiber insulation layer can be a physical processing method, such as laser cutting, mechanical scraping, etc. The input of the method is damage location data and insulation damage points, and the output is the re-insulated insulation damage points. The method can remove the insulation layer on the insulation damage points to expose the optical fiber core, and then re-insulate the location of the insulation damage points to restore the integrity of the optical fiber.

[0115] Step S295: Repeat steps S291 to S294 until the result data is determined to be consistent data, and then perform a frequency response characteristic test on the detection circuit to obtain frequency response data; use the frequency response data to evaluate and optimize the detection circuit to obtain a parameter detection circuit.

[0116] Specifically, for example, the frequency response characteristic test can be an electrical test method, such as a network analyzer, a spectrum analyzer, etc. The input of this method is the detection circuit and consistency data, and the output is the frequency response data. This method can measure the input and output characteristics of the detection circuit at different frequencies, thereby evaluating the performance of the detection circuit and optimizing it, thereby obtaining a parameter detection circuit.

[0117] The present invention can measure and obtain the forward and reverse resistance values ​​of each component in the detection circuit by performing forward and reverse working voltage tests on the detection circuit, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By performing consistency judgment on the forward resistance reading and the reverse resistance reading, it is possible to judge and identify whether there are insulation damage or short circuit faults in the detection circuit, thereby improving the accuracy and reliability of the parameter detection system. When the judgment result data is determined to be inconsistent data, the insulation damage point of the entire optical fiber connection circuit is located, and the specific location of the insulation damage or short circuit fault can be located and discovered, thereby improving the efficiency and convenience of the parameter detection system. By stripping the optical fiber insulation layer at the insulation damage point according to the damage position data, and re-insulating the location where the insulation damage point is located, it is possible to effectively repair and handle the insulation damage or short circuit faults, thereby improving the safety and stability of the parameter detection system. By repeating steps S291 to S294, until the judgment result data is consistent data, the frequency response characteristics of each component in the detection circuit are tested and obtained, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By using frequency response data to evaluate and optimize the detection circuit, the frequency response characteristics of each component in the detection circuit can be analyzed and evaluated, thereby improving the optimization and stability of the parameter detection system.

[0118] Preferably, step S295 includes the following steps:

[0119] Step S2951: repeating steps S291 to S294 until the result data is judged to be consistent data, continuously transmitting the frequency scanning signal to the detection circuit through a preset network analyzer, and recording the transmission consumption and impedance parameters of the detection circuit during the frequency scanning process, so as to obtain frequency response data;

[0120] Specifically, for example, the detection circuit can be a microwave circuit, such as a filter, an amplifier, a mixer, etc. The preset network analyzer can be an instrument capable of outputting and receiving microwave signals, such as a vector network analyzer. The continuous frequency sweep signal can be a signal that gradually changes from low frequency to high frequency, such as a linear frequency sweep signal. The transmission consumption can be the attenuation degree of the input signal of the detection circuit, such as insertion loss. The impedance parameter can be the reflection degree of the input signal of the detection circuit, such as a reflection coefficient.

[0121] Step S2952: plotting the amplitude, phase value, and impedance parameters of each frequency point in the frequency response data, thereby obtaining a phase-frequency response curve and an impedance matching curve;

[0122] Specifically, for example, the amplitude may be the ratio of the input signal to the output signal, such as a transmission coefficient. The phase value may be the phase difference between the input signal and the output signal, such as a phase delay. The impedance parameter may be the input impedance or output impedance of the detection circuit, such as an impedance matrix. Curve drawing may be connecting data points into a curve using a graphics software, such as MATLAB.

[0123] Step S2953: performing linear phase range analysis on the phase-frequency response curve to obtain phase bandwidth parameters;

[0124] Specifically, for example, the linear phase range analysis can be performed by using a mathematical method to calculate the slope change of the phase-frequency response curve in different frequency segments, such as the least square method. The phase bandwidth parameter can be the width of the phase-frequency response curve in the frequency segment where the slope is close to zero, such as the group delay bandwidth.

[0125] Step S2954: performing group delay variation calculation on the phase bandwidth parameter to obtain delay error data;

[0126] Specifically, for example, the group delay variation calculation can be performed by using a mathematical method to calculate the variation rate of the phase bandwidth parameter at different frequency points, such as a differential method. The delay error data can be an absolute value or a relative value of the group delay variation rate, such as a group delay distortion.

[0127] Step S2955: performing matching bandwidth analysis on the impedance matching curve to obtain matching bandwidth parameters;

[0128] Specifically, for example, matching bandwidth analysis can determine the shape of the impedance matching curve in different frequency bands by using a graphical method, such as a Smith chart. The matching bandwidth parameter can be the width of the impedance matching curve in a frequency band that meets a preset condition, such as a -10 dB bandwidth.

[0129] Step S2956: performing impedance matching analysis on the matching bandwidth parameters to obtain matching data;

[0130] Specifically, for example, impedance matching analysis can be performed by using numerical methods to calculate the degree of deviation of the impedance matching curve at different frequency points, such as normalized impedance. The matching data can be the deviation value or deviation ratio of the impedance matching curve, such as reflection coefficient or standing wave ratio.

[0131] Step S2957: using the phase bandwidth parameter, delay error data, and matching degree data to perform high-speed performance evaluation on the detection circuit, thereby obtaining performance indicator data;

[0132] Specifically, for example, high-speed performance evaluation can be performed by using an evaluation method to comprehensively analyze phase bandwidth parameters, delay error data, and matching data, such as a weighted average method. Performance indicator data can be the quality of the detection circuit in high-speed signal transmission, such as a signal-to-noise ratio or a bit error rate.

[0133] Step S2958: Optimize the detection circuit according to the performance indicator data to obtain a parameter detection circuit.

[0134] Specifically, for example, the optimization can be performed by adjusting the structure or parameters of the detection circuit using an optimization method, such as a genetic algorithm or a gradient descent method. The parameter detection circuit can be an optimized detection circuit, such as a detection circuit with improved phase bandwidth, delay error, and matching degree.

[0135] The present invention repeats steps S291 to S294 until the result data is judged to be consistent data. The transmission consumption and impedance parameters of the detection circuit at different frequencies can be continuously tested and recorded by the preset network analyzer through continuous frequency scanning signal transmission of the detection circuit, thereby improving the theoretical basis and knowledge reserve of the parameter detection system. By drawing curves of the amplitude, phase value, and impedance parameters of each frequency point in the frequency response data, the phase-frequency response characteristics and impedance matching characteristics of the detection circuit at different frequencies can be visualized and analyzed, thereby improving the visibility and ease of use of the parameter detection system. By performing linear phase range analysis on the phase-frequency response curve, the phase change of the detection circuit at different frequencies can be quantified and evaluated, thereby improving the accuracy and reliability of the parameter detection system. By performing group delay change calculation on the phase bandwidth parameter, the group delay change of the detection circuit at different frequencies can be calculated and predicted, thereby improving the sensitivity and resolution of the parameter detection system. By performing matching bandwidth analysis on the impedance matching curve, the impedance matching of the detection circuit at different frequencies can be quantified and evaluated, thereby improving the adaptability and stability of the parameter detection system. By using phase bandwidth parameters, delay error data, and matching data to perform high-speed performance evaluation on the detection circuit, it is possible to comprehensively evaluate and optimize the high-speed performance indicators of the detection circuit, such as bandwidth, delay, distortion, etc., thereby improving the optimization and stability of the parameter detection system. By optimizing the detection circuit according to the performance indicator data, it is possible to adjust and improve the parameters of each component in the detection circuit, such as resistance, capacitance, inductance, etc., thereby improving the efficiency and stability of the parameter detection system.

[0136] Preferably, in step S2954, the error value of the group delay variation is calculated by a group delay error calculation formula based on the phase linear range, wherein the group delay error calculation formula is as follows:

[0137]

[0138] Where δ is the group delay error, t 1 is the transmission time of the signal, g(ω) is the frequency response function of the signal, ω is the angular frequency, g k (ω k ) is the frequency response function of the kth sampling point, ω k is the angular frequency of the kth sampling point, Δt 1 k is the time interval of the kth sampling point, is the phase accumulation of the signal, and k is the sequence number of the sampling point.

[0139] The present invention constructs a group delay error calculation formula, which can calculate the error value of the group delay change, thereby providing an evaluation basis for the signal transmission quality. The formula takes into account the following aspects: the signal transmission time t 1 , which represents the time it takes for the signal to travel from the transmitter to the receiver. The shorter it is, the higher the signal transmission efficiency is, and the longer it is, the lower the signal transmission efficiency is. It can be measured according to the actual transmission distance and speed to reflect the transmission performance of the signal. The frequency response function of the signal g(ω), which represents the amplitude and phase changes of the signal at different frequencies. The smoother it is, the better the spectrum characteristics of the signal are, and the more volatile it is, the worse the spectrum characteristics of the signal are. It can be obtained according to the actual signal source and channel characteristics to reflect the frequency domain characteristics of the signal. Phase accumulator of the signal It represents the accumulated phase change of the signal during the transmission process. The smaller it is, the better the phase linearity of the signal is, and the larger it is, the worse the phase linearity of the signal is. It can be integrated according to the actual frequency response function to reflect the phase characteristics of the signal. The serial number k of the sampling point represents the number and position of the signal sampled during the transmission process. The more the number, the higher the sampling accuracy, and the fewer the number, the lower the sampling accuracy. It can be determined according to the actual sampling frequency and sampling time to reflect the sampling characteristics of the signal. Through the combined effect of these aspects, the formula can calculate the error value of the group delay change, and utilizes differential and summation operations to increase the sensitivity and accuracy of the error value, so that the error value can better reflect the change of the group delay. This formula can improve the transmission quality and stability of the signal.

[0140] Preferably, step S5 comprises the following steps:

[0141] Step S51: performing signal enhancement on the parameter digital signal to obtain an enhanced parameter electrical signal;

[0142] Specifically, for example, signal enhancement can be performed by filtering, amplifying, denoising, etc. the parameter digital signal using a signal processing method, such as Kalman filtering or wavelet transform. The enhanced parameter electrical signal can be a parameter digital signal after signal enhancement, such as a parameter digital signal with a higher signal-to-noise ratio or a clearer waveform.

[0143] Step S52: extracting data from the enhanced parameter electrical signal to obtain state characteristic parameters;

[0144] Specifically, for example, data extraction can be performed by using data mining methods to perform feature extraction, feature selection, feature dimension reduction, etc. on the enhanced parameter electrical signal, such as principal component analysis or support vector machine. The state characteristic parameter can be a state-related characteristic value or characteristic vector extracted from the enhanced parameter electrical signal, such as frequency, amplitude, phase, etc.

[0145] Step S53: Calculate the state evaluation parameters for the state characteristic parameters, thereby obtaining the state parameters;

[0146] Specifically, for example, the state assessment parameter calculation can be performed by using a mathematical model or a machine learning model to perform state assessment or state prediction on the state characteristic parameters, such as linear regression or neural network. The state parameter can be a parameter value or parameter vector related to the state assessment calculated from the state characteristic parameters, such as health, life, failure rate, etc.

[0147] Step S54: Plotting the state parameters to obtain a state assessment image;

[0148] Specifically, for example, the drawing can be performed by using graphics software or programming languages, such as Excel or Python, to visualize or analyze the state parameters. The state assessment image can be a graph or chart related to the state assessment generated from the state parameters, such as a curve chart, a bar chart, a pie chart, etc.

[0149] Step S55: presenting the state assessment image on a human-computer interaction interface to obtain visualization state parameters.

[0150] Specifically, for example, the human-computer interaction interface presentation can be performed by using interface design software or programming languages, such as QT or HTML, to layout, beautify, and interact with the status assessment image. The visual status parameter can be a status assessment image and related text descriptions or prompt information presented to the user through the human-computer interaction interface, such as a dashboard, report, warning, etc.

[0151] The present invention can realize the extraction and amplification of effective information in the parameter digital signal by performing signal enhancement on the parameter digital signal, thereby improving the sensitivity and resolution of the parameter detection system. For example, the noise and interference in the parameter digital signal can be removed by filtering, smoothing, interpolation and other methods, and it can be amplified to a suitable voltage level to facilitate subsequent data extraction and analysis. By performing data extraction on the enhanced parameter electric signal, it is possible to identify and extract the characteristic information in the enhanced parameter electric signal, thereby improving the accuracy and reliability of the parameter detection system. For example, the characteristic information such as frequency, amplitude, phase, etc. in the enhanced parameter electric signal can be extracted by methods such as Fourier transform, wavelet transform, neural network, etc., and converted into state characteristic parameters. By performing state evaluation parameter calculation on the state characteristic parameters, it is possible to calculate and evaluate the key information in the state characteristic parameters, thereby improving the adaptability and stability of the parameter detection system. For example, the key information in the state characteristic parameters such as current, voltage, temperature, etc. can be calculated by methods such as linear regression, support vector machine, random forest, etc., and converted into state parameters. By mapping the state parameters, it is possible to realize the visual display and analysis of the changing trends and laws in the state parameters, thereby improving the visibility and ease of use of the parameter detection system. For example, the changing trends and rules in the state parameters can be plotted through line graphs, bar graphs, scatter plots, etc., and converted into state assessment images. By presenting the state assessment image in a human-computer interaction interface, it is possible to interactively display and interpret the important information in the state assessment image, thereby improving the interactivity and friendliness of the parameter detection system. For example, the important information in the state assessment image, such as the maximum value, minimum value, average value, etc., can be presented in a human-computer interaction interface through buttons, sliders, menus, etc., and converted into visual state parameters.

[0152] Therefore, the embodiments should be regarded as illustrative and non-restrictive from all points, and the scope of the present invention is limited by the appended claims rather than the above description, and it is therefore intended that all changes falling within the meaning and range of equivalent elements of the application documents are included in the present invention.

[0153] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A method for collecting state parameters of an IGBT device, characterized in that: The following steps are involved: Step S1: Obtain the IGBT working circuit diagram and PCB layout diagram; Plan the light source position according to the PCB layout to obtain the optimal position data; Perform line connection planning on the IGBT working circuit diagram to obtain an optical fiber connection solution; wherein step S1 includes the following steps: Step S11: Obtaining the IGBT working circuit diagram and PCB layout diagram; Step S12: performing three-dimensional modeling on the PCB layout diagram to obtain a three-dimensional model of the PCB board; Step S13: performing simulation analysis on the optimal position of the microchip laser source based on the PCB board three-dimensional model, thereby obtaining optimal position data; wherein step S13 includes the following steps: Step S131: Obtaining optical property data corresponding to components in the PCB board three-dimensional model; Step S132: Importing the PCB board three-dimensional model into CAD software, and setting the PCB board three-dimensional model using the optical property numbers corresponding to the components, thereby obtaining a simulation model; Step S133: constructing a three-dimensional model of the microchip laser source and adjusting the emission mode of the microchip laser source to obtain a light source model; Step S134: Scan and analyze the edge positions of key nodes in the simulation model to obtain candidate position data, wherein the candidate position data includes multiple candidate positions; Step S135: importing the light source model into the simulation model according to the candidate position data, thereby obtaining a simulation model containing the light source; Step S136: performing optical transmission simulation on the light source simulation model, and calculating the light intensity distribution from each candidate position in the candidate position data to the key node, thereby obtaining light intensity distribution data; Step S137: Optimally screening the candidate position data using the light intensity distribution data to obtain the best position data; Step S14: determining key points of the collector, gate, and emitter in the IGBT working circuit diagram, thereby obtaining the detected points; Step S15: Calculating optical channel parameters for the microchip laser source and the detected point, thereby obtaining optical channel parameters; Step S16: determining the model and specifications of the optical fiber according to the optical channel parameters, thereby obtaining an adapted optical fiber; Step S17: performing line connection planning based on the PCB layout diagram according to the optimal position data and the spatial distribution of the detected points, thereby obtaining a fiber optic connection solution; Step S2: Mechanically testing the adapted optical fiber to obtain optical fiber mechanical data; performing transmission loss simulation calculations on the optical fiber mechanical data to obtain a transmission loss data set; connecting optical fiber lines according to the transmission loss data set and the optical fiber connection plan to obtain a detection connection line; arranging the microchip laser source based on the detection connection line and the optimal position data to obtain a parameter detection circuit; Step S4: using a single-photon detector based on germanium-silicon compounds to capture the transmission light beam of the adapter optical fiber in the parameter detection circuit, thereby obtaining a parameter digital electrical signal; Step S5: performing signal processing on the parameter digital electrical signal to obtain state parameter data; and visualizing the state parameter data to obtain visualized state parameters.

2. The method for collecting state parameters of an IGBT device according to claim 1, wherein: In step S136, the light intensity attenuation distribution of the microchip laser source from different candidate positions to the key node is calculated using the light intensity attenuation calculation formula, thereby obtaining light intensity distribution data. The light intensity distribution data provides a basis for the optimal position of the microchip laser source. The light intensity attenuation calculation formula is as follows: Where I(x,y,z) is the light intensity from the microchip laser source to the key node (x,y,z), I0 is the initial light intensity of the light source, α is the attenuation coefficient of light in air, λ is the wavelength of light, φ is the initial phase of light, f(t) is the transmission function of light in the z direction, t is all the positions passed by the light during transmission in the z direction, x is the horizontal distance of the key node, y is the vertical distance of the key node, and z is the depth distance of the key node.

3. The method for collecting state parameters of an IGBT device according to claim 1, wherein: Step S2 includes the following steps: Step S21: performing a tensile test and measuring on the material of the adapted optical fiber to obtain maximum deformation data; Step S22: performing a torsion test and measuring the material of the adapted optical fiber to obtain a maximum torsion angle; Step S23: performing a bending test and measuring on the material of the adapted optical fiber to obtain minimum radius data; Step S24: taking the maximum deformation data, the maximum torsion angle and the minimum radius data as optical fiber mechanical data; Step S25: Inputting the optical fiber mechanical data into a preset computer program, performing transmission loss simulation calculations on the adapted optical fiber at different bending radii, thereby obtaining a transmission loss data set, wherein the transmission loss data set includes a plurality of transmission loss data; Step S26: sorting and analyzing the transmission loss data set to obtain a low-loss data set; Step S27: taking the bending radius range corresponding to the low-loss data set as the optimal radius range; Step S28: Connecting the collector, gate, and emitter of the IGBT device using an adaptor optical fiber according to the optical fiber connection scheme and the optimal radius range, thereby obtaining a detection connection circuit; Step S29: Arranging the microchip laser source according to the optimal position data based on the detection connection line, the preset driving circuit and the control circuit, thereby obtaining a parameter detection circuit.

4. The method for collecting state parameters of an IGBT device according to claim 3, wherein: Step S25 includes the following steps: Step S251: Inputting optical fiber data into a preset computer program, wherein the optical fiber data includes maximum deformation data, maximum torsion angle data, and minimum radius data; Step S252: Acquire light intensity data of the microchip laser source; Step S253: performing illumination energy calculation on the illumination intensity data to obtain the illumination power value; Step S254: performing heat conduction calculation on the light irradiation power value to obtain temperature field distribution data; Step S255: obtaining surface temperature data of the adapted optical fiber at different bending radii based on the temperature field distribution data, performing multi-physics field coupling transmission loss calculation on the surface temperature data, thereby obtaining a temperature rise loss evaluation result; Step S256: performing reliability analysis on the mechanical breakage risk of the adapted optical fiber according to the maximum deformation data, thereby obtaining a breakage loss assessment result; Step S257: performing a ray tracing optical simulation calculation on the twist misalignment effect of the adapted optical fiber according to the maximum twist angle, thereby obtaining a twist loss evaluation result; Step S258: performing finite difference bound mode analysis on the refractive index polarization of the adapted optical fiber according to the minimum radius data, thereby obtaining a refractive loss evaluation result; Step S259: The temperature rise loss evaluation result, the fracture loss evaluation result, the twisting loss evaluation result, and the refractive loss evaluation result are respectively used as the temperature loss factor, the mechanical failure loss factor, the torsional misalignment loss factor, and the refractive index distortion loss factor; a weighted superposition analysis is performed on the temperature loss factor, the mechanical failure loss factor, the torsional misalignment loss factor, and the refractive index distortion loss factor to obtain a comprehensive loss evaluation result; Step S2510: performing transmission loss simulation calculation on the adapted optical fiber at different bending radii according to the comprehensive loss evaluation result, thereby obtaining a transmission loss data set, wherein the transmission loss data set includes a plurality of transmission loss data.

5. The method for collecting state parameters of an IGBT device according to claim 3, wherein: Step S29 includes the following steps: Step S291: performing forward and reverse working voltage tests on the detection circuit to obtain forward resistance readings and reverse resistance readings; Step S292: performing consistency judgment on the forward resistance reading and the reverse resistance reading, thereby obtaining judgment result data; Step S293: When it is determined that the judgment result data is inconsistent data, the insulation damage point of the entire optical fiber connection circuit is located to obtain damage position data; Step S294: stripping the optical fiber insulation layer at the insulation damage point according to the damage position data, and re-insulating the location where the insulation damage point is located; Step S295: Repeat steps S291 to S294 until the result data is determined to be consistent data, perform a frequency response characteristic test on the detection circuit to obtain frequency response data; use the frequency response data to evaluate and optimize the detection circuit to obtain a parameter detection circuit.

6. The method for collecting state parameters of an IGBT device according to claim 5, characterized in that: Step S295 includes the following steps: Step S2951: Repeat steps S291 to S294 until the result data is determined to be consistent data, continuously transmitting a frequency sweep signal to the detection circuit through a preset network analyzer, and recording the transmission consumption and impedance parameters of the detection circuit during the frequency sweep process to obtain frequency response data; Step S2952: plotting the amplitude, phase value, and impedance parameters of each frequency point in the frequency response data to obtain a phase-frequency response curve and an impedance matching curve; Step S2953: performing linear phase range analysis on the phase-frequency response curve to obtain phase bandwidth parameters; Step S2954: performing group delay variation calculation on the phase bandwidth parameter to obtain delay error data; Step S2955: performing matching bandwidth analysis on the impedance matching curve to obtain matching bandwidth parameters; Step S2956: performing impedance matching analysis on the matching bandwidth parameters to obtain matching data; Step S2957: Performing a high-speed performance evaluation on the detection circuit using the phase bandwidth parameter, delay error data, and matching data to obtain performance index data; Step S2958: Optimize the detection circuit according to the performance indicator data to obtain a parameter detection circuit.

7. The method for collecting state parameters of an IGBT device according to claim 6, wherein: In step S2954, the group delay variation is calculated using a group delay error calculation formula based on the phase linear range, where the group delay error calculation formula is as follows: Where δ is the group delay error, t 1 is the transmission time of the signal, g(ω) is the frequency response function of the signal, ω is the angular frequency, g k (ω k ) is the frequency response function of the kth sampling point, ω k is the angular frequency of the kth sampling point, Δt 1 k is the time interval of the kth sampling point, is the phase accumulation of the signal, and k is the sequence number of the sampling point.

8. The method for collecting state parameters of an IGBT device according to claim 1, wherein: Step S5 includes the following steps: Step S51: performing signal enhancement on the parameter digital signal to obtain an enhanced parameter electrical signal; Step S52: extracting data from the enhanced parameter electrical signal to obtain state characteristic parameters; Step S53: Calculating state evaluation parameters based on state characteristic parameters to obtain state parameters; Step S54: Plotting the state parameters to obtain a state assessment image; Step S55: presenting the state assessment image on a human-computer interaction interface to obtain visual state parameters.

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