An electronic component pin forming tool and a forming method thereof

Abstract

The application relates to an electronic component pin forming tool, which comprises a base, a pressing strip and a pressing block arranged on the base through a rotating shaft, the base is used for placing the component, the pressing strip is used for fixing the component, and the pressing block is used for bending and forming the pin of the component; wherein the pressing strip is arranged between the base and the pressing block, a first spring is arranged between the base and the pressing strip at one end close to the rotating shaft, and a second spring is arranged between the pressing strip and the pressing block at one end far from the rotating shaft; a first spring groove is arranged on one side of the top of the base close to the rotating shaft, and one end of the first spring is arranged in the first spring groove; and a second spring groove is arranged on one side of the bottom of the pressing block far from the rotating shaft, and one end of the second spring is arranged in the second spring groove. The electronic component can be fixed and bent and formed through one-time pressing, the pressing strip can press the pin of the component when moving around the rotating shaft during pressing, the component cannot slide or overturn during the forming process, and the forming efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic component molding technology, and in particular to a pin molding fixture and molding method for electronic components. Background Technology

[0002] In the manufacturing process of electronic products, it is usually necessary to shape the leads of resistors or diodes before soldering them, that is, to cut and bend the leads of resistors or diodes.

[0003] When bending the pins of components, the components need to be fixed first to prevent them from moving before bending them. This requires multiple operations, resulting in low bending efficiency.

[0004] Therefore, we propose a tooling for forming electronic component leads and its forming method. Summary of the Invention

[0005] In response to the shortcomings of the existing production technology, the applicant provides an electronic component pin forming fixture and its forming method, which can achieve the fixing and bending forming of the component with a single press. When pressing, the pressure bar moves around the axis to press the pin of the component, ensuring that the component will not slide or flip during the forming process, thereby improving the consistency of the silkscreen position and direction on the component.

[0006] The technical solution adopted in this invention is as follows:

[0007] An electronic component lead forming fixture, comprising:

[0008] A base, and pressure strips and pressure blocks that are rotatably mounted on the base via a pivot; the base is used to place components; the pressure strips are used to fix the components; the pressure blocks are used to bend and shape the leads of the components.

[0009] The pressure strip is positioned between the base and the pressure block. A first spring is positioned between the base and the pressure strip at the end near the rotating shaft, and a second spring is positioned between the pressure strip and the pressure block at the end away from the rotating shaft.

[0010] Its further features are:

[0011] The base is mounted on the work tray.

[0012] The work tray is provided with multiple second threaded holes, and the base is fixed to the second threaded holes of the work tray by screws.

[0013] The base has a first placement groove on the side away from the pivot on the top, and a second placement groove that communicates with the first placement groove.

[0014] The base has a first spring groove on the top side near the rotating shaft, with one end of the first spring located in the first spring groove; the pressure block has a second spring groove on the bottom side away from the rotating shaft, with one end of the second spring located in the second spring groove.

[0015] The pressure strip has a through groove on the side away from the rotating shaft, and the bottom of the pressure strip has a limiting groove on both sides of the through groove that corresponds to the second placement groove.

[0016] A pressure rod is provided on the top of the pressure block via a pressure rod connecting block.

[0017] The pressure rod connecting block is provided with a first threaded hole, and the pressure rod is provided with a thread corresponding to the first threaded hole. The axis of the first threaded hole has an angle with the bottom surface.

[0018] Each pressure block is provided with a second groove, and a protective pad is provided in the second groove to prevent damage to the pins of the components.

[0019] This invention also discloses a method for forming the pins of electronic components, comprising the following steps:

[0020] Step 1: Install the base onto the second threaded hole of the work tray using screws;

[0021] Step two: Place the component in the first placement slot, and place the component's pins in the second placement slot;

[0022] Step 3: Press down the pressure bar. As the pressure bar is pressed down, the pressure strip is first pressed onto the base. The limiting groove of the pressure strip presses onto the pins of the component to prevent the pins of the component from shaking. As the pressure bar continues to press down, the protective pad on the pressure block squeezes the pins of the component downward, causing the pins of the component to bend downward along the gap between the base and the protective pad.

[0023] The beneficial effects of this invention are as follows:

[0024] This invention features a compact and reasonable structure, and is easy to operate. By placing the component in the first placement slot and positioning the component's pins in the second placement slot, and because the first spring is closer to the rotating shaft than the second spring, when the pressure rod is pressed down, the first spring is compressed first. That is, the pressure bar is pressed down more than the pressure block. The pressure bar contacts the base first, and the limiting groove of the pressure bar presses on the component's pins to prevent the pins from moving. As the pressure rod continues to press down, the pressure block is gradually pressed down, and the protective pad on the pressure block presses down on the component's pins, causing the component's pins to bend and form downwards along the gap between the base and the protective pad. By pressing down once, the component can be fixed and bent into shape, improving the efficiency of component pin forming.

[0025] In addition, the present invention also has the following advantages:

[0026] (1) Protective pads are provided on both sides of the pressure block, which can simultaneously bend and shape the pins on both sides of the component. This is much more effective than single-sided extrusion molding.

[0027] (2) The protective pad is made of nylon. The protective pad is fixed in the second groove of the pressure block by screws or other means. The protective pad squeezes the pins of the components to prevent excessive damage to the pins of the components.

[0028] (3) The first half of the protective pad that contacts the pin of the component has an angle with the vertical direction, which is about 3°. The angle design can further reduce the damage to the pin of the component during the molding process.

[0029] (4) A pressure bar is provided on the top of the pressure block, which makes pressing the pressure block easier. A first threaded hole is provided on the pressure bar connecting block, and a thread matching the first threaded hole is provided on the pressure bar. The axis of the first threaded hole and the bottom surface have an angle of about 30°. A force-saving torque can be formed by the pressure bar, reducing operator fatigue and improving molding efficiency.

[0030] (5) The base is fixed to the second threaded hole of the work tray by screws. Multiple second threaded holes are evenly arranged on the work tray to meet the installation requirements of tooling of different sizes and different directions. The bottom of the work tray is equipped with EVA foam pads, which can play the role of anti-slip and filling. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of the present invention.

[0032] Figure 2 for Figure 1 Top view.

[0033] Figure 3 for Figure 2 Schematic diagram of the AA section.

[0034] Figure 4 This is a schematic diagram of the base of the present invention.

[0035] Figure 5 This is a cross-sectional view of the pressure bar connecting block of the present invention.

[0036] Figure 6 This is a schematic diagram of the pressing block of the present invention.

[0037] Figure 7 for Figure 6 Top view.

[0038] Figure 8 for Figure 7 Schematic diagram of the BB cross section.

[0039] Figure 9 This is a schematic diagram of the pressure strip of the present invention.

[0040] Figure 10 This is a schematic diagram of the protective pad of the present invention.

[0041] The components are as follows: 1. Base; 101. First groove; 102. First spring groove; 103. First placement groove; 104. Second placement groove; 105. First spring; 106. Rotating shaft; 2. Pressure bar; 201. Through groove; 202. Limiting groove; 3. Pressure block; 301. Second groove; 302. Protective pad; 303. Second spring groove; 304. Second spring; 4. Pressure rod; 401. Pressure rod connecting block; 402. First threaded hole; 5. Working plate; 501. Second threaded hole. Detailed Implementation

[0042] The specific embodiments of the present invention will now be described with reference to the accompanying drawings.

[0043] like Figures 1-10 As shown, an electronic component pin forming fixture includes a base 1, a pressure strip 2, a pressure block 3, a pressure rod 4, and a working tray 5. The base 1 is positioned above the working tray 5. The pressure strip 2 and the pressure block 3 are rotatably mounted on the base 1. The pressure strip 2 is positioned between the base 1 and the pressure block 3. The component is placed on the base 1. The base 1 and the pressure strip 2 cooperate to fix the component. The pressure block 3 then bends and forms the pin of the component.

[0044] like Figures 1-4 As shown, a first groove 101 is provided on one side of the top of the base 1, a rotating shaft 106 is provided at the first groove 101, a first spring groove 102 is provided on the side of the top of the base 1 close to the first groove 101, a first placement groove 103 is provided on the side of the top of the base 1 away from the first groove 101, and a second placement groove 104 is provided on both sides of the top of the base 1, which communicates with the first placement groove 103.

[0045] The pressure bar 2 and the pressure block 3 are rotatably mounted on the base 1 via the rotating shaft 106. The first spring 105 is placed in the first spring groove 102 and is located between the base 1 and the pressure bar 2.

[0046] The work tray 5 has multiple second threaded holes 501. The base 1 is fixed to the second threaded holes 501 of the work tray 5 with screws. The multiple second threaded holes 501 are evenly distributed on the work tray 5 to meet the installation requirements of tooling of different sizes and in different directions. The bottom of the work tray 5 is provided with EVA foam pads, which can play a role in anti-slip and filling.

[0047] like Figure 9As shown, a through groove 201 is provided on the side of the pressure strip 2 away from the rotating shaft 106. Limiting grooves 202 are provided on both sides of the through groove 201 at the bottom of the pressure strip 2. The limiting grooves 202 correspond to the second placement groove 104. After the pressure strip 2 is pressed down, the limiting grooves 202 press against the pins of the component. The limiting grooves 202 and the second placement groove 104 cooperate to fix the pins of the component, preventing the pins of the component from sliding or flipping during the forming process.

[0048] like Figure 3 , Figures 6-8 , Figure 10 As shown, a second spring groove 303 is provided on the bottom side of the pressure block 3 away from the rotating shaft 106. A second spring 304 is provided in the second spring groove 303, and the second spring 304 is located between the pressure block 3 and the pressure strip 2. A second groove 301 is provided on both sides of the pressure block 3. A protective pad 302 is provided in the second groove 301. The protective pad 302 is made of nylon and is fixed in the second groove 301 of the pressure block 3 by screws or other means. The protective pad 302 compresses the pins of the component to prevent excessive damage to the component pins. The minimum distance between the two protective pads 302 is greater than the width of the base 1, so that the protective pads 302 can be pressed down to both sides of the base 1, thereby completing the bending and shaping of the component pins.

[0049] The protective pad 302 has an angle of about 3° between the front half of the contact area between the pad and the component pin and the vertical direction. This angle design can further reduce the damage to the component pin during the molding process.

[0050] like Figures 1-3 , Figure 5 As shown, a pressure rod 4 is provided on the top of the pressure block 3, which makes pressing the pressure block 3 easier. The pressure rod 4 is installed on the pressure block 3 through a pressure rod connecting block 401. The pressure rod connecting block 401 is installed on the pressure block 3 by screws. The pressure rod connecting block 401 is provided with a first threaded hole 402. The pressure rod 4 is provided with a thread that matches the first threaded hole 402. The axis of the first threaded hole 402 has an angle with the bottom surface, which is about 30°. The pressure rod 4 can form a force-saving torque, reduce operator fatigue, and improve molding efficiency.

[0051] In practical use, the component is placed in the first placement slot 103, and the lead of the component is placed in the second placement slot 104. Since the first spring 105 is closer to the rotating shaft 106 than the second spring 304, when the pressure rod 4 is pressed down, the first spring 105 is compressed first. That is, the pressure bar 2 is pressed down more than the pressure block 3. The pressure bar 2 contacts the base 1 first, and the limiting groove 202 of the pressure bar 2 presses on the lead of the component to prevent the lead from moving. As the pressure rod 4 continues to press down, the pressure block 3 is gradually pressed down. The protective pad 302 on the pressure block 3 squeezes the lead of the component downward, so that the lead of the component bends downward along the gap between the base 1 and the protective pad 302. Then the pressure rod 4 is released. Under the elastic force of the first spring 105 and the second spring 304, the pressure bar 2 and the pressure block 3 move upward to the initial position, and the component is removed.

[0052] The component can be fixed and bent into shape by pressing down once. When pressing down, the pressure bar 2 will first move around the rotating shaft 106 to press down the pin of the component, ensuring that the component will not slide or flip during the forming process, and improving the consistency of the silk screen position and direction on the component.

[0053] A method for forming the pins of an electronic component includes the following steps:

[0054] Step 1: Install the base 1 onto the second threaded hole 501 of the work tray 5 using screws;

[0055] Step 2: Place the component in the first placement slot 103, and place the component's pins in the second placement slot 104;

[0056] Step 3: Press down the pressure rod 4. As the pressure rod 4 is pressed down, the pressure strip 2 is first pressed onto the base 1. The limiting groove 202 of the pressure strip 2 presses onto the pin of the component to prevent the pin of the component from shaking. As the pressure rod 4 continues to press down, the protective pad 302 on the pressure block 3 squeezes the pin of the component downward, so that the pin of the component bends downward along the gap between the base 1 and the protective pad 302.

[0057] The above description is an explanation of the present invention and not a limitation thereof. The scope of the present invention is defined by the claims. Within the scope of protection of the present invention, any form of modification may be made.

Claims

1. A tooling for forming leads of electronic components, characterized in that, include: A base (1), and a pressure strip (2) and a pressure block (3) rotatably mounted on the base (1) via the same pivot (106); the base (1) is used to place components; the pressure strip (2) is used to fix the components; the pressure block (3) is used to bend and shape the pins of the components; Among them, the pressure strip (2) is set between the base (1) and the pressure block (3), and a first spring (105) is set between the base (1) and the pressure strip (2) at the end near the rotating shaft (106), and a second spring (304) is set between the pressure strip (2) and the pressure block (3) at the end away from the rotating shaft (106). The top of the base (1) is provided with a first placement groove (103) on the side away from the pivot (106), and a second placement groove (104) connected to the first placement groove (103). A through groove (201) is provided on the side of the pressure strip (2) away from the rotating shaft (106), and a limiting groove (202) corresponding to the second placement groove (104) is provided on both sides of the through groove (201) at the bottom of the pressure strip (2). The pressure block (3) has a second groove (301) on both sides. A protective pad (302) is provided in the second groove (301). The first half of the protective pad (302) that contacts the pin of the component has an angle of 3° with the vertical direction.

2. The electronic component lead forming fixture as described in claim 1, characterized in that: The base (1) is mounted on the work tray (5).

3. The electronic component lead forming fixture as described in claim 2, characterized in that: The work tray (5) is provided with a plurality of second threaded holes (501), and the base (1) is fixed to the second threaded holes (501) of the work tray (5) by screws.

4. The electronic component lead forming fixture as described in claim 1, characterized in that: The base (1) has a first spring groove (102) on the top side near the rotating shaft (106), and one end of the first spring (105) is located in the first spring groove (102); the pressure block (3) has a second spring groove (303) on the bottom side away from the rotating shaft (106), and one end of the second spring (304) is located in the second spring groove (303).

5. The electronic component lead forming fixture as described in claim 1, characterized in that: The top of the pressure block (3) is provided with a pressure rod (4) through a pressure rod connecting block (401).

6. The electronic component lead forming fixture as described in claim 5, characterized in that: The pressure rod connecting block (401) is provided with a first threaded hole (402), and the pressure rod (4) is provided with a thread corresponding to the first threaded hole (402). The axis of the first threaded hole (402) has an angle with the bottom surface.

7. A method for forming electronic component leads, using the electronic component lead forming fixture as described in claim 1, characterized in that, Includes the following steps: Step 1: Install the base (1) onto the second threaded hole (501) of the work carrier (5) using screws; Step 2: Place the component in the first placement slot (103) and place the component's pins in the second placement slot (104); Step 3: Press down the pressure bar (4). As the pressure bar (4) is pressed down, the pressure strip (2) is first pressed onto the base (1). The limiting groove (202) of the pressure strip (2) presses onto the pin of the component to prevent the pin of the component from shaking. As the pressure bar (4) continues to press down, the protective pad (302) on the pressure block (3) squeezes the pin of the component downward, so that the pin of the component bends downward along the gap between the base (1) and the protective pad (302).

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