A mildew-proof and pressure-resistant wardrobe composite board and its processing technology

By using vertical textured pine veneer and flame-retardant and anti-mold adhesive layer in the composite board, combined with antibacterial epoxy resin and other materials, the problem of solid wood composite boards being susceptible to mold is solved, and the anti-mold and physical properties are improved. Enhanced security.

CN117415895BActive Publication Date: 2024-12-20上海拉迷家具有限公司
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Patent Information

Application Number
CN202311355145.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-10-19
Publication Date
2024-12-20
Estimated Expiration
2043-10-19

AI Technical Summary

Technical Problem

Solid wood composite boards are susceptible to mold, resulting in reduced aesthetics and hidden health risks. It is difficult for the existing technology to effectively prevent mold.

Method used

Composite board made of 6-12 layers of pine veneer glued, with adjacent layers of vertical texture, and a flame-retardant and anti-mold adhesive layer is set between them, and antibacterial modified epoxy adhesive is used, containing antibacterial epoxy resin and epoxy Resin E51, zinc oxide and nanosilver improve mold resistance through specific process treatment.

Benefits of technology

It significantly improves the antibacterial and moisture resistance of composite sheets, avoids cracking, enhances physical properties and fire safety, and effectively prevents mold invasion.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of artificial boards, and in particular to a mildew-proof and pressure-resistant wardrobe composite board and a processing technology thereof; in order to improve the antibacterial property of the prepared composite board, the invention prepares an antibacterial modified epoxy resin with antibacterial function, uses hexahydro-1,3,5-tris(hydroxyethyl)-s-triazine as a raw material, utilizes the positive charge carried by the triazine ring to combine with the microbial cell membrane, causes damage to the microbial cell membrane, and thus achieves the purpose of antibacterial; then, fluorine element is introduced into the end group of hexahydro-1,3,5-tris(hydroxyethyl)-s-triazine, thereby improving the flame retardant property and water resistance of the epoxy adhesive, effectively improving the moisture resistance of the epoxy resin, and improving its safety factor in response to safety hazards such as fire; and. In order to improve the physical properties of the prepared composite board, the invention performs a texture vertical stacking treatment on pine veneers, thereby avoiding the defect that conventional solid wood boards are easy to crack, and improving the mechanical properties of the composite board.
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Description

Technical Field

[0001] The invention relates to the technical field of artificial boards, and in particular to a mildew-proof and pressure-resistant wardrobe composite board and a processing technology thereof. Background Art

[0002] As an important classification of composite panels, solid wood composite panels have important applications in the field of furniture. Solid wood composite panels are usually made of multiple layers of solid wood slices or blocks, which can maximize the use of raw materials and reduce the impact on the natural environment. In the preparation process, due to the use of a multi-layer splicing structure, the texture and wood grain of the solid wood composite panels are evenly distributed, avoiding the problems of warping and cracking that may exist in solid wood veneers. This makes solid wood composite panels an ideal choice for making stable and non-deformable furniture.

[0003] However, although solid wood composite panels are superior to ordinary solid wood materials in terms of stability and durability, they are still susceptible to mold damage, resulting in a decrease in aesthetics and health risks. Therefore, it is necessary to overcome this defect to meet market demand. Summary of the invention

[0004] The object of the present invention is to provide a mildew-proof and pressure-resistant wardrobe composite board and a processing technology thereof, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a mildew-proof and pressure-resistant wardrobe composite board, which is made by gluing 6-12 layers of pine veneers;

[0006] The textures of adjacent layers of pine veneers are perpendicular to each other; a flame retardant and mildew-proof adhesive layer is provided between adjacent layers of pine veneers; the flame retardant and mildew-proof adhesive layer is formed by curing a mildew-proof and flame retardant epoxy adhesive;

[0007] The mildew-proof and flame-retardant epoxy adhesive comprises the following components by weight: 10-30 parts of antibacterial modified epoxy resin, 60-70 parts of epoxy resin E51, 8-12.5 parts of curing agent, 8-15 parts of zinc oxide, and 0.2-0.5 parts of nano silver.

[0008] Furthermore, the thickness of the pine veneer is 1.5-2.5 mm.

[0009] Furthermore, the curing agent is any one or more of dicyandiamide and diethylenetriamine.

[0010] A processing technology for a mildew-proof and pressure-resistant wardrobe composite board comprises the following steps:

[0011] S1. Preparation of antibacterial modified epoxy resin;

[0012] S11. Disperse 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc, stir and mix for 15-30 minutes under a nitrogen atmosphere, cool to 0-5°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat dimethylbiphenyl diisocyanate to 82-85°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1-3h, after the dropwise addition is completed, add dibutyltin dilaurate, continue to heat to 115-120°C, react for 1-3h, stop heating, and dry under vacuum at 60-80°C to constant weight to obtain a fluorine-modified diisocyanate compound;

[0013] S12. Disperse hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine in chloroform, stir and mix for 30-60 min under a nitrogen atmosphere, and then cool to 8-10 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0014] The fluorine-modified diisocyanate compound prepared in step S11 is dispersed in chloroform, shaken and mixed for 30-50 minutes, and then cooled to 5-8°C under nitrogen atmosphere. The hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 is added dropwise at a uniform speed for 1-1.5 hours. After the addition is completed, DMF is added, and the temperature is raised to 55-60°C. After reflux reaction for 4-8 hours, the temperature is raised to 120-135°C, and the reaction is continued for 2-4 hours. The excess solvent is removed by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0015] S13. Disperse the isocyanate-modified triazine compound in pure chloroform, add stannous octoate, stir and disperse for 1-2 hours, slowly dropwise add the isocyanate-modified triazine compound into 1,4-di(2',3'-epoxypropyl)perfluorobutane, raise the temperature to 55-60° C., react for 8-12 hours, stop heating, and evaporate in vacuum to constant weight to obtain an antibacterial modified epoxy resin;

[0016] S2. Preparing epoxy adhesive;

[0017] Mix zinc oxide, nanosilver and antibacterial modified epoxy resin, stir at a rate of 150-400 rpm for 45-60 minutes, add epoxy resin E51, continue mixing for 40-60 minutes, perform vacuum defoaming for 10-15 minutes, add curing agent, continue mixing for 10-15 minutes, and obtain epoxy adhesive;

[0018] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0019] S31. The pine wood is peeled into pine veneer, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 6.8-8.5%;

[0020] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110-160g / m 2 After the spraying is completed, multiple layers of pine veneers with perpendicular textures are stacked and combined by hot pressing. After the hot pressing is completed, the prepared board is further cold pressed to obtain a mildew-proof and pressure-resistant wardrobe composite board.

[0021] Furthermore, in terms of weight, in step S11, the mass ratio of the 2,2'-bis(trifluoromethyl)diaminobiphenyl, dimethylbiphenyl diisocyanate, and dibutyltin dilaurate is (5.4-6.1):10:(0.03-0.05).

[0022] Furthermore, in terms of weight, in step S12, the mass ratio of the fluorine-modified diisocyanate compound, hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine, and DMF is (9.5-11.5):1:(0.05-0.1).

[0023] Furthermore, in terms of parts by weight, in step S13, the mass ratio of the isocyanate-modified triazine compound to 1,4-di(2',3'-epoxypropyl)perfluorobutane and stannous octoate is 10:(3-3.5):(0.01-0.03).

[0024] Furthermore, in step S32, during the hot pressing, the hot pressing temperature is 130-135°C, the hot pressing time is 20-30 minutes, and the hot pressing pressure is 2.5-3.5 MPa.

[0025] Furthermore, in step S32, the cold pressing treatment pressure is 1.1-1.5 MPa, and the cold pressing treatment time is 8-16 hours.

[0026] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0027] 1. In order to improve the antibacterial property of the prepared composite board, the present invention prepares an antibacterial modified epoxy resin with antibacterial function when preparing the epoxy adhesive, and uses hexahydro-1,3,5-tris(hydroxyethyl)-s-triazine as a raw material, and utilizes the electrostatic effect of the positive charge carried by the triazine ring on the microbial cell membrane, thereby combining with the microbial cell membrane to cause damage to the microbial cell membrane, thereby achieving the purpose of antibacterial; at the same time, the triazine ring is a hydrophobic group, which can greatly improve the shielding effect of the prepared epoxy adhesive on water vapor, thereby effectively improving the moisture resistance of the prepared composite board and avoiding cracking in a humid environment; then the present invention further uses 2,2'-bis(trifluoromethyl)diaminobiphenyl and The invention relates to a method for preparing a diisocyanate compound containing fluorine by reacting with diisocyanate and controlling the reaction conditions, and then reacting the diisocyanate compound with hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine to introduce fluorine into hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine, thereby improving the flame retardancy and water resistance of the epoxy adhesive. Then, the invention further uses 1,4-di(2',3'-epoxypropyl)perfluorobutane to react with the diisocyanate compound to finally generate an antibacterial modified epoxy resin with an epoxy terminal group; the diisocyanate compound contains a triazine ring with antibacterial function and a large amount of fluorine with flame retardancy and water resistance, which can effectively improve the moisture resistance of the epoxy resin and improve its safety factor in dealing with potential safety hazards such as fire.

[0028] 2. In order to improve the physical properties of the prepared composite board, the present invention uses pine boards as raw materials, and after preparing them into pine veneers, the textures are stacked vertically to each other, thereby avoiding the defect of easy cracking of conventional solid wood boards and improving the mechanical properties of the composite board. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The 2,2'-bis(trifluoromethyl)diaminobiphenyl used in this application is provided by Shanghai Aladdin Biochemical Technology Co., Ltd.; the dimethylbiphenyl diisocyanate used is provided by Pande (Shanghai) International Trade Co., Ltd.; the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine used is provided by Shandong Jining Chemical Co., Ltd.; the 1,4-bis(2',3'-epoxypropyl)perfluorobutane used is provided by Shanghai Jizhi Biochemical Technology Co., Ltd.; the nanosilver used is XFJ14 nanosilver powder provided by Jiangsu Xianfeng Nanomaterial Technology Co., Ltd.; the zinc oxide used is Hengyuan indirect zinc oxide provided by Shijiazhuang Dayuan Chemical Co., Ltd.; the epoxy resin E51 used is Phoenix brand WSR618 epoxy resin;

[0031] Embodiment 1. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized in that it comprises the following steps:

[0032] S1. Preparation of antibacterial modified epoxy resin;

[0033] S11. Disperse 5.4 parts of 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc by weight, stir and mix for 15 minutes under a nitrogen atmosphere, cool to 0°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat 10 parts of dimethylbiphenyl diisocyanate to 82°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1 hour, after the dropwise addition is completed, add 0.03 parts of dibutyltin dilaurate, continue to heat to 115°C, react for 1 hour, stop heating, dry under vacuum at 60°C to constant weight, and obtain a fluorine-modified diisocyanate compound;

[0034] S12. By weight, 1 part of hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine was dispersed in chloroform, stirred and mixed under a nitrogen atmosphere for 30 min, and then cooled to 8 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0035] Disperse 9.5 parts of the fluorine-modified diisocyanate compound prepared in step S11 in chloroform, shake and mix for 30 minutes, protect under nitrogen atmosphere, cool to 5°C, uniformly add dropwise the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 for 1 hour, add 0.05 parts of DMF after the addition, heat to 55°C, reflux for 4 hours, heat to 120°C, continue to react for 2 hours, and remove excess solvent by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0036] S13. Disperse 10 parts of isocyanate-modified triazine compound in pure chloroform by weight, add 0.01 parts of stannous octoate, stir and disperse for 1 hour, then slowly dropwise add it into 3 parts of 1,4-di(2',3'-epoxypropyl)perfluorobutane, heat to 55°C, react for 8 hours, stop heating, evaporate in vacuum to constant weight, and obtain an antibacterial modified epoxy resin;

[0037] S2. Preparing epoxy adhesive;

[0038] By weight, 8 parts of zinc oxide, 0.2 parts of nanosilver and 10 parts of antibacterial modified epoxy resin were mixed, and the mixture was stirred at a rate of 150 rpm for 45 minutes, and then 60 parts of epoxy resin E51 were added, and the mixture was mixed for 40 minutes, and then vacuum defoamed for 10 minutes, and then 8 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0039] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0040] S31. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0041] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0042] Embodiment 2. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized in that it comprises the following steps:

[0043] Compared with Example 1, this embodiment increases the amount of antibacterial modified epoxy resin added in step S2;

[0044] S1. Preparation of antibacterial modified epoxy resin;

[0045] S11. Disperse 5.4 parts of 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc by weight, stir and mix for 15 minutes under a nitrogen atmosphere, cool to 0°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat 10 parts of dimethylbiphenyl diisocyanate to 82°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1 hour, after the dropwise addition is completed, add 0.03 parts of dibutyltin dilaurate, continue to heat to 115°C, react for 1 hour, stop heating, dry under vacuum at 60°C to constant weight, and obtain a fluorine-modified diisocyanate compound;

[0046] S12. By weight, 1 part of hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine was dispersed in chloroform, stirred and mixed under a nitrogen atmosphere for 30 min, and then cooled to 8 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0047] Disperse 9.5 parts of the fluorine-modified diisocyanate compound prepared in step S11 in chloroform, shake and mix for 30 minutes, protect under nitrogen atmosphere, cool to 5°C, uniformly add dropwise the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 for 1 hour, add 0.05 parts of DMF after the addition, heat to 55°C, reflux for 4 hours, heat to 120°C, continue to react for 2 hours, and remove excess solvent by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0048] S13. Disperse 10 parts of isocyanate-modified triazine compound in pure chloroform by weight, add 0.01 parts of stannous octoate, stir and disperse for 1 hour, then slowly dropwise add it into 3 parts of 1,4-di(2',3'-epoxypropyl)perfluorobutane, heat to 55°C, react for 8 hours, stop heating, evaporate in vacuum to constant weight, and obtain an antibacterial modified epoxy resin;

[0049] S2. Preparing epoxy adhesive;

[0050] By weight, 8 parts of zinc oxide, 0.2 parts of nanosilver and 30 parts of antibacterial modified epoxy resin were mixed, and the mixture was stirred at a rate of 150 rpm for 45 minutes, and then 60 parts of epoxy resin E51 were added, and the mixture was mixed for 40 minutes, and then vacuum defoamed for 10 minutes, and then 8 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0051] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0052] S31. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0053] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0054] Embodiment 3. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized in that it comprises the following steps:

[0055] Compared with Example 2, this example increases the amount of 2,2'-bis(trifluoromethyl)diaminobiphenyl added in step S11;

[0056] S1. Preparation of antibacterial modified epoxy resin;

[0057] S11. Disperse 6.1 parts of 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc by weight, stir and mix for 15 minutes under a nitrogen atmosphere, cool to 0°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat 10 parts of dimethylbiphenyl diisocyanate to 82°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1 hour, after the dropwise addition is completed, add 0.03 parts of dibutyltin dilaurate, continue to heat to 115°C, react for 1 hour, stop heating, dry at 60°C in vacuum to constant weight, and obtain a fluorine-modified diisocyanate compound;

[0058] S12. By weight, 1 part of hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine was dispersed in chloroform, stirred and mixed under a nitrogen atmosphere for 30 min, and then cooled to 8 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0059] Disperse 9.5 parts of the fluorine-modified diisocyanate compound prepared in step S11 in chloroform, shake and mix for 30 minutes, protect under nitrogen atmosphere, cool to 5°C, uniformly add dropwise the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 for 1 hour, add 0.05 parts of DMF after the addition, heat to 55°C, reflux for 4 hours, heat to 120°C, continue to react for 2 hours, and remove excess solvent by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0060] S13. Disperse 10 parts of isocyanate-modified triazine compound in pure chloroform by weight, add 0.01 parts of stannous octoate, stir and disperse for 1 hour, then slowly dropwise add it into 3 parts of 1,4-di(2',3'-epoxypropyl)perfluorobutane, heat to 55°C, react for 8 hours, stop heating, evaporate in vacuum to constant weight, and obtain an antibacterial modified epoxy resin;

[0061] S2. Preparing epoxy adhesive;

[0062] By weight, 8 parts of zinc oxide, 0.2 parts of nanosilver and 30 parts of antibacterial modified epoxy resin were mixed, and the mixture was stirred at a rate of 150 rpm for 45 minutes, and then 60 parts of epoxy resin E51 were added, and the mixture was mixed for 40 minutes, and then vacuum defoamed for 10 minutes, and then 8 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0063] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0064] S31. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0065] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0066] Embodiment 4. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized in that it comprises the following steps:

[0067] Compared with Example 2, this example increases the amount of fluorine-modified diisocyanate compound added in step S12;

[0068] S1. Preparation of antibacterial modified epoxy resin;

[0069] S11. Disperse 5.4 parts of 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc by weight, stir and mix for 15 minutes under a nitrogen atmosphere, cool to 0°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat 10 parts of dimethylbiphenyl diisocyanate to 82°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1 hour, after the dropwise addition is completed, add 0.03 parts of dibutyltin dilaurate, continue to heat to 115°C, react for 1 hour, stop heating, dry under vacuum at 60°C to constant weight, and obtain a fluorine-modified diisocyanate compound;

[0070] S12. By weight, 1 part of hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine was dispersed in chloroform, stirred and mixed under a nitrogen atmosphere for 30 min, and then cooled to 8 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0071] Disperse 11.5 parts of the fluorine-modified diisocyanate compound prepared in step S11 in chloroform, shake and mix for 30 minutes, protect under nitrogen atmosphere, cool to 5°C, uniformly add dropwise the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 for 1 hour, add 0.05 parts of DMF after the addition, heat to 55°C, reflux for 4 hours, heat to 120°C, continue to react for 2 hours, and remove excess solvent by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0072] S13. Disperse 10 parts of isocyanate-modified triazine compound in pure chloroform by weight, add 0.01 parts of stannous octoate, stir and disperse for 1 hour, then slowly dropwise add it into 3 parts of 1,4-di(2',3'-epoxypropyl)perfluorobutane, heat to 55°C, react for 8 hours, stop heating, evaporate in vacuum to constant weight, and obtain an antibacterial modified epoxy resin;

[0073] S2. Preparing epoxy adhesive;

[0074] By weight, 8 parts of zinc oxide, 0.2 parts of nanosilver and 30 parts of antibacterial modified epoxy resin were mixed, and the mixture was stirred at a rate of 150 rpm for 45 minutes, and then 60 parts of epoxy resin E51 were added, and the mixture was mixed for 40 minutes, and then vacuum defoamed for 10 minutes, and then 8 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0075] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0076] S31. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0077] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0078] Embodiment 5. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized by comprising the following steps:

[0079] Compared with Example 2, this example increases the amount of 1,4-di(2',3'-epoxypropyl)perfluorobutane added in step S13;

[0080] S1. Preparation of antibacterial modified epoxy resin;

[0081] S11. Disperse 5.4 parts of 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc by weight, stir and mix for 15 minutes under a nitrogen atmosphere, cool to 0°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat 10 parts of dimethylbiphenyl diisocyanate to 82°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1 hour, after the dropwise addition is completed, add 0.03 parts of dibutyltin dilaurate, continue to heat to 115°C, react for 1 hour, stop heating, dry under vacuum at 60°C to constant weight, and obtain a fluorine-modified diisocyanate compound;

[0082] S12. By weight, 1 part of hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine was dispersed in chloroform, stirred and mixed under a nitrogen atmosphere for 30 min, and then cooled to 8 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0083] Disperse 9.5 parts of the fluorine-modified diisocyanate compound prepared in step S11 in chloroform, shake and mix for 30 minutes, protect under nitrogen atmosphere, cool to 5°C, uniformly add dropwise the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 for 1 hour, add 0.05 parts of DMF after the addition, heat to 55°C, reflux for 4 hours, heat to 120°C, continue to react for 2 hours, and remove excess solvent by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0084] S13. Disperse 10 parts of isocyanate-modified triazine compound in pure chloroform by weight, add 0.01 parts of stannous octoate, stir and disperse for 1 hour, then slowly dropwise add it into 3.5 parts of 1,4-di(2',3'-epoxypropyl)perfluorobutane, heat to 55°C, react for 8 hours, stop heating, evaporate in vacuum to constant weight, and obtain an antibacterial modified epoxy resin;

[0085] S2. Preparing epoxy adhesive;

[0086] By weight, 8 parts of zinc oxide, 0.2 parts of nanosilver and 30 parts of antibacterial modified epoxy resin were mixed, and the mixture was stirred at a rate of 150 rpm for 45 minutes, and then 60 parts of epoxy resin E51 were added, and the mixture was mixed for 40 minutes, and then vacuum defoamed for 10 minutes, and then 8 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0087] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0088] S31. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0089] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0090] Embodiment 6. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized in that it comprises the following steps:

[0091] S1. Preparation of antibacterial modified epoxy resin;

[0092] S11. Disperse 6.1 parts of 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc by weight, stir and mix for 15 minutes under a nitrogen atmosphere, cool to 0°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat 10 parts of dimethylbiphenyl diisocyanate to 82°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, and add 0.05 parts of dibutyltin dilaurate after the dropwise addition is completed. Continue to heat to 115°C. After reacting for 1 hour, stop heating, and dry at 60°C in vacuum to constant weight to obtain a fluorine-modified diisocyanate compound;

[0093] S12. By weight, 1 part of hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine was dispersed in chloroform, stirred and mixed under a nitrogen atmosphere for 30 min, and then cooled to 8 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0094] Disperse 11.5 parts of the fluorine-modified diisocyanate compound prepared in step S11 in chloroform, shake and mix for 30 minutes, protect under nitrogen atmosphere, cool to 5°C, and uniformly dropwise add the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 for 1 hour. After the dropwise addition, add 0.1 parts of DMF, heat to 55°C, reflux for 4 hours, heat to 120°C, continue to react for 2 hours, and remove excess solvent by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0095] S13. Disperse 10 parts of isocyanate-modified triazine compound in pure chloroform by weight, add 0.03 parts of stannous octoate, stir and disperse for 1 hour, then slowly dropwise add it into 3.5 parts of 1,4-di(2',3'-epoxypropyl)perfluorobutane, heat to 55°C, react for 8 hours, stop heating, evaporate in vacuum to constant weight, and obtain an antibacterial modified epoxy resin;

[0096] S2. Preparing epoxy adhesive;

[0097] By weight, 15 parts of zinc oxide, 0.5 parts of nanosilver and 30 parts of antibacterial modified epoxy resin were mixed, and the mixture was stirred at a rate of 150 rpm for 45 minutes, and then 70 parts of epoxy resin E51 were added, and the mixture was mixed for 40 minutes, and then vacuum defoamed for 10 minutes, and then 12.5 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0098] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0099] S31. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0100] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0101] Comparative Example 1. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized in that it comprises the following steps:

[0102] Compared with Comparative Example 2, this comparative example did not prepare the antibacterial modified epoxy resin;

[0103] S1. Preparing epoxy adhesive;

[0104] By weight, 8 parts of zinc oxide, 0.2 parts of nano silver and 60 parts of epoxy resin E51 were mixed for 40 minutes, vacuum defoamed for 10 minutes, 8 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0105] S2. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0106] S21. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0107] S22. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0108] Comparative Example 2. A processing technology for a mildew-proof and pressure-resistant wardrobe composite board, characterized in that it comprises the following steps:

[0109] Compared with Example 2, this comparative example does not add nanosilver;

[0110] S1. Preparation of antibacterial modified epoxy resin;

[0111] S11. Disperse 5.4 parts of 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc by weight, stir and mix for 15 minutes under a nitrogen atmosphere, cool to 0°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat 10 parts of dimethylbiphenyl diisocyanate to 82°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1 hour, after the dropwise addition is completed, add 0.03 parts of dibutyltin dilaurate, continue to heat to 115°C, react for 1 hour, stop heating, dry under vacuum at 60°C to constant weight, and obtain a fluorine-modified diisocyanate compound;

[0112] S12. By weight, 1 part of hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine was dispersed in chloroform, stirred and mixed under a nitrogen atmosphere for 30 min, and then cooled to 8 ° C to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion;

[0113] Disperse 9.5 parts of the fluorine-modified diisocyanate compound prepared in step S11 in chloroform, shake and mix for 30 minutes, protect under nitrogen atmosphere, cool to 5°C, uniformly add dropwise the hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 for 1 hour, add 0.05 parts of DMF after the addition, heat to 55°C, reflux for 4 hours, heat to 120°C, continue to react for 2 hours, and remove excess solvent by rotary evaporation to obtain an isocyanate-modified triazine compound;

[0114] S13. Disperse 10 parts of isocyanate-modified triazine compound in pure chloroform by weight, add 0.01 parts of stannous octoate, stir and disperse for 1 hour, then slowly dropwise add it into 3 parts of 1,4-di(2',3'-epoxypropyl)perfluorobutane, heat to 55°C, react for 8 hours, stop heating, evaporate in vacuum to constant weight, and obtain an antibacterial modified epoxy resin;

[0115] S2. Preparing epoxy adhesive;

[0116] By weight, 8 parts of zinc oxide and 30 parts of antibacterial modified epoxy resin were mixed, and after mixing and stirring at a rate of 150 rpm for 45 minutes, 60 parts of epoxy resin E51 were added, and the mixture was mixed for 40 minutes, vacuum defoaming was performed for 10 minutes, and 8 parts of diethylenetriamine curing agent were added, and the mixture was mixed for 10 minutes to obtain an epoxy adhesive;

[0117] S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels;

[0118] S31. The pine wood is peeled into a pine veneer having a thickness of 1.5 mm, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 7.1-7.2%;

[0119] S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface with a single-sided spraying amount of 110g / m 2 After spraying, stack multiple layers of pine veneers with perpendicular textures and combine them by hot pressing. The hot pressing temperature is 130℃ and the hot pressing time is 20min. The hot pressing pressure is 2.5MPa. After the hot pressing, the prepared board is cold pressed. The cold pressing pressure is 1.1MPa and the cold pressing time is 8h. After the cold pressing treatment, a mildew-proof and pressure-resistant wardrobe composite board is obtained.

[0120] Testing: According to GB / T 15036.2, the bonding strength of the composite boards prepared in Examples 1-6 and Comparative Examples 1-2 was tested; the composite boards prepared in Examples 1-6 and Comparative Examples 1-2 were placed in an environment with an ambient temperature of 20°C and an air humidity of 85-90%, and the surface mildew time was recorded; according to the large plate combustion simulation method of GB / T 12441, the limiting oxygen index of the composite boards prepared in Examples 1-6 and Comparative Examples 1-2 was tested. The test results are shown in the following table;

[0121]

[0122]

[0123] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A processing technology for mildew-proof and pressure-resistant wardrobe composite board, characterized in that: The following steps are involved: S1. Preparation of antibacterial modified epoxy resin; S11. Disperse 2,2'-bis(trifluoromethyl)diaminobiphenyl in DMAc, stir and mix for 15-30 minutes under a nitrogen atmosphere, cool to 0-5°C to obtain a 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, heat dimethylbiphenyl diisocyanate to 82-85°C, uniformly dropwise add the 2,2'-bis(trifluoromethyl)diaminobiphenyl dispersion, stir and ultrasonically shake during the dropwise addition, the dropwise addition time is 1-3h, after the dropwise addition is completed, add dibutyltin dilaurate, continue to heat to 115-120°C, react for 1-3h, stop heating, dry under vacuum at 60-80°C to constant weight, and obtain a fluorine-modified diisocyanate compound; S12. Disperse hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine in chloroform, stir and mix for 30-60 min under a nitrogen atmosphere, and then cool to 8-10° C. to obtain a hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion; The fluorine-modified diisocyanate compound prepared in step S11 is dispersed in chloroform, shaken and mixed for 30-50 minutes, and then cooled to 5-8°C under nitrogen atmosphere. The hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine dispersion prepared in step S11 is added dropwise at a uniform speed for 1-1.5 hours. After the addition is completed, DMF is added, and the temperature is raised to 55-60°C. After reflux reaction for 4-8 hours, the temperature is raised to 120-135°C, and the reaction is continued for 2-4 hours. The excess solvent is removed by rotary evaporation to obtain an isocyanate-modified triazine compound; S13. Disperse the isocyanate-modified triazine compound in pure chloroform, add stannous octoate, stir and disperse for 1-2 hours, slowly dropwise add the isocyanate-modified triazine compound into 1,4-di(2',3'-epoxypropyl)perfluorobutane, raise the temperature to 55-60°C, react for 8-12 hours, stop heating, and evaporate in vacuum to constant weight to obtain an antibacterial modified epoxy resin; S2. Preparing epoxy adhesive; Mix zinc oxide, nanosilver and antibacterial modified epoxy resin, stir at a rate of 150-400 rpm for 45-60 minutes, add epoxy resin E51, continue mixing for 40-60 minutes, perform vacuum defoaming for 10-15 minutes, add curing agent, continue mixing for 10-15 minutes, and obtain epoxy adhesive; S3. Preparation of mildew-proof and pressure-resistant wardrobe composite panels; S31. The pine wood is peeled into pine veneer, and the prepared pine veneer is hot-air dried until the moisture content of the pine veneer is 6.8-8.5%; S32. After the dried pine veneer surface is swept with strong wind to remove the dry sawdust on the surface, the epoxy adhesive is sprayed on the surface, and the spraying amount on one side is 110-160g / m 2 After the spraying is completed, multiple layers of pine veneers with perpendicular textures are stacked and combined by hot pressing. After the hot pressing is completed, the prepared board is further cold pressed to obtain a mildew-proof and pressure-resistant wardrobe composite board.

2. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: The mildew-proof and pressure-resistant wardrobe composite board is made by gluing 6-12 layers of pine veneer; Among them, the textures of adjacent layers of pine veneers are perpendicular to each other; a flame retardant and mildew-proof adhesive layer is provided between adjacent layers of pine veneers; the flame retardant and mildew-proof adhesive layer is formed by curing the mildew-proof and flame retardant epoxy adhesive; The mildew-proof and flame-retardant epoxy adhesive comprises the following components by weight: 10-30 parts of antibacterial modified epoxy resin, 60-70 parts of epoxy resin E51, 8-12.5 parts of curing agent, 8-15 parts of zinc oxide, and 0.2-0.5 parts of nano silver.

3. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: The thickness of the pine veneer is 1.5-2.5 mm.

4. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: The curing agent is any one or more of dicyandiamide and diethylenetriamine.

5. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: In terms of weight, in step S11, the mass ratio of 2,2'-bis(trifluoromethyl)diaminobiphenyl, dimethylbiphenyl diisocyanate, and dibutyltin dilaurate is (5.4-6.1): 10:(0.03-0.05)。 6. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: In terms of weight, in step S12, the mass ratio of the fluorine-modified diisocyanate compound, hydrogen-1,3,5-tris(hydroxyethyl)-s-triazine, and DMF is (9.5-11.5):1:(0.05-0.1).

7. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: In terms of weight, in step S13, the mass ratio of the isocyanate-modified triazine compound to 1,4-di(2',3'-epoxypropyl)perfluorobutane and stannous octoate is 10:(3-3.5):(0.01-0.03).

8. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: In step S32, during the hot pressing bonding, the hot pressing temperature is 130-135°C, the hot pressing time is 20-30 minutes, and the hot pressing pressure is 2.5-3.5 MPa.

9. The processing technology of the mildew-proof and pressure-resistant wardrobe composite board according to claim 1 is characterized by: In step S32, the cold pressing treatment pressure is 1.1-1.5 MPa, and the cold pressing treatment time is 8-16 hours.