A semiconductor material chemical coating device

Abstract

The present invention discloses a semiconductor material chemical plating device, comprising a jig, which is provided with a cavity for accommodating the semiconductor material to be plated; a fixed bracket for fixing the jig; and a rotating device connected to the jig for driving the jig to rotate; an input component, which comprises a plurality of liquid inlet pipes simultaneously connected to the inlet of the first end of the jig, and each liquid inlet pipe is connected to a different type of liquid storage tank; an air inlet pipe connected to the inlet of the first end of the jig, and the air inlet pipe is connected to an air source; an output component, which comprises a plurality of liquid outlet pipes simultaneously connected to the outlet of the second end of the jig, and each liquid outlet pipe is connected to a different type of liquid storage tank; and a plurality of liquid discharge pipes, each liquid discharge pipe is connected to a corresponding liquid discharge pipe, and each liquid discharge pipe is connected to a waste liquid tank. The device can automatically introduce and discharge different liquids into and out of the jig in sequence and shake the jig, thereby completing the plating of the semiconductor material in the jig.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor material coating, and in particular to a semiconductor material chemical coating device. Background Art

[0002] During the chemical plating process of semiconductor materials, the semiconductor materials need to be immersed in various solutions for reaction, and optical thin films are produced or deposited on the surface of optical parts by chemical reaction. Therefore, the semiconductor materials need to be placed in a container, and then different types of solutions are introduced into the container in sequence. During this process, when the next solution needs to be introduced, the previous solution needs to be discharged from the container first. For such a range of process steps, there is currently no automated equipment specifically for chemical plating of semiconductor materials, so the entire plating process has low work efficiency and poor coating effect.

[0003] It should be noted that the above technical background is merely provided to provide a clear and complete description of the technical solutions of the present invention and to facilitate understanding by those skilled in the art. Simply because these solutions are described in the technical background section of the present invention, it should not be assumed that the above technical solutions are well known to those skilled in the art. Summary of the Invention

[0004] In order to overcome the above shortcomings, the purpose of the present invention is to provide a semiconductor material chemical plating equipment, thereby effectively solving the above technical problems.

[0005] In order to achieve the above objectives, the technical solution adopted by the present invention is: a semiconductor material chemical plating device, including a device body, the device body including:

[0006] A fixture having a cavity inside for accommodating the semiconductor material to be plated;

[0007] Rotating support assembly,

[0008] It includes a fixing bracket for fixing the jig;

[0009] It also includes a rotating device connected to the jig to drive the jig to rotate;

[0010] Input components,

[0011] It includes a plurality of liquid inlet pipes connected to the inlet of the first end of the fixture at the same time, and each liquid inlet pipe is connected to a different type of liquid storage tank;

[0012] It also includes an air inlet pipe connected to the inlet of the first end of the fixture, and the air inlet pipe is connected to the air source;

[0013] Output components,

[0014] It includes a plurality of liquid outlet pipes connected to the outlet of the second end of the fixture at the same time, and each liquid outlet pipe is connected to a different type of liquid storage tank;

[0015] It also includes a plurality of drainage pipes, one drainage pipe is connected to a corresponding liquid outlet pipe, and each drainage pipe is connected to a waste liquid tank.

[0016] The present invention is a semiconductor material chemical plating device designed, which places the semiconductor material to be plated in the cavity of the jig, and then fixes the jig as a whole on a fixed bracket, the inlet of the first end of the jig is connected to multiple liquid inlet pipes and air inlet pipes, and at the same time, the liquid inlet pipes are respectively connected to different types of liquid storage tanks; the outlet of the second end of the jig is connected to multiple liquid outlet pipes, and at the same time, the liquid outlet pipes are respectively connected to different types of liquid storage tanks; when plating, the jig is first rotated into a vertical state by a rotating device, the inlet of the first end of the jig is located at the bottom end, and the outlet of the second end of the jig is located at the top end, and then one of the liquid inlet pipes is used to pass one type of solution into the interior of the jig through the inlet of the first end of the jig. After completion, the jig needs to be rotated again by the rotating device to shake the jig so that the solution inside the jig can fully contact and react with the semiconductor material, and then the rotating device rotates the jig to a vertical state again. At this time, the inlet of the first end of the jig is at the bottom end, and the outlet of the second end of the jig is at the top end. It needs to be located at the top, and the second end outlet of the fixture is located at the bottom, so that the solution inside the fixture can be completely drained when inflating and discharging, and then an inert gas is introduced into the interior of the fixture through the air inlet pipe, so that the solution inside the fixture flows from the second end outlet of the fixture to the liquid outlet pipe back to the liquid storage tank, thus completing the cycle of introducing one solution; then the second solution is introduced into the fixture again according to the above steps, and then downward, according to different process requirements, a variety of different solutions are introduced in turn until the last solution is discharged from the fixture to complete the chemical plating of the entire semiconductor material; in addition, each liquid outlet pipe is connected to a drainage pipe. Some solutions cannot be recycled after chemical reaction, so such solutions cannot be returned to the liquid storage tank for reuse after entering the fixture and reacting with the semiconductor material. They need to be transferred from the liquid outlet pipe to the drainage pipe, and then from the drainage pipe to the waste liquid tank for unified collection.

[0017] The beneficial effects of the present invention are as follows: the device can automatically introduce and discharge different liquids into the jig in sequence and shake the jig, thereby completing the coating of the semiconductor material in the jig; the equipment has a high degree of automation, no manual operation is required, the coating efficiency is high, the coating effect is good, and the versatility is high. The design of multiple liquid storage tanks connected to the circulation pipeline can adapt to a variety of different types of semiconductor material chemical plating processes.

[0018] Furthermore, the jig is cylindrical in shape and has a hollow accommodating cavity inside. The inlet and outlet of the jig are respectively opened at the top and bottom of the cylindrical jig; the semiconductor material is placed in the hollow accommodating cavity inside the jig, and an inlet and outlet are respectively opened at both ends of the jig. The inlet of the jig is connected to the liquid inlet pipe and the air inlet pipe. At the same time, the liquid inlet pipe is connected to different types of liquid storage tanks; the outlet at the second end of the jig is connected to the liquid outlet pipe, and the liquid outlet pipe is connected to different types of liquid storage tanks; then, the solution is introduced into the hollow accommodating cavity through the inlet at one end of the jig to react with the semiconductor material. After the reaction is completed, an inert gas is introduced into the interior of the jig through the air inlet pipe, so that the solution inside the jig flows back to the liquid storage tank from the outlet of the jig through the liquid outlet pipe, and the original solution in the jig is discharged by ventilation and drainage method, and then the next solution is introduced.

[0019] Furthermore, a positioning block is provided on the fixed bracket, and an arc-shaped slot is provided on the positioning block, and a lock corresponding to the slot is provided on the positioning block; the positioning block is used to secure the jig on the fixed bracket to ensure that the jig will not get loose when the bracket rotates with the jig; the jig is placed in the slot of the positioning block, and finally the jig is buckled by the lock to ensure that the jig is locked on the fixed bracket, which also facilitates the disassembly and assembly of the jig and the fixed bracket.

[0020] Furthermore, the rotating device includes a first driving motor, a first driving gear and a first driven gear, wherein:

[0021] The output end of the first driving motor is connected to the first driving gear, the first driven gear is meshed with the first driving gear, and the first driven gear and the fixing bracket are both sleeved on the same rotating shaft and rotate synchronously.

[0022] The main function of the rotating device is to drive the fixed bracket and the fixture on the bracket to rotate, because when liquid is introduced into the fixture and gas is introduced to discharge the liquid, the inlet and outlet positions at both ends of the fixture need to be switched in the two states. In addition, the fixture also needs to shake the internal solution by rotation to ensure that the solution can fully contact and react with the semiconductor material; the working principle of the rotating device is: first, the first driving motor drives the first driving gear to rotate, and the first driving gear drives the first driven gear to rotate. Since the first driven gear is coaxially connected to the fixed bracket, the first driven gear and the fixed bracket can achieve synchronous rotation; in addition, the first driving gear and the first driven gear belong to a pair of reduction gears with corresponding gear ratios, the first driving gear is a small gear, and the first driven gear is a large gear.

[0023] Furthermore, pipeline switching devices are provided at both ports of the fixture, and the pipeline switching devices are used to switch different pipelines to be connected to the ports of the fixture respectively.

[0024] Since the two ports of the fixture can only be connected to the mouth of one pipe at a time, when the solution inside the fixture needs to be replaced, the ports of the fixture need to be switched to different pipes for connection through the pipe switching device; therefore, the pipe switching device needs to be set at both ends of the fixture and have the same structure.

[0025] Furthermore, the pipeline switching device includes a rotating disk, a connector, a second drive motor, a second driving gear, a second driven gear, a movable plate and a telescopic cylinder, wherein:

[0026] The pipe openings of the pipes are fixedly mounted on the rotating disk, the output end of the second driving motor is connected to the second driving gear, the second driving gear is meshed with the second driven gear, and the second driven gear and the movable plate are sleeved on the same rotating shaft and rotate synchronously;

[0027] The connector is connected to the port of the fixture and is installed on the movable plate. The movable plate is connected to the active end of the telescopic cylinder. At the same time, the telescopic cylinder drives the movable plate to move, so that the connector on the movable plate is connected to the pipe mouth of the pipeline on the rotating disk.

[0028] The working principle of the pipeline switching device is as follows: since the two ports of the fixture can only be connected to the orifices of one pipeline at a time, when the solution inside the fixture needs to be replaced, the ports of the fixture need to be switched to different pipelines for connection through the pipeline switching device; after the previous pipeline is connected to the port of the fixture, the connector is docked with the orifice of the pipeline, so it is necessary to use the telescopic cylinder to drive the movable plate back to separate the connector from the orifice of the pipeline first, and then the second drive motor starts working, and the second drive motor drives the second driving gear to rotate, and the second driving gear drives the second driven gear to rotate. Since the second driven gear is coaxially connected to the rotating disk, the rotating disk rotates synchronously, so that the orifice of the pipeline to be connected on the rotating disk moves to a state aligned with the connector, and then the telescopic cylinder works again to drive the movable plate to extend, so that the connector is docked with the orifice of the pipeline to be connected; in addition, the second driving gear and the second driven gear belong to a pair of reduction gears with corresponding gear ratios, the second driving gear is a small gear, and the second driven gear is a large gear.

[0029] Furthermore, the waste liquid tank includes a recyclable waste liquid tank and a non-recyclable waste liquid tank, and there are several recyclable waste liquid tanks and one non-recyclable waste liquid tank. Some solutions cannot be recycled after a chemical reaction occurs, so such solutions cannot flow back to the liquid storage tank for reuse after entering the jig to react with the semiconductor material. They need to be transferred from the liquid outlet pipe to the drain pipe, and then passed from the drain pipe into the waste liquid tank for unified collection. Among these non-reusable solutions, there are also solutions with recycling value and solutions without recycling value. Therefore, two different types of waste liquid tanks, recyclable waste liquid tanks and non-recyclable waste liquid tanks, are set. Solutions with recycling value need to be recycled, so they cannot be mixed with other solutions with recycling value. Therefore, multiple recyclable waste liquid tanks need to be set according to the types of solutions with recycling value. Solutions without recycling value are generally discharged directly afterwards, so even solutions of different types can be mixed and collected in a non-recyclable waste liquid tank.

[0030] Furthermore, the device body also includes a fluid replenishment component, which includes a plurality of fluid replenishment pipes respectively connected to corresponding fluid storage tanks; when the device is in continuous operation, the solution in each fluid storage tank will become less and less. In order to ensure that the device can work normally, it is necessary to replenish the fluid in the fluid storage tank in time; therefore, according to different types of solutions, multiple fluid replenishment pipes are set up to be connected to their respective corresponding fluid storage tanks, and the other end of the fluid replenishment pipe is generally connected to the source of solution supply.

[0031] Furthermore, the air intake pipe is provided with a plurality of branch pipes, through which the air intake pipe is connected to all the liquid storage tanks and waste liquid tanks; in addition to being connected to the port of the jig for ventilation and drainage inside the jig, the air intake pipe can also introduce inert gas into each liquid storage tank through the jig pipe to ensure that each liquid storage tank maintains a positive pressure state and ensure the normal operation of the equipment.

[0032] Furthermore, the liquid inlet pipe and the liquid outlet pipe are both provided with control valves and delivery pumps; the device controls the control valves and delivery pumps on each pipe through a controller, thereby realizing automatic operation of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 Schematic diagram of the overall structure of the device according to one embodiment of the present invention.

[0034] Figure 2 Schematic diagram of the structure of a rotating support assembly according to an embodiment of the present invention.

[0035] Figure 3 Schematic diagram of the structure of a rotating device according to an embodiment of the present invention.

[0036] Figure 4 Schematic diagram of the structure of a pipeline switching device according to an embodiment of the present invention.

[0037] Figure 5 Schematic diagram of the input component structure according to an embodiment of the present invention.

[0038] Figure 6 Schematic diagram of the output component structure of an embodiment of the present invention.

[0039] Figure 7 Schematic diagram of the structure of a fluid infusion component according to an embodiment of the present invention.

[0040] In the figure: 1. Fixture; 2. Rotary support assembly; 3. Input assembly; 4. Output assembly; 5. Fluid replenishment assembly;

[0041] 2.1. Fixed bracket; 2.2. Arc-shaped slot; 2.3. Lock; 2.4. Rotating device; 2.5. Pipe switching device;

[0042] 2.4.1. First drive motor; 2.4.2. First driving gear; 2.4.3. First driven gear;

[0043] 2.5.1. Rotating plate; 2.5.2. Connector; 2.5.3. Second drive motor; 2.5.4. Second driving gear; 2.5.5. Second driven gear; 2.5.6. Movable plate; 2.5.7. Telescopic cylinder;

[0044] 3.1. Liquid inlet pipe; 3.2. Liquid storage tank; 3.3. Air inlet pipe;

[0045] 4.1, liquid outlet pipe; 4.2, liquid discharge pipe; 4.3, waste liquid tank;

[0046] 5.1. Fluid infusion pipeline. DETAILED DESCRIPTION

[0047] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0048] See also Figures 1 to 7. It should be noted that in the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the invented product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third" and the like are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance. Terms such as "horizontal", "vertical", and "overhanging" do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0049] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0050] Combine Figure 1 、 Figure 5 、 Figure 6 as well as Figure 7 As shown, a semiconductor material chemical plating device includes a device body, the device body includes a fixture 1, which has a cavity inside for accommodating the semiconductor material to be plated; further includes a rotating support assembly 2, the rotating support assembly 2 includes a fixed bracket 2.1, the fixed bracket 2.1 is used to fix the fixture 1; further includes a rotating device 2.4, the rotating device 2.4 is connected to the fixture 1 to drive the fixture 1 to rotate; further includes an input assembly 3, the input assembly 3 includes a plurality of liquid inlet pipes 3.1 that are simultaneously connected to the first end inlet of the fixture 1, and each liquid inlet pipe The fixture 1 further comprises a plurality of liquid outlet pipes 4.1 connected to the outlet of the second end of the fixture 1, and each of the liquid outlet pipes 4.1 is connected to a different type of liquid storage tank 3.2; the fixture 1 further comprises an air inlet pipe 3.3 connected to the inlet of the first end of the fixture 1, and the air inlet pipe 3.3 is connected to the air source; the fixture 1 further comprises an output component 4, the output component 4 comprises a plurality of liquid outlet pipes 4.1 connected to the outlet of the second end of the fixture 1, and each of the liquid outlet pipes 4.1 is connected to a different type of liquid storage tank 3.2; the fixture 1 further comprises a plurality of liquid discharge pipes 4.2, each liquid discharge pipe 4.2 is connected to a corresponding liquid discharge pipe 4.1, and each liquid discharge pipe 4.2 is connected to a waste liquid tank 4.3.

[0051] The present invention is a semiconductor material chemical plating device, the specific working principle of which is:

[0052] The semiconductor material to be coated is placed in the cavity of the jig 1, and then the jig 1 is fixed as a whole on the fixed bracket 2.1. The inlet of the first end of the jig 1 is connected to multiple liquid inlet pipes 3.1 and air inlet pipes 3.3. At the same time, the liquid inlet pipes 3.1 are respectively connected to different types of liquid storage tanks 3.2; the outlet of the second end of the jig 1 is connected to multiple liquid outlet pipes 4.1. At the same time, the liquid outlet pipes 4.1 are respectively connected to different types of liquid storage tanks 3.2; when coating, the jig 1 is first rotated into a vertical state by the rotating device 2.4, The inlet of the first end of the jig 1 is located at the bottom, and the outlet of the second end of the jig 1 is located at the top. Then, one of the liquid inlet pipes 3.1 is used to introduce one type of solution into the inside of the jig 1 through the inlet of the first end of the jig 1. After completion, the jig 1 needs to be rotated again by the rotating device 2.4 to shake the jig 1 so that the solution inside the jig 1 can fully contact and react with the semiconductor material. Then, the rotating device 2.4 rotates the jig 1 to a vertical state again. At this time, the inlet of the first end of the jig 1 needs to be at the top, and the outlet of the second end of the jig 1 is at the bottom. In this way, the solution inside the jig 1 can be completely drained during inflation and drainage. Then, inert gas is introduced into the inside of the jig 1 through the air inlet pipe 3.3, so that the solution inside the jig 1 flows from the second end outlet of the jig 1 to the liquid outlet pipe 4.1 and back to the liquid storage tank 3.2, thus completing the cycle of introducing one solution. Then, the second solution is introduced into the jig 1 again according to the above steps, and then, according to different process requirements, multiple different solutions are introduced in turn. The solution is passed through the fixture 1 until the last solution is discharged from the fixture 1, completing the chemical plating of the entire semiconductor material. In addition, each liquid outlet pipe 4.1 is connected to a drainage pipe 4.2. Some solutions cannot be recycled after a chemical reaction occurs. Therefore, such solutions cannot flow back to the liquid storage tank 3.2 for reuse after entering the fixture 1 to react with the semiconductor material. They need to be transferred from the liquid outlet pipe 4.1 to the drainage pipe 4.2, and then from the drainage pipe 4.2 to the waste liquid tank 4.3 for unified collection.

[0053] This equipment can automatically introduce and discharge different liquids into the jig 1 in sequence and shake the jig 1, thereby completing the coating of the semiconductor material in the jig 1; the equipment has a high degree of automation, no manual operation is required, the coating efficiency is high, the coating effect is good, and it is highly versatile. The design of multiple liquid storage tanks 3.2 connected to the circulation pipeline can adapt to a variety of different types of semiconductor material chemical plating processes.

[0054] In one or more embodiments, Figure 2 As shown, the jig 1 is cylindrical in shape with a hollow accommodating cavity inside. The inlet and outlet of the jig 1 are respectively opened at the top and bottom of the cylindrical jig 1.

[0055] The semiconductor material is placed in the hollow accommodating cavity inside the jig 1. An inlet and an outlet are respectively provided at both ends of the jig 1. The inlet of the jig 1 is connected to the liquid inlet pipe 3.1 and the air inlet pipe 3.3. At the same time, the liquid inlet pipe 3.1 is connected to different types of liquid storage tanks 3.2; the outlet at the second end of the jig 1 is connected to the liquid outlet pipe 4.1, and the liquid outlet pipe 4.1 is connected to different types of liquid storage tanks 3.2; then, the solution is introduced into the hollow accommodating cavity through the inlet at one end of the jig 1 to react with the semiconductor material. After the reaction is completed, an inert gas is introduced into the interior of the jig 1 through the air inlet pipe 3.3, so that the solution inside the jig 1 flows from the outlet of the jig 1 through the liquid outlet pipe 4.1 back to the liquid storage tank 3.2. The original solution in the jig 1 is discharged by ventilation and drainage, and then the next solution is introduced.

[0056] In one or more embodiments, Figure 2 As shown, a positioning block is provided on the fixing bracket 2.1, an arc-shaped slot 2.2 is provided on the positioning block, and a lock buckle 2.3 corresponding to the slot is provided on the positioning block.

[0057] The positioning block is used to secure the jig 1 on the fixed bracket 2.1 to ensure that the jig 1 will not get loose when the bracket rotates with the jig 1; the jig 1 is placed in the slot of the positioning block, and finally the jig 1 is buckled by the lock 2.3 to ensure that the jig 1 is locked on the fixed bracket 2.1, and it also facilitates the disassembly and assembly between the jig 1 and the fixed bracket 2.1.

[0058] In one or more embodiments, Figure 3 As shown, the rotating device 2.4 includes a first driving motor 2.4.1, a first driving gear 2.4.2 and a first driven gear 2.4.3, wherein the output end of the first driving motor 2.4.1 is connected to the first driving gear 2.4.2, the first driven gear 2.4.3 is engaged with the first driving gear 2.4.2, and the first driven gear 2.4.3 and the fixed bracket 2.1 are both sleeved on the same rotating shaft and rotate synchronously.

[0059] The main function of the rotating device 2.4 is to drive the fixed bracket 2.1 and the fixture 1 on the bracket to rotate. Because when liquid is introduced into the fixture 1 and gas is introduced to discharge the liquid, the inlet and outlet positions at both ends of the fixture 1 need to be switched in the two states. In addition, the fixture 1 also needs to shake the internal solution by rotation to ensure that the solution can fully contact and react with the semiconductor material; the working principle of the rotating device 2.4 is: first, the first driving motor 2.4.1 drives the first driving gear 2.4.2 to rotate, and the first driving gear 2.4.2 drives the first driven gear 2.4.3 to rotate. Since the first driven gear 2.4.3 is coaxially connected to the fixed bracket, the first driven gear 2.4.3 and the fixed bracket can rotate synchronously; in addition, the first driving gear 2.4.2 and the first driven gear belong to a pair of reduction gears with corresponding gear ratios. The first driving gear 2.4.2 is a small gear and the first driven gear 2.4.3 is a large gear.

[0060] In one or more embodiments, Figure 4 As shown, pipeline switching devices 2.5 are provided at the two ports of the fixture 1, and the pipeline switching devices 2.5 are used to switch different pipelines to be connected to the ports of the fixture 1 respectively.

[0061] Since the two ports of the fixture 1 can only be connected to the mouth of one pipe at a time, when the solution inside the fixture 1 needs to be replaced, the ports of the fixture 1 need to be switched to different pipes for connection through the pipe switching device 2.5; therefore, the pipe switching device 2.5 needs to be set at both ends of the fixture 1 and have the same structure.

[0062] In one or more embodiments, Figure 4 As shown, the pipeline switching device 2.5 includes a rotating disk 2.5.1, a connector 2.5.2, a second drive motor 2.5.3, a second driving gear 2.5.4, a second driven gear 2.5.5, a movable plate 2.5.6 and a telescopic cylinder 2.5.7, wherein the pipe openings are fixedly mounted on the rotating disk 2.5.1, the output end of the second drive motor 2.5.3 is connected to the second driving gear 2.5.4, and the second driving gear 2.5.4 is meshed with the second driven gear 2.5.5. The second driven gear 2.5.5 and the movable plate 2.5.6 are both mounted on the same rotating shaft and rotate synchronously; the connecting head 2.5.2 is connected to the port of the jig 1, and the connecting head 2.5.2 is installed on the movable plate 2.5.6. The movable plate 2.5.6 is connected to the working end of the telescopic cylinder 2.5.7. At the same time, the telescopic cylinder 2.5.7 drives the movable plate 2.5.6 to move, so that the connecting head 2.5.2 on the movable plate 2.5.6 is connected to the pipe mouth of the pipe on the rotating disk 2.5.1.

[0063] The working principle of the pipeline switching device 2.5 is as follows: since the two ports of the fixture 1 can only be connected to the nozzle of one pipeline at a time, when the solution inside the fixture 1 needs to be replaced, the port of the fixture 1 needs to be switched to a different pipeline for connection through the pipeline switching device 2.5; after the previous pipeline is connected to the port of the fixture 1, the connector 2.5.2 is connected to the nozzle of the pipeline, so it is necessary to use the telescopic cylinder 2.5.7 to drive the movable plate 2.5.6 to retract, first separate the connector 2.5.2 from the nozzle of the pipeline, and then the second drive motor 2.5.3 starts to work, and the second drive motor 2.5.3 drives the second driving gear 2.5.4 to rotate, and the second driving gear 2.5.4 is turned. Gear 2.5.4 drives the second driven gear 2.5.5 to rotate. Since the second driven gear 2.5.5 is coaxially connected to the rotating disk 2.5.1, the rotating disk 2.5.1 rotates synchronously, so that the pipe opening to be connected on the rotating disk 2.5.1 moves to a state aligned with the connector 2.5.2, and then the telescopic cylinder 2.5.7 works again to drive the movable plate 2.5.6 to extend, so that the connector 2.5.2 is connected to the pipe opening to be connected. In addition, the second driving gear 2.5.4 and the second driven gear are a pair of reduction gears with corresponding gear ratios. The second driving gear 2.5.4 is a small gear and the second driven gear 2.5.5 is a large gear.

[0064] In one or more embodiments, the waste liquid tank 4.3 includes a recyclable waste liquid tank 4.3 and a non-recyclable waste liquid tank 4.3. There are several recyclable waste liquid tanks 4.3 and there is one non-recyclable waste liquid tank 4.3.

[0065] Some solutions cannot be recycled after a chemical reaction occurs, so such solutions cannot flow back to the liquid storage tank 3.2 for reuse after entering the jig 1 to react with the semiconductor material. They need to be transferred from the liquid outlet pipe 4.1 to the drain pipe 4.2, and then passed from the drain pipe 4.2 to the waste liquid tank 4.3 for unified collection; and among these solutions that cannot be reused, there are also solutions with recycling value and solutions without recycling value, so two different types of waste liquid tanks 4.3 are set, namely, recyclable waste liquid tanks 4.3 and non-recyclable waste liquid tanks 4.3. Solutions with recycling value need to be recycled, so they cannot be mixed with other solutions with recycling value, so multiple recyclable waste liquid tanks 4.3 need to be set according to the number of solutions with recycling value; solutions without recycling value are generally discharged directly afterwards, so even if they belong to different types of solutions, they can be mixed and collected in a non-recyclable waste liquid tank 4.3.

[0066] In one or more embodiments, Figure 7 As shown, the device body further includes a fluid replenishing component 5, and the fluid replenishing component 5 includes a plurality of fluid replenishing pipes 5.1 respectively connected to corresponding fluid storage tanks 3.2.

[0067] When the device is in continuous operation, the solution in each liquid storage tank 3.2 will become less and less. In order to ensure the normal operation of the device, the liquid storage tank 3.2 needs to be replenished in time. Therefore, according to different types of solutions, multiple liquid replenishment pipes 5.1 are set to connect to their corresponding liquid storage tanks 3.2 respectively, and the other end of the liquid replenishment pipe 5.1 is generally connected to the source of solution supply.

[0068] In one or more embodiments, Figure 5 As shown, the air intake pipe 3.3 is provided with a plurality of branch pipes, and the air intake pipe 3.3 is connected with all the liquid storage tanks 3.2 and the waste liquid tank 4.3 through all the branch pipes.

[0069] In addition to being connected to the port of the fixture 1 for ventilation and drainage inside the fixture 1, the air inlet pipe can also be used to introduce inert gas into each liquid storage tank 3.2 through the pipeline of the fixture 1 to ensure that each liquid storage tank 3.2 maintains a positive pressure state and ensures the normal operation of the equipment.

[0070] In one or more embodiments, the liquid inlet pipe 3.1 and the liquid outlet pipe 4.1 are both provided with a control valve and a delivery pump.

[0071] The equipment controls the control valves and delivery pumps on each pipeline through the controller, thereby realizing the automatic operation of the equipment.

[0072] The above embodiments are only for illustrating the technical concept and features of the present invention. Its purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. It cannot be used to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor material chemical plating device, comprising a device body, characterized in that: The device body comprises: A fixture (1) is provided with a cavity therein for accommodating semiconductor material to be plated; Rotating support assembly (2), It includes a fixing bracket (2.1) for fixing the fixture (1); It also includes a rotating device (2.4) connected to the jig (1) to drive the jig (1) to rotate; Input component (3), It comprises a plurality of liquid inlet pipes (3.1) simultaneously connected to the inlet of the first end of the fixture (1), and each liquid inlet pipe (3.1) is respectively connected to a different type of liquid storage tank (3.2); It also includes an air intake pipe (3.3) connected to the inlet of the first end of the fixture (1), and the air intake pipe (3.3) is connected to the air source; Output component (4), It comprises a plurality of liquid outlet pipes (4.1) simultaneously connected to the outlet of the second end of the fixture (1), and each liquid outlet pipe (4.1) is respectively connected to a different type of liquid storage tank (3.2); It also includes a plurality of drainage pipes (4.2), one drainage pipe (4.2) correspondingly connected to one liquid outlet pipe (4.1), and each drainage pipe (4.2) is connected to a waste liquid tank (4.3).

2. The semiconductor material chemical plating equipment according to claim 1, characterized in that: The jig (1) is cylindrical in shape, with a hollow accommodating cavity inside, and the inlet and outlet of the jig (1) are respectively opened at the top and bottom of the cylindrical jig (1).

3. The semiconductor material chemical plating equipment according to claim 1, characterized in that: A positioning block is provided on the fixed bracket (2.1), an arc-shaped slot (2.2) is provided on the positioning block, and a lock buckle (2.3) corresponding to the slot is provided on the positioning block.

4. The semiconductor material chemical plating equipment according to claim 1, characterized in that: The rotating device (2.4) comprises a first driving motor (2.4.1), a first driving gear (2.4.2) and a first driven gear (2.4.3), wherein: The output end of the first driving motor (2.4.1) is connected to the first driving gear (2.4.2), the first driven gear (2.4.3) is meshed with the first driving gear (2.4.2), and the first driven gear (2.4.3) and the fixed bracket (2.1) are both sleeved on the same rotating shaft and rotate synchronously.

5. The semiconductor material chemical plating equipment according to claim 1, characterized in that: Both ports of the fixture (1) are provided with pipeline switching devices (2.5), and the pipeline switching devices (2.5) are used to switch different pipelines to be connected to the ports of the fixture (1).

6. The semiconductor material chemical plating equipment according to claim 5, characterized in that: The pipeline switching device (2.5) comprises a rotating disk (2.5.1), a connector (2.5.2), a second driving motor (2.5.3), a second driving gear (2.5.4), a second driven gear (2.5.5), a movable plate (2.5.6) and a telescopic cylinder (2.5.7), wherein: The pipe openings are fixedly mounted on the rotating disk (2.5.1); the output end of the second drive motor (2.5.3) is connected to the second driving gear (2.5.4); the second driving gear (2.5.4) is meshed with the second driven gear (2.5.5); the second driven gear (2.5.5) and the movable plate (2.5.6) are sleeved on the same rotating shaft and rotate synchronously; The connector (2.5.2) is connected to the port of the fixture (1), and the connector (2.5.2) is installed on the movable plate (2.5.6). The movable plate (2.5.6) is connected to the active end of the telescopic cylinder (2.5.7). At the same time, the telescopic cylinder (2.5.7) drives the movable plate (2.5.6) to move, so that the connector (2.5.2) on the movable plate (2.5.6) is connected to the pipe opening of the pipeline on the rotating disk (2.5.1).

7. The semiconductor material chemical plating equipment according to claim 1, characterized in that: The waste liquid tank (4.3) comprises a recyclable waste liquid tank (4.3) and a non-recyclable waste liquid tank (4.3), wherein a plurality of the recyclable waste liquid tanks (4.3) are provided, and a single non-recyclable waste liquid tank (4.3) is provided.

8. The semiconductor material chemical plating equipment according to claim 1, characterized in that: The device body further comprises a fluid replenishing assembly (5), and the fluid replenishing assembly (5) comprises a plurality of fluid replenishing pipes (5.1) respectively connected to corresponding fluid storage tanks (3.2).

9. The semiconductor material chemical plating equipment according to claim 1, characterized in that: The air intake pipe (3.3) is provided with a plurality of branch pipes, and the air intake pipe (3.3) is connected to all the liquid storage tanks (3.2) and the waste liquid tank (4.3) through all the branch pipes.

10. The semiconductor material chemical plating equipment according to claim 1, characterized in that: The liquid inlet pipe (3.1) and the liquid outlet pipe (4.1) are both provided with a control valve and a delivery pump.

Images