A method of manufacturing a thermal barrier coating

Abstract

The present application relates to the technical field of high-temperature oxidation-resistant coating of turbine blade, and particularly relates to a thermal barrier coating and a preparation method thereof, which comprises a first metal layer, a second metal layer, a first ceramic layer and a second ceramic layer arranged on the surface of a high-temperature alloy in sequence. According to the mass percentage, the first metal layer comprises 20-25% of Co, 22-24% of Cr, 13-15% of Al, 1.2-1.4% of Y, 0.3-0.5% of Hf and 0.3-0.5% of Si, and the balance is Ni; the second metal layer comprises 12-15% of Si and 6-8% of Y, and the balance is Al; the first ceramic layer is a YSZ ceramic layer, and the second ceramic layer is a La2Ce2O7 and modified material ceramic layer, which has a double-metal layer structure, realizes the regularity that the Al content decreases from the outer surface to the inside in a concentration gradient, can effectively reduce the mutual diffusion phenomenon between Al and the matrix, avoids the generation of TCP phase, thereby ensuring the sufficient Al content of the whole structure and prolonging the service life of the coating. The present application solves the problem of low service life of the thermal barrier coating in the prior art.

Description

Technical Field

[0001] This invention relates to the field of high-temperature anti-oxidation coating technology for turbine blades, specifically to a thermal barrier coating and its preparation method. Background Technology

[0002] Thermal barrier coatings (TBCs) typically consist of a metal bonding substrate with good oxidation and corrosion resistance (e.g., PtAl or MCrAlY) and a ceramic topcoat with low thermal conductivity (e.g., Y₂O₃·ZrO₂). Due to their excellent oxidation resistance, corrosion resistance, and high-temperature insulation properties, TBCs have been widely used in high-temperature hot-end components of engines and gas turbines, enabling the high-temperature alloy substrate to withstand higher service temperatures and longer service life. This provides a guarantee for further increasing the turbine inlet gas temperature, while also significantly improving engine lifespan and reliability.

[0003] Currently, the most widely used thermal barrier coating material in engines and gas turbines is Y₂O₃·ZrO₂ (YSZ), but its operating temperature limit is 1170℃. Exceeding this temperature will result in a severe phase transition, causing the thermal barrier coating to peel off under alternating hot and cold temperatures. Simultaneously, due to the excessively high operating temperature, the diffusion of Al elements in the bonding layer is further intensified, leading to a significant reduction in coating life due to Al deficiency. With the continuous increase in engine thrust-to-weight ratio and turbine inlet temperature, the operating temperature of thermal barrier coatings is also constantly rising. The industry offers thermal barrier coating ceramic materials suitable for higher operating temperatures, such as Gd₂Zr₂O₇ with a pyrochlore structure, La₂Ce₂O₇ with a fluorite structure, perovskite oxides, and hexagonal lanthanum aluminate magnetite. However, in practical applications, these materials have some inherent limitations, resulting in a relatively low thermal cycle life.

[0004] The problem of insufficient lifespan of novel ceramic coatings can be alleviated by designing and fabricating a YSZ layer between the novel ceramic layer and the binder layer to form a double ceramic layer structure. Studies have found that the coating peeling in the double ceramic layer structure is concentrated at the interface between the YSZ ceramic layer and the novel ceramic layer. This is mainly due to the difficulty in controlling the deposition process during electron beam physical vapor deposition (EBPV), and improper interface treatment leading to excessive stress in the interface structure, resulting in poor overall thermal stability and preventing the double ceramic layer from achieving the expected lifespan. Researchers have focused on adding rare earth elements to the MCrAlY binder layer to pin the Al content and thus improve the coating lifespan. However, this method cannot fundamentally solve the problem of insufficient Al content; it only prolongs the time of Al deficiency and cannot fundamentally improve the overall service life of the thermal barrier coating. Furthermore, simply increasing the Al content in the metal binder layer can cause excessive Al diffusion into the matrix, forming TCP phases and secondary reaction zones with refractory metal elements, severely affecting the mechanical properties and service life of the high-temperature alloy matrix. Summary of the Invention

[0005] To address the problem of low lifespan of thermal barrier coatings in existing technologies, this invention provides a thermal barrier coating and its preparation method.

[0006] To achieve the above objectives, the present invention employs the following technical solution:

[0007] This invention provides a thermal barrier coating, comprising a first metal layer, a second metal layer, a first ceramic layer, and a second ceramic layer sequentially disposed on the surface of a high-temperature alloy substrate;

[0008] The first metal layer comprises the following raw material components by mass percentage: 20%–25% Co, 22%–24% Cr, 13%–15% Al, 1.2%–1.4% Y, 0.3%–0.5% Hf, and 0.3%–0.5% Si, with the balance being Ni;

[0009] The second metal layer comprises the following raw material components by mass percentage: 12% to 15% Si and 6% to 8% Y, with the balance being Al;

[0010] The first ceramic layer comprises the following raw material components by mass percentage: 6% to 8% Y2O3, with the balance being ZrO2;

[0011] The second ceramic layer is a rare earth modified ceramic material.

[0012] The present invention also provides a method for preparing the thermal barrier coating as described above, comprising the following steps:

[0013] S1: A first metal layer and a second metal layer are sequentially deposited on a high-temperature alloy substrate to obtain a high-temperature alloy substrate with a bimetallic layer;

[0014] S2: Diffusion treatment is performed on the high-temperature metal substrate of the bimetallic layer to obtain a bimetallic matrix alloy;

[0015] S3: On the bimetallic substrate alloy, the first ceramic layer and the second ceramic layer are deposited sequentially to complete the preparation of the thermal barrier coating.

[0016] Furthermore, the specific method of S1 is as follows:

[0017] Surface treatment of the high-temperature alloy matrix;

[0018] A first metal layer is deposited on a surface-treated high-temperature alloy substrate;

[0019] After the first metal layer is deposited, the first metal layer and the second metal layer are deposited together on the basis of the first metal layer.

[0020] After depositing a first metal layer and a second metal layer together, the deposition of the second metal layer continues until the thickness ratio of the first metal layer to the second metal layer is 1:1. The deposition of the second metal layer is then stopped, resulting in a high-temperature alloy substrate with a bimetallic layer.

[0021] Preferably, the time for co-depositing the first metal layer and the second metal layer is 10 min to 20 min.

[0022] Preferably, the first metal layer is deposited by multi-arc electronic plating, and the deposition conditions are as follows: vacuum pressure: 0.1Pa~0.5Pa, preheating temperature: 300℃~350℃, main voltage: 100V~110V, duty cycle: 80%~90%, and arc current: 150A~200A.

[0023] Preferably, the first and second metal layers are deposited together using multi-arc electroplating, and the second metal layer is deposited using multi-arc electroplating. The deposition conditions are as follows: vacuum pressure: 0.1 Pa to 0.5 Pa, preheating temperature: 300°C to 350°C, main voltage: 80 V to 100 V, duty cycle: 80% to 90%, and arc current: 50 A to 100 A.

[0024] Furthermore, the specific method of S2 is as follows:

[0025] The high-temperature alloy substrate of the bimetallic layer is heated to 1030℃~1080℃, then cooled to 900℃~920℃, and finally cooled to room temperature to obtain the bimetallic matrix alloy.

[0026] Preferably, the heating rate is 6℃ / min to 10℃ / min, and the holding time after heating is 30min to 40min.

[0027] Preferably, the cooling rate is 100℃ / min to 150℃ / min, and the holding time after cooling is 90min to 120min.

[0028] Furthermore, the specific method of S3 is as follows:

[0029] The first ceramic layer was deposited on the bimetallic substrate alloy using electron beam physical vapor deposition.

[0030] After the first ceramic layer is deposited, a second ceramic layer is deposited on top of the first ceramic layer; the time for the co-deposition of the first and second ceramic layers is 4 to 6 minutes.

[0031] After co-depositing the first and second ceramic layers, the second ceramic layer is deposited until the thickness ratio of the first ceramic layer to the second ceramic layer is 1:1, thus completing the preparation of the thermal barrier coating.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The present invention provides a thermal barrier coating, comprising a first metal layer, a second metal layer, a first ceramic layer, and a second ceramic layer sequentially disposed on the surface of a high-temperature alloy.

[0034] The first metal layer comprises the following raw material components by mass percentage: 20%–25% Co, 22%–24% Cr, 13%–15% Al, 1.2%–1.4% Y, 0.3%–0.5% Hf, and 0.3%–0.5% Si, with the balance being Ni;

[0035] The second metal layer comprises the following raw material components by mass percentage: 12% to 15% Si and 6% to 8% Y, with the balance being Al;

[0036] The first ceramic layer comprises the following raw material components by mass percentage: 6% to 8% Y2O3, with the balance being ZrO2;

[0037] The material of the second ceramic layer is a rare earth modified ceramic material.

[0038] By employing a bimetallic layer structure, the Al content decreases gradually from the outer surface to the interior. The key feature of this structure is that the Al content is lower on the substrate side, which can effectively reduce the interdiffusion phenomenon between Al and the substrate, avoid the formation of TCP phase, and thus ensure sufficient Al content throughout the structure, extending the coating life.

[0039] This invention also provides a method for preparing a thermal barrier coating as described above. This method involves sequentially depositing a first metal layer and a second metal layer onto a high-temperature alloy substrate to obtain a bimetallic high-temperature alloy substrate, thus achieving the preparation of a bimetallic coating structure for the thermal barrier coating. This ensures sufficient Al content in the metal layers and extends the coating's lifespan. Then, the high-temperature metal substrate of the bimetallic layer undergoes a diffusion treatment to obtain a bimetallic substrate alloy, which enables effective diffusion of Al elements in the bimetallic layer and forms a concentration gradient, effectively ensuring the bonding force within the metal layer and between the metal layer and the high-temperature alloy substrate. Finally, a first ceramic layer and a second ceramic layer are sequentially deposited on the bimetallic substrate alloy to complete the preparation of the thermal barrier coating. The prepared thermal barrier layer has a longer service life and better thermal stability. The preparation method is simple and highly stable.

[0040] The process involves surface treatment of a high-temperature alloy substrate; deposition of a first metal layer on the surface-treated substrate; deposition of a second metal layer on top of the first metal layer; deposition of the second metal layer after the first and second metal layers are completed; and deposition of the second metal layer continuing until the thickness ratio of the first to second metal layers is 1:1. The deposition of the second metal layer is then stopped, resulting in a high-temperature alloy substrate with a bimetallic layer. This process allows for multi-arc ion plating of bimetallic layers without removing the first metal layer from the furnace. The second metal layer can be prepared by controlling the opening and closing of the arc target, ensuring good process continuity, achieving interface-free co-deposition of the bimetallic layer, and offering a simple, easy-to-control, and highly efficient process suitable for engineering applications. Furthermore, it provides process design ideas and methods for preparing other types of bimetallic layers.

[0041] The bimetallic high-temperature alloy substrate was heated to 1025℃~1035℃, then cooled to 850℃~900℃, and finally cooled to room temperature to obtain the bimetallic matrix alloy. This gradient heating and holding method better facilitates the effective diffusion of Al elements in the bimetallic layer and forms a concentration gradient, effectively ensuring the bonding strength between the metal layer and the high-temperature alloy substrate.

[0042] A first ceramic layer is deposited on a bimetallic substrate alloy using electron beam physical vapor deposition (EBPV). After the first ceramic layer is deposited, a second ceramic layer is deposited on top of it. The co-deposition time for the first and second ceramic layers is 2–4 minutes. After the co-deposition of the first and second ceramic layers, the second ceramic layer is deposited until the thickness ratio of the first to the second ceramic layers is 1:1, thus completing the preparation of the thermal barrier coating. This method eliminates the need to remove the first ceramic layer from the furnace after preparation. By controlling parameters such as the lateral feed position, heating gun current, and evaporation gun current during the preparation of the first and second ceramic layers, continuous deposition of the two ceramic layers is achieved. The composition at the interface changes continuously, realizing interface-free co-deposition of the two ceramic layers. The process control is simple, and the stability is high, providing a technical basis for the application of EBPV in the preparation of bimetallic materials. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of the structure of a thermal barrier coating according to the present invention.

[0044] Figure 2 This is a flowchart of a method for preparing a thermal barrier coating according to the present invention.

[0045] Figure 3 This is a flowchart of a method for preparing a bimetallic layer of a thermal barrier coating according to the present invention.

[0046] Figure 4 This is a diagram showing the target installation structure for preparing a bimetallic layer in an embodiment of the present invention, using a method for preparing a thermal barrier coating.

[0047] Figure 5 This is a flowchart of a method for preparing a double ceramic layer of thermal barrier coating according to the present invention.

[0048] Figure 6 This is a diagram showing the installation structure of a double ceramic layer target in a method for preparing a thermal barrier coating according to an embodiment of the present invention.

[0049] Figure 7 This is a structural diagram of the bimetallic and biceramic layers of the thermal barrier coating prepared in Example 1 of the present invention.

[0050] Figure 8 The image shows the microstructure of the bimetallic and biceramic layers of the thermal barrier coating prepared in Example 2 of this invention.

[0051] Figure 9 The image shows the microstructure of the bimetallic and biceramic layers of the thermal barrier coating prepared in Example 3 of this invention.

[0052] Wherein, 1-first metal layer, 2-second metal layer, 3-first ceramic layer, 4-second ceramic layer, 5-first target material, 6-second target material, 7-high temperature alloy substrate, 8-bimetallic layer substrate alloy, 9-third target material, 10-fourth target material, 11-first evaporation gun, 12-first heating gun, 13-second evaporation gun, 14-second heating gun. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0055] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0056] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0057] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0058] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0059] The present invention will be further described in detail below with reference to specific embodiments. These descriptions are for explanation purposes only and are not intended to limit the scope of the invention.

[0060] This invention discloses a thermal barrier coating, with reference to Figure 1 The substrate includes a first metal layer 1, a second metal layer 2, a first ceramic layer 3, and a second ceramic layer 4 sequentially disposed on the surface of the high-temperature alloy substrate 7; the thickness ratio of the first metal layer 1 to the second metal layer 2 is 1:1, and the thickness ratio of the first ceramic layer 3 to the second ceramic layer 4 is 1:1.

[0061] The first metal layer 1 comprises the following raw material components by mass percentage: 20%–25% Co, 22%–24% Cr, 13%–15% Al, 1.2%–1.4% Y, 0.3%–0.5% Hf, and 0.3%–0.5% Si, with the balance being Ni;

[0062] The second metal layer 2 comprises the following raw material components by mass percentage: 12% to 15% Si and 6% to 8% Y, with the balance being Al;

[0063] The first ceramic layer 3 comprises the following raw material components by mass percentage: 6% to 8% Y2O3, with the balance being ZrO2;

[0064] The second ceramic layer is a rare earth modified material, preferably comprising the following raw material components by mass percentage: 50% to 55% La2O3 and 45% to 50% CeO2.

[0065] See Figure 2 The present invention also provides a method for preparing the thermal barrier coating as described above, comprising the following steps:

[0066] S1: On the high-temperature alloy substrate 7, a first metal layer 1 and a second metal layer 2 are sequentially deposited to obtain a bimetallic high-temperature alloy substrate. See [link / reference]. Figure 3 and Figure 4 The specific method is as follows:

[0067] S1.1: Surface treatment of high-temperature alloy substrate 7: Polish the surface of high-temperature alloy substrate 7, and control the surface roughness to 0.8-1.6μm after polishing. Remove the surface oxide layer and clean the polished high-temperature alloy substrate 7 with acetone or alcohol as a cleaning agent to clean the surface of high-temperature alloy substrate 7.

[0068] S1.2: On the surface-treated high-temperature alloy substrate 7, a first metal layer 1 is deposited: the first metal layer 1 is deposited using a multi-arc ion plating process. A first target 5 is prepared according to the above-mentioned mass percentage, and the first target 5 serves as the target for the first metal layer 1. A second target 6 is prepared according to the above-mentioned mass percentage, and the second target 6 serves as the target for the second metal layer 2. The first target 5 and the second target 6 are alternately mounted on the arc targets of the multi-arc ion plating equipment to improve the uniformity of the first metal layer 1 and the second metal layer 2. Then, the second target 6 is shielded to prevent the first metal layer 1 from being deposited on the second target 6. The first target 5 is turned on, and the first metal layer 1 is deposited on the surface-treated high-temperature alloy substrate 7. After reaching the target thickness, the deposition of the first metal layer 1 is completed. The deposition conditions are: vacuum pressure: 0.1 Pa to 0.5 Pa, preheating temperature: 300°C to 350°C, main voltage: 100 V to 110 V, duty cycle: 80% to 90%, and arc current: 150 A to 200 A.

[0069] S1.3: After the first metal layer 1 is deposited, the first metal layer 1 and the second metal layer 2 are deposited together on the basis of the first metal layer 1. After the first metal layer 1 coating is deposited, the second target 6 is turned on for deposition while the first target 5 continues to deposit, so that the first metal layer 1 and the second metal layer 2 are deposited together for 10 min to 20 min. The deposition conditions are: vacuum pressure: 0.1 Pa to 0.5 Pa, preheating temperature: 300 ℃ to 350 ℃, main voltage: 80 V to 100 V, duty cycle: 80% to 90%, arc current: 50 A to 100 A.

[0070] S1.4: After co-depositing the first metal layer 1 and the second metal layer 2, continue depositing the second metal layer 2 until the thickness ratio of the first metal layer 1 to the second metal layer 2 is 1:1. Then stop depositing the second metal layer 2 to obtain a bimetallic high-temperature alloy substrate. After co-depositing the first metal layer 1 and the second metal layer 2, turn off the first target 5 and physically shield it. Continue depositing the second metal layer 2 until the thickness ratio of the first metal layer 1 to the second metal layer 2 is 1:1 to obtain a bimetallic high-temperature alloy substrate. Deposition conditions are: vacuum pressure: 0.1 Pa~0.5 Pa, preheating temperature: 300℃~350℃, main voltage: 80V~100V, duty cycle: 80%~90%, arc current: 50A~100A.

[0071] S2: The high-temperature metal substrate of the bimetallic layer is subjected to diffusion treatment to obtain a bimetallic matrix alloy. Specifically, the high-temperature alloy substrate of the bimetallic layer is placed in a vacuum heat treatment furnace. In order to better achieve the effective diffusion of Al elements in the bimetallic layer and form a concentration gradient, a gradient heating and holding method is used for heat treatment. The process control is as follows: the temperature is raised to 1030℃~1080℃ at a heating rate of 6℃ / min~10℃ / min and held for 30min~40min. This process achieves rapid diffusion of the interface and internal structure, effectively ensuring the bonding force between the metal layer and the substrate. Then, the temperature is rapidly reduced to 900℃~920℃ at a cooling rate of 100℃ / min~150℃ / min and held for 90min~120min. This process achieves further homogenization of the internal structure of the coating. Finally, the argon fan is turned on to cool to room temperature, completing the diffusion treatment of the high-temperature metal substrate of the bimetallic layer, and obtaining the bimetallic matrix alloy 8.

[0072] S3: On the bimetallic substrate alloy 8, the first ceramic layer 3 and the second ceramic layer 4 are deposited sequentially to complete the preparation of the thermal barrier coating. See [link to documentation]. Figure 5 and Figure 6 The specific method is as follows:

[0073] S3.1: A first ceramic layer 3 is deposited on the bimetallic substrate alloy 8 using electron beam physical vapor deposition (EBPD). A third target 9 and a fourth target 10 are prepared according to the above-mentioned mass percentages. The third target 9 serves as the target for the first ceramic layer 3, and the fourth target 10 serves as the target for the second ceramic layer 4. The self-loading chamber containing the bimetallic substrate alloy 8 is moved above the third target 9, and the first ceramic layer 3 is deposited on the bimetallic substrate alloy 8 using EBPD. The current of the first heating gun 12 is 0.20A to 0.25A, the current of the first evaporation gun 11 is 1.4A to 1.6A, and the vacuum control range is ×10. -4 Torr, reaching the target thickness, completes the deposition of the first ceramic layer 3.

[0074] S3.2: After the first ceramic layer 3 is deposited, the first ceramic layer 3 and the second ceramic layer 4 are deposited together on the basis of the first ceramic layer 3; wherein the time for the co-deposition of the first ceramic layer 3 and the second ceramic layer is 2 min to 4 min; after the first ceramic layer 3 is deposited, the current of the first evaporation gun 11 and the first heating gun 12 is kept constant, and at the same time, the second evaporation gun 13 and the second heating gun 14 corresponding to the fourth target material 10 are turned on. The current of the second heating gun 14 is 0.20A to 0.25A, and the current of the second evaporation gun 13 is 1.3A to 1.5A, with the vacuum control range ×10. -4Torr moves the bimetallic substrate alloy 8 coated with the first ceramic layer 3 above the fourth target 10, and begins to deposit the first ceramic layer 3 and the second ceramic layer 4 together on the basis of the first ceramic layer 3, with a deposition time of 4 min to 6 min.

[0075] S3.3: After co-depositing the first ceramic layer 3 and the second ceramic layer 4, deposit the second ceramic layer 4 until the thickness ratio of the first ceramic layer 3 to the second ceramic layer 4 is 1:1, thus completing the preparation of the thermal barrier coating: After co-depositing the first ceramic layer 3 and the second ceramic layer 4, turn off the first heating gun 12 and the first evaporation gun 11 corresponding to the third target 9, and continue to deposit the fourth target 10 so that the thickness ratio of the second ceramic layer 4 to the third ceramic layer 3 is 1:1, thus completing the preparation of the thermal barrier coating.

[0076] Example 1

[0077] The surface of the high-temperature alloy substrate 7 was subjected to abrasive belt polishing. After polishing, the surface roughness was controlled to be 0.8μm to remove the surface oxide layer. Acetone or alcohol was used as a cleaning agent to clean the polished high-temperature alloy substrate 7 and clean the substrate surface.

[0078] The first target material 5 is prepared by mixing 20% ​​Co, 23% Cr, 14% Al, 1.4% Y, 0.5% Hf and 0.3% Si, with the balance being Ni, by mass percentage; the second target material 6 is prepared by mixing 12% Si and 8% Y, with the balance being Al, by mass percentage.

[0079] The first target 5 and the second target 6 are alternately installed on the arc target of the multi-arc ion plating equipment. The total number of targets in the furnace of the multi-arc ion plating equipment is controlled to be 8. The two types of targets are arranged crosswise on the multi-arc ion plating equipment to achieve uniform composition of the coating atmosphere in the furnace.

[0080] The first metal layer 1 of the bimetallic layer was prepared using a multi-arc ion plating process. During the preparation process, the second target 6 was physically shielded. The process parameters were: vacuum pressure: 0.1 Pa, preheating temperature: 300℃, main voltage: 100V, duty cycle: 80%, arc current: 150A. After the first metal layer 1 was coated, the second target 6 was turned on while the first target 5 continued to deposit. The deposition parameters were: vacuum pressure: 0.1 Pa, preheating temperature: 300℃, main voltage: 80V, duty cycle: 80%, arc current: 50A. After co-deposition for 10 minutes, the first target 5 was turned off and physically shielded. The second metal layer 2 was then coated according to the set process parameters, controlling the thickness ratio of the first metal layer 1 and the second metal layer 2 to be 1:1. After coating, the equipment was turned off, and the high-temperature alloy substrate of the bimetallic layer was removed.

[0081] The high-temperature alloy substrate of the bimetallic layer was placed in a vacuum heat treatment furnace, and the temperature was raised to 1030℃ at a heating rate of 6℃ / min and held for 30min. Then, the temperature was rapidly lowered to 900℃ at a cooling rate of 100℃ / min and held for 90min. Finally, the argon fan was turned on to cool it to room temperature, thus completing the vacuum diffusion treatment of the bimetallic layer and obtaining the bimetallic matrix alloy 8.

[0082] The third target material 9 is prepared by using 6% Y2O3 and the balance ZrO2.

[0083] The fourth target material 10 was prepared by mixing 55% La2O3 and 45% CeO2 by mass percentage.

[0084] The third target 9 and the fourth target 10 are placed in two crucibles of the electron beam physical vapor deposition (EBPD) apparatus, respectively. The self-loading chamber containing the bimetallic substrate alloy 8 is moved directly above the third target 9. The first ceramic layer 3 is prepared using EBPD, with the current of the first heating gun 12 at 0.20 A, the current of the first evaporation gun 11 at 1.4 A, and the vacuum control range at 1 × 10⁻⁶. -4 Torr, after reaching the target thickness, completes the preparation of the first ceramic layer 3.

[0085] After the first ceramic layer 3 is prepared, the currents of the first evaporation gun 11 and the first heating gun 12 are kept constant. Simultaneously, the second heating gun 14 and the second evaporation gun 13 corresponding to the fourth target 10 are turned on, with the current of the second heating gun 14 being 0.20A and the current of the second evaporation gun 13 being 1.3A. Then, the bimetallic substrate alloy 8 coated with the first ceramic layer 3 is moved laterally above the fourth target 10 to begin the co-deposition of the bimetallic layer. The co-deposition time is controlled at 4 minutes. Then, the currents of the first heating gun 12 and the first evaporation gun 11 corresponding to the third target 9 are turned off, and the vacuum level is controlled within the range of 1×10⁻⁶. -4 Torr continues to evaporate and deposit the fourth target 10, making the thickness ratio of the first ceramic layer 3 and the second ceramic layer 4 1:1. The current of the second heating gun 14 and the second evaporation gun 13 is turned off to complete the deposition of the double ceramic layer and complete the preparation of the thermal barrier coating.

[0086] See Figure 7 To verify the difference in microstructure between the thermal barrier coating of the present invention and the existing single metal layer and single ceramic layer, cross-sectional microstructure analysis was performed on the bimetallic and double ceramic layer thermal barrier coating to obtain metallographic microstructure images.

[0087] Example 2

[0088] The surface of the high-temperature alloy substrate 7 was subjected to abrasive belt polishing. After polishing, the surface roughness was controlled to 1μm to remove the surface oxide layer. Acetone or alcohol was used as a cleaning agent to clean the polished high-temperature alloy substrate 7 and clean the substrate surface.

[0089] The first target material 5 is prepared by mass percentage of 25% Co, 22% Cr, 15% Al, 1.2% Y, 0.4% Hf and 0.4% Si, with the balance being Ni; the second target material 6 is prepared by mass percentage of 15% Si and 7% Y, with the balance being Al.

[0090] The first target 5 and the second target 6 are alternately installed on the arc target of the multi-arc ion plating equipment. The total number of targets in the furnace of the multi-arc ion plating equipment is controlled to be 10. The two types of targets are arranged crosswise on the multi-arc ion plating equipment to achieve uniform composition of the coating atmosphere in the furnace.

[0091] The first metal layer 1 of the bimetallic layer was prepared using a multi-arc ion plating process. During the preparation process, the second target 6 was physically shielded. The process parameters were: vacuum pressure: 0.3 Pa, preheating temperature: 320℃, main voltage: 105V, duty cycle: 85%, and arc current: 180A. After the first metal layer 1 was coated, the second target 6 was turned on while the first target 5 continued to deposit. The deposition parameters were: vacuum pressure: 0.3 Pa, preheating temperature: 320℃, main voltage: 90V, duty cycle: 85%, and arc current: 80A. After co-deposition for 15 minutes, the first target 5 was turned off and physically shielded. The second metal layer 2 was then coated according to the set process parameters, controlling the thickness ratio of the first metal layer 1 and the second metal layer 2 to be 1:1. After coating, the equipment was turned off, and the high-temperature alloy substrate of the bimetallic layer was removed.

[0092] The high-temperature alloy substrate of the bimetallic layer was placed in a vacuum heat treatment furnace, and the temperature was raised to 1050℃ at a heating rate of 8℃ / min and held for 35min. Then, the temperature was rapidly reduced to 910℃ at a cooling rate of 130℃ / min and held for 100min. Finally, the argon fan was turned on to cool it to room temperature, thus completing the vacuum diffusion treatment of the bimetallic layer and obtaining the bimetallic matrix alloy 8.

[0093] The third target material 9 is prepared by using 7% Y2O3 and the balance ZrO2.

[0094] The fourth target material 10 was prepared by mixing 50% La2O3 and 50% CeO2 by mass percentage.

[0095] The third target 9 and the fourth target 10 are placed in two crucibles of the electron beam physical vapor deposition (EBPD) apparatus, respectively. The self-loading chamber containing the bimetallic substrate alloy 8 is moved directly above the third target 9. The first ceramic layer 3 is prepared using EBPD, with the current of the first heating gun 12 at 0.22 A, the current of the first evaporation gun 11 at 1.5 A, and the vacuum control range at 2 × 10⁻⁶. -4 Torr, after reaching the target thickness, completes the preparation of the first ceramic layer 3.

[0096] After the first ceramic layer 3 is prepared, the currents of the first evaporation gun 11 and the first heating gun 12 are kept constant. Simultaneously, the second heating gun 14 and the second evaporation gun 13 corresponding to the fourth target 10 are turned on, with the current of the second heating gun 14 being 0.22A and the current of the second evaporation gun 13 being 1.4A. Then, the bimetallic substrate alloy 8 coated with the first ceramic layer 3 is moved laterally above the fourth target 10 to begin the co-deposition of the bimetallic layer. The co-deposition time is controlled at 5 minutes. Then, the currents of the first heating gun 12 and the first evaporation gun 11 corresponding to the third target 9 are turned off, and the vacuum degree is controlled within a range of 2×10⁻⁶. -4 Torr continues to evaporate and deposit the fourth target 10, making the thickness ratio of the first ceramic layer 3 and the second ceramic layer 4 1:1. The current of the second heating gun 14 and the second evaporation gun 13 is turned off to complete the deposition of the double ceramic layer and complete the preparation of the thermal barrier coating.

[0097] See Figure 8 To verify the difference in microstructure between the thermal barrier coating of the present invention and the existing single metal layer and single ceramic layer, cross-sectional microstructure analysis was performed on the bimetallic and double ceramic layer thermal barrier coating to obtain metallographic microstructure images.

[0098] Example 3

[0099] The surface of the high-temperature alloy substrate 7 was subjected to abrasive belt polishing. After polishing, the surface roughness was controlled to 1.6μm to remove the surface oxide layer. Acetone or alcohol was used as a cleaning agent to clean the polished high-temperature alloy substrate 7 and clean the substrate surface.

[0100] The first target material 5 is prepared by mass percentage of 23% Co, 24% Cr, 13% Al, 1.3% Y, 0.3% Hf and 0.5% Si, with the balance being Ni; the second target material 6 is prepared by mass percentage of 13% Si and 6% Y, with the balance being Al.

[0101] The first target material 5 and the second target material 6 are alternately installed on the arc target of the multi-arc ion plating equipment. The total number of targets in the furnace of the multi-arc ion plating equipment is controlled to be 12. The two types of targets are arranged crosswise on the multi-arc ion plating equipment to achieve uniform composition of the coating atmosphere in the furnace.

[0102] The first metal layer 1 of the bimetallic layer was prepared using a multi-arc ion plating process. During the preparation process, the second target 6 was physically shielded. The process parameters were: vacuum pressure: 0.5 Pa, preheating temperature: 350℃, main voltage: 110V, duty cycle: 90%, arc current: 200A. After the first metal layer 1 was coated, the second target 6 was turned on while the first target 5 continued to deposit. The deposition parameters were: vacuum pressure: 0.5 Pa, preheating temperature: 350℃, main voltage: 100V, duty cycle: 90%, arc current: 100A. After co-deposition for 20 minutes, the first target 5 was turned off and physically shielded. The second metal layer 2 was then coated according to the set process parameters, controlling the thickness ratio of the first metal layer 1 and the second metal layer 2 to be 1:1. After coating, the equipment was turned off, and the high-temperature alloy substrate of the bimetallic layer was removed.

[0103] The high-temperature alloy substrate of the bimetallic layer was placed in a vacuum heat treatment furnace, and the temperature was raised to 1080℃ at a heating rate of 10℃ / min and held for 40min. Then, the temperature was rapidly lowered to 920℃ at a cooling rate of 150℃ / min and held for 120min. Finally, the argon fan was turned on to cool it to room temperature, thus completing the vacuum diffusion treatment of the bimetallic layer and obtaining the bimetallic layer substrate alloy 8.

[0104] The third target material 9 is prepared by using 8% Y2O3 and the balance ZrO2.

[0105] The fourth target material 10 was prepared by using 52% La2O3 and 48% CeO2 by mass percentage.

[0106] The third target 9 and the fourth target 10 are placed in two crucibles of the electron beam physical vapor deposition (EBPD) apparatus, respectively. The self-loading chamber containing the bimetallic substrate alloy 8 is moved directly above the third target 9. The first ceramic layer 3 is prepared using EBPD, with the current of the first heating gun 12 at 0.25 A, the current of the first evaporation gun 11 at 1.6 A, and the vacuum control range at 3 × 10⁻⁶. -4 Torr, after reaching the target thickness, completes the preparation of the first ceramic layer 3.

[0107] After the first ceramic layer 3 is prepared, the currents of the first evaporation gun 11 and the first heating gun 12 are kept constant. Simultaneously, the second heating gun 14 and the second evaporation gun 13 corresponding to the fourth target 10 are turned on, with the current of the second heating gun 14 being 0.25A and the current of the second evaporation gun 13 being 1.5A. Then, the bimetallic substrate alloy 8 coated with the first ceramic layer 3 is moved laterally above the fourth target 10 to begin the co-deposition of the bimetallic layer. The co-deposition time is controlled at 6 minutes. Then, the currents of the first heating gun 12 and the first evaporation gun 11 corresponding to the third target 9 are turned off, and the vacuum level is controlled within the range of 3 × 10⁻⁶. -4 Torr continues to evaporate and deposit the fourth target 10, making the thickness ratio of the first ceramic layer 3 and the second ceramic layer 4 1:1. The current of the second heating gun 14 and the second evaporation gun 13 is turned off to complete the deposition of the double ceramic layer and complete the preparation of the thermal barrier coating.

[0108] See Figure 9 To verify the difference in microstructure between the thermal barrier coating of the present invention and the existing single metal layer and single ceramic layer, cross-sectional microstructure analysis was performed on the bimetallic and double ceramic layer thermal barrier coating to obtain metallographic microstructure images.

Claims

1. A method of producing a thermal barrier coating, characterized by, The thermal barrier coating comprises a first metal layer (1), a second metal layer (2), a first ceramic layer (3) and a second ceramic layer (4) arranged on the surface of the high-temperature alloy substrate (7) in sequence. The first metal layer (1) comprises the following raw material components in percentage by mass: 20-25% of Co, 22-24% of Cr, 13-15% of Al, 1.2-1.4% of Y, 0.3-0.5% of Hf and 0.3-0.5% of Si, and the balance of Ni. The second metal layer (2) comprises the following raw material components in percentage by mass: 12-15% of Si and 6-8% of Y, and the balance of Al. The first ceramic layer (3) comprises the following raw material components in percentage by mass: 6-8% of Y2O3, and the balance of ZrO2. The second ceramic layer (4) is a rare earth modified ceramic material. The preparation method comprises the following steps: S1: on the high-temperature alloy substrate (7), a first metal layer (1) and a second metal layer (2) are sequentially plated to obtain a high-temperature alloy substrate with double metal layers, specifically as follows: the high-temperature alloy substrate (7) is subjected to surface treatment; the first metal layer (1) is deposited on the high-temperature alloy substrate (7) after surface treatment; after the deposition of the first metal layer (1) is completed, the first metal layer (1) and the second metal layer (2) are jointly deposited on the basis of the first metal layer (1); after the joint deposition of the first metal layer (1) and the second metal layer (2) is completed, the second metal layer (2) is continuously deposited until the thickness ratio of the first metal layer (1) to the second metal layer (2) is 1:1, the deposition of the second metal layer (2) is stopped, and the high-temperature alloy substrate with double metal layers is obtained; S2: the high-temperature metal substrate with double metal layers is subjected to diffusion treatment to obtain a double metal layer substrate alloy (8), specifically as follows: the high-temperature alloy substrate with double metal layers is heated to 1030-1080℃, then cooled to 900-920℃, and finally cooled to room temperature to obtain the double metal layer substrate alloy (8); S3: on the double metal layer substrate alloy, a first ceramic layer (3) and a second ceramic layer (4) are sequentially deposited to complete the preparation of the thermal barrier coating, specifically as follows: the first ceramic layer (3) is deposited on the double metal layer substrate alloy (8) by electron beam physical vapor deposition; after the deposition of the first ceramic layer (3) is completed, the first ceramic layer (3) and the second ceramic layer (4) are jointly deposited on the basis of the first ceramic layer (3); the joint deposition time of the first ceramic layer (3) and the second ceramic layer (4) is 4-6 min; after the joint deposition of the first ceramic layer (3) and the second ceramic layer (4) is completed, the second ceramic layer (4) is deposited until the thickness ratio of the first ceramic layer (3) to the second ceramic layer (4) is 1:1, and the preparation of the thermal barrier coating is completed.

2. The method of producing a thermal barrier coating according to claim 1, characterized in that The joint deposition time of the first metal layer (1) and the second metal layer (2) is 10-20 min.

3. The method of claim 1, wherein the thermal barrier coating is formed by a process comprising: The first metal layer (1) is deposited by multi-arc ion plating, and the deposition conditions are as follows: vacuum pressure: 0.1 Pa-0.5 Pa, preheating temperature: 300-350 DEG C, main voltage: 100-110 V, duty cycle: 80-90%, arc current: 150-200 A.

4. The method of claim 1, wherein the thermal barrier coating is formed by a process comprising: The first metal layer (1) and the second metal layer (2) are deposited by multi-arc ion plating, and the second metal layer (2) is deposited by multi-arc ion plating, and the deposition conditions are as follows: vacuum pressure: 0.1 Pa-0.5 Pa, preheating temperature: 300-350 DEG C, main voltage: 80-100 V, duty cycle: 80-90%, arc current: 50-100 A.

5. The method of claim 1, wherein the thermal barrier coating is formed by a process comprising: The heating rate of the heating temperature rise is 6-10 DEG C / min, and after the temperature rise, the holding time is 30-40 min.

6. The method of producing a thermal barrier coating according to claim 1, characterized in that The cooling rate is 100-150 DEG C / min, and the holding time after cooling is 90-120 min.

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