Insulated cover and process chamber

Abstract

This invention provides a heat-insulating cover plate and a process chamber. The heat-insulating cover plate includes a cover plate body, a heat-insulating ring, a heat-insulating block, and at least one gas pipe. The cover plate body is disposed on a first side wall of the process chamber. An opening for accommodating a spray head is provided in the central region of the cover plate body. The heat-insulating ring is disposed at the opening of the cover plate body to support the spray head. A heater is provided on the spray head. The heat-insulating block is disposed above the heater to prevent heat emitted by the heater from being transferred upwards. At least one cooling space is provided between the heat-insulating block and the heater. The at least one gas pipe extends into the cooling space to supply cooling air to it. By providing a heat-insulating structure, this invention can insulate the cover plate under high-temperature conditions, preventing damage to components, the generation of impurity particles affecting film formation, and avoiding burns to technicians.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device processing, and more particularly to a heat insulation cover and a process chamber. Background Technology

[0002] In thin film deposition equipment, when the process chamber requires high-temperature conditions, the cover plate in the internal structure needs to be heated to a high temperature. However, excessively high temperatures can damage the surface of internal components, thus shortening the equipment's lifespan. Simultaneously, high temperatures can cause impurity particles to deposit, affecting the film quality on the wafer. Furthermore, under high-temperature conditions, technicians must wait a considerable amount of time for the equipment to cool down during operation, and there is a risk of serious problems such as burns.

[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved heat insulation cover plate for heat insulation of the cover plate under high temperature conditions, so as to prevent damage to components, generation of impurity particles that affect the film formation effect, and avoid burns to technicians. Summary of the Invention

[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a heat-insulating cover plate and a process chamber, which can be used to insulate the cover plate under high temperature conditions by setting a heat-insulating structure, so as to prevent damage to components, generation of impurity particles that affect the film formation effect, and avoid burns to technicians.

[0006] Specifically, the heat-insulating cover plate provided according to the first aspect of the present invention includes a cover plate body, a heat-insulating ring, a heat-insulating block, and at least one gas pipe. The cover plate body is disposed on a first side wall of a process chamber. An opening for accommodating a spray head is provided in the central region of the cover plate body. The heat-insulating ring is disposed at the opening of the cover plate body to support the spray head. A heater is provided on the spray head. The heat-insulating block is disposed on the heater to prevent heat emitted by the heater from being transferred upward. At least one cooling space is provided between the heat-insulating block and the heater. The at least one gas pipe extends into the cooling space to supply cooling air thereto.

[0007] Furthermore, in some embodiments of the present invention, a spray head is also included. The spray head includes a spray cover and a spray plate. The spray plate is provided with a plurality of air passage holes to uniformly spray the working gas input from above into the process chamber below. The spray cover is located above the spray plate and is provided with the heater. The spray cover and the spray plate are respectively installed in the opening of the cover plate body via a plurality of support structures of the heat insulation ring.

[0008] Furthermore, in some embodiments of the present invention, the spray cover has an upwardly extending second sidewall for mounting to the top of the heat insulation ring via a first protrusion located at the edge of the second sidewall, and forming a receiving cavity for accommodating the heat insulation block via the second sidewall.

[0009] Furthermore, in some embodiments of the invention, a heater is also included. The heater includes at least one mica heating element disposed on the bottom surface of the inner side of the receiving cavity and / or at least one stepped surface of the inner edge of the receiving cavity to heat the spray cover.

[0010] Furthermore, in some embodiments of the present invention, the diameter of the heat insulation block is smaller than the inner diameter of the receiving cavity, a first cooling space is formed between the heat insulation block and the second sidewall, and first cooling air is introduced through a first gas pipe to prevent the heat emitted by the heater from being transferred outward to the heat insulation ring.

[0011] Furthermore, in some embodiments of the present invention, a heat insulation pad is also included. The heat insulation pad is disposed between the heater and the heat insulation block to form a second cooling space between the heater and the heat insulation block, and a second cooling air is introduced through a second gas pipe to prevent the heat emitted by the heater from being transferred upward to the heat insulation block.

[0012] Furthermore, in some embodiments of the present invention, a heat insulation plate is also included. A first end of the heat insulation plate is fixed to the heat insulation block to prevent heat from the heat insulation block from being transferred upwards. A second protrusion is provided at a second end of the heat insulation plate. The second protrusion is installed at the top of the second sidewall of the spray cover to lift the heat insulation block, thereby forming a second cooling space between the heater and the heat insulation block, and allowing second cooling air to be introduced via a second gas pipe to prevent heat emitted by the heater from being transferred upwards to the heat insulation block.

[0013] Furthermore, in some embodiments of the present invention, a heat-insulating pressure plate is also included. The first end of the heat-insulating pressure plate is fixedly connected to the cover plate body, while its second end is provided with a third protrusion. The third protrusion is installed at the top end of the second sidewall of the spray cover to fix the spray cover to the cover plate body.

[0014] Furthermore, in some embodiments of the present invention, the heat insulation ring is a quartz ring. The heat insulation block, the heat insulation plate, and the heat insulation pressure plate are made of PI material.

[0015] Furthermore, in some embodiments of the present invention, a ceramic ring is also included. The spray cover is mounted on the spray plate via the ceramic ring, and a mixing chamber for the working gas is formed on the spray plate.

[0016] Furthermore, the process chamber provided according to the second aspect of the present invention includes a chamber body and a heat insulation cover provided according to the first aspect of the present invention. Attached Figure Description

[0017] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0018] Figure 1 A front view structural schematic diagram of a heat-insulating cover plate provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A side view of the structure of a heat-insulating cover provided according to some embodiments of the present invention is shown.

[0020] Figure 3 A three-dimensional structural schematic diagram of a heat-insulating cover plate provided according to some embodiments of the present invention is shown.

[0021] Figure 4 A schematic diagram of the structure of a heat insulation pad provided according to some embodiments of the present invention is shown.

[0022] Figure 5 A schematic diagram of the structure of a heater provided according to some embodiments of the present invention is shown.

[0023] Figure label:

[0024] 101 Cover plate body

[0025] 102 Thermal Insulation Ring

[0026] 103 Insulation Block

[0027] 104 Heater

[0028] 1051 Sprayer Cover

[0029] 1052 Sprayer Plate

[0030] 106 Insulation Pad

[0031] 107 Insulation Board

[0032] 108 heat insulation board

[0033] 109 Ceramic Ring

[0034] 110 Temperature Sensor

[0035] 111 Reaction gas inlet pipe

[0036] 211 First Gas Pipeline

[0037] 212 Second Gas Pipeline

[0038] 311 First Cooling Space

[0039] 312 Second Cooling Space Detailed Implementation

[0040] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0041] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0042] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0043] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0044] As mentioned above, excessively high temperatures can damage the surfaces of internal components, thereby shortening the equipment's lifespan. Simultaneously, high temperatures can cause impurity particles to deposit, affecting the film quality of the wafer. Furthermore, at high temperatures, technicians must wait a considerable amount of time for the equipment to cool down during operation, and there is a risk of serious problems such as burns.

[0045] In order to overcome the above-mentioned defects in the prior art, the present invention provides a heat-insulating cover plate and a process cavity, which can be used to insulate the cover plate under high temperature conditions by setting a heat-insulating structure, so as to prevent damage to components, generation of impurity particles that affect the film formation effect, and avoid burns to technicians.

[0046] In some non-limiting embodiments, the heat-insulating cover plate provided in the first aspect of the present invention can be configured within the process chamber provided in the second aspect of the present invention. Specifically, the process chamber provided in the second aspect of the present invention includes a chamber body and the heat-insulating cover plate provided in the first aspect of the present invention.

[0047] Please refer to further details. Figures 1-3 , Figure 1 A front view structural schematic diagram of a heat-insulating cover plate provided according to some embodiments of the present invention is shown. Figure 2 A side view of the structure of a heat-insulating cover plate provided according to some embodiments of the present invention is shown. Figure 3 A three-dimensional structural schematic diagram of a heat-insulating cover plate provided according to some embodiments of the present invention is shown.

[0048] exist Figure 1In the illustrated embodiment, the heat-insulating cover plate provided by the first aspect of the present invention includes a cover plate body 101, a heat-insulating ring 102, a heat-insulating block 103, and at least one gas pipe. The cover plate body 101 is disposed on a first side wall of a process chamber, and its central region has an opening for accommodating a spray head. The heat-insulating ring 102 is disposed at the opening of the cover plate body 101 to support the spray head. A heater 104 is provided on the spray head. The heat-insulating block 103 is disposed above the heater 104 to prevent heat emitted by the heater 104 from being transferred upwards. At least one cooling space is provided between the heat-insulating block 103 and the heater 104. The at least one gas pipe extends into the cooling space to supply cooling air to accelerate the cooling of the cooling space. Here, the cooling air may optionally be compressed dry air (CDA).

[0049] Furthermore, the heat-insulating cover plate provided in the first aspect of the present invention also includes a spray head. The spray head includes a spray cover 1051 and a spray plate 1052. The spray plate 1052 has multiple air passages to uniformly spray the working gas input from above onto the process chamber below. The spray cover 1051 is located above the spray plate 1052 and has a heater 104 mounted thereon. The spray cover 1051 and the spray plate 1052 are respectively installed in the opening of the cover plate body 101 via multiple support structures of the heat insulation ring 102.

[0050] Here, the spray head is made of N4 nickel alloy, with a melting point of 1453℃. The cover body 101 is made of 6061-T6 alloy, with a melting point of 660℃. Therefore, the heat insulation ring 102 located between the cover body 101 and the spray head is a high-temperature resistant and heat-insulating quartz ring, used to isolate heat transfer and prevent the cover body 101 from deforming due to excessive temperature.

[0051] Furthermore, the spray cover 1051 has an upwardly extending second sidewall for mounting to the top of the heat insulation ring 102 via a first protrusion located at the edge of the second sidewall, and forms a receiving cavity for the heat insulation block 103 via the second sidewall.

[0052] like Figure 2 and Figure 3 As shown, the diameter of the heat insulation block 103 is smaller than the inner diameter of the receiving cavity, forming a first cooling space 311 between the heat insulation block 13 and the second side wall, and the first cooling air is introduced through the first gas pipe 211 to prevent the heat emitted by the heater 104 from being transferred outward to the heat insulation ring 102.

[0053] Please refer to further information. Figure 4 , Figure 4 A schematic diagram of the structure of a heat insulation pad provided according to some embodiments of the present invention is shown.

[0054] like Figure 4As shown, the heat insulation cover provided in the first aspect of the present invention further includes a heat insulation pad 106. The heat insulation pad 106 is disposed between the heater 104 and the heat insulation block 103, and is fixedly connected to the spray cover 1051. It forms a second cooling space 312 between the heater 104 and the heat insulation block 103, and allows second cooling air to be introduced via a second gas pipe 212 to prevent heat emitted by the heater 104 from being transferred upwards to the heat insulation block 103. In some embodiments, the heat insulation pad 106 is optionally attached to the spray cover 1051 by screws.

[0055] Furthermore, the heat insulation cover provided in the first aspect of the present invention also includes a heat insulation plate 107. A first end of the heat insulation plate 107 is fixed to the heat insulation block 103 to prevent heat from the heat insulation block 103 from being transferred upwards. A second protrusion is provided at the second end of the heat insulation plate 107, which is mounted on the top of the second sidewall of the spray cover 1051 to lift the heat insulation block 103, thereby forming a second cooling space 312 between the heater 104 and the heat insulation block 103, and allowing second cooling air to be introduced via a second gas pipe 212 to prevent heat emitted by the heater 104 from being transferred upwards to the heat insulation block 103. In some embodiments, the heat insulation plate 107 may optionally be screwed onto the heat insulation block 103.

[0056] Please refer to Figure 5 , Figure 5 A schematic diagram of the structure of a heater provided according to some embodiments of the present invention is shown.

[0057] exist Figure 5 In the illustrated embodiment, the heater 104 includes at least one mica heating element disposed on the bottom surface of the inner side of the receiving cavity and / or at least one stepped surface of the inner edge of the receiving cavity to heat the spray cover 1051. Furthermore, the heat generated by the heater 104 is transferred to the cover body 101 through the spray cover 1051 and the heat insulation ring 102. Here, the mica heating element is annular, used to bypass the heat insulation pad 106 and form a second cooling space 312 with it.

[0058] Furthermore, the heat-insulating cover plate provided in the first aspect of the present invention also includes a heat-insulating pressure plate 108. The first end of the heat-insulating pressure plate 108 is fixedly connected to the cover plate body 101, while its second end has a third protrusion. The third protrusion is installed on the top of the second sidewall of the spray cover 1051 to fix the spray cover 1051 to the cover plate body 101, thereby limiting the vertical displacement of the spray cover 1051. Here, the aforementioned heat-insulating block 103, heat-insulating plate 107, and heat-insulating pressure plate 108 are made of PI material. In some embodiments, the heat-insulating pressure plate 108 may optionally be screwed onto the cover plate body 101.

[0059] Furthermore, the heat insulation cover plate provided in the first aspect of the present invention also includes a ceramic ring 109. The spray cover 1051 is mounted on the spray plate 1052 via the ceramic ring 109, and a mixing chamber for the working gas is formed on the spray plate 1052.

[0060] Furthermore, in some embodiments, the heat-insulating cover plate provided in the first aspect of the present invention may optionally include a temperature controller (TC) 110 and a reaction gas input pipe 111. The temperature sensor 110 is used to detect the temperature of the spray head. The reaction gas input pipe 111 is used to input reaction gas into the spray head, and the input working gas is evenly sprayed into the process chamber below via the spray plate 1052.

[0061] In summary, the heat-insulating cover plate and process cavity provided by the present invention can all be used to insulate the cover plate under high temperature conditions by setting a heat-insulating structure, so as to prevent damage to parts, generation of impurity particles that affect the film formation effect, and avoid burns to technicians.

[0062] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0063] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat-insulating cover plate, characterized in that, include: The cover plate body is located on the first side wall of the process chamber, and its central area has an opening to accommodate the spray head; A heat insulation ring is provided at the opening of the cover plate body to support the spray head. The spray head includes a spray cover and a spray plate. The spray plate is provided with multiple air holes to evenly spray the working gas input from above into the process chamber below. The spray cover is located on the spray plate and is provided with a heater. The spray cover and the spray plate are respectively installed at the opening of the cover plate body via multiple support structures of the heat insulation ring. A heat insulation block, disposed above the heater, prevents heat emitted by the heater from being transferred upwards. The diameter of the heat insulation block is smaller than the inner diameter of the receiving cavity. A first cooling space is formed between the heat insulation block and the second sidewall, and first cooling air is introduced through a first gas pipe to prevent heat emitted by the heater from being transferred outwards to the heat insulation ring. The spray cover has an upwardly extending second sidewall for mounting to the top of the heat insulation ring via a first protrusion located at the edge of the second sidewall, and the second sidewall forms the receiving cavity for housing the heat insulation block. At least one gas pipe extends into the cooling space to supply cooling air to it.

2. The heat-insulating cover plate as described in claim 1, characterized in that, Also includes: The heater includes at least one mica heating element disposed on the bottom surface inside the receiving cavity and / or at least one stepped surface on the inner edge of the receiving cavity to heat the spray cover.

3. The heat-insulating cover plate as described in claim 1, characterized in that, Also includes: A heat insulation pad is disposed between the heater and the heat insulation block to form a second cooling space between the heater and the heat insulation block, and to introduce second cooling air through a second gas pipe to prevent the heat emitted by the heater from being transferred upward to the heat insulation block.

4. The heat-insulating cover plate as described in claim 1, characterized in that, Also includes: A heat insulation plate, the first end of which is fixed to the heat insulation block to prevent the heat of the heat insulation block from being transferred upward, wherein the second end of the heat insulation plate is provided with a second protrusion, which is installed on the top of the second side wall of the spray cover to lift the heat insulation block, thereby forming a second cooling space between the heater and the heat insulation block, and a second cooling air is introduced through a second gas pipe to prevent the heat emitted by the heater from being transferred upward to the heat insulation block.

5. The heat-insulating cover plate as described in claim 1 or 4, characterized in that, Also includes: A heat-insulating pressure plate has a first end fixedly connected to the cover plate body, and a second end provided with a third protrusion, wherein the third protrusion is installed on the top of the second side wall of the spray cover to fix the spray cover to the cover plate body.

6. The heat-insulating cover plate as described in claim 5, characterized in that, The heat insulation ring is a quartz ring, and the heat insulation block, the heat insulation plate and the heat insulation pressure plate are made of PI material.

7. The heat-insulating cover plate as described in claim 1, characterized in that, Also includes: A ceramic ring is used, wherein the spray cover is mounted on the spray plate via the ceramic ring, and a mixing chamber for the working gas is formed on the spray plate.

8. A process chamber, characterized in that, include: chamber body; as well as The heat-insulating cover plate as described in any one of claims 1 to 7.

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