A surface polishing method for copper contact fingers and copper-tungsten parts of an optical communication base
By combining rough grinding and fine polishing processes with diamond grinding fluid, zinc stearate, and zirconium oxide polishing balls, the problems of low surface treatment efficiency and scratches on copper-tungsten parts for copper contacts and optical communication bases have been solved, achieving efficient and scratch-free surface smoothing.
Patent Information
- Application Number
- CN202311370656.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-23
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2043-10-23
AI Technical Summary
In the existing technology, the surface treatment efficiency of copper contacts and copper-tungsten components for optical communication bases is low, and manual processing is prone to scratching the surface, leading to secondary rework.
The polishing process consists of two steps: rough grinding and fine polishing. Diamond grinding fluid, zinc stearate, zirconia polishing balls, and polishing brightener are used. By controlling the vibration frequency and time of the grinding machine, surface deburring and smoothing are achieved.
It improves the surface treatment efficiency of copper contacts and copper-tungsten components for optical communication bases, ensuring smooth and scratch-free surfaces, simplifying the operation process, and reducing the risk of secondary repairs.
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Figure CN117506564B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of surface polishing technology, in particular to a surface polishing treatment method for copper contact fingers and copper-tungsten parts of optical communication bases. BACKGROUND
[0002] Surface treatment is a process method of artificially forming a surface layer with different mechanical, physical and chemical properties on the surface of the base material. The purpose of surface treatment is to meet the requirements of corrosion resistance, wear resistance, decoration or other special functional requirements of the product. For metal castings, the commonly used surface treatment methods are mechanical polishing, chemical treatment, surface heat treatment, and sprayed surface. Surface treatment is to clean, clean, deburr, remove oil stains, and remove oxide skin on the surface of the workpiece.
[0003] Polishing treatment is a surface treatment technology used to improve the smoothness and gloss of the material surface. Polishing treatment is usually carried out after mechanical grinding or chemical corrosion to remove small defects and roughness on the surface and make the surface smoother and brighter.
[0004] The method of polishing treatment includes mechanical polishing, chemical polishing and electrolytic polishing. Among them, mechanical polishing is the most commonly used method, which uses abrasive materials such as sandpaper, grinding wheel, polishing head, etc. to rub and cut the surface of the material to remove small defects and roughness on the surface. Chemical polishing uses chemicals to treat the surface of the material to remove oxides, dirt and other impurities on the surface, making the surface smoother and brighter. Electrolytic polishing uses electrolysis principle to form a very thin metal or alloy layer on the surface of the material, thereby improving the hardness and gloss of the surface.
[0005] At present, the surface treatment method of the contact finger and the copper-tungsten part of the optical communication base is mostly manual treatment, and the treatment efficiency of the contact finger is low. The copper-tungsten part for optical communication is small, and the magnifying glass needs to be used to check during the burr treatment process, which is easy to scratch the surface and cause secondary repair. SUMMARY
[0006] To solve the above technical problems, the present application provides a surface polishing treatment method for copper contact fingers and copper-tungsten parts of optical communication bases.
[0007] The technical scheme of the present application is: a surface polishing treatment method for copper contact fingers and copper-tungsten parts of optical communication bases, comprising the following steps:
[0008] S1, rough grinding preparation
[0009] Turning on the water valve to clean the grinder, after cleaning, turning off the water valve, drying the inside of the grinder, the drying temperature is 110-120℃, the drying time is 5-8min, after drying, put in 10mm*10mm plastic grinding stone, then add the copper contact finger product or the optical communication base copper tungsten product that needs to be ground, the weight ratio of the product to the abrasive is 1:2, add diamond grinding fluid to the grinder, then add zinc stearate to the grinder, then add tap water to the grinder;
[0010] S2, rough grinding:
[0011] Adjust the frequency converter and time controller of the grinder, rough grinding for 1-1.2h, turn off the grinder, then discharge the wastewater in the grinder, then start the grinder again for rough grinding for 25-45min, then automatically vibrate the discharge, to get the rough ground copper contact finger product or optical communication base copper tungsten product;
[0012] S3, preparation before fine polishing:
[0013] Turning on the water valve to clean the grinder, after cleaning, turning off the water valve, drying the inside of the grinder, the drying temperature is 110-120℃, the drying time is 5-8min, after drying, put in zirconia polishing ball, the diameter of the zirconia polishing ball is 1-1.5mm, then add the rough ground copper contact finger product or optical communication base copper tungsten product to the grinder, then add the polishing brightener to the grinder, then add tap water to the grinder;
[0014] S4, fine polishing
[0015] Adjust the frequency converter and time controller of the grinder, fine polishing for 15min, turn off the grinder, then discharge the wastewater in the grinder, then automatically vibrate the discharge, to get the treated copper contact finger product or optical communication base copper tungsten product.
[0016] Further, the volume ratio of the diamond grinding fluid added in step S1 to the mass of the copper contact finger product or the optical communication base copper tungsten product being ground is 1ml:2kg.
[0017] Note: If the ratio is too low, it may not be able to fully lubricate the surface of the copper contact finger product or the optical communication base copper tungsten product, resulting in excessive wear and tear and scratches, if the ratio is too high, it may cause excessive lubrication, causing the copper contact finger product or the optical communication base copper tungsten product surface to produce stickiness, thereby reducing the rough grinding efficiency.
[0018] Further, the mass ratio of the zinc stearate added in step S1 to the mass of the copper contact finger product or the optical communication base copper tungsten product being ground is 1:5000.
[0019] Zinc stearate can form a protective film on the surface of the product, preventing oxidation and corrosion of the metal surface. It can also improve the smoothness of the surface, reducing friction and wear.
[0020] Further, the volume of tap water added in step S1 is 1L per 20kg of mass of the ground copper contact finger product or the copper-tungsten product for an optical communication base.
[0021] Note: The amount of tap water added should be appropriate to ensure the cleanliness of the product surface.
[0022] Further, the mass of zirconia polishing balls added in step S3 is 3:1 compared to the mass of the coarsely ground copper contact finger product or the copper-tungsten product for an optical communication base.
[0023] Note: Zirconia polishing balls have high hardness, high wear resistance, and high temperature stability, which can effectively polish the surface of the product and improve its surface quality and smoothness. In addition, zirconia polishing balls also have good chemical stability and are not easily eroded by chemicals, allowing for long-term use.
[0024] Further, the volume of polishing brightener added in step S3 is 3ml per 10kg of mass of the coarsely ground copper contact finger product or the copper-tungsten product for an optical communication base.
[0025] Note: Polishing brightener can remove oxides and dirt on the surface of the product through chemical reactions, and form a protective film on the surface to prevent oxidation and corrosion. Polishing brightener can also improve the gloss and wear resistance of the product surface.
[0026] Further, the volume of tap water added in step S3 is 1L per 50kg of mass of the coarsely ground copper contact finger product or the copper-tungsten product for an optical communication base.
[0027] Note: Chlorine and other impurities in tap water can clean and polish the surface of the product, removing surface dirt and oxides to improve polishing effect. The dissolved gas in tap water can increase the viscosity of the polishing liquid, thereby improving the polishing speed. Tap water contains a certain amount of dissolved gas and moisture, which can increase the flowability of the polishing liquid, making the polishing more uniform.
[0028] Further, the diamond grinding fluid is composed of the following components by weight: 10-18 parts of CVD diamond powder, 2-4 parts of sodium dodecyl sulfonate, 1-3 parts of isopropyl alcohol amine, 1-4 parts of sodium oleoyl amide acid, 3-5 parts of polyacrylamide, and 40-60 parts of ethylene glycol.
[0029] Description: CVD diamond powder itself has high hardness and wear resistance, adding to the diamond polishing liquid can increase the hardness and wear resistance of the whole polishing liquid, thereby improving the service life and polishing efficiency of the polishing liquid, sodium dodecyl sulfonate can reduce the surface tension of the polishing liquid, thereby improving the dispersibility and flowability of the polishing liquid, so that the CVD diamond powder can be more uniformly dispersed in the liquid phase, improving the polishing efficiency and surface quality.
[0030] Further, the polishing brightener is composed of the following ingredients by weight: 8-10 parts of beta-alumina powder, 5-8 parts of alumina ceramic powder, 2-3 parts of calcium carbonate powder, 7-11 parts of polyethylene glycol, 2-5 parts of sodium fatty alcohol ether sulfate, 30-50 parts of deionized water.
[0031] Description: Beta-alumina powder and alumina ceramic powder can form an extremely thin and uniform coating during polishing, which can play a lubricating and polishing role, thereby improving the surface quality and smoothness of the polished product.
[0032] Further, the grinder comprises a grinding barrel, the outer side of the grinding barrel is provided with a grinding shell, the inner wall of the grinding shell and the outer wall of the grinding barrel are connected through bearings, the outer walls of the front and rear sides of the grinding shell are each rotationally connected with a support frame, the lower end of the support frame is connected with a fixed plate, the fixed lower end is provided with a plurality of shock-absorbing springs, the lower end of the shock-absorbing spring is fixedly connected with a grinding base, the upper end of the grinding base is slidingly connected with the bottom of the grinding shell, the lower side of the grinding shell is provided with a grinding motor, the output shaft of the grinding motor is drivingly connected with the bottom of the grinding barrel, the left side of the fixed plate is provided with a vibrator, the left side of the fixed plate is provided with a hydraulic actuator, the left side of the grinding shell is hingedly connected with a guide rod, and the left end of the guide rod is hingedly connected with the top of the hydraulic actuator.
[0033] Description: The above-mentioned grinder rotates the grinding barrel through the grinding motor to coarsely grind and polish the product, after polishing, the left end of the guide rod is driven upward by the hydraulic actuator, thereby driving the grinding shell to tilt, and the vibrator is turned on to vibrate and discharge the material.
[0034] The beneficial effects of the present application are:
[0035] (1) The present application is simple to operate and completely relies on process guarantee, and is divided into two processes of coarse grinding and fine polishing, and then grinding liquid and polishing liquid are added to achieve the deburring and surface polishing effect required for the surface of the copper-tungsten part of the touch finger and optical communication base.
[0036] (2) This invention employs two processes: coarse grinding and fine polishing. Coarse grinding utilizes a plastic abrasive and a polishing fluid. The equipment rotates clockwise under vibration conditions. The ratio of the plastic abrasive to the product is controlled, and the vibration frequency and time of the equipment are adjusted to achieve the desired surface burr removal effect. Then, by adjusting the ratio of zirconia grinding stone to the product, adding polishing agent, and adjusting the vibration frequency and time of the equipment, the final surface quality required for the product is achieved. Attached Figure Description
[0037] Figure 1 This is a schematic diagram of the grinding machine of the present invention.
[0038] Among them, 1-grinding barrel, 2-grinding shell, 3-support frame, 4-fixed plate, 5-shock-absorbing spring, 6-grinding base, 7-grinding motor, 8-vibrator, 9-hydraulic actuator, 10-guide rod. Detailed Implementation
[0039] Example 1:
[0040] A surface polishing method for copper contact fingers and copper-tungsten components for optical communication bases includes the following steps:
[0041] S1. Preparations before rough grinding
[0042] Open the water valve to clean the grinder. After cleaning, close the water valve and dry the inside of the grinder at 110℃ for 5 minutes. After drying, place a 10mm*10mm plastic grinding stone inside, then add the copper contact finger product or optical communication base copper-tungsten product to be ground. The product weight to abrasive weight ratio is 1:2. Add diamond grinding fluid to the grinder, then add zinc stearate, and finally add tap water.
[0043] S2, Coarse Grinding:
[0044] Adjust the frequency converter and time controller of the grinding machine, coarse grind for 1 hour, turn off the grinding machine, drain the wastewater from the grinding machine, then start the grinding machine again for 25 minutes of coarse grinding, and then automatically vibrate to discharge the material to obtain the coarsely ground copper contact finger product or optical communication base copper-tungsten product.
[0045] S3. Preparations before fine polishing:
[0046] Open the water valve to clean the grinder. After cleaning, close the water valve and dry the inside of the grinder at 110℃ for 5 minutes. After drying, put in zirconia polishing balls with a diameter of 1mm. Then add the coarsely ground copper contact product or copper-tungsten product for optical communication base to the grinder. Next, add polishing agent to the grinder and then add tap water to the grinder.
[0047] S4, fine polishing
[0048] Adjust the frequency converter and time controller of the grinding machine, the fine polishing time is 15 min, turn off the grinding machine, then discharge the wastewater in the grinding machine, and then automatically vibrate the discharge to obtain the treated copper contact finger product or optical communication base copper tungsten product.
[0049] The volume of the diamond grinding liquid added in step S1 is 1 ml to 2 kg of the mass of the copper contact finger product or optical communication base copper tungsten product to be ground.
[0050] The mass of the zinc stearate added in step S1 is 1:5000 to the mass of the copper contact finger product or optical communication base copper tungsten product to be ground.
[0051] The volume of the tap water added in step S1 is 1 L to 20 kg of the mass of the copper contact finger product or optical communication base copper tungsten product to be ground.
[0052] The mass of the zirconia polishing ball added in step S3 is 3:1 to the mass of the copper contact finger product or optical communication base copper tungsten product after rough grinding.
[0053] The volume of the polishing brightener added in step S3 is 3 ml to 10 kg of the mass of the copper contact finger product or optical communication base copper tungsten product after rough grinding.
[0054] The volume of the tap water added in step S3 is 1 L to 50 kg of the mass of the copper contact finger product or optical communication base copper tungsten product after rough grinding.
[0055] The diamond grinding liquid is composed of the following components by weight: 10 parts of CVD diamond powder, 2 parts of sodium dodecyl sulfonate, 1 part of isopropanolamine, 1 part of sodium oleoyl amide acid, 3 parts of polyacrylamide, and 40 parts of ethylene glycol.
[0056] The polishing brightener is composed of the following components by weight: 8 parts of β-alumina powder, 5 parts of alumina ceramic powder, 2 parts of calcium carbonate powder, 7 parts of polyethylene glycol, 2 parts of fatty alcohol ether sodium sulfate, and 30 parts of deionized water.
[0057] Example 2:
[0058] A surface polishing treatment method for copper contact fingers and optical communication base copper tungsten parts, comprising the following steps:
[0059] S1, rough grinding preparation
[0060] Turning on the water valve to clean the grinder, after cleaning, turning off the water valve, drying the inside of the grinder, the drying temperature is 115℃, the drying time is 6min, after drying, put in 10mm*10mm plastic grinding stone, then add the copper contact finger product or the copper tungsten product of the optical communication base which needs to be ground, the weight ratio of the product to the abrasive is 1:2, add diamond grinding fluid to the grinder, then add zinc stearate to the grinder, then add tap water to the grinder;
[0061] S2, rough grinding:
[0062] Adjust the frequency converter and time controller of the grinder, rough grinding for 1.1h, turn off the grinder, then discharge the wastewater in the grinder, then start the grinder again for rough grinding for 30min, then automatically vibrate the discharge, to get the rough ground copper contact finger product or the copper tungsten product of the optical communication base;
[0063] S3, preparation before fine polishing:
[0064] Turning on the water valve to clean the grinder, after cleaning, turning off the water valve, drying the inside of the grinder, the drying temperature is 115℃, the drying time is 6min, after drying, put in zirconia polishing ball, the diameter of the zirconia polishing ball is 1.3mm, then add the rough ground copper contact finger product or the copper tungsten product of the optical communication base to the grinder, then add the polishing brightener to the grinder, then add tap water to the grinder;
[0065] S4, fine polishing
[0066] Adjust the frequency converter and time controller of the grinder, fine polishing for 15min, turn off the grinder, then discharge the wastewater in the grinder, then automatically vibrate the discharge, to get the treated copper contact finger product or the copper tungsten product of the optical communication base.
[0067] The volume ratio of the diamond grinding fluid added in step S1 to the mass of the copper contact finger product or the copper tungsten product of the optical communication base to be ground is 1ml:2kg.
[0068] The mass ratio of the zinc stearate added in step S1 to the mass of the copper contact finger product or the copper tungsten product of the optical communication base to be ground is 1:5000.
[0069] The volume ratio of the tap water added in step S1 to the mass of the copper contact finger product or the copper tungsten product of the optical communication base to be ground is 1L:20kg.
[0070] The mass ratio of the zirconia polishing ball added in step S3 to the mass of the rough ground copper contact finger product or the copper tungsten product of the optical communication base is 3:1.
[0071] The polishing brightener is added in step S3 in a volume ratio of 3ml:10kg to the mass of the rough-ground copper contact finger product or the optical communication base copper tungsten product.
[0072] The tap water is added in step S3 in a volume ratio of 1L:50kg to the mass of the rough-ground copper contact finger product or the optical communication base copper tungsten product.
[0073] The diamond grinding fluid is composed of the following ingredients in weight parts: 15 parts of CVD diamond powder, 3 parts of sodium dodecyl sulfonate, 2 parts of isopropanolamine, 3 parts of sodium oleoyl amido acid, 4 parts of polyacrylamide, and 50 parts of ethylene glycol.
[0074] The polishing brightener is composed of the following ingredients in weight parts: 9 parts of β-alumina powder, 7 parts of alumina ceramic powder, 2.5 parts of calcium carbonate powder, 9 parts of polyethylene glycol, 4 parts of sodium fatty alcohol ether sulfate, and 40 parts of deionized water.
[0075] Example 3:
[0076] A surface polishing treatment method for copper contact fingers and optical communication base copper tungsten parts, comprising the following steps:
[0077] S1, preparation before rough grinding
[0078] The water valve is opened to clean the grinder, after cleaning, the water valve is closed, the interior of the grinder is dried, the drying temperature is 120℃, the drying time is 8min, after drying, a 10mm*10mm plastic grinding stone is put in, then the copper contact finger product or the optical communication base copper tungsten product to be ground is added, the product weight to abrasive weight ratio is 1:2, the diamond grinding fluid is added to the grinder, then zinc stearate is added to the grinder, then tap water is added to the grinder;
[0079] S2, rough grinding:
[0080] The adjustment frequency converter and time controller of the grinder are adjusted, rough grinding is performed for 1.2h, the grinder is turned off, then the waste water in the grinder is discharged, then the grinder is started again for rough grinding for 45min, then the material is automatically vibrated out, obtaining the rough-ground copper contact finger product or the optical communication base copper tungsten product;
[0081] S3, preparation before fine polishing:
[0082] The water valve is opened to clean the grinder, after cleaning, the water valve is closed, the interior of the grinder is dried, the drying temperature is 120℃, the drying time is 8min, after drying, a 10mm*10mm plastic grinding stone is put in, then the copper contact finger product or the optical communication base copper tungsten product to be ground is added, the product weight to abrasive weight ratio is 1:2, the diamond grinding fluid is added to the grinder, then zinc stearate is added to the grinder, then tap water is added to the grinder;
[0083] S4, fine polishing
[0084] Adjust the frequency converter and time controller of the grinding machine, the fine polishing time is 15 min, turn off the grinding machine, then discharge the wastewater in the grinding machine, and then automatically vibrate the discharge to obtain the treated copper contact finger product or optical communication base copper tungsten product.
[0085] The volume of the diamond grinding liquid added in step S1 is 1 ml to 2 kg of the mass of the copper contact finger product or optical communication base copper tungsten product to be ground.
[0086] The mass of the zinc stearate added in step S1 is 1:5000 to the mass of the copper contact finger product or optical communication base copper tungsten product to be ground.
[0087] The volume of the tap water added in step S1 is 1 L to 20 kg of the mass of the copper contact finger product or optical communication base copper tungsten product to be ground.
[0088] The mass of the zirconia polishing ball added in step S3 is 3:1 to the mass of the copper contact finger product or optical communication base copper tungsten product after rough grinding.
[0089] The volume of the polishing brightener added in step S3 is 3 ml to 10 kg of the mass of the copper contact finger product or optical communication base copper tungsten product after rough grinding.
[0090] The volume of the tap water added in step S3 is 1 L to 50 kg of the mass of the copper contact finger product or optical communication base copper tungsten product after rough grinding.
[0091] The diamond grinding liquid is composed of the following components in parts by weight: 18 parts of CVD diamond powder, 4 parts of sodium dodecyl sulfonate, 3 parts of isopropanolamine, 4 parts of sodium oleoyl amide acid, 5 parts of polyacrylamide, and 60 parts of ethylene glycol.
[0092] The polishing brightener is composed of the following components in parts by weight: 10 parts of β-alumina powder, 8 parts of alumina ceramic powder, 3 parts of calcium carbonate powder, 11 parts of polyethylene glycol, 5 parts of fatty alcohol ether sodium sulfate, and 50 parts of deionized water.
[0093] Comparative Examples 1-3, Example 3 has the best polishing effect on the copper contact finger product or optical communication base copper tungsten product, and therefore, Example 3 is the best embodiment.
[0094] Example 4
[0095] On the basis of embodiment 3, the embodiment provides the grinder structure in the surface polishing treatment method of the copper contact finger and the copper-tungsten part of the optical communication base, the grinder comprises a grinding barrel 1, an outer side of the grinding barrel 1 is provided with a grinding shell 2, an inner wall of the grinding shell 2 is connected with an outer wall of the grinding barrel 1 through a bearing, the front and rear two outer walls of the grinding shell 2 are each rotationally connected with a support frame 3, a lower end of the support frame 3 is connected with a fixed plate 4, the fixed lower end is provided with a plurality of damping springs 5, a lower end of the damping spring 5 is fixedly connected with a grinding base 6, an upper end of the grinding base 6 is slidingly connected with a bottom of the grinding shell 2, a lower side of the grinding shell 2 is provided with a grinding motor 7, an output shaft of the grinding motor 7 is drivingly connected with the bottom of the grinding barrel 1, a left side of the fixed plate 4 is provided with a vibrator 8, an upper side of the left side of the fixed plate 4 is provided with a hydraulic actuator 9, a left side of the grinding shell 2 is hingedly connected with a guide rod 10, a left end of the guide rod 10 is hingedly connected with a top of the hydraulic actuator 9.
[0096] The grinder motor 7, the vibrator 8 and the hydraulic actuator 9 used in the above embodiments are all commercially available products, as long as the functions of the present application can be realized, and a person skilled in the art can select and use them according to conventional common sense, which is not specially limited here.
Claims
1. A method for surface polishing of copper contact fingers and copper-tungsten components for optical communication bases, characterized in that, Includes the following steps: S1. Preparations before rough grinding: Open the water valve to clean the grinder. After cleaning, close the water valve and dry the inside of the grinder at 110-120℃ for 5-8 minutes. After drying, place a 10mm*10mm plastic grinding stone inside, then add the copper contact finger product or copper-tungsten product for optical communication base that needs to be ground. The product weight to abrasive weight ratio should be 1:
2. Add diamond grinding fluid to the grinder, then add zinc stearate, and finally add tap water. S2, Coarse Grinding: Adjust the frequency converter and time controller of the grinding machine, coarse grind for 1-1.2 hours, turn off the grinding machine, drain the wastewater from the grinding machine, then start the grinding machine again for coarse grinding for 25-45 minutes, and then automatically vibrate to discharge the material to obtain the coarsely ground copper contact finger product or optical communication base copper-tungsten product. S3. Preparations before fine polishing: Open the water valve to clean the grinder. After cleaning, close the water valve and dry the inside of the grinder at 110-120℃ for 5-8 minutes. After drying, put in zirconia polishing balls with a diameter of 1-1.5mm. Then add the coarsely ground copper contact product or copper-tungsten product for optical communication base to the grinder. Next, add polishing agent to the grinder and then add tap water to the grinder. S4, Fine Polishing: Adjust the frequency converter and time controller of the grinding machine, set the fine polishing time to 15 minutes, turn off the grinding machine, drain the wastewater from the grinding machine, and then automatically vibrate to discharge the material, thus obtaining the processed copper contact product or optical communication base copper-tungsten product.
2. The surface polishing method for copper contact fingers and copper-tungsten components of optical communication bases as described in claim 1, characterized in that, In step S1, the volume of diamond polishing slurry added is in the mass ratio of the copper contact product or the copper-tungsten optical communication base product being polished to 1 ml: 2 kg.
3. The surface polishing method for copper contact fingers and copper-tungsten components of optical communication bases as described in claim 1, characterized in that, In step S1, the mass ratio of added zinc stearate to the mass of the ground copper contact product or the copper-tungsten product for optical communication base is 1:5000.
4. The surface polishing method for copper contact fingers and copper-tungsten components of optical communication bases as described in claim 1, characterized in that, In step S1, the volume ratio of tap water added to the mass ratio of the ground copper contact product or the copper-tungsten product for optical communication base is 1L:20kg.
5. The surface polishing method for copper contact fingers and copper-tungsten components of optical communication bases as described in claim 1, characterized in that, In step S3, the mass ratio of the added zirconium oxide polishing balls to the mass of the coarsely ground copper contact product or the copper-tungsten product for optical communication base is 3:
1.
6. The surface polishing method for copper contact fingers and copper-tungsten components of optical communication bases as described in claim 1, characterized in that, In step S3, the volume ratio of the added polishing agent to the mass ratio of the coarsely ground copper finger product or the copper-tungsten product for optical communication base is 3 ml: 10 kg.
7. The surface polishing method for copper contact fingers and copper-tungsten components of optical communication bases as described in claim 1, characterized in that, In step S3, the volume ratio of tap water added to the mass ratio of the coarsely ground copper contact product or the copper-tungsten product for optical communication base is 1L:50kg.
8. The surface polishing method for copper contact fingers and copper-tungsten components for optical communication bases as described in claim 1, characterized in that, The diamond polishing fluid is composed of the following components in parts by weight: 10-18 parts CVD diamond powder, 2-4 parts sodium dodecyl sulfonate, 1-3 parts isopropanolamine, 1-4 parts sodium oleoyl amino acid, 3-5 parts polyacrylamide, and 40-60 parts ethylene glycol.
9. The surface polishing method for copper contact fingers and copper-tungsten components of optical communication bases as described in claim 1, characterized in that, The diamond polishing fluid is composed of the following components in parts by weight: 10-18 parts CVD diamond powder, 2-4 parts sodium dodecyl sulfonate, 1-3 parts isopropanolamine, 3-5 parts polyacrylamide, and 40-60 parts ethylene glycol.
10. The surface polishing method for copper contact fingers and copper-tungsten components for optical communication bases as described in claim 1, characterized in that, The grinding machine includes a grinding barrel (1), a grinding shell (2) is provided on the outside of the grinding barrel (1), the inner wall of the grinding shell (2) is connected to the outer wall of the grinding barrel (1) by a bearing, a support frame (3) is rotatably connected to the front and rear outer walls of the grinding shell (2), a fixed plate (4) is connected to the lower end of the support frame (3), a plurality of shock-absorbing springs (5) are provided at the lower end of the fixed plate (4), a grinding base (6) is fixedly connected to the lower end of the shock-absorbing springs (5), the upper end of the grinding base (6) is slidably connected to the bottom of the grinding shell (2), a grinding motor (7) is provided below the grinding shell (2), the output shaft of the grinding motor (7) is connected to the bottom of the grinding barrel (1) for transmission, a vibrator (8) is provided on the left side of the fixed plate (4), a hydraulic actuator (9) is provided on the upper left side of the fixed plate (4), a guide rod (10) is hinged to the left side of the grinding shell (2), and the left end of the guide rod (10) is hinged to the top of the hydraulic actuator (9).
Citation Information
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