Heat dissipation device and electronic device

Abstract

The application provides a heat dissipation device and an electronic device, which are used for improving the heat conduction efficiency between the heat dissipation device and a hard disk and improving the heat dissipation performance. The heat dissipation device comprises a heat radiator and a plurality of heat conduction components. The plurality of heat conduction components are connected with the heat radiator. The plurality of heat conduction components are arranged at intervals. An insertion interface is formed between two adjacent heat conduction components. The insertion interface is used for inserting a hard disk.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, in particular to a heat dissipation device and an electronic device. BACKGROUND

[0002] Under the background of double carbon, the energy efficiency improvement of data centers has become a hot topic today. In existing electronic devices, hard disks are often numerous and have large total power, resulting in serious heat generation of the hard disks. However, the heat conduction efficiency between the existing heat dissipation device and the hard disk is low, and the heat dissipation performance is poor. SUMMARY

[0003] The present application provides a heat dissipation device and an electronic device for improving the heat conduction efficiency between the heat dissipation device and the hard disk and improving the heat dissipation performance.

[0004] In a first aspect, the present application provides a heat dissipation device, comprising a heat sink and a plurality of heat conduction components, the plurality of heat conduction components are connected with the heat sink, the plurality of heat conduction components are arranged at intervals, and an insertion port is formed between two adjacent heat conduction components, the insertion port being used for inserting a hard disk.

[0005] In the heat dissipation device shown in the present application, the heat generated by the hard disk during operation can be first transmitted to the two adjacent heat conduction components, and then transmitted to the heat sink through the two adjacent heat conduction components, thereby effectively improving the heat conduction efficiency between the heat sink and the hard disk, improving the heat dissipation performance of the heat sink on the hard disk, and achieving effective heat dissipation of the hard disk. When the heat dissipation device is used in an electronic device, the electronic device can support high-density hard disk deployment while also achieving heat dissipation of high-power hard disks.

[0006] In a possible implementation, the hard disk comprises a first contact surface and a second contact surface arranged opposite to each other, and the first contact surface and the second contact surface are respectively in contact with the two adjacent heat conduction components, so as to increase the contact area between the hard disk and the heat conduction components, improve the heat transfer efficiency between the hard disk and the heat conduction components, and improve the heat dissipation performance of the heat dissipation device on the hard disk.

[0007] In a possible implementation, the first contact surface and the second contact surface are parallel to the extension direction of the hard disk, so as to ensure that the surface with the largest area of the hard disk is in contact with the heat conduction components, increase the contact area between the hard disk and the heat conduction components, improve the heat transfer efficiency between the hard disk and the heat conduction components, and improve the heat dissipation performance of the heat dissipation device and the hard disk.

[0008] In a possible implementation, the heat conduction component comprises a main body and at least one heat conduction piece, the main body is made of heat conductive material; the main body comprises a third contact surface and a fourth contact surface arranged opposite to each other, the heat conduction piece is located at at least one of the third contact surface and the fourth contact surface, and the heat conduction piece is connected with the heat sink.

[0009] The heat generated by the hard disk during operation can be transferred to the heat conducting member, or transferred to the heat conducting member through the main body, and then transferred to the heat sink through the heat conducting member, thereby achieving effective heat dissipation for the hard disk.

[0010] In a possible implementation, the heat conducting member is a heat pipe, so as to increase the heat transfer efficiency between the hard disk and the heat conducting member, and further increase the heat transfer efficiency between the hard disk and the heat conducting assembly.

[0011] In a possible implementation, the heat conducting assembly further comprises at least one contact member, the contact member being located at at least one of the third contact surface and the fourth contact surface where the heat conducting member is present.

[0012] When the contact member is located at the contact surface where the heat conducting member is present, the contact member is located at the side of the heat conducting member away from the main body and in contact with the heat conducting member; or,

[0013] When the contact member is located at the contact surface where the heat conducting member is absent, the contact member is directly in contact with the main body.

[0014] The heat generated by the hard disk during operation can be transferred to the contact member, and then transferred to the heat conducting member through the contact member, or transferred to the heat conducting member through the contact member and the main body, and finally transferred to the heat sink through the heat conducting member, thereby achieving effective heat dissipation for the hard disk.

[0015] In a possible implementation, the heat conducting assembly comprises the main body and at least one heat conducting member, the material of the main body is not a heat conducting material; the main body comprises the third contact surface and the fourth contact surface arranged oppositely, the heat conducting member is located at at least one of the third contact surface and the fourth contact surface facing the hard disk, and the heat conducting member is connected with the heat sink.

[0016] The heat generated by the hard disk during operation can be transferred to the heat conducting member, and then transferred to the heat sink through the heat conducting member, thereby achieving effective heat dissipation for the hard disk.

[0017] In a possible implementation, the heat conducting member is a heat pipe, so as to increase the heat transfer efficiency between the hard disk and the heat conducting member, and further increase the heat transfer efficiency between the hard disk and the heat conducting assembly.

[0018] In a possible implementation, the heat conducting assembly further comprises at least one contact member, the contact member being located at at least one of the third contact surface and the fourth contact surface where the heat conducting member is present; and the first contact surface is located at the side of the contact member away from the main body and in contact with the contact member.

[0019] The heat generated by the hard disk during operation can be transferred to the contact member, and then transferred to the heat conducting member through the contact member, and finally transferred to the heat sink through the heat conducting member, thereby achieving effective heat dissipation for the hard disk.

[0020] In a possible implementation, the contact member is a spring leaf, and the spring leaf is used to realize the plugging and unplugging of the hard disk, so that the effective contact area between the hard disk and the heat conduction assembly is increased, the contact between the hard disk and the heat conduction assembly is better, the heat of the hard disk can be better transferred from the heat conduction assembly to the heat sink, and effective heat dissipation of the hard disk is realized.

[0021] In a possible implementation, the heat dissipation device further comprises a shell, the shell is provided with a through slot, the heat sink is arranged on one side of the shell and opposite to the through slot, and the plurality of heat conduction assemblies are arranged in the through slot, and the portions of the plurality of heat conduction assemblies extending out of the through slot are connected with the heat sink.

[0022] In a possible implementation, the heat sink is a cold plate.

[0023] In a possible implementation, the heat sink is provided with a containing cavity and a plurality of insertion openings, the containing cavity contains a cooling working medium, the plurality of insertion openings are in communication with the containing cavity, one end of each heat conduction assembly is inserted into one insertion opening and extends into the containing cavity and is soaked in the cooling working medium.

[0024] In a second aspect, the present application provides an electronic device, comprising at least one hard disk and any of the heat dissipation devices described above, and each hard disk is plugged into one insertion opening.

[0025] In the electronic device, the heat generated by the hard disk during operation can be transferred to the heat conduction assembly, and then transferred to the heat sink through the heat conduction assembly, so that the heat conduction efficiency between the heat sink and the hard disk is effectively improved, the heat dissipation performance of the heat sink on the hard disk is improved, and effective heat dissipation of the hard disk is realized, so that the electronic device can support high-density hard disk deployment and also realize heat dissipation of high-power hard disks.

[0026] In a possible implementation, the electronic device further comprises a hard disk back plate, the hard disk back plate is located on the side of the heat sink facing the plurality of heat conduction assemblies and is electrically connected with the at least one hard disk. The hard disk can work according to the electrical signal provided by the hard disk back plate.

[0027] In a possible implementation, the hard disk back plate is provided with a avoiding space, the avoiding space penetrates through the hard disk back plate along the thickness direction of the hard disk back plate, and the plurality of heat conduction assemblies are arranged in the avoiding space. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used by the embodiments of the present application will be described below.

[0029] Figure 1 is a structural schematic diagram of an electronic device provided by the embodiments of the present application;

[0030] Figure 2 is Figure 1 is a structural schematic diagram of a hard disk in the electronic device.

[0031] Figure 3 is Figure 1 a structural schematic diagram of a second heat dissipation device in the electronic device shown in FIG. 1;

[0032] Figure 4 is Figure 3 an exploded structural schematic diagram of the second heat dissipation device shown in FIG. 2;

[0033] Figure 5 is Figure 3 a structural schematic diagram of a plurality of heat conduction assemblies in the second heat dissipation device shown in FIG. 3;

[0034] Figure 6 is Figure 5 a structural schematic diagram of the heat conduction assembly in a first implementation shown in FIG. 4;

[0035] Figure 7 is Figure 6 an exploded structural schematic diagram of the heat conduction assembly shown in FIG. 5;

[0036] Figure 8a is Figure 5 a structural schematic diagram of the heat conduction assembly in a second implementation shown in FIG. 6;

[0037] Figure 8b is Figure 8a a structural schematic diagram of the heat conduction assembly from another angle shown in FIG. 7;

[0038] Figure 9a is Figure 8a an exploded structural schematic diagram of the heat conduction assembly shown in FIG. 8;

[0039] Figure 9b is Figure 8b an exploded structural schematic diagram of the heat conduction assembly shown in FIG. 9;

[0040] Figure 10a is Figure 5 a structural schematic diagram of the heat conduction assembly in a third implementation shown in FIG. 10;

[0041] Figure 10b is Figure 10a a structural schematic diagram of the heat conduction assembly from another angle shown in FIG. 11;

[0042] Figure 11a is Figure 10a an exploded structural schematic diagram of the heat conduction assembly shown in FIG. 12;

[0043] Figure 11b is Figure 10b an exploded structural schematic diagram of the heat conduction assembly shown in FIG. 13;

[0044] Figure 12 is Figure 1As shown in the electronic device, the assembly structure of the plurality of hard disks, the hard disk backboard and the second heat dissipation device is shown in the schematic view.

[0045] Figure 13 As shown in the electronic device, the assembly structure of the plurality of hard disks, the hard disk backboard and the second heat dissipation device is shown in the schematic view. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

[0047] Please refer to Figure 1 , Figure 1 As shown in the electronic device 100, the structure schematic view is provided. Among them, Figure 1 The arrowed solid line shown is the flow path of the cooling working medium.

[0048] The electronic device 100 provided by the present application can be a computer, a router, a switch and a server, etc. which needs to store information. Next, take the electronic device 100 as an example to illustrate the server. Among them, in order to facilitate the description, the length direction of the electronic device 100 is defined as the X axis direction, the width direction of the electronic device 100 is defined as the Y axis direction, and the height direction of the electronic device 100 is defined as the Z axis direction, and the X axis direction, the Y axis direction and the Z axis direction are perpendicular to each other.

[0049] The electronic device 100 includes a shell 110, a memory stick (not shown), a processor (not shown), a hard disk 120, a hard disk backboard 130 and a heat dissipation device 140, and the memory stick, the processor, the hard disk 120, the hard disk backboard 130 and the heat dissipation device 140 are all installed on the inner side of the shell 110. Among them, the heat dissipation device 140 has two, and the hard disk 120 has a plurality of. The two heat dissipation devices 140 are respectively a first heat dissipation device 140a and a second heat dissipation device 140b. The first heat dissipation device 140a is used for dissipating heat of the memory stick and the processor, and the second heat dissipation device 140b is used for dissipating heat of the plurality of hard disks 120. It should be noted that the "plurality" mentioned in the present application refers to two or more.

[0050] The memory stick, the processor and the first heat dissipation device 140a are all located on the right side of the electronic device 100. The first heat dissipation device 140a can conduct the heat generated by the memory stick and the processor during operation to the outside of the shell 110, so as to realize heat dissipation of the memory stick and the processor. Among them, the processor can be a central processing unit (CPU).

[0051] It should be understood that the "top", "bottom", "left", "right", "front" and "back" mentioned in the electronic device 100 described in the present application are all relative to the direction shown in the drawings.Figure 3 The orientation shown is described as "top" toward the positive direction of the Z-axis, "bottom" toward the negative direction of the Z-axis, "left" toward the negative direction of the X-axis, "right" toward the positive direction of the X-axis, "front" toward the positive direction of the Y-axis, and "back" toward the negative direction of the Y-axis, which does not form a limitation on the second heat dissipation device 140b in the actual application scenario.

[0052] In this embodiment, the first heat dissipation device 140a includes a first heat sink 150 and a second heat sink 160. The first heat sink 150 is used for dissipating heat from the memory bank, and the second heat sink 160 is used for dissipating heat from the processor. The first heat sink 150 and the second heat sink 160 are both cold plates. It should be understood that a cold plate is a sealed heat sink that can accommodate liquid flow, which is usually attached to a heat generating device through a thermally conductive interface material to carry away the heat generated by the heat generating device. In other embodiments, the first heat sink 150 and / or the second heat sink 160 can also be other components that can dissipate heat, which is not specifically limited in the present application.

[0053] For example, there are four first heat sinks 150 and two second heat sinks 160. Each two first heat sinks 150 and one second heat sink 160 form a heat sink group (not marked in the figure). In other embodiments, the first heat sink 150 can also have one, two, three or more than five, and / or the second heat sink 160 can also have one or more than three.

[0054] The plurality of hard disks 120, the hard disk backboard 130, and the second heat dissipation device 140b are located on one side of the electronic device 100. In this embodiment, the second heat dissipation device 140b includes a plurality of heat conduction components 143 and a heat sink 142. Along the Y-axis direction, the plurality of heat conduction components 143 are arranged at intervals. Between two adjacent heat conduction components 143, a plug-in interface 144 is formed. Each plug-in interface 144 is used to plug in a hard disk 120. The heat sink 142 is connected with the plurality of heat conduction components 143. The heat sink 142 is a cold plate. The hard disk backboard 130 is located on the side of the heat sink 142 away from the first heat dissipation device 140a, and is arranged opposite to the plurality of plug-in interfaces 144. The plurality of hard disks 120 are plugged into the plurality of plug-in interfaces 144 one by one, and are electrically connected with the hard disk backboard 130.

[0055] The plurality of hard disks 120 can work according to the electrical signals provided by the hard disk backboard 130. The heat generated by each hard disk 120 during work can be transmitted to the heat sink 142 through two heat conduction components 143, and the heat sink 142 transmits the heat to the outside of the shell 110, thereby achieving heat dissipation of the plurality of hard disks 120, solving the heat dissipation problem of high-density and high-power hard disks 120 in the electronic device 100, and reducing the working load of the cooling fan (not shown) in the electronic device 100.

[0056] In some other embodiments, the electronic device 100 can also include one or more hard disks 120 and one or more virtual hard disks (not shown), which are plugged into the plurality of plug interfaces 144 one by one. It should be understood that the virtual hard disk is a component having the same external structure as the hard disk 120 but unable to work according to the electrical signals provided by the hard disk backplane 130.

[0057] Next, the flow path of the cooling medium in the electronic device 100 is described with reference to the cooling medium path shown in Figure 1

[0058] After the cooling medium such as cooling liquid or cooling gas enters the inside of the housing 110, it is divided into three paths. One path of the cooling medium directly enters the radiator 142 of the second heat dissipation device 140b, carries away the heat transferred to the radiator 142 through the plurality of heat conducting components 143, and flows out of the housing 110, thereby achieving heat dissipation for the plurality of hard disks 120. The other two paths of the cooling medium flow through two radiator groups respectively, and pass through the first radiator 150, the second radiator 160 and the first radiator 150 of the radiator groups in sequence, and flow out of the housing 110, thereby achieving heat dissipation for the memory bank and the processor.

[0059] It should be understood that in the present embodiment, the two radiator groups of the first heat dissipation device 140a and the radiator 142 of the second heat dissipation device 140b are arranged in parallel, and the three paths of the cooling medium flow through the two radiator groups and the radiator 142 of the second heat dissipation device 140b respectively, thereby maximizing the heat dissipation for the memory bank, the processor and the hard disks 120.

[0060] In some other embodiments, the two radiator groups of the first heat dissipation device 140a can also be arranged in series, at which time the cooling medium entering the inside of the housing 110 is divided into two paths of cooling medium, and the two paths of cooling medium flow through the first heat dissipation device 140a and the second heat dissipation device 140b respectively, thereby achieving heat dissipation for the memory bank, the processor and the hard disks 120. The present application does not specifically limit the connection mode of the two radiator groups in the first heat dissipation device 140a.

[0061] Please refer to Figure 1 and Figure 2 , Figure 2 is Figure 1 the structural schematic diagram of the hard disk 120 in the electronic device 100 shown in

[0062] ​In the embodiment, the hard disk 120 is cuboid. The hard disk 120 comprises a first contact surface 121, a second contact surface 122 and a connecting surface 123. The first contact surface 121 and the second contact surface 122 are oppositely arranged and respectively contact two heat conduction components 143 to increase the contact area between the hard disk 120 and the heat conduction components 143, quickly transfer the heat generated by the hard disk 120 to the two heat conduction components 143, improve the heat transfer efficiency between the hard disk 120 and the heat conduction components 143, and improve the heat dissipation performance of the second heat dissipation device 140b on the hard disk 120. The first contact surface 121 and the second contact surface 122 are parallel to the extension direction (the X-axis direction in the figure) of the hard disk 120, so as to ensure that the surface with the largest area of the hard disk 120 contacts the heat conduction components 143 and increase the contact area between the hard disk 120 and the heat conduction components 143. The connecting surface 123 is connected between the first contact surface 121 and the second contact surface 122 and is used to electrically connect the hard disk backboard 130, so as to realize the electrical connection between the hard disk 120 and the hard disk backboard 130.

[0063] Please refer to Figure 3 and Figure 4 , Figure 3 is Figure 1 the structure diagram of the second heat dissipation device 140b in the electronic equipment 100 shown in FIG. 1, Figure 4 is Figure 3 the exploded structure diagram of the second heat dissipation device 140b shown in FIG. 2. Among them, Figure 3 and Figure 4 only four heat conduction components 143 of the second heat dissipation device 140b are shown.

[0064] The second heat dissipation device 140b further comprises a shell 145, an inlet pipeline 146 and an outlet pipeline 147. The shell 145 is provided with a through slot (not marked in the figure), which accommodates the plurality of heat conduction components 143 to protect the plurality of heat conduction components 143. The inlet pipeline 146 and the outlet pipeline 147 are both in communication with the radiator 142. The inlet pipeline 146 inputs the cooling working medium outside the shell 110 (as shown in FIG. 3) to the radiator 142, and the outlet pipeline 147 outputs the cooling working medium from the radiator 142 to the outside of the shell 110, so as to transfer the heat to the outside of the shell 110 and realize the heat dissipation on the plurality of hard disks 120. Figure 1

[0065] ​The shell 145 comprises a first shell 148 and a second shell 149. The first shell 148 and the second shell 149 are fixedly connected with the plurality of heat-conducting components 143 and jointly enclose the through slot. The left end face of the first shell 148 and the left end face of the second shell 149 jointly enclose the first opening 145a, and the right end face of the second shell 149 and the right end face of the second shell 149 jointly enclose the second opening 145b. Exemplarily, the first shell 148 and the second shell 149 can be fixedly connected with the plurality of heat-conducting components 143 by screws or bolts and the like. In other embodiments, the first shell 148 and the second shell 149 can also be fixedly connected with the plurality of heat-conducting components 143 by welding or bonding and the like, which is not specifically limited in the present application.

[0066] The heat sink 142 is arranged at one side of the shell 145 and is spaced apart from the shell 145. Specifically, the heat sink 142 is located at the side of the second opening 145b away from the first opening 145a and is arranged opposite to the through slot. The heat sink 142 is provided with an insertion port 142a, a containing cavity (not shown), a liquid inlet 142b and a liquid outlet 142c. The opening of the insertion port 142a is located on the surface of the heat sink 142 facing the shell 145. Among them, the insertion port 142a has a plurality of insertion ports 142a, which are arranged in the Y-axis direction and are arranged opposite to the plurality of heat-conducting components 143. Exemplarily, the insertion port 142a has four insertion ports. In other embodiments, the insertion port 142a can also have one, two, three or more than five, which is not specifically limited in the present application.

[0067] The containing cavity is arranged in the interior of the heat sink 142 and is used for containing the cooling working medium. Among them, a plurality of heat dissipation fins can be arranged in the containing cavity to increase the heat dissipation efficiency of the heat sink 142. The liquid inlet 142b and the liquid outlet 142c are arranged in a spaced apart manner and are in communication with the containing cavity. Specifically, the openings of the liquid inlet 142b and the liquid outlet 142c are arranged on the side face of the heat sink 142. The liquid inlet pipe 146 is inserted into the liquid inlet 142b to input the cooling working medium outside the shell 110 from the liquid inlet 142b to the containing cavity. The liquid outlet pipe 147 is inserted into the liquid outlet 142c to output the cooling working medium in the containing cavity from the liquid outlet 142c to the outside of the shell 110.

[0068] Please refer to Figure 3 and Figure 5 , Figure 5 is Figure 3 the structural schematic view of the plurality of heat-conducting components 143 in the second heat dissipation device 140b.

[0069] The plurality of heat-conducting components 143 are arranged in the through slot, and the portions of the plurality of heat-conducting components 143 extending out of the through slot are connected with the heat sink 142. Specifically, in each heat-conducting component 143, a portion of the heat-conducting component 143 is located between the first opening 145a and the second opening 145b, and a portion of the heat-conducting component 143 extends out of the second opening 145b and is inserted into the insertion opening 142a and connected with the heat sink 142. The adjacent two heat-conducting components 143 form an insertion interface 144, and the plurality of insertion interfaces 144 are in communication with the first opening 145a and the second opening 145b. Each insertion opening 142a is used to insert a hard disk 120.

[0070] It should be noted that the plurality of heat-conducting components 143 can adopt one or more of the following heat-conducting components 143. The plurality of heat-conducting components 143 can be the same or different. Next, the different structures of the heat-conducting components 143 will be described in detail.

[0071] Please refer to Figure 6 and Figure 7 , Figure 6 is Figure 5 the structural schematic diagram of the heat-conducting component 143 in the first embodiment, Figure 7 is Figure 6 the exploded structural schematic diagram of the heat-conducting component 143.

[0072] In this embodiment, the heat-conducting component 143 extends along the X-axis direction. The heat-conducting component 143 includes a main body 10, a heat-conducting member 20, and a contact member 30, and the heat-conducting member 20 and the contact member 30 are both mounted on the main body 10.

[0073] The main body 10 includes a third contact surface 101 and a fourth contact surface 102, and the third contact surface 101 and the fourth contact surface 102 are arranged opposite to each other. The third contact surface 101 is a surface of the main body 10 facing the negative direction of the Y-axis, and the fourth contact surface 102 is a surface of the main body 10 facing the positive direction of the Y-axis. The main body 10 is provided with a first mounting groove 103 and a second mounting groove 104. The opening of the first mounting groove 103 is located on the third contact surface 101. The first mounting groove 103 is recessed from the third contact surface 101 to the fourth contact surface 102 (the positive direction of the Y-axis shown in the figure). The opening of the second mounting groove 104 is located on the groove bottom wall of the first mounting groove 103. The second mounting groove 104 is recessed from the groove bottom wall of the first mounting groove 103 to the fourth contact surface 102 (the positive direction of the Y-axis shown in the figure). The material of the main body 10 can be a heat-conducting material. For example, the material of the main body 10 is a metal material with high heat-conducting coefficient, such as copper or aluminum.

[0074] The heat conducting member 20 is located at one of the third contact surface 101 and the fourth contact surface 102. In this embodiment, the heat conducting member 20 is located at the third contact surface 101. Specifically, the heat conducting member 20 is installed in the second installation groove 104. The heat conducting member 20 comprises an auxiliary surface 201 which is parallel to the opening direction of the second installation groove 104. The auxiliary surface 201 is flush with the groove bottom wall of the first installation groove 103. The heat conducting member 20 can completely reuse the size of the main body 10 along the Y axis direction, which helps to reduce the size of the heat conducting assembly 143 along the Y axis direction.

[0075] In some other embodiments, the auxiliary surface 201 can also not be flush with the groove bottom wall of the first installation groove 103. For example, the auxiliary surface 201 can be recessed relative to the groove bottom wall of the first installation groove 103, or the auxiliary surface 201 can be protruded relative to the groove bottom wall of the first installation groove 103. The present application does not make specific limitations in this regard.

[0076] The heat conducting member 20 is a heat pipe to ensure high heat conducting performance of the heat conducting member 20. For example, the heat conducting member 20 can be installed in the second installation groove 104 by welding. It should be understood that the heat pipe is a heat transfer element with extremely high heat conducting performance, which transfers heat through evaporation and condensation of liquid in a fully sealed vacuum pipe. For example, the heat pipe is a long strip-shaped flat pipe made of copper. In some other embodiments, the heat conducting member 20 can also be other heat conducting members with high heat conducting performance, and the present application does not make specific limitations in this regard.

[0077] The contact member 30 is located at one of the third contact surface 101 and the fourth contact surface 102 where the heat conducting member 20 is located. In this embodiment, the contact member 30 is located at the third contact surface 101. Specifically, the contact member 30 is installed in the first installation groove 103 and contacts the auxiliary surface 201 of the heat conducting member 20. The contact member 30 is used to contact the hard disk 120 (as shown in the figure). Figure 2 At this time, the first contact surface 121 of the hard disk 120 is located at the side of the contact member 30 away from the main body 10 and contacts the contact member 30.

[0078] In this embodiment, the contact member 30 is a spring piece. For example, the contact member 30 is installed in the main body 10 by welding. The contact member 30 is made of heat conducting material. For example, the contact member 30 is made of beryllium copper or other materials with high heat conductivity.

[0079] Specifically, the contact member 30 comprises a main body portion 31 and a spring portion 32, and the spring portion 32 is fixedly connected to the main body portion 31. The spring portion 32 is used to contact the hard disk 120. The main body portion 31 is installed in the first installation slot 103 and contacts the auxiliary surface 201 of the heat conduction member 20. The main body portion 31 is provided with a plurality of installation holes 33, and each installation hole 33 penetrates the main body portion 31 along the thickness direction (Y-axis direction) of the main body portion 31. Along the extension direction (X-axis direction) of the main body portion 31, the plurality of installation holes 33 are arranged at intervals.

[0080] The spring portion 32 has a plurality of spring portions 32. Each spring portion 32 is fixedly connected to the left edge of one installation hole 33, extends along the positive direction of the X-axis, and is spaced apart from the right edge of the installation hole 33. Specifically, each spring portion 32 protrudes away from the surface of the heat conduction member 20 relative to the main body portion 31. Each spring portion 32 is in a wave shape to increase the elasticity of the spring portion 32. In addition, each spring portion 32 is provided with a plurality of through holes 34. Along the Z-axis direction, the plurality of through holes 34 are arranged at intervals. The extension direction of each through hole 34 is parallel to the extension direction of the spring portion 32 to increase the elasticity of the spring portion 32.

[0081] Please refer to Figure 2 and Figure 3 In the embodiment, the part of the main body 10 and the heat conduction member 20 that extends out of the second opening 145b is inserted into the insertion opening 142a and connected with the heat sink 142. Since the material of the main body 10 is a material with high thermal conductivity, the heat generated by the hard disk 120 during operation can be transmitted to the heat conduction member 20 and the main body 10 through the contact member 30, and then transmitted to the heat sink 142 through the heat conduction member 20 and the main body 10, thereby achieving heat dissipation of the hard disk 120.

[0082] In other embodiments, the heat conduction assembly 143 can also not include the contact member 30. At this time, the heat generated by the hard disk 120 during operation can be transmitted to the heat conduction member 20 and the main body 10, and then transmitted to the heat sink 142 through the heat conduction member 20 and the main body 10. Alternatively, when the hard disk is in contact with a surface without the heat conduction member 20, for example, the hard disk is in contact with the fourth contact surface 102, and the heat conduction member 20 is located at the third contact surface 101. At this time, the heat generated by the hard disk 120 during operation can be transmitted from the main body 10 to the heat conduction member 20, and then transmitted to the heat sink 142 through the heat conduction member 20 and the main body 10.

[0083] Alternatively, the main body 10 can be made of a non-thermal-conducting material, with the thermally conductive element 20 located on one of the third contact surfaces 101 and 102 facing the hard disk 120, and the contact element 30 located on one of the third contact surfaces 101 and 102 where the thermally conductive element 20 is located. In this case, the heat generated by the hard disk 120 during operation can be transferred to the thermally conductive element 20 via the contact element 30, and then to the heat sink 142 via the thermally conductive element 20, thus achieving heat dissipation for the hard disk 120.

[0084] Please see Figure 8a , Figure 8b , Figure 9a and Figure 9b , Figure 8a yes Figure 5 The schematic diagram shown is a structural diagram of the heat-conducting component 143 in the second embodiment. Figure 8b yes Figure 8a The diagram shown is a structural schematic of the heat-conducting component 143 from another angle. Figure 9a yes Figure 8a The exploded structural diagram of the heat-conducting component 143 shown is as follows. Figure 9b yes Figure 8b The exploded structural diagram of the heat-conducting component 143 is shown.

[0085] The heat-conducting assembly 143 includes a main body 10, a heat-conducting element 20, and a contact element 30, both of which are mounted on the main body 10. The difference between the heat-conducting assembly 143 shown in this embodiment and the heat-conducting assembly 143 shown in the first embodiment is that the contact element 30 and the heat-conducting element are located on different contact surfaces. For example, the opening of the first mounting groove 103 is located on the fourth contact surface 102. The first mounting groove 103 is recessed from the fourth contact surface 102 towards the third contact surface 101 (in the negative Y-axis direction shown in the figure). The opening of the second mounting groove 104 is located on the third contact surface 101. The second mounting groove 104 is recessed from the third contact surface 101 towards the fourth contact surface 102 (in the positive Y-axis direction shown in the figure). The structures of the main body 10, the heat-conducting element 20, and the contact element 30 of the heat-conducting assembly 143 are generally the same as those in the first embodiment, and will not be described again here.

[0086] Please refer to the following: Figure 2 and Figure 3In this embodiment, the part of the main body 10 and the heat conducting member 20 which extends out of the second opening 145b is inserted into the insertion opening 142a and connected with the heat sink 142. Similar to the first embodiment, the material of the main body 10 can be heat conducting material. When the hard disk 120 contacts with the side having the contact member, the heat generated by the hard disk 120 during operation can be transferred to the main body 10 through the contact member 30, then to the heat conducting member 20 through the main body 10, and finally to the heat sink 142 through the main body 10 and the heat conducting member 20, so as to achieve the heat dissipation of the hard disk 120. When the hard disk 120 contacts with the side having the heat conducting member, the heat generated by the hard disk 120 during operation can be transferred to the main body 10 through the heat conducting member 20, then to the contact member 30 through the main body 10, and finally to the heat sink 142 through the main body 10 and the heat conducting member 20, so as to achieve the heat dissipation of the hard disk 120.

[0087] Alternatively, the material of the main body 10 can also be non-heat conducting material, the heat conducting member 20 is located in one of the third contact surface 101 and the fourth contact surface 102 which faces the hard disk 120, and the contact member 30 is located in the other contact surface. At this time, the heat generated by the hard disk 120 during operation can be transferred to the heat sink 142 through the heat conducting member 20, so as to achieve the heat dissipation of the hard disk 120.

[0088] Please refer to Figure 10a 、 Figure 10b 、 Figure 11a and Figure 11b , Figure 10a is Figure 5 the structure schematic diagram of the heat conducting assembly 143 in the third embodiment, Figure 10b is Figure 10a the structure schematic diagram of the heat conducting assembly 143 in another angle, Figure 11a is Figure 10a the exploded structure schematic diagram of the heat conducting assembly 143, Figure 11b is Figure 10b the exploded structure schematic diagram of the heat conducting assembly 143.

[0089] The heat conducting assembly 143 comprises a main body 10, a heat conducting member 20 and two contact members 30, and the heat conducting member 20 and the contact members 30 are installed on the main body 10. The difference between the heat conducting assembly 143 in this embodiment and the heat conducting assembly 143 in the first embodiment is that the contact members 30 are two, which are the first contact member 31 and the second contact member 32, and the first contact member 31 is located in the third contact surface 101 and the second contact member 32 is located in the fourth contact surface 102. The structure of the main body 10, the heat conducting member 20 and the contact members 30 of the heat conducting assembly 143 is basically the same as that of the main body 10, the heat conducting member 20 and the contact members 30 in the first embodiment, and will not be described here.

[0090] Further, the main body 10 is provided with a third mounting groove 105, and the opening of the third mounting groove 105 is located at the fourth contact surface 102. The third mounting groove 105 is recessed from the fourth contact surface 102 to the direction of the third contact surface 101 (the negative direction of the Y axis shown in the figure). The first contact member 31 is mounted in the first mounting groove 103 and contacts the auxiliary surface 201 of the heat conducting member 20. The second contact member 32 is mounted in the third mounting groove 105.

[0091] Please refer to Figure 2 and Figure 3 In this embodiment, the part of the main body 10 and the heat conducting member 20 that extends out of the second opening 145b is inserted into the insertion opening 142a and connected with the heat sink 142. Similar to the first embodiment, the material of the main body 10 can be a heat conducting material. When the hard disk 120 contacts the first contact member 31, the heat generated by the hard disk 120 during operation can be transferred to the main body 10 and the heat conducting member 20 through the first contact member 31, and then transferred to the heat sink 142 through the main body 10 and the heat conducting member 20, thereby achieving heat dissipation for the hard disk 120 located at the rear side of the heat conducting assembly 143. When the hard disk 120 contacts the second contact member 32, the heat generated by the hard disk 120 during operation can be transferred to the main body 10 through the second contact member 32, and then transferred to the heat sink 142 through the main body 10 and the heat conducting member 20, thereby achieving heat dissipation for the hard disk 120 located at the front side of the heat conducting assembly 143.

[0092] Alternatively, the material of the main body 10 can also be a non-heat conducting material. The heat conducting member 20 is located at at least one contact surface of the third contact surface 101 and the fourth contact surface 102 that faces the hard disk 120, and the contact member 30 is located at both the third contact surface 101 and the fourth contact surface 102. At this time, the heat generated by the hard disk 120 during operation can be transferred to the heat conducting member 20 through the contact member 30, and then transferred to the heat sink 142 through the heat conducting member 20, thereby achieving heat dissipation for the hard disk 120.

[0093] In some other embodiments, the heat conducting member 20 can also have two, which are a first heat conducting member and a second heat conducting member. The main body 10 can also be provided with a fourth mounting groove (not shown in the figure), the opening of which is located at the groove bottom wall of the third mounting groove 105. The fourth mounting groove is recessed from the groove bottom wall of the third mounting groove 105 towards the direction of the third contact surface 101 (the negative direction of the Y axis in the figure). The first heat conducting member is mounted in the second mounting groove 104, the second heat conducting member is mounted in the fourth mounting groove, the second contact member 32 is mounted in the third mounting groove 105 and contacts the second heat conducting member. At this time, when the hard disk 120 contacts the first contact member 31, the heat generated by the hard disk 120 during operation can be transferred to the first heat conducting member and the main body 10 through the first contact member 31, and can also be transferred to the second heat conducting member through the main body 10, and then transferred to the heat dissipating device 142 through the main body 10, the first heat conducting member and the second heat conducting member, thereby achieving heat dissipation of the hard disk 120. When the hard disk 120 contacts the second contact member 32, the heat generated by the hard disk 120 during operation can be transferred to the second heat conducting member and the main body 10 through the second contact member 32, and can also be transferred to the first heat conducting member through the main body 10, and then transferred to the heat dissipating device 142 through the main body 10, the first heat conducting member and the second heat conducting member, thereby achieving heat dissipation of the hard disk 120.

[0094] Alternatively, when the heat conducting member 20 can also have two, the heat conducting assembly 143 can not include the first contact member 31 or the second contact member 32.

[0095] It should be noted that when the heat conducting member 20 has two, since the two contact surfaces of the main body are provided with heat conducting members, the main body can be made of a heat conducting material or a non-heat conducting material, and the hard disk 120 can contact any one of the contact surfaces of the heat conducting assembly.

[0096] In summary, the heat conducting assembly 143 can include a main body and at least one heat conducting member, wherein the main body includes a third contact surface and a fourth contact surface arranged oppositely, the part of the main body and the heat conducting member extending out of the second opening 145b are inserted into the insertion opening 142a and connected with the heat dissipating device 142.

[0097] When the material of the main body is a heat conducting material, the heat conducting member is located at at least one of the third contact surface and the fourth contact surface, and the heat conducting member is connected with the heat dissipating device. Exemplarily, the heat conducting member can be a heat pipe. The heat conducting assembly can also include at least one contact member, which is located at at least one of the third contact surface and the fourth contact surface:

[0098] When the contact member is located at the contact surface where the heat conducting member exists, the contact member is located at the side of the heat conducting member away from the main body and contacts the heat conducting member; or when the contact member is located at the contact surface where the heat conducting member does not exist, the contact member directly contacts the main body. Exemplarily, the contact member can be a reed.

[0099] When the main body material is not a heat-conductive material, the heat-conductive member is located at at least one of the third contact surface and the fourth contact surface facing the hard disk, and the heat-conductive member is connected with the heat sink. Exemplarily, the heat-conductive member can be a heat pipe. The heat-conductive assembly can further include at least one contact member located at at least one of the third contact surface and the fourth contact surface where the heat-conductive member is located; wherein the contact member is located at a side of the heat-conductive member away from the main body and in contact with the heat-conductive member. Exemplarily, the contact member can be a spring piece.

[0100] Referring to Figure 5 In the embodiment, the plurality of heat-conductive assemblies 143 include two first heat-conductive assemblies 143a and at least one second heat-conductive assembly 143b. It should be understood that the division of the first heat-conductive assemblies 143a and the second heat-conductive assemblies 143b is based on the location of each heat-conductive assembly 143. The two first heat-conductive assemblies 143a are the outermost heat-conductive assemblies 143, and the second heat-conductive assemblies 143b are the heat-conductive assemblies 143 located in the middle and between the two first heat-conductive assemblies 143a.

[0101] Specifically, the two first heat-conductive assemblies 143a have the same structure. The two first heat-conductive assemblies 143a are a first front heat-conductive assembly 143c and a first rear heat-conductive assembly 143d. The first front heat-conductive assembly 143c is the frontmost heat-conductive assembly 143, and the first rear heat-conductive assembly 143d is the rearmost heat-conductive assembly 143. The first front heat-conductive assembly 143c adopts the structure of the heat-conductive assembly 143 shown in the first embodiment, and the heat-conductive member is arranged in the direction facing the hard disk, i.e., arranged rearward. The first rear heat-conductive assembly 143d also adopts the structure of the heat-conductive assembly 143 shown in the first embodiment, and the heat-conductive member is arranged in the direction facing the hard disk, i.e., arranged forward. The second heat-conductive assembly 143b adopts the structure of the heat-conductive assembly 143 shown in the third embodiment.

[0102] It can be understood that in other embodiments, the first front heat-conductive assembly 143c can also adopt the structure of the heat-conductive assembly 143 shown in the second embodiment or the third embodiment, and / or the first rear heat-conductive assembly 143d can also adopt the structure of the heat-conductive assembly 143 shown in the first embodiment or the third embodiment, and / or the second heat-conductive assembly 143b can also adopt the structure of the heat-conductive assembly 143 shown in the first embodiment or the second embodiment.

[0103] Exemplarily, the heat conducting components 143 are two. The two first heat conducting components 143a and the two second heat conducting components 143b are inserted into the four insertion openings 142a of the heat sink 142 respectively from the parts protruding towards the second opening 145b, and are connected with the heat sink 142, so as to realize the connection between the multiple heat conducting components 143 and the heat sink 142. In other embodiments, the second heat conducting components 143b can also be one or more than three, which is not specifically limited in the present application.

[0104] Please refer to Figure 2 and Figure 12 , Figure 12 is Figure 1 the assembly structure schematic diagram of the multiple hard disks 120, the hard disk back plate 130 and the second heat dissipation device 140b in the electronic device 100.

[0105] The hard disk back plate 130 is located between the heat sink 142 and the shell 145, and is spaced apart from the heat sink 142 and the shell 145. The hard disk back plate 130 is provided with a avoiding space (not shown in the figure), which penetrates through the hard disk back plate 130 along the thickness direction (X-axis direction shown in the figure) of the hard disk back plate 130. Specifically, the parts of the multiple heat conducting components 143 protruding towards the second opening 145b are arranged in the avoiding space. The hard disk back plate 130 is a circuit board.

[0106] The multiple hard disks 120 are inserted into the multiple insertion openings 144 from the first opening 145a, and protrude towards the second opening 145b and are electrically connected with the hard disk back plate 130. Specifically, the first contact surface 121 and the second contact surface 122 of the hard disk 120 respectively contact the contact pieces of the two adjacent heat conducting components 143, and the connecting surface 123 is electrically connected with the hard disk back plate 130. The hard disk 120 can work according to the electrical signal provided by the hard disk back plate 130 and generate heat. The heat of the hard disk 120 can be transmitted to the heat conducting components 143 through the first contact piece or the second contact piece, and then transmitted to the heat sink 142 through the heat conducting components 143, so as to realize effective heat dissipation of the hard disk 120.

[0107] The hard disk 120 located between the two heat conduction assemblies 143 has the first contact surface 121 in contact with the contact piece 30 of one heat conduction assembly 143 and the second contact surface 122 in contact with the contact piece 30 of the other heat conduction assembly 143. It should be noted that since the contact piece of the heat conduction assembly 143 is a spring piece, when the hard disk 120 is inserted into the insertion port 144, the hard disk 120 can be inserted and pulled out through the spring piece part 32a, and the effective contact area of the hard disk 120 and the heat conduction assembly 143 can be increased, so that the hard disk 120 and the heat conduction assembly 143 are in better contact, the heat of the hard disk 120 can be better transferred from the heat conduction assembly 143 to the heat dissipator 142, the effective heat dissipation of the hard disk 120 is realized, and the electronic equipment 100 can support the deployment of high-density hard disks 120 and can also realize the heat dissipation of high-power hard disks 120.

[0108] Please refer to Figure 13 , Figure 13 is a second heat dissipator 142 and a heat conduction assembly 143 assembly structure schematic diagram of a second heat dissipation device in a second electronic equipment provided by the embodiment of the present application. Wherein, Figure 1 The arrowed solid line shown in the figure is the flow path of the cooling working medium.

[0109] The heat dissipator of the heat dissipation device in the electronic equipment shown in the embodiment of the present application is different from the heat dissipator 142 of the heat dissipation device 140 in the electronic equipment 100 shown in the above embodiment, and the heat dissipator 142 is an immersion heat dissipator. Specifically, the insertion port 142a of the heat dissipator 142 is in communication with the accommodation cavity 142d. The accommodation cavity 142d of the heat dissipator 142 contains the cooling working medium. The liquid level of the cooling working medium is higher than the insertion port 142a. The liquid inlet 142b and the liquid outlet 142c of the heat dissipator 142 are both higher than the liquid level of the cooling working medium. The cooling working medium enters the accommodation cavity 142d from the liquid inlet 142b, and is output from the accommodation cavity 142d to the liquid outlet 142c, so as to realize the replacement of the cooling working medium in the accommodation cavity 142d.

[0110] One end of the heat conduction assembly 143 is inserted into the insertion port 142a and extends into the accommodation cavity 142d and is immersed in the cooling working medium. The heat generated by the hard disk 120 during operation is transmitted to the cooling working medium through the heat conduction assembly 143, and the heat is transmitted to the outside through the replacement of the cooling working medium, so as to realize the heat dissipation of the hard disk 120.

[0111] In the embodiment, the heat generated by the hard disk 120 during operation can be transmitted to the heat conduction component 143 through the first contact surface 121 and the second contact surface 122, and then transmitted to the heat sink 142 through the heat conduction component 143, so as to effectively improve the heat conduction efficiency between the heat dissipation device 140 and the hard disk 120, improve the heat dissipation performance of the heat dissipation device 140 on the hard disk 120, realize effective heat dissipation of the hard disk 120, and enable the electronic device 100 to support high-density hard disk 120 deployment and realize heat dissipation of high-power hard disk 120 at the same time.

[0112] The above description is merely specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which shall be covered within the protection scope of the present application; in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device comprises a heat sink and a plurality of heat conduction assemblies, the heat conduction assembly comprises a main body, at least one heat conduction piece and at least one contact piece, the main body comprises a third contact surface and a fourth contact surface arranged oppositely, the main body is provided with a first mounting groove and a second mounting groove, the opening of the first mounting groove is located at the third contact surface, the first mounting groove is recessed from the third contact surface to the fourth contact surface, the opening of the second mounting groove is located at the bottom wall of the first mounting groove, the second mounting groove is recessed from the bottom wall of the first mounting groove to the fourth contact surface, the contact piece is mounted in the first mounting groove, and the heat conduction piece is mounted in the second mounting groove, and the heat conduction piece is connected with the heat sink. The plurality of heat conduction assemblies are arranged at intervals, and an insertion interface is formed between two adjacent heat conduction assemblies, the insertion interface is used for inserting a hard disk, and the hard disk comprises a first contact surface and a second contact surface arranged oppositely, and the first contact surface and the second contact surface are in contact with two adjacent heat conduction assemblies respectively.

2. The heat dissipating device according to claim 1, wherein The main body material is a heat-conducting material.

3. The heat dissipating device of claim 2, wherein, The heat conduction piece is a heat pipe.

4. The heat dissipating device according to claim 2 or 3, characterized in that When the contact piece is present on the contact surface of the heat conduction piece, the contact piece is located on the side of the heat conduction piece away from the main body and in contact with the heat conduction piece; or When the contact piece is not present on the contact surface of the heat conduction piece, the contact piece is directly in contact with the main body.

5. The heat dissipating device of claim 1, wherein The main body material is not a heat-conducting material.

6. The heat dissipating device according to claim 5, wherein The heat conduction piece is a heat pipe.

7. The heat dissipating device according to claim 5 or 6, characterized in that The contact piece is located on the side of the heat conduction piece away from the main body and in contact with the heat conduction piece.

8. The heat dissipating device of claim 4, wherein, The contact piece is a reed.

9. The heat dissipating device of claim 7, wherein, The contact piece is a reed.

10. The heat dissipating device according to any one of claims 1 to 3, 5, 6, 8 and 9, characterized in that, The heat dissipation device further comprises a shell, the shell is provided with a through groove, the heat sink is arranged on one side of the shell and opposite to the through groove, and the plurality of heat conduction assemblies are arranged in the through groove, and the parts of the plurality of heat conduction assemblies extending out of the through groove are connected with the heat sink.

11. The heat dissipating device of claim 4, wherein, The heat dissipation device further comprises a shell, the shell is provided with a through groove, the heat sink is arranged on one side of the shell and opposite to the through groove, and the plurality of heat conduction assemblies are arranged in the through groove, and the parts of the plurality of heat conduction assemblies extending out of the through groove are connected with the heat sink.

12. The heat dissipating device of claim 7, wherein, The heat dissipation device further comprises a shell, the shell is provided with a through groove, the heat sink is arranged on one side of the shell and opposite to the through groove, and the plurality of heat conduction assemblies are arranged in the through groove, and the parts of the plurality of heat conduction assemblies extending out of the through groove are connected with the heat sink.

13. The heat dissipating device according to any one of claims 1 to 3, 5, 6, 8, 9, 11 and 12, characterized in that, The heat sink is a cold plate.

14. The heat dissipating device of claim 4, wherein, The heat sink is a cold plate.

15. The heat dissipating device of claim 7, wherein, The heat sink is a cold plate.

16. The heat dissipating device of claim 10, wherein, The heat sink is a cold plate.

17. The heat dissipating device according to any one of claims 1 to 3, 5, 6, 8, 9, 11 and 12, characterized by, The heat sink is provided with a containing cavity and a plurality of insertion openings, the containing cavity contains a cooling working medium, the plurality of insertion openings are in communication with the containing cavity, one end of each heat conduction assembly is inserted into one insertion opening and extends into the containing cavity and is soaked in the cooling working medium.

18. The heat dissipating device of claim 4, wherein, The heat sink is provided with a containing cavity and a plurality of insertion ports, the containing cavity contains cooling working medium, the insertion ports are communicated with the containing cavity, one end of each heat conducting component is inserted into one insertion port and extends into the containing cavity and is soaked in the cooling working medium.

19. The heat dissipating device of claim 7, wherein, The heat sink is provided with a containing cavity and a plurality of insertion ports, the containing cavity contains cooling working medium, the insertion ports are communicated with the containing cavity, one end of each heat conducting component is inserted into one insertion port and extends into the containing cavity and is soaked in the cooling working medium.

20. The heat dissipating device of claim 10, wherein, The heat sink is provided with a containing cavity and a plurality of insertion ports, the containing cavity contains cooling working medium, the insertion ports are communicated with the containing cavity, one end of each heat conducting component is inserted into one insertion port and extends into the containing cavity and is soaked in the cooling working medium.

21. An electronic device, comprising: The electronic equipment comprises at least one hard disk and the heat sink as claimed in any one of claims 1 to 20, each hard disk is inserted into one insertion port.

22. The electronic device of claim 21, wherein, The electronic equipment further comprises a hard disk back plate, the hard disk back plate is located on the side of the heat sink facing the plurality of heat conducting components and is electrically connected with the at least one hard disk.

23. The electronic device of claim 22, wherein, The hard disk back plate is provided with a avoiding space, the avoiding space penetrates the hard disk back plate along the thickness direction of the hard disk back plate, and the plurality of heat conducting components are arranged in the avoiding space.

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