Single-wafer wet processing apparatus and abnormality processing method

Abstract

The present application provides a single wafer wet process abnormality processing method, comprising the following steps: providing a wafer, an arm and a light receiving unit, the arm is connected to an actuating motor and is provided with a nozzle and a light turning element, the actuating motor can rotate between a plurality of circumferential positions to drive the arm to swing horizontally, a reference angle interval is defined among the circumferential positions, the actuating motor is located in the reference angle interval when the nozzle is located at the center of the wafer, and the light turning element is located at a trigger position; projecting a light beam from a predetermined position to the trigger position; swinging the arm, and receiving the light beam from the light turning element by the light receiving unit when the light turning element passes through the trigger position; and if the circumferential position of the actuating motor when the light receiving unit measures the light beam is out of the reference angle interval, then shutting off the nozzle and flushing the wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to wafer processing, in particular, a single wafer wet processing device and an abnormality processing method thereof. BACKGROUND

[0002] The existing wafer processing procedure includes multiple steps of immersing in chemical solution, spraying chemical solution, rinsing and drying. In single wafer processing, a nozzle can be moved above a wafer by an arm to spray etching chemical solution. Generally, when the arm is not in operation, a sensor is provided at a standby position of the arm, and the sensor can be used to detect whether the arm is deviated. Once the arm is deviated, the processing is interrupted.

[0003] The foregoing structure cannot detect the deviation of the arm during the processing. The deviation of the arm that occurs after the arm starts to operate must be detected after the arm returns to the standby position after the processing is completed. This makes the wafer unable to continue to be used and needs to be discarded. Therefore, the detection mechanism of the existing single wafer wet processing device often cannot save the wafer being processed when the arm is deviated.

[0004] Therefore, the present application person has the improvement target of solving the above-mentioned problems by the earnest research and the application of the theory. SUMMARY

[0005] The present application provides a single wafer wet processing device and an abnormality processing method thereof, which can detect the deviation of a mechanism during the processing to further interrupt the processing and recover the wafer.

[0006] The present application provides an abnormality processing method of single wafer wet processing, which includes the following steps: providing a wafer, an arm and a light receiving unit, an actuating motor connected to the arm, the arm provided with a nozzle, a light turning element and the actuating motor, the actuating motor having multiple circumferential positions with equal angular intervals, the actuating motor being able to rotate between the circumferential positions to drive the arm to swing horizontally, wherein a reference angle interval is defined among the circumferential positions, the actuating motor is located in the reference angle interval when the nozzle is located above the center of the wafer, and the light turning element is located at a trigger position above the center of the wafer; projecting a light beam to the trigger position from a predetermined position; swinging the arm, and receiving the light beam from the light turning element by the light receiving unit when the light turning element passes through the trigger position; comparing the circumferential position of the actuating motor when the light beam is detected by the light receiving unit with the reference angle interval; and shutting off the nozzle and rinsing the wafer when the circumferential position of the actuating motor exceeds the reference angle interval.

[0007] In an embodiment, the light beam is turned by the light turning element. The predetermined position is located directly above the center of the wafer. The light beam from the light turning element is received by the light receiving unit at the predetermined position.

[0008] In an embodiment, the light beam is refracted by the light turning element to turn the light beam.

[0009] In an embodiment, a light emitting unit is provided, and the light beam is projected by the light emitting unit.

[0010] In an embodiment, a light transceiver is provided, the light transceiver is disposed at a predetermined position, and the light transceiver includes a light emitting unit and a light receiving unit.

[0011] The present application also provides a single-wafer wet processing device, which includes a wafer carrier, an arm, a light emitting unit, a light receiving unit, an emergency flushing assembly, and a controller. The arm is pivotally arranged at one side of the wafer carrier and can horizontally swing to above the wafer carrier. The arm is provided with a nozzle and a light turning element. When the nozzle is located above the center of the wafer carrier, the light turning element is located at a trigger position. The arm is provided with an actuating motor, which has a plurality of circumferential positions with equal angular intervals. The actuating motor can rotate between the circumferential positions to drive the arm to swing. A reference angular interval is defined among the circumferential positions. When the light turning element is located at the trigger position, the actuating motor is located within the reference angular interval. The light emitting unit is disposed at a predetermined position and is arranged towards the trigger position to project a light beam towards the trigger position. The light receiving unit is disposed correspondingly to the light emitting unit. When the light turning element is located at the trigger position, the light turning element can turn the light beam to project to the light receiving unit. The emergency flushing assembly is arranged correspondingly to the wafer carrier. The controller is electrically connected to the light receiving unit, the actuating motor, and the flushing assembly.

[0012] In an embodiment, the nozzle and the light turning element are arranged on the same vertical line.

[0013] In an embodiment, the light receiving unit is located at the predetermined position.

[0014] In an embodiment, the light turning element is a mirror. The light turning element is arranged upwards, and the normal direction of the light turning element is arranged vertically.

[0015] In an embodiment, the light turning element is a lens.

[0016] In an embodiment, the abnormality processing device further includes a light transceiver, which is disposed at a predetermined position and includes a light emitting unit and a light receiving unit.

[0017] In an embodiment, a plurality of arms are provided. The arms are arranged correspondingly to the wafer carrier and can horizontally swing to above the wafer carrier, respectively. When the nozzle of any arm is located above the center of the wafer carrier, the light turning element on the arm is located at the trigger position.

[0018] In an embodiment, the emergency flushing assembly is arranged at one side of the wafer carrier and is adjacent to the wafer carrier.

[0019] The single-wafer wet process apparatus and anomaly handling method of the present invention can determine whether the component has shifted when the light-directing element passes the trigger position during the process. Once a shift occurs, the process can be interrupted immediately and the process solution on the wafer can be cleaned. The recovered wafer is then reused in the process depending on the degree of surface damage. During the process, the light-directing element frequently passes the trigger position, so component shift can be detected in real time, thereby reducing the amount of wafer scrap caused by component shift. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of the single-wafer wet process apparatus of the present invention.

[0021] Figure 2 This is a top view of the single-wafer wet process apparatus of the present invention.

[0022] Figure 3 This is a top view of the single-wafer wet process apparatus of the present invention in use.

[0023] Figure 4 This is a three-dimensional schematic diagram of the actuator motor of the single-wafer wet process apparatus of the present invention.

[0024] Figure 5 This is a side view of the single-wafer wet process apparatus of the present invention in use.

[0025] Figure 6 and Figure 7 These are schematic diagrams illustrating other variations of the single-wafer wet process apparatus of the present invention.

[0026] Figure 8 This is a flowchart of the steps of the single-wafer wet process anomaly handling method of the present invention.

[0027] Figure 9 This is a schematic diagram of the single-wafer wet process apparatus of the present invention for rinsing wafers.

[0028] In the attached figures, the following labels are used:

[0029] 10: Wafer

[0030] 100: Wafer stage

[0031] 110: Gripper

[0032] 200 / 200a: Swing arm

[0033] 201: Radial Reference Line

[0034] 202: Reference Angle Range

[0035] 203: Circumferential Position

[0036] 210 / 210a: nozzle

[0037] 220 / 220a / 220b: light turning element

[0038] 230: actuating motor

[0039] 231: drive shaft

[0040] 300: optical transceiver

[0041] 310: light emitting unit

[0042] 320: light receiving unit

[0043] 400: emergency rinsing assembly

[0044] P1: trigger position

[0045] P2: predetermined position

[0046] a-e: steps DETAILED DESCRIPTION

[0047] The present application is described in detail below with reference to the accompanying drawings and specific examples, but is not limited to the same.

[0048] Referring to Figures 1 to 5 The present application provides a single wafer 10 wet process device, which at least comprises a wafer carrier 100, at least one swing arm 200, a light emitting unit 310, a light receiving unit 320, an emergency rinsing assembly 400 and a controller (not shown in the figure).

[0049] In this embodiment, the wafer carrier 100 is used to carry a single wafer 10, and the wafer carrier 100 has a plurality of clamping jaws 110 to clamp the edge of the wafer 10 so that the center of the wafer 10 is aligned with the center of the wafer carrier 100.

[0050] The swing arm 200 is pivotally arranged on one side of the wafer carrier 100 and can swing horizontally to the upper side of the wafer carrier 100. There can be a plurality of swing arms 200, and the end of at least one swing arm 200 is provided with a nozzle 210 and a light turning element 220. When the nozzle 210 is located above the center of the wafer carrier 100, the light turning element 220 is located at a trigger position P1, and the swing arm 200 is provided with an actuating motor 230. Generally speaking, the swing arm 200 for spraying etching liquid with the nozzle 210 is provided with the light turning element 220; the swing arm 200a for spraying cleaning liquid with the nozzle 210a can be without the light turning element 220.

[0051] Referring to Figure 4The actuating motor 230 has a plurality of circumferential positions 203 with equal angular interval, and the actuating motor 230 can rotate between the circumferential positions 203 to drive the swing arm 200 to swing. In the embodiment, a radial reference line 201 can be defined by the driving shaft 231 of the actuating motor 230, and the angle of the specific radial reference line 201 indicates the circumferential position 203. A reference angle interval 202 is defined among the circumferential positions 203, and when the light turning element 220 is located at the trigger position P1, the actuating motor 230 is located within the reference angle interval 202, i.e. the radial reference line 201 is located within the reference angle interval 202. The reference angle interval 202 is slightly extended forward and backward from the circumferential position 203 of the actuating motor 230 when the light turning element 220 stops at the trigger position P1, so as to compensate the time difference caused by the fast movement of the swing arm 200.

[0052] Referring to Figure 1 and Figure 5 The light emitting unit 310 is arranged at a predetermined position P2 and is configured to face the trigger position P1 to project a light beam toward the trigger position P1. The light receiving unit 320 is arranged correspondingly to the light emitting unit 310, and when the light turning element 220 is located at the trigger position P1, the light turning element 220 can turn the light beam to project to the light receiving unit 320.

[0053] Referring to Figures 1 to 3 In the embodiment, a plurality of swing arms 200 can be arranged to spray etching liquid, and the configurations of the swing arms 200 are substantially the same. The swing arms 200 are arranged correspondingly to the wafer table 100 to be able to swing horizontally to the upper side of the wafer table 100 respectively. When the nozzle 210 of any swing arm 200 is located above the center of the wafer table 100, the light turning element 220 on the swing arm 200 is located at the trigger position P1.

[0054] In the embodiment, as shown in Figure 5 The light turning element 220 is a mirror, and specifically, the function of the mirror can be achieved by a reflective sticker, or the local surface of the swing arm 200 can be polished to be a mirror surface. In the embodiment, the light turning element 220 is arranged horizontally upward. The nozzle 210 and the light turning element 220 are arranged on the same vertical line, and the light receiving unit 320 is located at the predetermined position P2. Specifically, the abnormality processing device shown in the embodiment further includes a light transceiver 300, and the light transceiver 300 is arranged at the predetermined position P2, and the light emitting unit 310 and the light receiving unit 320 are integrated into the light transceiver 300.

[0055] The emergency rinsing assembly 400 is configured to supply water to the wafer stage 100 to rinse the wafer 10 mounted on the wafer stage 100. In this embodiment, the emergency rinsing assembly 400 is configured on one side of the wafer stage 100 and adjacent to the wafer stage 100.

[0056] The controller is electrically connected to the light receiving unit 320, the actuation motor 230, and the emergency flushing assembly 400. This invention is not limited to the form of the controller; generally, it can be implemented by executing corresponding control software on a computer, or by executing the control program on a custom circuit board. The controller can read the switching signal of the light receiving unit 320. The light receiving unit 320 is normally closed (OFF), and the controller detects an ON signal when the light receiving unit 320 detects a light beam. The controller can compare the circumferential position 203 of the actuation motor 230 when the light receiving unit 320 detects a light beam with a reference angle range 202. Figure 9 As shown, when the circumferential position 203 of the actuator motor 230 exceeds the reference angle range 202, the controller can immediately shut off the nozzle 210 and start the emergency flushing assembly 400 to flush the wafer 10.

[0057] See Figure 6 The light-directing element 220a can be a reflector. The light-directing element 220a is tilted, and the light-receiving unit 320 is separately configured from the light-emitting unit 310 and is not located at the predetermined position P2. When the light-emitting unit 310 projects a light beam toward the trigger position P1, the light-directing element 220a can reflect and redirect the light beam to be projected onto the light-receiving unit 320.

[0058] See Figure 7 The light steering element 220b can be a lens, and the light receiving unit 320 is separately configured from the light emitting unit 310 and is not located at the predetermined position P2. When the light emitting unit 310 projects a light beam toward the trigger position P1, the light steering element 220b can refract and redirect the light beam to project it onto the light receiving unit 320.

[0059] See Figure 8 This invention provides a method for handling anomalies in a single-wafer 10-wet process, which is applied to the aforementioned single-wafer 10-wet process apparatus. In this embodiment, the method for handling anomalies in a single-wafer 10-wet process of this invention includes the steps described below.

[0060] See Figures 1 to 3 and Figure 8 First, in step a, the aforementioned single wafer 10 wet process apparatus is provided, thus providing a swing arm 200 and a light receiving unit 320, and a wafer 10 is carried on a wafer stage 100 for wet processing.

[0061] See Figure 1 and Figure 5In the aforementioned single-wafer 10 wet process apparatus, at least one swing arm 200 is provided with a nozzle 210 for spraying etching solution, a light-directing element 220, and an actuating motor 230. In this embodiment, the nozzle 210 and the light-directing element 220 are arranged on the same vertical line, but the present invention is not limited thereto.

[0062] See Figures 2 to 4 The actuation motor 230 has a plurality of circumferential positions 203 arranged at equal angular intervals along the circumferential direction. The actuation motor 230 is capable of rotating between the circumferential positions 203 to drive the swing arm 200 to swing horizontally. A reference angle interval 202 is defined within the circumferential positions 203 of the actuation motor 230. The reference angle interval 202 is defined as the actuation motor 230 being located within the reference angle interval 202 when the nozzle 210 is located above the center of the wafer 10.

[0063] See Figure 1 and Figure 8 Following step a, in step b, a light beam is projected from a predetermined position P2 to a trigger position P1. Specifically, in this step, the light beam is projected using the light emitting unit 310. In this embodiment, both the predetermined position P2 and the trigger position P1 are located directly above the center of the wafer 10, and the predetermined position P2 is directly above the trigger position P1. However, this invention is not limited thereto. Figures 6 to 7 The corresponding text also provides various pre-selected location P2 configurations.

[0064] See Figure 2 , Figure 3 , Figure 5 and Figure 8 Following step b, in step c, the swing arm 200 is swung. When the light-directing element 220 passes the trigger position P1, the light receiving unit 320 receives the light beam from the light-directing element 220. In this step, the light-directing element 220 reflects the light beam to redirect it. Here, the light-directing element 220 is in the form of a mirror, but the invention is not limited to this; other methods may also be used. Figure 7 The light beam is deflected by a lens-shaped light-directing element 220b.

[0065] In this embodiment, the light receiving unit 320 receives the light beam from the light steering element 220 at a predetermined position P2. Specifically, an optical transceiver 300 including a light emitting unit 310 and a light receiving unit 320 is provided at the predetermined position P2. However, the present invention is not limited thereto, and the light receiving unit 320 may also be configured as follows: Figure 6 and Figure 7 The light emitting unit 310 is configured separately from the light emitting unit and is not located at the predetermined position P2.

[0066] See Figures 4 to 5 and Figure 8Following step c, in step d, the circumferential position 203 of the actuator motor 230 when the light beam is measured by the light receiving unit 320 is compared with the reference angle range 202. In this embodiment, the comparison is performed by a controller electrically connected to the light receiving unit 320 and the actuator motor 230.

[0067] See Figure 8 and Figure 9 Following step d, in step e, when the circumferential position 203 of the actuation motor 230 exceeds the reference angle range 202, the nozzle 210 is shut off and the wafer 10 is rinsed. In this embodiment, the controller can be further electrically connected to the emergency rinsing assembly 400 adjacent to the wafer stage 100. When the circumferential position 203 of the actuation motor 230 exceeds the reference angle range 202, the controller can immediately shut off the nozzle 210 and activate the emergency rinsing assembly 400 to rinse the wafer 10.

[0068] The single-wafer 10 wet process apparatus and anomaly handling method of the present invention can determine whether the component has shifted when the light-directing element 220 passes the trigger position P1 during the process. Once a shift occurs, the process can be interrupted immediately and the process solution on the wafer 10 can be cleaned. The recovered wafer 10 is then reused in the process depending on the degree of surface damage. During the process, the light-directing element 220 frequently passes the trigger position P1, so component shift can be determined in real time, thereby reducing the amount of wafer 10 scrap caused by component shift.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the patent scope of the present invention. Other equivalent variations that utilize the patent spirit of the present invention should all fall within the patent scope of the present invention.

Claims

1. A method for handling anomalies in a single-wafer wet process, characterized in that, Include: a) Provides a wafer, a swing arm, a nozzle, and a light receiving unit. The swing arm is provided with a nozzle, a light deflecting element, and an actuating motor. The actuating motor is connected to the swing arm and has a plurality of circumferential positions arranged at equal angular intervals along the circumferential direction. The actuating motor is capable of rotating between these circumferential positions to drive the swing arm to swing horizontally. A reference angle range is defined among these circumferential positions. When the light deflecting element is located at a trigger position above the center of the wafer, the actuating motor is located within the reference angle range. b) Projecting a beam of light from a predetermined position to the trigger position; c) Swing the arm so that when the light-directing element passes the trigger position, the light-receiving unit receives the light beam from the light-directing element; d) Compare the circumferential position of the actuation motor when the light beam is measured by the light receiving unit with the reference angle range; and e) When the circumferential position of the actuator motor in step d exceeds the reference angle range, the nozzle is turned off and the wafer is rinsed.

2. The method for handling anomalies in a single-wafer wet process as described in claim 1, characterized in that, In step c, the light beam is redirected by reflecting it with the light-directing element.

3. The method for handling anomalies in a single-wafer wet process as described in claim 2, characterized in that, The designated position is located directly above the center of the wafer.

4. The anomaly handling method for single-wafer wet processing as described in claim 3, characterized in that, In step c, the light receiving unit receives the light beam from the light steering element at the predetermined position.

5. The method for handling anomalies in a single-wafer wet process as described in claim 1, characterized in that, In step c, the light beam is refracted by the light-directing element to redirect the light beam.

6. The method for handling anomalies in a single-wafer wet process as described in claim 1, characterized in that, In step a, a light emitting unit is provided, and in step c, the light beam is projected using the light emitting unit.

7. The method for handling anomalies in a single-wafer wet process as described in claim 6, characterized in that, Step a provides an optical transceiver, which is set at the predetermined location and includes an optical transmitting unit and an optical receiving unit.

8. A single-wafer wet processing apparatus, characterized in that, Include: A wafer carrier; A swing arm is pivotally mounted on one side of the wafer stage and can swing horizontally to above the wafer stage. The end of the swing arm is provided with a nozzle and a light-directing element. When the nozzle is above the center of the wafer stage, the light-directing element is in a trigger position. The swing arm is provided with an actuating motor. The actuating motor has multiple circumferential positions arranged at equal angular intervals along the circumference. The actuating motor can rotate between these circumferential positions to drive the swing arm to swing. A reference angle range is defined among these circumferential positions. When the light-directing element is in the trigger position, the actuating motor is located within the reference angle range. A light emitting unit is disposed at a predetermined position and configured toward the trigger position so as to project a light beam toward the trigger position; A light receiving unit is provided corresponding to the light emitting unit. When the light deflecting element is in the trigger position, the light deflecting element can deflect the light beam and project it onto the light receiving unit. An emergency flushing assembly, corresponding to the wafer stage configuration; and A controller is electrically connected to the light receiving unit, the actuation motor, and the rinsing assembly.

9. The single-wafer wet processing apparatus as described in claim 8, characterized in that, The nozzle and the light-directing element are arranged on the same vertical line.

10. The single-wafer wet processing apparatus as described in claim 8, characterized in that, The optical receiving unit is located at the predetermined position.

11. The single-wafer wet processing apparatus as described in claim 8, characterized in that, The light-directing element is a reflector.

12. The single-wafer wet processing apparatus as described in claim 11, characterized in that, The light steering element is configured to face upwards and its normal direction is vertically aligned.

13. The single-wafer wet processing apparatus as described in claim 8, characterized in that, The light-directing element is a lens.

14. The single-wafer wet processing apparatus as described in claim 8, characterized in that, It also includes an optical transceiver, which is disposed at the predetermined location, and the optical transceiver includes the optical transmitting unit and the optical receiving unit.

15. The single-wafer wet processing apparatus as described in claim 8, characterized in that, There are multiple swing arms, which are configured to swing horizontally above the wafer stage. When the nozzle of any swing arm is above the center of the wafer stage, the light-directing element on the swing arm is in the trigger position.

16. The single-wafer wet processing apparatus as described in claim 8, characterized in that, The emergency flushing assembly is located on one side of the wafer stage and adjacent to the wafer stage.

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