A method and device for manufacturing a PTC thermistor used in large energy storage equipment

Abstract

The present application discloses a method and device for manufacturing a PTC thermistor used in large-scale energy storage equipment, which relates to the field of semiconductor technology and is applied to sintering equipment. The sintering equipment is provided with a plurality of temperature sensors in an array in accordance with a preset arrangement. The method includes: obtaining the temperature parameter setting requirements of each process stage; when sintering, obtaining the temperature data collected by each temperature sensor; judging whether the change trend of the temperature data obtained by the plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirements; and adjusting the operation of the current process stage according to the matching situation. By providing a plurality of temperature sensors in an array, a more macroscopic perception of the temperature change trend in the sintering equipment can be achieved, and the working conditions of the sintering equipment can be effectively judged both overall and locally, and then the operation can be adjusted in an appropriate manner to achieve precise control of the temperature during the process.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method and device for manufacturing a PTC thermistor used in large energy storage equipment. Background Art

[0002] Large-scale energy storage equipment usually needs to face high current charging and discharging processes, which may cause excessive current under abnormal conditions, thereby damaging the equipment. PTC thermistors play an important role in large-scale energy storage equipment and are used for overcurrent protection, temperature measurement and control, and overcharge protection to ensure the safety and stability of the equipment. Compared with ordinary PTC thermistors, large-scale energy storage equipment requires PTC thermistors with higher stability, wider temperature range, higher precision and higher resistance to ensure the operating stability and safety of the equipment.

[0003] The production process of PTC thermistors involves multiple links and factors. The four key factors affecting their quality are raw material selection, heating temperature and time, contact and packaging, and detection and screening. Among them, sintering is an important process step in the production process of PTC thermistors. The purpose of sintering is to allow the sensitive material particles to combine and diffuse to form dense grain boundaries and electronic conduction channels. Through sintering, not only can the conductivity of the resistor film be improved, but it can also have higher thermal shock resistance and mechanical strength. In addition, sintering can also adjust the crystal structure and morphology of the resistor material, and further optimize the resistance characteristics and temperature response. In the sintering process of PTC thermistors, temperature is a key parameter, which directly affects the sintering effect and product performance.

[0004] Therefore, in order to improve the product quality of PTC thermistors, how to provide a more accurate temperature control method in the process of manufacturing PTC thermistors for large energy storage devices is a problem that needs to be solved urgently. Summary of the invention

[0005] In order to solve the above problems, the present application provides a method and device for manufacturing a PTC thermistor for large energy storage equipment.

[0006] In a first aspect, the present application provides a method for manufacturing a PTC thermistor for use in a large energy storage device, which is applied to a sintering device, wherein a plurality of temperature sensors are arranged in an array in a preset arrangement manner in the sintering device, and the method comprises:

[0007] Obtain the temperature parameter setting requirements for each process stage;

[0008] When sintering is performed, temperature data collected by each temperature sensor is obtained;

[0009] Determine whether a change trend of temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement;

[0010] Adjust the operation of the current process stage according to the matching situation.

[0011] Optionally, the step of determining whether a change trend of temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement includes:

[0012] When the temperature in the sintering device is adjusted according to the temperature parameter setting requirements, determining the temperature adjustment trend;

[0013] Determine the theoretical change trend of temperature data based on the positional relationship between each temperature sensor and the heating module or cooling module in the sintering equipment;

[0014] The change trend of the simultaneously sampled temperature data acquired by the multiple temperature sensors is compared with the theoretical change trend to determine whether the two match.

[0015] Optionally, the step of determining whether a change trend of simultaneously sampled temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement specifically includes:

[0016] When the adjustment trend is to increase the temperature toward the target temperature, the theoretical increasing trend of the temperature data is obtained according to the positional relationship between each temperature sensor and the temperature increasing module;

[0017] Comparing the variation trend of the simultaneously sampled temperature data actually obtained with the theoretical rising trend;

[0018] If the changing trend of the simultaneously sampled temperature data lags behind the theoretical rising trend, or the changing trend is different from the theoretical rising trend, it is determined that the two do not match.

[0019] Optionally, the step of determining whether a change trend of simultaneously sampled temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement specifically includes:

[0020] When the adjustment trend is to keep the target temperature constant, determine whether there is a temperature sensor with abnormal temperature fluctuation;

[0021] If it appears, it is considered a mismatch.

[0022] Optionally, the step of determining whether a change trend of simultaneously sampled temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement specifically includes:

[0023] When the adjustment trend is to cool down to the target temperature, the theoretical downward trend of the temperature data is obtained according to the positional relationship between each temperature sensor and the cooling module;

[0024] Comparing the variation trend of the simultaneously sampled temperature data actually obtained with the theoretical downward trend;

[0025] If the change trend of the simultaneously sampled temperature data is delayed from the theoretical downward trend, or the change trend is different from the theoretical downward trend, it is determined that the two do not match.

[0026] Optionally, the step of adjusting the operation of the current process stage according to the matching situation includes:

[0027] When the changing trend of the simultaneously sampled temperature data is delayed from the theoretical rising trend or the changing trend of the simultaneously sampled temperature data is delayed from the theoretical falling trend, the temperature is adjusted by increasing the output power of the heating module or the cooling module.

[0028] Optionally, the step of adjusting the operation of the current process stage according to the matching situation includes:

[0029] When the change trend is different from the theoretical rising trend or the change trend is different from the theoretical falling trend, determining the temperature sensor causing the change trend to be mismatched;

[0030] Depending on the position of the temperature sensor, check whether the sintering equipment is functioning normally.

[0031] In a second aspect, the present application provides a PTC thermistor manufacturing device for large energy storage equipment, which is applied to a sintering device, wherein a plurality of temperature sensors are arranged in an array in a preset arrangement manner in the sintering device, and the device comprises:

[0032] A parameter acquisition unit, used to obtain the temperature parameter setting requirements of each process stage;

[0033] A data acquisition unit, used to obtain temperature data collected by various temperature sensors during sintering;

[0034] A data matching unit, used to determine whether a change trend of temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement;

[0035] The operation adjustment unit is used to adjust the operation of the current process stage according to the matching situation.

[0036] In a third aspect, the present application provides an electronic device, including:

[0037] one or more processors;

[0038] Memory;

[0039] One or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs are configured to execute the method as described in the first aspect.

[0040] In a fourth aspect, the present application provides a computer-readable storage medium, in which a program code is stored. The program code can be called by a processor to execute the method described in the first aspect.

[0041] In summary, this application includes the following beneficial technical effects:

[0042] During the sintering process, multiple temperature sensors arranged in an array can achieve a more macroscopic perception of the temperature change trend in the sintering equipment, and effectively judge the working conditions of the sintering equipment both overall and locally, and then take appropriate measures to adjust the operation and achieve precise control of the temperature during the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a method flow chart of a method for manufacturing a PTC thermistor applied to large energy storage equipment provided in an embodiment of the present application.

[0044] Figure 2 It is a functional module block diagram of a PTC thermistor manufacturing device for large energy storage equipment provided in an embodiment of the present application.

[0045] Figure 3 The present invention is a structural block diagram of an electronic device for executing a method for manufacturing a PTC thermistor for large energy storage devices according to an embodiment of the present application.

[0046] Figure 4 It is a structural block diagram of a computer-readable storage medium for storing or carrying program codes for implementing a method for manufacturing a PTC thermistor applied to a large energy storage device according to an embodiment of the present application.

[0047] Reference numerals:

[0048] Parameter acquisition unit 110; data acquisition unit 120; data matching unit 130; operation adjustment unit 140; electronic device 300; processor 310; memory 320; computer readable storage medium 400; program code 410. DETAILED DESCRIPTION

[0049] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0050] In the description of the embodiments of the present application, words such as "illustrative", "for example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "illustrative", "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "illustrative", "for example" or "for example" is intended to present related concepts in a specific way.

[0051] In the description of the embodiments of the present application, unless otherwise stated, the meaning of the term "multiple" refers to two or more. For example, multiple systems refer to two or more systems, and multiple screen terminals refer to two or more screen terminals. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0052] The production process of PTC thermistors involves multiple links and factors. The four key factors affecting their quality are raw material selection, heating temperature and time, contact and packaging, and detection and screening. Among them, sintering is an important process step in the production process of PTC thermistors. The purpose of sintering is to allow the sensitive material particles to combine and diffuse to form dense grain boundaries and electronic conduction channels. Through sintering, not only can the conductivity of the resistor film be improved, but it can also have higher thermal shock resistance and mechanical strength. In addition, sintering can also adjust the crystal structure and morphology of the resistor material, and further optimize the resistance characteristics and temperature response. In the sintering process of PTC thermistors, temperature is a key parameter, which directly affects the sintering effect and product performance.

[0053] Therefore, in order to improve the product quality of PTC thermistors, how to provide a more accurate temperature control method in the process of manufacturing PTC thermistors for large energy storage devices is a problem that needs to be solved urgently.

[0054] In order to solve the above problems, an embodiment of the present invention provides a method and device for manufacturing a PTC thermistor for large-scale energy storage equipment, which is applied to sintering equipment. In the production process of PTC thermistors, the sintering equipment commonly used in the sintering process is a sintering furnace or a hot press. The sintering equipment can achieve the control of conditions such as high temperature, high pressure and controllable atmosphere, so sensors for sensing various environmental parameters are arranged inside. In an embodiment of the present application, in order to better monitor the temperature, a plurality of temperature sensors are arranged in an array in the sintering equipment according to a preset arrangement. The specific array method can be reasonably set according to factors such as material properties, process requirements and product specifications. It can be evenly arranged for the internal space of the sintering equipment, or it can be focused on a specific area, such as around the sintering material, or near the heating module.

[0055] In the internal space of the sintering equipment, when the local temperature changes, the temperature data detected by the sensors at different points of change from the central point of change gradually change in sequence. According to the trend and gradient of the data change, the temperature change in the internal space of the sintering equipment can be better perceived, and then better adjusted, so that the entire sintering process can achieve better results and improve product quality. The following will explain in detail how to monitor and adjust the temperature through specific embodiments.

[0056] like Figure 1 As shown, a method for manufacturing a PTC thermistor provided by an embodiment of the present invention is applied to a sintering device, wherein a plurality of temperature sensors are arranged in an array in a preset arrangement manner in the sintering device, and the method comprises:

[0057] Step S101, obtaining the temperature parameter setting requirements for each process stage.

[0058] For different sintering materials, material weights and process effects, the process stages and specific temperature parameter setting requirements for each stage are different during sintering. Before performing specific operations, it is necessary to obtain the temperature parameter setting requirements for each process stage to be executed, and then in subsequent operations, control the temperature in the sintering equipment in different process stages according to the temperature parameter setting requirements.

[0059] Step S102, when sintering, obtain the temperature data collected by each temperature sensor.

[0060] The temperature sensors are arranged in an array in a preset manner in the sintering equipment. Depending on the specific type, model, and internal space size of the sintering equipment, the arrangement of the sensors may also be different.

[0061] As a preferred embodiment, generally, a temperature sensor with a higher density is arranged at a position where the temperature has a greater impact on the sintering material.

[0062] During sintering, the temperature changes at each stage of the process are monitored in real time through the various temperature sensors that are set up, and sampling is performed at reasonable sampling intervals to obtain temperature data at corresponding spatial positions.

[0063] Step S103, determining whether a change trend of temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement.

[0064] The entire sintering process can be divided into several different stages, and the temperature parameter settings for each stage may also be different. According to the temperature parameter setting requirements for different stages, the temperature data obtained by multiple temperature sensors are actually collected and integrated to obtain the change trend of the temperature data.

[0065] The temperature changes gradually, and as the temperature of the center of change changes, the temperature of other spatial positions will also change in a gradient according to the distance from the center of change. By matching the change trends of multiple temperature sensors set adjacent to each other with the temperature parameter setting requirements, it can be determined whether the temperature in the sintering equipment changes toward the target as expected. When matching, it is necessary to pay attention to information in two dimensions, one is whether the change trend is reasonable, and the other is whether the result of the change can meet the temperature parameter setting requirements. Only when the information in these two dimensions is normal, it means that the current process is proceeding in the preset manner, otherwise reasonable adjustments are required.

[0066] For each process stage of sintering, there are three types according to the temperature parameter setting requirements: heating stage, temperature maintenance stage, and cooling stage. For different stages, other environmental parameters are also required to cooperate, such as pressure control, atmosphere control, etc. When adjusting the temperature at each stage, in addition to considering the temperature control itself, the impact of other factors on the temperature should also be considered to achieve a more accurate control effect.

[0067] As a preferred implementation of the embodiment of the present invention, when the change trend of the temperature data acquired by the multiple temperature sensors arranged adjacently matches the temperature parameter setting requirement, the method specifically includes the following steps:

[0068] 1. When the temperature in the sintering equipment is adjusted according to the temperature parameter setting requirements, determining the temperature adjustment trend;

[0069] 2. Determine the theoretical change trend of temperature data based on the positional relationship between each temperature sensor and the heating module or cooling module in the sintering equipment;

[0070] 3. Compare the change trend of the simultaneously sampled temperature data acquired by multiple temperature sensors with the theoretical change trend to determine whether the two match.

[0071] For each stage, first determine the temperature adjustment trend during the stage according to the initial state and temperature parameter setting requirements of the stage, whether it is rising, falling or maintaining. On this basis, determine the theoretical change trend of the temperature data of each temperature sensor according to the power of the heating module or cooling module itself in the sintering equipment, the size of the space in the sintering equipment, and the positional relationship between each temperature sensor and the heating module or cooling module in the sintering equipment. Because as the heating module or cooling module works, the temperature change of the internal space must be based on the heating module or cooling module as the starting point or center, and the gradient changes. Therefore, according to the different positional relationships, there is a certain delay in the theoretical change trend of the temperature data of each temperature sensor. At the same time, for different stages, due to different initial states and temperature parameter setting requirements, the way to judge whether it matches is also different. The following will be specifically explained for different types of process stages.

[0072] In the heating stage, the adjustment trend is to heat up to the target temperature. At this time, the theoretical rising trend of the temperature data is obtained according to the positional relationship between each temperature sensor and the heating module. In the entire process, multiple heating stages may occur, and the required time, starting temperature, and target temperature of each heating stage may be different. Therefore, it is necessary to determine the theoretical rising trend of the temperature data of each temperature sensor according to these conditions. The change trend of the actually obtained simultaneous sampling temperature data is compared with the theoretical rising trend. In theory, the temperature rise time point monitored by the temperature sensor closer to the heating module is also earlier. At the same time, according to the pressure and atmosphere settings in this stage, based on the heat conduction mode, the temperature monitored by the temperature sensor closer to other positions will also gradually rise, showing a certain change trend delay, but with the continuous operation of the heating module, the temperature in the entire internal space is finally balanced. On this basis, it is judged whether the change trend of the actually obtained simultaneous sampling temperature data matches the above-mentioned theoretical rising trend. The match is judged from two dimensions. One is the rising trend of the temperature monitored by each temperature sensor, that is, the changing trend of the temperature rising curve is delayed from the theoretical rising trend. For example, the temperature data of the temperature sensor at a certain location, theoretically, can detect the temperature starting to rise 10 seconds after the heating module is started, and then it is actually found that the temperature rise is detected at this location 30 seconds after the start, which indicates that there is a mismatch; another situation is that after the temperature starts to rise, theoretically, the temperature can reach the target temperature after 300 seconds, and the entire temperature rise process is carried out at a fixed temperature change rate. However, the actual situation is that the temperature rise range after 100 seconds does not reach one-third of the theoretical rise, which also indicates that there is a mismatch. Another dimension of judgment is that the overall change trend of multiple sensors is different from the theoretical rising trend, and the temperature data at different locations do not change in a gradient manner according to the distance from the heating module. For example, the shape of a certain heating module is a rectangle. The temperature data at the position above the corresponding position of the rectangle and at the same length from the heating module should start to detect the rise at the same time point after the heating module is started. Then, the rise of the temperature data at some positions is actually detected with a time delay, indicating that there is a mismatch. Another situation is that one or several temperature sensors far away from the heating module detect the temperature rise before the temperature sensors close to the heating module. These are all indications of mismatch. Through the above method, not only can the mismatch be discovered, but also the specific location causing the mismatch can be located according to the gradient change law of the temperature data of multiple adjacent temperature sensors, which is convenient for subsequent control and adjustment.

[0073] For the cooling stage, the judgment logic is the same as that of the heating stage, and the main difference lies in the detection of the temperature drop. When the adjustment trend is to cool down to the target temperature, the theoretical downward trend of the temperature data is obtained according to the positional relationship between each temperature sensor and the cooling module; the change trend of the simultaneously sampled temperature data actually obtained is compared with the theoretical downward trend; if the change trend of the simultaneously sampled temperature data is delayed from the theoretical downward trend, or the change trend is different from the theoretical downward trend, it is judged that the two do not match. It should be noted that in some processes, the cooling stage is processed passively, that is, the temperature is not lowered by a special cooling module, but by stopping heating and waiting for automatic cooling by heat dissipation through the physical structure. In this case, the gradient trend of the temperature drop of multiple sensors is related to the distance from the sensor to the outside world, or the distance from the sensor to the heat dissipation structure.

[0074] For the temperature maintenance stage, the adjustment trend is to keep the target temperature constant near the temperature parameter setting requirements. At this stage, the main thing is to determine whether there are temperature sensors with abnormal temperature fluctuations. If so, it is determined to be mismatched. There are many cases of abnormal temperature fluctuations. One is that the overall temperature in the sintering equipment fluctuates, resulting in failure to meet the basic requirements of the sintering process. In this case, the temperature data of basically all temperature sensors will show obvious changes, and the location of the problem can be determined based on the gradient of the temperature change. Another situation is local temperature. The temperature data of a part of the number of temperature sensors fluctuates beyond the safe range. The location and scope of influence can be determined by the gradient direction of the temperature sensor where the temperature change occurs (that is, the temperature data of the temperature sensors at which positions have changed with the same trend). For the second situation, it may occur in several different areas at the same time, and the fluctuation method may also be different.

[0075] Step S104, adjusting the operation of the current process stage according to the matching situation.

[0076] In response to the above-mentioned mismatches in different stages, dimensions and situations, corresponding operations need to be taken to achieve accurate temperature control.

[0077] Based on the strategy of taking countermeasures, the specific corresponding operations can be divided into two categories. One is for the change trend of the sampled temperature data delayed from the theoretical rising trend or the change trend of the sampled temperature data delayed from the theoretical falling trend. The corresponding situation of this operation is caused by the insufficient working efficiency of the heating module or the cooling module. The corresponding specific operation is to increase the output power of the heating module or the cooling module to adjust the temperature. The other is for when the change trend is different from the theoretical rising trend or the change trend is different from the theoretical falling trend. The corresponding situation of this operation is that the function of the sintering equipment is abnormal, such as the failure of the heating module or the cooling module, the structural damage of the sintering equipment, or the sudden change of other environmental parameters. The corresponding specific operation adopted is to determine the specific location of the abnormality according to the relationship between the position where the multiple temperature sensors are set and the gradient change of the temperature data, check whether the function of the sintering equipment at the corresponding position is normal, and adopt appropriate countermeasures according to the results of the inspection. For example, temporarily shelving without processing, increasing or reducing the output power of the heating module or the cooling module, adjusting the position of the material to an area with relatively normal temperature, etc.

[0078] Through the above-mentioned whole process, the detailed monitoring and adjustment of the temperature conditions in the sintering equipment during the sintering process is realized, which makes the temperature control of the whole process more precise and improves the product quality of the process.

[0079] like Figure 2 As shown, the PTC thermistor manufacturing device for large energy storage equipment provided by the embodiment of the present invention is applied to a sintering device, wherein a plurality of temperature sensors are arranged in an array in a preset arrangement manner in the sintering device, and the device comprises:

[0080] A parameter acquisition unit 110, used to acquire temperature parameter setting requirements for each process stage;

[0081] The data acquisition unit 120 is used to obtain temperature data collected by each temperature sensor during sintering;

[0082] A data matching unit 130 is used to determine whether a change trend of temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement;

[0083] The operation adjustment unit 140 is used to adjust the operation of the current process stage according to the matching situation.

[0084] The PTC thermistor manufacturing device for large-scale energy storage equipment provided in the embodiment of the present invention is used to implement the above-mentioned PTC thermistor manufacturing method for large-scale energy storage equipment. Therefore, the specific implementation method is the same as the above-mentioned method and will not be repeated here.

[0085] like Figure 3 As shown, a structural block diagram of an electronic device 300 provided in an embodiment of the present invention. The electronic device 300 may be an electronic device 300 capable of running applications, such as a smart phone, a tablet computer, an e-book, etc. The electronic device 300 in the present application may include one or more of the following components: a processor 310, a memory 320, and one or more applications, wherein the one or more applications may be stored in the memory 320 and configured to be executed by one or more processors 310, and the one or more programs are configured to execute the method described in the aforementioned method embodiment.

[0086] The processor 310 may include one or more processing cores. The processor 310 uses various interfaces and lines to connect various parts of the entire electronic device 300, and executes various functions and processes data of the electronic device 300 by running or executing instructions, programs, code sets or instruction sets stored in the memory 320, and calling data stored in the memory 320. Optionally, the processor 310 can be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), and programmable logic array (PLA). The processor 310 can integrate one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), and a modem. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing display content; and the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 310, but may be implemented separately through a communication chip.

[0087] The memory 320 may include a random access memory (RAM) or a read-only memory (ROM). The memory 320 may be used to store instructions, programs, codes, code sets or instruction sets. The memory 320 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the following various method embodiments, etc. The data storage area may also store data created by the terminal during use (such as a phone book, audio and video data, chat record data), etc.

[0088] like Figure 4 FIG. 4 is a block diagram of a computer-readable storage medium 400 provided in an embodiment of the present invention. The computer-readable storage medium stores program code 410, which can be called by a processor to execute the method described in the above method embodiment.

[0089] The computer-readable storage medium 400 may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read-only memory), an EPROM, a hard disk, or a ROM. Optionally, the computer-readable storage medium 400 includes a non-transitory computer-readable storage medium. The computer-readable storage medium 400 has storage space for program codes 410 for executing any method steps in the above method. These program codes 410 may be read from or written to one or more computer program products. The program codes 410 may be compressed, for example, in a suitable form.

[0090] In summary, the PTC thermistor manufacturing method and device for large-scale energy storage equipment provided in the embodiments of the present invention can achieve a more macroscopic perception of the temperature change trend in the sintering equipment through a plurality of temperature sensors arranged in an array, and can effectively judge the working conditions of the sintering equipment both overall and locally, and then take appropriate measures to adjust the operation, thereby achieving precise control of the temperature during the process.

[0091] In several embodiments disclosed in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and a module, a program segment or a part of the code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0092] In addition, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0093] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0094] The above is only an exemplary embodiment of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and the truth of practice, those skilled in the art will easily think of other embodiments of the present disclosure.

[0095] This application is intended to cover any variation, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art not described in the present disclosure. The description and examples are to be regarded as exemplary only, and the scope and spirit of the present disclosure are defined by the claims.

Claims

1. A method for manufacturing a PTC thermistor for large energy storage equipment, characterized in that: Applied to a sintering device, a plurality of temperature sensors are arranged in an array in a preset arrangement manner in the sintering device, and the method comprises: Obtain the temperature parameter setting requirements for each process stage; When sintering is performed, temperature data collected by each temperature sensor is obtained; Determine whether a change trend of temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement; Adjust the operation of the current process stage according to the matching situation; The step of determining whether the change trend of the temperature data acquired by the plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement comprises: When the temperature in the sintering equipment is adjusted according to the temperature parameter setting requirements, determining the temperature adjustment trend; wherein the temperature adjustment trend includes rising, falling or maintaining; Determine the theoretical change trend of temperature data based on the positional relationship between each temperature sensor and the heating module or cooling module in the sintering equipment; Comparing the change trend of the simultaneously sampled temperature data acquired by the multiple temperature sensors with the theoretical change trend to determine whether the two match; The step of determining whether a change trend of simultaneously sampled temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement specifically includes: When the adjustment trend is to increase the temperature toward the target temperature, the theoretical increasing trend of the temperature data is obtained according to the positional relationship between each temperature sensor and the temperature increasing module; Comparing the variation trend of the simultaneously sampled temperature data actually obtained with the theoretical rising trend; If the change trend of the simultaneously sampled temperature data is delayed from the theoretical rising trend, or the change trend is different from the theoretical rising trend, it is determined that the two do not match; The step of determining whether a change trend of simultaneously sampled temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement specifically includes: When the adjustment trend is to keep the target temperature constant, determine whether there is a temperature sensor with abnormal temperature fluctuation; If it appears, it is judged as a mismatch; The step of determining whether a change trend of simultaneously sampled temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement specifically includes: When the adjustment trend is to cool down to the target temperature, the theoretical downward trend of the temperature data is obtained according to the positional relationship between each temperature sensor and the cooling module; Comparing the variation trend of the simultaneously sampled temperature data actually obtained with the theoretical downward trend; If the change trend of the simultaneously sampled temperature data is delayed from the theoretical downward trend, or the change trend is different from the theoretical downward trend, it is determined that the two do not match.

2. The method for manufacturing a PTC thermistor according to claim 1, characterized in that: The step of adjusting the operation of the current process stage according to the matching situation includes: When the change trend of the simultaneously sampled temperature data is delayed from the theoretical rising trend or the change trend of the simultaneously sampled temperature data is delayed from the theoretical falling trend, the temperature is adjusted by increasing the output power of the heating module or the cooling module.

3. The method for manufacturing a PTC thermistor according to claim 2, characterized in that: The step of adjusting the operation of the current process stage according to the matching situation includes: When the change trend is different from the theoretical rising trend or the change trend is different from the theoretical falling trend, determining the temperature sensor causing the change trend to be mismatched; Depending on the position of the temperature sensor, check whether the sintering equipment is functioning normally.

4. A PTC thermistor manufacturing device for large energy storage equipment, characterized in that: Applied to a sintering device, used to perform the PTC thermistor manufacturing method according to any one of claims 1 to 3, wherein a plurality of temperature sensors are arranged in an array in a preset arrangement manner in the sintering device, and the device comprises: A parameter acquisition unit, used to obtain the temperature parameter setting requirements of each process stage; A data acquisition unit, used to obtain temperature data collected by various temperature sensors during sintering; A data matching unit, used to determine whether a change trend of temperature data acquired by a plurality of adjacently arranged temperature sensors matches the temperature parameter setting requirement; The operation adjustment unit is used to adjust the operation of the current process stage according to the matching situation.

5. An electronic device, characterized in that: include: one or more processors; Memory; One or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs are configured to execute the method according to any one of claims 1 to 3.

6. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores program code, and the program code can be called by a processor to execute the method according to any one of claims 1 to 3.

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