A silicon wafer loading system and method

Abstract

The application discloses a silicon wafer loading system, which comprises a rack, a silicon wafer transfer mechanical arm, a carrier plate conveying device, a carrier plate positioning device and a lifting device, wherein the lifting device is arranged on the rack and is used to drive the carrier plate conveying device to lift, the carrier plate positioning device comprises a positioning seat, a carrier plate support plate, a plurality of moving mechanisms and a plurality of visual detection mechanisms, the positioning seat is arranged on the rack, the carrier plate support plate is connected with the positioning seat through the moving mechanisms, the plurality of moving mechanisms are arranged at intervals around the center of the carrier plate support plate, each moving mechanism comprises a horizontal moving assembly and a vertical moving assembly, a carrier plate fixing assembly is arranged on the carrier plate support plate, and the plurality of visual detection mechanisms are arranged correspondingly with the moving mechanisms to detect the moving position of the carrier plate, and the silicon wafer transfer mechanical arm is used to grab the silicon wafer and put it into the carrier plate. The application also discloses a loading method. The application has the advantages of accurate positioning and improved silicon wafer yield.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer conveying, in particular to a silicon wafer feeding system and method. BACKGROUND

[0002] At present, the traditional silicon wafer feeding and feeding are generally to use a suction cup to adsorb the silicon wafer on the silicon wafer conveying line and then place the silicon wafer in the pocket of a carrier plate through a horizontal moving mechanism. With the improvement of the production yield required, the gap between the pocket of the carrier plate and the silicon wafer is getting smaller and smaller, and whether the silicon wafer can be accurately placed in the pocket of the carrier plate determines the yield of the whole machine silicon wafer. The existing silicon wafer feeding system usually uses a mechanical arm to realize the feeding of the silicon wafer, and uses a mechanical positioning structure to position the carrier plate, for example, the carrier plate is conveyed to the top of a rotating platform, and the position of the carrier plate is adjusted through the rotating platform. These feeding devices have the following disadvantages: 1) if the size of the carrier plate is large, the rotating platform is arranged at the middle part of the carrier plate, and the positioning ability of the edge of the carrier plate is poor, the alignment and feeding precision of the silicon wafer and the edge pocket is low, and the silicon wafer cannot be accurately placed in the pocket of the carrier plate; 2) the movement steps of the mechanical arm are more, the cumulative error is increased, the positioning error of the existing mechanical positioning structure is large, and when the silicon wafer is placed in the pocket, the edge of the silicon wafer will be knocked and contacted, which affects the yield of the silicon wafer; 3) the middle part of the large-size carrier plate will be concave due to its own weight, which will affect the size of the pocket and the feeding of the silicon wafer. SUMMARY

[0003] The technical problem to be solved by the present application is to overcome the shortcomings of the prior art and provide a silicon wafer feeding system and method with accurate positioning and improved silicon wafer yield.

[0004] To solve the above technical problems, the present application adopts the following technical scheme:

[0005] A silicon wafer feeding system, comprising a rack, a silicon wafer transfer mechanical arm, a carrier plate conveying device, a carrier plate positioning device and a lifting device, the lifting device is arranged on the rack, the lifting device is used to drive the carrier plate conveying device to lift, so as to place the carrier plate on the carrier plate conveying device on the carrier plate positioning device for positioning, the carrier plate positioning device comprises a positioning seat, a carrier plate support plate, a plurality of moving mechanisms and a plurality of visual detection mechanisms, the positioning seat is arranged on the rack, the carrier plate support plate is connected with the positioning seat through the moving mechanism, a plurality of moving mechanisms are arranged at intervals around the center of the carrier plate support plate, and each moving mechanism comprises a horizontal moving assembly and a vertical moving assembly, the carrier plate support plate is provided with a carrier plate fixing assembly for fixing the carrier plate, a plurality of visual detection mechanisms are respectively arranged corresponding to each moving mechanism to detect the moving position of the carrier plate, and the silicon wafer transfer mechanical arm is used to grab the silicon wafer and place it in the carrier plate.

[0006] As a further improvement of the above technical scheme:

[0007] The moving mechanism is provided with four, four of which are arranged at the four corners of the carrier plate support plate, the horizontal moving assembly of two of the moving mechanisms on one diagonal is slidably arranged on the positioning seat, the vertical moving assembly is slidably arranged on the horizontal moving assembly, and at least one horizontal moving assembly is connected with a driving assembly; the vertical moving assembly of two of the moving mechanisms on the other diagonal is slidably arranged on the positioning seat, the horizontal moving assembly is slidably arranged on the vertical moving assembly, and at least one vertical moving assembly is connected with a driving assembly.

[0008] The driving assembly comprises a lead screw and a rotary motor for driving the lead screw to rotate, and the horizontal moving assembly and the vertical moving assembly are threadedly connected with corresponding lead screws.

[0009] The positioning seat is provided with a first position sensor at each moving mechanism, and the first position sensor is used to detect the moving position of the carrier plate.

[0010] The carrier plate conveying device comprises a double-output-shaft motor and two groups of oppositely arranged belt conveying mechanisms, and the two output shafts of the double-output-shaft motor are respectively connected with one group of belt conveying mechanisms.

[0011] The belt conveying mechanism comprises a mounting seat, a driving wheel assembly, a driven wheel assembly and a conveying belt, the driving wheel assembly comprises a driving wheel shaft and a driving wheel arranged on the driving wheel shaft, the driving wheel shaft is rotatably connected with a first mounting plate and a second mounting plate on the two sides of the driving wheel respectively, the first mounting plate and the second mounting plate are detachably connected with the mounting seat, the driving wheel shaft is connected with the output shaft through a shaft coupling, the driven wheel assembly comprises a driven wheel shaft and a driven wheel arranged on the driven wheel shaft, the driven wheel shaft is rotatably connected with a third mounting plate and a fourth mounting plate on the two sides of the driven wheel respectively, the third mounting plate and the fourth mounting plate are detachably connected with the mounting seat, the conveying belt is arranged on the driving wheel and the driven wheel, and the mounting seat is arranged on the lifting device.

[0012] The mounting seat is provided with a limiting assembly and a guiding assembly, the limiting assembly is used to limit the conveying position of the carrier plate, and the guiding assembly provides guidance for the conveying of the carrier plate.

[0013] The mounting seat is provided with a plurality of second position sensors, the carrier plate is provided with a sensing block for sensing the second position sensors, a plurality of second position sensors are arranged at intervals along the conveying direction of the conveying belt, and are electrically connected with the double-output-shaft motor.

[0014] The silicon wafer loading system further comprises a plurality of pressing assemblies for pressing the carrier plate, and the plurality of pressing assemblies are arranged at the four corners of the carrier plate respectively, the pressing assembly comprises a pressing plate and a lifting cylinder for driving the pressing plate to lift, and the lifting cylinder is arranged on the lifting device.

[0015] A silicon wafer loading method comprises the following steps:

[0016] S1, the silicon wafer transfer mechanical arm picks up the silicon wafer and transfers it to the above of the carrier plate positioning device;

[0017] S2, the carrier plate is input through the conveying device and is preliminarily positioned through the limiting component;

[0018] S3, the lifting device drives the conveying device and the pressing component to descend, so that the carrier plate falls on the carrier plate support plate of the carrier plate positioning device, and the carrier plate fixing component fixes the carrier plate on the carrier plate support plate;

[0019] S4, after the visual detection mechanism takes a photo and positions, the corresponding moving mechanism is driven to move horizontally and longitudinally through the lead screw, so that the carrier plate moves and rotates, and the visual detection mechanism is used for accurate positioning of the carrier plate, so that the carrier plate is located at the loading position of the silicon wafer;

[0020] S5, the four corners of the carrier plate are pressed through the pressing component, and then the silicon wafer transfer mechanical arm puts the silicon wafer into the carrier plate, and the loading starts.

[0021] Compared with the prior art, the beneficial effects of the present application are that:

[0022] The silicon wafer loading system disclosed by the present application is characterized in that a plurality of moving mechanisms are arranged at intervals around the center of the carrier plate support plate, each moving mechanism comprises a horizontal moving component and a longitudinal moving component, the whole moving and rotating of the carrier plate support plate are driven, the carrier plate is fixed through the carrier plate fixing component, the carrier plate can move and rotate with the carrier plate support plate, the plurality of moving mechanisms can provide better support and positioning effect compared with the single rotating platform arranged at the center position, the positioning effect of the edge of the large-size carrier plate is improved, the carrier plate can be accurately positioned to the loading position of the silicon wafer through cooperation with the visual detection mechanism, the silicon wafer can be accurately put into the pocket of the carrier plate, the knocking and contact between the silicon wafer and the pocket of the carrier plate are reduced, and the yield of the silicon wafer is improved.

[0023] The silicon wafer loading method disclosed by the present application is characterized in that a plurality of moving mechanisms are arranged, which can provide better support and positioning effect compared with the single rotating platform arranged at the center position, the positioning effect of the edge of the large-size carrier plate is improved, the carrier plate can be accurately positioned to the loading position of the silicon wafer through cooperation with the visual detection mechanism, the silicon wafer can be accurately put into the pocket of the carrier plate, the knocking and contact between the silicon wafer and the pocket of the carrier plate are reduced, and the yield of the silicon wafer is improved, and the four corners of the carrier plate are pressed by the pressing component when the silicon wafer is loaded, so that the middle part of the carrier plate is not depressed due to its own gravity after the silicon wafer is put in, the deformation of the pocket in the middle part of the carrier plate is reduced, and the yield of the silicon wafer is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the silicon wafer loading system.

[0025] Figure 2 Figure 1 is a schematic diagram of the three-dimensional structure of the carrier plate positioning device and the carrier plate support plate in the present application.

[0026] Figure 3 Figure 2 is an enlarged view of A in Figure 1. Figure 2

[0027] Figure 4 Figure 3 is a schematic diagram of the three-dimensional structure of the carrier plate positioning device in the present application.

[0028] Figure 5 Figure 4 is a schematic diagram of the three-dimensional structure of the carrier plate conveying device in the present application.

[0029] Figure 6 Figure 5 is an enlarged view of B in Figure 4. Figure 5

[0030] Figure 7 Figure 6 is an enlarged view of C in Figure 4. Figure 5

[0031] Figure 1 is a schematic diagram of the three-dimensional structure of the carrier plate positioning device and the carrier plate support plate in the present application.1, frame; 2, wafer transfer robot; 3, carrier plate conveying device; 31, double-output-shaft motor; 32, output shaft; 33, belt conveying mechanism; 331, mounting seat; 332, driving wheel assembly; 3321, driving wheel shaft; 3322, driving wheel; 3323, first mounting plate; 3324, second mounting plate; 333, driven wheel assembly; 3332, driven wheel; 3333, third mounting plate; 3334, fourth mounting plate; 334, conveying belt; 335, limiting assembly; 336, guiding assembly; 3361, guiding roller; 337, second position sensor; 34, shaft coupling; 4, carrier plate positioning device; 41, positioning seat; 411, first guide rail; 412, second guide rail; 42, carrier plate support plate; 43, moving mechanism; 431, horizontal moving assembly; 432, vertical moving assembly; 433, driving assembly; 4331, screw rod; 4332, rotary motor; 44, visual detection mechanism; 45, carrier plate fixing assembly; 451, baffle; 452, locking member; 453, locking roller; 46, first position sensor; 5, lifting device; 7, pressing assembly; 71, pressing plate; 72, lifting cylinder. DETAILED DESCRIPTION

[0032] The present application is further described in detail below in conjunction with the accompanying drawings and specific examples.

[0033] ​​In the description of the present application, it is to be understood by the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0034] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0035] In the present application, unless otherwise specifically defined and limited, the terms "assembly", "connection", "connection", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] Embodiment one

[0037] Figures 1 to 7 An embodiment of the present application is shown, the silicon wafer feeding system of the embodiment, including rack 1, silicon wafer transfer mechanical arm 2, carrier plate conveying device 3, carrier plate positioning device 4 and lifting device 5, lifting device 5 is arranged on rack 1, lifting device 5 is used to drive carrier plate conveying device 3 to lift, so as to put the carrier plate on carrier plate conveying device 3 to carrier plate positioning device 4 for positioning, carrier plate positioning device 4 includes positioning seat 41, carrier plate support plate 42, multiple moving mechanisms 43 and multiple visual detection mechanisms 44, positioning seat 41 is arranged on rack 1, carrier plate support plate 42 is connected with positioning seat 41 through moving mechanism 43, multiple moving mechanisms 43 are arranged at intervals around the center of carrier plate support plate 42, and each moving mechanism 43 includes horizontal moving assembly 431 and vertical moving assembly 432, carrier plate support plate 42 is provided with carrier plate fixing assembly 45 for fixing carrier plate, multiple visual detection mechanisms 44 are respectively arranged corresponding to each moving mechanism 43, so as to detect the moving position of carrier plate, silicon wafer transfer mechanical arm 2 is used to grab silicon wafer and put it into carrier plate.

[0038] The loading process of the silicon wafer loading system is as follows: the silicon wafer transfer robot 2 picks up the silicon wafer to a specified position above the carrier plate positioning device 4, then the carrier plate (not shown in the figure) is input by the carrier plate conveying device 3, after being input in place, the lifting device 5 drives the carrier plate conveying device 3 to descend, so that the carrier plate on the carrier plate conveying device 3 falls on the carrier plate support plate 42 of the carrier plate positioning device 4, the carrier plate fixing assembly 45 on the carrier plate support plate 42 fixes the carrier plate, after the visual detection mechanism 44 takes a photo and positions, the carrier plate support plate 42 and the carrier plate are moved and rotated by the horizontal movement and vertical movement of each movement mechanism 43, and the position of the carrier plate is detected by the visual detection mechanism 44, so that the carrier plate is accurately positioned to the loading position of the silicon wafer, for example, the visual detection mechanism 44 is signal connected with the movement mechanism 43, the movement and rotation of the movement mechanism 43 are controlled through visual feedback, finally the silicon wafer transfer robot 2 puts the silicon wafer into the pocket of the carrier plate, and the loading starts.

[0039] The silicon wafer loading system, by arranging a plurality of movement mechanisms 43 at intervals around the center of the carrier plate support plate 42, and each movement mechanism 43 including a horizontal movement assembly 431 and a vertical movement assembly 432, drives the overall movement and rotation of the carrier plate support plate 42, and fixes the carrier plate through the carrier plate fixing assembly 45, that is, the carrier plate can move and rotate with the carrier plate support plate 42, the setting of the plurality of movement mechanisms 43 can better support and position the edge of the large-size carrier plate, improve the positioning effect of the edge of the large-size carrier plate, and ensure that the carrier plate can be accurately positioned to the loading position of the silicon wafer through cooperation with the visual detection mechanism 44, can be compatible with the cumulative error of the silicon wafer transfer robot 2, so that the silicon wafer can be accurately put into the pocket of the carrier plate, reduce the knocking and contact between the silicon wafer and the pocket of the carrier plate, and improve the yield of the silicon wafer.

[0040] In the embodiment, the movement mechanism 43 is provided with four movement mechanisms 43, the four movement mechanisms 43 are respectively arranged at four corners of the carrier plate support plate 42, the horizontal movement assembly 431 of one diagonal two movement mechanisms 43 is slidably arranged on the positioning seat 41, the vertical movement assembly 432 is slidably arranged on the horizontal movement assembly 431, and at least one horizontal movement assembly 431 is connected with a driving assembly 433; the vertical movement assembly 432 of the other diagonal two movement mechanisms 43 is slidably arranged on the positioning seat 41, the horizontal movement assembly 431 is slidably arranged on the vertical movement assembly 432, and at least one vertical movement assembly 432 is connected with a driving assembly 433. Specifically, as shown in Figure 4As shown, the horizontal moving assembly 431 of the moving mechanism 43 at the upper left corner and the lower right corner slides on the positioning seat 41, the vertical moving assembly 432 slides on the horizontal moving assembly 431, the support plate 42 of the carrier plate is connected with the vertical moving assembly 432, and the moving mechanism 43 at the lower left corner is not connected with the driving assembly and is a follow-up mechanism. The horizontal moving assembly 431 at the lower right corner is connected with the driving assembly 433 and is a driving horizontal moving mechanism, which drives the carrier plate to move horizontally. The vertical moving assembly 432 of the moving mechanism 43 at the upper left corner and the lower right corner slides on the positioning seat 41, the horizontal moving assembly 431 slides on the vertical moving assembly 432, and the two vertical moving assemblies 432 are connected with the right driving assembly 433 and are driving vertical moving mechanisms, which drive the carrier plate to move vertically. The horizontal and vertical moving distances are controlled to realize the movement and rotation of the carrier plate. Meanwhile, the driving horizontal moving mechanism is provided with the follow-up vertical moving assembly 432, and the driving vertical moving mechanism is provided with the follow-up horizontal moving assembly 431, which will not interfere with the movement and rotation of the carrier plate. The four moving mechanisms 43 are arranged at the corners, which can strengthen the positioning effect of the edge of the carrier plate and support the carrier plate. Of course, in other embodiments, the moving mechanism 43 at the upper left corner can also be a driving horizontal moving mechanism. Preferably, the positioning seat 41 is provided with the first guide rail 411 for guiding the horizontal movement of the horizontal moving assembly 431 and the second guide rail 412 for guiding the vertical movement of the vertical moving assembly 432.

[0041] In the embodiment, the driving assembly 433 includes a screw rod 4331 and a rotating motor 4332 for driving the screw rod 4331 to rotate, and the horizontal moving assembly 431 and the vertical moving assembly 432 are threadedly connected with the corresponding screw rod 4331. The rotating motor 4332 at the upper left corner and the lower right corner drives the screw rod 4331 to rotate, drives the corresponding vertical moving assembly 432 to slide on the positioning seat 41, and realizes vertical movement. The rotating motor 4332 at the lower right corner drives the screw rod 4331 to rotate, drives the corresponding horizontal moving assembly 431 to slide on the positioning seat 41, and realizes horizontal movement. Preferably, the screw rod 4331 is a ball screw rod, which further improves the positioning accuracy.

[0042] In the embodiment, the positioning seat 41 is provided with a first position sensor 46 corresponding to each moving mechanism 43, and the first position sensor 46 is used for detecting the moving position of the carrier plate. The first position sensor 46 assists the carrier plate to be accurately positioned.

[0043] In the embodiment, the carrier plate conveying device 3 includes a double-output-shaft motor 31 and two groups of oppositely arranged belt conveying mechanisms 33, and the two output shafts 32 of the double-output-shaft motor 31 are connected with one group of belt conveying mechanisms 33 respectively. The two output shafts 32 of the double-output-shaft motor 31 drive one group of belt conveying mechanisms 33 simultaneously, realize the synchronous conveying of the two groups of belt conveying mechanisms 33, and the double-output-shaft motor 31 is arranged between the two groups of belt conveying mechanisms 33, so that the structure is compact.

[0044] In the embodiment, the belt conveying mechanism 33 comprises a mounting seat 331, a driving wheel assembly 332, a driven wheel assembly 333 and a conveying belt 334. The driving wheel assembly 332 comprises a driving wheel shaft 3321 and a driving wheel 3322 arranged on the driving wheel shaft 3321. The driving wheel shaft 3321 is rotatably connected with a first mounting plate 3323 and a second mounting plate 3324 on both sides of the driving wheel 3322 respectively. The first mounting plate 3323 and the second mounting plate 3324 are detachably connected with the mounting seat 331. The driving wheel shaft 3321 is detachably connected with the output shaft 32 through a shaft coupling 34. The driven wheel assembly 333 comprises a driven wheel shaft (not shown in the figure) and a driven wheel 3332 arranged on the driven wheel shaft. The driven wheel shaft is rotatably connected with a third mounting plate 3333 and a fourth mounting plate 3334 on both sides of the driven wheel 3332 respectively. The third mounting plate 3333 and the fourth mounting plate 3334 are detachably connected with the mounting seat 331. The conveying belt 334 is arranged around the driving wheel 3322 and the driven wheel 3332. The mounting seat 331 is arranged on the lifting device 5. The driving wheel shaft 3321 is detachably connected with the output shaft 32 through the shaft coupling 34. When the belt conveying mechanism 33 needs to be replaced, only the belt conveying mechanism 33 needs to be disassembled, and the double-output-shaft motor 31 and the output shaft 32 do not need to be disassembled, which is simple to disassemble. However, the conveying belt 334 in the belt conveying mechanism 33 is relatively easy to damage and needs to be frequently replaced. At this time, only the outer mounting plates (for example, the first mounting plate 3323 and the third mounting plate 3333 shown in the figure) need to be disassembled, and the driving wheel 3322, the driven wheel 3332 and the conveying belt 334 can be disassembled and replaced, which is convenient for the disassembly and replacement of the conveying belt 334. Figure 6 and Figure 7 The first mounting plate 3323 and the third mounting plate 3333 are shown in the figure.

[0045] In the embodiment, the mounting seat 331 is provided with a limiting assembly 335 and a guiding assembly 336. The limiting assembly 335 is used for limiting the conveying position of the carrier plate. The guiding assembly 336 provides guidance for the conveying of the carrier plate. The limiting assembly 335 is arranged close to one end of the driving wheel assembly 332. The carrier plate is input from one end of the driven wheel assembly 333 and moves to the driving wheel assembly 332 through the conveying belts 334 on both sides until it contacts the limiting assembly 335, and then stops moving, thereby limiting and preliminarily positioning the conveying position of the carrier plate, avoiding the carrier plate from separating from the conveying belt 334, and facilitating the placement of the carrier plate into the carrier plate positioning device 4. The guiding assembly 336 comprises a plurality of guiding rollers 3361. The plurality of guiding rollers 3361 are arranged in the conveying direction of the conveying belt 334 to provide guidance for the conveying of the carrier plate. The guiding rollers 3361 and the carrier plate are in rolling friction, and the friction force is small, which can protect the carrier plate to a certain extent.

[0046] In the embodiment, the mounting seat 331 is provided with a plurality of second position sensors 337, the carrier plate is provided with a sensing block for sensing the second position sensors 337, the plurality of second position sensors 337 are arranged along the conveying direction of the conveying belt 334, and are electrically connected with the double-output shaft motor 31. Specifically, the second position sensor 337 is provided with three, when the sensing block (not shown in the figure) senses the three second position sensors 337 in sequence during the conveying process of the carrier plate, the double-output shaft motor 31 performs the actions of starting conveying, decelerating conveying and stopping conveying respectively, and controls the conveying of the carrier plate. Preferably, the second position sensor 337 is an optical switch, which is simple in structure and sensitive in sensing.

[0047] In the embodiment, the wafer loading system further comprises a plurality of pressing assemblies 7 for pressing the carrier plate, the plurality of pressing assemblies 7 are respectively arranged at four corners of the carrier plate, the pressing assembly 7 comprises a pressing plate 71 and a lifting cylinder 72 for driving the pressing plate 71 to lift, and the lifting cylinder 72 is arranged on the lifting device 5. After the carrier plate positioning device 4 completes positioning of the carrier plate, the lifting cylinder 72 drives the pressing plate 71 to descend and tightly press the four corners of the carrier plate, so as to fix the carrier plate, avoid the middle part of the carrier plate from being concave due to its own gravity after the wafer is placed in the carrier plate, reduce the deformation of the pocket in the middle part of the carrier plate, and improve the wafer yield.

[0048] In the embodiment, the carrier plate fixing assembly 45 comprises a baffle 451 and a locking piece 452, the baffle 451 is fixed to one side of the carrier plate support plate 42, the locking piece 452 is rotationally arranged on the other side of the carrier plate support plate 42, the locking piece 452 is provided with two locking rollers 453 arranged in an up-down manner, and a locking slot is formed between the two locking rollers 453. When the carrier plate falls onto the carrier plate support plate 42, the locking piece 452 is rotated, so that one side of the carrier plate abuts against the baffle 451 and the other side is inserted into the locking slot, thereby realizing fixing of the carrier plate. The locking piece 452 is reversely rotated to release the locking of the carrier plate, so that the carrier plate can be moved.

[0049] Embodiment two

[0050] The wafer loading method of the embodiment comprises the following steps:

[0051] S1, the wafer transfer mechanical arm 2 grabs the wafer and transfers it to above the carrier plate positioning device 4;

[0052] S2, the carrier plate is input by the conveying device 3 and is preliminarily positioned by the limiting assembly 335;

[0053] S3, the lifting device 5 drives the conveying device 3 and the pressing assembly 7 to descend, so that the carrier plate falls on the carrier plate support plate 42 of the carrier plate positioning device 4, and the carrier plate fixing assembly 45 fixes the carrier plate on the carrier plate support plate 42;

[0054] S4, after the visual detection mechanism 44 takes a picture and positions, the lead screw 4331 drives the corresponding moving mechanism 43 to move horizontally and vertically, so that the carrier plate moves and rotates, and the visual detection mechanism 44 is used to accurately position the carrier plate, so that the carrier plate is located at the loading position of the silicon wafer;

[0055] S5, the four corners of the carrier plate are pressed by the pressing assembly 7, then the silicon wafer transfer robot 2 puts the silicon wafer into the carrier plate, and the loading is started.

[0056] The silicon wafer loading method, the setting of the plurality of moving mechanisms 43, relative to the setting of only one rotating platform at the center position, can better support and position, improve the positioning effect of the edge of the large-size carrier plate, and cooperate with the visual detection mechanism 44 to ensure that the carrier plate can be accurately positioned to the loading position of the silicon wafer, so that the silicon wafer can be accurately put into the pocket of the carrier plate, reduce the knocking and contact between the silicon wafer and the pocket of the carrier plate, improve the yield of the silicon wafer, and press the four corners of the carrier plate by the pressing assembly 7 when the silicon wafer is loaded, so that the middle part of the carrier plate is not depressed due to its own gravity after the silicon wafer is put in, the deformation of the pocket in the middle part of the carrier plate is reduced, and the yield of the silicon wafer is further improved.

[0057] Although the present application has been disclosed with the preferred embodiments as above, it is not intended to limit the present application. Any person skilled in the art can make many possible changes and modifications to the technical solutions disclosed above, or modify equivalent embodiments with equivalent changes, without departing from the scope of the technical solutions of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, which does not depart from the content of the technical solutions of the present application, shall fall within the scope of protection of the technical solutions of the present application.

Claims

1. A silicon wafer loading system, characterized by: The device comprises a rack (1), a silicon wafer transfer mechanical arm (2), a carrier plate conveying device (3), a carrier plate positioning device (4), a lifting device (5) and a plurality of pressing assemblies (7). The lifting device (5) is arranged on the rack (1) and is used to drive the carrier plate conveying device (3) to lift so as to place the carrier plate on the carrier plate conveying device (3) on the carrier plate positioning device (4) for positioning. The carrier plate positioning device (4) comprises a positioning seat (41), a carrier plate support plate (42), a plurality of moving mechanisms (43) and a plurality of visual detection mechanisms (44). The positioning seat (41) is arranged on the rack (1). The carrier plate support plate (42) is connected with the positioning seat (41) through the moving mechanisms (43). The moving mechanisms (43) are arranged at intervals around the center of the carrier plate support plate (42). Each moving mechanism (43) comprises a horizontal moving assembly (431) and a vertical moving assembly (432). The positioning seat (41) is provided with a driving assembly (433) for driving the horizontal and vertical moving of the moving mechanisms (43). The carrier plate support plate (42) is provided with a carrier plate fixing assembly (45) for fixing the carrier plate. The visual detection mechanisms (44) are arranged correspondingly with the moving mechanisms (43) to detect the moving position of the carrier plate. The silicon wafer transfer mechanical arm (2) is used to grab the silicon wafer and place it in the carrier plate. The pressing assemblies (7) are used to press the four corners of the carrier plate.

2. The silicon wafer loading system of claim 1, wherein: The moving mechanisms (43) are arranged at four corners of the carrier plate support plate (42). The horizontal moving assemblies (431) of two moving mechanisms (43) at one diagonal are slidably arranged on the positioning seat (41). The vertical moving assemblies (432) are slidably arranged on the horizontal moving assemblies (431). At least one horizontal moving assembly (431) is connected with the driving assembly (433). The vertical moving assemblies (432) of two moving mechanisms (43) at another diagonal are slidably arranged on the positioning seat (41). The horizontal moving assemblies (431) are slidably arranged on the vertical moving assemblies (432). At least one vertical moving assembly (432) is connected with the driving assembly (433).

3. The silicon wafer loading system of claim 2, wherein: The driving assembly (433) comprises a screw rod (4331) and a rotating motor (4332) for driving the screw rod (4331) to rotate. The horizontal moving assemblies (431) and the vertical moving assemblies (432) are threadedly connected with the corresponding screw rods (4331).

4. The silicon wafer loading system of claim 1, wherein: The positioning seat (41) is provided with a first position sensor (46) at each moving mechanism (43). The first position sensor (46) is used to detect the moving position of the carrier plate.

5. The silicon wafer loading system of any one of claims 1 to 4, wherein: The carrier plate conveying device (3) comprises a double-output-shaft motor (31) and two groups of oppositely arranged belt conveying mechanisms (33). Two output shafts (32) of the double-output-shaft motor (31) are connected with one group of belt conveying mechanisms (33) respectively.

6. The silicon wafer loading system of claim 5, wherein: The belt conveying mechanism (33) comprises a mounting seat (331), a driving wheel assembly (332), a driven wheel assembly (333) and a conveying belt (334), the driving wheel assembly (332) comprises a driving wheel shaft (3321) and a driving wheel (3322) arranged on the driving wheel shaft (3321), the driving wheel shaft (3321) is rotatably connected with a first mounting plate (3323) and a second mounting plate (3324) on the two sides of the driving wheel (3322) respectively, the first mounting plate (3323) and the second mounting plate (3324) are detachably connected with the mounting seat (331), the driving wheel shaft (3321) is connected with the output shaft (32) through a shaft coupling (34), the driven wheel assembly (333) comprises a driven wheel shaft and a driven wheel (3332) arranged on the driven wheel shaft, the driven wheel shaft is rotatably connected with a third mounting plate (3333) and a fourth mounting plate (3334) on the two sides of the driven wheel (3332) respectively, the third mounting plate (3333) and the fourth mounting plate (3334) are detachably connected with the mounting seat (331), the conveying belt (334) is arranged on the driving wheel (3322) and the driven wheel (3332), and the mounting seat (331) is arranged on the lifting device (5).

7. The silicon wafer loading system of claim 6, wherein: The mounting seat (331) is provided with a limiting assembly (335) and a guide assembly (336), the limiting assembly (335) is used for limiting the conveying position of the carrier plate, and the guide assembly (336) provides guidance for the conveying of the carrier plate.

8. The silicon wafer loading system of claim 6, wherein: A plurality of second position sensors (337) are arranged on the mounting seat (331), the carrier plate is provided with a sensing block for sensing the second position sensors (337), the plurality of second position sensors (337) are arranged along the conveying direction of the conveying belt (334) and are electrically connected with the double-output-shaft motor (31).

9. The silicon wafer loading system of claim 6, wherein: A plurality of pressing assemblies (7) are arranged at the four corners of the carrier plate respectively, the pressing assembly (7) comprises a pressing plate (71) and a lifting cylinder (72) for driving the pressing plate (71) to lift, and the lifting cylinder (72) is arranged on the lifting device (5).

10. A method of loading a silicon wafer into the system of any one of claims 1 to 9, comprising: placing the silicon wafer on the loading surface; and rotating the loading surface to align the silicon wafer with the loading slot. The method comprises the following steps: S1, the wafer transfer mechanical arm (2) grabs the wafer and transfers it to above the carrier plate positioning device (4); S2, the carrier plate is input through the conveying device (3) and is preliminarily positioned through the limiting assembly (335); S3, the lifting device (5) drives the conveying device (3) and the pressing assembly (7) to descend, so that the carrier plate falls on the carrier plate support plate (42) of the carrier plate positioning device (4), and the carrier plate fixing assembly (45) fixes the carrier plate on the carrier plate support plate (42); S4, after the visual detection mechanism (44) takes a photo and positions, the driving assembly (433) drives the corresponding moving mechanism (43) to move horizontally and vertically, so that the carrier plate moves and rotates, and the visual detection mechanism (44) is used for accurately positioning the carrier plate, so that the carrier plate is located at the wafer feeding position; S5, the four corners of the carrier plate are pressed through the pressing assembly (7), then the wafer transfer mechanical arm (2) puts the wafer into the carrier plate, and the feeding starts.

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