LED light source wire welding all-in-one machine

Abstract

The application discloses a LED light source wire welding integrated machine which is used for welding wires on LED light sources, and comprises a rack, a wire tin dipping device and a wire welding device; the wire tin dipping device comprises a wire feeding mechanism, a first limiting mechanism, a rotating mechanism, a tin dipping mechanism and a tin storage mechanism. The wire feeding mechanism is used for feeding wires, the first limiting mechanism is used for clamping the wires, then the rotating mechanism drives the wires on the first limiting mechanism to rotate, so that the wires on the first limiting mechanism are inclined to the tin storage mechanism at the lower end of the rotating mechanism, and under the driving of the tin dipping mechanism, the wires move into the tin storage mechanism, so that the wires contact with the tin in the tin storage mechanism, thereby realizing automatic tin dipping of the wires, improving the tin dipping efficiency, and improving the production efficiency of the LED light source.

Description

Technical Field

[0001] This invention relates to the technical field of LED light source production equipment, and more particularly to an integrated LED light source wire bonding machine. Background Technology

[0002] With societal development, LED lights are being used more and more frequently, leading to a surge in demand. In the LED light production process, wires need to be soldered to the LED light source, and the end of the wire furthest from the LED light source needs to be tinned to facilitate connection between the LED light source and electrical equipment. Currently, there are generally two methods for tinning the wires: one is to tin the wire first and then solder the untinned end to the LED light source; the other is to solder the wire to the LED light source first and then tin the end furthest from the LED light source. Both methods involve manual tinning, which is inefficient and negatively impacts LED light source production efficiency. Summary of the Invention

[0003] To address the technical problems mentioned in the background section, this invention provides an integrated LED light source wire bonding machine.

[0004] This invention provides an integrated LED light source wire bonding machine for bonding wires to an LED light source. The integrated LED light source wire bonding machine includes a frame, a wire tinning device mounted on the frame for tinning the wires before bonding, and a wire bonding device for bonding the tinned wires to the LED light source. The wire tinning device includes a wire feeding mechanism for feeding wires, a first limiting mechanism connected to the wire feeding mechanism for clamping and limiting the wires, a rotating mechanism for rotating the first limiting mechanism, a tinning mechanism mounted on the rotating mechanism for moving the first limiting mechanism, and a solder storage mechanism mounted at the lower end of the rotating mechanism.

[0005] Furthermore, the rotating mechanism includes a rotating frame, a rotating shaft mounted on the rotating frame and rotatable relative to the rotating frame, a rotating seat mounted on the rotating shaft, and a rotating power unit for driving the rotating shaft to rotate the rotating seat.

[0006] Furthermore, the tinning mechanism is mounted on the rotating base, and the tinning mechanism includes a tinning guide rail mounted on the rotating base, a tinning base slidably mounted on the tinning guide rail, and a tinning power component for driving the tinning base to move directionally on the tinning guide rail.

[0007] Furthermore, the first limiting mechanism includes a first guide plate mounted on the tin-immersion base, a first limiting frame mounted on the tin-immersion base adjacent to the first guide plate, a first pressing power member mounted on the first limiting frame, and a first limiting plate connected to the output end of the first pressing power member.

[0008] Furthermore, the solder storage mechanism includes a melting tank and a solder bath mounted on the frame and adjacent to each other at the lower end of the rotating mechanism; the solder immersion mechanism also includes a switching mechanism for driving the rotating mechanism to move so that the wire on the first limiting mechanism is sequentially immersed in the melting tank and the solder bath; the switching mechanism includes a switching guide rail mounted on the frame, a switching base slidably mounted on the switching guide rail, and a switching power component for driving the switching base to move directionally on the switching guide rail; the rotating frame is mounted on the switching base.

[0009] Furthermore, the LED light source wire bonding integrated machine also includes a wire cutting device, which includes a second limiting mechanism mounted on the frame and a wire cutting mechanism mounted on the frame between the wire tinning device and the second limiting mechanism. The wire cutting mechanism includes a wire cutting frame mounted on the frame, a wire cutting station mounted on the wire cutting frame, and a wire cutting assembly mounted on the wire cutting frame at the upper end of the wire cutting station. The wire cutting assembly includes a wire cutting power component mounted on the wire cutting frame and a cutting blade connected to the output end of the wire cutting power component.

[0010] Furthermore, the wire cutting device also includes a transfer mechanism mounted on the frame; the transfer mechanism includes a transfer component mounted on the frame and a steering component mounted on the transfer component.

[0011] Furthermore, the transfer assembly includes a transfer guide rail, a transfer base slidably mounted on the transfer guide rail, and a transfer power component for driving the transfer base to move directionally on the transfer guide rail.

[0012] Furthermore, the steering assembly includes a steering power component mounted on the transfer base and a steering seat connected to the output end of the steering power component; the second limiting mechanism is mounted on the steering seat.

[0013] Furthermore, the wire welding device includes an LED light source feeding mechanism mounted on the frame, a welding station mounted on the frame, and a welding mechanism mounted on the frame for welding the wires pre-fixed at the welding station to the LED light source.

[0014] Furthermore, the welding station includes a station plate with a light source slot, a pre-fixed power component mounted on the station plate, and a pre-fixed plate connected to the output end of the pre-fixed power component.

[0015] Furthermore, the welding mechanism includes a welding frame mounted on the frame, a z-axis slide rail mounted on the welding frame, a z-axis base slidably mounted on the z-axis slide rail, a z-axis power component for driving the z-axis base to move up and down on the z-axis slide rail, and a welding head mounted on the z-axis base.

[0016] Furthermore, the welding device also includes a reciprocating mechanism for driving the welding station to move back and forth between the LED light source feeding mechanism and the welding mechanism; the reciprocating mechanism includes a reciprocating slide rail mounted on the frame, a reciprocating base slidably mounted on the reciprocating slide rail, and a reciprocating power component for driving the reciprocating base to move directionally on the reciprocating slide rail; the welding station is mounted on the reciprocating base.

[0017] Furthermore, the LED light source feeding mechanism includes a light source conveyor belt mounted on the frame and an adsorption assembly that picks up LED light sources from the light source conveyor belt and places them onto the welding station; the adsorption assembly includes an adsorption frame mounted on the frame, an adsorption transfer slide rail mounted on the adsorption frame, an adsorption transfer seat slidably mounted on the adsorption transfer slide rail, an adsorption transfer power component for driving the adsorption transfer seat to move directionally on the adsorption transfer slide rail, and an adsorption element mounted on the adsorption transfer seat.

[0018] Furthermore, the rotary power unit includes a rotary gear connected to the rotary shaft, a gear rack cooperating with the rotary gear, and a gear rack drive member whose output end is connected to the gear rack; the upper end of the gear rack drive member extends in the direction of the gear rack with an anti-detachment part; an anti-detachment wheel is shaft-connected to the anti-detachment part, and the anti-detachment wheel abuts the gear rack against the rotary gear.

[0019] Using the above technical solution, the present invention feeds the wires through a wire feeding mechanism, clamps the wires by the first limiting mechanism, and then the rotating mechanism drives the wires on the first limiting mechanism to rotate, causing the wires on the first limiting mechanism to tilt towards the solder storage mechanism at the lower end of the rotating mechanism. Under the drive of the tinning mechanism, the wires move into the solder storage mechanism, so that the wires come into contact with the solder in the solder storage mechanism, thereby completing the automatic tinning of the wires, improving the tinning efficiency, and thus improving the production efficiency of LED light sources. Attached Figure Description

[0020] Figure 1 This is a perspective view of the LED light source wire bonding integrated machine of the present invention.

[0021] Figure 2 This is another perspective view of the LED light source wire bonding integrated machine of the present invention.

[0022] Figure 3 This is a perspective view of the wire tinning device and wire cutting device of the present invention.

[0023] Figure 4 This is a perspective view of the wire tinning device and wire cutting mechanism of the present invention.

[0024] Figure 5 This is a perspective view of the hidden switching mechanism and solder storage mechanism of the wire tinning apparatus of the present invention.

[0025] Figure 6 This is a perspective view of the tin material storage mechanism of the present invention.

[0026] Figure 7 This is a perspective view of the thread cutting mechanism of the present invention.

[0027] Figure 8 This is a perspective view of the thread cutting device of the present invention, with the thread cutting mechanism hidden.

[0028] Figure 9 This is a perspective view of the wire welding apparatus of the present invention.

[0029] Figure 10 This is a perspective view of the welding mechanism and the material feeding mechanism of the present invention.

[0030] Figure 11 This is a schematic diagram of the light source conveyor belt, reciprocating mechanism, and welding station of the present invention.

[0031] Figure 12 This is a schematic diagram of the light source conveyor belt, welding station, and adsorption assembly of the present invention.

[0032] Figure 13 This is a perspective view of the welding station and reciprocating base of the present invention.

[0033] Figure 14 This is a perspective view of the first guide plate of the present invention. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. Moreover, features in the embodiments of the present invention can be combined with each other without conflict.

[0035] like Figures 1-14As shown, the present invention provides an integrated LED light source wire bonding machine for bonding wires to an LED light source. The integrated LED light source wire bonding machine includes a frame 1, a wire tinning device 2 for tinning the wires before bonding, and a wire bonding device 4 for bonding the tinned wires to the LED light source, all mounted on the frame 1. The wire tinning device 2 includes a wire feeding mechanism 21 for feeding wires, a first limiting mechanism connected to the wire feeding mechanism 21 for clamping and limiting the wires, a rotating mechanism for rotating the first limiting mechanism, a tinning mechanism mounted on the rotating mechanism for moving the first limiting mechanism, and a solder storage mechanism mounted at the lower end of the rotating mechanism.

[0036] In this embodiment, the wire feeding mechanism 21 feeds the wire, and the first limiting mechanism clamps the wire. Then, the rotating mechanism drives the wire on the first limiting mechanism to rotate, causing the wire to tilt towards the solder storage mechanism at the lower end of the rotating mechanism. Driven by the tinning mechanism, the wire moves into the solder storage mechanism, making contact with the solder inside, thus completing the automatic tinning of the wire, improving tinning efficiency, and consequently increasing the production efficiency of the LED light source. Furthermore, placing the solder storage mechanism at the lower end of the rotating mechanism reduces the equipment's footprint in the production space. The rotating mechanism can drive the tin-dipping mechanism and the first limiting mechanism to rotate at a certain angle, such as 45 degrees or 90 degrees. By tilting the tin-dipping mechanism and the first limiting mechanism, the tin-dipping mechanism can drive the wire on the first limiting mechanism to move towards the position of the solder storage mechanism, thereby making the wire contact with the solder to achieve the tin-dipping operation. Preferably, the rotating mechanism drives the tin-dipping mechanism and the first limiting mechanism to rotate at an angle of 90 degrees, so that the wire can be perpendicular to the horizontal plane, which facilitates the tin-dipping of the wire and allows the solder storage mechanism to be set directly below the rotating mechanism, further reducing the space occupied by the equipment.

[0037] In one specific embodiment, the rotating mechanism includes a rotating frame 231, a rotating shaft 232 mounted on the rotating frame 231 and rotatable relative to the rotating frame 231, a rotating seat 233 mounted on the rotating shaft 232, and a rotating power unit for driving the rotating shaft 232 to rotate the rotating seat 233. In this embodiment, the rotating power unit drives the rotating shaft 232 to rotate relative to the rotating frame 231, thereby driving the tin-dipping mechanism and the first limiting mechanism on the rotating seat 233 to rotate. This allows the first limiting mechanism to drive the wire to rotate at a certain angle, facilitating the tin-dipping mechanism to drive the wire into the tin storage mechanism to contact the tin.

[0038] Furthermore, the rotary power unit includes a rotary gear 234 connected to the rotary shaft 232, a gear rack 235 cooperating with the rotary gear 234, and a gear rack drive member 236 whose output end is connected to the gear rack 235; the upper end of the gear rack drive member 236 extends towards the gear rack 235 with an anti-detachment part 237; an anti-detachment wheel 238 is shaft-connected to the anti-detachment part 237, and the anti-detachment wheel 238 abuts the gear rack 235 against the rotary gear 234. In this embodiment, the gear rack drive member 236 drives the gear rack 235 to move forward and backward, thereby causing the gear rack 235 to mesh with the rotary gear 234, causing the rotary gear 234 to rotate, which in turn drives the rotary shaft 232 to rotate, realizing that the wire on the first limiting mechanism rotates at a certain angle and faces the solder storage mechanism, utilizing the rotational power of the rotary gear 234 and the gear rack 235. The device enables precise control of the rotation angle of the rotating gear 234 by controlling the moving distance of the toothed rack 235, thereby facilitating the tinning operation and solving the problem of difficulty in achieving precise rotation angle control using traditional rotary cylinder control methods. The toothed rack drive member 236 is provided with an anti-detachment part 237 extending towards the toothed rack 235, so that the anti-detachment wheel 238 on the anti-detachment part 237 can press the toothed rack 235 against the rotating gear 234, thereby preventing the rotating gear 234 from not being connected to the toothed rack 235, which would affect the progress of the toothed rack drive member 236 driving the rotating gear 234. Furthermore, the anti-detachment wheel 238 allows the toothed rack 235 to move back and forth under the drive of the toothed rack drive member 236 while being connected to the rotating gear 234.

[0039] In one specific embodiment, the tinning mechanism is mounted on the rotating base 233, thereby being driven to rotate by the rotating mechanism. The tinning mechanism includes a tinning guide rail 241 mounted on the rotating base 233, a tinning base 242 slidably mounted on the tinning guide rail 241, and a tinning power component 243 for driving the tinning base 242 to move directionally on the tinning guide rail 241. In this embodiment, when the wire on the first limiting mechanism rotates under the drive of the rotating mechanism and is opposite to the opening of the solder tank of the soldering mechanism, the tinning power component 243 drives the tinning base 242 to move the first limiting mechanism and the wire toward the solder tank, thereby making the wire contact the solder in the solder tank, thereby realizing the tinning operation.

[0040] In one specific embodiment, the first limiting mechanism includes a first guide plate 221 mounted on the tin-immersion base 242, a first limiting frame 222 mounted on the tin-immersion base 242 adjacent to the first guide plate 221, a first pressing force member 223 mounted on the first limiting frame 222, and a first limiting plate 224 connected to the output end of the first pressing force member 223. In this embodiment, the first guide plate 221 is provided with a plurality of first wire grooves 2211 spaced apart, and a plurality of wires are accommodated in the first wire grooves 2211, thereby realizing the spaced arrangement of the wires. During the tin-immersion process of the wires, it can prevent the solder of adjacent wires from condensing together. Before the wires need to be tin-immersed, the first pressing force member 223 drives the first limiting plate 224 to press down, thereby limiting the wires exposed on the first guide plate 221 on the tin-immersion base 242. At this time, the conductive core of the wire is exposed outside the first limiting plate 224, thereby allowing the conductive core of the wire to be tin-immersed.

[0041] In one specific embodiment, the solder storage mechanism includes a melting tank 251 and a solder tank 252 mounted on the frame 1 and adjacent to each other at the lower end of the rotating mechanism; the solder immersion mechanism further includes a switching mechanism for driving the rotating mechanism to move so that the wire on the first limiting mechanism is sequentially immersed in the melting tank 251 and the solder tank 252; the switching mechanism includes a switching guide rail 244 mounted on the frame 1, a switching base 245 slidably mounted on the switching guide rail 244, and a switching power component 246 for driving the switching base 245 to move directionally on the switching guide rail 244; the rotating frame 231 is mounted on the switching base 245. In this embodiment, the melting tank 251 is used for... The tin bath 252 is used to hold liquid tin. The wire is driven by the rotating mechanism towards the dissolving bath 251. Then, the tinning mechanism drives the wire into the dissolving bath 251 and into contact with the dissolving substance, so that the residual insulation on the wire dissolves, preventing the conductive core from having residual insulation that would affect the subsequent tinning effect. Then, the tinning mechanism drives the wire away from the dissolving bath 251. The switching power component 246 drives the rotating mechanism to move the wire to the upper end of the tin bath 252, and the tinning mechanism continues to drive the wire into the tin bath 252, so that the conductive core of the wire comes into contact with the tin in the tin bath 252, thereby completing the tinning operation.

[0042] Furthermore, the tin storage mechanism also includes a control mechanism for controlling the opening or closing of the melting tank 251. The control mechanism includes a control power component 253 and a sealing plate 254 connected to the output end of the control power component 253. In the initial state, the sealing plate 254 covers the opening of the melting tank 251 to prevent the dissolved substance from evaporating or foreign objects from entering the melting tank 251 and coming into contact with the dissolved substance, thus preventing a safety accident. When it is necessary to dissolve the residual insulation of the wire, the control power component 253 drives the sealing plate 254 to retract, thereby leaving the opening of the melting tank 251 and removing the obstruction of the opening of the melting tank 251.

[0043] In one specific embodiment, the switching base 245 is further provided with a shock absorber 247. The shock absorber 247 abuts against the rotating seat 233 when it is not rotating, thereby providing support for the switching base 245. The shock absorber 247 is provided with an elastic head, so that when the rotating seat 233 returns from the tin-dipped state (rotating seat 233 tilted) to the horizontal state, it can prevent the rotating seat 233 from rigidly contacting the shock absorber 247, thereby affecting the service life of the equipment. The elastic head can be made of elastic material or can be a component with a spring.

[0044] In one specific embodiment, the LED light source wire bonding integrated machine further includes a wire cutting device 3. The wire cutting device 3 includes a second limiting mechanism mounted on the frame 1 and a wire cutting mechanism mounted on the frame 1 between the wire tinning device and the second limiting mechanism. The wire cutting mechanism includes a wire cutting frame 321 mounted on the frame 1, a wire cutting station 322 mounted on the wire cutting frame 321, and a wire cutting assembly mounted on the wire cutting frame 321 at the upper end of the wire cutting station 322. The wire cutting assembly includes a wire cutting power component 323 mounted on the wire cutting frame 321 and a cutting blade connected to the output end of the wire cutting power component 323. In this embodiment, after the wire tinning is completed on the wire tinning device, the wire is... Driven by the wire feeding mechanism 21, it moves towards the second limiting mechanism, causing the second limiting mechanism to clamp the tin-soaked end of the wire. Then, the wire cutting mechanism located between the wire tin-soaking device and the second limiting mechanism cuts the wire exposed at the lower end of the first and second limiting mechanisms, thereby separating the tin-soaked wire from the wire roll. At this time, the wire segment clamped on the second limiting mechanism is the pre-set wire to be soldered to the LED light source. Specifically, during the cutting process, the wire exposed at the first and second limiting mechanisms is supported on the upper end of the wire cutting station 322. The wire cutting power component 323 drives the cutting blade to press down, thereby cooperating with the wire cutting station 322 to separate the tin-soaked wire from the wire roll.

[0045] In one specific embodiment, the wire cutting station 322 is provided with a wire cutting groove 3221. The cross-section of the wire cutting groove 3221 is V-shaped. The cutting knife includes a cutting knife sleeve and a blade hidden in the cutting knife sleeve. The shape of the cutting knife sleeve is adapted to the wire cutting groove 3221. When cutting, the cutting knife sleeve first contacts the wire and presses the guide into the wire cutting groove 3221, so that the insulation sheath of the wire located in the wire cutting groove 3221 is separated from the conductive core of the wire. Then the blade is exposed and cuts the conductive core, thereby separating the wire segment in the second limiting mechanism from the wire coil, realizing the stripping and cutting operation of the wire.

[0046] In one specific embodiment, the wire cutting device 3 further includes a transfer mechanism mounted on the frame 1; the transfer mechanism includes a transfer component mounted on the frame 1 and a steering component mounted on the transfer component. In this embodiment, after the tin-dipped wire segment on the second limiting mechanism is separated from the wire coil, the steering component drives the second limiting mechanism to rotate 90 degrees, so that the untin-dipped end slots toward the wire welding device 4. Then, the transfer component drives the wire on the steering component to move toward the wire welding device 4, so that the tin-dipped wire segment enters the next process.

[0047] In some embodiments, the structure of the second limiting mechanism is the same as that of the first limiting mechanism.

[0048] In some embodiments, the second limiting mechanism includes a gripper power member 311, two gripping arms 312 connected to the output end of the gripper power member 311, and a clamping plate 313 connected to the gripping arms 312. After the tinning mechanism tinns the free end of the wire coil, the free end of the wire coil moves toward the second limiting mechanism under the drive of the wire feeding mechanism 21, so that the free end of the wire coil enters the position between the two clamping plates 313. Then, the gripper power member 311 drives the gripping arms 312 to close towards each other, so that the two clamping plates 313 clamp the free end of the wire coil, so that the first limiting mechanism and the second limiting mechanism can fix the wires at both ends of the wire cutting mechanism, which facilitates the wire cutting mechanism to cut the wires, and also facilitates the second limiting mechanism to transport the cut wires to the wire welding device 4 for welding with the LED light source.

[0049] In one specific embodiment, the transfer assembly includes a transfer guide rail 3311, a transfer base 3312 slidably mounted on the transfer guide rail 3311, and a transfer power component 3313 for driving the transfer base 3312 to move directionally on the transfer guide rail 3311. In this embodiment, the transfer power component 3313 drives the transfer base 3312 to move the wire on the second limiting mechanism directionally on the transfer guide rail 3311, so that the tin-immersed wire segment moves toward the wire welding device 4.

[0050] Furthermore, the steering assembly includes a steering power component 3321 mounted on the transfer base 3312 and a steering seat 3322 connected to the output end of the steering power component 3321; the second limiting mechanism is mounted on the steering seat 3322. In this embodiment, the steering power component 3321 drives the steering seat 3322 to rotate, thereby causing the untinned end of the wire on the second limiting mechanism to face the wire welding device 4, which facilitates the welding of the wire to the LED light source.

[0051] In one specific embodiment, the wire welding device 4 includes an LED light source feeding mechanism mounted on the frame 1, a welding station 442 mounted on the frame 1, and a welding mechanism 43 mounted on the frame 1 for welding the wires pre-fixed on the welding station 442 to the LED light source. In this embodiment, the LED light source feeding mechanism feeds the LED light source onto the welding station 442, then the transfer mechanism feeds the tin-dipped wires onto the welding station 442, and the welding station 442 contacts and fixes the untinned end of the wire to the welding point on the LED light source. Finally, the welding mechanism 43 welds the wires onto the LED light source, thereby completing the wire welding operation of the LED light source.

[0052] Furthermore, the welding station 442 includes a station plate 421 with a light source slot 422, a pre-fixed power component 423 mounted on the station plate 421, and a pre-fixed plate 424 connected to the output end of the pre-fixed power component 423. In this embodiment, the LED light source feeding mechanism feeds the LED light source into the light source slot 422. The slot shape of the light source slot 422 is set to match the shape of the LED light source, thereby enabling the positioning of the LED light source. Then, the wire is transported to the welding station 442 by the transfer mechanism, exposing the conductive core with the tin-dipped end exposed. After contacting the solder joint on the LED light source, the pre-fixing power component 423 drives the pre-fixing plate 424 to press down, thereby pressing the wire onto the welding station 442. At this time, the pre-fixing plate will not press the cell of the wire in contact with the solder joint of the LED light source. After this operation, the welding mechanism 43 can easily weld the LED light source and the wire, preventing poor welding. The pre-fixing plate 424 is provided with a fixing hole 4241 that matches the wire, so as to play a pre-fixing role and allow the wire to avoid the fixing hole 4241, preventing damage to the wire.

[0053] In one specific embodiment, the welding mechanism 43 includes a welding frame 431 mounted on the frame 1, a z-axis slide rail 432 mounted on the welding frame 431, a z-axis base 433 slidably mounted on the z-axis slide rail 432, a z-axis power member 434 for driving the z-axis base 433 to move up and down on the z-axis slide rail 432, and a welding head 435 mounted on the z-axis base 433. In this embodiment, after the wire is fixed on the welding station 442 so that the exposed conductive core of the wire contacts the welding point of the LED light source, the z-axis power member 434 drives the z-axis base 433 to drive the welding head 435 to slide down the z-axis slide rail 432, so that the welding head 435 can weld the wire to the LED light source, thereby realizing the welding of the LED with the wire.

[0054] In one specific embodiment, the welding device further includes a reciprocating mechanism for driving the welding station 442 to move back and forth between the LED light source feeding mechanism and the welding mechanism 43; the reciprocating mechanism includes a reciprocating slide rail 441 mounted on the frame 1, a reciprocating base 442 slidably mounted on the reciprocating slide rail 441, and a reciprocating power component 443 for driving the reciprocating base 442 to move directionally on the reciprocating slide rail 441; the welding station 442 is mounted on the reciprocating base 442. In this embodiment, the reciprocating mechanism can be used to control the welding station. The position of 442 is switched so that, in the initial state, the welding station 442 is located between the LED light source feeding mechanism and the wire cutting mechanism, which facilitates the wire cutting mechanism and the LED light source feeding mechanism to transport the wire and the LED light source to the welding station 442 respectively. Then, the reciprocating power component 443 drives the reciprocating base 442 to move the welding station 442 in a directional manner on the reciprocating guide rail, thereby transporting the welding station 442 with the pre-fixed LED light source and wire to the lower end of the welding mechanism 43, so as to facilitate the welding mechanism 43 to perform welding.

[0055] In one specific embodiment, the LED light source feeding mechanism includes a light source conveyor belt 411 mounted on the frame 1 and an adsorption assembly 412 that clamps LED light sources from the light source conveyor belt 411 onto the welding station 442; the adsorption assembly 412 includes an adsorption frame 4121 mounted on the frame 1, an adsorption transfer slide rail 4122 mounted on the adsorption frame 4121, an adsorption transfer seat 4126 slidably mounted on the adsorption transfer slide rail 4122, and an adsorption transfer actuator for driving the adsorption transfer seat 4126 to move directionally on the adsorption transfer slide rail 4122. The force component 4123 and the adsorption component mounted on the adsorption transfer seat 4126 are used in this embodiment. The light source conveyor belt 411 feeds the LED light source, and the adsorption transfer force component 4123 drives the adsorption transfer seat 4126 to move the adsorption component in a direction on the adsorption transfer slide rail 4122, so that the LED light source on the light source conveyor belt 411 can be adsorbed onto the welding station 442. Specifically, the adsorption component includes a pressing force component 4124 and an adsorption head 4125 connected to the output end of the pressing force component 4124. The adsorption head 4125 is connected to a vacuum pump.

[0056] In one specific embodiment, the LED light source wire bonding machine further includes a feeding mechanism 5, which has the same structure as the adsorption component 412. The feeding mechanism 5 can adsorb and feed the LED light source containing the wire after the welding mechanism 43 has welded the LED light source and the wire.

[0057] In one specific embodiment, there are two welding mechanisms 43, which are respectively arranged on both sides of the position adjacent to the light source conveyor belt 411 and the transfer component. Similarly, there are also two unloading mechanisms 5, which are adjacent to one welding mechanism 43. There are also two reciprocating mechanisms, one of which is connected to a welding station 442. With the arrangement of this embodiment, when one welding mechanism 43 is welding the LED light source and wire conveyed by one reciprocating mechanism, the welding station 442 on the other reciprocating mechanism is located between the wire cutting device 3 and the light source conveyor belt 411 to pre-fix the LED light source and wire, thereby improving the welding efficiency.

[0058] In one specific embodiment, the wire feeding mechanism 21 includes a wire alignment frame 211 disposed on the frame 1 and an alignment plate 212 disposed on the wire alignment frame 211. The alignment plate 212 is provided with guide holes for wires to pass through at intervals. The distance between adjacent guide holes is equal to the distance between adjacent first wire grooves 2211, thereby facilitating the conveying of guides. The number of guide holes and light source grooves 422 in the first wire grooves 2211 is the same, thereby enabling simultaneous wire welding of rows of LED light sources and improving welding efficiency.

[0059] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these examples without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated LED light source wire bonding machine, used to bond wires to an LED light source, characterized in that: Includes a frame, and the following mechanisms mounted on the frame: A wire tinning device is used to tin wires. A wire soldering device is used to solder tin-dipped wires onto LED light sources; The wire tinning device includes a wire feeding mechanism for feeding wires, a first limiting mechanism connected to the wire feeding mechanism for clamping and limiting the wires, a rotating mechanism for driving the first limiting mechanism to rotate, a tinning mechanism mounted on the rotating mechanism for driving the first limiting mechanism to move, and a tin storage mechanism mounted at the lower end of the rotating mechanism; The rotating mechanism includes a rotating frame, a rotating shaft mounted on the rotating frame and rotatable relative to the rotating frame, a rotating seat mounted on the rotating shaft, and a rotating power unit for driving the rotating shaft to rotate the rotating seat. The tinning mechanism is mounted on the rotary seat. The tinning mechanism includes a tinning guide rail mounted on the rotary seat, a tinning base slidably mounted on the tinning guide rail, and a tinning power component for driving the tinning base to move directionally on the tinning guide rail. The first limiting mechanism includes a first guide plate mounted on the tin-immersion base, a first limiting frame mounted on the tin-immersion base adjacent to the first guide plate, a first pressing force member mounted on the first limiting frame, and a first limiting plate connected to the output end of the first pressing force member; The solder storage mechanism includes a melting tank and a solder bath mounted on the frame and adjacent to each other at the lower end of the rotating mechanism; the tin-immersion mechanism also includes a switching mechanism for driving the rotating mechanism to move so that the wires on the first limiting mechanism are sequentially immersed in the melting tank and the solder bath; the switching mechanism includes a switching guide rail mounted on the frame, a switching base slidably mounted on the switching guide rail, and a switching power component for driving the switching base to move directionally on the switching guide rail; the rotating frame is mounted on the switching base.

2. The LED light source wire bonding integrated machine according to claim 1, characterized in that: The LED light source wire bonding integrated machine also includes a wire cutting device, which includes a second limiting mechanism mounted on the frame and a wire cutting mechanism mounted on the frame between the wire tinning device and the second limiting mechanism. The wire cutting mechanism includes a wire cutting frame mounted on the frame, a wire cutting station mounted on the wire cutting frame, and a wire cutting assembly mounted on the wire cutting frame at the upper end of the wire cutting station. The wire cutting assembly includes a wire cutting power component mounted on the wire cutting frame and a cutting blade connected to the output end of the wire cutting power component.

3. The LED light source wire bonding integrated machine according to claim 2, characterized in that: The wire cutting device further includes a transfer mechanism mounted on the frame; the transfer mechanism includes a transfer component mounted on the frame and a steering component mounted on the transfer component; The transfer assembly includes a transfer guide rail, a transfer base slidably mounted on the transfer guide rail, and a transfer power component for driving the transfer base to move in a specific direction on the transfer guide rail. The steering assembly includes a steering power component mounted on the transfer base and a steering seat connected to the output end of the steering power component; the second limiting mechanism is mounted on the steering seat.

4. The LED light source wire bonding integrated machine according to claim 1, characterized in that: The wire welding device includes an LED light source feeding mechanism mounted on the frame, a welding station mounted on the frame, and a welding mechanism mounted on the frame for welding the wires pre-fixed at the welding station to the LED light source. The welding station includes a station plate with a light source slot, a pre-fixed power component mounted on the station plate, and a pre-fixed plate connected to the output end of the pre-fixed power component.

5. The LED light source wire bonding integrated machine according to claim 4, characterized in that: The welding mechanism includes a welding frame mounted on the frame, a z-axis slide rail mounted on the welding frame, a z-axis base slidably mounted on the z-axis slide rail, a z-axis power component for driving the z-axis base to move up and down on the z-axis slide rail, and a welding head mounted on the z-axis base.

6. The LED light source wire bonding integrated machine according to claim 4, characterized in that: The welding device further includes a reciprocating mechanism for driving the welding station to move back and forth between the LED light source feeding mechanism and the welding mechanism; the reciprocating mechanism includes a reciprocating slide rail mounted on the frame, a reciprocating base slidably mounted on the reciprocating slide rail, and a reciprocating power component for driving the reciprocating base to move directionally on the reciprocating slide rail; the welding station is mounted on the reciprocating base.

7. The LED light source wire bonding integrated machine according to claim 4, characterized in that: The LED light source feeding mechanism includes a light source conveyor belt mounted on the frame and an adsorption assembly that picks up LED light sources from the light source conveyor belt and places them onto the welding station. The adsorption assembly includes an adsorption frame mounted on the frame, an adsorption transfer slide rail mounted on the adsorption frame, an adsorption transfer seat slidably mounted on the adsorption transfer slide rail, an adsorption transfer power component for driving the adsorption transfer seat to move directionally on the adsorption transfer slide rail, and an adsorption element mounted on the adsorption transfer seat.

8. The LED light source wire bonding integrated machine according to claim 1, characterized in that: The rotary power unit includes a rotary gear connected to the rotary shaft, a gear rack that cooperates with the rotary gear, and a gear rack drive unit whose output end is connected to the gear rack; the upper end of the gear rack drive unit extends in the direction of the gear rack and has an anti-detachment part; an anti-detachment wheel is shaft-connected to the anti-detachment part and the anti-detachment wheel abuts the gear rack against the rotary gear.

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