Photomask production monitoring point positioning method, device and electronic equipment

Abstract

The present disclosure provides a photomask production monitoring point positioning method, device and electronic equipment. The photomask production monitoring point positioning method comprises: determining the coordinates of one or more target detection areas on a photomask layout to be measured; generating a mask according to the coordinates of the target detection areas, the mask being the same size as the photomask layout to be measured, the mask comprising a hollow area corresponding to the target detection area; performing a logical operation on the photomask layout to be measured and the mask, and obtaining a photomask layout of the target detection area according to the result of the logical operation; obtaining a plurality of production monitoring positions meeting a preset screening condition according to the photomask layout of the target detection area, and outputting the coordinates of the production monitoring positions as production monitoring points of the photomask layout to be measured. The present disclosure can improve the efficiency of determining the production monitoring points of the photomask layout.

Description

Technical Field

[0001] This disclosure relates to the field of integrated circuit manufacturing, and more specifically, to a method, apparatus, and electronic device for locating monitoring points during photomask production. Background Technology

[0002] Photolithography is a crucial step in integrated circuit manufacturing. In photolithography, a photomask is used to expose the processing area (the area coated with photoresist). This causes the photoresist in the processing area not covered by the photomask to denature. Then, chemical agents are used to remove the denatured or undenatured photoresist, exposing the etching area for etching.

[0003] The dimensional accuracy of the photomask directly determines the dimensional accuracy of the integrated circuit manufacturing process. Therefore, rigorous dimensional inspection is required during photomask manufacturing. When delivering the photomask layout to the manufacturing plant, the photomask provider specifies the coordinates of the most suitable production monitoring points and the inspection standards for dimensional inspection during or after manufacturing. These most suitable production monitoring points may be, for example, critical dimension points of key components, critical dimension points of key signal lines, or other points requiring strict dimensional control, as well as points that represent overall process deviations.

[0004] Because of the complexity and small size of the photomask pattern, it usually takes a lot of time to find the production monitoring points with suitable positions and sizes on the magnified photomask pattern. This places a heavy burden on the photomask delivery work. Therefore, a more efficient method for locating photomask production monitoring points is needed.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this disclosure is to provide a method, apparatus, and electronic device for locating monitoring points in photomask production, so as to overcome, at least to some extent, the problem of low efficiency in locating monitoring points in photomask production.

[0007] According to a first aspect of the present disclosure, a method for locating production monitoring points of a photomask is provided, comprising: determining the coordinates of one or more target detection areas on a photomask layout to be tested; generating a mask based on the coordinates of the target detection areas, the mask having the same size as the photomask layout to be tested, the mask including a cutout area corresponding to the target detection area; performing logical operations on the photomask layout to be tested and the mask, and obtaining the photomask layout of the target detection areas based on the result of the logical operations; obtaining multiple production monitoring locations that meet preset screening conditions based on the photomask layout of the target detection areas, and outputting the coordinates of the production monitoring locations as production monitoring points of the photomask layout to be tested.

[0008] In one exemplary embodiment of this disclosure, determining the coordinates of one or more target detection regions on the photomask layout to be tested includes: acquiring layout data corresponding to one or more target detection regions; and determining the geometric center coordinates and edge coordinates of the target detection regions based on the layout data.

[0009] In one exemplary embodiment of this disclosure, obtaining the layout data corresponding to one or more target detection regions includes: responding to a pen operation completion instruction corresponding to the layout data, and obtaining the layout data corresponding to a closed shape drawn by a pen tool.

[0010] In one exemplary embodiment of this disclosure, the closed shape includes a rectangle, a square ring, a circle, and a polygon.

[0011] In one exemplary embodiment of this disclosure, obtaining layout data corresponding to one or more target detection regions includes: responding to a semiconductor element selection operation corresponding to the layout data, and determining the layout data corresponding to the selected semiconductor element.

[0012] In an exemplary embodiment of this disclosure, generating a mask based on the coordinates of the target detection area includes: generating an initial mask based on the size of the photomask pattern to be tested; generating a first graphic on the initial mask with the geometric center coordinates of one of the target detection areas as the origin, the coordinate range of the first graphic including the edge coordinates of the target detection area; and setting the areas corresponding to one or more of the first graphics corresponding to one or more of the target detection areas as hollowed-out areas on the initial mask to form the mask.

[0013] In one exemplary embodiment of this disclosure, the first graphic is an axisymmetric graphic, including a rectangle and a circle.

[0014] In one exemplary embodiment of this disclosure, generating a mask based on the coordinates of the target detection area includes: generating an initial mask based on the size of the photomask pattern to be tested; generating a second graphic on the initial mask with the geometric center coordinates of the target detection area as the origin, wherein the edge coordinates are equal to the edge coordinates of the target detection area; and setting one or more areas corresponding to the second graphic on the initial mask as hollowed-out areas to form the mask.

[0015] In one exemplary embodiment of this disclosure, determining the coordinates of one or more target detection regions on the photomask layout to be tested includes: in response to one or more point selection operations on the photomask layout to be tested, setting the coordinates corresponding to the one or more point selection operations as the geometric center target of the one or more target detection regions.

[0016] In an exemplary embodiment of this disclosure, generating a mask based on the coordinates of the target detection area includes: generating an initial mask based on the size of the photomask pattern to be tested; generating a third graphic of a preset shape and preset size on the initial mask with the geometric center coordinates of the target detection area as the origin; and setting one or more areas corresponding to the third graphic on the initial mask as hollowed-out areas to form the mask.

[0017] In an exemplary embodiment of this disclosure, obtaining multiple production monitoring locations that meet preset screening conditions based on the photomask layout of the target detection area includes: inputting the preset screening conditions based on the photomask layout of the target detection area to determine the locations in the photomask layout of the target detection area that meet the preset screening conditions; and automatically outputting the coordinates of the locations in the photomask layout of the target detection area that meet the preset screening conditions.

[0018] In one exemplary embodiment of this disclosure, the preset filtering conditions include a filtering target, filtering parameters of the filtering target, and filtering values ​​corresponding to the filtering parameters.

[0019] In one exemplary embodiment of this disclosure, the filtering target includes lines, the filtering parameters include the tilt angle of the lines, the line width, and the spacing between the lines and adjacent graphics, and the filtering values ​​include the tilt angle value, the line width value, and the spacing value of the lines.

[0020] According to a second aspect of this disclosure, a photomask production monitoring point positioning device is provided, comprising: a target detection area positioning module, configured to determine the coordinates of one or more target detection areas on a photomask layout to be tested; a mask generation module, configured to generate a mask based on the coordinates of the target detection areas, the mask having the same size as the photomask layout to be tested, the mask including a cutout area corresponding to the target detection area; a photomask layout processing module, configured to perform logical operations on the photomask layout to be tested and the mask, and obtain the photomask layout of the target detection area based on the result of the logical operations; and a monitoring position filtering module, configured to obtain multiple production monitoring positions that meet preset filtering conditions based on the photomask layout of the target detection area, and output the coordinates of the production monitoring positions as production monitoring points of the photomask layout to be tested.

[0021] According to a third aspect of the present disclosure, an electronic device is provided, comprising: a memory; and a processor coupled to the memory, the processor being configured to perform the method as described in any one of the preceding embodiments based on instructions stored in the memory.

[0022] This embodiment of the present disclosure uses a cutout mask that matches the target detection area to perform logical operations on the photomask layout under test, which can accurately obtain the photomask layout of the target detection area, thereby quickly realizing the detection of the target detection area and the screening of production monitoring positions, which can greatly improve the efficiency of determining the production monitoring positions of the layout.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0025] Figure 1 This is a flowchart of the photomask production monitoring point positioning method in an exemplary embodiment of this disclosure.

[0026] Figure 2 This is a sub-flowchart of step S1 in one embodiment of this disclosure.

[0027] Figure 3 This is a sub-flowchart of step S2 in one embodiment of this disclosure.

[0028] Figure 4 This is a sub-flowchart of step S2 in another embodiment of this disclosure.

[0029] Figure 5 This is a sub-flowchart of step S2 in another embodiment of the present disclosure.

[0030] Figure 6A , Figure 6B , Figure 6C These are schematic diagrams of the masks formed in the embodiments of this disclosure.

[0031] Figure 7A and Figure 7B These are all schematic diagrams and results of the operation shown in step S3.

[0032] Figure 8 This is a diagram showing the locations of production monitoring.

[0033] Figure 9 This is a schematic diagram of an application scenario in one embodiment of this disclosure.

[0034] Figure 10 This is a schematic diagram of the photomask production monitoring point positioning device in an embodiment of this disclosure.

[0035] Figure 11 This is a block diagram of an electronic device according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0036] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this disclosure more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced with one or more of these specific details omitted, or other methods, components, apparatus, or steps can be employed. In other instances, well-known technical solutions are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0037] Furthermore, the accompanying drawings are merely illustrative of this disclosure, and the same reference numerals in the drawings denote the same or similar parts, thus omitting repeated descriptions of them. The block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0038] In the photomask fabrication process, critical dimension measurement (CDM) parameters, including the values ​​of multiple critical dimensions and the coordinates of the measurement positions (also known as CDM coordinates), are crucial parameters for monitoring photomask quality. These parameters are provided by the wafer designer based on design requirements. The photomask manufacturer measures the dimensions of the corresponding locations on the photomask based on the CDM coordinates and the corresponding critical dimension values ​​provided by the wafer designer, and then generates a photomask quality report. Currently, the wafer designer manually searching for suitable CDM coordinates for measurement is generally inefficient and prone to errors. Measurements of special patterns also struggle to ensure uniformity and accuracy, resulting in an inaccurate and comprehensive assessment of the overall photomask quality.

[0039] The exemplary embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0040] Figure 1 This is a flowchart of the photomask production monitoring point positioning method in an exemplary embodiment of this disclosure.

[0041] refer to Figure 1 The photomask production monitoring point positioning method 100 may include:

[0042] Step S1: Determine the coordinates of one or more target detection areas on the photomask layout to be tested;

[0043] Step S2: Generate a mask based on the coordinates of the target detection area. The mask has the same size as the photomask pattern to be tested. The mask includes a cutout area corresponding to the target detection area.

[0044] Step S3: Perform logical operations on the photomask layout to be tested and the mask, and obtain the photomask layout of the target detection area based on the result of the logical operations;

[0045] Step S4: Based on the photomask layout of the target detection area, obtain multiple production monitoring locations that meet the preset screening conditions, and output the coordinates of the production monitoring locations as the production monitoring points of the photomask layout to be tested.

[0046] This embodiment of the present disclosure uses a cutout mask that matches the target detection area to perform logical operations on the photomask layout under test, which can accurately obtain the photomask layout of the target detection area, thereby quickly realizing the detection of the target detection area and the screening of production monitoring positions, which can greatly improve the efficiency of determining the production monitoring positions of the layout.

[0047] The following is a detailed explanation of each step in the photomask production monitoring point positioning method 100.

[0048] In step S1, the coordinates of one or more target detection areas on the photomask layout to be tested are determined.

[0049] The photomask layout to be tested refers to the electronic file (such as a MEBES file) of the layout data generated by the designer who will deliver it to the photomask manufacturer for photomask production. This electronic file contains graphic data, coordinate data, or digital data that can be queried and modified.

[0050] The target detection area corresponds to CDM coordinates and is used to control product quality during the photomask production process at the photomask manufacturer. One or more target areas can be specified based on default data (experience) or design specifications, or can be specified by the designer based on the actual design graphics. The target detection area can be the layout area corresponding to important components that need to be accurately measured, the layout area containing key dimensions that need to be precisely controlled, or the layout area containing graphics that can maximize the verification of layout manufacturing accuracy (such as minimum spacing or minimum linewidth). Any layout area that can help detect the quality of photomask production can be used as a target detection area, and this disclosure does not impose any special restrictions on it.

[0051] In practice, the target detection area can be a range defined by selection tools, a range specified by input coordinates, or a target element selected by mouse, touch, or other means.

[0052] In one embodiment of this disclosure, the coordinates of the target detection region may include the geometric center coordinates and edge coordinates of the target detection region.

[0053] Figure 2 This is a sub-flowchart of step S1 in one embodiment of this disclosure.

[0054] refer to Figure 2 In one exemplary embodiment of this disclosure, step S1 may include:

[0055] Step S11: Obtain the map data corresponding to one or more target detection regions;

[0056] Step S12: Determine the geometric center coordinates and edge coordinates of the target detection area based on the map data.

[0057] In step S11, in response to a pen operation completion command corresponding to the photomask layout under test, the layout data corresponding to the closed shape drawn by the pen tool can be obtained. In one embodiment, the closed shape can be a rectangle, a square ring, a circle, or a polygon. The aforementioned pen operation can be performed using the pen tool, selection tool, etc., provided by the layout drawing software. The pen operation can be performed by the operator to flexibly mark the closed shape corresponding to the target detection area on the photomask layout under test, thereby obtaining the layout data corresponding to the closed shape. The closed shape does not necessarily have to be a symmetrical shape; it can be set as a shape formed along the edge of the target detection area according to actual needs to accurately match the target detection area.

[0058] In another embodiment, step S11 may also respond to a semiconductor element selection operation corresponding to the photomask layout under test, determining the layout data corresponding to the selected semiconductor element. It is understood that when the target detection area is the selected semiconductor element, the edge of the semiconductor element's layout area is not necessarily a regular shape such as a square or circle.

[0059] Next, the geometric center coordinates and edge coordinates of the target detection area can be automatically located based on the selected map data.

[0060] In another embodiment of this disclosure, the coordinates corresponding to one or more point selection operations on the photomask layout to be tested can be directly set as the geometric center target of one or more target detection areas. In this embodiment, the point selection operation does not need to involve the edge coordinates of the target detection area, and the edge coordinates of the target detection area are automatically formed in the subsequent mask generation process, resulting in high operation efficiency.

[0061] Besides selecting the coordinates of the target detection area, you can also directly input the geometric center and edge coordinates of the target detection area based on the coordinate range of the map data. For example, you can directly determine the range of edge coordinates as the area enclosed by four positioning points (x1, y1), (x2, y2), (x3, y4), and (x4, y4), or a circle with center (x5, y5) and radius R, etc. The number of positioning points mentioned above is just an example; in actual operation, more than three positioning points are needed to define an enclosed area.

[0062] Directly inputting coordinates to locate the target detection area can further improve positioning efficiency, making it suitable for scenarios with accurate measurement objectives, such as those requiring uniformity of the target detection area. For example, when locating a fixed offset point of each chip in a photomask layout involving multiple chips, the center coordinates of each chip in the photomask layout can be obtained first, or the coordinates of the same positioning point shared by all chips (e.g., coordinates of a certain overlay mark). Then, based on an offset coordinate, the geometric positioning coordinates of the target detection area corresponding to each chip can be generated. These positioning coordinates can be either the center coordinates of the target detection area or the coordinates of a certain edge of the target detection area, such as the coordinates of a corner. Since the final positioning coordinates of the target detection area are automatically calculated, fast, uniform, and accurate positioning of the target detection area can be achieved.

[0063] In step S2, a mask is generated based on the coordinates of the target detection area. The mask has the same size as the photomask pattern to be tested, and the mask includes a cutout area corresponding to the target detection area.

[0064] Depending on whether the edge coordinates of the target detection area are defined, different operation procedures are performed for generating the mask in step S2.

[0065] Figure 3 This is a sub-flowchart of step S2 in one embodiment of this disclosure. Figure 3 The embodiment shown corresponds to the scenario in step S1 where the edge coordinates of the target detection area are defined.

[0066] refer to Figure 3 In one exemplary embodiment of this disclosure, step S2 may include:

[0067] Step S21: Generate an initial mask based on the dimensions of the photomask pattern to be tested;

[0068] Step S22: Generate a first graphic on the initial mask with the geometric center coordinates of a target detection region as the origin. The coordinate range of the first graphic includes the edge coordinates of the target detection region.

[0069] Step S23: On the initial mask, set the regions corresponding to one or more target detection regions and one or more first graphics to be hollowed out to form a mask.

[0070] In one embodiment of this disclosure, the initial mask file type is a GDS file (x.gds), the file used to store the first graphic corresponding to the target detection area is also a GDS file, the mask formed after processing based on the initial mask is an OASIS file (x.oas), and the finally generated cutout mask is the same OASIS file. Both the GDS and OASIS files are layout files used to produce the photomasks required for the photolithography process. The GDS corresponds to a Cartesian coordinate system (e.g., recording a rectangle requires recording the coordinates of four vertices), containing the geometry of planes in the integrated circuit layout, text or labels, and other relevant information, and can be composed of a hierarchical structure. The OASIS file corresponds to a polar coordinate system (recording a rectangle requires recording the coordinates of one endpoint and one angle), defining the code required for rectangular, trapezoidal, and polygonal geometries, defining the type of each shape, how to organize them into pattern units containing these shapes, and the relative position of each pattern unit. The OASIS file has a smaller data size, which helps to shorten file transfer time.

[0071] The initial mask is completely identical in shape (size and shape) to the photomask pattern under test. The initial mask also has coordinates completely identical to those of the photomask pattern under test. In step S22, the same coordinate point can be located on the initial mask based on the geometric center coordinates of the target detection area. The coordinates on the initial mask and the photomask pattern under test will not be distinguished verbally below.

[0072] Each target detection region corresponds to a first graphic. The first graphic can be a graphic centered on the geometric center coordinates of the target detection region and covering the corresponding target detection region (the coordinate range includes the edge coordinates of the target detection region). In an exemplary embodiment of this disclosure, the first graphic is an axisymmetric graphic, including rectangles and circles. Figure 3 The illustrated embodiment can be applied to scenarios where the edge contours of the target detection region are irregular (e.g., the target detection region defined by outlining with a brush tool and the target detection region of a corresponding irregular semiconductor element), improving the efficiency of mask generation. The edge calculation rules of the first graphic can be preset to generate the first graphic based on the maximum range of the target detection region.

[0073] After the first graphic is formed, the initial mask is cut out in step S23 to form a mask. Each cutout area in the mask corresponds to a target detection area, which is used to retain the coordinate information of the target detection area and to locate the photomask pattern to be tested based on these coordinate information in subsequent operations.

[0074] The cutout operation can perform a logical AND NOT operation on the initial mask and the file used to store the coordinates of the target detection area to generate a mask that does not include the area corresponding to the target detection area.

[0075] Figure 4 This is a sub-flowchart of step S2 in another embodiment of this disclosure. Figure 4 The embodiment shown also corresponds to the scenario in step S1 where the edge coordinates of the target detection area are defined.

[0076] refer to Figure 4 In another embodiment of this disclosure, step S2 may include:

[0077] Step S21: Generate an initial mask based on the dimensions of the photomask pattern to be tested;

[0078] Step S24: On the initial mask, with the geometric center coordinates of the target detection area as the origin, generate a second graphic whose edge coordinates are equal to the edge coordinates of the target detection area.

[0079] Step S25: Set one or more areas corresponding to the second graphic to be cut out on the initial mask to form a mask.

[0080] exist Figure 4 In the embodiment shown, the edge of the cutout area on the mask accurately coincides with the edge of the target detection area, that is, a cutout area that precisely corresponds to the target detection area is formed on the mask. Figure 4The illustrated embodiment can be applied to target detection areas with relatively regular outlines (e.g., rectangles) to accurately locate the corresponding cutout areas, or it can be applied when the area of ​​the target detection area is larger than a preset value to reduce the area of ​​the cutout areas, reduce the workload of subsequent screening, and improve the efficiency of production monitoring location positioning in subsequent steps.

[0081] Figure 5 This is a sub-flowchart of step S2 in another embodiment of the present disclosure. Figure 5 The embodiment shown also corresponds to the scenario in step S1 where only the edge coordinates of the target detection area are given.

[0082] refer to Figure 5 In one exemplary embodiment of this disclosure, step S2 may include:

[0083] Step S21: Generate an initial mask based on the dimensions of the photomask pattern to be tested;

[0084] Step S26: Generate a third graphic with a preset shape and preset size on the initial mask, using the geometric center coordinates of the target detection area as the origin;

[0085] Step S27: Set the area corresponding to one or more third graphics to be cut out on the initial mask to form a mask.

[0086] Figure 5 The illustrated embodiment can be applied to locations where the shape of the target detection area is not critical. For example, the target detection area corresponds to multiple dense parallel lines (e.g., parallel data signal lines, address signal lines, etc., involving large areas and long distances on a layout), to verify the line width and spacing of the parallel lines. In this case, a third graphic including information about multiple parallel lines can be generated, centered on any point in the central part of the parallel line area, to capture the parallel line information. In this situation, the size and shape of the third graphic are not critical; the third graphic can be, for example, a rectangle (window-like), whose edges only need to cover multiple parallel lines.

[0087] The above is merely an example. In practice, it can be applied to any region where the shape of the target detection area is not strictly required. Figure 5 The illustrated embodiment generates a mask to improve mask generation efficiency. The preset shape and size corresponding to the third graphic can be edited to adapt to various layout areas.

[0088] Although Figure 3 , Figure 4 , Figure 5 The process of generating the layout is described separately, but it will be understood that in other embodiments of this disclosure, Figure 3 , Figure 4 , Figure 5The process of generating cutout areas in the mask can be used in combination to correspond to various target detection areas.

[0089] In addition, Figure 3 , Figure 4 , Figure 5 In the illustrated embodiment, the process of generating a mask based on the target detection area can be achieved through a logical AND-NOT operation. That is, a logical AND-NOT operation is performed between the initial mask and the first / second / third graphic to form a cutout area on the initial mask, thereby forming the mask. There are various ways to set cutouts on the initial mask, and this disclosure is not limited to this.

[0090] Figure 6A , Figure 6B , Figure 6C These are schematic diagrams of the masks formed in the embodiments of this disclosure.

[0091] Figure 6A Mask 62 shown Figure 3 The illustrated embodiment corresponds to... Figure 6B Mask 63 shown Figure 4 The illustrated embodiment corresponds to... Figure 6C Mask 64 shown Figure 5 The illustrated embodiment corresponds to this.

[0092] refer to Figure 6A The initial mask 60 has the same size and shape as the photomask pattern 61 to be tested, and the photomask pattern 61 records a defined target detection area 600. In step S22, a first graphic 601 with rules is generated according to the target detection area 600, and then in step S23, the corresponding area of ​​the first graphic 601 is set as a cutout to form a mask 62, which has a cutout area 602. The cutout area 602 of the mask 62 covers the edge coordinates of the target detection area 600. The coordinate range of the first graphic 601 includes the coordinate range of the target detection area 600.

[0093] refer to Figure 6B The initial mask 60 has the same size and shape as the photomask pattern 61 to be tested, and the photomask pattern 61 to be tested records a defined target detection area 603. In step S24, a completely identical second graphic 604 is generated based on the target detection area 603, and then in step S25, the corresponding area of ​​the second graphic 604 is set as a cutout to form a mask 63, which has a cutout area 605. The cutout area 605 of the mask 63 completely coincides with the edge coordinates of the target detection area 603.

[0094] refer to Figure 6CThe initial mask 60 has the same size and shape as the photomask pattern 61 to be tested. The photomask pattern 61 to be tested records the geometric center coordinates 606 of the defined target detection area. In step S26, a third graphic 607 with a preset shape and preset size is generated based on the geometric center coordinates 606 of the target detection area. Then, in step S27, the corresponding area of ​​the third graphic 607 is set as a cutout to form a mask 64, which has a cutout area 608. The geometric center coordinates of the cutout area 608 of the mask 64 are the geometric center coordinates 606 of the target detection area, and the edge coordinates completely coincide with the edge coordinates of the third graphic 607.

[0095] exist Figure 6A , Figure 6B , Figure 6C In the illustrated embodiment, the logical operations used to generate the hollow mask 64 can all be ANDNOT operations.

[0096] In step S3, logical operations are performed on the photomask layout to be tested and the mask, and the photomask layout of the target detection area is obtained based on the result of the logical operations.

[0097] In one embodiment, the logical operation in step S3 is a logical OR operation. Since the mask generated in step S2 does not contain the coordinates corresponding to the target detection area, the layout data corresponding to the target detection area in the photomask layout can be filtered out by performing a logical OR operation between the photomask layout to be tested and the mask, and then the layout data can be saved to form the photomask layout of the target detection area.

[0098] Figure 7A and Figure 7B These are all schematic diagrams and results of the operation shown in step S3.

[0099] refer to Figure 7A and Figure 7B The photomask layout 70 and the mask 71 are two independent data files, but they have completely consistent coordinate systems and outer edge dimension data. The mask 71 has multiple cutout regions 701 corresponding to the target detection area. In step S3, a logical OR operation is performed on the photomask layout 70 and the mask 71 to obtain the photomask layout corresponding to the cutout region of the mask 71 on the photomask layout 71, that is, the photomask layout 72 of the target detection area.

[0100] Figure 7A This is a schematic diagram showing that the target detection area is located in the center of the photomask layout 70 under test. Figure 7B This is a schematic diagram showing the target detection area located on the border of the photomask layout 70 under test.

[0101] Figure 7A and Figure 7BBoth images show magnified images of the photomask layout 72 for the target detection region. It can be seen that the photomask layout 72 only includes a small amount of layout information from the photomask layout 70 under test that corresponds to the target detection region, thereby reducing the computational load of step S4 and greatly improving the processing efficiency of the photomask layout 70 under test.

[0102] Figure 7A and Figure 7B The mask layout under test in the image can correspond to a storage subarray. By offsetting the center coordinates of the storage subarray, a corresponding rectangle can be accurately drawn to select the measurement area, such as measuring only the core area. Figure 7A Or only measure the edge region of the storage subarray ( Figure 7B Therefore, the method provided in this disclosure can evaluate the size of a specific region's graphic, and the generated production monitoring points can provide a more comprehensive and accurate evaluation of the photomask quality.

[0103] It should be noted that the file format of the photomask layout 72 of the target detection area generated in step S3 can be an OASIS file, the same as the file format of the cut-out mask 71. The file format of the photomask layout 70 to be tested can be a MEBES file.

[0104] By performing a logical OR operation on the photomask layout 70 to be tested using a hollow mask 71, a photomask layout 72 containing only the layout data of the target detection area can be generated. This can greatly reduce the computational load of subsequent screening and positioning, and accurately obtain the layout data of the target detection area, thereby improving the accuracy of production monitoring location screening.

[0105] In step S4, based on the photomask layout of the target detection area, multiple production monitoring locations that meet preset screening conditions are obtained, and the coordinates of the production monitoring locations are output as the production monitoring points of the photomask layout to be tested.

[0106] In one embodiment of this disclosure, step S4 may include: inputting preset filtering conditions based on the photomask layout of the target detection area to determine the positions in the photomask layout of the target detection area that meet the preset filtering conditions, and then automatically outputting the coordinates of the positions in the photomask layout of the target detection area that meet the preset filtering conditions.

[0107] The preset filtering conditions can include the filtering target, the filtering parameters of the filtering target, and the filtering values ​​corresponding to the filtering parameters.

[0108] Filtering the photomask layout of the target detection area can be performed automatically through a pre-set calculation program. Since the amount of layout data to be filtered is very small (see reference...), this is necessary. Figure 7A or Figure 7B(Comparison of photomask layout 72 in the target detection area with photomask layout 70 under test) The computational load of the calculation program is greatly reduced and the calculation efficiency is greatly improved. It can quickly locate the position that meets the preset screening conditions, and then output the coordinates of these positions as production monitoring points.

[0109] Figure 8 This is a diagram showing the locations of production monitoring.

[0110] refer to Figure 8 In one embodiment, the filtering target includes lines, and the filtering parameters include the line's tilt angle, line width, and spacing between the line and adjacent graphics. The filtering values ​​include the line's tilt angle, line width, and spacing. The lines can be diagonal, meaning the tilt angle is not equal to 0°, 90°, 180°, or 270°. The tilt angle is defined based on the default coordinate system of the drawing software. In general, when drawing based on the default coordinate system of the drawing software, the border of a rectangle is either vertical or horizontal. Figure 8 In the illustrated embodiment, the diagonal line refers to a diagonal line relative to the rectangular border.

[0111] For example, you can set a position where the line tilt angle is -60°, the line width is 30nm, and the spacing between the line and the edge of the adjacent graphic is 90nm. Figure 8 Position 81 in the middle.

[0112] In related technologies, for oblique lines with irregular tilt angles (neither horizontal nor vertical), screening based on all data of the photomask layout 70 under test would be extremely time-consuming, typically taking several hours or even more than ten hours to process a single photomask layout 70. Alternatively, operators could visually locate areas where lines might meet the criteria, measuring line by line, marking points, and finally marking the positions that meet the criteria. However, this manual measurement is labor-intensive and prone to errors, making it extremely difficult to achieve the high-precision testing requirements of the photomask layout 70 under test.

[0113] The method of this disclosure, by narrowing the range of automatically screened pattern data from the photomask pattern 70 to a photomask pattern 72 with multiple target detection areas, can greatly improve the efficiency of automatic screening, quickly and accurately marking production monitoring locations that meet preset screening conditions, thereby obtaining production monitoring points that can be provided to photomask manufacturers. According to experiments, the output time of production monitoring points in this disclosure embodiment can be reduced to less than half an hour, with an average speed increase of more than 8 times, greatly saving time costs.

[0114] In one embodiment, the method of this disclosure can be used to locate specific graphics and regions of a chip area (chip).

[0115] Figure 9 This is a schematic diagram of an application scenario in one embodiment of this disclosure.

[0116] refer to Figure 9 The same pattern may become different after OPC (Optical Proximity Correction). By using the method provided in this disclosure, a hollow mask is used to perform logical operations on the pattern to obtain the pattern data of the target detection area. That is, the pattern data of the two target detection areas 91 and 92 after OPC correction are accurately located by Pattern match (mask matching). The size difference of the two identical patterns after correction can be compared, and the impact of OPC correction on the mask fabrication can be analyzed.

[0117] Furthermore, the embodiments disclosed herein can also implement key graphic size links.

[0118] The dimensions of the fabricated photomask will differ from those in the design file. After exposure using this photomask, the pattern on the wafer will also differ from that of the photomask, resulting in a significant difference between the pattern on the wafer and the design file.

[0119] Using the method provided in this disclosure, the coordinates of key dimension graphics can be captured, graphics prone to defects can be tracked and detected, and a complete dimension monitoring system can be formed by linking with the backend.

[0120] In summary, the embodiments of this disclosure, by using a mask to export the photomask layout of the target measurement area and then filtering the photomask layout of the target measurement area with a small amount of data to determine the CDM coordinates, greatly shorten the time for CDM coordinate filtering and solve the problems of long time consumption, low efficiency and easy error in manual CDM measurement in related technologies.

[0121] Furthermore, by providing the coordinates of the target detection area and using a mask to filter out a small number of target measurement areas, the mask layout data of the specified graphic area can be selectively exported and analyzed. This ensures the uniformity and accuracy of CDM size measurement and accurately assesses the impact of OPC (Optical Proximity Correction) on the mask fabrication process.

[0122] Finally, since the shape and coordinates of the photomask pattern in the target detection area can be accurately defined, the uniformity and accuracy of the calculation are far superior to manual measurement. The improved uniformity and accuracy can overcome the problem of capturing special graphic sizes and can be used to monitor the size of specific graphics in the photomask pattern to be measured.

[0123] Corresponding to the above embodiments, this disclosure also provides a photomask production monitoring point positioning device for implementing the above embodiments.

[0124] Figure 10 This is a schematic diagram of the photomask production monitoring point positioning device in an embodiment of this disclosure.

[0125] refer to Figure 10 The photomask production monitoring point positioning device 1000 may include:

[0126] The target detection area positioning module 101 is configured to determine the coordinates of one or more target detection areas on the photomask layout to be tested.

[0127] The mask generation module 102 is configured to generate a mask based on the coordinates of the target detection area. The mask has the same size as the photomask pattern to be tested. The mask includes a cutout area corresponding to the target detection area.

[0128] The photomask layout processing module 103 is configured to perform logical operations on the photomask layout to be tested and the mask, and obtain the photomask layout of the target detection area based on the result of the logical operations.

[0129] The monitoring location filtering module 104 is configured to obtain multiple production monitoring locations that meet preset filtering conditions based on the photomask layout of the target detection area, and output the coordinates of the production monitoring locations as the production monitoring points of the photomask layout to be tested.

[0130] In one exemplary embodiment of this disclosure, the target detection region localization module 101 is configured to: acquire map data corresponding to one or more target detection regions; and determine the geometric center coordinates and edge coordinates of the target detection region based on the map data.

[0131] In one exemplary embodiment of this disclosure, the target detection area localization module 101 is configured to: in response to a pen operation completion instruction corresponding to the map data, acquire map data corresponding to the closed shape drawn by the pen tool.

[0132] In one exemplary embodiment of this disclosure, the closed shape includes a rectangle, a square ring, a circle, and a polygon.

[0133] In one exemplary embodiment of this disclosure, the target detection area localization module 101 is configured to: in response to a semiconductor element selection operation corresponding to the layout data, determine the layout data corresponding to the selected semiconductor element.

[0134] In an exemplary embodiment of this disclosure, the mask generation module 102 is configured to: generate an initial mask according to the size of the photomask pattern to be tested; generate a first graphic on the initial mask with the geometric center coordinates of one of the target detection areas as the origin, the coordinate range of the first graphic including the edge coordinates of the target detection area; and set the areas corresponding to one or more of the first graphic corresponding to one or more of the target detection areas as hollowed-out areas on the initial mask to form the mask.

[0135] In one exemplary embodiment of this disclosure, the first graphic is an axisymmetric graphic, including a rectangle and a circle.

[0136] In an exemplary embodiment of this disclosure, the mask generation module 102 is configured to: generate an initial mask according to the size of the photomask pattern to be tested; generate a second graphic on the initial mask with the geometric center coordinates of the target detection area as the origin, and the edge coordinates of the second graphic being equal to the edge coordinates of the target detection area; and set one or more areas corresponding to the second graphic on the initial mask as hollowed-out areas to form the mask.

[0137] In one exemplary embodiment of this disclosure, the target detection region localization module 101 is configured to: in response to one or more point selection operations on the photomask layout to be tested, set the coordinates corresponding to the one or more point selection operations as the geometric center target of the one or more target detection regions.

[0138] In one exemplary embodiment of this disclosure, the mask generation module 102 is configured to: generate an initial mask according to the size of the photomask pattern to be tested; generate a third graphic of a preset shape and preset size on the initial mask with the geometric center coordinates of the target detection area as the origin; and set the areas corresponding to one or more of the third graphics on the initial mask as hollowed-out areas to form the mask.

[0139] In one exemplary embodiment of this disclosure, the monitoring location filtering module 104 is configured to: input the preset filtering conditions based on the photomask layout of the target detection area to determine the location in the photomask layout of the target detection area that meets the preset filtering conditions; and automatically output the coordinates of the location in the photomask layout of the target detection area that meets the preset filtering conditions.

[0140] In one exemplary embodiment of this disclosure, the preset filtering conditions include a filtering target, filtering parameters of the filtering target, and filtering values ​​corresponding to the filtering parameters.

[0141] In one exemplary embodiment of this disclosure, the filtering target includes lines, the filtering parameters include the tilt angle of the lines, the line width, and the spacing between the lines and adjacent graphics, and the filtering values ​​include the tilt angle value, the line width value, and the spacing value of the lines.

[0142] In an exemplary embodiment of this disclosure, an electronic device capable of implementing the above-described method is also provided.

[0143] Those skilled in the art will understand that aspects of the embodiments of this disclosure can be implemented as a system, method, or program product. Therefore, aspects of the embodiments of this disclosure can be specifically implemented as: a completely hardware implementation, a completely software implementation (including firmware, microcode, etc.), or an implementation combining hardware and software aspects, collectively referred to herein as a "circuit," "module," or "system."

[0144] The following reference Figure 11 To describe an electronic device 1100 according to such an embodiment of the present disclosure. Figure 11 The electronic device 1100 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments disclosed herein.

[0145] like Figure 11 As shown, the electronic device 1100 is manifested in the form of a general-purpose computing device. The components of the electronic device 1100 may include, but are not limited to: at least one processing unit 1111, at least one storage unit 1120, and a bus 1130 connecting different system components (including storage unit 1120 and processing unit 1111).

[0146] The storage unit stores program code that can be executed by the processing unit 1111, causing the processing unit 1111 to perform the steps described in the "Exemplary Methods" section of this specification according to various exemplary embodiments of this disclosure. For example, the processing unit 1111 can perform the method shown in the embodiments of this disclosure.

[0147] Storage unit 1120 may include readable media in the form of volatile storage units, such as random access memory (RAM) 11201 and / or cache memory 11202, and may further include read-only memory (ROM) 11203.

[0148] Storage unit 1120 may also include a program / utility 11204 having a set (at least one) program module 11205, such program module 11205 including but not limited to: operating system, one or more application programs, other program modules and program data, each or some combination of these examples may include an implementation of a network environment.

[0149] Bus 1130 can represent one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local bus using any of the various bus structures.

[0150] Electronic device 1100 can also communicate with one or more external devices 1200 (e.g., keyboard, pointing device, Bluetooth device, etc.), one or more devices that enable a user to interact with electronic device 1100, and / or any device that enables electronic device 1100 to communicate with one or more other computing devices (e.g., router, modem). This communication can be performed via input / output (I / O) interface 1150. Furthermore, electronic device 1100 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 1160. As shown, network adapter 1160 communicates with other modules of electronic device 1100 via bus 1130. It should be understood that, although not shown in the figures, other hardware and / or software modules can be used in conjunction with electronic device 1100, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0151] In exemplary embodiments of this disclosure, a computer-readable storage medium is also provided, on which a program product capable of implementing the methods described above is stored. In some possible implementations, various aspects of the embodiments of this disclosure may also be implemented as a program product including program code, which, when the program product is run on a terminal device, causes the terminal device to perform the steps of the various exemplary embodiments of this disclosure described in the "Exemplary Methods" section above.

[0152] Furthermore, the above figures are merely illustrative of the processes included in the method according to exemplary embodiments of this disclosure and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously in multiple modules.

[0153] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and concept of this disclosure are indicated by the claims.

Claims

1. A method for locating monitoring points in photomask production, characterized in that, include: Determine the coordinates of one or more target detection regions on the photomask layout to be tested; A mask is generated based on the coordinates of the target detection area. The mask has the same size as the photomask pattern to be tested. The mask includes a cutout area corresponding to the target detection area. Perform logical operations on the photomask layout to be tested and the mask, and obtain the photomask layout of the target detection area based on the result of the logical operations; Based on the photomask layout of the target detection area, multiple production monitoring locations that meet preset screening conditions are obtained, including: inputting the preset screening conditions based on the photomask layout of the target detection area to determine the locations in the photomask layout of the target detection area that meet the preset screening conditions, and automatically outputting the coordinates of the locations in the photomask layout of the target detection area that meet the preset screening conditions; outputting the coordinates of the production monitoring locations as production monitoring points of the photomask layout to be tested; wherein, the preset screening conditions include screening targets and screening parameters of the screening targets; the screening targets include lines, and the screening parameters include the tilt angle of the lines, the line width, and the spacing between the lines and adjacent graphics.

2. The method for locating monitoring points in photomask production as described in claim 1, characterized in that, Determining the coordinates of one or more target detection regions on the photomask layout includes: Acquire the layout data corresponding to one or more of the target detection regions; The geometric center coordinates and edge coordinates of the target detection area are determined based on the map data.

3. The method for locating monitoring points in photomask production as described in claim 2, characterized in that, The step of acquiring the map data corresponding to one or more of the target detection regions includes: In response to a pen operation completion command corresponding to the layout data, the layout data corresponding to the closed shape drawn by the pen tool is obtained.

4. The method for locating monitoring points in photomask production as described in claim 3, characterized in that, The closed shapes include rectangles, square rings, circular rings, and polygons.

5. The method for locating monitoring points in photomask production as described in claim 2, characterized in that, The step of acquiring the map data corresponding to one or more of the target detection regions includes: In response to a semiconductor element selection operation corresponding to the layout data, the layout data corresponding to the selected semiconductor element is determined.

6. The method for locating monitoring points in photomask production as described in any one of claims 2 to 5, characterized in that, Generating a mask based on the coordinates of the target detection area includes: An initial mask is generated based on the dimensions of the photomask layout to be tested; A first graphic is generated on the initial mask with the geometric center coordinates of the target detection region as the origin, and the coordinate range of the first graphic includes the edge coordinates of the target detection region; On the initial mask, one or more regions corresponding to one or more of the target detection regions and one or more regions corresponding to the first graphic are set as hollowed out to form the mask.

7. The method for locating monitoring points in photomask production as described in claim 6, characterized in that, The first figure is an axisymmetric figure, including rectangles and circles.

8. The method for locating monitoring points in photomask production as described in any one of claims 2 to 5, characterized in that, Generating a mask based on the coordinates of the target detection area includes: An initial mask is generated based on the dimensions of the photomask layout to be tested; On the initial mask, with the geometric center coordinates of the target detection area as the origin, a second graphic is generated whose edge coordinates are equal to the edge coordinates of the target detection area. One or more areas corresponding to the second graphic are set as cutouts on the initial mask to form the mask.

9. The method for locating monitoring points in photomask production as described in claim 1, characterized in that, Determining the coordinates of one or more target detection regions on the photomask layout includes: In response to one or more point selection operations on the photomask layout to be tested, the coordinates corresponding to the one or more point selection operations are set as the geometric center target of the one or more target detection areas.

10. The method for locating monitoring points in photomask production as described in claim 9, characterized in that, The step of generating a mask based on the coordinates of the target detection region includes: An initial mask is generated based on the dimensions of the photomask layout to be tested; A third graphic of a preset shape and size is generated on the initial mask with the geometric center coordinates of the target detection area as the origin; The mask is formed by setting one or more areas corresponding to the third graphic to be hollowed out on the initial mask.

11. The method for locating monitoring points in photomask production as described in claim 1, characterized in that, The preset filtering conditions also include the filtering values ​​corresponding to the filtering parameters.

12. The method for locating monitoring points in photomask production as described in claim 11, characterized in that, The filtering values ​​include the tilt angle of the lines, the line width, and the spacing.

13. A photomask production monitoring point positioning device, characterized in that, include: The target detection area localization module is configured to determine the coordinates of one or more target detection areas on the photomask layout to be tested. The mask generation module is configured to generate a mask based on the coordinates of the target detection area. The mask has the same size as the photomask pattern to be tested, and the mask includes a cutout area corresponding to the target detection area. The photomask layout processing module is configured to perform logical operations on the photomask layout to be tested and the mask, and obtain the photomask layout of the target detection area based on the result of the logical operations. The monitoring location filtering module is configured to obtain multiple production monitoring locations that meet preset filtering conditions based on the photomask layout of the target detection area. This includes: inputting the preset filtering conditions based on the photomask layout of the target detection area to determine locations in the photomask layout that meet the preset filtering conditions; automatically outputting the coordinates of these locations in the photomask layout; and outputting the coordinates of the production monitoring locations as production monitoring points in the photomask layout to be tested. The preset filtering conditions include filtering targets and filtering parameters for the filtering targets. The filtering targets include lines, and the filtering parameters include the tilt angle of the lines, the line width, and the spacing between the lines and adjacent graphics.

14. An electronic device, characterized in that, include: Memory; as well as A processor coupled to the memory, the processor being configured to execute the photomask production monitoring point location method as described in any one of claims 1-12 based on instructions stored in the memory.

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