Chip and electronic device

By dividing the chip into sensing regions and utilizing highly sensitive magnetic tunnel junctions to sense magnetic fields and temperatures, the reliability problem of MRAM chips under external magnetic field interference is solved, enabling cost-effective failure location determination and user alerts.

CN117672285BActive Publication Date: 2026-05-29HUAWEI TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2022-08-30
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

In chips containing MRAM, the reliability of the chip is easily affected by interference from the external magnetic field environment, and existing technologies increase packaging costs by adding magnetic field and temperature sensors.

Method used

The chip is divided into sensing areas, and the high sensitivity of the first magnetic tunnel junction in the sensing area is used to sense the magnetic field and/or temperature. By setting magnetic tunnel junctions of different diameters during the same wafer etching process, the magnetic field and temperature sensing capabilities of the sensing area are enhanced, and the sensor packaging is reduced.

Benefits of technology

This enables timely and accurate location determination of chip failure, reduces sensor packaging costs, and improves chip reliability and the accuracy of user alerts.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN117672285B_ABST
    Figure CN117672285B_ABST
Patent Text Reader

Abstract

The application provides a chip and an electronic device, wherein the chip comprises a data storage area and a sensing area, the magnetic field sensitivity of a first magnetic tunnel junction in the sensing area is higher than the magnetic field sensitivity of a second magnetic tunnel junction in the data storage area, and / or the temperature sensitivity of the first magnetic tunnel junction in the sensing area is higher than the temperature sensitivity of the second magnetic tunnel junction in the data storage area, data is stored through the data storage area, and the magnetic field and / or temperature of the chip are sensed through the sensing area, so that the failure position of the chip can be determined in time and accurately.
Need to check novelty before this filing date? Find Prior Art