Heat dissipation module and electronic device

Abstract

Embodiments of the present application provide a heat dissipation module and an electronic device, and relate to the technical field of heat dissipation. The heat dissipation module comprises a first cooling pipeline, a second cooling pipeline, a first cold plate, a second cold plate, at least one heat pipe, a first cold plate support and a second cold plate support. The first cooling pipeline is used for inputting a cooling working medium, and the second cooling pipeline is used for outputting the cooling working medium. The first cold plate support is used for supporting the first cold plate, and the second cold plate support is used for supporting the second cold plate. The first cold plate is in communication with the first cooling pipeline and the second cooling pipeline. A contact surface of the first cold plate is in contact with a component to be cooled, and is used for absorbing heat of the component to be cooled. The second cold plate is in communication with the first cooling pipeline and the second cooling pipeline. The second cold plate is arranged in a spaced manner with the first cold plate. The heat pipe is connected with the first cold plate and the second cold plate. The heat dissipation module provided by the embodiments of the present application can be applied to the electronic device, and heat dissipation of the electronic device can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and in particular to a heat dissipation module and an electronic device. BACKGROUND

[0002] An electronic device will generate a large amount of heat when working. In order to avoid the temperature being too high to affect the normal work of the electronic device, a heat dissipation device needs to be used to dissipate heat for the electronic device. SUMMARY

[0003] The purpose of the present application is to provide a heat dissipation module and an electronic device for reducing the thermal resistance in the heat dissipation module and improving the heat dissipation effect of the heat dissipation module.

[0004] In order to achieve the above purpose, the present application provides the following technical scheme:

[0005] On the one hand, the embodiments of the present application provide a heat dissipation module and an electronic device, which relate to the technical field of heat dissipation. The heat dissipation module comprises a first cooling pipeline, a second cooling pipeline, a first cold plate support, a second cold plate support, a first cold plate, a second cold plate and at least one heat pipe. The first cooling pipeline is used for inputting a cooling working medium, and the second cooling pipeline is used for outputting the cooling working medium. The first cold plate support is used for supporting the first cold plate, and the second cold plate support is used for supporting the second cold plate.

[0006] The first cold plate is in communication with the first cooling pipeline and the second cooling pipeline. The contact surface of the first cold plate is in contact with a component to be cooled, and is used for absorbing the heat of the component to be cooled. The second cold plate is in communication with the first cooling pipeline and the second cooling pipeline. The second cold plate and the first cold plate are arranged in a spaced manner. The heat pipe is connected with the first cold plate and the second cold plate.

[0007] In the embodiments of the present application, the contact surface of the first cold plate can be in contact with the component to be cooled, so that the heat on the component to be cooled can be transmitted to the first cold plate. For example, the heat on the component to be cooled can be transmitted to the first cold plate through the contact surface of the first cold plate. At the same time, the first cold plate is in communication with the first cooling pipeline and the second cooling pipeline, and in the use process, the cooling working medium can flow into the first cold plate through the first cooling pipeline, absorb the heat of the first cold plate, and then be discharged to the outside of the first cold plate through the second cooling pipeline. That is, with the flow of the cooling working medium, the heat generated by the component to be cooled can be released through the first cold plate and the cooling working medium flowing through the first cold plate, thereby realizing the effect of dissipating heat for the component to be cooled. The cooling working medium can be any one or several of water, 25% propylene glycol or 25% ethylene glycol.

[0008] The second cold plate is connected to the first cold plate by at least one heat pipe. That is, one end of the heat pipe connected to the first cold plate can absorb part of the heat on the first cold plate, and can release the part of the heat to the second cold plate through the other end of the heat pipe connected to the second cold plate. Therefore, by arranging the second cold plate and the heat pipe, the heat on the first cold plate can be further reduced, thereby better dissipating heat for the component to be cooled. Therefore, the second cold plate can share the heat of the component to be cooled absorbed by the first cold plate by using the heat pipe. Therefore, it is beneficial to reduce the thermal resistance of the first cold plate (i.e., the temperature difference between the inlet and outlet of the first cold plate, and the ratio of the power of the component to be cooled), and to improve the heat dissipation effect for the component to be cooled.

[0009] In addition, the second cold plate is arranged apart from the first cold plate, which can prevent the second cold plate from directly contacting the first cold plate, and the heat of the second cold plate can also be transmitted to the first cold plate, affecting the heat dissipation effect of the first cold plate. At the same time, the heat on the second cold plate is less likely to affect the component to be cooled.

[0010] In addition, the second cold plate is also in communication with the first cooling pipeline and the second cooling pipeline. During use, the cooling working medium can also flow into the second cold plate through the first cooling pipeline, absorb the heat of the second cold plate, and then be discharged to the outside of the second cold plate through the second cooling pipeline. That is, with the flow of the cooling working medium, the heat on the second cold plate can be released through the cooling working medium flowing through the second cold plate, thereby achieving the effect of dissipating heat for the second cold plate. At this time, the heat dissipation effect for the first cold plate and the component to be cooled can also be improved. Therefore, it is beneficial to further reduce the thermal resistance of the first cold plate and to improve the heat dissipation effect for the component to be cooled.

[0011] In some embodiments, the second cold plate is located on the side of the first cold plate away from the contact surface. Such an arrangement is beneficial to reduce the occupation of space in the direction parallel to the contact surface, and also makes the heat on the second cold plate less likely to affect the component to be cooled.

[0012] In some embodiments, any one of the heat pipes includes a first pipe segment and a second pipe segment connected in sequence. The first pipe segment is in contact with the first cold plate, and the second pipe segment is in contact with the second cold plate. Therefore, the first pipe segment can be used to absorb part of the heat on the first cold plate, and the second pipe segment can be used to release the part of the heat to the second cold plate. The first pipe segment can be an evaporation section of the heat pipe. The second pipe segment can be a condensation section of the heat pipe.

[0013] Such an arrangement can use the heat pipe to make the second cold plate share the heat of the component to be cooled absorbed by the first cold plate, further reduce the heat on the first cold plate, and better dissipate heat for the component to be cooled.

[0014] In some embodiments, the contact surface of the first cold plate comprises a recessed region, and the first pipe segment is located in the recessed region. In this way, the first pipe segment of the heat pipe can be better fixed, and the first pipe segment can better absorb the heat of the component to be cooled on the first cold plate. In addition, the length of the pipe diameter of the first pipe segment does not affect the contact between the contact surface and the component to be cooled, so that the first pipe segment of the heat pipe can better absorb the heat of the component to be cooled on the first cold plate. This can also facilitate the subsequent heat conduction of the heat to the second cold plate. In order to utilize the first cold plate and the second cold plate to cool the component to be cooled together, and improve the heat dissipation effect of the heat dissipation module.

[0015] In some embodiments, the heat dissipation module further comprises a first cold plate support. The first cold plate support comprises a first hollow region and a first connecting portion surrounding the first hollow region. The first cold plate is installed in the first hollow region.

[0016] In this way, the first cold plate is installed in the first hollow region, that is, the first connecting portion surrounds the first cold plate. In addition, the side of the first connecting portion away from the first cold plate can be used to connect external structures. Thus, the first cold plate can be fixed by the first cold plate support, which is beneficial to improve the structural stability of the heat module.

[0017] In some embodiments, the heat dissipation module further comprises a second cold plate support. The second cold plate support comprises a second hollow region and a second connecting portion surrounding the second hollow region. The second cold plate is installed in the second hollow region.

[0018] In this way, the second cold plate is installed in the second hollow region, that is, the second connecting portion surrounds the second cold plate. In addition, the side of the second connecting portion away from the second cold plate can be used to connect external structures. Thus, the second cold plate can be fixed by the second cold plate support, which is beneficial to improve the structural stability of the heat module.

[0019] In some embodiments, the first cold plate support further comprises a first heat pipe mounting hole extending from the first side surface of the first cold plate support to the first hollow region. The first pipe segment extends into the first hollow region through the first heat pipe mounting hole to make the first pipe segment contact the first cold plate.

[0020] In this way, the first heat pipe mounting hole extends from the first side surface of the first cold plate support to the first hollow region, that is, one end of the first heat pipe mounting hole penetrates the first side surface of the first cold plate support, so that the external heat pipe can extend into the interior of the first cold plate support through the first heat pipe mounting hole. At the same time, the other end of the first heat pipe mounting hole extends to the first hollow region, that is, the first pipe segment of the heat pipe can extend into the first hollow region through the first heat pipe mounting hole to directly contact the first cold plate installed in the first hollow region, so that the first pipe segment can better absorb the heat of the component to be cooled on the first cold plate.

[0021] Thus, the first pipe section of the heat pipe can absorb part of the heat in the first cold plate and conduct the heat to the second cold plate. The effect of simultaneously dissipating heat from the heat-dissipating component by the first cold plate and the second cold plate is achieved, and the heat dissipation performance of the heat dissipation module is improved.

[0022] In some embodiments, the first cold plate support further comprises a first extension hole extending from the first hollowed-out area to a direction away from the first side surface, and an axis of the first extension hole coincides with an axis of the first heat pipe mounting hole.

[0023] In this way, the first pipe section can extend through the first heat pipe mounting hole, the first hollowed-out area, and the first extension hole in sequence. That is, the two ends of the first pipe section can protrude out of the first hollowed-out area, and the first pipe section can be further fixed. Thus, the problem of the first pipe section sinking due to its own gravity can be prevented.

[0024] In some embodiments, the second cold plate support further comprises a second heat pipe mounting hole extending from the second side surface of the second cold plate support to the second hollowed-out area. The second pipe section extends through the second heat pipe mounting hole to the second hollowed-out area, so that the second pipe section is in contact with the second cold plate.

[0025] In this way, the second heat pipe mounting hole extends from the second side surface of the second cold plate support to the second hollowed-out area, that is, one end of the second heat pipe mounting hole penetrates through the second side surface of the second cold plate support, so that the external heat pipe can extend into the interior of the second cold plate support through the second heat pipe mounting hole. Meanwhile, the other end of the second heat pipe mounting hole extends to the second hollowed-out area, that is, the second pipe section of the heat pipe can extend into the second hollowed-out area through the second heat pipe mounting hole and be in direct contact with the second cold plate mounted in the second hollowed-out area, so that the second pipe section can release the heat absorbed from the first cold plate to the second cold plate.

[0026] Thus, the effect of simultaneously dissipating heat from the heat-dissipating component by the first cold plate and the second cold plate is achieved, and the heat dissipation performance of the heat dissipation module is improved.

[0027] In some embodiments, the second cold plate support further comprises a second extension hole extending from the second hollowed-out area to a direction away from the third side surface, and an axis of the second extension hole coincides with an axis of the second heat pipe mounting hole.

[0028] In this way, the second pipe section can extend through the second heat pipe mounting hole, the second hollowed-out area, and the second extension hole in sequence. That is, the two ends of the second pipe section can protrude out of the second hollowed-out area, and the second pipe section can be further fixed. Thus, the problem of the second pipe section sinking due to its own gravity can be prevented.

[0029] In some embodiments, the heat dissipation module further comprises a third cooling pipeline. The inlet of the first cold plate is in communication with the first cooling pipeline, the outlet of the first cold plate and the inlet of the second cold plate are in communication through the third cooling pipeline, and the outlet of the second cold plate is in communication with the second cooling pipeline.

[0030] In this way, the second cold plate and the first cold plate are connected in series between the first cooling pipeline and the second cooling pipeline. Thus, the first cold plate and the second cold plate can be used to dissipate heat from the component to be cooled at the same time. In the case of using two cold plates in series to dissipate heat from the component to be cooled, a relatively low flow rate of the cooling medium in the cold plate can achieve better heat dissipation effect. At the same time, in the case of reducing the flow rate of the cooling medium in the cold plate of the heat dissipation module, the pressure drop at the inlet and outlet of the cold plate can be reduced. Thus, the heat dissipation effect of the cold plate can be improved, that is, the heat dissipation effect of the heat dissipation module can be improved.

[0031] In some embodiments, the first cooling pipeline comprises a first branch pipe, a second branch pipe and a first main pipe. One end of the first branch pipe and one end of the second branch pipe are in communication with the first main pipe. The second cooling pipeline comprises a third branch pipe, a fourth branch pipe and a second main pipe. One end of the third branch pipe and one end of the fourth branch pipe are in communication with the second main pipe. The inlet of the first cold plate is in communication with the other end of the first branch pipe, and the outlet of the first cold plate is in communication with the other end of the third branch pipe. The inlet of the second cold plate is in communication with the other end of the second branch pipe, and the outlet of the second cold plate is in communication with the other end of the fourth branch pipe.

[0032] In this way, the second cold plate and the first cold plate are connected in parallel between the first cooling pipeline and the second cooling pipeline. Thus, the first cold plate and the second cold plate can be used to dissipate heat from the component to be cooled at the same time. In the case of using two cold plates in parallel to dissipate heat from the component to be cooled, the two cold plates can distribute the total flow rate of the cooling medium in the heat dissipation module, that is, the flow rate of the cooling medium in any one cold plate can be reduced, and the pressure drop in the heat dissipation module can be relatively reduced, thereby improving the heat dissipation effect of the heat dissipation module.

[0033] In some embodiments, the heat pipe further comprises a third pipe segment in communication between the first pipe segment and the second pipe segment. The first cold plate comprises opposite first and second edges. The third pipe segment is located on the side of the first edge away from the second edge. In this way, the third pipe segments of the plurality of heat pipes are concentrated on one side edge of the first cold plate. The volume of the heat dissipation module can be reduced, facilitating the miniaturization of the heat dissipation module.

[0034] In some embodiments, the number of heat pipes is multiple. The multiple heat pipes are arranged along the extension direction of the side edge of the first cold plate. For example, the multiple heat pipes are arranged along the extension direction of the first edge in sequence. In this way, by using the multiple heat pipes to conduct heat from the first cold plate to the second cold plate, the heat conduction area of the heat pipes with the first cold plate and the second cold plate can be increased, which can help to reduce the heat dissipation time required for the first cold plate to conduct heat to the second cold plate and improve the heat conduction efficiency. That is, the required heat dissipation time of the heat dissipation module is reduced, and the heat dissipation effect of the heat dissipation module is improved.

[0035] In some embodiments, a reference plane parallel to the contact surface is used as a reference plane. The normal projection of the second cold plate on the reference plane coincides with the normal projection of the first cold plate on the reference plane. Wherein, the coincidence includes absolute coincidence and approximate coincidence. That is, the gap between the normal projection of the first cold plate on the reference plane and the normal projection of the second cold plate on the reference plane can be considered as approximately "coinciding" as long as the floating range of the gap does not exceed the error threshold.

[0036] In this way, the heat dissipation module has a simple structure, which can help to concentrate the structures in the heat dissipation module and reduce the space occupation of the heat dissipation module in the direction parallel to the contact surface.

[0037] In some embodiments, the number of second cold plates is multiple. The multiple second cold plates are arranged in sequence along the direction away from the first cold plate. In this way, the heat dissipation module can include three or more cold plates. By using multiple cold plates to dissipate heat from the heat dissipation component at the same time, the thermal resistance in the heat dissipation module can be reduced, and the heat dissipation effect of the heat dissipation module can be improved.

[0038] In some embodiments, the heat pipe includes a pipe shell, a wick, and a working fluid. The wick is located on the inner wall of the pipe shell, and the working fluid is located in the pipe shell. In this way, the first pipe section of the heat pipe is in contact with the first cold plate. When the first pipe section is heated, the working fluid in the wick in the first pipe section vaporizes, the steam flows to the second pipe section to release heat and condenses into liquid, and the liquid flows back to the first pipe section along the wick under the action of capillary force, thus realizing the heat conduction from the first cold plate to the second cold plate.

[0039] In some embodiments, the first cold plate includes a first shell and a first fin assembly, and the first shell has a first receiving cavity. The first fin assembly is located in the first receiving cavity.

[0040] In this way, the first cold plate includes the first fin assembly, which can help to improve the heat dissipation effect of the first cold plate, that is, the heat dissipation effect of the heat dissipation module can be improved.

[0041] In some embodiments, the second cold plate includes a second shell and a second fin assembly, and the second shell has a second receiving cavity. The second fin assembly is located in the second receiving cavity.

[0042] In this way, the second cold plate comprises a second fin assembly. This can be advantageous in improving the heat dissipation effect of the second cold plate, i.e. in improving the heat dissipation effect of the heat dissipation module.

[0043] In another aspect, embodiments of the present application provide an electronic device. The electronic device comprises at least one component to be cooled and at least one heat dissipation module as described above. The contact surface of the first cold plate of the heat dissipation module is in contact with the at least one component to be cooled. The component to be cooled can be a chip.

[0044] In some embodiments, when the electronic device comprises one heat dissipation module, one heat dissipation module can be used to cool one component to be cooled.

[0045] In some embodiments, when the electronic device comprises at least two heat dissipation modules arranged in series, multiple heat dissipation modules can be used to cool one component to be cooled simultaneously, or one heat dissipation module of the multiple heat dissipation modules can be used to cool one or more components to be cooled.

[0046] Since the electronic device provided by embodiments of the present application comprises a heat dissipation module as described above, it has all the beneficial effects described above, which will not be repeated here.

[0047] In some embodiments, the area of the contact surface of the first cold plate of the heat dissipation module is greater than or equal to the area of the surface of the component to be cooled close to the heat dissipation module.

[0048] In this way, the surface of the component to be cooled close to the heat dissipation module can be in complete contact with the contact surface of the first cold plate of the heat dissipation module. This can be advantageous in increasing the contact area of the heat dissipation module and the component to be cooled, improving the heat dissipation effect of the heat dissipation module on the component to be cooled, and improving the heat dissipation performance of the heat dissipation module. BRIEF DESCRIPTION OF DRAWINGS

[0049] Figure 1 The structural schematic diagram of the electronic device provided by some embodiments of the present application is shown in the figure;

[0050] Figure 2A The structural schematic diagram of the heat dissipation module provided by some embodiments of the present application is shown in the figure;

[0051] Figure 2B The structural schematic diagram of the heat dissipation module provided by some embodiments of the present application is shown in the figure;

[0052] Figure 2C The structural schematic diagram of the heat dissipation module provided by some embodiments of the present application is shown in the figure;

[0053] Figure 2D The structural schematic diagram of the heat dissipation module provided by some embodiments of the present application is shown in the figure;

[0054] Figure 3A Fig. 1 is a perspective view of a heat dissipation module according to an embodiment of the present application; Figure 2A Fig. 2 is a plan view of the structure shown in the dashed box in Fig. 1 at a first viewing angle V;

[0055] Figure 3B Fig. 3 is a perspective view of a heat dissipation module according to another embodiment of the present application; Figure 2B Fig. 4 is a plan view of the structure shown in the dashed box in Fig. 3 at a first viewing angle V;

[0056] Figure 4A Fig. 5 is a perspective view of a heat dissipation module according to another embodiment of the present application; Figure 2A Fig. 6 is an assembly schematic view of the heat dissipation module in Fig. 5;

[0057] Figure 4B Fig. 7 is a sectional view in the J-J' direction of the heat dissipation module in Fig. 5; Figure 2A

[0058] Figure 4C Fig. 8 is an assembly schematic view of the first cold plate support and the first pipe segment of the heat pipe in the heat dissipation module in Fig. 5; Figure 2A

[0059] Figure 4D Fig. 9 is another sectional view in the J-J' direction of the heat dissipation module in Fig. 5; Figure 2A

[0060] Figure 4E Fig. 10 is another assembly schematic view of the first cold plate support and the first pipe segment of the heat pipe in the heat dissipation module in Fig. 5; Figure 2A

[0061] Figure 5A Fig. 11 is a structural schematic view of a heat dissipation module with multiple second cold plates provided by some embodiments of the present application;

[0062] Figure 5B Fig. 12 is a structural schematic view of a heat dissipation module with multiple second cold plates provided by some other embodiments of the present application;

[0063] Figure 6A Fig. 13 is a structural schematic view of a first cold plate; Figure 2A

[0064] Figure 6B Fig. 14 is a sectional view in the F-F' direction of the first cold plate in Fig. 13; Figure 6A

[0065] Figure 7 Fig. 15 is a structural schematic view of a heat pipe. Figure 2A DETAILED DESCRIPTION

[0066] ​​​​​​​With reference to the drawings, a clear and complete description will be given below of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments provided by the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0067] Unless otherwise required by context, the term "comprise" and its other forms such as "comprises" and "comprising" are to be construed as open, inclusive, meaning, i.e., "including but not limited to", throughout the specification and claims. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to mean that a particular feature, structure, material or characteristic included in at least one embodiment or example of the present application. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

[0068] Hereinafter, the terms "first", "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the embodiments of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0069] In describing some embodiments, "connection", "connection" and their derivatives may be used. For example, the term "connection" may be used to describe some embodiments to indicate that two or more components have direct or indirect physical contact with each other. For example, A and B are connected, which means that A and B are connected, or A and B are connected through other components.

[0070] "A, B and C at least one of them" has the same meaning as "at least one of A, B or C", which includes the following combinations of A, B and C: only A, only B, only C, combination of A and B, combination of A and C, combination of B and C, and combination of A, B and C.

[0071] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0072] As used herein, "about," "approximately," or "around" includes the recited value and the average value within an acceptable range of deviation from the recited value, as determined by one of ordinary skill in the art considering the measurement in question and the error intended to be eliminated (i.e., the limitations of the measurement system).

[0073] As used herein, "parallel," "perpendicular," and "equal" include the recited condition and conditions that approximate the recited condition, the approximation being within an acceptable range of deviation, as determined by one of ordinary skill in the art considering the measurement in question and the error intended to be eliminated (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and near parallel, where near parallel can be within an acceptable deviation of, for example, 5°; "perpendicular" includes absolute perpendicular and near perpendicular, where near perpendicular can also be within an acceptable deviation of, for example, 5°. "Equal" includes absolute equality and near equality, where near equality can be within an acceptable deviation of, for example, less than or equal to 5% of either of the two quantities being compared.

[0074] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are schematic illustrations of idealized embodiments. In this regard, the dimensions of the layers and regions shown in the figures are exaggerated for clarity. Thus, an exemplary embodiment can not be drawn to scale. Accordingly, the exemplary embodiments are not to be interpreted as limiting the scope of the exemplary embodiments. For example, the shapes and relative sizes of regions and layers shown in the figures can vary considerably from the shapes and relative sizes of the regions and layers in actual devices. Thus, the exemplary embodiments should not be construed as limited to the shapes and relative sizes of regions and layers shown in the figures. The exemplary embodiments are intended to be exemplary, and should not be construed as limiting the scope of the exemplary embodiments.

[0075] Figure 1 A structural schematic diagram of an electronic device provided for some embodiments of the present application.

[0076] Embodiments of the present application provide an electronic device 200, as shown in Figure 1 The electronic device 200 includes at least one component 300 to be cooled and at least one heat dissipation module 100. The contact surface of the cold plate in the heat dissipation module 100 is in contact with the at least one component to be cooled. Thus, the cooling medium in the cold plate of the heat dissipation module 100 can absorb the heat of the component to be cooled 300, and then output the cooling medium from the cold plate, i.e., dissipate the absorbed heat. Thus, the component to be cooled 300 can be cooled.

[0077] In some embodiments, the electronic device 200 can be a server or a communication device.

[0078] In some embodiments, the component to be cooled 300 can be a chip, a central processing unit (CPU), an accelerated processing unit (APU), a graphics processing unit (GPU), or the like.

[0079] In some embodiments, as shown in FIG. 2, the electronic device 200 can include a component to be cooled 300 and a heat dissipation module 100. Figure 1 In some embodiments, as shown in FIG. 2, the electronic device 200 can include a component to be cooled 300 and a heat dissipation module 100.

[0080] In this way, the heat dissipation module 100 can completely cover the component to be cooled 300, sufficiently contact the component to be cooled 300, and better absorb the heat of the component to be cooled 300. That is, the heat dissipation effect of the heat dissipation module 100 on the component to be cooled 300 in the electronic device 200 can be improved, and the service life of the electronic device 200 can be prevented from being affected by the excessively high temperature of the component to be cooled 300.

[0081] In some embodiments, as shown in FIG. 2, the electronic device 200 can include a component to be cooled 300 and a heat dissipation module 100. Figure 1 For example, the area of the contact surface of the first cold plate of the heat dissipation module 100 is greater than the area of the surface of the component to be cooled 300 close to the heat dissipation module 100. It can be understood that in other embodiments, the area of the contact surface of the first cold plate of the heat dissipation module 100 can be equal to the area of the surface of the component to be cooled 300 close to the heat dissipation module 100. The present disclosure does not limit this.

[0082] In the following, the component to be cooled 300 is taken as a chip for example. The chip 300 has a large power consumption when working, so that the chip 300 generates a high heat when in use, which affects the service life of the electronic device 200. The contact surface of the cold plate in the heat dissipation module 100 is arranged to face the chip 300. The chip 300 can be cooled by the heat dissipation module 100, so as to prevent the excessively high temperature from affecting the service life of the chip 300 and improve the quality of the electronic device 200.

[0083] In some embodiments, as shown in FIG. 2, the electronic device 200 can include a component to be cooled 300 and a heat dissipation module 100. Figure 1 In some embodiments, as shown in FIG. 2, the electronic device 200 can include a component to be cooled 300 and a heat dissipation module 100. Figure 1 For example, the electronic device 200 includes a chip 300. The chip 300 can be located below the heat dissipation module 100, that is, the chip 300 is covered by the heat dissipation module 100. Since the chip 300 has a large power consumption when working, the chip 300 generates a high heat when in use, which affects the service life of the electronic device 200. Figure 1Take the chip 300 included in the electronic device 200 as an example. The chip 300 can be located Figure 1 below the heat dissipation module 100 shown on the left side, or below the heat dissipation module 100 shown on the right side, and the present disclosure does not limit this.

[0084] In this way, the contact surface of the cold plate in the heat dissipation module 100 can be in contact with the chip 300, the heat dissipation module 100 can absorb the heat of the chip 300, and the part of the heat can be released. The chip 300 is effectively cooled to prevent excessive temperature from affecting the service life of the chip 300 and improve the quality of the electronic device 200.

[0085] In other embodiments, the electronic device 200 includes a plurality of (such as two or more) chips 300. One heat dissipation module 100 can be provided to cool one chip 300. One heat dissipation module 100 can also be provided to cool multiple chips 300 at the same time. For example, when the electronic device 200 includes two heat dissipation modules 100 and four chips 300. One heat dissipation module 100 can be in contact with two chips 300, that is, one heat dissipation module 100 can be used to cool two chips 300 at the same time. The present disclosure does not limit this, as long as the heat dissipation module 100 is used to cool the chip 300, which can prevent the high temperature of the chip 300 from affecting the service life of the electronic device 200.

[0086] The present disclosure does not limit the number of chips 300 that need to be cooled in the electronic device 200, and the number of heat dissipation modules 100 corresponding to different numbers of chips can be set. Specifically, the number of heat dissipation modules 100 in the electronic device will be introduced below. First, the electronic device 200 including one heat dissipation module 100 will be introduced below in combination with Figure 2A and Figure 2B The electronic device 200 including one heat dissipation module 100 will be introduced below in combination with

[0087] Figure 2A The structure diagram of the heat dissipation module provided by some embodiments of the present disclosure is shown. Figure 2B The structure diagram of the heat dissipation module provided by some embodiments of the present disclosure is shown.

[0088] In some embodiments, as shown in Figure 2AAs shown, the electronic device 200 includes a heat dissipation module 100. The heat dissipation module 100 includes a first cooling pipeline 10 (a pipeline for inputting cooling working medium), a second cooling pipeline 20 (a pipeline for outputting cooling working medium), a first cold plate 30, a second cold plate 40, a heat pipe 50, a first cold plate support 60, a second cold plate support 70, and a third cooling pipeline 80. The first cold plate support 60 can be used to support the first cold plate 30, and the second cold plate support 70 can be used to support the second cold plate 40. The first cold plate 30 and the second cold plate 40 are connected in series between the first cooling pipeline 10 and the second cooling pipeline 20. For example, the inlet of the first cold plate 30 is connected to the first cooling pipeline 10, the outlet of the first cold plate 30 and the inlet of the second cold plate 40 are connected through the third cooling pipeline 80, and the outlet of the second cold plate 40 is connected to the second cooling pipeline 20. In this way, the first cold plate 30 and the second cold plate 40 are connected in series between the first cooling pipeline 10 and the second cooling pipeline 20. Thus, the two cold plates in the heat dissipation module 100 can be used to dissipate heat from the component 300 to be cooled, which can improve the heat dissipation effect of the heat dissipation module 100.

[0089] In addition, the heat pipe 50 connects the first cold plate 30 and the second cold plate 40. That is, one end of any heat pipe 50 is in contact with the first cold plate 30, and the other end of the heat pipe 50 is in contact with the second cold plate 40.

[0090] During use of the heat dissipation module 100, the cooling working medium can flow into the first cold plate 30 through the first cooling pipeline 10 in sequence, absorb heat from the first cold plate 30, and be discharged to the third cooling pipeline 80 through the second cooling pipeline 20. Then, since the heat pipe 50 connects the first cold plate 30 and the second cold plate 40, the heat pipe 50 can absorb part of the heat from the first cold plate 30 through the part of the heat pipe 50 in contact with the first cold plate 30, and then release the heat to the second cold plate 40 through the part of the heat pipe 50 in contact with the second cold plate 40. At this time, the cooling working medium in the third cooling pipeline 80 can flow into the second cold plate 40 through the first cooling pipeline 10, absorb heat from the second cold plate 40, and then be discharged to remove the heated cooling working medium, thereby achieving the effect of dissipating heat from the component 300 to be cooled.

[0091] In some examples, as shown in FIG. 2B, the cooling working medium in the heat dissipation module 100 can first flow into the second cold plate 40 and then flow into the first cold plate 30. Figure 2A

[0092] ​In some examples, the cooling medium in the second cold plate 40 in the heat dissipation module 100 is discharged to an external liquid cooling source through the second cooling pipeline 20. The cooling medium is cooled by the liquid cooling source, and the above steps are repeated after the cooling medium is cooled. That is, the cooling medium is input into the first cold plate 30 in the heat dissipation module 100 again to form a cycle, so as to realize heat dissipation of the component to be cooled 300.

[0093] For example, the first cooling pipeline 10 and the second cooling pipeline 20 can be connected to the external cooling source through a connecting structure 210 to provide the cooling medium for the heat dissipation module 100 and cool the cooling medium after being heated. The connecting structure 210 can be a heat exchange joint.

[0094] In some examples, the connecting structure 210 can include a first heat exchange joint 211 and a second heat exchange joint 212. The first heat exchange joint 211 can be in communication with the first cooling pipeline 10, and the cooling medium is provided through the first heat exchange joint 211 and then input into the first cold plate 30 through the first cooling pipeline 10. The second heat exchange joint 212 can be in communication with the second cooling pipeline 20, and the cooling medium in the second cold plate 40 after being heated is output to the external cooling source through the second heat exchange joint 212, and the cooling medium is cooled by the liquid cooling source. After the cooling medium is cooled, the above steps are repeated.

[0095] In some examples, the connecting structure 210 can further include a first connecting pipe 220 and a second connecting pipe 230. The two ends of the first connecting pipe 220 are in communication with the first heat exchange joint 211 and the first cooling pipeline 10, respectively. The two ends of the second connecting pipe 230 are in communication with the second heat exchange joint 212 and the second cooling pipeline 20, respectively.

[0096] For example, the outer side of the pipe wall of the first connecting pipe 220 and the second connecting pipe 230 can be provided with a protective layer. For example, the protective layer can be a heat preservation layer. The influence of the temperature of the external environment on the temperature of the cooling medium is prevented. Alternatively, the material of the protective layer can be a corrosion-resistant material, which can be used to protect the first heat exchange joint 211 and the second heat exchange joint 212 and prolong the service life of the first heat exchange joint 211 and the second heat exchange joint 212.

[0097] In another embodiment, as Figure 2BAs shown, the heat dissipation module 100 includes a first cooling pipeline 10 (a pipeline for inputting cooling working medium), a second cooling pipeline 20 (a pipeline for outputting cooling working medium), a first cold plate 30, a second cold plate 40, a heat pipe 50, a first cold plate support 60 and a second cold plate support 70. The first cold plate support 60 can be used to support the first cold plate 30, and the second cold plate support 70 can be used to support the second cold plate 40. Among them, the first cooling pipeline 10 includes a first branch pipe 10a, a second branch pipe 10b and a first main pipe 10c. The second cooling pipeline 20 includes a third branch pipe 20a, a fourth branch pipe 20b and a second main pipe 20c.

[0098] Different from the prior art, the first cold plate 30 and the second cold plate 40 are connected in parallel between the first cooling pipeline 10 and the second cooling pipeline 20. Figure 2A

[0099] For example, one end of the first branch pipe 10a and one end of the second branch pipe 10b are in communication with the first main pipe 10c. One end of the third branch pipe 20a and one end of the fourth branch pipe 20b are in communication with the second main pipe 20c. The inlet of the first cold plate 30 is in communication with the other end of the first branch pipe 10a, and the outlet of the first cold plate 30 is in communication with the other end of the third branch pipe 20a. In addition, the inlet of the second cold plate 40 is in communication with the other end of the second branch pipe 10b, and the outlet of the second cold plate 40 is in communication with the other end of the fourth branch pipe 20b. Thus, the two parallel cold plates in the heat dissipation module 100 can be used to dissipate heat from the component to be cooled 300, which can help to improve the heat dissipation effect of the heat dissipation module 100.

[0100] In addition, the heat pipe 50 connects the first cold plate 30 and the second cold plate 40. That is, one end of any heat pipe 50 is in contact with the first cold plate 30, and the other end of the heat pipe 50 is in contact with the second cold plate 40.

[0101] ​During use of the heat dissipation module 100, the cooling medium can flow into the first branch pipe 10a and the second branch pipe 10b through the first main pipe 10c in the first cooling pipe 10. Then, the cooling medium can flow into the first cold plate 30 through the first branch pipe 10a, absorb heat of the first cold plate 30, and then be discharged to the outside of the heat dissipation module 100 through the third branch pipe 20a of the second cooling pipe 20, i.e., be discharged to the second main pipe 20c, and finally be discharged through the second main pipe 20c. Then, since the heat pipe 50 is connected to the first cold plate 30 and the second cold plate 40, part of the heat on the first cold plate 30 can be absorbed by the part of the heat pipe 50 in contact with the first cold plate 30, and then the part of the heat can be released to the second cold plate 40 by the part of the heat pipe 50 in contact with the second cold plate 40. In addition, the cooling medium can flow into the second cold plate 40 through the second branch pipe 10b of the first cooling pipe 10, absorb heat of the second cold plate 40, and then be discharged to the outside of the heat dissipation module 100 through the fourth branch pipe 20b of the second cooling pipe 20, i.e., be discharged to the second main pipe 20c, and finally be discharged through the second main pipe 20c. In summary, the cooling medium flowing through the first cold plate 30 and the second cold plate 40 can be discharged to the outside of the heat dissipation module 100 through the second main pipe 20c after being heated and warmed, thereby achieving the effect of dissipating heat of the component to be cooled 300.

[0102] In some examples, as shown in FIGS. 1 and 2, the cooling medium flows into the first cold plate 30 and the second cold plate 40 at the same time. Figure 2B

[0103] In examples, the heat dissipation module 100 can discharge the cooling medium warmed in the heat dissipation module 100 to the outside liquid cooling source through the second main pipe 20c. The cooling medium is cooled by the liquid cooling source, and then the above steps are repeated. That is, the cooling medium is input into the heat dissipation module 100 through the first main pipe 10c again to form a cycle, thereby achieving the effect of dissipating heat of the component to be cooled 300.

[0104] For example, the first main pipe 10c of the first cooling pipe 10 and the second main pipe 20c of the second cooling pipe 20 can be connected to the external cooling source through a connection structure 210, thereby providing the cooling medium for the heat dissipation module 100 and cooling the cooling medium warmed. Figure 2A The specific structure of the connection structure 210 can be the same as the connection structure 210 shown in FIG. 3, that is, the connection structure 210 provided in the present embodiment can refer to the description of the connection structure 210 above, and will not be described here again.

[0105] In some examples, as shown in FIGS. 1 and 2, the cooling medium flows into the first cold plate 30 and the second cold plate 40 at the same time. Figure 2A Figure 2B In some examples, as shown in FIGS. 1 and 2, the cooling medium flows into the first cold plate 30 and the second cold plate 40 at the same time.​​

[0106] In some examples, as shown in Figure 2A and Figure 2B indicated, the second cold plate bracket 70 can also be used to support the other end of the heat pipe 50, so that the other end of the heat pipe 50 is in contact with the second cold plate 40.

[0107] In the above, the electronic device 200 is taken as an example including one heat dissipation module 100, which is shown in Figure 2A and Figure 2B In the following, the electronic device 200 is taken as an example including two heat dissipation modules 100, which is shown in Figure 2C and Figure 2D

[0108] Figure 2C The structure schematic diagram of the two heat dissipation modules in series provided by some embodiments of the present application is shown in Figure 2D The structure schematic diagram of the two heat dissipation modules in series provided by some other embodiments of the present application is shown in

[0109] In some embodiments, as shown in Figure 2C and Figure 2D indicated, the two heat dissipation modules 100 are respectively a first heat dissipation module 101 and a second heat dissipation module 102. The electronic device 200 further includes a fourth cooling pipeline 90. The first heat dissipation module 101 and the second heat dissipation module 102 can be connected in series. For example, as shown in Figure 2C , in the two adjacent heat dissipation modules 100: the inlet of the first cold plate 30A in the first heat dissipation module 101 is in communication with the first cooling pipeline 10A, and the outlet of the second cold plate 40B in the second heat dissipation module 102 is in communication with the second cooling pipeline 20B. In addition, the outlet of the second cold plate 20A in the first heat dissipation module 101 can be in communication with the inlet of the first cold plate 10B in the second heat dissipation module 102 through the fourth cooling pipeline 90, so as to realize the series connection of the two adjacent heat dissipation modules 100.

[0110] In this way, the cooling working medium flows into the first heat dissipation module 101 through the first cooling pipeline 10A, absorbs the heat of the component to be cooled 300 (as shown in Figure 1 ), and is heated. The heated cooling working medium is discharged to the second heat dissipation module 102 through the fourth cooling pipeline 90, and the cooling working medium in the heat dissipation module 102 absorbs the heat of the component to be cooled 300, and is heated, and is then discharged to the next heat dissipation module. When the second heat dissipation module 102 is the last heat dissipation module, the heated cooling working medium can be discharged to the outside of the second heat dissipation module 102 through the second cooling pipeline 20B, so as to realize the heat dissipation effect of the component to be cooled 300. In this way, the multiple heat dissipation modules 100 can be used for heat dissipation together, which can be beneficial to improve the heat dissipation effect of the heat dissipation module 100.​

[0111] For example, the heated cooling medium in the last heat dissipation module 100 is discharged to an external liquid cooling source through the second cooling pipe 20B. The liquid cooling source cools the cooling medium, and after cooling, the above steps are repeated. That is, the cooling medium is reintroduced into the first heat dissipation module 101 through the first cooling pipe 10A to form a circulation, thereby dissipating heat from the component 300 to be cooled.

[0112] However, this disclosure does not limit the connection relationship between the multiple heat dissipation modules 100. It is understood that in some other embodiments, the multiple heat dissipation modules 100 may be connected in parallel.

[0113] In some embodiments, such as Figure 2C As shown, the electronic device 200 includes two heat dissipation modules 100, namely a first heat dissipation module 101 and a second heat dissipation module 102. The electronic device 200 also includes a fourth cooling pipe 90. The first heat dissipation module 100 includes a first cooling pipe 10A, a second cooling pipe 20A, a first cold plate 30A, a second cold plate 40A, a heat pipe 50A, a first cold plate support 60A, a second cold plate support 70A, and a third cooling pipe 80A. The first cold plate support 60A supports the first cold plate 30A, and the second cold plate support 70A supports the second cold plate 40A. The second heat dissipation module 102 includes a first cooling pipe 10B, a second cooling pipe 20B, a first cold plate 30B, a second cold plate 40B, a heat pipe 50B, a first cold plate support 60B, a second cold plate support 70B, and a third cooling pipe 80B. The first cold plate bracket 60B is used to support the first cold plate 30B, and the second cold plate bracket 70B is used to support the second cold plate 40B.

[0114] Taking the first heat dissipation module 101 as an example, the first cold plate 30A and the second cold plate 40A are both connected in series between the first cooling pipe 10A and the second cooling pipe 20A. For example, the inlet of the first cold plate 30A is connected to the first cooling pipe 10A. The outlet of the second cold plate 40A is connected to the second cooling pipe 20A. Furthermore, the outlet of the first cold plate 30A and the inlet of the second cold plate 40A are connected through a third cooling pipe 80. Thus, the first cold plate 30A and the second cold plate 40A are connected in series. Therefore, the two series-connected cold plates in the heat dissipation module 100 can be used simultaneously to dissipate heat from the component 300 to be cooled, which can help improve the heat dissipation effect of the heat dissipation module 100.

[0115] In addition, each heat pipe 50A is connected to the first cold plate 30A and the second cold plate 40A. For example, one end of each heat pipe 50A is in contact with the contact surface of the first cold plate 30A, and the other end of the heat pipe 50A is in contact with the side of the second cold plate 40A that is close to the first cold plate 30A.

[0116] In addition, the second cold plate 40A in the first heat dissipation module 101 is in communication with the first cold plate 30B of the second heat dissipation module 102, so that the first heat dissipation module 101 and the second heat dissipation module 102 are connected in series. For example, the second cooling pipe 20A connected to the second cold plate 40A in the first heat dissipation module 101 can be in communication with the first cooling pipe 10B connected to the first cold plate 30B of the second heat dissipation module 102 through the fourth cooling pipe 90.

[0117] As for the specific structure of the second heat dissipation module 102, since the structure of the second heat dissipation module 102 is the same as that of the first heat dissipation module 101, the above description is combined here and will not be repeated.

[0118] In the use process of the first heat dissipation module 101 and the second heat dissipation module 102, the cooling medium can flow into the first cold plate 30A of the first heat dissipation module 101 through the first cooling pipe 10A, absorb the heat of the first cold plate 30A, and then be discharged to the third cooling pipe 80A. Then, since one end of each heat pipe 50A is in contact with the first cold plate 30A, the heat pipe 50A can absorb part of the heat on the first cold plate 30A through the part in contact with the first cold plate 30A, and then release the heat to the second cold plate 40A through the part in contact with the second cold plate 40A. At this time, the cooling medium in the third cooling pipe 80A can flow into the second cold plate 40A, absorb the heat in the second cold plate 40A, and then be discharged to the fourth cooling pipe 90 through the second cooling pipe 20A.

[0119] At this time, the cooling medium in the fourth cooling pipe 90 can flow into the first cold plate 30B of the second heat dissipation module 102 through the first cooling pipe 10B in the second heat dissipation module 102, absorb the heat of the first cold plate 30B, and then be discharged to the third cooling pipe 80. Then, the heat pipe 50B can absorb part of the heat on the first cold plate 30B through the part in contact with the first cold plate 30B, and then release the heat to the second cold plate 40B through the part in contact with the second cold plate 40B. At this time, the cooling medium in the third cooling pipe 80B can flow into the second cold plate 40B, absorb the heat in the second cold plate 40B, and then be discharged to the second cooling pipe 20B. Finally, the cooling medium after being heated is discharged through the second cooling pipe 20B, thereby achieving the effect of dissipating heat from the component 300 to be cooled.

[0120] In some examples, as shown in FIG. 1, the heat dissipation module 100 includes a first cooling pipeline 10A and a second cooling pipeline 20A. Figure 2C As shown in FIG. 1, the cooling medium in the heat dissipation module 100 can first flow into the first cold plate 30 and then flow into the second cold plate 40.

[0121] For example, the first cooling pipeline 10A and the second cooling pipeline 20A can be connected to the external cooling source through a connection structure 210 to provide the cooling medium for the heat dissipation module 100 and to cool the cooling medium after being heated. The specific structure of the connection structure 210 can be the same as that shown in FIG. 2, that is, the connection structure 210 provided in the present embodiment can refer to the description of the connection structure 210 above, and will not be described here again.

[0122] For example, the first cooling pipeline 10A and the second cooling pipeline 20B can be connected to the external cooling source through a connection structure 210 to provide the cooling medium for the heat dissipation module 100 and to cool the cooling medium after being heated. The specific structure of the connection structure 210 can be the same as that shown in FIG. 2, that is, the connection structure 210 provided in the present embodiment can refer to the description of the connection structure 210 above, and will not be described here again. Figure 2A

[0123] In some examples, as shown in FIG. 1, the heat dissipation module 100 includes a first cooling pipeline 10A and a second cooling pipeline 20A. Figure 2D As shown in FIG. 1, the heat dissipation module 100 includes a first cooling pipeline 10A and a second cooling pipeline 20A.

[0124] The first heat dissipation module 101 includes a first cooling pipeline 10A, a second cooling pipeline 20A, a first cold plate 30A, a second cold plate 40A, a heat pipe 50A, a first cold plate support 60A, a second cold plate support 70A, and a third cooling pipeline 80A. The first cold plate support 60A is used to support the first cold plate 30A, and the second cold plate support 70A is used to support the second cold plate 40A. The first cooling pipeline 10A includes a first branch pipe 10Aa, a second branch pipe 10Ab, and a first main pipe 10Ac, one end of the first branch pipe 10Aa and one end of the second branch pipe 10Ab are communicated with the first main pipe 10Ac. The second cooling pipeline 20A includes a third branch pipe 20Aa, a fourth branch pipe 20Ab, and a second main pipe 20Ac, one end of the third branch pipe 20Aa and one end of the fourth branch pipe 20Ab are communicated with the second main pipe 20Ac.

[0125] ​The second heat dissipation module 102 includes a first cooling pipe 10B, a second cooling pipe 20B, a first cold plate 30B, a second cold plate 40B, a heat pipe 50B, a first cold plate support 60B, a second cold plate support 70B, and a third cooling pipe 80B. The first cold plate support 60B supports the first cold plate 30B, and the second cold plate support 70B supports the second cold plate 40B. The first cooling pipe 10B includes a first branch pipe 10Ba, a second branch pipe 10Bb, and a first main pipe 10Bc. One end of the first branch pipe 10Ba and one end of the second branch pipe 10Bb are connected to the first main pipe 10Bc. The second cooling pipe 20B includes a third branch pipe 20Ba, a fourth branch pipe 20Bb, and a second main pipe 10Bc. One end of the third branch pipe 20Ba and one end of the fourth branch pipe 20Bb are connected to the second main pipe 10Bc.

[0126] and Figure 2C The difference lies in the fact that, taking the first heat dissipation module 101 as an example, the first cold plate 30A and the second cold plate 40A are connected in parallel between the first cooling pipe 10A and the second cooling pipe 20A. For example, the inlet of the first cold plate 30A is connected to the first branch pipe 10Aa of the first cooling pipe 10A, and the outlet of the first cold plate 30A is connected to the third branch pipe 20Aa of the second cooling pipe 20A. Furthermore, the inlet of the second cold plate 40A is connected to the second branch pipe 10Ab of the first cooling pipe 10A, and the fourth branch pipe 20Ab of the second cooling pipe 20A is connected to the second cold plate 40A. The first branch pipe 10Aa and the second branch pipe 10Ab are connected to the first main pipe 10Ac, and the third branch pipe 20Aa and the fourth branch pipe 20Ab are connected to the second main pipe 10Bc. Thus, the first cold plate 30A and the second cold plate 40A are connected in parallel between the first cooling pipe 10A and the second cooling pipe 20A. Therefore, the two parallel cold plates (first cold plate 30A and second cold plate 40A) in the first heat dissipation module 101 can be used to dissipate heat on the component 300 to be dissipated at the same time, which can help improve the heat dissipation effect of the first heat dissipation module 101.

[0127] Furthermore, any one of the heat pipes 50A is connected to the first cold plate 30A and the second cold plate 40A. For example, one end of any one heat pipe 50A is in contact with the contact surface of the first cold plate 30A, and the other end of the heat pipe 50A is in contact with the side of the second cold plate 40A near the first cold plate 30A.

[0128] The structure of the second heat dissipation module 102 is the same as that of the first heat dissipation module 101, as shown above, and will not be repeated here.

[0129] In use, the cooling medium can flow into the first cold plate 30A of the first heat dissipation module 101 through the first branch pipe 10Aa of the first cooling pipe 10A, absorb the heat of the first cold plate 30A, and then be discharged to the fourth cooling pipe 90 through the third branch pipe 20Aa of the second cooling pipe 20A. Then, the part of the heat pipe 50A in contact with the first cold plate 30A can absorb part of the heat on the first cold plate 30A, and the part of the heat pipe 50A in contact with the second cold plate 40A can release the heat to the second cold plate 40A. At this time, the cooling medium can flow into the second cold plate 40A of the first heat dissipation module 101 through the second branch pipe 10Ab of the first cooling pipe 10A, absorb the heat of the second cold plate 40A, and then be discharged to the fourth cooling pipe 90 through the fourth branch pipe 20Ab of the second cooling pipe 20A.

[0130] At this time, the cooling medium in the fourth cooling pipe 90 can flow into the first cold plate 30B of the second heat dissipation module 102 through the first branch pipe 10Ba of the first cooling pipe 10B, absorb the heat of the first cold plate 30B, and then be discharged through the third branch pipe 20Ba of the second cooling pipe 20B. Then, the part of the heat pipe 50B in contact with the first cold plate 30B can absorb part of the heat on the first cold plate 30B, and the part of the heat pipe 50B in contact with the second cold plate 40B can release the heat to the second cold plate 40B of the second heat dissipation module 102. At this time, the cooling medium can flow into the second cold plate 40B of the second heat dissipation module 102 through the second branch pipe 10Bb of the first cooling pipe 10B, absorb the heat of the second cold plate 40B, and then be discharged through the fourth branch pipe 20Bb of the second cooling pipe 20B. That is, the cooling medium flowing in the first cold plate 30B and the second cold plate 40B of the second heat dissipation module 102 (the last heat dissipation module) is discharged to the outside of the second heat dissipation module 102 after being heated and warmed, thereby achieving the effect of dissipating heat from the component to be cooled 300.

[0131] In some examples, as shown in FIG. 1, the cooling medium in the heat dissipation module 100 can flow into the first cold plate 30 and the second cold plate 40 at the same time. Figure 2D

[0132] In an example, the heat dissipation module 100 can discharge the cooling medium warmed in the heat dissipation module 100 to the outside liquid cooling source through the second main pipe 20Bc. The cooling medium is cooled by the liquid cooling source, and then the above steps are repeated. That is, the cooling medium is input into the heat dissipation module 100 again through the first main pipe 10Ac to form a cycle, thereby achieving the effect of dissipating heat from the component to be cooled 300.

[0133] ​For example, the first main pipe 10Ac of the first cooling pipeline 10A and the second main pipe 20Bc of the second cooling pipeline 20B can be connected with an external cold source through a connection structure 210 to provide a cold region working medium for the heat dissipation module 100 and to cool the cooling working medium after being heated. The specific structure of the connection structure 210 can be the same as that of the connection structure 210 shown in Figure 2A The connection structure 210 provided in the embodiment can be referred to the description of the connection structure 210 above, and will not be described here again.

[0134] The electronic device 200 and the number of heat dissipation modules 100 in the electronic device are introduced above in combination with some drawings. In the following, the structure of the heat dissipation module 100 in the electronic device 200 will be specifically introduced in combination with some other drawings.

[0135] In some examples, the structure of the first cold plate support 60B can be the same as that of the first cold plate support 60A, which can be referred to the description of the structure of the first cold plate support 60A above. In addition, the structure of the second cold plate support 70B can be the same as that of the second cold plate support 70A, which can be referred to the description of the structure of the second cold plate support 70A above, and will not be described here again.

[0136] In some examples, as shown in Figure 2C and Figure 2D The first cold plate support 60A can also be used to support one end of the heat pipe 50A to make the one end of the heat pipe 50A contact with the first cold plate 30A.

[0137] In some examples, as shown in Figure 2C and Figure 2D The second cold plate support 70A can also be used to support the other end of the heat pipe 50A to make the other end of the heat pipe 50A contact with the second cold plate 40A.

[0138] Figure 3A The structure shown in the dashed box is a plan view of the first perspective view V. Figure 2A

[0139] The heat dissipation module 100 includes a first cooling pipeline 10, a second cooling pipeline 20, a first cold plate 30, a second cold plate 40, at least one heat pipe 50, a first cold plate support 60 and a second cold plate support 70. The first cooling pipeline 10 is used to input cooling working medium, and the second cooling pipeline 20 is used to output cooling working medium. The first cold plate support 60 can be used to support the first cold plate 30, and the second cold plate support 70 can be used to support the second cold plate 40.

[0140] The first cold plate 30 is in communication with the first cooling pipeline 10 and the second cooling pipeline 20, and the contact surface 000 of the first cold plate 30 contacts with the component 300 to be cooled to absorb heat of the component 300 to be cooled.​

[0141] In use, the heat on the component to be cooled 300 can be transferred to the first cold plate 30, for example, the heat on the component to be cooled 300 can be transferred to the first cold plate 30 via the contact surface of the first cold plate 30, thereby the heat of the component to be cooled 300 can be absorbed by the first cold plate 30. Meanwhile, the first cold plate 30 is connected between the first cooling pipeline 10 and the second cooling pipeline 20, in use, the cooling medium can flow into the first cold plate 30 through the first cooling pipeline 10, absorb the heat of the first cold plate 30, and then be discharged out of the first cold plate 30 via the second cooling pipeline 20. That is, with the flow of the cooling medium, the heat generated by the component to be cooled 300 can be released through the first cold plate 30 and the cooling medium flowing through the first cold plate 30, thereby achieving the effect of cooling the component to be cooled 300.

[0142] As shown in Figure 3A The second cold plate 40 is spaced apart from the first cold plate 30, and the second cold plate 40 is connected to the first cold plate 30 by at least one heat pipe 50. The part of the heat pipe 50 in contact with the first cold plate 30 can absorb the heat on the first cold plate 30 and transfer it; the part of the heat pipe 50 in contact with the second cold plate 40 can release the part of the heat absorbed to the second cold plate 40.

[0143] Therefore, by providing the second cold plate 40 and the heat pipe 50, the heat on the first cold plate 30 can be further reduced, thereby better cooling the component to be cooled 300. Therefore, the second cold plate 40 can share the heat of the component to be cooled 300 absorbed by the first cold plate 30 by using the heat pipe 50. Therefore, it is beneficial to reduce the thermal resistance of the first cold plate 30 (i.e., the temperature difference between the cooling medium inlet and the cooling medium outlet of the first cold plate 30, and the ratio of the power of the component to be cooled 300), and improve the cooling effect of the component to be cooled 300.

[0144] In addition, the second cold plate 40 is also connected to the first cooling pipeline 10 and the second cooling pipeline 20, in use, the cooling medium can also flow into the second cold plate 40 through the first cooling pipeline 10, absorb the heat of the second cold plate 40, and then be discharged out of the second cold plate 40 via the second cooling pipeline 20. That is, with the flow of the cooling medium, the heat on the second cold plate 40 can be released through the cooling medium flowing through the second cold plate 40, thereby achieving the effect of cooling the second cold plate 40, at this time, the cooling effect of the first cold plate 30 and the component to be cooled 300 can also be improved. Therefore, it is beneficial to further reduce the thermal resistance of the first cold plate 30 and improve the cooling effect of the component to be cooled 300.

[0145] As can be seen from the above, compared with the case of using only the first cold plate 30 to dissipate heat from the heat-dissipating component 300, the heat dissipation module 100 provided in the embodiment can distribute part of the heat of the heat-dissipating component 300 to the second cold plate 40. That is, the heat-dissipating component 300 can be cooled by the first cold plate 30 and the second cold plate 40 at the same time, so that the heat dissipation effect of the heat dissipation module 100 can be improved.

[0146] For example, the cooling medium in the heat dissipation module 100 is discharged to an external liquid cooling source through the second cooling pipeline 20. The cooling medium is cooled by the liquid cooling source, and the cooling process is repeated after the cooling medium is cooled. That is, the cooling medium is flowed into the heat dissipation module 100 through the first cooling pipeline 10 again to form a cycle, so that the heat-dissipating component 300 can be cooled.

[0147] In some examples, the heat pipe 50 can be adjusted to uniformly distribute the heat absorbed by the first cold plate 30 and the second cold plate 40, so that the heat dissipation capacity of the first cold plate 30 and the second cold plate 40 can be uniform, the uniformity of the heat dissipation effect of different areas of the heat dissipation module 100 can be improved, and the performance of the heat dissipation module 100 can be improved.

[0148] For example, the number, aperture length, internal structure, etc. of the heat pipe 50 can be adjusted to uniformly distribute the heat absorbed by the first cold plate 30 and the second cold plate 40.

[0149] In some examples, the cooling medium in the heat dissipation module 100 can be any one of water, 25% propylene glycol, or 25% ethylene glycol, or a combination of several thereof. It can be understood that the cooling medium in the heat dissipation module 100 can be other cooling medium that can absorb heat, and the embodiment of the present application does not limit this.

[0150] In some examples, the number of heat pipes 50 in the heat dissipation module 100 can be one, two, three, or more. Figure 3A For example, the heat dissipation module 100 includes six heat pipes 50. It can be understood that in other embodiments, the number of heat pipes 50 can be one, two, three, or more.

[0151] The structure of the heat dissipation module 100 is generally introduced above in combination with some drawings, and the connection mode of the first cold plate 30 and the second cold plate 40 in the heat dissipation module 100 will be introduced below in combination with the drawings.

[0152] In some embodiments, as shown in FIG. 1, the first cold plate 30 and the second cold plate 40 are connected in series. Figure 3AAs shown, the heat dissipation module 100 further comprises a third cooling pipeline 80. The first cold plate 30 comprises a first inlet R1 and a first outlet T1, and the second cold plate 40 comprises a second inlet R2 and a second outlet T2. The first inlet R1 is in communication with the first cooling pipeline 10, and the second outlet T2 is in communication with the second cooling pipeline 20. One end of the third cooling pipeline 80 is in communication with the first outlet T1, and the other end of the third cooling pipeline 80 is in communication with the second inlet R2.

[0153] In this way, the second cold plate 40 and the first cold plate 30 are arranged in series between the first cooling pipeline 10 and the second cooling pipeline 20.

[0154] During use of the heat dissipation module 100, the cooling medium flowing through the first cooling pipeline 10 flows into the first cold plate 30 through the first inlet R1, absorbs the heat of the first cold plate 30, and then flows into the second cooling pipeline 20 through the first outlet T1 with the cooling medium in the first cold plate 30 being heated. The cooling medium is then discharged from the second cooling pipeline 20 to the third cooling pipeline 80.

[0155] Then, the heat pipe 50 can absorb part of the heat on the first cold plate 30 by the part of the heat pipe 50 in contact with the first cold plate 30, and then release the part of the heat to the second cold plate 40 by the part of the heat pipe 50 in contact with the second cold plate 40. At this time, the cooling medium in the third cooling pipeline 80 can flow through the first cooling pipeline 10, flow into the second cold plate 40 through the second inlet R2, absorb the heat in the second cold plate 40, and then flow into the second cooling pipeline 20 through the second outlet T2 with the cooling medium in the second cold plate 40 being heated. The cooling medium is then discharged from the second cooling pipeline 20 to the outside of the second cold plate 40, i.e. to the outside of the heat dissipation module 100, thereby achieving the effect of dissipating heat from the component 300 to be cooled.

[0156] It can be understood that the heat dissipation module 100 provided by the embodiments of the present application utilizes the heat pipe 50 to simultaneously dissipate the heat of the component to be cooled 300 to the first cold plate 30 and the second cold plate 40. Since the first cold plate 30 and the second cold plate 40 are connected in series, and further in the case that the heat to be dissipated is consistent, such as the heat of the component to be cooled 300, the flow of the cooling medium in the heat dissipation module 100 can be reduced by about 25% and the pressure drop can be reduced by about 7% when the first cold plate 30 and the second cold plate 40 are used to simultaneously dissipate heat relative to the case that only one cold plate is used to dissipate heat.

[0157] Therefore, the heat dissipation module 100 includes the first cold plate 30 and the second cold plate 40 connected by the heat pipe 50, and the first cold plate 30 and the second cold plate 40 are connected in series, which can be beneficial to improve the heat dissipation effect of the heat dissipation module 100.

[0158] In some examples, in the case that the heat to be dissipated is consistent, such as the heat of the component to be cooled 300, the flow of the cooling medium in the heat dissipation module 100 can be reduced by about 25% and the pressure drop can be reduced by about 7% when two cold plates (the first cold plate 30 and the second cold plate 40) are connected in series to dissipate heat relative to the case that only one cold plate is used to dissipate heat from the component to be cooled 300.

[0159] It should be noted that in some examples, due to the existence of certain uncontrollable errors (such as manufacturing process errors, equipment precision, measurement errors, etc.), the error of the flow reduction of the cooling medium can be within the range of 25% ± 5%, and the error of the pressure drop reduction can be within the range of 7% ± 5%.

[0160] Figure 3B For Figure 2B The structure shown in the dashed box is a plan view of the structure under the first visual angle V.

[0161] In some embodiments, as Figure 3B shown, and in combination with Figure 2BThe heat dissipation module 100 includes a first cooling pipeline 10, a second cooling pipeline 20, a first cold plate 30, a second cold plate 40, at least one heat pipe 50, a first cold plate support 60 and a second cold plate support 70. The first cooling pipeline 10 includes a first branch pipe 10a, a second branch pipe 10b and a first main pipe 10c. The first cold plate 30 includes a first inlet R1 and a first outlet T1. The second cold plate 40 includes a second inlet R2 and a second outlet T2.

[0162] At this time, the first inlet R1 of the first cold plate 30 is in communication with the first branch pipe 10a, and the first outlet T1 of the first cold plate 30 is in communication with the third branch pipe 20a. The second inlet of the second cold plate 40 is in communication with the third branch pipe 20a, and the second outlet of the second cold plate 40 is in communication with the fourth branch pipe 20b. One end of the first branch pipe 10a and one end of the second branch pipe 10b are in communication with the first main pipe 10c. The second cooling pipeline 20 includes a third branch pipe 20a, a fourth branch pipe 20b and a second main pipe 20c. One end of the third branch pipe 20a and one end of the fourth branch pipe 20b are in communication with the second main pipe 20c.

[0163] In this way, the second cold plate 40 is connected in parallel with the first cold plate 30 between the first cooling pipeline 10 and the second cooling pipeline 20.

[0164] During use of the heat dissipation module 100, the cooling medium flowing through the first main pipe 10c of the first cooling pipeline 10 can flow into different cold plates through the first branch pipe 10a and the second branch pipe 10b, respectively. For example, the cooling medium flowing through the first main pipe 10c of the first cooling pipeline 10 to the first branch pipe 10a can flow into the first cold plate 30 through the first inlet R1, absorb heat of the first cold plate 30, and then be discharged from the first cold plate 30 through the first outlet T1. That is, the cooling medium after being heated in the first cold plate 30 can flow to the second main pipe 20c through the third branch pipe 20a of the second cooling pipeline 20, and then be discharged from the heat dissipation module 100 through the second main pipe 20c of the second cooling pipeline 20. Then, the part of the heat on the first cold plate 30 can be absorbed by the part of the heat pipe 50 in contact with the first cold plate 30, and the part of the heat can be released to the second cold plate 40 by the part of the heat pipe 50 in contact with the second cold plate 40.

[0165] At this time, the cooling medium flowing to the second branch pipe 10b through the first main pipe 10c of the first cooling pipeline 10 can flow into the second cold plate 40 through the second inlet R2, absorb the heat in the second cold plate 40, and then be discharged from the second cold plate 40 through the second outlet T2 after being heated, that is, the heated cooling medium can flow to the second main pipe 20c through the fourth branch pipe 20b of the second cooling pipeline 20. Then, the second main pipe 20c of the second cooling pipeline 20 is used to discharge the heated cooling medium to the heat dissipation module 100. That is, the cooling medium flowing through the first cold plate 30 and the second cold plate 40 can be discharged through the second main pipe 20c after being heated, thereby achieving the effect of dissipating heat from the component to be cooled 300.

[0166] It can be understood that the heat dissipation module 100 provided by the embodiment of the present application uses the heat pipe 50 to dissipate the heat of the component to be cooled 300 to the first cold plate 30 and the second cold plate 40. Since the first cold plate 30 and the second cold plate 40 are connected in parallel, that is, the flow of the cooling medium in the original cold plate is distributed to the first cold plate 30 and the second cold plate 40. Therefore, under the condition that the flow of the cooling medium flowing through the heat dissipation module 100 is the same, the use of two cold plates can share the flow of the cooling medium, which can reduce the flow of the cooling medium flowing through the first cold plate 30. At the same time, it can also reduce the pressure drop in the first cold plate 30, thereby improving the heat dissipation effect of the first cold plate 30, that is, improving the heat dissipation effect of the heat dissipation module 100. Moreover, the working condition of the second cold plate 40 is similar to that of the first cold plate 30, that is, the flow of the cooling medium in the second cold plate 40 is also lower than the flow and pressure drop in the cold plate when only one cold plate is provided, thereby improving the heat dissipation effect of the heat dissipation module 100.

[0167] Therefore, it can be known that the heat dissipation module 100 includes the first cold plate 30 and the second cold plate 40 connected by the heat pipe 50, and when the first cold plate 30 and the second cold plate 40 are connected in parallel, it can be beneficial to improve the heat dissipation effect of the heat dissipation module 100.

[0168] In some examples, under the condition that the flow of the cooling medium flowing through the heat dissipation module 100 is the same, compared with dissipating heat from the component to be cooled 300 by one cold plate, when two cold plates (the first cold plate 30 and the second cold plate 40) are connected in parallel to dissipate heat together, the pressure drop in the heat dissipation module 100 can be reduced by about 70%, and the temperature of the component to be cooled 300 can be relatively reduced by about 3℃.

[0169] It should be noted that in some examples, due to certain uncontrollable errors (such as manufacturing process errors, equipment precision, measurement errors, etc.), the error of the pressure drop reduction can be within the range of 70% ± 5%, and the error of the temperature reduction can be within the range of 3℃ ± 5%.

[0170] The connection manner of the first cold plate 30 and the second cold plate 40 in the heat dissipation module 100 is not limited in the embodiments of the present disclosure, and can be set according to actual needs.

[0171] In some examples, as shown in Figure 3A and Figure 3B , the first cold plate support 60 can also be used to support one end of the heat pipe 50 to make the one end of the heat pipe 50 contact the first cold plate 30.

[0172] In some examples, as shown in Figure 3A and Figure 3B , the second cold plate support 70 can also be used to support the other end of the heat pipe 50 to make the other end of the heat pipe 50 contact the second cold plate 40.

[0173] In some embodiments, as shown in Figure 3A and Figure 3B , the contact surface 000 of the first cold plate 30 in the heat dissipation module 100 contacts the component to be cooled 300. The second cold plate 40 can be located on the side of the first cold plate away from the contact surface 000.

[0174] In this way, it is not only beneficial to reduce the occupation of space in the direction parallel to the contact surface, but also can make the heat on the second cold plate 40 not easily affect the component to be cooled 300.

[0175] It can be understood that the above structure is applicable to the heat dissipation module 100 in which the first cold plate 30 and the second cold plate 40 are connected in series as shown in Figure 3A . Meanwhile, the above structure is also applicable to the heat dissipation module 100 in which the first cold plate 30 and the second cold plate 40 are connected in parallel as shown in Figure 3B . The embodiments of the present disclosure do not limit this.

[0176] The above describes the connection manner of the first cold plate 30 and the second cold plate 40 in the heat dissipation module 100, and the positional relationship between the first cold plate 30 and the second cold plate 40 in combination with some of the drawings. The following will introduce the setting manner of the heat pipe in the heat dissipation module 100 in combination with other drawings.

[0177] Figure 4A For Figure 2A , an assembly schematic diagram of the component to be cooled, the first pipe segment and the first cold plate.

[0178] In some embodiments, as shown in Figure 4A , and in combination with Figure 2A . Wherein, although Figure 4A the first cold plate 30 and the first pipe segment 51 are taken as an example for illustration. The connection relationship between the second cold plate 40 and the second pipe segment 52 is the same as the connection structure of the first cold plate 30 and the first pipe segment 51. For example, as shown in Figure 4A , the first pipe segment 51 is connected to the first cold plate 30.Figure 4A The first cold plate 30 in the first embodiment is replaced by a second cold plate 40, and the first pipe segment 51 is replaced by a second pipe segment 52.

[0179] The heat pipe 50 in the heat dissipation module 100 in the embodiment includes the first pipe segment 51 and the second pipe segment 52 connected. The first pipe segment 51 is in contact with the first cold plate 30, and the second pipe segment 52 is in contact with the second cold plate 40. Thus, the first pipe segment 51 can be used to absorb part of the heat on the first cold plate 30, and the second pipe segment 52 can be used to dissipate the part of the heat to the second cold plate 40.

[0180] It can be understood that, in some embodiments, Figure 4A The first pipe segment 51 can be connected to the first cold plate 30 in series or in parallel. Figure 2A The assembly schematic diagram of the to-be-cooled component, the first pipe segment, and the first cold plate in the first embodiment. In other embodiments, Figure 4A The first pipe segment 51 can be connected to the first cold plate 30 in series or in parallel. Figure 2B The assembly schematic diagram of the to-be-cooled component, the first pipe segment, and the first cold plate in the first embodiment. In other embodiments,

[0181] In yet other embodiments, as shown in FIG. 5, the first pipe segment 51 is in contact with the contact surface 000 of the first cold plate 30. This can make the first pipe segment 51 of the heat pipe 50 better absorb the heat of the to-be-cooled component 300 absorbed on the first cold plate 30. This can also be conducive to subsequent heat conduction of the part of the heat to the second cold plate 40. In order to utilize the first cold plate 30 and the second cold plate 40 to jointly dissipate heat for the to-be-cooled component 300, and improve the heat dissipation effect of the heat dissipation module 100. Figure 4A For example, the contact surface 000 of the first cold plate 30 is provided with a heat-conductive material. The first pipe segment 51 is in contact with the heat-conductive material of the contact surface 000 of the first cold plate 30. This can make the first pipe segment 51 of the heat pipe 50 better absorb the heat of the to-be-cooled component 300 absorbed on the first cold plate 30. This can also be conducive to subsequent heat conduction of the part of the heat to the second cold plate 40. In order to utilize the first cold plate 30 and the second cold plate 40 to jointly dissipate heat for the to-be-cooled component 300, and improve the heat dissipation effect of the heat dissipation module 100. For example, the heat-conductive material can be stainless steel, copper, or aluminum, etc. The embodiments of the present application do not limit this.

[0182] For example, the contact surface 000 of the first cold plate 30 is provided with a heat-conductive material. The first pipe segment 51 is in contact with the heat-conductive material of the contact surface 000 of the first cold plate 30. This can make the first pipe segment 51 of the heat pipe 50 better absorb the heat of the to-be-cooled component 300 absorbed on the first cold plate 30. This can also be conducive to subsequent heat conduction of the part of the heat to the second cold plate 40. In order to utilize the first cold plate 30 and the second cold plate 40 to jointly dissipate heat for the to-be-cooled component 300, and improve the heat dissipation effect of the heat dissipation module 100. For example, the heat-conductive material can be stainless steel, copper, or aluminum, etc. The embodiments of the present application do not limit this.

[0183] It can be understood that the second cold plate 40 is provided with a heat-conducting material on the side close to the first cold plate 30. The second pipe segment 52 can also be in contact with the heat-conducting material on the side of the second cold plate 40 close to the first cold plate 30, so that the heat pipe 50 can better conduct heat to the second cold plate 40, so as to improve the heat dissipation effect of the heat dissipation module 100 by using the first cold plate 30 and the second cold plate 40 to jointly dissipate heat from the heat-dissipation component 300. For example, the heat-conducting material can be stainless steel, copper, or aluminum, etc. The embodiments of the present application do not limit this.

[0184] Figure 4B For Figure 2A a cross-sectional view of the middle J-J' direction.

[0185] In some examples, as shown in Figure 4A and Figure 4B , the contact surface 000 of the first cold plate 30 includes a recessed area N, and the first pipe segment 51 of the heat pipe 50 is located in the recessed area N. It can better play a role in fixing the first pipe segment 51, so that the first pipe segment 51 of the heat pipe 50 is in contact with the contact surface 000 of the first cold plate 30, and the first pipe segment 51 can better absorb the heat of the heat-dissipation component 300 absorbed by the first cold plate 30.

[0186] In other examples, as shown in Figure 4A , the pipe diameter of the first pipe segment 51 is equal to the depth of the recessed area N. When the first pipe segment 51 is located inside the recessed area N, the side of the first pipe segment 51 close to the heat-dissipation component 300 is at the same level as the side of the first cold plate 30 close to the heat-dissipation component 300 at other positions except the recessed area N. This can help reduce the distance between the first cold plate 30 and the heat-dissipation component 300, and better absorb the heat of the heat-dissipation component 300 for heat dissipation treatment. At the same time, it can also be more convenient to fix the position of the first cold plate 30 and the heat-dissipation component 300, and improve the structural stability of the heat dissipation module 100.

[0187] For example, Figure 4A a square cross-section of the recessed area N is taken as an example for illustration. It can be understood that in other examples, the cross-section of the recessed area N can also be n-shaped, which can make the first pipe segment 51 and the recessed area N more easily engaged.

[0188] Among them, Figure 4A one first pipe segment 51 is placed in one recessed area N as an example for illustration. It can be understood that in other embodiments, one recessed area N can also correspond to the placement of multiple first pipe segments 51, and a fixing material can be added in the recessed area N to fix the multiple first pipe segments 51. For example, a colloid can be used.

[0189] In some embodiments, as shown in Figure 4B , and in combination withFigure 2A As shown, the first cold plate 30 includes a first edge U1 and a second edge U2 opposite to each other. The first cold plate 30 further includes a third edge U3 between the first edge U1 and the second edge U2. The length of the first edge U1 is greater than the length of the third edge U3. The heat pipe 50 further includes a third pipe segment 53 which is in communication between the first pipe segment 51 and the second pipe segment 52. The third pipe segment 53 is located on the side of the first edge U1 away from the second edge U2.

[0190] As the heat dissipation module 100 includes at least one heat pipe 50, the length of the first edge U1 is greater than the length of the third edge U3, and the third pipe segment 53 is arranged on the side of the first edge U1 away from the second edge U2. That is, it can be understood that the heat pipe 50 is concentrated on the longer side of the heat dissipation module 100. In this way, on the one hand, the volume of the heat dissipation module 100 is reduced, which is beneficial to the miniaturization of the heat dissipation module 100, and the cost of the heat dissipation module 100 can also be reduced. On the other hand, the heat pipe 50 is arranged on the longer side, which can facilitate the arrangement of the heat pipe 50 and the flexible arrangement of the number and position of the heat pipe 50.

[0191] In some examples, the two ends of the third edge U3 can be connected with the first edge U1 and the second edge U2 respectively. It can be understood that in other examples, as shown in Figure 2A The third edge U3 can be connected with the second edge U2 through other edges. The embodiments of the present application do not limit this.

[0192] In some examples, the first edge U1 and the second edge U2 are relatively parallel, and the length of the first edge U1 is equal to the length of the second edge U2. The lengths of the opposite first edge U1 and the second edge U2 are equal, which can be beneficial to simplify the manufacturing process of the cold plate.

[0193] It can be understood that in other embodiments, the length of the first edge U1 can be equal to the length of the third edge U3. When the lengths of the edges in the first cold plate 30 are all equal, a plurality of heat pipes can be arranged on one side of any edge, which can reduce the volume of the heat dissipation module 100 and facilitate the miniaturization of the heat dissipation module 100.

[0194] In some embodiments, as shown in Figure 4A and in combination with Figure 2A The number of heat pipes 50 is multiple. The multiple heat pipes 50 are arranged in sequence along the extension direction X of the side edge of the first cold plate 30. For example, the multiple heat pipes 50 are arranged in sequence along the extension direction X of the first edge U1.

[0195] In the embodiment, the heat dissipation module 100 includes a plurality of heat pipes 50. The plurality of heat pipes 50 can conduct heat on the first cold plate 30 to the second cold plate 40, which can reduce the heat dissipation time required for the first cold plate 30 to conduct heat to the second cold plate 40. That is, the required heat dissipation time of the heat dissipation module 100 is reduced, and the heat dissipation effect of the heat dissipation module 100 is improved. In addition, the plurality of heat pipes 50 are arranged along the extension direction X of the first edge U1 in sequence and are spaced apart. The contact between adjacent heat pipes 50 can be prevented, that is, the effect of the heat pipe 50 on the heat conduction of the first cold plate 30 to the second cold plate 40 can be prevented.

[0196] In some examples, the heat dissipation module 100 includes a plurality of heat pipes 50. The plurality of heat pipes 50 are arranged along the extension direction X of the first edge U1 in sequence and are equidistantly spaced apart, which facilitates the position arrangement of the first pipe section 51 and the second pipe section 52 of the heat pipe 50, simplifies the structure of the heat dissipation module 100, and facilitates manufacturing.

[0197] In some embodiments, as shown in FIG. 1, a reference plane parallel to the contact surface 000 (as shown in FIG. 2) is used as a reference plane. The orthogonal projection of the second cold plate 40 on the reference plane coincides with the orthogonal projection of the first cold plate 30 on the reference plane. Figure 4B Figure 4A It should be noted that "substantially coincides" includes absolute coincidence and approximate coincidence. That is, the gap between the orthogonal projection of the first cold plate 30 on the reference plane and the orthogonal projection of the second cold plate 40 on the reference plane does not exceed the error threshold, and it can be considered that the edges of the two pipe sections are approximately coincident.

[0198] In this way, on the one hand, the volume of the heat dissipation module 100 is reduced, which facilitates the miniaturization of the heat dissipation module 100, and on the other hand, the cost of the heat dissipation module 100 is also reduced.

[0199] In some examples, as shown in FIG. 1, the first pipe section 51 is in contact with the first cold plate 30, and the second pipe section 52 is in contact with the second cold plate 40. The heat pipe 50 further includes a third pipe section 53 for connecting the first pipe section 51 and the second pipe section 52.

[0200] In some examples, as shown in FIG. 1, the first pipe section 51 is in contact with the first cold plate 30, and the second pipe section 52 is in contact with the second cold plate 40. The heat pipe 50 further includes a third pipe section 53 for connecting the first pipe section 51 and the second pipe section 52. Figure 4B

[0201] In some examples, as shown in FIG. 1, the first pipe section 51 is in contact with the first cold plate 30, and the second pipe section 52 is in contact with the second cold plate 40. The heat pipe 50 further includes a third pipe section 53 for connecting the first pipe section 51 and the second pipe section 52.

[0202] In some embodiments, as shown in FIG. 1, a reference plane parallel to the contact surface 000 (as shown in FIG. 2) is used as a reference plane. The orthogonal projection of the second cold plate 40 on the reference plane coincides with the orthogonal projection of the first cold plate 30 on the reference plane. Figure 4B ​​As shown, the first tube segment 51 in the orthographic projection of the plane where the first cold plate 30 is located is substantially coincident with the second tube segment 52 in the orthographic projection of the plane where the first cold plate 30 is located. In this way, the third tube segment 53 connected to the first tube segment 51 and the second tube segment 52 can be arranged, and the process difficulty of the heat pipe 50 is simplified.

[0203] It should be noted that "substantial coincidence" includes absolute coincidence and approximate coincidence. That is, the gap between the first tube segment 51 in the orthographic projection of the plane where the first cold plate 30 is located and the second tube segment 52 in the orthographic projection of the plane where the first cold plate 30 is located is within an error threshold, and the edges of the two tube segments are considered to be approximately coincident.

[0204] The following will introduce other structures of the heat dissipation module in combination with some related drawings. First, the following will introduce the structure of the first cold plate support 60 in the heat dissipation module 100 in combination with some related drawings.

[0205] Figure 4C For Figure 2A A schematic view of an assembly of the first cold plate support and the first tube segment of the heat pipe.

[0206] In some embodiments, as Figure 4C shown, and in combination with Figure 2A shown, the first cold plate support 60 includes a first hollow area 61 and a first connecting portion 62 surrounding the first hollow area 61. The first cold plate 30 is installed in the first hollow area 61.

[0207] In this embodiment, the first cold plate 30 is installed in the first hollow area 61, so that the first cold plate 30 can be fixed by the first hollow area 61 in the first cold plate support 60. At the same time, the outer edge of the first connecting portion 62 can be used to connect an external structure, which can be a base, a support, etc. in the electronic device 200. Further, the first cold plate support 60 can be fixed by the external structure, so that the first cold plate 30 is fixed by the first hollow area 61 in the first cold plate support 60. Thus, the stability of the first cold plate support 60 can be improved, that is, the stability of the heat dissipation module 100 can be improved. In some examples, the external structure can reuse the original structure in the electronic device 200. In other examples, the external structure can also be a fixed structure additionally provided in the electronic device 200.

[0208] In this way, the contact surface 000 of the first cold plate 30 can be in contact with the component 300 to be cooled. The first cold plate 30 can absorb the heat of the component 300 to be cooled and perform cooling treatment on the component 300 to be cooled.

[0209] In some embodiments, as Figure 4CAs shown, the first hollow area 61 can be located at the middle part W1 of the first cold plate bracket 60. In turn, the first cold plate 30 can be defined to be located at the middle part W1 of the first cold plate bracket 60 by using the first hollow area 61. The first cold plate bracket 60 can be made to bear force evenly. Moreover, it is also beneficial to simplify the process difficulty of the first cold plate bracket 60.

[0210] In some embodiments, as shown in Figure 4B and Figure 4C As shown, the first cold plate bracket 60 further comprises a first heat pipe mounting hole 63 extending from the first side surface E1 of the first cold plate bracket 60 to the first hollow area 61. The first heat pipe mounting hole 63 can be provided to facilitate the installation of the first pipe segment 51 of the heat pipe 50. By arranging the first pipe segment 51 to extend into the first hollow area 61 through the first heat pipe mounting hole 63, the contact surface 000 of the first pipe segment 51 and the first cold plate 30 can be prevented from being misaligned, that is, it can be ensured that the first pipe segment 51 can be in contact with the contact surface 000 of the first cold plate 30. In turn, the heat pipe 50 can absorb the heat of the first cold plate 30 by using the first pipe segment 51, and partially conduct the heat of the heat-dissipating component 300 absorbed thereby to the second cold plate 40. Thus, the heat source can be simultaneously dissipated by using the first cold plate 30 and the second cold plate 40, which is beneficial to improve the heat dissipation effect of the heat dissipation module 100.

[0211] In some embodiments, as shown in Figure 4B and Figure 4C As shown, the first heat pipe mounting hole 63 is taken as an example, with one end thereof away from the first side surface E1 located inside the first hollow area 61.

[0212] It can be understood that in other embodiments, the first heat pipe mounting hole 63 can also be arranged such that one end thereof away from the first side surface E1 is flush with one side of the first hollow area 61 away from the first side surface E1. The embodiment shown in Figure 4B and Figure 4C The first heat pipe mounting hole 63 can be arranged such that one end thereof away from the first side surface E1 is located inside the first hollow area 61, which can be beneficial to increase the overlapping area of the first heat pipe mounting hole 63 and the first hollow area 61, that is, it can be beneficial to increase the contact area between the first pipe segment 51 and the first cold plate 30, so that the first pipe segment 51 can better absorb the heat on the first cold plate 30, and partially conduct the heat of the heat-dissipating component 300 absorbed thereby to the second cold plate 40. The heat source can be simultaneously dissipated by using the first cold plate 30 and the second cold plate 40, which is beneficial to improve the heat dissipation effect of the heat dissipation module 100.

[0213] However, the present embodiment does not make any limitation in this regard, as long as there is an overlapping area between the first heat pipe mounting hole 63 and the first hollow area 61, that is, the first pipe segment 51 can be in contact with the first cold plate 30.

[0214] Figure 4D ForFigure 2A Another cross-sectional view along the J-J' direction. Figure 4E for Figure 2A Another assembly diagram of the first cold plate support and the first section of the heat pipe.

[0215] In other embodiments, such as Figure 4D and Figure 4E As shown, and, can be combined simultaneously Figure 4B As shown, the first cold plate support 60 also includes a first extension hole 64. The first extension hole 64 extends from the first hollow area 61 in a direction away from the first side surface E1, and the axis M1 of the first extension hole 64 is approximately coincident with the axis M2 of the first heat pipe mounting hole 63. This prevents misalignment between the first heat pipe mounting hole 63 and the first extension hole 64. Thus, the first pipe segment 51 can extend sequentially through the first heat pipe mounting hole 63 and the first hollow area 61 into the first extension hole 64. In other words, both ends of the first pipe segment 51 can protrude from the first hollow area 61 and be located within the first heat pipe mounting hole 63 and the first extension hole 64, thus providing fixed support for the first pipe segment 51 and preventing it from sinking due to its own weight.

[0216] It should be noted that "approximately coincident" includes both absolute coincidence and near coincidence. That is, if the fluctuation range of the gap between the axis M1 of the first extension hole 64 and the axis M2 of the first heat pipe mounting hole 63 does not exceed the error threshold, it can be considered that the axis M1 of the first extension hole 64 and the axis M2 of the first heat pipe mounting hole 63 are approximately coincident.

[0217] In this embodiment, the extent to which the first extension hole 64 extends from the first hollow area 61 toward the side opposite to the first side surface E1 is not limited, as long as the side of the first pipe segment 51 opposite to the first side surface E1 protrudes from the first hollow area 61.

[0218] In some examples, the first extension hole 64 extends to the second side E2 of the first cold plate support 60. The second side E2 and the first side E1 are arranged opposite each other along the Y direction, which is parallel to the contact surface 000, and the X and Y directions intersect. This can further secure the first pipe segment 51, thereby preventing the first pipe segment 51 from sinking due to its own weight.

[0219] In some examples, direction X and direction Y are perpendicular. It is understood that in other embodiments, direction X and direction Y intersect to form an angle, which can be acute or obtuse.

[0220] In some examples, such as Figure 4C and Figure 4EAs shown, the first connecting portion 62 near the first hollow area 61 also includes a first protruding edge (not shown in the figure), which surrounds the first cold plate 30. The first protruding edge can support the first cold plate 30. This application embodiment does not limit the specific structure of the first protruding edge; the first protruding edge can be a closed shape. The first protruding edge can also be multiple protrusions spaced around the first cold plate 30.

[0221] In some other examples, the first cold plate 30 can be snapped onto the first hollow area 61, or the first cold plate 30 can be bolted to the first cold plate bracket 60. In this case, this embodiment does not limit whether the first connecting part 62 is equipped with a first protruding edge. That is, the first connecting part 62 may or may not have a first protruding edge.

[0222] in, Figure 4C and Figure 4E To clearly illustrate the internal structure of the first cold plate support 60, the first cooling pipe 10 and the second cooling pipe 20, which need to be connected to the first cold plate 30, are not shown. The specific structures of the first cooling pipe 10 and the second cooling pipe 20 can be found in [the diagram / illustration]. Figure 2A As shown.

[0223] also, Figure 4C and Figure 4E The diagram illustrates the first hollow area 61 as an octagon. It is understood that in other embodiments, the first hollow area 61 can be elliptical or square. The specific shape can be adjusted according to the shape of the first cold plate 30.

[0224] In the above embodiments, with Figures 4B-4E Applicable to Figure 2A The heat dissipation module 100 shown is illustrated as an example. It is understood that in other embodiments, Figures 4B-4E Applicable to Figure 2B The heat dissipation module 100 is shown. That is, regardless of whether the first cold plate 30 and the second cold plate 40 in the heat dissipation module 100 are connected in series or in parallel, the structure of the first cold plate support 60 and the second cold plate support 70 in the heat dissipation module 100 can be set as described above.

[0225] The above embodiments combined Figures 4B-4E The structure of the first cold-plate support 60 is described in detail. Since the structure of the second cold-plate support can be the same as that of the first cold-plate support 60, the structure of the second cold-plate support can also be referenced. Figures 4B-4E As shown.

[0226] For example, the second cold plate support 70 includes a second hollow area and a second connecting portion surrounding the second hollow area. The second cold plate is mounted on the second hollow area.

[0227] The structure of the second hollow area can be the same as that of the first hollow area 61. The second hollow area is different from the first hollow area 61 in that the second hollow area is used to mount the second cold plate 40. The structure of the second connecting part can be the same as that of the first connecting part 62. The second connecting part is different from the first connecting part 62 in that the second connecting part is used to fix the second cold plate.

[0228] For example, the second cold plate support further includes a second heat pipe mounting hole extending from the second side surface of the second cold plate support to the second hollow area. The second pipe section extends into the second hollow area through the second heat pipe mounting hole, so that the third pipe section is in contact with the second cold plate.

[0229] The structure of the second heat pipe mounting hole can be the same as that of the first heat pipe mounting hole 63. The second heat pipe mounting hole is different from the first heat pipe mounting hole 63 in that the second heat pipe mounting hole is used to fix the second pipe section 52 of the heat pipe 50.

[0230] For example, the second cold plate support further includes a second extension hole extending from the second hollow area in a direction away from the third side surface, and the axis of the second extension hole coincides with the axis of the second heat pipe mounting hole.

[0231] The structure of the second extension hole can be the same as that of the first extension hole 64. The second extension hole is different from the first extension hole 64 in that the second extension hole is used to fix the second pipe section 52 of the heat pipe 50.

[0232] In some of the above embodiments, the first cold plate support 60 and the second cold plate support are the same in structure. It can be understood that in other embodiments, the structure of the first cold plate support 60 can also be different from that of the second cold plate support 70, as long as the contact surface of the first cold plate 30 is in contact with the component to be cooled, and the heat pipe 50 connects the first cold plate 30 and the second cold plate 40. The present disclosure does not limit this.

[0233] Figure 5A A structure diagram of a heat dissipation module with multiple second cold plates provided by some embodiments of the present application is shown.

[0234] In some other embodiments, as shown in Figure 5A The number of the second cold plates 40 is multiple. The multiple second cold plates 40 are arranged in sequence in a direction away from the first cold plate 30. When the number of the second cold plates 40 is multiple, the heat dissipation module 100 further includes a third cooling pipe 80 for connecting the multiple cold plates in the heat dissipation module 100.

[0235] As shown in Figure 5AAs shown, the heat dissipation module 100 includes two second cold plates 40, and the first cold plate 30 and the first second cold plate 40a are connected in series, and the second cold plate 40a is also connected in series with the second cold plate 40b adjacent thereto. At this time, the first cooling pipeline 10 is in communication with the first cold plate 30. The first cold plate 30 is in communication with the second cold plate 40a through the third cooling pipeline 80. The second cold plate 40a is in communication with the second cold plate 40b through the third cooling pipeline 80. And the second cold plate 40b is in communication with the second cooling pipeline 20, so as to realize that the first cold plate 30, the second cold plate 40a and the second cold plate 40b are connected in series between the first cooling pipeline 10 and the second cooling pipeline 20.

[0236] In this way, the heat dissipation module 100 can include three or more cold plates. By using multiple cold plates to dissipate heat from the component to be cooled 300 at the same time, it is possible to reduce the thermal resistance in the heat dissipation module 100 and improve the heat dissipation effect of the heat dissipation module 100.

[0237] In some examples, as Figure 5A As shown, when the heat dissipation module 100 includes three or more cold plates, the heat dissipation module 100 includes two second cold plates 40 and a first cold plate 30. The heat dissipation module 100 includes two groups of heat pipes 50. The two second cold plates 40 are respectively a second cold plate 40a and a second cold plate 40b, and the two groups of heat pipes are respectively a heat pipe 50a and a heat pipe 50b. The two ends of the heat pipe 50a are respectively in contact with the first cold plate 30 and the second cold plate 40a. The heat pipe 50b is in contact with the second cold plate 40a and the second cold plate 40b.

[0238] Among them, Figure 5A For example, the heat pipe 50a and the heat pipe 50b are located at two side edges of the heat dissipation module 100. By arranging the heat pipe 50a and the heat pipe 50b at different side edges of the heat dissipation module 100, it is possible to prevent the heat pipe 50a and the heat pipe 50b from affecting each other, and reduce the heat dissipation effect of the heat dissipation module 100.

[0239] It can be understood that in other embodiments, the heat pipe 50a and the heat pipe 50b can also be located at the same side of the heat dissipation module 100. By arranging the heat pipe 50a and the heat pipe 50b at the same side of the heat dissipation module 100, it is possible to reduce the volume of the heat dissipation module, and facilitate the miniaturization of the heat dissipation module. The relative position relationship of the multiple groups of heat pipes 50 is not limited in the embodiments of the present application.

[0240] In other embodiments, as Figure 5A As shown, the multiple second cold plates 40 are arranged in sequence and spaced apart in a direction away from the first cold plate 30. It is possible to prevent the multiple second cold plates 40 from directly contacting each other and affecting each other, so as to better realize the discharge of heat to the outside of the heat dissipation module 100, and affect the heat dissipation effect of the heat dissipation module 100.

[0241] Figure 5B A structure diagram of the heat dissipation module with multiple second cold plates is provided for some other embodiments of the present application.

[0242] In some other embodiments, as shown in Figure 5B , the number of second cold plates 40 is multiple. The multiple second cold plates 40 are arranged in sequence in the direction away from the first cold plate 30.

[0243] The difference between Figure 5A is that the heat dissipation module 100 includes 2 second cold plates 40, and the first cold plate 30 and the first second cold plate 40a are connected in parallel, and the second cold plate 40a is also connected in parallel with its adjacent second cold plate 40b. At this time, the first cooling pipeline 10 includes the first branch pipe 10a, the second branch pipe 10b, and the fifth branch pipe 10d. The second cooling pipeline 20 includes the third branch pipe 20a, the fourth branch pipe 20b, and the sixth branch pipe 20d.

[0244] At this time, the first branch pipe 10a of the first cooling pipeline 10 is in communication with the inlet of the first cold plate 30, and the third branch pipe 20a of the second cooling pipeline 20 is in communication with the outlet of the first cold plate 30. The second branch pipe 10b of the first cooling pipeline 10 is in communication with the inlet of the second cold plate 40a, and the fourth branch pipe 20b of the second cooling pipeline 20 is in communication with the outlet of the second cold plate 40a. The fifth branch pipe 10d of the first cooling pipeline 10 is in communication with the inlet of the second cold plate 40b, and the sixth branch pipe 20d of the second cooling pipeline 20 is in communication with the outlet of the second cold plate 40b. And the first branch pipe 10a, the second branch pipe 10b and the fifth branch pipe 10d are communicated in the common main pipeline. The third branch pipe 20a, the fourth branch pipe 20b and the sixth branch pipe 20d are communicated in the common main pipeline. To achieve that the first cold plate 30, the second cold plate 40a and the second cold plate 40b are connected in parallel between the first cooling pipeline 10 and the second cooling pipeline 20.

[0245] In this way, the heat dissipation module 100 can include three or more cold plates. By using multiple cold plates to dissipate heat from the heat dissipation component 300 at the same time, it is possible to reduce the thermal resistance in the heat dissipation module 100 and improve the heat dissipation effect of the heat dissipation module 100.

[0246] In some examples, as shown in Figure 5B , when the heat dissipation module 100 can include three or more cold plates, such as the heat dissipation module 100 including 2 second cold plates 40 and the first cold plate 30. The heat dissipation module 100 includes two groups of heat pipes 50. The two second cold plates 40 are respectively the second cold plate 40a and the second cold plate 40b, and the two groups of heat pipes are respectively the heat pipe 50a and the heat pipe 50b. The two ends of the heat pipe 50a are respectively in contact with the first cold plate 30 and the second cold plate 40a. The heat pipe 50b is in contact with the second cold plate 40a and the second cold plate 40b.

[0247] wherein, Figure 5B For example, the heat pipe 50a and the heat pipe 50b are located at two side edges of the heat dissipation module 100 respectively. The heat pipe 50a and the heat pipe 50b are arranged at different side edges of the heat dissipation module 100, which can prevent the heat pipe 50a and the heat pipe 50b from affecting each other, and reduce the heat dissipation effect of the heat dissipation module 100.

[0248] It can be understood that, in other embodiments, the heat pipe 50a and the heat pipe 50b can also be located at the same side of the heat dissipation module 100. The heat pipe 50a and the heat pipe 50b are arranged at the same side edge of the heat dissipation module 100, which can reduce the volume of the heat dissipation module and facilitate the miniaturization of the heat dissipation module. The relative position relationship of the plurality of heat pipes 50 is not limited in the embodiments of the present application.

[0249] In other embodiments, as shown in Figure 5B , the plurality of second cold plates 40 are arranged in sequence and spaced apart in a direction away from the first cold plate 30. The plurality of second cold plates 40 can be prevented from directly contacting each other and affecting each other, and the heat can be better discharged to the outside of the heat dissipation module 100, which affects the heat dissipation effect of the heat dissipation module 100.

[0250] Figure 6A For Figure 2A , a structural schematic diagram of the first cold plate is shown, Figure 6B , a sectional view in the direction of F-F' in 6A is shown.

[0251] In some embodiments, as shown in Figure 6A and Figure 6B , the first cold plate 30 includes a first shell 31 and a first fin assembly 32, the first shell 31 has a first containing cavity P1, and the first fin assembly 32 is located in the first containing cavity P1. The first cold plate 30 is provided with the first fin assembly 32, which can improve the heat dissipation effect of the first cold plate 30, that is, the heat dissipation effect of the heat dissipation module 100.

[0252] In some examples, the first fin assembly 32 includes a plurality of first fins. Figure 6A and Figure 6B For example, the first fin assembly 32 includes 10 first fins, but the number and arrangement of the first fins are not limited in the embodiments of the present application.

[0253] Figure 6A For example, the structure of the first cold plate is shown. The structure of the second cold plate can be the same as that of the first cold plate, and the structure of the second cold plate can also be shown in Figure 6A .

[0254] For example, the second cold plate includes a second fin assembly of a second shell. Wherein, the structure of the second shell can be the same as the structure of the first shell, and the description of the structure of the first shell can be referred to for the structure of the second shell. In addition, the structure of the second fin assembly can also be the same as the structure of the first fin assembly, and the description of the structure of the first fin assembly can be referred to for the structure of the second fin assembly.

[0255] The above embodiments are described in the following Figure 6A For Figure 2A The structure of the first cold plate is schematically shown. It can be understood that in other embodiments, Figure 6A may also be Figure 2B The structure of the first cold plate is schematically shown. That is, no matter whether the first cold plate 30 and the second cold plate 40 in the heat dissipation module 100 adopt a series connection mode or a parallel connection mode, the structure of the first cold plate can be applicable. Of course, the structure of the second cold plate can also be applicable.

[0256] The internal structure of the heat pipe of the heat dissipation module 100 will be introduced in the following with reference to the relevant drawings.

[0257] Figure 7 The structure of the heat pipe is schematically shown. Figure 2A

[0258] In some embodiments, as shown in Figure 7 The heat pipe 50 includes a pipe shell 54, a wick 55 and a working medium. The wick 55 is located on the inner wall of the pipe shell 54, and the working medium is located in the pipe shell 54. Wherein, the first pipe section 51 of the heat pipe 50 can be an evaporation pipe section, and the second pipe section 52 can be a condensation pipe section. The evaporation pipe section is used to evaporate the liquid working medium into the vapor working medium. The condensation pipe section is used to condense the vapor working medium into the liquid working medium.

[0259] It can be understood that when the first pipe section 51 is heated, the working medium in the first pipe section 51 can be evaporated by absorbing heat. The working medium can flow to the second pipe section 52 through the third pipe section 53 under the driving action of the gas pressure, and the working medium is condensed in the second pipe section 52 to release heat.

[0260] It should be noted that in the embodiments of the present application, only the vapor working medium input by the first pipe section 51, the liquid working medium output by the first pipe section 51, the liquid working medium input by the second pipe section 52 and the liquid working medium output by the second pipe section 52 are taken as examples.

[0261] In some examples, when the heat pipe 50 is in use, the second pipe section 52 is located above the first pipe section 51 along the direction of gravity, so that the liquid working medium in the pipe shell 54 can flow to the first pipe section 51 under the action of gravity. The flow speed of the working medium is improved, thereby improving the heat transfer efficiency, that is, improving the heat dissipation efficiency of the heat dissipation module 100.

[0262] ​In some examples, the tube shell 54 can be a seamless metal tube. Exemplarily, the tube shell 54 can be made of one or more of copper, aluminum or stainless steel.

[0263] In some examples, the tube shell 54 can be a standard circle, or can be a special shape, such as an oval, a square, a rectangle, a flat tube, a corrugated tube, etc.

[0264] The above examples are described with reference to the structure of the heat pipe. Figure 7 For example, the structure of the heat pipe is shown in the structure diagram of the heat pipe. Figure 2A It can be understood that in other examples, Figure 7 may also be Figure 2B The structure diagram of the first cold plate is shown in the structure diagram of the heat pipe. That is, no matter whether the first cold plate 30 and the second cold plate 40 in the heat dissipation module 100 are connected in series or in parallel, the structure of the heat pipe can be applicable.

[0265] In summary, the heat dissipation module 100 and the electronic device 200 provided in some examples of the present application, when the heat dissipation module 100 is used, the first cold plate 30 is connected between the first cooling pipeline 10 and the second cooling pipeline 20, and the cooling working medium can flow into the first cold plate 30 through the first cooling pipeline 10. After the first cold plate 30 absorbs the heat on the component to be cooled 300, the heat is discharged to the outside of the first cold plate 30 through the second cooling pipeline 20.

[0266] At the same time, since the first pipe section 51 of any heat pipe 50 is in contact with the first cold plate 30, and the second pipe section 52 of the heat pipe 50 is in contact with the second cold plate 40. The first pipe section 51 can be used to absorb part of the heat on the first cold plate 30, the third pipe section 53 can be used to transfer the heat absorbed by the first pipe section 51, and the second pipe section 52 can be used to release the heat to the second cold plate 40. Since the second cold plate 40 is also connected between the first cooling pipeline 10 and the second cooling pipeline 20, the cooling working medium can also flow into the second cold plate 40 through the first cooling pipeline 10, absorb the heat of the second cold plate 40, and then be discharged to the outside of the second cold plate 40 through the second cooling pipeline 20. That is, at this time, the heat pipe 50 can be used to make the second cold plate 40 share the heat of the component to be cooled 300 absorbed by the first cold plate 30.

[0267] In addition, the heat absorbed in the first cold plate 30 and the second cold plate 40 will be released with the cooling working medium discharged, thereby achieving the effect of dissipating the heat of the component to be cooled.

[0268] From the above, relative to the case of only using the first cold plate 30 to dissipate heat from the heat dissipation component 300, the heat dissipation module 100 provided in the embodiment of the present application can distribute part of the heat of the heat dissipation component 300 to the second cold plate 40. That is, the first cold plate 30 and the second cold plate 40 can be used simultaneously to dissipate heat from the heat dissipation component 300, thereby improving the heat dissipation effect of the heat dissipation module 100.

[0269] At the same time, the electronic device 200 with the heat dissipation module 100 has the beneficial effects of the heat dissipation module 100 in any of the embodiments described above, which will not be repeated here.

[0270] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art who thinks of changes or replacements within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipation module, disposed in an electronic device, the electronic device including a component to be cooled, characterized in that, comprising: a first cooling pipeline and a second cooling pipeline; the first cooling pipeline is used for inputting cooling working medium, and the second cooling pipeline is used for outputting the cooling working medium; a first cold plate, which is in communication with the first cooling pipeline and the second cooling pipeline; a contact surface of the first cold plate is in contact with the component to be cooled, and is used for absorbing heat of the component to be cooled; a second cold plate, which is in communication with the first cooling pipeline and the second cooling pipeline; the second cold plate is arranged in a spaced manner with the first cold plate; at least one heat pipe, which is connected with the first cold plate and the second cold plate; a first cold plate support, which is used for supporting the first cold plate and supporting one end of the heat pipe, so that the one end of the heat pipe is in contact with the first cold plate; a second cold plate support, which is used for supporting the second cold plate and supporting the other end of the heat pipe, so that the other end of the heat pipe is in contact with the second cold plate. The second cold plate is located on a side of the first cold plate away from the contact surface.

2. The heat dissipation module of claim 1, wherein, Any one of the heat pipes comprises a first pipe segment and a second pipe segment connected in sequence; the first pipe segment is in contact with the first cold plate, and the second pipe segment is in contact with the second cold plate.

3. The heat dissipation module of claim 1, wherein, The contact surface of the first cold plate comprises a recessed area, and the first pipe segment is located in the recessed area.

4. The heat dissipation module of claim 3, wherein, The first cold plate support comprises a first hollow area and a first connecting portion surrounding the first hollow area, and the first cold plate is mounted in the first hollow area; and / or 5. The heat dissipation module of claim 3, wherein, The second cold plate support comprises a second hollow area and a second connecting portion surrounding the second hollow area, and the second cold plate is mounted in the second hollow area. The first cold plate support further comprises a first heat pipe mounting hole extending from a first side surface of the first cold plate support to the first hollow area; The first pipe segment extends into the first hollow area through the first heat pipe mounting hole, so that the first pipe segment is in contact with the first cold plate; 6. The heat dissipation module of claim 5, wherein, The second cold plate support further comprises a second heat pipe mounting hole extending from a second side surface of the second cold plate support to the second hollow area; The second pipe segment extends into the second hollow area through the second heat pipe mounting hole, so that the second pipe segment is in contact with the second cold plate. The first cold plate further comprises a third cooling pipeline; an inlet of the first cold plate is in communication with the first cooling pipeline, an outlet of the first cold plate and an inlet of the second cold plate are in communication through the third cooling pipeline, and an outlet of the second cold plate is in communication with the second cooling pipeline.

8. The heat dissipation module according to claim 1, wherein the first cooling pipeline comprises a first branch pipe, a second branch pipe and a first main pipe; one end of the first branch pipe and one end of the second branch pipe are in communication with the first main pipe; the second cooling pipeline comprises a third branch pipe, a fourth branch pipe and a second main pipe; one end of the third branch pipe and one end of the fourth branch pipe are in communication with the second main pipe; 7. The heat dissipating module of claim 1, wherein, the inlet of the first cold plate is in communication with the other end of the first branch pipe, and the outlet of the first cold plate is in communication with the other end of the third branch pipe. ​ ​ ​ ​ An inlet of the second cold plate is communicated with the other end of the second branch pipe, and an outlet of the second cold plate is communicated with the other end of the fourth branch pipe.

9. The heat dissipation module according to claim 1, characterized in that, The number of the heat pipes is multiple, and the multiple heat pipes are sequentially and spacedly arranged along the extension direction of the side edge of the first cold plate.

10. The heat dissipation module according to claim 1, characterized in that, A reference plane is parallel to the contact surface; The normal projection of the second cold plate on the reference plane coincides with the normal projection of the first cold plate on the reference plane.

11. The heat dissipation module according to claim 1, characterized in that, The number of the second cold plates is multiple, and the multiple second cold plates are sequentially arranged in the direction away from the first cold plate.

12. The heat dissipation module according to any one of claims 1-11, characterized in that, The first cold plate comprises a first shell and a first fin assembly, the first shell has a first accommodating cavity therein, and the first fin assembly is located in the first accommodating cavity; and / or, The second cold plate comprises a second shell and a second fin assembly, the second shell has a second accommodating cavity therein, and the second fin assembly is located in the second accommodating cavity.

13. An electronic device, comprising: Comprise: At least one component to be cooled; At least one heat dissipation module according to any one of claims 1-12; The contact surface of the first cold plate of the heat dissipation module is in contact with at least one component to be cooled.

14. The electronic device of claim 13, wherein, The area of the contact surface of the first cold plate of the heat dissipation module is greater than or equal to the area of the surface of at least one component to be cooled close to the heat dissipation module.

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