Electrical equipment comprising a loudspeaker enclosure

By incorporating heat-conducting elements and vents into the speaker housing, the problem of heat dissipation difficulties in compact electrical equipment is solved, achieving efficient heat dissipation and improved speaker performance.

CN117677144BActive Publication Date: 2025-11-18SAGEMCOM BROADBAND SAS
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Patent Information

Application Number
CN202311155951.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2022-09-08
Filing Date
2023-09-07
Publication Date
2025-11-18
Estimated Expiration
2043-09-07

AI Technical Summary

Technical Problem

The speaker housing design in modern electrical equipment makes heat dissipation difficult, especially in compact designs. Due to space constraints and audio signal interference, traditional heat dissipation devices are inefficient and the use of fans is impractical.

Method used

The design incorporates a combination of thermal conductive elements and ventilation openings. The ventilation openings include fins and cable channels. The fins are spaced apart to avoid acoustic interference. The thermal conductive elements are thermally coupled to the electronic components. The shape of the ventilation openings is optimized to maximize the airflow contact area.

Benefits of technology

It improves heat dissipation efficiency, reduces equipment size, and maintains speaker performance while avoiding acoustic interference and turbulence problems.

✦ Generated by Eureka AI based on patent content.

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Abstract

An electrical equipment (1) comprising a loudspeaker enclosure, the electrical equipment comprising: • the loudspeaker enclosure (2) comprising a chamber (3), a loudspeaker (4) and a vent (5); • an electronic assembly (16); • a heat sink device (17) arranged to dissipate heat generated by the electronic assembly and comprising both the vent (5) and a thermally conductive element (18) extending from an end (8) of the vent and thermally coupled with the electronic assembly.
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Description

Technical Field

[0001] This invention relates to the field of electrical equipment including speaker housings. Background Technology

[0002] Many modern electrical equipment components include speaker housings that house speakers within a cavity, as well as various electronic components. Specifically, such electrical equipment includes "enhanced" set-top boxes, smart speakers, voice assistants, and the like.

[0003] Such equipment typically features a very compact design, meaning all its functions need to be contained within a small volume. Specifically, the presence of the speaker chamber reduces the volume available for the electronic components that house the various functions (speaker and other features). Consequently, the air volume around the components is smaller, which hinders the cooling of the electronic components and leads to a major heat dissipation problem.

[0004] Therefore, electrical equipment includes devices specifically designed to dissipate and remove heat, such as radiators and heat sinks. The effectiveness of such devices is often insufficient, especially because the available space for them is also limited. Using fans appears problematic due to space constraints and the potential interference generated in the audio signal reproduced by the speaker enclosure. Summary of the Invention

[0005] The purpose of this invention is to improve heat dissipation in electrical equipment, including speaker housings.

[0006] To achieve this objective, an electrical device is provided, comprising:

[0007] • Speaker housing, including the chamber, speaker, and vents;

[0008] • Electronic components;

[0009] • A heat sink device arranged to dissipate heat generated by electronic components, and includes both a vent and a heat-conducting element extending from the end of the vent and thermally coupled to the electronic components.

[0010] In addition to the heat dissipation surface of the heat-conducting element, the tubular portion of the vent forms an additional heat dissipation surface. Furthermore, during operation, the surface of the vent comes into contact with a considerable airflow, thereby further improving the dissipation of heat generated by the electronic components. An apparatus as described above is also provided, wherein the heat-conducting element comprises a plate located in a plane perpendicular to the longitudinal axis of the vent, and wherein the vent expands at said end and opens within said plate. An apparatus as described above is also provided, wherein the electronic components are mounted on a circuit board located between the plate and the surface of the chamber, extending parallel to said plate and said surface. An apparatus device as described above is also provided, wherein the vent presents an elliptical shape when viewed in a cross-section in a plane perpendicular to its longitudinal axis.

[0011] The device described above is also provided, wherein the vent includes fins that protrude from the inner surface of the vent and extend parallel to the longitudinal axis of the vent.

[0012] The equipment described above is also provided, wherein two adjacent fins are spaced apart by a distance e, such that:

[0013] e>2*h

[0014] Where h is the height of the fin.

[0015] An apparatus is also provided in which the height of each fin decreases as it approaches the end of the vent.

[0016] The equipment described above is also provided, including cable channels formed on or in the fins or between two adjacent fins, the cable channels extending along the length of the fins.

[0017] The equipment described above is also provided, wherein the cable channel includes a groove formed in the surface of the fin, which is away from the inner surface of the vent, from which the fin protrudes.

[0018] The equipment described above is also provided, including multiple vents with parallel corresponding longitudinal axes.

[0019] The equipment described above is also provided, wherein the plurality of vents includes at least two vents, each vent having a wall that contacts or overlaps with the wall of the other vent.

[0020] The device described above is also provided, wherein the heat-conducting element comprises a plate forming the entire surface of or a portion thereof of the chamber.

[0021] The equipment described above is also provided, wherein thermal coupling between the thermally conductive element and the electronic component is provided by a thermal connection device positioned between the thermally conductive element and the electronic component.

[0022] A device described above is also provided, which is a set-top box.

[0023] The present invention can be better understood from the following description of specific, non-limiting embodiments thereof. Attached Figure Description

[0024] Referring to the attached diagram, in which:

[0025] [ Figure 1 ] Figure 1 A cross-sectional view on a vertical plane shows electrical equipment according to a specific embodiment;

[0026] [ Figure 2 ] Figure 2 The present invention illustrates a prior art speaker housing without vents, and a prior art speaker housing with vents;

[0027] [ Figure 3 ] Figure 3 It shows Figure 2 The frequency response of the speaker housing;

[0028] [ Figure 4 ] Figure 4 This is a plan view showing the chamber and radiator equipment;

[0029] [ Figure 5 ] Figure 5 A portion of the vent is shown in a cross-sectional view on a plane perpendicular to the vent's longitudinal axis;

[0030] [ Figure 6 ] Figure 6 The fins and ends of the vent are shown in a cross-sectional view on a plane containing the longitudinal axis of the vent.

[0031] [ Figure 7 ] Figure 7 The fins and cables are shown in a cross-sectional view on a plane perpendicular to the longitudinal axis of the fins.

[0032] [ Figure 8 ] Figure 8 Another specific embodiment of the electrical equipment is shown in a cross-sectional view on a vertical plane;

[0033] [ Figure 9 ] Figure 9 This is a plan view of the chamber and radiator device in another embodiment; Detailed Implementation

[0034] refer to Figure 1The present invention is described as being implemented in a set-top box (STB) 1. Specifically, STB 1 is an "enhanced" STB, which includes not only the electronic components that enable it to perform the usual functions of an STB, but also a speaker housing 2 that enables it to play audio signals to the surrounding environment.

[0035] The speaker housing 2 includes a chamber 3, a speaker 4, and a vent 5. In this example, the speaker 4 is a woofer (or "bass horn") used to reproduce low frequencies.

[0036] Vent 5 extends through the surface 6 (top surface) of chamber 3, away from the surface 7 (bottom surface) where the diaphragm of speaker 4 is located.

[0037] The vertical axis X of vent 5 is perpendicular to surface 6 (and perpendicular to surface 7).

[0038] Ventilation 5 has one end 8 located outside the chamber 3 and the other end 9 located inside the chamber 3.

[0039] Typically, the low-frequency performance of a speaker enclosure is improved by adding such vents to the chamber. This is known as a "bass-reflex" enclosure. The air flowing through the vents between the inside and outside of the chamber creates a mechanical system that resonates at a specific frequency.

[0040] exist Figure 2 In the image, housing 10 and housing 11 are visible, both of which are prior art housings. Housing 10 is a closed housing, while housing 11 includes vents. The bass-reflex design improves the housing's performance at low frequencies without requiring additional mechanical components (such as passive radiators) and without requiring the speaker's diaphragm to be displaced too far (where any displacement of the diaphragm is limited by both its mechanical properties and the external design of the device).

[0041] refer to Figure 3 As can be seen, the response 12 of the bass-reflex design speaker housing increases at low frequencies compared to the response 14 of the "sealed" speaker housing (i.e., the speaker housing has no vents and has a closed volume).

[0042] The increased response at low frequencies is due to the tubular shape of the vent, which acts as a Helmholtz resonator due to its coupling to the internal volume of the housing. The resonant frequency of this system is given by the following formula:

[0043]

[0044] Where c is the speed of sound in air ( Where L is the length of the vent (along its longitudinal axis X), V is the volume of the speaker housing cavity, K is the end correction factor, and S is the cross-section of the vent (i.e., its cross-sectional area). In the common case of a vent with a circular cross-section, its cross-section is equal to the area of ​​the circle, i.e. , where r is the radius of the circle.

[0045] Return to the present invention and Figure 1 STB1 also includes one or more circuit cards on which electronic components are mounted. These circuit cards include a card 15 mounted outside the chamber 3, positioned parallel to and abutting the outer surface of the surface 6. The card 15 is secured to the surface 6. In particular, the card 15 includes an electronic component 16, which is a component that generates considerable heat during operation. It can be any type of component, and for example it can be a system-on-a-chip (SoC), a processor, a radio transmitter, an amplifier, etc.

[0046] STB1 also includes a heat sink device 17 for improving the heat dissipation of STB1, and specifically for dissipating the heat generated by the electronic component 16 when it is in operation.

[0047] The heat sink device 17 includes a vent 5 and a thermally conductive element that extends from the end 8 of the vent 5 and is thermally coupled to the electronic component 16.

[0048] In this example, the heat-conducting element is a rectangular plate extending in a plane perpendicular to the longitudinal axis X of the vent 5. The vent 5 expands at its end 8, thus opening within the plate. In this example, the vent 5 and the plate form a single piece (but are not required).

[0049] The component is made of one or more rigid materials, such as aluminum or acrylonitrile-butadiene-styrene (ABS) type plastics, so that the cross-section of the vent 5 remains constant despite pressure changes, and in order to achieve good thermal conductivity.

[0050] The plate extends parallel to surface 6 of chamber 3 to the outside of chamber 3. Circuit board 15 and electronic component 16 are located between heat-conducting plate and surface 6 of chamber 3. The plate extends over most of the area of ​​surface 6 of chamber 3, and in particular, it covers all the area of ​​electronic component 16.

[0051] The heat sink device 17 also includes a thermal connection device located between the surface of the electronic component 16 and the plate for thermally coupling them together.

[0052] In this example, the thermal connection device includes a thermal pad 19 disposed between the electronic component 16 and the hot plate to contact both components.

[0053] The heat sink device 17 thus enables the heat generated by the electronic components 16 to be dissipated.

[0054] Vent 5 is used as a heat dissipation surface. When the speaker 4 is in operation, this surface is in direct contact with a considerable airflow in one direction or the other: when sound is played, air moves at high speed in vent 5.

[0055] The shape of the vent 5 is designed to maximize the contact area with the air.

[0056] refer to Figure 4 Ventilation opening 5 is a cylindrical shape with an elliptical cross-section: When viewed in a cross-section on a plane perpendicular to its longitudinal axis X, ventilation opening 5 appears to be elliptical.

[0057] Therefore, the outline 20 of the vent 5 is rectangular, with a rounded short side and a long side parallel to the length of STB 1.

[0058] Giving the vent 5 a slender, rather than circular, cross-section allows the diameter of the vent 5 to be reduced in its shorter dimension (the “width” of the vent 5), thereby reducing the depth of the STB1 while increasing the area of ​​the vent 5 in contact with the air for a given volume of air (the perimeter of the vent 5 increases for a given cross-sectional area). Therefore, this slender shape improves heat exchange while reducing the overall size of the STB 1.

[0059] Furthermore, fins 21 are provided around the periphery of the vent 5. The fins 21 protrude from the inner surface 22 of the vent 5 and extend parallel to its longitudinal axis X. The fins 21 further increase the contact area with air.

[0060] The reduction in the effective cross-section of the vent 5 caused by the presence of fins 21 needs to be compensated for by increasing its size (compared to the vent 5 without fins). The new resonant frequency of the heat dissipation vent is then given by the following equation:

[0061]

[0062] in ,in It is the cross-sectional area of ​​fin 21, and It refers to the number of fins 21 contained in the vent 5.

[0063] The required increase in the size of the vent 5 is relatively small because the presence of the fins 21 has almost no effect on the cross-section of the vent 5. Nevertheless, these fins 21 allow for a significant increase in the perimeter of the vent 5, and thus a significant increase in the heat exchange area between the radiator device 17 and the air. However, to maximize the heat power extracted from the vent 5, proper airflow between the fins 21 is necessary: ​​the airflow velocity profile must be as uniform as possible within the cross-section of the vent 5, both inlet and outlet. Moreover, if the air does not flow properly between the fins 21, the effective cross-section of the vent 5 decreases, and the bass-reflex resonant frequency no longer matches the frequency calculated for the speaker housing 2. Therefore, referring to... Figure 5 In order to minimize the influence of the fins 21 on the airflow, their size and position must be selected such that the distance e between two adjacent fins 21 is greater than the height h of the fins 21.

[0064] Advantageously, this gives: .

[0065] The width l of each fin 21 should preferably be chosen to be as small as possible, even if it has a very small effect on the increase in the periphery of the vent 5. These criteria are also used to avoid acoustic interference (where such interference can generate whistling noise) when air flows at high speed between the two fins 21.

[0066] Furthermore, it is preferable that the inlet and outlet of the vent do not have sharp edges, because sharp edges would create turbulence in the airflow.

[0067] refer to Figure 6 The height h of the fin 21 decreases as it approaches each of the ends 8 and 9 of the vent 5. Along its length, each fin 21 has a central portion of constant height and two ends whose height decreases as they approach the respective ends of the fin (and thus the vent).

[0068] Therefore, when viewed in a cross-sectional view on the plane containing the longitudinal axis X of the vent 5, each end of the fin 21 has a shape with a slope extending downward toward the closer end of the vent 5. Thus, each fin 21 is shaped and tapers at the inlet and outlet of the vent 5, thereby preventing turbulence. The resulting chamfer is used to prevent the fin 21 from acting as an obstruction to the airflow.

[0069] refer to Figure 7 At least one fin 21 has a cable channel that extends along the length of the fin 21 and is used to receive a cable 23 (which may be simply an electrical wire). Specifically, each of the plurality of fins 21 includes a corresponding cable channel.

[0070] For example, these cables 23 connect the speaker 4 to an amplifier located outside the chamber 3.

[0071] However, this is not necessary: ​​Cable 23 can connect components other than speakers and amplifiers perfectly well.

[0072] Specifically, each cable channel includes a groove 24 formed in the protruding surface 25 of the fin, i.e., the surface away from the inner surface 22 of the vent 5 from which the fin protrudes.

[0073] The groove 24 allows the cable 23 to be inserted along the entire length of the vent 5. The groove 24 holds the cable 23 by clamping it. This makes it possible for the cable 23 to pass through the vent 5, thereby avoiding the formation of a channel for the cable 23 to pass through the wall of the chamber, and thus avoiding sealing problems.

[0074] Regardless of whether the cable 23 is smooth or rough, it must be flexible enough to fit into the groove 24 and be held in place by force. The aforementioned material of the vent 5 is used to ensure that the fins 21 are strong enough to hold the cable without deformation. Finally, the extension of the radiator device 17 at the outlet of the vent 5 can be used to guide the cable 23 to the component located outside and connected to the chamber 3.

[0075] In this example, the groove 24 narrows at its outlet (and possibly at its inlet) to avoid any risk of the cable 23 “popping out” during normal use of the device.

[0076] It should be observed that when the cable 23 is received in the groove 24, the "solid" cross-section of the fin 21 in the plane perpendicular to the longitudinal axis of the fin 21, that is, the sum of the area of ​​the cross-section of the fin 21 and the area of ​​the cross-section of the cable 23, is almost equal to the area of ​​the cross-section that the fin 21 would have without the groove 24. Therefore, the presence of the groove 24 and the cable 23 does not change the above formula for the resonant frequency of the vent 5, thereby making the heat sink device 17 easier to design.

[0077] Numerous variations are possible.

[0078] refer to Figure 8 Ventilation 5 can extend through different sides of chamber 3, and for example through its rear surface 26.

[0079] The electronic component 16 for cooling and the circuit card 15 on which it is mounted can still be located on top of the chamber 3. In this case, the outer portion of the vent 5 extends from the first plate 18a and then from the second plate 18b perpendicular to the first plate 18a, wherein the second plate 18b completely covers the surface of the electronic component 16. The first plate 18a and the second plate 18b (and the vent 5) can be formed as a single piece, but this is not necessary.

[0080] (The plates) can form part of one or more surfaces of the chamber 3, or can form the entire surface.

[0081] In another variation, the height of these fins 21 can be increased just as well to accommodate multiple ducts, the sum of which equals the cross-section of the initial vent.

[0082] refer to Figure 9 Therefore, the speaker housing 2 has multiple vents.

[0083] Ventilation openings can be "contact" (e.g., through one of their walls), or they can be non-contact.

[0084] In this example, the speaker housing has four vents 5a, 5b, 5c, and 5d. The longitudinal axis X of the vents 5 is parallel to each other and perpendicular to the plane in which the plate extends.

[0085] As described above, the cross-section of each vent 5 in a plane perpendicular to its longitudinal axis X is elliptical. The profile 20 of each vent 5 is rectangular, with a rounded short side and a long side parallel to the length of STB 1.

[0086] The vents are aligned and extend coherently such that the major axis Y of their profile 20 is aligned with and parallel to the length of STB 1.

[0087] The vents are positioned such that the outer surfaces of two adjacent vents contact each other across the width of their contour 20: vent 5a contacts vent 5b, vent 5b also contacts vent 5c, and vent 5c also contacts vent 5d.

[0088] These surfaces can overlap where they come into contact, thus acting as the aforementioned fins.

[0089] This configuration is designed to maximize the heat exchange area with air. This variation can be used when providing fin 21 is too complex, for example, if the material is too flexible or if it is impossible to process the fins.

[0090] Naturally, the invention is not limited to the described embodiments, but covers any variations that fall within the scope of the invention as defined by the claims.

[0091] The electrical equipment implementing this invention need not be an STB, but can be any equipment including a speaker housing and electronic components: smart speaker; voice assistant; television set, etc.

[0092] Of course, the heat sink can be thermally coupled to multiple electronic components.

[0093] The plate can optionally be provided with ribs / fins to increase its dissipation area.

[0094] The plate and the cooling components can be located inside the chamber; the plate will then extend from the end 9 of the vent 5.

[0095] The heat sink device may have two plates, each extending from the corresponding end of the vent: one plate is located outside the chamber and the other plate is located inside the chamber, each plate being thermally coupled to at least one electronic component.

[0096] The heat-conducting element extending from the end of the vent does not have to be plate-shaped, but can be any shape.

[0097] Vents and heat-conducting elements can be designed as multiple distinct parts connected together by suitable thermally conductive joints (either in direct contact or via thermal bonding devices, such as thermal pads). These two parts can then be made of, for example, different materials, such as aluminum or copper for vents and ABS plastic for vents. This reduces overall manufacturing costs compared to all-metal equipment (ABS is easier to process for complex shapes).

[0098] The thermal device used to couple a component for heat cooling to a thermally conductive element does not necessarily have to be a pad: for example, the device can be thermally conductive paste or even thermally conductive epoxy resin.

[0099] The cable channel associated with the fin does not have to be a groove. As an example, it can be a tubular channel formed inside the fin, or a fastening device such as a hook positioned on the surface of the fin.

[0100] The cable channel does not necessarily have to be associated with a single fin. The cable channel can be formed on or within a single fin, or between two adjacent fins, extending along the length of the fin(s). For example, the cable channel can consist of two fins positioned close together such that the cable can be clamped between them. The faces of the fins facing the inserted cable can optionally be ribbed to help hold the cable in place.

Claims

1. An electrical equipment (1) comprising a loudspeaker enclosure, said electrical equipment comprising: • said loudspeaker enclosure (2) comprising a chamber (3), a loudspeaker (4) and a vent (5); • an electronic assembly (16); and • a heat sink device (17) arranged to dissipate heat generated by said electronic assembly and comprising both said vent (5) comprising fins (21) protruding from an inner surface (22) of said vent and extending parallel to a longitudinal axis (X) of said vent and a thermally conductive element (18) extending from an end (8) of said vent and thermally coupled with said electronic assembly, said electrical equipment being characterized in that it comprises a cable and a cable channel formed on or in a fin or between two adjacent fins, said cable channel extending along the length of said fin.

2. The electrical equipment of claim 1, wherein, Said thermally conductive element comprises a plate lying in a plane perpendicular to said longitudinal axis (X) of said vent and wherein said vent flares at said end and opens in said plate.

3. The electrical equipment of claim 2, wherein, Said electronic assembly is mounted on a circuit board (15) lying between said plate and a face (6) of said chamber, extending parallel to said plate and said face of said chamber.

4. The electrical equipment of any preceding claim, wherein, Said vent (5) presents an elliptical shape when viewed in a cross-section on a plane perpendicular to its longitudinal axis (X).

5. The electrical equipment of any one of claims 1 to 3, wherein, Two adjacent fins (21) are spaced apart by a distance e such that: e > 2*h where h is the height of said fin (21).

6. The electrical equipment of any one of claims 1 to 3, wherein, The height of each fin (21) decreases as it approaches said end (8, 9) of said vent (5).

7. The electrical equipment of any one of claims 1 to 3, wherein, Said cable channel comprises a groove (24) formed in a surface (25) of a fin, said surface being distal from an inner surface (22) of said vent, said fin protruding from said inner surface.

8. The electrical equipment of claim 7, wherein, Said cable is inserted into said groove along the entire length of said vent, said groove retaining said cable by clamping.

9. The electrical equipment of any one of claims 1 to 3, wherein, It comprises a plurality of vents (5a, 5b, 5c, 5d) having respective longitudinal axes (X) parallel.

10. The electrical equipment of claim 9, wherein, Said plurality of vents comprises at least two vents, each vent having a wall in contact or coinciding with a wall of another vent.

11. The electrical equipment of any one of claims 1 to 3, wherein, Said thermally conductive element comprises a plate forming the entire face of said chamber or a portion thereof.

12. The electrical equipment of any one of claims 1 to 3, wherein, The thermal coupling between said thermally conductive element (18) and said electronic assembly (16) is provided by a thermal connection device positioned between said thermally conductive element and said electronic assembly (16).

13. The electrical equipment of any one of claims 1 to 3, wherein, Said electrical equipment is a set-top box (1).

Citation Information

Patent Citations

  • Bass reflex type loudspeaker enclosure

    CN111492665A

  • Passive thermal control system for electronic speaker device and associated electronic speaker device

    CN112218190A