Attenuator based on 3D heterogeneous chip and attenuation method thereof

Abstract

The application discloses a 3D heterogeneous chip-based attenuator and an attenuation method thereof. The 3D heterogeneous chip-based attenuator comprises a first radio frequency chip and a second radio frequency chip. The first radio frequency chip is provided with a first radio frequency transmission line for transmitting a radio frequency signal, a first coupling member for coupling radio frequency signal energy and a second coupling member for coupling radio frequency signal energy. The first coupling member is electrically connected with an input end of the first radio frequency transmission line, and the second coupling member is electrically connected with an output end of the first radio frequency transmission line. The second radio frequency chip is provided with a second radio frequency transmission line for receiving the radio frequency signal on the first coupling member and outputting the radio frequency signal to the second coupling member. In the application, the first coupling member and the second coupling member can sequentially couple radio frequency signal energy to realize radio frequency signal energy attenuation, that is, the attenuator does not need to install a resistor on the first radio frequency chip when attenuating radio frequency signal energy, which improves the integration of the 3D heterogeneous chip.

Description

Technical Field

[0001] This invention belongs to the field of millimeter-wave circuit technology, and particularly relates to attenuators based on 3D heterogeneous chips and their attenuation methods. Background Technology

[0002] In recent years, with the rapid development of millimeter-wave technology, the requirements for millimeter-wave circuits have become increasingly stringent. Currently, the attenuators of traditional 3D heterogeneous chips mainly achieve attenuation by setting T-type or π-type resistor attenuation networks on the RF chip. The entire RF circuit of this attenuator is located on the surface of the RF chip, requiring a large mounting area. This is not conducive to improving the integration of 3D heterogeneous chips, and the attenuators of traditional 3D heterogeneous chips are difficult to meet the requirements of millimeter-wave circuits. Summary of the Invention

[0003] To overcome the shortcomings of existing technologies, this invention provides an attenuator and its attenuation method based on a 3D heterogeneous chip, which can achieve radio frequency signal energy attenuation and enable the 3D heterogeneous chip to meet integration requirements.

[0004] The objective of this invention is achieved through the following technical solution:

[0005] Firstly, an attenuator based on a 3D heterogeneous chip is provided, comprising:

[0006] The first radio frequency chip has a first radio frequency transmission line for transmitting radio frequency signals, a first coupling element for coupling radio frequency signal energy, and a second coupling element for coupling radio frequency signal energy. The first coupling element is electrically connected to the input end of the first radio frequency transmission line, and the second coupling element is electrically connected to the output end of the first radio frequency transmission line.

[0007] The second radio frequency chip has a second radio frequency transmission line for receiving radio frequency signals from the first coupler and for outputting radio frequency signals to the second coupler.

[0008] In one embodiment, a first radio frequency switch electrically connected to a first coupler and a second radio frequency switch electrically connected to a second coupler are provided on the first radio frequency transmission line.

[0009] The beneficial effects of adopting the above technical solution are as follows: the first RF switch enables the RF signal to be transmitted from the first RF transmission line to the first coupler, and the second RF switch enables the RF signal to be transmitted from the second coupler to the first RF transmission line, thereby achieving RF signal energy attenuation; the first RF switch can also prevent the RF signal from being transmitted from the first RF transmission line to the first coupler, and the second RF switch can also prevent the RF signal from being transmitted from the second coupler to the first RF transmission line, that is, no energy attenuation of the RF signal is performed, but it is directly output to the outside through the first RF transmission line.

[0010] In one embodiment, a first RF chip is provided with a first pad electrically connected to a first RF switch, a first coupling member is a copper pillar, and the first coupling member is soldered to the first pad. A second RF chip is provided with a second pad electrically connected to a second RF transmission line, and a first coupling member is located between the first pad and the second pad. The length of the first coupling member is less than the distance between the first pad and the second pad.

[0011] The beneficial effects of adopting the above technical solution are as follows: the first coupling element in the form of a copper pillar is at a certain distance from the second pad. After the radio frequency signal is transmitted to the first coupling element, the first coupling element in the form of a copper pillar can couple part of the energy of the radio frequency signal and then transmit it to the second pad.

[0012] In one embodiment, a first radio frequency (RF) transmission branch is provided on the first RF chip, and the two ends of the first RF transmission branch are electrically connected to a first RF switch and a first pad, respectively.

[0013] The beneficial effects of adopting the above technical solution are as follows: the first RF switch and the first pad are electrically connected through the first RF transmission branch.

[0014] In one embodiment, the first RF chip is provided with a third pad that is electrically connected to the second RF switch, the second coupling element is a copper pillar, the second RF chip is provided with a fourth pad that is electrically connected to the second RF transmission line, and the two ends of the second coupling element are soldered to the third pad and the fourth pad, respectively.

[0015] The beneficial effects of adopting the above technical solution are as follows: the radio frequency signal after one attenuation on the second radio frequency transmission line can be transmitted to the second coupler in the form of a copper pillar through the fourth pad, and the second coupler in the form of a copper pillar can couple part of the energy of the radio frequency signal again and transmit it to the third pad.

[0016] In one embodiment, a second radio frequency transmission branch is provided on the first radio frequency chip, and the two ends of the second radio frequency transmission branch are electrically connected to a second radio frequency switch and a third pad, respectively.

[0017] The beneficial effect of adopting the above technical solution is that the second RF switch and the third pad are electrically connected through the second RF transmission branch.

[0018] In one embodiment, the second coupling element is located between the third pad and the fourth pad, and the length of the second coupling element matches the distance between the third pad and the fourth pad.

[0019] The beneficial effects of adopting the above technical solution are as follows: the second coupling element is located between the third pad and the fourth pad, and the length of the second coupling element is matched with the distance between the third pad and the fourth pad, so that the two ends of the second coupling element can be soldered to the third pad and the fourth pad.

[0020] In one embodiment, a control circuit is provided on the second radio frequency chip.

[0021] Secondly, an attenuation method based on a 3D heterogeneous chip attenuator is provided, which includes the following steps:

[0022] Input radio frequency signals into the first radio frequency transmission line;

[0023] The first radio frequency transmission line transmits radio frequency signals to the first coupler, and the first coupler couples the energy of the radio frequency signal and then transmits the coupled radio frequency signal to the second radio frequency transmission line.

[0024] The second radio frequency transmission line outputs a radio frequency signal to the second coupler. The second coupler couples the energy of the radio frequency signal and then transmits the radio frequency signal after two couplings to the first radio frequency transmission line.

[0025] The first radio frequency transmission line outputs the radio frequency signal after two couplings to achieve radio frequency signal energy attenuation.

[0026] The beneficial effects of this invention are as follows:

[0027] The first and second coupling elements can sequentially couple radio frequency signal energy to achieve radio frequency signal energy attenuation. That is, when the attenuator attenuates radio frequency signal energy, it is not necessary to install a resistor on the first radio frequency chip. This reduces the area requirement of the first radio frequency chip and improves the area utilization and integration of the 3D heterogeneous chip. This has great value in reducing the size and cost of the 3D heterogeneous chip. Attached Figure Description

[0028] The invention will now be described in more detail with reference to embodiments and the accompanying drawings.

[0029] Figure 1 A schematic diagram of the structure of the first radio frequency chip in this invention is shown;

[0030] Figure 2 A schematic diagram of the structure of the second radio frequency chip in this invention is shown;

[0031] Figure 3 The diagram shows the structure of the first coupling member and the second coupling member in this invention;

[0032] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not to scale.

[0033] Figure label:

[0034] 1-First RF chip, 101-First RF transmission line, 102-First RF transmission branch, 103-First pad, 104-Third pad, 105-Second RF transmission branch, 106-Second RF switch, 107-First RF switch, 2-Second RF chip, 201-Second pad, 202-Second RF transmission line, 203-Fourth pad, 3-First coupler, 4-Second coupler. Detailed Implementation

[0035] The invention will now be further described with reference to the accompanying drawings.

[0036] Traditional 3D heterogeneous chip attenuators mainly achieve attenuation by setting T-type or π-type resistor attenuation networks on the RF chip. The RF circuit part of the attenuator is entirely set on the surface of the RF chip and requires a large mounting area. This is not conducive to improving the integration of 3D heterogeneous chips. Traditional 3D heterogeneous chip attenuators are difficult to meet people's requirements for millimeter-wave circuits.

[0037] Therefore, as Figure 1-3 As shown, the present invention provides an attenuator based on a 3D heterogeneous chip, which includes:

[0038] The first radio frequency chip 1 is provided with a first radio frequency transmission line 101 for transmitting radio frequency signals, a first coupling element 3 for coupling radio frequency signal energy, and a second coupling element 4 for coupling radio frequency signal energy. The first coupling element 3 is electrically connected to the input end of the first radio frequency transmission line 101, and the second coupling element 4 is electrically connected to the output end of the first radio frequency transmission line 101.

[0039] The second radio frequency chip 2 is provided with a second radio frequency transmission line 202 for receiving radio frequency signals from the first coupler 3 and for outputting radio frequency signals to the second coupler 4.

[0040] It is understandable that the first coupling element 3 and the second coupling element 4 can sequentially couple radio frequency signal energy to achieve radio frequency signal energy attenuation. That is, when the attenuator attenuates radio frequency signal energy, it is not necessary to install a T-type or π-type resistor on the first radio frequency chip 1. This reduces the area requirement of the first radio frequency chip 1 and improves the area utilization and integration of the 3D heterogeneous chip. This has great value in reducing the size and cost of the 3D heterogeneous chip.

[0041] In one embodiment, the first radio frequency transmission line 101 is provided with a first radio frequency switch 107 electrically connected to the first coupler 3 and a second radio frequency switch 106 electrically connected to the second coupler 4.

[0042] It is understandable that the first RF switch 107 enables the RF signal to be transmitted from the first RF transmission line 101 to the first coupler 3, and the second RF switch 106 enables the RF signal to be transmitted from the second coupler 4 to the first RF transmission line 101, thereby achieving RF signal energy attenuation; the first RF switch 107 can also prevent the RF signal from being transmitted from the first RF transmission line 101 to the first coupler 3, and the second RF switch 106 can also prevent the RF signal from being transmitted from the second coupler 4 to the first RF transmission line 101, that is, no energy attenuation is performed on the RF signal, but it is directly output to the outside through the first RF transmission line 101.

[0043] In one embodiment, the first RF chip 1 is provided with a first pad 103 electrically connected to the first RF switch 107, the first coupling member 3 is a micro copper pillar, and the first coupling member 3 is soldered to the first pad 103. The second RF chip 2 is provided with a second pad 201 electrically connected to the second RF transmission line 202, the first coupling member 3 is located between the first pad 103 and the second pad 201, and the length of the first coupling member 3 is less than the distance between the first pad 103 and the second pad 201.

[0044] It is understandable that the first coupling element 3 in the form of a micro copper pillar is at a certain distance from the second pad 201. After the radio frequency signal is transmitted to the first coupling element 3, the first coupling element 3 in the form of a micro copper pillar can couple part of the energy of the radio frequency signal and then transmit it to the second pad 201.

[0045] In one embodiment, the first radio frequency chip 1 is provided with a first radio frequency transmission branch 102, and the two ends of the first radio frequency transmission branch 102 are electrically connected to the first radio frequency switch 107 and the first pad 103, respectively.

[0046] It is understandable that the first RF switch 107 and the first pad 103 are electrically connected through the first RF transmission branch 102.

[0047] In one embodiment, the first RF chip 1 is provided with a third pad 104 electrically connected to the second RF switch 106, the second coupling member 4 is a micro copper pillar, the second RF chip 2 is provided with a fourth pad 203 electrically connected to the second RF transmission line 202, and the two ends of the second coupling member 4 are respectively soldered to the third pad 104 and the fourth pad 203.

[0048] Understandably, the radio frequency signal after one attenuation on the second radio frequency transmission line 202 can be transmitted to the second coupler 4 in the form of a micro copper pillar via the fourth pad 203. The second coupler 4 in the form of a micro copper pillar can recouple part of the energy of the radio frequency signal and transmit it to the third pad 104.

[0049] It should be noted that the first pad 103 and the third pad 104 are both located on the same end face of the first RF chip 1, and the second pad 201 and the fourth pad 203 are both located on the same end face of the second RF chip 2. Furthermore, the end of the first RF chip 1 where the first pad 103 and the third pad 104 are located is close to the end of the second RF chip 2 where the second pad 201 and the fourth pad 203 are located.

[0050] In one embodiment, a second radio frequency transmission branch 105 is provided on the first radio frequency chip 1, and the two ends of the second radio frequency transmission branch 105 are electrically connected to the second radio frequency switch 106 and the third pad 104, respectively.

[0051] It is understandable that the second RF switch 106 and the third pad 104 are electrically connected through the second RF transmission branch 105.

[0052] In one embodiment, the second coupling element 4 is located between the third pad 104 and the fourth pad 203, and the length of the second coupling element 4 matches the distance between the third pad 104 and the fourth pad 203.

[0053] It is understood that the second coupling element 4 is located between the third pad 104 and the fourth pad 203, and the length of the second coupling element 4 is matched with the distance between the third pad 104 and the fourth pad 203 so that both ends of the second coupling element 4 can be soldered to the third pad 104 and the fourth pad 203.

[0054] In one embodiment, the second radio frequency chip 2 is provided with a control circuit.

[0055] This invention also provides an attenuation method for an attenuator based on a 3D heterogeneous chip, which includes the following steps:

[0056] An radio frequency signal is input to the first radio frequency transmission line 101;

[0057] The first radio frequency transmission line 101 transmits radio frequency signals to the first coupler 3. After coupling the energy of the radio frequency signal, the first coupler 3 transmits the coupled radio frequency signal to the second radio frequency transmission line 202.

[0058] The second radio frequency transmission line 202 outputs a radio frequency signal to the second coupler 4. The second coupler 4 couples the energy of the radio frequency signal and then transmits the radio frequency signal after two couplings to the first radio frequency transmission line 101.

[0059] The first radio frequency transmission line 101 outputs the radio frequency signal after two couplings to achieve radio frequency signal energy attenuation.

[0060] It should be noted that before the attenuator based on the 3D heterogeneous chip performs attenuation, the first RF switch 107 and the second RF switch 106 need to be switched so that the first RF transmission line 101 transmits RF signals to the first coupler 3 and the second coupler 4 transmits RF signals to the first RF transmission line 101.

[0061] In the description of this invention, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0062] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. An attenuator based on a 3D heterogeneous chip, characterized in that, include: The first radio frequency chip (1) is provided with a first radio frequency transmission line (101) for transmitting radio frequency signals, a first coupling element (3) for coupling radio frequency signal energy and a second coupling element (4) for coupling radio frequency signal energy. The first coupling element (3) is electrically connected to the input end of the first radio frequency transmission line (101) and the second coupling element (4) is electrically connected to the output end of the first radio frequency transmission line (101). The second radio frequency chip (2) is provided with a second radio frequency transmission line (202) for receiving radio frequency signals from the first coupler (3) and for outputting radio frequency signals to the second coupler (4). The first radio frequency transmission line (101) is provided with a first radio frequency switch (107) electrically connected to the first coupling member (3) and a second radio frequency switch (106) electrically connected to the second coupling member (4). The first RF chip (1) is provided with a first pad (103) electrically connected to the first RF switch (107), the first coupling member (3) is a copper pillar, the first coupling member (3) is soldered to the first pad (103), the second RF chip (2) is provided with a second pad (201) electrically connected to the second RF transmission line (202), the first coupling member (3) is located between the first pad (103) and the second pad (201), and the length of the first coupling member (3) is less than the distance between the first pad (103) and the second pad (201); The first RF chip (1) is provided with a third pad (104) electrically connected to the second RF switch (106), the second coupling member (4) is a copper pillar, the second RF chip (2) is provided with a fourth pad (203) electrically connected to the second RF transmission line (202), and the two ends of the second coupling member (4) are respectively soldered to the third pad (104) and the fourth pad (203).

2. The attenuator based on a 3D heterogeneous chip according to claim 1, characterized in that, The first radio frequency chip (1) is provided with a first radio frequency transmission branch (102), and the two ends of the first radio frequency transmission branch (102) are electrically connected to the first radio frequency switch (107) and the first pad (103), respectively.

3. The attenuator based on a 3D heterogeneous chip according to claim 1, characterized in that, The first radio frequency chip (1) is provided with a second radio frequency transmission branch (105), and the two ends of the second radio frequency transmission branch (105) are electrically connected to the second radio frequency switch (106) and the third pad (104), respectively.

4. The attenuator based on a 3D heterogeneous chip according to claim 1, characterized in that, The second coupling element (4) is located between the third pad (104) and the fourth pad (203), and the length of the second coupling element (4) matches the distance between the third pad (104) and the fourth pad (203).

5. The attenuator based on a 3D heterogeneous chip according to claim 1, characterized in that, The second radio frequency chip (2) is provided with a control circuit.

6. An attenuation method for an attenuator based on a 3D heterogeneous chip as described in any one of claims 1-5, characterized in that, Includes the following steps: An radio frequency signal is input to the first radio frequency transmission line (101); The first radio frequency transmission line (101) transmits radio frequency signals to the first coupler (3), and the first coupler (3) couples the energy of the radio frequency signal and then transmits the coupled radio frequency signal to the second radio frequency transmission line (202). The second radio frequency transmission line (202) outputs a radio frequency signal to the second coupler (4), and the second coupler (4) couples the energy of the radio frequency signal and then transmits the radio frequency signal after two couplings to the first radio frequency transmission line (101). The first radio frequency transmission line (101) outputs the radio frequency signal after two couplings to achieve radio frequency signal energy attenuation.

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